A fully automatic probe test device and method for a chip

Abstract

The present invention relates to the technical field of chip probe testing, and specifically relates to a fully automatic probe testing device and method for a chip. The testing device includes a probing machine main body, on which a platform for adsorbing and positioning the chip is installed. A plurality of probe units are annularly arranged above the platform, and a position adjuster for driving the spatial movement of the probe units is also installed above the platform. The probe unit includes a probe root group and a V-shaped probe. In the traditional technology, the probe contacts the chip once to complete the detection, and the accuracy of the test data results cannot be guaranteed. If the same probe contacts the chip for multiple tests, if there is a problem with the probe itself, all the data from multiple tests will be incorrect. Therefore, the present invention uses multiple V-shaped probes to alternately contact the chip for multiple tests, analyzes multiple data to confirm the correct data, and can simultaneously detect the problematic V-shaped probes, and then replace the V-shaped probes in time to ensure the correct progress of subsequent chip detection work.

Description

Technical Field

[0001] The present invention relates to the technical field of chip probe testing, in particular to a full-automatic probe testing device for a chip and a method thereof. Background Art

[0002] In the field of chip probe testing, the traditional single probe contact chip detection method has shortcomings. For example, due to inaccurate probe head size, rough surface, insufficient elasticity, and insufficient metal content, the contact test results of a single probe will be inaccurate. It is impossible to determine whether the data of a single probe test is correct. Multiple probes can be used for testing in turn. In addition, the elasticity of the probe also affects the quality of the probe detection work. If the probe is too soft, although it can reduce the damage to the surface of the chip contact part, the probe contact end will shake significantly during the movement of the probe in space, and it is necessary to wait for the jitter to end before the probe end can be contacted with the chip. Contact, if the jittering end contacts the chip too early, the contact point may be inaccurate. If the probe is too hard, although the probe can be quickly moved and positioned under the control of the driving mechanism, the hard contact and impact of the probe end on the chip may damage the contact part of the chip, resulting in inaccurate results of subsequent tests. If the probe is in a hard state during the process of moving close to the chip in space, the jittering of the probe end can be avoided. When the probe end contacts the chip, the probe itself softens. In this way, the probe end is flexibly in contact with the chip to avoid impact damage to the chip. For this reason, the present invention provides a fully automatic probe testing device and method for chips. Summary of the invention

[0003] The object of the present invention is to provide a fully automatic probe testing device for a chip and a method thereof to solve the problems raised in the above background technology.

[0004] To achieve the above object, the present invention provides the following technical solution: a fully automatic probe testing device for a chip, comprising a probe machine body, a platform for adsorbing and positioning the chip is installed on the probe machine body, a plurality of probers are arranged around the platform, and a position regulator for driving the prober to move in space is also installed above the platform, and the prober comprises:

[0005] An instrument frame, one end of which is fixedly connected to the position regulator;

[0006] A plurality of probe root groups are supported at the other end of the instrument frame, and the plurality of probe root groups are arranged in an arc shape, and the probe root groups are connected to an arc plate frame on the instrument frame;

[0007] Multiple V-shaped probes that swing in turn, each probe root group clamps a corresponding V-shaped probe;

[0008] One end of each V-shaped probe corresponds to a connected wire, and the other end of the V-shaped probe is brought close to the chip by rapid rigid swinging, and then flexibly contacts the chip;

[0009] A power integration is provided, wherein the power integration drives the plurality of probe root groups to swing in turn.

[0010] The probe root group includes:

[0011] A pile plate with one end fixed to the arc plate frame of the device frame;

[0012] A columnar assembly supported at the other end of the pile plate;

[0013] One end of the fastening pile is connected to the columnar integrated component, and the V-shaped probe is plugged and fixed on the other end of the fastening pile.

[0014] The power integration includes:

[0015] The arc flat ring frame, the outer arc plate on the arc flat ring frame slides through the arc plate hole opened on the pile plate;

[0016] The arc plate rack is fixed on one side of the inner arc plate on the arc flat ring frame;

[0017] The displacement shaft is supported on the arc plate frame of the device frame, and one end of the displacement shaft is meshed and transmission-connected with the arc plate rack through a fixed gear.

[0018] The columnar integrated component includes a transverse control shaft movably sleeved in a rough hole opened in a pile plate, a chuck device arranged at one end of the transverse control shaft, a pressure device for pressing the chuck device, and an actuating device transmission-connected to the other end of the transverse control shaft, the actuating device and the arc-shaped inwardly convex short plate arranged on the arc flat ring frame are in contact transmission, and one end of the fastening pile is movably sleeved on the ring cylinder opened on the transverse control shaft by setting a cylinder.

[0019] The columnar integrated component also includes a clockwork thick piece, which is fixedly sleeved on the transverse control shaft, and the outer end of the clockwork thick piece is fixed on a convex seat arranged on the fastening pile.

[0020] The transverse control shaft includes a P-plate rack sliding through a plate hole opened in the pile plate, a roller arranged at one end of the P-plate rack, a travel shaft distributed at the other end of the P-plate rack, a travel gear fixed at one end of the travel shaft, and a worm driven on one side of the travel gear. One end of the worm is meshed and connected to the travel gear through a fixed gear, the helical teeth on the other end of the worm are meshed and connected to the outer gear ring on the transverse control shaft, the other end of the travel shaft is meshed and connected to the P-plate rack by setting a shaft gear, and the arc-shaped inwardly convex short plate of the arc flat ring frame is braked by pushing the roller.

[0021] The worm and the travel shaft are respectively movably sleeved in different through holes opened on the pile plate. The transverse control shaft also includes a pullback spring sheet, one end of which is fixed on the pile plate, and the other end is fixed on the P plate rack.

[0022] The chuck device includes an end position disk fixed to the end of the horizontal control shaft, a pressure - actuating ring cylinder slidably sleeved on the horizontal control shaft, a spring supported between the pressure - actuating ring cylinder and the fastening pile cylinder body, and a plurality of unit clamping plates uniformly arranged and fixed on one side of the pressure - actuating ring cylinder. The unit clamping plates are inserted into the square grooves opened on the fastening pile cylinder body, and the edge of the outer opening of the square groove is a rounded - corner structure for guiding the insertion of the unit clamping plates. The spring is sleeved on the horizontal control shaft, and convex blocks are arranged inside the pressure - actuating ring cylinder to be clamped into the axial sliding grooves opened on the outer side wall of the horizontal control shaft.

[0023] The pressure device includes a folding frame fixed at one end to the pile plate, an L - shaped lifting plate slidably passing through the plate hole opened at the other end of the folding frame, and a J - shaped elastic sheet for pressing the L - shaped lifting plate. The other end of the J - shaped elastic sheet is fixed to the folding frame. One end of the L - shaped lifting plate presses on the chamfered surface arranged around the outside of the pressure - actuating ring cylinder. A semi - ring plate is fixed to the other end of the L - shaped lifting plate, and the outer edge of the end position disk pushes the semi - ring plate of the L - shaped lifting plate through the arranged convex arc plate.

[0024] A fully automatic probe testing method for a chip includes the following steps:

[0025] Step 1: Place the chip at the air - hole position on the platform, and the air - holes on the platform adsorb and position the chip by exhausting air.

[0026] Step 2: The position regulator drives the spatial movement of the probe device, and the probe device moves to the predetermined detection position.

[0027] Step 3: The power integration drives the swing of a probe root group on the probe device. The probe root group drives the rigid swing of the V - shaped probe. When the end of the V - shaped probe contacts the chip, the rigid - flexible conversion is completed inside the probe root group. The probe root group provides flexible pressure to the V - shaped probe. The end of the V - shaped probe contacts the chip flexibly. The probe root groups on multiple probe devices complete the docking with the chip through the rigid - flexible conversion method. Subsequently, the V - shaped probe in contact with the chip is energized, and the host terminal on the detection machine body collects and analyzes the data of the energized detection.

[0028] Step 4: The power integration drives the swing of different probe root groups on the probe device in turn to control the contact detection of the corresponding V - shaped probe with the chip. When switching to the swing of the next probe root group in the probe device, the previous probe root group automatically resets. The host terminal collects the detection data at the same position on the chip multiple times, and determines the correct detection data by judging the collected multiple data.

[0029] Compared with the prior art, the beneficial effects of the present invention are:

[0030] 1. In the traditional technology, the probe makes contact with the chip once to complete the detection, and it is impossible to guarantee the accuracy of the test data results. If the same probe makes multiple contacts with the chip for testing, if there is a problem with the probe itself, all the data obtained from multiple tests will be incorrect. Therefore, in the present invention, multiple V-shaped probes are used to alternately contact the chip for multiple tests. By analyzing multiple data, the correct data can be confirmed, and at the same time, the problematic V-shaped probes can be identified and replaced in a timely manner to ensure the correct progress of subsequent chip detection work.

[0031] 2. In the present invention, the V-shaped probe approaches the chip quickly through rigid swinging, and the jitter at the tip of the V-shaped probe is avoided. When the tip of the V-shaped probe contacts the chip, the root group of the probe automatically undergoes a rigid-flexible conversion, and the root group of the probe provides a flexible pressure to the V-shaped probe. As a result, the tip of the V-shaped probe is gently pressed on the contact part of the chip, avoiding the impact and damage of the chip by the tip of the V-shaped probe. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic structural diagram of the present invention.

[0033] Figure 2 It is a schematic diagram of the position of the probe device.

[0034] Figure 3 It is a schematic structural diagram of the probe device.

[0035] Figure 4 It is a schematic structural diagram of the power integration structure.

[0036] Figure 5 It is a schematic structural diagram of the fastening pile.

[0037] Figure 6 It is a schematic structural diagram of the columnar integrated component.

[0038] Figure 7 It is a schematic structural diagram of the pile plate.

[0039] Figure 8 It is a schematic structural diagram of the horizontal control shaft.

[0040] Figure 9 It is a schematic structural diagram of the thick hairspring piece.

[0041] Figure 10 It is a schematic structural diagram of the arc-shaped flat ring frame.

[0042] Figure 11 It is a schematic structural diagram of the chuck device.

[0043] Figure 12 It is a schematic structural diagram of the unit card board.

[0044] Figure 13 It is a schematic structural diagram of the pressure release ring cylinder.

[0045] In the figure: the detector body 1, the platform 2, the probe 3, the position regulator 4, the frame 5, the probe root group 6, the V-type probe 7, the wire 8, the power integration 9, the displacement shaft 10, the arc flat ring frame 11, the arc plate rack 12, the pile plate 13, the fastening pile 14, the columnar integration 15, the pressure device 16, the chuck device 17, the clockwork thick piece 18, the horizontal control shaft 19, the driving device 20, the worm 21, the travel gear 22, the travel shaft 23, the P plate rack 24, the pull-back spring 25, the roller 26, the unit card plate 27, the end plate 28, the spring 29, the pressure ring 30, the J-type spring 31, the L-type lifting plate 32, and the folding frame 33. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the technical solutions in the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] See also Figures 1 to 13 The present invention provides a technical solution: a fully automatic probe test device for a chip, comprising a probe machine body 1, a platform 2 for adsorbing and positioning the chip is installed on the probe machine body 1, a plurality of probe devices 3 are arranged around the platform 2, and a position regulator 4 for driving the probe device 3 to move in space is also installed above the platform 2, and the probe device 3 includes:

[0048] An apparatus frame 5, one end of which is fixedly connected to the position regulator 4;

[0049] A plurality of probe root groups 6 are supported at the other end of the apparatus frame 5, and the plurality of probe root groups 6 are arranged in an arc shape, and the probe root groups 6 are connected to an arc plate frame on the apparatus frame 5;

[0050] A plurality of V-shaped probes 7 that swing in turn, each probe root group 6 correspondingly clamps a V-shaped probe 7;

[0051] One end of each V-shaped probe 7 corresponds to a connected wire 8, and the other end of the V-shaped probe 7 approaches the chip by rapid rigid swinging, and then flexibly contacts the chip;

[0052] The power integration 9 drives the plurality of probe root groups 6 to swing in turn.

[0053] The detector body 1, platform 2 and position regulator 4 are prior art devices. The position regulator 4 controls the probe to move in three spatial directions of XYZ. The position regulator 4 first drives the probe 3 to move in place to ensure that each V-shaped probe 7 swings at a fixed angle, and the end of the V-shaped probe 7 can touch the chip. Figure 3It can be understood that the seven V-shaped probes are distributed around the axis. The points where the tips of the V-shaped probes 7 fall after swinging are on the axis, that is, the position where the chip is pre-fixed is at the axis position. The inner arc surface of the arc plate frame on the instrument rack 5 can be understood as a partial surface of the outer sidewall of a cylinder, and the chips are distributed on the axis of this cylinder.

[0054] Reference Figure 4 It can be understood that the probe root group 6 includes:

[0055] A pile plate 13 fixed at one end on the arc plate frame of the instrument rack 5;

[0056] A cylindrical integrated part 15 supported at the other end of the pile plate 13;

[0057] A fastening pile 14 connected to the cylindrical integrated part 15 at one end, and the V-shaped probe 7 is inserted and fixed at the other end of the fastening pile 14.

[0058] Reference Figure 4 It can be understood that the power integration 9 includes:

[0059] An arc-shaped flat ring frame 11, and the outer arc plate on the arc-shaped flat ring frame 11 slides through the arc plate hole opened on the pile plate 13;

[0060] An arc plate rack 12 fixed on one side of the inner arc plate of the arc-shaped flat ring frame 11;

[0061] A displacement shaft 10 supported on the arc plate frame of the instrument rack 5. One end of the displacement shaft 10 is meshed and drivenly connected to the arc plate rack 12 through a fixed gear. The displacement shaft 10 is movably sleeved in the column hole opened on the instrument rack 5, and the other end of the displacement shaft 10 is externally connected to a motor drive mechanism in the prior art.

[0062] Reference Figure 6 It can be understood that the cylindrical integrated part 15 includes a horizontal control shaft 19 movably sleeved in the thick hole opened on the pile plate 13, a chuck device 17 arranged at one end of the horizontal control shaft 19, a pressure device 16 for pressing the chuck device 17, and a driving device 20 drivingly connected to the other end of the horizontal control shaft 19. The driving device 20 is in contact transmission with the arc-shaped inner convex short plate arranged on the arc-shaped flat ring frame 11. One end of the fastening pile 14 is movably sleeved on the ring cylinder opened on the horizontal control shaft 19 through a set cylinder.

[0063] The cylindrical integrated part 15 further includes a thick hairspring piece 18, the thick hairspring piece 18 is fixedly sleeved on the horizontal control shaft 19, and the outer end of the thick hairspring piece 18 is fixed on the convex seat arranged on the fastening pile 14.

[0064] Reference Figure 8It is understood that the horizontal control shaft 19 includes a P-plate rack 24 that slides through a plate hole opened on the pile plate 13, a roller 26 provided at one end of the P-plate rack 24, a stroke shaft 23 distributed at the other end of the P-plate rack 24, a stroke gear 22 fixed at one end of the stroke shaft 23, and a worm 21 driven on one side of the stroke gear 22. One end of the worm 21 is meshed and drivingly connected to the stroke gear 22 through a fixed gear, the spiral teeth on the other end of the worm 21 are meshed and drivingly connected to the external gear ring on the horizontal control shaft 19, and the other end of the stroke shaft 23 is meshed and drivingly connected to the P-plate rack 24 through a shaft gear. The arc-shaped inner convex short plate of the arc-shaped flat ring frame 11 brakes by pushing the roller 26.

[0065] The worm 21 and the stroke shaft 23 are respectively movably sleeved in different through holes opened on the pile plate 13. The horizontal control shaft 19 further includes a pulling spring piece 25. One end of the pulling spring piece 25 is fixed on the pile plate 13, and the other end is fixed on the P-plate rack 24.

[0066] The chuck device 17 includes an end position disk 28 fixed at the end of the horizontal control shaft 19, a pressing ring cylinder 30 slidably sleeved on the horizontal control shaft 19, a spring 29 supported between the pressing ring cylinder 30 and the cylinder body of the fastening pile 14, and a plurality of unit clamping plates 27 evenly and annularly fixed on one side of the pressing ring cylinder 30. The unit clamping plates 27 are inserted into a square groove opened on the cylinder body of the fastening pile 14, and the edge of the outer opening of the square groove is a rounded corner structure for guiding the insertion of the unit clamping plates 27. The spring 29 is sleeved on the horizontal control shaft 19, and the inside of the pressing ring cylinder 30 is provided with a convex block to be stuck into an axial chute opened on the outer side wall of the horizontal control shaft 19.

[0067] The pressure device 16 includes a folding frame 33 fixed at one end on the pile plate 13, an L-shaped lifting plate 32 that slides through a plate hole opened at the other end of the folding frame 33, and a J-shaped spring piece 31 for pressing the L-shaped lifting plate 32. The other end of the J-shaped spring piece 31 is fixed on the folding frame 33. One end of the L-shaped lifting plate 32 presses on the chamfered surface annularly arranged outside the pressing ring cylinder 30. A semi-circular plate is fixed at the other end of the L-shaped lifting plate 32, and the outer edge of the end position disk 28 pushes the semi-circular plate of the L-shaped lifting plate 32 through an outwardly convex arc plate.

[0068] A fully automatic probe testing method for a chip includes the following steps:

[0069] Step 1: Place the chip at the air hole position on the platform 2. The air holes on the platform 2 adsorb and position the chip by exhausting air.

[0070] Step 2: The position regulator 4 drives the probe device 3 to move spatially, and the probe device 3 moves to the predetermined detection position.

[0071] Step 3: The power integration 9 drives a probe root group 6 on the probe device 3 to swing. The probe root group 6 drives the V-shaped probe 7 to swing rigidly. When the end of the V-shaped probe 7 contacts the chip, the rigid-flexible conversion is completed inside the probe root group 6. The probe root group 6 provides a flexible pressure to the V-shaped probe 7. The end of the V-shaped probe 7 contacts the chip flexibly. The probe root groups 6 on multiple probe devices 3 complete the docking with the chip through the rigid-flexible conversion method. Subsequently, the V-shaped probe 7 in contact with the chip is powered on, and the host terminal on the main body 1 of the detector collects and analyzes the data detected during power-on.

[0072] Step 4: The power integration 9 drives different probe root groups 6 on the probe device 3 to swing in turn to control the contact detection between the corresponding V-shaped probe 7 and the chip. When switching to the next probe root group 6 to swing in the probe device 3, the previous probe root group 6 automatically resets. The host terminal collects the detection data at the same position on the chip multiple times, and determines the correct detection data by judging the multiple collected data.

[0073] By controlling the rotation of the displacement shaft 10 to control the circumferential swing of the arc plate rack 12, and then the circumferential swing of the arc flat ring frame 11. The arc-shaped inner convex short plate on the arc flat ring frame 11 selects a columnar integrated part 15 to drive. Specifically, the arc-shaped inner convex short plate presses the roller 26, and then the P plate rack 24 moves to drive the stroke shaft 23 to rotate. Subsequently, the stroke gear 22 drives the worm 21 to control the rotation of the horizontal control shaft 19. The horizontal control shaft 19 drives the chuck device 17. The chuck device 17 clamps the fastening pile 14. Then, the horizontal control shaft 19 drives the fastening pile 14 to rotate synchronously. The fastening pile 14 drives the V-shaped probe 7 to swing. When the V-shaped probe 7 is about to contact the chip, the clamping state between the chuck device 17 and the fastening pile 14 disappears because the horizontal control shaft 19 drives the end position disk 28 to rotate synchronously. When the end position disk 28 rotates to the end, the outer convex arc plate on the end position disk 28 will contact and push the L-shaped lifting plate 32. The L-shaped lifting plate 32 gradually moves away from the axis of the pressure release ring cylinder 30. The spring 29 rebounds to push the pressure release ring cylinder 30. The axial movement of the pressure release ring cylinder 30 drives the unit clamping plate 27. The unit clamping plate 27 is withdrawn from the cylinder on the fastening pile 14. In this way, the fastening pile 14 and the horizontal control shaft 19 can rotate relative to each other. At this time, the thick hairspring 18 comes into play. Under the support connection of the thick hairspring 18, although the horizontal control shaft 19 and the fastening pile 14 can rotate synchronously, the fastening pile 14 and the horizontal control shaft 19 are in an elastic connection state. In this way, although the horizontal control shaft 19 continues to rotate, the fastening pile 14 swings elastically under the control of the thick hairspring 18, so that the end of the V-shaped probe 7 presses on the chip flexibly.

[0074] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A fully automatic probe testing device for a chip, comprising a probe machine body, characterized in that: The main body of the detector is equipped with a platform for adsorbing and positioning the chip, a plurality of probes are arranged around the platform, and a position regulator for driving the probe to move in space is also installed above the platform. The probe includes: An instrument frame, one end of which is fixedly connected to the position regulator; A plurality of probe root groups are supported at the other end of the instrument frame, and the plurality of probe root groups are arranged in an arc shape, and the probe root groups are connected to an arc plate frame on the instrument frame; Multiple V-shaped probes that swing in turn, each probe root group clamps a corresponding V-shaped probe; One end of each V-shaped probe corresponds to a connected wire, and the other end of the V-shaped probe is brought close to the chip by rapid rigid swinging, and then flexibly contacts the chip; A power integration is provided, wherein the power integration drives the plurality of probe root groups to swing in turn.

2. The fully automatic probe testing equipment for chips according to claim 1, characterized in that: The probe root group includes: A pile plate with one end fixed to the arc plate frame of the device frame; A columnar integrated component supported by the other end of the pile plate; One end of the fastening pile is connected to the columnar integrated component, and the V-shaped probe is plugged and fixed on the other end of the fastening pile.

3. The fully automatic probe testing equipment for chips according to claim 2, characterized in that: The power integration includes: The arc flat ring frame, the outer arc plate on the arc flat ring frame slides through the arc plate hole opened on the pile plate; The arc plate rack is fixed on one side of the inner arc plate on the arc flat ring frame; The displacement shaft is supported on the arc plate frame of the device frame, and one end of the displacement shaft is meshed and transmission-connected with the arc plate rack through a fixed gear.

4. The fully automatic probe testing equipment for chips according to claim 3, characterized in that: The columnar integrated component includes a transverse control shaft movably sleeved in a rough hole opened in a pile plate, a chuck device arranged at one end of the transverse control shaft, a pressure device for pressing the chuck device, and an actuating device transmission-connected to the other end of the transverse control shaft, the actuating device and the arc-shaped inwardly convex short plate arranged on the arc flat ring frame are in contact transmission, and one end of the fastening pile is movably sleeved on the ring cylinder opened on the transverse control shaft by setting a cylinder.

5. The fully automatic probe testing equipment for chips according to claim 4, characterized in that: The columnar integrated component also includes a clockwork thick piece, which is fixedly sleeved on the transverse control shaft, and the outer end of the clockwork thick piece is fixed on a convex seat arranged on the fastening pile.

6. The fully automatic probe testing equipment for chips according to claim 4, characterized in that: The transverse control shaft includes a P-plate rack sliding through a plate hole opened in the pile plate, a roller arranged at one end of the P-plate rack, a travel shaft distributed at the other end of the P-plate rack, a travel gear fixed at one end of the travel shaft, and a worm driven on one side of the travel gear. One end of the worm is meshed and connected to the travel gear through a fixed gear, the helical teeth on the other end of the worm are meshed and connected to the outer gear ring on the transverse control shaft, the other end of the travel shaft is meshed and connected to the P-plate rack by setting a shaft gear, and the arc-shaped inwardly convex short plate of the arc flat ring frame is braked by pushing the roller.

7. The fully automatic probe testing equipment for chips according to claim 6, characterized in that: The worm and the travel shaft are respectively movably sleeved in different through holes opened on the pile plate. The transverse control shaft also includes a pullback spring sheet, one end of which is fixed on the pile plate, and the other end is fixed on the P plate rack.

8. The fully automatic probe testing equipment for chips according to claim 4, characterized in that: The chuck device includes an end plate fixed on the end of the transverse control shaft, a pressure ring tube slidably sleeved on the transverse control shaft, a spring supported between the pressure ring tube and the fastening pile cylinder, and a plurality of unit clamping plates evenly arranged and fixed on one side of the pressure ring tube, the unit clamping plate is inserted into a square groove opened on the fastening pile cylinder, and the outer edge of the square groove is a rounded structure for guiding the insertion of the unit clamping plate, the spring is sleeved on the transverse control shaft, and the interior of the pressure ring tube is clamped into an axial sliding groove opened on the outer side wall of the transverse control shaft by setting a protrusion.

9. The fully automatic probe testing equipment for chips according to claim 8, characterized in that: The pressure device includes a folding frame with one end fixed on the pile plate, an L-shaped lifting plate sliding through a plate hole opened at the other end of the folding frame, and a J-shaped spring sheet for pressing the L-shaped lifting plate. The other end of the J-shaped spring sheet is fixed on the folding frame. One end of the L-shaped lifting plate presses the chamfered surface of the outer ring of the pressing ring tube, and a semi-ring plate is fixed to the other end of the L-shaped lifting plate. The outer edge of the end plate pushes the semi-ring plate of the L-shaped lifting plate by setting an outer convex arc plate.

10. A fully automatic probe testing method for a chip, using the fully automatic probe testing device for a chip according to claim 1, characterized in that: The following steps are involved: Step 1: Place the chip at the air hole on the platform. The air hole on the platform absorbs and positions the chip by exhausting air. Step 2: The position regulator drives the probe to move in space, and the probe moves to the predetermined detection position; Step 3: A probe root group on the power integrated drive probe device swings, and the probe root group drives the V-shaped probe to swing rigidly. When the V-shaped probe tip contacts the chip, the probe root group completes the rigid-flexible conversion inside, and the probe root group provides flexible pressure to the V-shaped probe. The V-shaped probe tip contacts the chip flexibly. The probe root groups on multiple probe devices complete the docking with the chip through the rigid-flexible conversion method. Then, the V-shaped probe in contact with the chip is powered on, and the host terminal on the detector body collects and analyzes the data of the power-on detection. Step 4: The power integration drives different probe root groups on the probe device to swing in turn to control the contact detection between the corresponding V-type probe and the chip. When the next probe root group in the probe device is switched to swing, the previous probe root group is automatically reset. The host terminal collects the detection data of the same position on the chip multiple times, and confirms the correct detection data by judging and collecting multiple data.

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