LED epitaxial wafer continuous detection device and detection method thereof

Abstract

The present invention provides an LED epitaxial wafer continuous detection device and a detection method thereof, which relate to the technical field of LED epitaxial wafer detection, and comprise a detection platform and a first electrically controlled turntable and a second electrically controlled turntable installed on the surface of the detection platform; the LED epitaxial wafer detection device is installed on the surface of the detection platform, and further comprises an LED epitaxial wafer carrier plate for carrying LED epitaxial wafers of various specifications; the surface of the LED epitaxial wafer carrier plate is provided with a suction port, a U-shaped carrier plate, an electromagnet, an LED epitaxial wafer carrier box, a pressure rod, a constraint sleeve, a damping wheel, and two groups of first rollers are symmetrically arranged inside the U-shaped carrier plate; the present invention can make the LED epitaxial wafer be dynamically circulated and stored during detection through the cooperation of the U-shaped carrier plate and the constraint sleeve, so as to cooperate with the detection of the LED epitaxial wafer by each workstation; and the overall detection efficiency of the LED epitaxial wafer is improved through the cooperation of a control unit.

Description

Technical Field

[0001] The invention relates to the technical field of LED epitaxial wafer detection, and in particular to a continuous detection device for LED epitaxial wafers and a detection method thereof. Background Art

[0002] LED epitaxial wafers are prone to various defects such as breakage, hidden cracks, and scratches during the production process. In particular, defects such as pits, protrusions, and hidden cracks are very difficult to detect. These defects will affect the function and performance of the chip. Therefore, it is very necessary to effectively detect and analyze LED epitaxial wafer defects.

[0003] Existing LED epitaxial wafer inspection requires the use of a variety of inspection equipment, such as automatic optical inspection equipment (AOI) to detect surface scratches, particles and other defects of LED epitaxial wafers, laser interferometer to detect the surface flatness and height distribution of LED epitaxial wafers, acoustic acoustic microscope (SAM) to detect internal cracks, voids and other defects of LED epitaxial wafers, X-ray photoelectron spectrometer (XPS) to detect the chemical composition of the surface of LED epitaxial wafers, etc.

[0004] The time required for detection by the above-mentioned instruments is different. When continuous detection is performed on large quantities of LED epitaxial wafers, the flow of LED epitaxial wafers is prone to be delayed, which is not conducive to improving the continuous detection efficiency of LED epitaxial wafers. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a continuous detection device for LED epitaxial wafers. Through the cooperation of the U-shaped carrier and the constraint sleeve, the LED epitaxial wafers can be dynamically circulated and stored during the detection, so as to cooperate with the detection of the LED epitaxial wafers at each workstation. Through the cooperation of the control unit, the overall detection efficiency of the LED epitaxial wafers is improved.

[0006] In order to solve the above technical problems, the technical solution of the present invention is as follows:

[0007] An LED epitaxial wafer continuous detection device comprises a detection platform and a first electrically controlled turntable and a second electrically controlled turntable mounted on the surface of the detection platform, wherein the LED epitaxial wafer detection device is mounted on the surface of the detection platform, and further comprises:

[0008] LED epitaxial wafer carrier, used to carry LED epitaxial wafers of various specifications, the surface of the LED epitaxial wafer carrier is provided with an adsorption port, and negative pressure adsorption of different LED epitaxial wafers is performed by controlling the pressure inside the adsorption port;

[0009] A U-shaped carrier, used for transporting the LED epitaxial wafer carrier board carrying the LED epitaxial wafer;

[0010] An electromagnet, used to provide initial kinetic energy to the LED epitaxial wafer carrier during the transportation of the LED epitaxial wafer carrier, and to fix the LED epitaxial wafer carrier by the electromagnet;

[0011] An LED epitaxial wafer carrier box, used for placing the LED epitaxial wafer carrier board carrying the LED epitaxial wafer;

[0012] A pressing rod, used to press down one of the LED epitaxial wafer carriers carrying the LED epitaxial wafer to a required position;

[0013] A restraining sleeve, used to cooperate with the magnetic change of the electromagnet to move the LED epitaxial wafer carrier board carrying the LED epitaxial wafer into or out of the corresponding LED epitaxial wafer carrier box, and to restrain the LED epitaxial wafer carrier board that does not need to be moved;

[0014] A damping wheel, which generates damping on the movement of the U-shaped platform;

[0015] Two groups of first rollers are symmetrically arranged inside the U-shaped carrier, and are used to move the LED epitaxial wafer carrier entering the U-shaped carrier;

[0016] The electromagnet is installed in a first installation groove opened on the surface of the U-shaped carrier and in a second installation groove opened on the surface of the constraint sleeve.

[0017] Furthermore, the LED epitaxial wafer carrier box is arranged in a circular array on the surface of the first electrically controlled turntable, and the surface of the second electrically controlled turntable is provided with a plurality of outer sliding rods in a circular array, the surfaces of the outer sliding rods are all slidably connected with sliding arms, the U-shaped platform is fixedly connected to one end of the sliding arm, the surface of the detection platform is fixedly connected to a gantry, an electrically controlled telescopic cylinder is installed in a reserved groove opened on the surface of the gantry, the end of the output shaft of the electrically controlled telescopic cylinder is fixedly connected to a U-shaped connecting frame, the bottom surface of the U-shaped connecting frame is fixedly connected to a restraining sleeve, the surface of the U-shaped connecting frame is fixedly connected to a connecting arm, and the end of the connecting arm away from the U-shaped connecting frame is fixedly connected to a pressure rod, two groups of the first rollers are respectively arranged in the receiving grooves symmetrically opened on the surface of the U-shaped platform, the first rollers are fixedly connected to the U-shaped platform through a third bearing, and a second motor is installed on the surface of the U-shaped platform, and the output shaft of the second motor is fixedly connected to one of the first rollers.

[0018] Furthermore, a fixed truncated table is arranged above the second electrically controlled turntable, a first screw rod is arranged between the fixed truncated table and the second electrically controlled turntable, two ends of the first screw rod are rotatably connected to the second electrically controlled turntable and the fixed truncated table respectively through two first bearings, a first motor is installed on the surface of the fixed truncated table, an output shaft of the first motor is fixedly connected to the first screw rod, a plurality of inner sliding rods are fixedly connected to the bottom surface of the fixed truncated table in a circular array, the inner sliding rods are fixedly connected to the second electrically controlled turntable, a plurality of fixed arms are fixedly connected to the surface of the fixed truncated table in a circular array, the fixed arms are fixedly connected to the corresponding outer sliding rods, and the sliding arms are slidably connected to the inner sliding rods.

[0019] Furthermore, the surfaces of the outer sliding rod and the inner sliding rod are respectively provided with a first spring and a second spring, the first spring is located above the sliding arm, the second spring is located below the sliding arm, the surface of the first screw rod is threadedly connected with a threaded block, the surface of the threaded block is fixedly connected with a plurality of first connecting blocks in a circular array, the first connecting block is slidably connected to the inner sliding rod, the sliding arm is located below the first connecting block, and the sliding arm conflicts with the first connecting block.

[0020] Furthermore, a connecting plate is arranged parallel to the bottom surface of the sliding arm, and two connecting plates are symmetrically arranged on both sides of the corresponding outer sliding rod. The damping wheel is symmetrically arranged between the two connecting plates, and the damping wheel is rotatably connected to the two connecting plates through two first one-way bearings, and the damping wheels are in conflict with the outer sliding rod.

[0021] Furthermore, a suction port is provided on the surface of the LED epitaxial wafer carrier, a barcode identification block is fixedly connected to the surface of the LED epitaxial wafer carrier, a connecting cavity, an air pressure cavity and an adjusting cavity are provided inside the LED epitaxial wafer carrier, the suction port, the connecting cavity, the air pressure cavity and the interior of the adjusting cavity are connected in sequence, an adjusting plug is provided inside the air pressure cavity, the adjusting plug is slidably connected to the LED epitaxial wafer carrier, a reset spring is provided inside the air pressure cavity, both ends of the reset spring are fixedly connected to the adjusting plug and the LED epitaxial wafer carrier respectively, magnetic blocks are symmetrically provided on the surface of the LED epitaxial wafer carrier, and the magnetic blocks are embedded in the first groove provided on the surface of the LED epitaxial wafer carrier.

[0022] Furthermore, a bobbin is provided inside the adjustment cavity, and the bobbin is rotatably connected to the first circular hole opened on the surface of the LED epitaxial wafer carrier through a fifth bearing, a knob sleeve is fixedly connected to the surface of the LED epitaxial wafer carrier, an adjustment knob is slidably connected inside the knob sleeve, a friction ring is fixedly connected to the surface of the adjustment knob, a third spring is provided inside the knob sleeve, the surface of the third spring is in conflict with the LED epitaxial wafer carrier and the friction ring, a hexagonal prism block is fixedly connected to the bottom surface of the adjustment knob, and the hexagonal prism block is slidably connected to a slide groove opened on the surface of the bobbin, a pull rope is provided inside the LED epitaxial wafer carrier, and both ends of the pull rope are fixedly connected to the bobbin and the adjustment plug respectively, and the upper surface of the friction ring and the inner top surface of the knob sleeve are both rough.

[0023] Furthermore, the LED epitaxial wafer carrier box is arranged in a circular array on the surface of the first electrically controlled turntable, and the surface of the second electrically controlled turntable is provided with a plurality of outer sliding rods in a circular array, the surfaces of the outer sliding rods are all slidably connected with sliding arms, the U-shaped platform is fixedly connected to one end of the sliding arm, the surface of the detection platform is fixedly connected to a gantry, an electrically controlled telescopic cylinder is installed in a reserved groove opened on the surface of the gantry, the end of the output shaft of the electrically controlled telescopic cylinder is fixedly connected to a U-shaped connecting frame, the bottom surface of the U-shaped connecting frame is fixedly connected to a restraining sleeve, the surface of the U-shaped connecting frame is fixedly connected to a connecting arm, and the end of the connecting arm away from the U-shaped connecting frame is fixedly connected to a pressure rod, two groups of the first rollers are respectively arranged in the receiving grooves symmetrically opened on the surface of the U-shaped platform, the first rollers are fixedly connected to the U-shaped platform through a third bearing, and a second motor is installed on the surface of the U-shaped platform, and the output shaft of the second motor is fixedly connected to one of the first rollers.

[0024] Furthermore, the real-time defect data of LED epitaxial wafers is analyzed, and the workstation priority corresponding to the optimized LED epitaxial wafer inspection is output, including:

[0025] Track the working status of the workstations in real time, and give priority to allocating new LED epitaxial wafers to the workstations with the shortest idle time. When any workstation detects defective products, the detection is terminated and the working status of the workstation is updated. Calculate the priority of the workstation, where The priority assigned to the workstation, For workstation The detection time, For workstation The length of the current task queue, is the weight coefficient of queue length, For workstation The idle state, is the weight coefficient of the idle state, For workstation The historical detection efficiency of For workstation The historical scrap probability, is the weight coefficient of scrap probability.

[0026] Furthermore, a method for continuous detection of LED epitaxial wafers comprises the following steps:

[0027] Step 1: Install the equipment required for LED epitaxial wafer testing on the surface of the testing platform;

[0028] Step 2: Place the LED epitaxial wafer to be tested in the internal compartment of the LED epitaxial wafer carrier, control the LED epitaxial wafer carrier to perform negative pressure adsorption on the LED epitaxial wafer by twisting the adjustment knob, and place the LED epitaxial wafer carrier carrying the LED epitaxial wafer inside the LED epitaxial wafer carrier box;

[0029] Step 3, by rotating the second electrically controlled turntable, the corresponding U-shaped carrier is directed toward the corresponding LED epitaxial wafer testing equipment, and the LED epitaxial wafer carrier board carrying the tested LED epitaxial wafer is transferred to the LED epitaxial wafer carrier box;

[0030] Step four, in step three, after one of the U-shaped carriers is moved to the set position, the restraint sleeve is placed on the surface of one of the LED epitaxial wafer carrier boxes through the extension and retraction of the electric-controlled telescopic cylinder. At the same time, as the electric-controlled telescopic cylinder is extended, the pressure rod presses the corresponding U-shaped carrier down to the set position, and through the push of the magnetic force of the electromagnet and the operation of the second motor, the corresponding LED epitaxial wafer carrier is transferred between the LED epitaxial wafer carrier box and the U-shaped carrier.

[0031] The above solution of the present invention includes at least the following beneficial effects:

[0032] The above scheme of the present invention dynamically adjusts the constraint sleeve and the U-shaped carrier through the rotation of the first electrically controlled turntable and the second electrically controlled turntable, so that the LED epitaxial wafer is transferred and stored in the constraint sleeve, which is convenient for controlling the circulation of the LED epitaxial wafer. The cooperation of the electromagnet facilitates the transportation and fixation of the LED epitaxial wafer carrier carrying the LED epitaxial wafer. The cooperation of the first spring and the second spring makes it easy to reset the U-shaped carrier, thereby facilitating the cooperation between the U-shaped carrier and each workstation. The cooperation of the damping wheel and the first one-way bearing makes the resetting process of the U-shaped carrier relatively smooth, so that the LED epitaxial wafer carrier carrying the LED epitaxial wafer inside it moves smoothly, thereby keeping the LED epitaxial wafer moving stably; by adjusting the adjustment plug inside the LED epitaxial wafer carrier, the adsorption force of the LED epitaxial wafer carrier on the LED epitaxial wafer can be adjusted according to the different specifications of the LED epitaxial wafer, while keeping the LED epitaxial wafer stably fixed, avoiding excessive suction to damage the thinner specifications of the LED epitaxial wafer; by using the control unit, the detection sequence of the LED epitaxial wafer is dynamically adjusted to improve the overall detection efficiency of the LED epitaxial wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of the overall structure provided by the present invention.

[0034] Figure 2 It is a schematic diagram of the thread block in the present invention.

[0035] Figure 3 It is a schematic diagram of the first roller in the present invention.

[0036] Figure 4 The present invention Figure 1 Enlarged view of point A in the middle.

[0037] Figure 5 The present invention Figure 2 Enlarged view of point B in the middle.

[0038] Figure 6 It is a schematic diagram of the LED epitaxial wafer carrier in the present invention.

[0039] Figure 7 It is a schematic diagram of the connecting cavity in the present invention.

[0040] Figure 8 It is a schematic diagram of the adjustment knob in the present invention.

[0041] Fig. 9 It is a schematic diagram of the control unit in the present invention.

[0042] In the figure: 101, detection platform; 102, first electric-controlled turntable; 103, second electric-controlled turntable;

[0043] 201, fixed truncated table; 202, first screw rod; 203, first motor; 204, threaded block; 205, first connecting block; 206, inner slide rod; 207, outer slide rod; 208, LED epitaxial wafer carrier box; 209, restraint sleeve; 210, U-shaped connecting frame; 211, connecting arm; 212, pressure rod; 213, first spring; 214, second spring; 215, connecting piece; 216, damping wheel; 217, U-shaped carrier; 218, first roller; 219, second motor; 220, electromagnet; 221, fixed arm; 222, gantry; 223, electric telescopic cylinder; 224, sliding arm;

[0044] 301, LED epitaxial wafer carrier; 302, adsorption port; 303, barcode identification block; 304, knob cover; 305, adjustment knob; 306, friction ring; 307, third spring; 308, hexagonal prism block; 309, bobbin; 310, pull rope; 311, adjustment plug; 312, reset spring; 313, adjustment chamber; 314, air pressure chamber; 315, connecting chamber; 316, magnetic block. DETAILED DESCRIPTION

[0045] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0046] like Figures 1 to 9 As shown, an embodiment of the present invention provides an LED epitaxial wafer continuous detection device, including a detection platform 101 and a first electrically controlled turntable 102 and a second electrically controlled turntable 103 mounted on the surface of the detection platform 101. The LED epitaxial wafer detection device is mounted on the surface of the detection platform 101, and further includes:

[0047] The LED epitaxial wafer carrier 301 is used to carry LED epitaxial wafers of various specifications. A suction port 302 is provided on the surface of the LED epitaxial wafer carrier 301. Different LED epitaxial wafers are suctioned under negative pressure by controlling the pressure inside the suction port 302.

[0048] A U-shaped carrier 217, used for transporting an LED epitaxial wafer carrier plate 301 carrying an LED epitaxial wafer;

[0049] The electromagnet 220 is used to provide initial kinetic energy to the LED epitaxial wafer carrier 301 during the transportation of the LED epitaxial wafer carrier 301, and fix the LED epitaxial wafer carrier 301 through the electromagnet 220;

[0050] LED epitaxial wafer carrier box 208, used for placing LED epitaxial wafer carrier board 301 carrying LED epitaxial wafers;

[0051] A pressing rod 212, used to press down one of the LED epitaxial wafer carriers 301 carrying the LED epitaxial wafer to a desired position;

[0052] The restraining sleeve 209 is used to cooperate with the magnetic change of the electromagnet 220 to move the LED epitaxial wafer carrier 301 carrying the LED epitaxial wafer into or out of the corresponding LED epitaxial wafer carrier box 208, and to restrain the LED epitaxial wafer carrier 301 that does not need to be moved;

[0053] The damping wheel 216 generates damping for the movement of the U-shaped carrier 217;

[0054] Two groups of first rollers 218 are symmetrically arranged inside the U-shaped carrier 217 for moving the LED epitaxial wafer carrier 301 entering into the U-shaped carrier 217 .

[0055] The electromagnet 220 is installed in a first installation groove opened on the surface of the U-shaped carrier 217 and in a second installation groove opened on the surface of the constraint sleeve 209 .

[0056] In the embodiment of the present invention, each time the second electric-controlled turntable 103 rotates a certain angle, one of the U-shaped carriers 217 is made to face one of the LED epitaxial wafer carrier boxes 208. Initially, the U-shaped carrier 217 corresponds to the height of the uppermost compartment in the compartment inside the LED epitaxial wafer carrier box 208. When the LED epitaxial wafer detection device is installed on the surface of the detection platform 101, a U-shaped carrier 217 may also be provided in its detection area, so that the LED epitaxial wafer carrier board 301 carrying the LED epitaxial wafer is transferred back from the detection area of ​​the detection device to the corresponding U-shaped carrier 217.

[0057] The magnetic blocks 316 on the surface of the LED epitaxial wafer carrier 301 have the same magnetic poles facing outwards;

[0058] The second motor 219 is electrically connected to the corresponding electromagnet 220. When the second motor 219 rotates to make the LED epitaxial wafer carrier 301 leave the interior of the U-shaped carrier 217, the magnetic force generated by the electromagnet 220 repels the magnetic block 316 on the surface of the LED epitaxial wafer carrier 301. When the second motor 219 rotates in the opposite direction, the magnetic force generated by the electromagnet 220 attracts the magnetic block 316 on the surface of the LED epitaxial wafer carrier 301.

[0059] When the LED epitaxial wafer carrier 301 is transferred between two opposite U-shaped carriers 217, the second motor 219 is started, so that the second motor 219 drives one of the first rollers 218 to rotate, so that the LED epitaxial wafer carrier 301 in the U-shaped carrier 217 moves in the direction away from the inside of the U-shaped carrier 217, and at the same time, current is passed into the electromagnet 220 in the U-shaped carrier 217, so that the electromagnet 220 generates magnetic force, and gives the LED epitaxial wafer carrier 301 an initial kinetic energy through the effect of like charges repelling each other, so that the LED epitaxial wafer carrier 301 contacts the first roller 218 driven by the second motor 219, and moves to the inside of the U-shaped carrier 217 located in the detection area under the action of the friction force of the first roller 218;

[0060] The second motor 219 located on the surface of the U-shaped carrier 217 in the detection area is rotated, and the rotation of the second motor 219 drives one of the first rollers 218 to rotate. When the LED epitaxial wafer carrier 301 entering the U-shaped carrier 217 in the detection area contacts the first roller 218, the LED epitaxial wafer carrier 301 continues to move toward the inside of the U-shaped carrier 217 in the detection area through the friction force until the electromagnet 220 with reverse current is tightly adsorbed inside the U-shaped carrier 217, so as to maintain the stability of the LED epitaxial wafer during detection.

[0061] When the LED epitaxial wafer carrier 301 is transferred between the opposite U-shaped carrier 217 and the LED epitaxial wafer carrier box 208, the restraining sleeve 209 and the pressure rod 212 are moved down to a certain position, so that the U-shaped carrier 217 is opposite to one of the compartments of the LED epitaxial wafer carrier box 208, and the restraining sleeve 209 shields several adjacent compartments below the compartment. When the LED epitaxial wafer carrier 301 enters the restraining sleeve 209, the electromagnet 220 in the restraining sleeve 209 is controlled to generate a contact with the LED epitaxial wafer carrier 301. When the LED epitaxial wafer carrier 301 leaves the interior of the constraint sleeve 209, the electromagnet 220 in the constraint sleeve 209 is controlled to generate a magnetism that repels the magnetic block 316 on the surface of the LED epitaxial wafer carrier 301, so that the LED epitaxial wafer carrier 301 can enter and exit the interior of the constraint sleeve 209 easily. At the same time, the constraint sleeve 209 shields several adjacent partitions, so that the remaining LED epitaxial wafer carriers 301 placed in the constraint sleeve 209 are not easily disturbed by the magnetism of the electromagnet 220.

[0062] During the movement of the U-shaped platform 217, the unidirectional rotation of the damping wheel 216 makes the resistance of the U-shaped platform 217 during the resetting process greater than the resistance during the downward movement of the U-shaped platform 217, so as to slow down the resetting speed of the U-shaped platform 217 and keep the LED epitaxial wafer in the U-shaped platform 217 stable.

[0063] like Figures 1 to 8As shown, the LED epitaxial wafer carrier box 208 is arranged in a circular array on the surface of the first electrically controlled turntable 102, and the surface of the second electrically controlled turntable 103 is provided with a plurality of outer slide bars 207 in a circular array. The surfaces of the outer slide bars 207 are all slidably connected with slide arms 224, and the U-shaped carrier 217 is fixedly connected to one end of the slide arm 224. The surface of the detection platform 101 is fixedly connected with a gantry 222, and an electrically controlled telescopic cylinder 223 is installed in a reserved groove opened on the surface of the gantry 222. The end of the output shaft of the electrically controlled telescopic cylinder 223 is fixedly connected with a U-shaped connecting frame 210, and the bottom surface of the U-shaped connecting frame 210 is fixedly connected with a restraining sleeve 209, and the surface of the U-shaped connecting frame 210 is fixedly connected with a connecting arm 211, and the end of the connecting arm 211 away from the U-shaped connecting frame 210 is fixedly connected with a pressure rod 212.

[0064] A fixed truncated table 201 is arranged above the second electrically controlled turntable 103, and a first screw rod 202 is arranged between the fixed truncated table 201 and the second electrically controlled turntable 103. Two ends of the first screw rod 202 are rotatably connected to the second electrically controlled turntable 103 and the fixed truncated table 201 respectively through two first bearings, a first motor 203 is installed on the surface of the fixed truncated table 201, and the output shaft of the first motor 203 is fixedly connected to the first screw rod 202, and a plurality of inner sliding rods 206 are fixedly connected to the bottom surface of the fixed truncated table 201 in a circular array, and the inner sliding rods 206 are fixedly connected to the second electrically controlled turntable 103, and a plurality of fixed arms 221 are fixedly connected to the surface of the fixed truncated table 201 in a circular array, and the fixed arms 221 are fixedly connected to the corresponding outer sliding rods 207, and the sliding arms 224 are slidably connected to the inner sliding rods 206.

[0065] In an embodiment of the present invention, by controlling the extension of the electric telescopic cylinder 223, the constraint sleeve 209 and the connecting arm 211 on the surface of the U-shaped connecting frame 210 are driven to move downward at the same time. The downward movement of the connecting arm 211 drives the pressure rod 212 to move downward. During the downward movement, the pressure rod 212 presses down the sliding arm 224, causing the sliding arm 224 to move downward on the surface of the outer sliding rod 207, so that the corresponding U-shaped carrier 217 is consistent in height with one of the partitions of the corresponding constraint sleeve 209, and several partitions below the partition are blocked, so that the LED epitaxial wafer carrier 301 can be transferred between the U-shaped carrier 217 and the constraint sleeve 209.

[0066] By controlling the operation of the first motor 203, the operation of the first motor 203 causes the first screw rod 202 to rotate, and the rotation of the first screw rod 202 causes the threaded block 204 to drive the first connecting block 205 to slide on the surface of the inner slide rod 206. The first connecting block 205 sliding downward on the surface of the inner slide rod 206 will force the sliding arm 224 to slide downward on the surfaces of the inner slide rod 206 and the outer slide rod 207, thereby driving the U-shaped platform 217 to slide downward until the U-shaped platform 217 moves to a set height. The fixed arm 221 on the surface of the fixed truncated table 201 will slide in the avoidance groove opened on the surface of the pressure rod 212 during the process of the pressure rod 212 pressing down the corresponding sliding arm 224, so as to prevent interference with the action of the pressure rod 212 pressing down the sliding arm 224.

[0067] like Figures 1 to 8 As shown, the surfaces of the outer slide bar 207 and the inner slide bar 206 are respectively provided with a first spring 213 and a second spring 214, the first spring 213 is located above the sliding arm 224, and the second spring 214 is located below the sliding arm 224, the surface of the first screw rod 202 is threadedly connected with a threaded block 204, and the surface of the threaded block 204 is fixedly connected with a plurality of first connecting blocks 205 in an annular array, the first connecting block 205 is slidably connected to the inner slide bar 206, the sliding arm 224 is located below the first connecting block 205, and the sliding arm 224 conflicts with the first connecting block 205.

[0068] The two groups of first rollers 218 are respectively arranged in the receiving grooves symmetrically opened on the surface of the U-shaped carrier 217. The first rollers 218 are fixedly connected to the U-shaped carrier 217 through the third bearing. The surface of the U-shaped carrier 217 is installed with a second motor 219, and the output shaft of the second motor 219 is fixedly connected to one of the first rollers 218.

[0069] In the embodiment of the present invention, the second motor 219 is operated, and the operation of the second motor 219 drives one of the first rollers 218 to operate. When the first roller 218 contacts the LED epitaxial wafer carrier 301, the LED epitaxial wafer carrier 301 is driven to move accordingly through friction.

[0070] like Figures 1 to 8 As shown, a connecting piece 215 is arranged parallel to the bottom surface of the sliding arm 224, and the two connecting pieces 215 are symmetrically arranged on both sides of the corresponding outer sliding rod 207. A damping wheel 216 is symmetrically arranged between the two connecting pieces 215. The damping wheel 216 is rotatably connected to the two connecting pieces 215 through two first one-way bearings, and the damping wheels 216 are in conflict with the outer sliding rod 207.

[0071] In the embodiment of the present invention, the damping wheel 216 between the two connecting pieces 215 is provided with a first one-way bearing so that the damping wheel 216 rolls along the surface of the outer slide bar 207 while following the U-shaped platform 217 to slide downward. At the same time, the elastic potential energy of the first spring 213 and the second spring 214 increases during the downward movement of the U-shaped platform 217. When the pressure rod 212 leaves the surface of the U-shaped platform 217, the U-shaped platform 217 moves upward under the action of the elastic potential energy of the first spring 213 and the second spring 214. The upward movement of the U-shaped platform 217 causes the damping wheel 216 to generate sliding friction with the inner slide bar 206 under the action of the first one-way bearing, thereby increasing the upward movement resistance of the U-shaped platform 217 and preventing the U-shaped platform 217 from moving upward too fast, causing the LED epitaxial wafer carried by the LED epitaxial wafer carrier 301 inside the U-shaped platform 217 to become unstable.

[0072] like Figures 1 to 8 As shown, an adsorption port 302 is provided on the surface of the LED epitaxial wafer carrier 301, a barcode identification block 303 is fixedly connected to the surface of the LED epitaxial wafer carrier 301, a connecting cavity 315, an air pressure cavity 314 and an adjusting cavity 313 are provided inside the LED epitaxial wafer carrier 301, the interiors of the adsorption port 302, the connecting cavity 315, the air pressure cavity 314 and the adjusting cavity 313 are connected in sequence, an adjusting plug 311 is provided inside the air pressure cavity 314, the adjusting plug 311 is slidably connected to the LED epitaxial wafer carrier 301, a reset spring 312 is provided inside the air pressure cavity 314, two ends of the reset spring 312 are respectively fixedly connected to the adjusting plug 311 and the LED epitaxial wafer carrier 301, a magnetic block 316 is symmetrically provided on the surface of the LED epitaxial wafer carrier 301, and the magnetic block 316 is embedded in the first groove provided on the surface of the LED epitaxial wafer carrier 301.

[0073] A bobbin 309 is provided inside the adjustment cavity 313, and the bobbin 309 is rotatably connected to the first circular hole opened on the surface of the LED epitaxial wafer carrier 301 through the fifth bearing. A knob sleeve 304 is fixedly connected to the surface of the LED epitaxial wafer carrier 301, and an adjustment knob 305 is slidably connected inside the knob sleeve 304. A friction ring 306 is fixedly connected to the surface of the adjustment knob 305, and a third spring 307 is provided inside the knob sleeve 304. The surface of the third spring 307 conflicts with the LED epitaxial wafer carrier 301 and the friction ring 306. A hexagonal prism block 308 is fixedly connected to the bottom surface of the adjustment knob 305, and the hexagonal prism block 308 is slidably connected to the slide groove opened on the surface of the bobbin 309. A pull rope 310 is provided inside the LED epitaxial wafer carrier 301, and the two ends of the pull rope 310 are respectively fixedly connected to the bobbin 309 and the adjustment plug 311, and the upper surface of the friction ring 306 and the inner top surface of the knob sleeve 304 are both rough.

[0074] In the embodiment of the present invention, the barcode identification block 303 on the surface of the LED epitaxial wafer carrier 301 aligns the LED epitaxial wafer carrier 301 with the LED epitaxial wafer it carries, and the LED epitaxial wafer is positioned by the barcode identification block 303, so that the defect information scanned by the LED epitaxial wafer can be quickly found. When the LED epitaxial wafer is placed on the LED epitaxial wafer carrier 301, the suction port 302 is located near the center of the surface of the LED epitaxial wafer, and the adjustment knob 305 is pressed downward and twisted inside the knob sleeve 304. The rotation of the adjustment knob 305 drives the spool 309 to rotate through the hexagonal prism block 308. The rotation of the spool 309 causes the pull rope 310 to be rolled up on the surface of the spool 309. The rolling up of the spool 309 causes the adjustment plug 311 to move toward the inside of the adjustment cavity 313. The adjusting plug 311 moves in the direction of the stretching reset spring 312, and the movement of the adjusting plug 311 makes the gas inside the adsorption port 302 flow into the adjusting chamber 313 through the connecting chamber 315, and reduces the pressure inside the adsorption port 302 to form a negative pressure to adsorb the LED epitaxial wafer placed on the surface of the LED epitaxial wafer carrier 301. When the adjusting knob 305 is released, the adjusting knob 305 drives the friction ring 306 to contact the inner top surface of the knob sleeve 304 under the action of the elastic potential energy of the third spring 307. The friction force between the friction ring 306 and the knob sleeve 304 keeps the bobbin 309 stationary, so that the position of the adjusting plug 311 remains stable. When the LED epitaxial wafer needs to be taken out, the adjusting knob 305 can be reset by pressing it downward inside the knob sleeve 304 and twisting it in the opposite direction.

[0075] like Fig. 9 As shown, the control unit includes:

[0076] Real-time monitoring module: used to collect the working status of each inspection station and the defect data of LED epitaxial wafers;

[0077] The rapid screening module is used to calculate the probability of scrap-level defects in various areas on the surface of LED epitaxial wafers based on historical data, and to prioritize data collection for areas with a high probability of scrap-level defects.

[0078] The dynamic scheduling module is used to group each inspection station based on its average processing time to form multiple inspection echelons. The inspection stations in the same inspection echelon inspect the LED epitaxial wafers at the same time, and different echelons inspect in order. The real-time defect data of the LED epitaxial wafers is analyzed, and the station priority corresponding to the optimized LED epitaxial wafer inspection is output to balance the processing speed differences between different stations.

[0079] In the embodiment of the present invention, the state parameters of the inspection station are first collected: working time, working status, type and quantity of the currently inspected LED epitaxial wafer, etc., and the defect position coordinates are obtained based on the collection of each station. and defect type (Such as scratches, defects, pollution, etc.).

[0080] Defect Data Matrix for:

[0081] ;

[0082] in, Indicates The number of the data point, is the total number of data points.

[0083] Workstation status model for:

[0084] ;

[0085] in, For the The status of each detection station, It is the average processing time, which is used to measure the long-term performance of the inspection station and reflect the stability and efficiency of the station. The current processing time is used to monitor the working status of the current workstation and determine whether there is a delay or bottleneck. It measures the load of the workstation based on the number of LED epitaxial wafers currently being processed.

[0086] Calculate the area of ​​each LED epitaxial wafer based on historical data statistics Probability of scrap-level defects :

[0087] ;

[0088] in, is the number of scrap-level defects, is the total number of tests.

[0089] In the continuous inspection of large quantities of LED epitaxial wafers, different inspection equipment is respectively used for different inspection stations. According to the different inspection times of each inspection station, the problem of early termination of inspection due to scrap-level defects is solved, and the inspection path is optimized to improve the inspection efficiency, that is, to minimize the total time to complete the inspection of LED epitaxial wafers and avoid waste of resources. If a certain LED epitaxial wafer has scrap-level defects, the subsequent inspection can be terminated directly to save inspection resources. According to the inspection time of the inspection station, short-time inspection tasks are given priority to reduce waiting time and total inspection time. Dynamic scheduling algorithms (such as polling scheduling or load balancing) are used to allocate inspection tasks to avoid long-term idleness or overload of certain stations. LED epitaxial wafers are grouped according to the estimated defect risk, and high-risk groups are processed first to reduce the probability of scrap being transferred to subsequent stations. Parallel inspection tasks are arranged as much as possible to fully utilize the capabilities of multiple inspection stations.

[0090] Each inspection station is grouped based on the average processing time of each inspection station to form multiple inspection echelons. The inspection stations in the same inspection echelon inspect the LED epitaxial wafers at the same time, and the inspections in different echelons are carried out in the echelon order. Specifically, the following steps are included:

[0091] S1, calculate the average processing time of each station :

[0092] ;

[0093] in, For workstation For The processing time of a LED epitaxial wafer is is the total number of processed LED epitaxial wafers.

[0094] S2, grouping into inspection echelons. Based on the processing capacity of the workstations, the inspection stations are divided into several echelons:

[0095] ;

[0096] in, For the echelons, is the time difference threshold, which is used to define the range of workstation groups. is the processing time of the workstation, The lowest average processing time among all workstations, used as a reference benchmark for the group.

[0097] S3, workstations within each echelon work in parallel, and work between echelons in sequence;

[0098] S4, when the average processing time between workstations varies greatly, the inspection order is optimized by redividing the echelons. For the new echelons, tasks are assigned first according to the lightest load to ensure that the overall inspection efficiency is maximized.

[0099] Analyze the real-time defect data of LED epitaxial wafers and output the workstation priority corresponding to the optimized LED epitaxial wafer inspection, including:

[0100] Track the working status of the workstations in real time, and give priority to allocating new LED epitaxial wafers to the workstations with the shortest idle time. When any workstation detects defective products, the detection is terminated and the working status of the workstation is updated. Calculate the priority of the workstation, where The priority assigned to the workstation, For workstation The detection time, For workstation The length of the current task queue, is the weight coefficient of queue length, For workstation The idle state, is the weight coefficient of the idle state, For workstation The historical detection efficiency of is the weight coefficient of detection efficiency, For workstation The historical scrap probability, is the weight coefficient of scrap probability.

[0101] In the embodiment of the present invention, by real-time analysis of the detection status of LED epitaxial wafers and the working status of workstations, the detection path is dynamically adjusted, and new LED epitaxial wafers are preferentially allocated to workstations with short idle time, thereby improving the overall detection efficiency. Specific optimizations include: preferentially detecting waste-level LED epitaxial wafers to avoid wasting time at subsequent workstations; dynamically calculating the priority of workstation allocation , LED epitaxial wafers are allocated according to priority.

[0102] The priority formula is:

[0103] ;

[0104] in, It is an inverse term of the core time and the queue length. By comprehensively considering the time and the queue, the workstations with short tasks and short queues are given priority in task allocation. Prioritize the allocation of idle workstations. If idle, If you are working, , The larger the value, the more inclined to assign tasks to idle stations, dynamically guiding the LED epitaxial wafers to be assigned to idle stations to avoid waste of resources; For the workstation history detection efficiency, A larger value means more reliance on the historical performance of the workstation, giving priority to using high-efficiency workstations to improve the overall inspection quality; The impact of the historical scrap rate of the workstation, The larger the value, the more emphasis is placed on the impact of scrap rate on workstation selection. By lowering the priority of workstations with high scrap rates, we can avoid wasting resources on workstations with high error rates.

[0105] A method for continuous detection of LED epitaxial wafers, comprising the following steps:

[0106] Step 1: Install the equipment required for LED epitaxial wafer testing on the surface of the testing platform 101;

[0107] Step 2: Place the LED epitaxial wafer to be tested in the internal compartment of the LED epitaxial wafer carrier 301, twist the adjustment knob 305 to control the LED epitaxial wafer carrier 301 to perform negative pressure adsorption on the LED epitaxial wafer, and place the LED epitaxial wafer carrier 301 carrying the LED epitaxial wafer in the LED epitaxial wafer carrier box 208;

[0108] Step 3, by rotating the second electrically controlled turntable 103, the corresponding U-shaped carrier 217 faces the corresponding LED epitaxial wafer testing equipment, and the LED epitaxial wafer carrier plate 301 carrying the tested LED epitaxial wafers is transferred to the LED epitaxial wafer carrier box 208;

[0109] Step four, in step three, after one of the U-shaped platforms 217 is moved to the set position, the restraint sleeve 209 is sleeved on the surface of one of the LED epitaxial wafer carrier boxes 208 through the extension and contraction of the electric-controlled telescopic cylinder 223. At the same time, as the electric-controlled telescopic cylinder 223 is extended, the pressure rod 212 presses the corresponding U-shaped platform 217 down to the set position, and through the push of the magnetic force of the electromagnet 220 and the operation of the second motor 219, the corresponding LED epitaxial wafer carrier plate 301 is transferred between the LED epitaxial wafer carrier box 208 and the U-shaped platform 217.

[0110] It should be noted that the use of the first electrically controlled turntable 102 and the second electrically controlled turntable 103 is well known in the prior art and will not be described in detail here; the device can be used in conjunction with other devices according to different detection requirements of LED epitaxial wafers, such as X-ray photoelectron spectrometer (XPS), X-ray detection equipment, laser interferometer, automatic optical detection equipment (AOI), acoustic microscope (SAM), infrared spectrometer (FTIR), etc. The installation and use of the above-mentioned devices are well known in the prior art and will not be described here; the sliding arm 224 is slidably connected to the inner sliding rod 206 and the outer sliding rod 207 respectively through two first sliding holes opened on the surface; the first connecting block 205 is slidably connected to the first motor 203 through the second sliding hole opened on the surface; the output shaft of the second motor 219 is fixedly connected to the first roller 218 through the first through hole opened on the surface of the U-shaped carrier 217;

[0111] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A continuous detection device for LED epitaxial wafers, comprising a detection platform (101) and a first electrically controlled turntable (102) and a second electrically controlled turntable (103) mounted on the surface of the detection platform (101), wherein the LED epitaxial wafer detection device is mounted on the surface of the detection platform (101), characterized in that: Also includes: An LED epitaxial wafer carrier (301) is used to carry LED epitaxial wafers of various specifications, a suction port (302) is provided on the surface of the LED epitaxial wafer carrier (301), and negative pressure suction is performed on different LED epitaxial wafers by controlling the pressure inside the suction port (302); A U-shaped carrier (217) used for transporting the LED epitaxial wafer carrier plate (301) carrying the LED epitaxial wafer; The electromagnet (220) is used to provide initial kinetic energy to the LED epitaxial wafer carrier (301) during the transportation of the LED epitaxial wafer carrier (301), and to fix the LED epitaxial wafer carrier (301) through the electromagnet (220); An LED epitaxial wafer carrier box (208) for placing the LED epitaxial wafer carrier plate (301) carrying the LED epitaxial wafer; A pressing rod (212) used to press down one of the LED epitaxial wafer carriers (301) carrying the LED epitaxial wafer to a required position; A restraining sleeve (209) is used to cooperate with the magnetic change of the electromagnet (220) to move the LED epitaxial wafer carrier (301) carrying the LED epitaxial wafer into or out of the corresponding LED epitaxial wafer carrier box (208), and to restrain the LED epitaxial wafer carrier (301) that does not need to be moved; A damping wheel (216) for generating damping on the movement of the U-shaped carrier (217); Two groups of first rollers (218) are symmetrically arranged inside the U-shaped carrier (217) and are used to move the LED epitaxial wafer carrier (301) that enters the U-shaped carrier (217); The electromagnet (220) is installed in a first installation groove opened on the surface of the U-shaped carrier (217) and in a second installation groove opened on the surface of the constraint sleeve (209); Also included is a control unit, the control unit comprising: Real-time monitoring module, used to collect the working status of each inspection station and the defect data of LED epitaxial wafers; The rapid screening module is used to calculate the probability of scrap-level defects in various areas on the surface of LED epitaxial wafers based on historical data, and to prioritize data collection for areas with a high probability of scrap-level defects. The dynamic scheduling module is used to group each inspection station based on its average processing time to form multiple inspection echelons. The inspection stations in the same inspection echelon inspect the LED epitaxial wafers at the same time, and different echelons inspect in order. The real-time defect data of the LED epitaxial wafers is analyzed, and the station priority corresponding to the optimized LED epitaxial wafer inspection is output to balance the processing speed differences between different stations.

2. The LED epitaxial wafer continuous detection device according to claim 1, characterized in that: The LED epitaxial wafer carrier box (208) is arranged in a circular array on the surface of the first electrically controlled turntable (102); the surface of the second electrically controlled turntable (103) is provided with a plurality of outer sliding rods (207) in a circular array; the surfaces of the outer sliding rods (207) are all slidably connected to sliding arms (224); the U-shaped carrier (217) is fixedly connected to one end of the sliding arm (224); the surface of the detection platform (101) is fixedly connected to a gantry (222); an electrically controlled telescopic cylinder (223) is installed in a reserved groove on the surface of the gantry (222); the end of the output shaft of the electrically controlled telescopic cylinder (223) is fixedly connected to a U-shaped connecting frame (210); the U-shaped A restraining sleeve (209) is fixedly connected to the bottom surface of the connecting frame (210), a connecting arm (211) is fixedly connected to the surface of the U-shaped connecting frame (210), and a pressure rod (212) is fixedly connected to one end of the connecting arm (211) away from the U-shaped connecting frame (210). Two groups of the first rollers (218) are respectively arranged in receiving grooves symmetrically opened on the surface of the U-shaped platform (217), and the first rollers (218) are fixedly connected to the U-shaped platform (217) via a third bearing. A second motor (219) is installed on the surface of the U-shaped platform (217), and an output shaft of the second motor (219) is fixedly connected to one of the first rollers (218).

3. The LED epitaxial wafer continuous detection device according to claim 2, characterized in that: A fixed truncated table (201) is arranged above the second electrically controlled turntable (103), a first screw rod (202) is arranged between the fixed truncated table (201) and the second electrically controlled turntable (103), two ends of the first screw rod (202) are rotatably connected to the second electrically controlled turntable (103) and the fixed truncated table (201) respectively through two first bearings, a first motor (203) is mounted on the surface of the fixed truncated table (201), and an output shaft of the first motor (203) is connected to the second electrically controlled turntable (103). The first screw rod (202) is fixedly connected, the bottom surface of the fixed truncated table (201) is fixedly connected with a plurality of inner sliding rods (206) in a circular array, the inner sliding rods (206) are fixedly connected to the second electrically controlled turntable (103), the surface of the fixed truncated table (201) is fixedly connected with a plurality of fixed arms (221) in a circular array, the fixed arms (221) are fixedly connected with the corresponding outer sliding rods (207), and the sliding arms (224) are slidably connected with the inner sliding rods (206).

4. The LED epitaxial wafer continuous detection device according to claim 3, characterized in that: A first spring (213) and a second spring (214) are respectively arranged on the surfaces of the outer sliding rod (207) and the inner sliding rod (206); the first spring (213) is located above the sliding arm (224), and the second spring (214) is located below the sliding arm (224); a threaded block (204) is threadedly connected to the surface of the first screw rod (202); a plurality of first connecting blocks (205) are fixedly connected to the surface of the threaded block (204) in an annular array; the first connecting block (205) is slidably connected to the inner sliding rod (206); the sliding arm (224) is located below the first connecting block (205), and the sliding arm (224) is in conflict with the first connecting block (205).

5. The LED epitaxial wafer continuous detection device according to claim 4, characterized in that: A connecting piece (215) is arranged parallel to the bottom surface of the sliding arm (224); the two connecting pieces (215) are symmetrically arranged on both sides of the corresponding outer sliding rod (207); the damping wheel (216) is symmetrically arranged between the two connecting pieces (215); the damping wheel (216) is rotatably connected to the two connecting pieces (215) via two first one-way bearings; and the damping wheels (216) are in contact with the outer sliding rod (207).

6. The LED epitaxial wafer continuous detection device according to claim 5, characterized in that: The surface of the LED epitaxial wafer carrier (301) is provided with an adsorption port (302), the surface of the LED epitaxial wafer carrier (301) is fixedly connected with a barcode identification block (303), the interior of the LED epitaxial wafer carrier (301) is provided with a connecting cavity (315), an air pressure cavity (314) and an adjusting cavity (313), the adsorption port (302), the connecting cavity (315), the air pressure cavity (314) and the interior of the adjusting cavity (313) are connected in sequence, and the interior of the air pressure cavity (314) is provided with an adjusting plug. (311), the regulating plug (311) is slidably connected to the LED epitaxial wafer carrier (301), a return spring (312) is arranged inside the air pressure chamber (314), two ends of the return spring (312) are respectively fixedly connected to the regulating plug (311) and the LED epitaxial wafer carrier (301), and a magnetic block (316) is symmetrically arranged on the surface of the LED epitaxial wafer carrier (301), and the magnetic block (316) is embedded in a first groove opened on the surface of the LED epitaxial wafer carrier (301).

7. The LED epitaxial wafer continuous detection device according to claim 6, characterized in that: A bobbin (309) is disposed inside the adjustment cavity (313); the bobbin (309) is rotatably connected to a first circular hole opened on the surface of the LED epitaxial wafer carrier (301) via a fifth bearing; a knob sleeve (304) is fixedly connected to the surface of the LED epitaxial wafer carrier (301); an adjustment knob (305) is slidably connected inside the knob sleeve (304); a friction ring (306) is fixedly connected to the surface of the adjustment knob (305); a third spring (307) is disposed inside the knob sleeve (304); and the surface of the third spring (307) is The adjusting knob (305) is in conflict with the LED epitaxial wafer carrier (301) and the friction ring (306); the bottom surface of the adjusting knob (305) is fixedly connected to a hexagonal prism block (308); the hexagonal prism block (308) is slidably connected to a slide groove provided on the surface of the spool (309); a pull rope (310) is provided inside the LED epitaxial wafer carrier (301); two ends of the pull rope (310) are respectively fixedly connected to the spool (309) and the adjusting plug (311); and the upper surface of the friction ring (306) and the inner top surface of the knob sleeve (304) are both roughened.

8. The LED epitaxial wafer continuous detection device according to claim 7, characterized in that: Analyze the real-time defect data of LED epitaxial wafers and output the workstation priority corresponding to the optimized LED epitaxial wafer inspection, including: Track the working status of the workstations in real time, and give priority to allocating new LED epitaxial wafers to the workstations with the shortest idle time. When any workstation detects defective products, the detection is terminated and the working status of the workstation is updated. Calculate the priority of the workstation, where The priority assigned to the workstation, For workstation The detection time, For workstation The length of the current task queue, is the weight coefficient of queue length, For workstation The idle state, is the weight coefficient of the idle state, For workstation The historical detection efficiency of is the weight coefficient of detection efficiency, For workstation The historical scrap probability, is the weight coefficient of scrap probability.

9. A method for continuous detection of LED epitaxial wafers, applied to the device as claimed in any one of claims 7 to 8, comprising the following steps: Step 1, installing equipment required for LED epitaxial wafer testing on the surface of the testing platform (101); Step 2: placing the LED epitaxial wafer to be tested in the internal compartment of the LED epitaxial wafer carrier (301), controlling the LED epitaxial wafer carrier (301) to perform negative pressure adsorption on the LED epitaxial wafer by twisting the adjustment knob (305), and placing the LED epitaxial wafer carrier (301) carrying the LED epitaxial wafer in the interior of the LED epitaxial wafer carrier box (208); Step three, by rotating the second electrically controlled turntable (103), the corresponding U-shaped carrier (217) is directed toward the corresponding LED epitaxial wafer testing equipment, and the LED epitaxial wafer carrier plate (301) carrying the tested LED epitaxial wafer is transferred to the LED epitaxial wafer carrier box (208); Step 4. In step 3, after one of the U-shaped carriers (217) is moved to the set position, the restraining sleeve (209) is sleeved on the surface of one of the LED epitaxial wafer carrier boxes (208) by the extension and contraction of the electrically controlled telescopic cylinder (223). At the same time, as the electrically controlled telescopic cylinder (223) is extended, the pressure rod (212) presses the corresponding U-shaped carrier (217) down to the set position, and the corresponding LED epitaxial wafer carrier (301) is transferred between the LED epitaxial wafer carrier box (208) and the U-shaped carrier (217) by the push of the magnetic force of the electromagnet (220) and the operation of the second motor (219).

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