Full-automatic probe testing equipment for chip and method of full-automatic probe testing equipment

Abstract

The invention relates to the technical field of chip probe testing, in particular to a full-automatic probe testing device for a chip and a method thereof.The testing device comprises a detector body, a platform for adsorbing and positioning the chip is installed on the detector body, and a plurality of probe devices are annularly arranged above the platform; a position regulator used for driving a probe device to move spatially is further mounted above the platform, the probe device comprises a probe root group and a V-shaped probe, in the prior art, the probe is in contact with a chip once to complete detection, the accuracy of a test data result cannot be guaranteed, the same probe is in contact with the chip for multiple times for testing, and if the probe has problems, the probe is not in contact with the chip. According to the invention, data of multiple tests are all wrong, so that multiple tests are carried out by adopting multiple V-shaped probes to contact the chip in turn, correct data are confirmed by analyzing the multiple data, and the V-shaped probes with problems can be checked, so that the V-shaped probes are replaced in time, and the subsequent chip detection work is ensured to be correctly carried out.

Description

Technical Field

[0001] The present invention relates to the technical field of chip probe testing, in particular to a full-automatic probe testing device for a chip and a method thereof. Background Art

[0002] In the field of chip probe testing, the traditional single probe contact chip detection method has shortcomings. For example, due to inaccurate probe head size, rough surface, insufficient elasticity, and insufficient metal content, the contact test results of a single probe will be inaccurate. It is impossible to determine whether the data of a single probe test is correct. Multiple probes can be used for testing in turn. In addition, the elasticity of the probe also affects the quality of the probe detection work. If the probe is too soft, although it can reduce the damage to the surface of the chip contact part, the probe contact end will shake significantly during the movement of the probe in space, and it is necessary to wait for the jitter to end before the probe end can be contacted with the chip. Contact, if the jittering end contacts the chip too early, the contact point may be inaccurate. If the probe is too hard, although the probe can be quickly moved and positioned under the control of the driving mechanism, the hard contact and impact of the probe end on the chip may damage the contact part of the chip, resulting in inaccurate results of subsequent tests. If the probe is in a hard state during the process of moving close to the chip in space, the jittering of the probe end can be avoided. When the probe end contacts the chip, the probe itself softens. In this way, the probe end is flexibly in contact with the chip to avoid impact damage to the chip. For this reason, the present invention provides a fully automatic probe testing device and method for chips. Summary of the invention

[0003] The object of the present invention is to provide a fully automatic probe testing device for a chip and a method thereof to solve the problems raised in the above background technology.

[0004] To achieve the above object, the present invention provides the following technical solution: a fully automatic probe testing device for a chip, comprising a probe machine body, a platform for adsorbing and positioning the chip is installed on the probe machine body, a plurality of probers are arranged around the platform, and a position regulator for driving the prober to move in space is also installed above the platform, and the prober comprises: An instrument frame, one end of which is fixedly connected to the position regulator; A plurality of probe root groups are supported at the other end of the instrument frame, and the plurality of probe root groups are arranged in an arc shape, and the probe root groups are connected to an arc plate frame on the instrument frame; Multiple V-shaped probes that swing in turn, each probe root group correspondingly clamps a V-shaped probe; One end of each V-shaped probe corresponds to a connected wire, and the other end of the V-shaped probe is brought close to the chip by rapid rigid swinging, and then flexibly contacts the chip; A power integration is provided, wherein the power integration drives the plurality of probe root groups to swing in turn.

[0005] The probe root group includes: A pile plate with one end fixed to the arc plate frame of the device frame; A columnar assembly supported at the other end of the pile plate; One end of the fastening pile is connected to the columnar integrated component, and the V-shaped probe is plugged and fixed on the other end of the fastening pile.

[0006] The power integration includes: The arc flat ring frame, the outer arc plate on the arc flat ring frame slides through the arc plate hole opened on the pile plate; The arc plate rack is fixed on one side of the inner arc plate on the arc flat ring frame; The displacement shaft is supported on the arc plate frame of the device frame, and one end of the displacement shaft is meshed and transmission-connected with the arc plate rack through a fixed gear.

[0007] The columnar integrated component includes a transverse control shaft movably sleeved in a rough hole opened in a pile plate, a chuck device arranged at one end of the transverse control shaft, a pressure device for pressing the chuck device, and an actuating device transmission-connected to the other end of the transverse control shaft, the actuating device and the arc-shaped inwardly convex short plate arranged on the arc flat ring frame are in contact transmission, and one end of the fastening pile is movably sleeved on the ring cylinder opened on the transverse control shaft by setting a cylinder.

[0008] The columnar integrated component also includes a clockwork thick piece, which is fixedly sleeved on the transverse control shaft, and the outer end of the clockwork thick piece is fixed on a convex seat arranged on the fastening pile.

[0009] The transverse control shaft includes a P-plate rack sliding through a plate hole opened in the pile plate, a roller arranged at one end of the P-plate rack, a travel shaft distributed at the other end of the P-plate rack, a travel gear fixed at one end of the travel shaft, and a worm driven on one side of the travel gear. One end of the worm is meshed and connected to the travel gear through a fixed gear, the helical teeth on the other end of the worm are meshed and connected to the outer gear ring on the transverse control shaft, the other end of the travel shaft is meshed and connected to the P-plate rack by setting a shaft gear, and the arc-shaped inwardly convex short plate of the arc flat ring frame is braked by pushing the roller.

[0010] The worm and the travel shaft are respectively movably sleeved in different through holes opened on the pile plate. The transverse control shaft also includes a pullback spring sheet, one end of which is fixed on the pile plate, and the other end is fixed on the P plate rack.

[0011] The chuck device includes an end plate fixed on the end of the transverse control shaft, a pressure ring tube slidably sleeved on the transverse control shaft, a spring supported between the pressure ring tube and the fastening pile cylinder, and a plurality of unit clamping plates evenly arranged and fixed on one side of the pressure ring tube, the unit clamping plate is inserted into a square groove opened on the fastening pile cylinder, and the outer edge of the square groove is a rounded structure for guiding the insertion of the unit clamping plate, the spring is sleeved on the transverse control shaft, and the interior of the pressure ring tube is clamped into an axial sliding groove opened on the outer side wall of the transverse control shaft by setting a protrusion.

[0012] The pressure device includes a folding frame with one end fixed on the pile plate, an L-shaped lifting plate sliding through a plate hole opened at the other end of the folding frame, and a J-shaped spring sheet for pressing the L-shaped lifting plate. The other end of the J-shaped spring sheet is fixed on the folding frame. One end of the L-shaped lifting plate presses the chamfered surface of the outer ring of the pressing ring tube, and a semi-ring plate is fixed to the other end of the L-shaped lifting plate. The outer edge of the end plate pushes the semi-ring plate of the L-shaped lifting plate by setting an outer convex arc plate.

[0013] A fully automatic probe testing method for a chip comprises the following steps: Step 1: Place the chip at the air hole on the platform. The air hole on the platform absorbs and positions the chip by exhausting air. Step 2: The position regulator drives the probe to move in space, and the probe moves to the predetermined detection position; Step 3: A probe root group on the power integrated drive probe device swings, and the probe root group drives the V-shaped probe to swing rigidly. When the V-shaped probe tip contacts the chip, the probe root group completes the rigid-flexible conversion inside, and the probe root group provides flexible pressure to the V-shaped probe. The V-shaped probe tip contacts the chip flexibly. The probe root groups on multiple probe devices complete the docking with the chip through the rigid-flexible conversion method. Then, the V-shaped probe in contact with the chip is powered on, and the host terminal on the detector body collects and analyzes the data of the power-on detection. Step 4: The power integration drives different probe root groups on the probe device to swing in turn to control the contact detection between the corresponding V-type probe and the chip. When the next probe root group in the probe device is switched to swing, the previous probe root group is automatically reset. The host terminal collects the detection data of the same position on the chip multiple times, and confirms the correct detection data by judging and collecting multiple data.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. In the traditional technology, the probe contacts the chip once to complete the detection, and the accuracy of the test data cannot be guaranteed. If the same probe contacts the chip for multiple times, if there is a problem with the probe itself, the data of the multiple tests will all be wrong. Therefore, the present invention uses multiple V-shaped probes to contact the chip in turn to perform multiple tests, and confirms the correct data by analyzing multiple data. At the same time, the problematic V-shaped probe can be detected, and the V-shaped probe can be replaced in time to ensure that the subsequent chip detection work is carried out correctly.

[0015] 2. The present invention uses the rigid swing of the V-shaped probe to quickly approach the chip and avoid the shaking of the V-shaped probe tip. When the V-shaped probe tip contacts the chip, the probe root group automatically performs a rigid-flexible conversion, and the probe root group provides flexible pressure to the V-shaped probe, so that the V-shaped probe tip is flexibly pressed on the chip contact part to avoid the V-shaped probe tip impacting and damaging the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of the present invention.

[0017] Figure 2 Schematic diagram of the probe location.

[0018] Figure 3 Schematic diagram of the probe structure.

[0019] Figure 4 This is a schematic diagram of the power integration structure.

[0020] Figure 5 Schematic diagram of the fastening pile structure.

[0021] Figure 6 Schematic diagram of the columnar integrated component structure.

[0022] Figure 7 Schematic diagram of the pile-board structure.

[0023] Figure 8 This is a schematic diagram of the transverse control axis structure.

[0024] Fig. 9 It is a schematic diagram of the structure of the mainspring thick piece.

[0025] Fig.10 This is a schematic diagram of the arc flat ring frame structure.

[0026] Fig.11 It is a schematic diagram of the structure of the chuck device.

[0027] Fig.12 It is a schematic diagram of the unit card board structure.

[0028] Fig.13 It is a schematic diagram of the structure of the press-release ring tube.

[0029] In the figure: the detector body 1, the platform 2, the probe 3, the position regulator 4, the frame 5, the probe root group 6, the V-type probe 7, the wire 8, the power integration 9, the displacement shaft 10, the arc flat ring frame 11, the arc plate rack 12, the pile plate 13, the fastening pile 14, the columnar integration 15, the pressure device 16, the chuck device 17, the clockwork thick piece 18, the horizontal control shaft 19, the driving device 20, the worm 21, the travel gear 22, the travel shaft 23, the P plate rack 24, the pull-back spring 25, the roller 26, the unit card plate 27, the end plate 28, the spring 29, the pressure ring 30, the J-type spring 31, the L-type lifting plate 32, and the folding frame 33. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the technical solutions in the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] See also Figures 1 to 13 The present invention provides a technical solution: a fully automatic probe test device for a chip, comprising a probe machine body 1, a platform 2 for adsorbing and positioning the chip is installed on the probe machine body 1, a plurality of probe devices 3 are arranged around the platform 2, and a position regulator 4 for driving the probe device 3 to move in space is also installed above the platform 2, and the probe device 3 includes: An apparatus frame 5, one end of which is fixedly connected to the position regulator 4; A plurality of probe root groups 6 are supported at the other end of the apparatus frame 5, and the plurality of probe root groups 6 are arranged in an arc shape, and the probe root groups 6 are connected to an arc plate frame on the apparatus frame 5; A plurality of V-shaped probes 7 that swing in turn, each probe root group 6 correspondingly clamps a V-shaped probe 7; One end of each V-shaped probe 7 corresponds to a connected wire 8, and the other end of the V-shaped probe 7 approaches the chip by rapid rigid swinging, and then flexibly contacts the chip; The power integration 9 drives the plurality of probe root groups 6 to swing in turn.

[0032] The detector body 1, platform 2 and position regulator 4 are prior art devices. The position regulator 4 controls the probe to move in three spatial directions of XYZ. The position regulator 4 first drives the probe 3 to move in place to ensure that each V-shaped probe 7 swings at a fixed angle, and the end of the V-shaped probe 7 can touch the chip. Figure 3It is understood that the position distribution of the three V-shaped probes 7 can be understood as being distributed around the axis. The point where the end of the V-shaped probe 7 falls after swinging is on the axis, that is, the position where the chip is fixed in advance is at the axis position. The inner arc surface of the arc plate frame on the device frame 5 can be understood as the local surface of the outer wall of the cylinder, and the chips are distributed on the axis of this cylinder.

[0033] refer to Figure 4 It is understood that probe root group 6 includes: A pile plate 13 having one end fixed to the arc plate frame of the frame 5; A columnar integrated component 15 supported by the other end of the pile plate 13; One end of the fastening pile 14 is connected to the columnar integrated component 15, and the V-shaped probe 7 is plugged and fixed to the other end of the fastening pile 14.

[0034] refer to Figure 4 Understand that power integration 9 includes: The arc flat ring frame 11, the outer arc plate on the arc flat ring frame 11 slides through the arc plate hole opened on the pile plate 13; An arc plate rack 12 fixed on one side of the inner arc plate on the arc flat ring frame 11; The shifting shaft 10 is supported on the arc plate frame of the instrument frame 5, and one end of the shifting shaft 10 is meshed and transmission-connected with the arc plate rack 12 through a fixed gear. The shifting shaft 10 is movably sleeved in a column hole opened on the instrument frame 5, and the other end of the shifting shaft 10 is externally connected to the motor drive mechanism in the prior art.

[0035] refer to Figure 6 It is understood that the columnar integrated component 15 includes a transverse control shaft 19 movably sleeved in a rough hole opened on the pile plate 13, a chuck device 17 arranged at one end of the transverse control shaft 19, a pressure device 16 for pressing the chuck device 17, and an actuating device 20 transmission-connected to the other end of the transverse control shaft 19. The actuating device 20 and the arc-shaped inward convex short plate arranged on the arc flat ring frame 11 are in contact with each other for transmission. One end of the fastening pile 14 is movably sleeved on the ring cylinder opened on the transverse control shaft 19 by setting a cylinder.

[0036] The columnar integrated component 15 further includes a clockwork thick piece 18 . The clockwork thick piece 18 is fixedly sleeved on the transverse control shaft 19 , and the outer end of the clockwork thick piece 18 is fixed on a convex seat provided on the fastening pile 14 .

[0037] refer to Figure 8It is understood that the transverse control shaft 19 includes a P-plate rack 24 that slides through a plate hole opened on the pile plate 13, a roller 26 arranged at one end of the P-plate rack 24, a travel shaft 23 distributed at the other end of the P-plate rack 24, a travel gear 22 fixed at one end of the travel shaft 23, and a worm 21 that drives one side of the travel gear 22. One end of the worm 21 is meshed and connected to the travel gear 22 through a fixed gear, and the helical teeth on the other end of the worm 21 are meshed and connected to the outer gear ring on the transverse control shaft 19. The other end of the travel shaft 23 is meshed and connected to the P-plate rack 24 by setting a shaft gear, and the arc-shaped inward convex short plate of the arc flat ring frame 11 is braked by pushing the roller 26.

[0038] The worm 21 and the travel shaft 23 are respectively movably sleeved in different through holes opened on the pile plate 13. The transverse control shaft 19 also includes a pullback spring 25. One end of the pullback spring 25 is fixed on the pile plate 13, and the other end is fixed on the P plate rack 24.

[0039] The chuck device 17 includes an end plate 28 fixed at the end of the transverse control shaft 19, a pressure-release ring tube 30 slidably sleeved on the transverse control shaft 19, a spring 29 supported between the pressure-release ring tube 30 and the cylinder body of the fastening pile 14, and a plurality of unit clamping plates 27 evenly arranged and fixed on one side of the pressure-release ring tube 30. The unit clamping plate 27 is inserted into a square groove opened on the cylinder body of the fastening pile 14, and the outer edge of the square groove is a rounded structure for guiding the insertion of the unit clamping plate 27. The spring 29 is sleeved on the transverse control shaft 19, and the interior of the pressure-release ring tube 30 is clamped into the axial sliding groove opened on the outer wall of the transverse control shaft 19 by setting a protrusion.

[0040] The pressure device 16 includes a folding frame 33 with one end fixed on the pile plate 13, an L-shaped lifting plate 32 sliding through a plate hole opened at the other end of the folding frame 33, and a J-shaped spring piece 31 for pressing the L-shaped lifting plate 32. The other end of the J-shaped spring piece 31 is fixed on the folding frame 33. One end of the L-shaped lifting plate 32 presses the chamfered surface of the outer ring of the pressing ring tube 30. A semi-ring plate is fixed to the other end of the L-shaped lifting plate 32, and the outer edge of the end plate 28 pushes the semi-ring plate of the L-shaped lifting plate 32 by setting an outer convex arc plate.

[0041] A fully automatic probe testing method for a chip comprises the following steps: Step 1: Place the chip at the air hole position on platform 2, and the air hole on platform 2 absorbs and positions the chip by exhausting air; Step 2: The position regulator 4 drives the probe 3 to move in space, and the probe 3 moves to the predetermined detection position; Step 3: The power integration 9 drives a probe root group 6 on the probe device 3 to swing, and the probe root group 6 drives the V-shaped probe 7 to swing rigidly. When the end of the V-shaped probe 7 contacts the chip, the rigid-flexible conversion is completed inside the probe root group 6. The probe root group 6 provides flexible pressure to the V-shaped probe 7, and the end of the V-shaped probe 7 contacts the chip flexibly. The probe root groups 6 on multiple probe devices 3 complete the docking with the chip through the rigid-flexible conversion method. Subsequently, the V-shaped probe 7 in contact with the chip is powered on, and the host terminal on the detector body 1 collects and analyzes the data of the power-on detection; Step 4: The power integration 9 drives different probe root groups 6 on the probe device 3 to swing in turn to control the contact detection between the corresponding V-shaped probe 7 and the chip. When the next probe root group 6 in the probe device 3 is switched to swing, the previous probe root group 6 is automatically reset. The host terminal collects the detection data of the same position on the chip multiple times, and confirms the correct detection data by judging and collecting multiple data.

[0042] The arc plate rack 12 is controlled to swing around by controlling the displacement shaft 10 to rotate, and then the arc flat ring frame 11 swings around. The arc-shaped inward convex short plate on the arc flat ring frame 11 selects a columnar integrated component 15 to drive, specifically, the arc-shaped inward convex short plate presses the roller 26, and then the P plate rack 24 moves to drive the travel shaft 23 to rotate, and then the travel gear 22 drives the worm 21 to control the rotation of the transverse control shaft 19, and the transverse control shaft 19 drives the chuck device 17, the chuck device 17 clamps the fastening pile 14, and then the transverse control shaft 19 drives the fastening pile 14 to rotate synchronously, and the fastening pile 14 drives the V-shaped probe 7 to swing. When the V-shaped probe 7 is about to contact the chip, the clamping state between the chuck device 17 and the fastening pile 14 disappears, because the transverse control shaft 19 drives the end disk 28 to rotate synchronously, and the end disk 28 rotates At the end, the convex arc plate on the end disk 28 will contact and push the L-shaped lifting plate 32, and the L-shaped lifting plate 32 gradually moves away from the axis of the pressure ring tube 30, and the spring 29 rebounds and pushes the pressure ring tube 30. The pressure ring tube 30 moves axially to drive the unit card plate 27, and the unit card plate 27 is pulled out from the cylinder on the fastening pile 14, so that the fastening pile 14 and the transverse control shaft 19 can rotate with each other in an offset manner. At this time, the clockwork thick piece 18 plays a role. Under the support connection of the clockwork thick piece 18, the transverse control shaft 19 and the fastening pile 14 can rotate synchronously, but the fastening pile 14 and the transverse control shaft 19 are in an elastic connection state. In this way, although the transverse control shaft 19 continues to rotate, the fastening pile 14 swings elastically under the control of the clockwork thick piece 18, so that the end of the V-shaped probe 7 is flexibly pressed on the chip.

[0043] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A fully automatic probe testing device for a chip, comprising a probe machine body, characterized in that: The main body of the detector is equipped with a platform for adsorbing and positioning the chip, a plurality of probes are arranged around the platform, and a position regulator for driving the probe to move in space is also installed above the platform. The probe includes: An instrument frame, one end of which is fixedly connected to the position regulator; A plurality of probe root groups are supported at the other end of the instrument frame, and the plurality of probe root groups are arranged in an arc shape, and the probe root groups are connected to an arc plate frame on the instrument frame; Multiple V-shaped probes that swing in turn, each probe root group correspondingly clamps a V-shaped probe; One end of each V-shaped probe corresponds to a connected wire, and the other end of the V-shaped probe is brought close to the chip by rapid rigid swinging, and then flexibly contacts the chip; A power integration is provided, wherein the power integration drives the plurality of probe root groups to swing in turn.

2. The fully automatic probe testing equipment for chips according to claim 1, characterized in that: The probe root group includes: A pile plate with one end fixed to the arc plate frame of the device frame; A columnar integrated component supported by the other end of the pile plate; One end of the fastening pile is connected to the columnar integrated component, and the V-shaped probe is plugged and fixed on the other end of the fastening pile.

3. The fully automatic probe testing equipment for chips according to claim 2, characterized in that: The power integration includes: The arc flat ring frame, the outer arc plate on the arc flat ring frame slides through the arc plate hole opened on the pile plate; The arc plate rack is fixed on one side of the inner arc plate on the arc flat ring frame; The displacement shaft is supported on the arc plate frame of the device frame, and one end of the displacement shaft is meshed and transmission-connected with the arc plate rack through a fixed gear.

4. The fully automatic probe testing equipment for chips according to claim 3, characterized in that: The columnar integrated component includes a transverse control shaft movably sleeved in a rough hole opened in a pile plate, a chuck device arranged at one end of the transverse control shaft, a pressure device for pressing the chuck device, and an actuating device transmission-connected to the other end of the transverse control shaft, the actuating device and the arc-shaped inwardly convex short plate arranged on the arc flat ring frame are in contact transmission, and one end of the fastening pile is movably sleeved on the ring cylinder opened on the transverse control shaft by setting a cylinder.

5. The fully automatic probe testing equipment for chips according to claim 4, characterized in that: The columnar integrated component also includes a clockwork thick piece, which is fixedly sleeved on the transverse control shaft, and the outer end of the clockwork thick piece is fixed on a convex seat arranged on the fastening pile.

6. The fully automatic probe testing equipment for chips according to claim 4, characterized in that: The transverse control shaft includes a P-plate rack sliding through a plate hole opened in the pile plate, a roller arranged at one end of the P-plate rack, a travel shaft distributed at the other end of the P-plate rack, a travel gear fixed at one end of the travel shaft, and a worm driven on one side of the travel gear. One end of the worm is meshed and connected to the travel gear through a fixed gear, the helical teeth on the other end of the worm are meshed and connected to the outer gear ring on the transverse control shaft, the other end of the travel shaft is meshed and connected to the P-plate rack by setting a shaft gear, and the arc-shaped inwardly convex short plate of the arc flat ring frame is braked by pushing the roller.

7. The fully automatic probe testing equipment for chips according to claim 6, characterized in that: The worm and the travel shaft are respectively movably sleeved in different through holes opened on the pile plate. The transverse control shaft also includes a pullback spring sheet, one end of which is fixed on the pile plate, and the other end is fixed on the P plate rack.

8. The fully automatic probe testing equipment for chips according to claim 4, characterized in that: The chuck device includes an end plate fixed on the end of the transverse control shaft, a pressure ring tube slidably sleeved on the transverse control shaft, a spring supported between the pressure ring tube and the fastening pile cylinder, and a plurality of unit clamping plates evenly arranged and fixed on one side of the pressure ring tube, the unit clamping plate is inserted into a square groove opened on the fastening pile cylinder, and the outer edge of the square groove is a rounded structure for guiding the insertion of the unit clamping plate, the spring is sleeved on the transverse control shaft, and the interior of the pressure ring tube is clamped into an axial sliding groove opened on the outer side wall of the transverse control shaft by setting a protrusion.

9. The fully automatic probe testing equipment for chips according to claim 8, characterized in that: The pressure device includes a folding frame with one end fixed on the pile plate, an L-shaped lifting plate sliding through a plate hole opened at the other end of the folding frame, and a J-shaped spring sheet for pressing the L-shaped lifting plate. The other end of the J-shaped spring sheet is fixed on the folding frame. One end of the L-shaped lifting plate presses the chamfered surface of the outer ring of the pressing ring tube, and a semi-ring plate is fixed to the other end of the L-shaped lifting plate. The outer edge of the end plate pushes the semi-ring plate of the L-shaped lifting plate by setting an outer convex arc plate.

10. A fully automatic probe testing method for a chip, using the fully automatic probe testing device for a chip according to claim 1, characterized in that: The following steps are involved: Step 1: Place the chip at the air hole on the platform. The air hole on the platform absorbs and positions the chip by exhausting air. Step 2: The position regulator drives the probe to move in space, and the probe moves to the predetermined detection position; Step 3: A probe root group on the power integrated drive probe device swings, and the probe root group drives the V-shaped probe to swing rigidly. When the V-shaped probe tip contacts the chip, the probe root group completes the rigid-flexible conversion inside, and the probe root group provides flexible pressure to the V-shaped probe. The V-shaped probe tip contacts the chip flexibly. The probe root groups on multiple probe devices complete the docking with the chip through the rigid-flexible conversion method. Then, the V-shaped probe in contact with the chip is powered on, and the host terminal on the detector body collects and analyzes the data of the power-on detection. Step 4: The power integration drives different probe root groups on the probe device to swing in turn to control the contact detection between the corresponding V-type probe and the chip. When the next probe root group in the probe device is switched to swing, the previous probe root group is automatically reset. The host terminal collects the detection data of the same position on the chip multiple times, and confirms the correct detection data by judging and collecting multiple data.

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