Performance test structure based on IPD filter

Abstract

The invention discloses a performance test structure based on an IPD filter, and belongs to the technical field of IPD filter testing, the performance test structure comprises a filter body and two groups of test parts, the two groups of test parts are respectively located at two ends of the filter body, one group of test parts is an input end, and the other group of test parts is an output end. Each test part comprises a signal terminal and a grounding terminal, and after the signal terminals and the grounding terminals are connected into probes, the two groups of test parts form an equivalent circuit for the filter body. According to the performance test structure based on the IPD filter, the wafer-level performance test is realized, the performance test can be completed before the subsequent process of the wafer, the test cost of the filter is reduced, the test structure does not need to add a customized needle card or other clamps, and the use of a client is not influenced while the test is satisfied.

Description

Technical Field

[0001] The invention belongs to the technical field of IPD filter testing, and in particular relates to a performance testing structure based on an IPD filter. Background Art

[0002] The IPD filter is an electronic component manufactured based on microelectronics technology. After the wafer processing technology is completed, the general IPD filter needs to undergo post-processing (such as ball implantation, copper pillar, cutting, welding and packaging) before the performance of the IPD filter can be tested. In actual operation, it is impossible to perform performance testing on the wafer at the wafer level. For the existing testing methods, if the wafer is unqualified after the test, it needs to be adjusted, which will lead to waste of post-process costs. In severe cases, it will also affect the quality of the filter, and its testing cost is relatively high. Summary of the invention

[0003] The present invention overcomes the deficiencies of the prior art and provides a performance test structure based on an IPD filter to solve the problems existing in the prior art.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a performance test structure based on an IPD filter, including a filter body and a test part, the number of the test parts is two groups and they are respectively located at the two ends of the filter body, one group of the test parts is the input end, and the other group of the test parts is the output end, the test part includes a signal terminal and a ground terminal, when the signal terminal and the ground terminal are connected to the probe, the two groups of the test parts form an equivalent circuit for the filter body.

[0005] In a preferred embodiment of the present invention, the signal terminal and the ground terminal are respectively electroplated on the surface of the filter body.

[0006] In a preferred embodiment of the present invention, the signal terminal and the ground terminal are both three-layer structures, and are electroplated on the surface of the filter body in sequence.

[0007] In a preferred embodiment of the present invention, the signal terminal and the ground terminal are electroplated on the surface of the filter body in sequence using multiple layers of metal, and the electroplating sequence is: copper plating, nickel plating and gold plating.

[0008] In a preferred embodiment of the present invention, a wire bonding portion is provided on the filter body to perform client connection of the filter body.

[0009] In a preferred embodiment of the present invention, the signal terminal and the ground terminal are both located on the surface of the dielectric layer of the filter body.

[0010] The present invention solves the defects existing in the background technology and has the following beneficial effects:

[0011] The present invention realizes wafer-level performance testing based on the performance testing structure of the IPD filter, and can complete the performance testing before the wafer undergoes back-end processing, which is beneficial to reducing the testing cost of the filter. In addition, the test structure does not require the addition of customized pin cards or other fixtures, and can meet the test requirements without affecting the client's use. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The present invention is further described below in conjunction with the accompanying drawings and embodiments;

[0013] Figure 1 It is a schematic diagram of the overall structure of a preferred embodiment of the present invention;

[0014] Figure 2 An equivalent circuit diagram formed for a preferred embodiment of the present invention;

[0015] In the figure: 10, filter body; 20, testing part; 21, signal terminal; 22, ground terminal; 30, bonding part. DETAILED DESCRIPTION

[0016] The following will disclose multiple embodiments of the present invention with drawings. For the purpose of clear description, many physical details will be described together in the following description. However, it should be understood that these physical details should not be used to limit the present invention. That is, in some embodiments of the present invention, these physical details are not necessary. In addition, for the purpose of simplifying the drawings, some conventional structures and components will be depicted in a simple schematic manner in the drawings.

[0017] In addition, in the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes, and do not specifically refer to the order or sequence, nor are they used to limit the present invention. They are only used to distinguish components or operations described with the same technical terms, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0018] The present embodiment provides a performance test structure based on the IPD filter. The performance test structure based on the IPD filter realizes wafer-level performance testing and can complete the performance test before the wafer undergoes back-end processing, which is beneficial to reducing the testing cost of the filter. The test structure does not require the addition of customized pin cards or other fixtures, and can meet the test requirements without affecting the client's use.

[0019] Combination Figure 1 and Figure 2 As shown, the performance test structure based on the IPD filter of this embodiment includes a filter body 10 and a test part 20. There are two groups of test parts 20, which are respectively located at both ends of the filter body 10. One group of test parts 20 is an input end, and the other group of test parts 20 is an output end. The test part 20 includes a signal terminal 21 and a ground terminal 22. When the signal terminal 21 and the ground terminal 22 are connected to the probe, the two groups of test parts 20 form an equivalent circuit for the filter body 10. During the test of the wafer, the signal terminal 21 and the ground terminal 22 are both plugged with probes, so that the equivalent circuit formed by the two groups of test parts 20 is in a connected state, so as to test the wafer. The signal terminal 21 and the ground terminal 22 of this embodiment are both located on the surface of the dielectric layer of the filter body 10.

[0020] In this embodiment, the signal terminal 21 and the ground terminal 22 are respectively plated on the surface of the filter body 10. The signal terminal 21 and the ground terminal 22 are both three-layer structures and are electroplated on the surface of the filter body 10 in sequence. The signal terminal 21 and the ground terminal 22 are electroplated on the surface of the filter body 10 in sequence using multiple layers of metal. The plating order is: copper plating, nickel plating and gold plating. The signal terminal 21 and the ground terminal 22 of this embodiment are both plated at the I / O port position of the filter body 10 to facilitate testing and will not affect its client use.

[0021] Furthermore, a bonding portion 30 is disposed on the filter body 10 of the present embodiment to perform client connection of the filter body 10 .

[0022] Before testing the performance test structure of this embodiment, a hole needs to be dug on the back of the filter body 10 , and a seed layer is sputtered and metal is electroplated at the hole position on the back to meet the grounding test requirements of the grounding terminal 22 .

[0023] In summary, the performance test structure of this embodiment realizes wafer-level performance testing and can complete performance testing before the wafer undergoes post-processing, which is beneficial to reducing the testing cost of the filter. In addition, the test structure does not require the addition of customized pin cards or other fixtures, which meets the test requirements without affecting the client's use.

[0024] Although the present invention has been described above with reference to various embodiments, it should be understood that many changes and modifications may be made without departing from the scope of the present invention. That is, the methods, systems or devices discussed above are all examples. Various configurations may appropriately omit, replace or add various processes or components. For example, in alternative configurations, the method may be performed in an order different from the order described, and / or various stages may be added, omitted and / or combined. Moreover, the features described with respect to certain configurations may be combined in various other configurations. Different aspects and elements of the configurations may be combined in a similar manner. In addition, with the development of technology, many elements are merely examples and do not limit the scope of the present disclosure or claims.

[0025] Specific details are given in the specification to provide a thorough understanding of the exemplary configurations including implementations. However, the configurations can be practiced without these specific details, for example, well-known circuits, processes, algorithms, structures, and techniques have been shown without unnecessary details to avoid obscuring the configurations. This description provides only example configurations and does not limit the scope, applicability, or configurations of the claims. On the contrary, the foregoing description of the configurations will provide those skilled in the art with an enabling description for implementing the described techniques. Various changes may be made to the functions and arrangements of the elements without departing from the spirit or scope of the present disclosure.

[0026] In addition, although each operation may describe the operation as a sequential process, many operations may be performed in parallel or simultaneously. In addition, the order of the operations may be rearranged. A process may have additional steps. In addition, examples of methods may be implemented by hardware, software, firmware, middleware, code, hardware description language, or any combination thereof. When implemented in software, firmware, middleware, or code, program code or code segments for performing the necessary tasks may be stored in a non-transitory computer-readable medium such as a storage medium, and the described tasks are performed by a processor.

[0027] In summary, it is intended that the above detailed description is considered to be exemplary rather than restrictive, and it should be understood that the claims (including all equivalents) are intended to limit the spirit and scope of the present invention. The above embodiments should be understood to be only used to illustrate the present invention and not to limit the scope of protection of the present invention. After reading the content of the record of the present invention, the technician can make various changes or modifications to the present invention, and these equivalent changes and modifications also fall into the scope limited by the claims of the present invention.

Claims

1. A performance test structure based on an IPD filter, characterized in that: The invention comprises a filter body (10) and a test unit (20), wherein the test units (20) are in two groups and are respectively located at two ends of the filter body (10), one group of the test units (20) is an input end, and the other group of the test units (20) is an output end, and the test units (20) comprise a signal terminal (21) and a ground terminal (22). When the signal terminal (21) and the ground terminal (22) are connected to a probe, the two groups of the test units (20) form an equivalent circuit for the filter body (10).

2. A performance test structure based on an IPD filter according to claim 1, characterized in that: The signal terminal (21) and the ground terminal (22) are respectively electroplated on the surface of the filter body (10).

3. A performance test structure based on IPD filter according to claim 2, characterized in that: The signal terminal (21) and the ground terminal (22) are both three-layer structures and are electroplated on the surface of the filter body (10) in sequence.

4. The performance test structure based on IPD filter according to claim 3, characterized in that: The signal terminal (21) and the ground terminal (22) are electroplated on the surface of the filter body (10) in sequence using multiple layers of metal, and the electroplating sequence is: copper plating, nickel plating and gold plating.

5. The performance test structure based on IPD filter according to claim 1, characterized in that: The filter body (10) is provided with a wire bonding portion (30) for performing client connection of the filter body (10).

6. The performance test structure based on IPD filter according to claim 1, characterized in that: The signal terminal (21) and the ground terminal (22) are both located on the surface of the dielectric layer of the filter body (10).

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