Sensor member and method for manufacturing sensor member

Abstract

The invention provides a sensor member and a manufacturing method of the sensor member. The sensor member can be easily manufactured even under the condition of different specifications. A sensor member (11) is provided with: a sensor (12); a wire member (13) connected to the sensor (12); a fixing bracket (15); and a resin molded member (16) which covers the sensor (12) and a part of the wire member (13) pulled out from the sensor (12) and is integrally molded with the fixing bracket (15). The resin molded member (16) has: a primary molded part (31) that covers the sensor (12) and a part of the wire member (13) pulled out from the sensor (12); and a secondary molding part (32) for molding the primary molding part (31) and the fixing bracket (15) as inserts.

Description

Technical Field

[0001] The present invention relates to a sensor component and a method for manufacturing the sensor component. Background Art

[0002] Conventionally, there is a sensor component such as a wheel speed sensor that includes a sensor, a wire component connected to the sensor, a fixing bracket, and a resin molded component that molds these components as an insert (for example, see Patent Document 1). The resin molded component covers the sensor and a portion of the wire component pulled out from the sensor and is integrally molded with the fixing bracket. Such a sensor component, for example, fixes the fixing bracket to a vehicle, and the sensor detects the rotation of the wheel.

[0003] Prior art literature Patent Literature Patent Document 1: Japanese Patent Application Publication No. 2015-141129

[0004] Problems to be solved by the invention

[0005] However, the specifications of the fixing bracket of the sensor component described above may differ depending on the vehicle model to be fixed, for example. Therefore, for example, a large mold for molding a large-sized resin molded component needs to be produced for each specification. This, for example, causes an increase in manufacturing costs. Summary of the invention

[0006] An object of the present disclosure is to provide a sensor member and a method for manufacturing the sensor member, which can be easily manufactured even when the specifications are different.

[0007] Technical solutions to solve problems

[0008] The sensor component disclosed in the present invention comprises: a sensor; a wire component connected to the sensor; a fixing bracket; and a resin molded component covering the sensor and a portion of the wire component pulled out from the sensor and molded integrally with the fixing bracket, wherein the resin molded component has: a primary molded portion covering the sensor and a portion of the wire component pulled out from the sensor; and a secondary molded portion molding the primary molded portion and the fixing bracket as an embedded part.

[0009] Effects of the Invention

[0010] According to the sensor member and the method for manufacturing the sensor member of the present disclosure, even when the specifications are different, they can be easily manufactured. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a perspective view of a sensor component in one embodiment. Figure 2 is a side view of a sensor component in one embodiment. Figure 3 It is a partial side view of a primary molded portion in one embodiment. Figure 4 It is a partial three-dimensional view of a primary molded portion in one embodiment. Figure 5 It is a partially cut-away perspective view of a primary molded portion in one embodiment.

[0012] Description of symbols 11 Sensor components 12 Sensors 13 Wire components 14 Sensor holder 15 Fixing bracket 15a Sensor fixing part 15b External fixing part 15c Through hole 15d Fixing hole 15e Export concave 15f Main surface 16 Resin molded components 21 Wire 21a Core wire 21b Insulation coating 22 Exterior Parts 23 Metal ring 31 Primary molding department 31a Front end 31b Middle 31c Connection 31d Anti-rotation part 31e Melt Rib 32 Secondary molding department 32a Secondary connection 32b Through section 32c Bend lead-out section DETAILED DESCRIPTION

[0013] [Description of Embodiments of the Present Disclosure]

[0014] First, embodiments of the present disclosure are listed for description.

[0015] The sensor member of the present disclosure is

[0016] [1] A sensor component comprising: a sensor; a wire component connected to the sensor; a fixing bracket; and a resin molded component covering the sensor and a portion of the wire component pulled out from the sensor and integrally molded with the fixing bracket, wherein the resin molded component has: a primary molded portion covering the sensor and a portion of the wire component pulled out from the sensor; and a secondary molded portion molding the primary molded portion and the fixing bracket as an embedded part.

[0017] According to this structure, the resin molded component has a primary molded portion that covers a portion of the sensor and the wire component, and a secondary molded portion that molds the primary molded portion and the fixing bracket as an insert, so that sensor components of different specifications can be easily obtained by using the primary molded portion as a common component. That is, the sensor component, for example, has a fixing bracket whose specifications are different depending on the type of vehicle to be fixed. And, for example, by producing the primary molded portion as a common component, parts with different specifications can be handled by only a small change in the mold. Therefore, sensor components of different specifications can be easily manufactured. As a result, for example, a reduction in manufacturing costs can be achieved.

[0018] [2] In the above [1], the fixing bracket may have a through hole through which the secondary molded portion passes, and the secondary molded portion may have a bent lead-out portion that is bent outside the through hole and leads out the wire member.

[0019] According to this structure, the secondary molding part has a bent lead-out part, which is bent outside the through hole of the fixing bracket and leads out the wire component, so that the wire component can be stably pulled out in a direction intersecting the axis of the through hole, and the thinning in the direction in which the axis of the through hole extends can be achieved. Thus, for example, it is possible to stably suppress the situation in which the wire component contacts other components. That is, for example, in the case where the space for the installation object of the sensor component is small in the direction in which the axis of the through hole extends, the sensor component can be installed in a manner that the wire component does not contact the installation object.

[0020] [3] In the above [2], the fixing bracket may be formed in a plate shape and have a fixing hole that passes through the fixing bracket in parallel with the through hole. The fixing bracket may also have a lead-out recess that is recessed in a manner such that at least a portion of the bent lead-out portion is embedded therein.

[0021] According to this structure, the fixing bracket is formed in a plate shape and has a fixing hole that passes through the through hole in parallel, and also has a lead-out recess that is recessed in a manner for burying at least a portion of the bent lead-out portion, thereby achieving further thinning in the direction in which the axis of the through hole extends.

[0022] [4] In any one of the above [1] to [3], the primary molded portion may include a connecting portion, the connecting portion is connected to the secondary molded portion, and the connecting portion includes a rotation stop portion in a portion in the circumferential direction.

[0023] According to this configuration, the primary molded portion includes the connection portion connected to the secondary molded portion, and the connection portion includes the anti-rotation portion in a portion in the circumferential direction. Therefore, it is possible to suppress the primary molded portion from rotating relative to the secondary molded portion.

[0024] The manufacturing method of the sensor component disclosed in the present invention is

[0025] [5] A method for manufacturing a sensor component, the sensor component comprising: a sensor; a wire component connected to the sensor; a fixing bracket; and a resin molded component covering the sensor and a portion of the wire component pulled out from the sensor and being integrally molded with the fixing bracket, wherein the method for manufacturing the sensor component comprises: a first molding step of molding a primary molding portion, the primary molding portion covering the sensor and a portion of the wire component pulled out from the sensor and being a portion of the resin molded component; and a second molding step of molding a secondary molding portion using the primary molding portion and the fixing bracket as an insert, the secondary molding portion being a portion of the resin molded component.

[0026] According to this method, the resin molded component has a primary molded portion that covers a portion of the sensor and the wire component, and a secondary molded portion that molds the primary molded portion and the fixing bracket as an insert, so that sensor components of different specifications can be easily obtained by using the primary molded portion as a common component. That is, the sensor component, for example, has a fixing bracket whose specifications are different depending on the type of vehicle to be fixed. And, for example, by producing the primary molded portion as a common component in the first molding process, parts of different specifications can be handled by only a small change of the mold in the second molding process. Therefore, sensor components of different specifications can be easily manufactured. As a result, for example, a reduction in manufacturing costs can be achieved.

[0027] [6] In the above [5], the first molded portion may have a connecting portion, the connecting portion is connected to the secondary molded portion, a molten rib is formed around the connecting portion in the first molding step, and the molten rib is melted in the second molding step.

[0028] According to this method, the primary molded part has a connecting part connected to the secondary molded part, and in the first molding step, a molten rib is formed around the connecting part, and the molten rib is melted in the second molding step, so that the primary molded part and the secondary molded part can be firmly connected. In addition, high waterproofness of the boundary between the primary molded part and the secondary molded part can be ensured.

[0029] [Details of the embodiments of the present disclosure]

[0030] Specific examples of the sensor components disclosed in the present invention are described below with reference to the accompanying drawings. In each of the drawings, for the sake of convenience of explanation, a part of the structure is sometimes exaggerated or simplified. In addition, the size ratios of the various parts are sometimes different in the various drawings. The "parallel", "orthogonal", and "perfect circle" in this specification include not only the cases of strict parallelism, orthogonality, and perfect circle, but also the cases of approximately parallelism, orthogonality, and perfect circle within the range of the effects of the present embodiment. In addition, the present invention is not limited to these examples, but is shown by the claims, and is intended to include all changes within the meaning and scope equivalent to the claims.

[0031] (Structure of Sensor Member 11)

[0032] like Figure 1 and Figure 2 As shown, the sensor member 11 includes a sensor 12, a wire member 13, a sensor holder 14, a fixing bracket 15, and a resin molded member 16. The sensor member 11 of this embodiment is, for example, a wheel speed sensor in which the fixing bracket 15 is fixed to a vehicle and the sensor 12 detects rotation of a wheel.

[0033] (Structure of sensor 12)

[0034] The sensor 12 is a rotation detection sensor capable of detecting a change in a magnetic field due to the rotation of a wheel, and is, for example, a quadrilateral plate-shaped Hall IC.

[0035] (Structure of Electric Wire Member 13)

[0036] The wire component 13 has two wires 21 and an outer casing 22. The wire 21 includes: a core wire 21a, which has conductivity; and an insulating coating 21b, which surrounds the outer periphery of the core wire 21a and has insulation. The outer casing 22 is made of a flexible material such as polyurethane, and bundles and covers the two wires 21. In addition, the wire component 13 is connected to the sensor 12. In detail, the ends of the two wires 21 are arranged to be exposed to the outside of the outer casing 22, and the core wires 21a of the two wires 21 are connected to the sensor 12.

[0037] (Structure of Sensor Holder 14)

[0038] The sensor holder 14 is made of a resin material. The sensor holder 14 holds the sensor 12 . In addition, the sensor holder 14 holds the connection state of the core wires 21 a of the two electric wires 21 and the sensor 12 .

[0039] (Structure of the fixing bracket 15)

[0040] The fixing bracket 15 is made of a resin material and is formed in a plate shape. The fixing bracket 15 has a disc-shaped sensor fixing portion 15a and an outer fixing portion 15b protruding outward from a part of the outer periphery of the sensor fixing portion 15a.

[0041] And, if Figure 2 As shown, the sensor fixing portion 15a has a through hole 15c. The through hole 15c penetrates the sensor fixing portion 15a along the axis of the plate thickness of the fixing bracket 15. The through hole 15c is formed in the center of the sensor fixing portion 15a. In addition, the external fixing portion 15b has a fixing hole 15d that penetrates in parallel with the through hole 15c. A cylindrical metal collar 23 is provided on the inner surface of the fixing hole 15d.

[0042] In addition, the sensor fixing portion 15a has a lead-out recess 15e extending from the opening end of the through hole 15c to the outer edge of the sensor fixing portion 15a. The lead-out recess 15e is recessed relative to one main surface 15f of the plate-shaped fixing bracket 15. In other words, the plate thickness of the portion of the plate-shaped fixing bracket 15 where the lead-out recess 15e is formed is formed thinner than that of other portions. The cross section of the lead-out recess 15e, which is orthogonal to the direction in which the lead-out recess 15e extends, is formed in an arc shape.

[0043] (Structure of Resin Molded Member 16)

[0044] The resin molded member 16 is made of a resin material. The resin molded member 16 covers the sensor 12, the sensor holder 14, and a portion of the wire member 13 pulled out from the sensor 12, and is integrally molded with the fixing bracket 15. That is, in the finished product of the sensor member 11, the fixing bracket 15 and the resin molded member 16 are an integrally molded product.

[0045] The resin molded member 16 includes a primary molded portion 31 covering the sensor 12 , the sensor holder 14 , and a portion of the wire member 13 pulled out from the sensor 12 , and a secondary molded portion 32 molded with the primary molded portion 31 and the fixing bracket 15 as an insert.

[0046] In detail, Figure 3As shown, the primary molded portion 31 is composed of a quadrangular column-shaped front end portion 31 a, a cylindrical middle portion 31 b, and a cylindrical connecting portion 31 c having a smaller diameter than the middle portion 31 b, which are continuously arranged in this order on a straight line.

[0047] The front end portion 31a covers the sensor holder 14 including the sensor 12. The intermediate portion 31b and the connecting portion 31c cover a portion of the electric wire member 13 pulled out from the sensor 12. The electric wire member 13 protrudes and extends to the outside from the end of the connecting portion 31c.

[0048] In addition, if Figures 3 to 5 As shown, the connecting portion 31c has a rotation stop portion 31d in a part of the circumferential direction. Figure 3 ) is connected to the secondary molded part 32. Furthermore, the anti-rotation part 31d is formed into a shape that can be engaged with the secondary molded part 32 in the circumferential direction in a manner that the primary molded part 31 does not rotate relative to the secondary molded part 32. The anti-rotation part 31d of this embodiment is provided with two anti-rotation parts 31d at equal intervals on the outer periphery of the connecting part 31c. The anti-rotation part 31d is a flat surface of a shape obtained by removing a part of the outer periphery of the cylindrical connecting part 31c. The two anti-rotation parts 31d are formed in parallel.

[0049] In addition, if Figure 3 and Figure 4 As shown, in a state before the secondary molded portion 32 is formed, the connecting portion 31c has a molten rib 31e around it. The molten rib 31e is provided on the entire outer periphery of the connecting portion 31c. That is, the molten rib 31e is provided in a ring shape. The molten rib 31e protrudes thinly so as to melt when the secondary molded portion 32 is formed. Three molten ribs 31e are provided at intervals on the connecting portion 31c. Two molten ribs 31e are provided at positions sandwiching the rotation stop portion 31d.

[0050] like Figure 1 and Figure 2 As shown, the secondary molded portion 32 includes: a cylindrical secondary connecting portion 32a; a cylindrical through portion 32b that extends continuously from the secondary connecting portion 32a and has a smaller diameter than the secondary connecting portion 32a; and a curved lead-out portion 32c that extends curvedly from the through portion 32b.

[0051] The secondary connection portion 32a is molded by using the primary molded portion 31 as an insert, thereby covering the connection portion 31c of the primary molded portion 31 and a portion of the electric wire member 13 protruding from the connection portion 31c, and being connected to the connection portion 31c.

[0052] The through portion 32b is filled inside the through hole 15c of the fixing bracket 15, thereby covering a portion of the wire member 13 and penetrating the through hole 15c. Furthermore, the curved lead-out portion 32c covers a portion of the wire member 13 and extends in a curved manner outside the through hole 15c. Furthermore, the wire member 13 is led out from the front end of the curved lead-out portion 32c. In addition, the curved lead-out portion 32c is configured so that a portion is buried in the lead-out recess 15e.

[0053] The fixing bracket 15 of the sensor member 11 configured as described above is mounted on a vehicle. The sensor member 11 of this embodiment is mounted near a wheel of the vehicle by bolts (not shown) penetrating the fixing holes 15 d , more specifically, the ferrules 23 .

[0054] Next, a method for manufacturing the sensor member 11 configured as described above will be described.

[0055] The method for manufacturing the sensor member 11 includes a pre-process, a first molding process, and a second molding process. In the pre-process, a member in which the sensor 12, the wire member 13, and the sensor holder 14 are assembled, and the fixing bracket 15 are prepared.

[0056] Then, in the first molding step, the primary molding part 31 is molded to cover the sensor 12, the sensor holder 14, and a portion of the wire member 13 pulled out from the sensor 12. That is, in the first molding step, the assembly of the sensor 12, the wire member 13, and the sensor holder 14 is placed as an insert in a mold (not shown), and the mold is filled with molten resin, thereby molding the primary molding part 31. In this first molding step, a molten rib 31e is molded around the connecting portion 31c (see Figure 3 and Figure 4 ), the molten rib 31e is melted in the second molding process.

[0057] Then, in the second molding step, the secondary molding part 32 is molded using the primary molding part 31 and the fixing bracket 15 as inserts. That is, in the second molding step, the primary molding part 31 and the fixing bracket 15 are placed as inserts in a mold (not shown), and molten resin is filled into the mold to mold the secondary molding part 32. In this way, the manufacturing of the sensor member 11 is completed.

[0058] Next, the effects of the above-described embodiment will be described below.

[0059] (1) The resin molded component 16 includes: a primary molded portion 31 covering the sensor 12, the sensor holder 14, and a portion of the wire component 13 pulled out from the sensor 12; and a secondary molded portion 32, which molds the primary molded portion 31 and the fixing bracket 15 as an insert. Therefore, it is possible to easily obtain sensor components 11 of different specifications by using the primary molded portion 31 as a common component. That is, the sensor component 11 may have a case where the specifications of the fixing bracket 15 are different depending on the vehicle model to be fixed, for example. And, for example, by producing the primary molded portion 31 as a common component, parts with different specifications can be handled by only a small change in the mold. Therefore, it is possible to easily manufacture sensor components 11 of different specifications. As a result, for example, it is possible to achieve a reduction in manufacturing costs.

[0060] (2) The secondary molding portion 32 has a bent lead-out portion 32c that bends outside the through hole 15c of the fixing bracket 15 and leads out the wire member 13. Therefore, the wire member 13 can be stably pulled out in a direction intersecting the axis of the through hole 15c, and thinning in the direction in which the axis of the through hole 15c extends can be achieved. Thus, for example, it is possible to stably suppress the wire member 13 from contacting other members. That is, for example, in a case where the space for the installation object of the sensor member 11 is small in the direction in which the axis of the through hole 15c extends, the sensor member 11 can be installed in a manner that the wire member 13 does not contact the installation object.

[0061] (3) The fixing bracket 15 is formed in a plate shape and has a fixing hole 15d extending parallel to the through hole 15c, and also has a lead-out recess 15e which is recessed so that at least a portion of the bent lead-out portion 32c is embedded therein. Therefore, it is possible to further reduce the thickness in the direction in which the axis of the through hole 15c extends.

[0062] (4) The primary molded portion 31 includes the connecting portion 31 c connected to the secondary molded portion 32 . The connecting portion 31 c includes the anti-rotation portion 31 d at a portion in the circumferential direction. Therefore, the primary molded portion 31 can be prevented from rotating relative to the secondary molded portion 32 .

[0063] (5) The primary molded portion 31 has a connecting portion 31c, which is connected to the secondary molded portion 32. In the first molding step, a melting rib 31e is formed around the connecting portion 31c, and the melting rib 31e is melted in the second molding step. Therefore, the primary molded portion 31 and the secondary molded portion 32 can be firmly connected. In addition, high waterproofness can be ensured at the boundary between the primary molded portion 31 and the secondary molded portion 32.

[0064] This embodiment can be implemented by modifying as follows: This embodiment and the following modification examples can be implemented in combination with each other within the range that there is no technical contradiction.

[0065] • In the above embodiment, the secondary molded portion 32 has a bent lead-out portion 32c that bends outside the through hole 15c of the fixing bracket 15 and leads out the wire member 13, but the present invention is not limited thereto, and a structure may be provided with a lead-out portion that does not bend and leads out the wire member 13. That is, the bent lead-out portion 32c may be changed to a lead-out portion that extends in the direction in which the axis of the through hole 15c extends and leads out the wire member 13 in the direction, and may be embodied as a sensor member 11 of different specifications having such a lead-out portion.

[0066] In the above embodiment, the fixing bracket 15 has the lead-out recess 15e which is recessed so as to embed at least a portion of the bent lead-out portion 32c. However, the present invention is not limited thereto and the structure may be without the lead-out recess 15e.

[0067] • In the above embodiment, the connection portion 31c of the primary molded portion 31 has the anti-rotation portion 31d in a part of the circumferential direction, but the present invention is not limited thereto and may be changed to a structure without the anti-rotation portion 31d. In addition, the number of the anti-rotation portions 31d may be changed to another number. In addition, the shape of the anti-rotation portion 31d may be changed to another shape.

[0068] In the above embodiment, the molten rib 31e is formed around the connection portion 31c in the first molding step and the molten rib 31e is melted in the second molding step. However, the present invention is not limited thereto and the molten rib 31e may not be formed.

[0069] In the above embodiment, the wire component 13 has two wires 21 and an outer casing 22, but the present invention is not limited thereto and may be changed to a wire component of another structure. For example, a wire component may have three or more wires 21. In addition, a wire component may not have an outer casing 22, for example.

[0070] In the above embodiment, the sensor component 11 is a wheel speed sensor including the sensor 12 capable of detecting changes in a magnetic field due to rotation of a wheel. However, the present invention is not limited thereto and may be embodied as a sensor component 11 for other purposes.

Claims

1. A sensor component comprising: sensor; A wire member connected to the sensor; fixing brackets; and a resin molded member that covers the sensor and a portion of the wire member pulled out from the sensor and is integrally molded with the fixing bracket, in, The resin molded member includes a primary molded portion that covers the sensor and a portion of the electric wire member pulled out from the sensor, and a secondary molded portion that molds the primary molded portion and the fixing bracket as an insert.

2. The sensor member according to claim 1, wherein The fixing bracket has a through hole, and the secondary molded part passes through the through hole. The secondary molded portion has a bent lead-out portion that is bent outside the through hole and leads out the electric wire member.

3. The sensor member according to claim 2, wherein: The fixing bracket is formed in a plate shape and has a fixing hole extending through the fixing bracket in parallel with the through hole. The fixing bracket further has a lead-out recessed portion that is recessed so that at least a portion of the curved lead-out portion is embedded therein.

4. The sensor member according to claim 1, wherein The primary molded portion has a connecting portion, and the connecting portion is connected to the secondary molded portion. The connection portion has a rotation stop portion at a portion in a circumferential direction.

5. A method for manufacturing a sensor component, the sensor component comprising: sensor; A wire member connected to the sensor; fixing brackets; and a resin molded member that covers the sensor and a portion of the wire member pulled out from the sensor and is integrally molded with the fixing bracket, in, The manufacturing method of the sensor component comprises: a first molding step of molding a primary molding portion that covers the sensor and a portion of the electric wire member pulled out from the sensor and is a portion of the resin molded member; and In the second molding step, the primary molded portion and the fixing bracket are used as inserts to mold a secondary molded portion, wherein the secondary molded portion is a part of the resin molded member.

6. The method for manufacturing a sensor member according to claim 5, wherein: The primary molded portion has a connecting portion, and the connecting portion is connected to the secondary molded portion. In the first molding step, a molten rib is molded around the connection portion, and the molten rib is melted in the second molding step.

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