Transient thermal resistance testing device and transient thermal resistance testing method

Abstract

The invention relates to a transient thermal resistance testing device and a transient thermal resistance testing method. The transient thermal resistance testing device comprises a bottom plate, the bottom plate comprises a bottom plate body, a circuit layer located on the surface of the bottom plate body and a bottom containing cavity located in the bottom plate body, the bottom plate body is used for bearing a chip to be tested, the circuit layer is used for being electrically connected with the chip to be tested, and the circuit layer is used for being electrically connected with the bottom containing cavity. The bottom accommodating cavity is used for sequentially conveying a plurality of bottom heat-conducting media with different heat conductivity coefficients or accommodating a bottom heat-insulating medium; the top cover is located above the bottom plate, the top cover comprises a top cover body and a top accommodating cavity located in the top cover body, the top cover body is used for covering the surface of the chip to be tested, and the top accommodating cavity is used for sequentially transmitting multiple top heat-conducting media with different heat conductivity coefficients or accommodating a top heat-insulating medium. According to the invention, the transient thermal resistance test operation is simplified, and the transient thermal resistance test efficiency, the test accuracy and the test reliability are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a transient thermal resistance testing device and a transient thermal resistance testing method. Background Art

[0002] Through the study of the reliability of electronic products, the components that affect the reliability of electronic products have been obtained. Among them, for every 10°C increase in the junction temperature of electronic products, the service life of the chip is reduced by half, and the failure rate of electronic products caused by temperature is as high as 55%. Transient thermal resistance is the ratio of the temperature rise caused by the pulse dissipation power to the power, which is used to reflect the thermal behavior of electronic devices in transient processes. The current transient thermal resistance test includes two aspects: the test of transient thermal resistance at the top of the chip and the test of transient thermal resistance at the bottom of the chip. When testing the transient thermal resistance at the bottom of the chip, the device to be tested is placed on a cold plate, and the standard thermal resistance test board on the device to be tested is in contact with the cold plate, and a thermal interface material is applied between the standard thermal resistance test board and the cold plate to perform a structure function test; then, the device to be tested is replaced with a standard thermal resistance test board with different copper content, and the structure function test is performed after applying the thermal interface material again; finally, the transient thermal resistance test result at the bottom of the device to be tested is confirmed by the structure function separation point obtained by the two tests. When testing the transient thermal resistance on the top of the chip, the device to be tested is placed upside down on a cold plate so that the top of the device to be tested is in contact with the cold plate, and the structure function test is performed without applying thermal interface material. Then, thermal interface material is applied between the top of the device to be tested and the cold plate, and the structure function test is performed again. Finally, the transient thermal resistance test result on the top of the device to be tested is confirmed by the structure function separation point obtained through the two tests.

[0003] However, the current test method requires two tests, whether it is the top transient thermal resistance test or the bottom transient thermal resistance test, and the operation process is relatively cumbersome. Moreover, in the actual test process, it is difficult to ensure the unidirectional flow of heat because effective insulation cannot be achieved, thereby reducing the accuracy of the test results. In addition, during the bottom transient thermal resistance test, it is necessary to replace two devices to be tested with standard thermal resistance test boards with different copper contents, making it difficult to ensure the consistency of the chips on the two devices to be tested. It is also difficult to avoid introducing other test thermal resistances during the test process, which results in the need to improve the test accuracy.

[0004] Therefore, how to simplify the transient thermal resistance test operation while improving the accuracy and reliability of the transient thermal resistance test results is a technical problem that needs to be solved urgently. Summary of the invention

[0005] The invention provides a transient thermal resistance testing device and a transient thermal resistance testing method, which are used to improve the accuracy and reliability of transient thermal resistance testing results while simplifying the transient thermal resistance testing operation.

[0006] According to some embodiments, the present invention provides a transient thermal resistance testing device, comprising:

[0007] A bottom plate, comprising a bottom plate body, a circuit layer located on the surface of the bottom plate body, and a bottom accommodating cavity located in the bottom plate body, wherein the bottom plate body is used to carry the chip to be tested, the circuit layer is used to be electrically connected to the chip to be tested, and the bottom accommodating cavity is used to sequentially transmit a plurality of bottom heat-conducting media with different thermal conductivities or to accommodate a bottom heat-insulating medium;

[0008] A top cover is located above the bottom plate, and the top cover includes a top cover body and a top accommodating cavity located in the top cover body. The top cover body is used to cover the surface of the chip to be tested, and the top accommodating cavity is used to sequentially transmit a plurality of top heat-conducting media with different thermal conductivities or to accommodate a top heat-insulating medium.

[0009] In some embodiments, the top heat-conducting medium and the bottom heat-conducting medium are both fluid media.

[0010] In some embodiments, it also includes:

[0011] The top sealing structure is used to seal the top accommodating cavity.

[0012] The bottom sealing structure is used to seal the bottom accommodating cavity.

[0013] In some embodiments, the base plate body includes an inner area for supporting the chip to be tested and an edge area located outside the inner area, and the circuit layer is at least located in the edge area;

[0014] The bottom receiving cavities are evenly distributed in the inner area.

[0015] In some embodiments, the top cover further comprises a top fluid inlet and a top fluid outlet communicated with the top accommodating cavity, and the top fluid inlet and the top fluid outlet are distributed at two opposite ends of the top cover body;

[0016] The bottom plate further comprises a bottom fluid inlet and a bottom fluid outlet communicated with the bottom accommodating cavity, and the bottom fluid inlet and the bottom fluid outlet are distributed at two opposite ends of the bottom plate body;

[0017] The top fluid inlet and the bottom fluid inlet are distributed on the same side, and the top fluid outlet and the bottom fluid outlet are distributed on the same side.

[0018] In some embodiments, it also includes:

[0019] The heat-insulating side wall is located between the bottom plate and the top cover, and the heat-insulating side wall is used to cover the side surface of the chip to be tested.

[0020] In some embodiments, the material of the bottom plate body and the material of the top cover body are both thermally conductive materials.

[0021] According to some other embodiments, the present invention further provides a transient thermal resistance testing method, comprising the following steps:

[0022] Placing the chip to be tested on the bottom plate of the transient thermal resistance test device as claimed in claim 1, and covering the top cover to the top surface of the chip to be tested, wherein the chip to be tested is electrically connected to the circuit layer on the bottom plate;

[0023] Circulating and transmitting a first top heat-conducting medium into the top containing chamber, and transmitting a bottom heat-insulating medium into the bottom containing chamber and sealing the bottom containing chamber;

[0024] Acquire a first top structure function curve of the chip to be tested;

[0025] Circulating a second top heat-conducting medium into the top accommodating chamber and keeping the bottom accommodating chamber sealed, wherein the thermal conductivity of the second top heat-conducting medium is different from the thermal conductivity of the first top heat-conducting medium;

[0026] Obtaining a second top structure function curve of the chip to be tested;

[0027] The top transient thermal resistance of the chip to be tested is obtained according to the first top structure function curve and the second top structure function curve.

[0028] In some embodiments, before circulating the first top heat-conducting medium into the top containing chamber, and transferring the bottom heat-insulating medium into the bottom containing chamber, and sealing the bottom containing chamber, the following steps are also included:

[0029] The heat-insulating sidewalls are covered on the side surfaces of the chip to be tested.

[0030] In some embodiments, the bottom heat insulating medium is air, and the first top heat conducting medium and the second top heat conducting medium are any one of cooling water, cooling oil and cooling air.

[0031] In some embodiments, the following steps are also included:

[0032] Circulating and transmitting a first bottom heat-conducting medium into the bottom containing chamber, and transmitting a top heat-insulating medium into the top containing chamber and sealing the top containing chamber;

[0033] Obtaining a first bottom structure function curve of the chip to be tested;

[0034] Circulating a second bottom heat-conducting medium into the bottom accommodating chamber and keeping the top accommodating chamber sealed, wherein the thermal conductivity of the first bottom heat-conducting medium is different from the thermal conductivity of the second bottom heat-conducting medium;

[0035] Obtaining a second bottom structure function curve of the chip to be tested;

[0036] The bottom transient thermal resistance of the chip to be tested is obtained according to the first bottom structure function curve and the second bottom structure function curve.

[0037] The transient thermal resistance testing device and the transient thermal resistance testing method provided by the present invention are provided with a bottom plate for carrying a chip to be tested and a top cover located above the bottom plate and used to cover the surface of the chip to be tested, wherein the bottom plate has a bottom accommodating cavity for transmitting a bottom heat-conducting medium or accommodating a bottom heat-insulating medium, and the top cover has a top accommodating cavity for transmitting a top heat-conducting medium or accommodating a top heat-insulating medium. In the process of performing a transient thermal resistance test on the chip to be tested, the bottom plate or the top cover can be used as a cold plate, and only the type of the heat-conducting medium (bottom heat-conducting medium or top heat-conducting medium) transmitted to the accommodating cavity (bottom accommodating cavity or top accommodating cavity) serving as the cold plate needs to be changed. By measuring the structure function curve of the chip to be tested when heat-conducting media with different thermal conductivities are transmitted to the accommodating cavity, the transient thermal resistance of the chip to be tested can be obtained, without the need to perform an erasing operation of the thermal interface material and without the need to replace the standard thermal resistance testing board, thereby simplifying the operation of the transient thermal resistance test and improving the efficiency of the transient thermal resistance test. In addition, by using the bottom plate or the top plate as a heat insulation plate and filling the top accommodating cavity of the top cover or the bottom accommodating cavity of the bottom plate with a heat insulation medium, it is possible to ensure unidirectional heat transmission during the transient thermal resistance test, thereby improving the accuracy of transient thermal resistance measurement. At the same time, since the chip to be tested does not need to be moved during the test, that is, the relative position of the chip to be tested and the top cover is fixed, and there is no need to replace the chip to be tested, the introduction of additional test errors is reduced or even avoided, thereby improving the accuracy and reliability of the transient thermal resistance test. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 It is a structural schematic diagram of a transient thermal resistance testing device in a specific embodiment of the present invention;

[0039] Figure 2 is a schematic diagram of a first top structure function curve and a second top structure function curve in a specific embodiment of the present invention;

[0040] Figure 3 It is a flow chart of a transient thermal resistance testing method in a specific implementation manner of the present invention. DETAILED DESCRIPTION

[0041] The specific implementation manner of the transient thermal resistance testing device and the transient thermal resistance testing method provided by the present invention is described in detail below in conjunction with the accompanying drawings.

[0042] This specific embodiment provides a transient thermal resistance testing device, Figure 1 Schematic diagram of the structure of the transient thermal resistance test device in a specific embodiment of the present invention. Figure 1 As shown, the transient thermal resistance testing device comprises:

[0043] The bottom plate includes a bottom plate body 10, a circuit layer located on the surface of the bottom plate body 10, and a bottom accommodating cavity located in the bottom plate body 10, wherein the bottom plate body 10 is used to carry a chip to be tested 11, the circuit layer is used to be electrically connected to the chip to be tested 11, and the bottom accommodating cavity is used to sequentially transmit a plurality of bottom heat-conducting media with different thermal conductivities or to accommodate a bottom heat-insulating medium;

[0044] The top cover is located above the bottom plate, and the top cover includes a top cover body 12 and a top accommodating cavity located in the top cover body 12. The top cover body 12 is used to cover the surface of the chip to be tested 11, and the top accommodating cavity is used to sequentially transmit a plurality of top heat-conducting media with different thermal conductivities or to accommodate a top heat-insulating medium.

[0045] Specifically, the transient thermal resistance test device includes the base plate and the top cover located above the base plate. The base plate includes the base plate body 10, the circuit layer located on the surface of the base plate body 10 facing the top cover, and the bottom accommodating cavity located in the base plate body 10. The end of the circuit layer has a wiring terminal 13, and the wiring terminal 13 is electrically connected to the circuit layer for transmitting power supply signals and test electrical signals to the circuit layer. The surface of the base plate body 10 facing the top cover is used to carry the chip to be tested 11, and the circuit layer is electrically connected to the chip to be tested 11, so as to facilitate the subsequent transmission of transient thermal resistance test electrical signals to the chip to be tested through the circuit layer. In one example, the chip to be tested 11 includes a top surface and a bottom surface that are relatively distributed, and the chip to be tested 11 is placed on the surface of the base plate body 10 with the bottom surface of the chip to be tested 11 facing the base plate. In another example, the chip under test 11 includes a relatively distributed top surface and a bottom surface, and the chip under test 11 is placed on the surface of the base plate body 10 with the top surface of the chip under test 11 facing the base plate (that is, the chip under test 11 is flipped on the base plate).

[0046] The top accommodating chamber located in the top cover body 12 and the bottom accommodating chamber located in the bottom plate body 10 are independent of each other, and the bottom accommodating chamber is used to sequentially transmit a plurality of bottom heat-conducting media with different thermal conductivities or to accommodate a bottom heat-insulating medium, and the top accommodating chamber is used to sequentially transmit a plurality of top heat-conducting media with different thermal conductivities or to accommodate a top heat-insulating medium, so that the top transient thermal resistance of the chip to be tested 11 and / or the bottom transient thermal resistance of the chip to be tested 11 can be obtained without repositioning and moving the chip to be tested 11, thereby further simplifying the transient thermal resistance test and greatly improving the flexibility and test efficiency of the transient thermal resistance test. Moreover, since there is no need to move the chip to be tested 11, other test errors are avoided, thereby further improving the accuracy of the transient thermal resistance test. In addition, since the top accommodating cavity can accommodate the top heat-insulating medium, and the bottom accommodating cavity can accommodate the bottom heat-insulating medium, when obtaining the top transient thermal resistance and / or the bottom transient thermal resistance of the chip to be tested 11, the unidirectional flow of heat is ensured, that is, the one-dimensional heat conduction path is ensured during the top transient thermal resistance test, thereby further improving the accuracy and reliability of the top transient thermal resistance test. In one example, the bottom accommodating cavity and the top accommodating cavity can both be cavities, pipes or passages.

[0047] Figure 2 It is a schematic diagram of the first top structure function curve and the second top structure function curve in a specific embodiment of the present invention. For example, in the process of testing the transient thermal resistance of the top of the chip 11 to be tested, top heat-conducting media with different thermal conductivities are circulated and transmitted into the top containing cavity in sequence. Since the thermal conductivities of the two top heat-conducting media transmitted in sequence are different, that is, the heat dissipation capabilities of the two top heat-conducting media transmitted in sequence are different, the thermal resistance and thermal capacity of the two top heat-conducting media are different. The structure function curve used to obtain the transient thermal resistance of the chip 11 to be tested is associated with the ratio between the thermal capacity and the thermal resistance of the top heat-conducting medium. The thermal resistance and thermal capacity of the two top heat-conducting media are different. Therefore, the two top structure function curves obtained under the two top heat-conducting media are different, for example Figure 2 The first top structure function curve 21 is a structure function curve obtained when a top heat-conducting medium is circulated into the top containing cavity, and the second top structure function curve 22 is a structure function curve obtained when another top heat-conducting medium with a different thermal conductivity is transmitted into the top containing cavity. The transient thermal resistance of the chip to be tested 11 (for example, the top transient thermal resistance of the chip to be tested 11) can be obtained according to the separation point of the two structure function curves (for example, the first top structure function curve 21 and the second top structure function curve 22).

[0048] This specific implementation only requires changing the type of heat-conducting medium transmitted to the top accommodating cavity or the bottom accommodating cavity, and by measuring the structure function curve of the chip to be tested when the heat-conducting medium with different thermal conductivity is transmitted to the top accommodating cavity or the bottom accommodating cavity, the transient thermal resistance of the chip to be tested can be obtained. There is no need to erase the thermal interface material on the surface of the chip to be tested, and there is no need to use and replace the standard thermal resistance test board, thereby simplifying the operation of the transient thermal resistance test and improving the efficiency of the transient thermal resistance test. At the same time, since there is no need to move the chip to be tested during the test, that is, the relative position of the chip to be tested and the top cover is fixed, and there is no need to replace the chip to be tested, the introduction of additional test errors is reduced or even avoided, thereby improving the accuracy and reliability of the transient thermal resistance test. In addition, by using the bottom plate or the top plate as an insulation plate, while circulating a heat-conducting medium into one of the top accommodating cavity of the top cover and the bottom accommodating cavity of the bottom plate, a heat-insulating medium is filled into the other of the top accommodating cavity and the bottom accommodating cavity, it is possible to ensure unidirectional heat transfer during the transient thermal resistance test, thereby improving the accuracy of the transient thermal resistance measurement.

[0049] In order to improve the uniformity of heat dissipation of the chip under test 11, thereby further improving the accuracy of the transient thermal resistance test result, in some embodiments, the base plate body 10 includes an internal area for carrying the chip under test 11 and an edge area located outside the internal area, and the circuit layer is at least located in the edge area;

[0050] The bottom receiving cavities are evenly distributed in the inner area.

[0051] In some embodiments, the top heat-conducting medium and the bottom heat-conducting medium are both fluid media, so as to realize the rapid circulation of the top heat-conducting medium in the top accommodating cavity and the rapid circulation of the bottom heat-conducting medium in the bottom accommodating cavity, so as to realize sufficient heat dissipation of the chip to be tested 11, so as to further simplify the transient thermal resistance test operation and further improve the test efficiency of transient thermal resistance. The cooling fluid can be any one of cooling water, cooling oil, cooling gas, or a combination of two or more thereof.

[0052] In some embodiments, the transient thermal resistance testing device further comprises:

[0053] The top sealing structure is used to seal the top accommodating cavity.

[0054] The bottom sealing structure is used to seal the bottom accommodating cavity.

[0055] The following is an example in which the bottom surface of the chip to be tested 11 is placed on the surface of the bottom plate body 10 in the direction of the bottom plate. When testing the top transient thermal resistance of the chip to be tested 11, the top cover is used as a cold plate to circulate cooling water or other top heat-conducting medium to the top accommodating cavity in the top cover body 12, and after the bottom accommodating cavity is filled with air or other bottom heat-insulating medium, the bottom accommodating cavity is sealed by the bottom sealing structure. Since the thermal conductivity of the bottom heat-insulating medium such as air is relatively low, the bottom heat-insulating medium such as air cannot flow in the sealed bottom accommodating cavity, which can be considered as heat-insulating, thereby ensuring the unidirectional flow of heat during the top transient thermal resistance test (i.e., heat only flows from the chip to be tested 11 to the top heat-conducting medium in the top cover body 12), ensuring a one-dimensional heat conduction path during the top transient thermal resistance test, thereby further improving the accuracy and reliability of the top transient thermal resistance test.

[0056] When testing the bottom transient thermal resistance of the chip to be tested 11, the bottom plate is used as a cold plate, and cooling water or other bottom heat-conducting medium is circulated to the bottom containing cavity in the bottom plate body 10, and after the top containing cavity is filled with air or other top heat-insulating medium, the top containing cavity is sealed by the top sealing structure. Since the thermal conductivity of the top heat-insulating medium such as air is relatively low, the top heat-insulating medium such as air cannot flow in the sealed top containing cavity, which can be considered as heat-insulating, thereby ensuring the unidirectional flow of heat during the bottom transient thermal resistance test (i.e., heat only flows from the chip to be tested 11 to the bottom heat-conducting medium in the bottom plate body 10), ensuring a one-dimensional heat conduction path during the bottom transient thermal resistance test, thereby further improving the accuracy and reliability of the bottom transient thermal resistance test.

[0057] In some embodiments, the top cover further comprises a top fluid inlet 15 and a top fluid outlet communicated with the top accommodating cavity, and the top fluid inlet 15 and the top fluid outlet are distributed at two opposite ends of the top cover body 12;

[0058] The bottom plate further comprises a bottom fluid inlet 16 and a bottom fluid outlet communicated with the bottom accommodating cavity, and the bottom fluid inlet 16 and the bottom fluid outlet are distributed at two opposite ends of the bottom plate body 10;

[0059] The top fluid inlet 15 and the bottom fluid inlet 16 are distributed on the same side, and the top fluid outlet and the bottom fluid outlet are distributed on the same side.

[0060] Specifically, by arranging the top fluid inlet 15 and the bottom fluid inlet 16 on the same side, and the top fluid outlet and the bottom fluid outlet on the same side, it is convenient for the top fluid inlet 15 and the bottom fluid inlet 16 to be connected to the same heat conductive medium storage source or heat insulating medium storage source, which helps to further reduce the cost of transient thermal resistance testing.

[0061] In some embodiments, the transient thermal resistance testing device further comprises:

[0062] The heat-insulating side wall 14 is located between the bottom plate and the top cover, and the heat-insulating side wall 14 is used to cover the side surface of the chip to be tested 11 .

[0063] In one example, the material of the heat insulating side wall 14 is heat insulating cotton. By providing the heat insulating side wall 14 distributed around the side of the chip under test 11, it is possible to prevent the heat generated by the chip under test 11 during the test from escaping from the side, thereby further improving the accuracy of transient thermal resistance test.

[0064] In some embodiments, the material of the bottom plate body 10 and the material of the top cover body 12 are thermally conductive materials. In one example, the material of the bottom plate body 10 and the material of the top cover body 12 are both copper, thereby further improving the thermal conductivity (e.g., heat dissipation efficiency) of the top cover and the bottom plate when they are respectively used as cold plates.

[0065] This specific implementation also provides a transient thermal resistance test method. Figure 3 1 is a flow chart of a transient thermal resistance test method in a specific embodiment of the present invention. The transient thermal resistance test method can be used as follows: Figure 1 The transient thermal resistance test device is implemented as shown. Figure 1 and Figure 3 As shown, the transient thermal resistance test method comprises the following steps:

[0066] Step S31, placing the chip to be tested 11 on the bottom plate of the transient thermal resistance test device as described above, and covering the top cover to the top surface of the chip to be tested 11, and the chip to be tested 11 is electrically connected to the circuit layer on the bottom plate;

[0067] Step S32, circulating the first top heat-conducting medium into the top accommodating chamber, and transmitting the bottom heat-insulating medium into the bottom accommodating chamber and sealing the bottom accommodating chamber;

[0068] Step S33, obtaining a first top structure function curve of the chip to be tested;

[0069] Step S34, circulating a second top heat-conducting medium into the top accommodating chamber, and keeping the bottom accommodating chamber sealed, wherein the thermal conductivity of the second top heat-conducting medium is different from the thermal conductivity of the first top heat-conducting medium;

[0070] Step S35, obtaining a second top structure function curve of the chip to be tested;

[0071] Step S36, obtaining the top transient thermal resistance of the chip to be tested according to the first top structure function curve and the second top structure function curve.

[0072] In some embodiments, before circulating the first top heat-conducting medium into the top containing chamber, and transferring the bottom heat-insulating medium into the bottom containing chamber, and sealing the bottom containing chamber, the following steps are also included:

[0073] The heat-insulating sidewall 14 covers the side surface of the chip under test 11 .

[0074] For example, the chip to be tested 11 is placed on the surface of the base plate body 10 with the bottom surface facing the base plate, and is electrically connected to the circuit layer on the base plate, and the top cover is covered on the top surface of the chip to be tested 11, and the heat-insulating side wall 14 is attached to the side of the chip to be tested 11, so that the bottom surface of the chip to be tested 11 is in direct contact with the base plate, and the top surface of the chip to be tested 11 is in direct contact with the top cover, and the side of the chip to be tested 11 is in contact with the heat-insulating side wall 14. When testing the top transient thermal resistance of the chip to be tested 11, the first top heat-conducting medium such as cooling water is circulated to the top containing cavity through the top fluid inlet 15, and the bottom containing cavity is filled with a bottom heat-insulating medium such as air through the bottom fluid inlet 16, and the bottom containing cavity is sealed by the bottom sealing structure. Afterwards, a test electrical signal is transmitted to the test chip 11 through the circuit layer to obtain the first top structure function curve. Next, a second top heat-conducting medium such as cooling oil is circulated to the top containing cavity through the top fluid inlet 15, and the bottom containing cavity is kept sealed, and then a test electrical signal is transmitted to the test chip 11 through the circuit layer to obtain the second top structure function curve. The top transient thermal resistance of the chip to be tested 11 is obtained according to the separation point of the first top structure function curve and the second top structure function curve.

[0075] In some embodiments, the bottom heat insulating medium is air, and the first top heat conducting medium and the second top heat conducting medium are any one of cooling water, cooling oil and cooling air.

[0076] In some embodiments, the transient thermal resistance testing method further includes the following steps:

[0077] Circulating and transmitting a first bottom heat-conducting medium into the bottom containing chamber, and transmitting a top heat-insulating medium into the top containing chamber and sealing the top containing chamber;

[0078] Obtaining a first bottom structure function curve of the chip under test 11;

[0079] Circulating a second bottom heat-conducting medium into the bottom accommodating chamber and keeping the top accommodating chamber sealed, wherein the thermal conductivity of the first bottom heat-conducting medium is different from the thermal conductivity of the second bottom heat-conducting medium;

[0080] Obtaining a second bottom structure function curve of the chip under test 11;

[0081] The bottom transient thermal resistance of the chip to be tested is obtained according to the first bottom structure function curve and the second bottom structure function curve.

[0082] For example, the chip to be tested 11 is placed on the surface of the base plate body 10 with the bottom surface facing the base plate, and is electrically connected to the circuit layer on the base plate, and the top cover is covered on the top surface of the chip to be tested 11, and the heat-insulating side wall 14 is attached to the side of the chip to be tested 11. When testing the bottom transient thermal resistance of the chip to be tested 11, the first bottom heat-conducting medium such as cooling water is circulated to the bottom accommodating cavity through the bottom fluid inlet 16, and the top heat-insulating medium such as air is filled into the top accommodating cavity through the top fluid inlet 15, and the top accommodating cavity is sealed by the top sealing structure. Afterwards, a test electrical signal is transmitted to the test chip 11 through the circuit layer to obtain the first bottom structure function curve. Then, a second bottom heat-conducting medium such as cooling oil is circulated to the bottom accommodating cavity through the bottom fluid inlet 16, and the top accommodating cavity is kept sealed, and then a test electrical signal is transmitted to the test chip 11 through the circuit layer to obtain the second bottom structure function curve. The bottom transient thermal resistance of the chip to be tested 11 is obtained according to the separation point of the first bottom structure function curve and the second bottom structure function curve.

[0083] The transient thermal resistance testing device and the transient thermal resistance testing method provided in the present specific embodiment are provided with a bottom plate for carrying the chip to be tested and a top cover located above the bottom plate and used to cover the surface of the chip to be tested, wherein the bottom plate has a bottom accommodating cavity for transmitting a bottom heat-conducting medium or accommodating a bottom heat-insulating medium, and the top cover has a top accommodating cavity for transmitting a top heat-conducting medium or accommodating a top heat-insulating medium. In the process of performing a transient thermal resistance test on the chip to be tested, the bottom plate or the top cover can be used as a cold plate, and only the type of the heat-conducting medium (bottom heat-conducting medium or top heat-conducting medium) transmitted to the accommodating cavity (bottom accommodating cavity or top accommodating cavity) serving as the cold plate needs to be changed. By measuring the structure function curve of the chip to be tested when heat-conducting media with different thermal conductivities are transmitted to the accommodating cavity, the transient thermal resistance of the chip to be tested can be obtained, without the need to perform an erasing operation of the thermal interface material and without the need to replace the standard thermal resistance test board, thereby simplifying the operation of the transient thermal resistance test and improving the efficiency of the transient thermal resistance test. In addition, by using the bottom plate or the top plate as a heat insulation plate and filling the top accommodating cavity of the top cover or the bottom accommodating cavity of the bottom plate with a heat insulation medium, it is possible to ensure unidirectional heat transmission during the transient thermal resistance test, thereby improving the accuracy of transient thermal resistance measurement. At the same time, since the chip to be tested does not need to be moved during the test, that is, the relative position of the chip to be tested and the top cover is fixed, and there is no need to replace the chip to be tested, the introduction of additional test errors is reduced or even avoided, thereby improving the accuracy and reliability of the transient thermal resistance test.

[0084] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A transient thermal resistance testing device, characterized in that: include: A bottom plate, comprising a bottom plate body, a circuit layer located on the surface of the bottom plate body, and a bottom accommodating cavity located in the bottom plate body, wherein the bottom plate body is used to carry the chip to be tested, the circuit layer is used to be electrically connected to the chip to be tested, and the bottom accommodating cavity is used to sequentially transmit a plurality of bottom heat-conducting media with different thermal conductivities or to accommodate a bottom heat-insulating medium; A top cover is located above the bottom plate, and the top cover includes a top cover body and a top accommodating cavity located in the top cover body. The top cover body is used to cover the surface of the chip to be tested, and the top accommodating cavity is used to sequentially transmit a plurality of top heat-conducting media with different thermal conductivities or to accommodate a top heat-insulating medium.

2. The transient thermal resistance testing device according to claim 1, characterized in that: The top heat-conducting medium and the bottom heat-conducting medium are both fluid media.

3. The transient thermal resistance testing device according to claim 1, characterized in that: Also includes: The top sealing structure is used to seal the top accommodating cavity. The bottom sealing structure is used to seal the bottom accommodating cavity.

4. The transient thermal resistance testing device according to claim 1, characterized in that: The base plate body comprises an inner area for carrying the chip to be tested and an edge area located outside the inner area, and the circuit layer is at least located in the edge area; The bottom receiving cavities are evenly distributed in the inner area.

5. The transient thermal resistance testing device according to claim 1, characterized in that: The top cover further comprises a top fluid inlet and a top fluid outlet communicated with the top accommodating chamber, and the top fluid inlet and the top fluid outlet are distributed at two opposite ends of the top cover body; The bottom plate further comprises a bottom fluid inlet and a bottom fluid outlet communicated with the bottom accommodating cavity, and the bottom fluid inlet and the bottom fluid outlet are distributed at two opposite ends of the bottom plate body; The top fluid inlet and the bottom fluid inlet are distributed on the same side, and the top fluid outlet and the bottom fluid outlet are distributed on the same side.

6. The transient thermal resistance testing device according to claim 1, characterized in that: Also includes: The heat-insulating side wall is located between the bottom plate and the top cover, and the heat-insulating side wall is used to cover the side surface of the chip to be tested.

7. The transient thermal resistance testing device according to claim 1, characterized in that: The material of the bottom plate body and the material of the top cover body are both heat-conducting materials.

8. A transient thermal resistance test method, characterized in that: The steps include: Placing the chip to be tested on the bottom plate of the transient thermal resistance test device as claimed in claim 1, and covering the top cover to the top surface of the chip to be tested, wherein the chip to be tested is electrically connected to the circuit layer on the bottom plate; Circulating and transmitting a first top heat-conducting medium into the top containing chamber, and transmitting a bottom heat-insulating medium into the bottom containing chamber and sealing the bottom containing chamber; Acquire a first top structure function curve of the chip to be tested; Circulating a second top heat-conducting medium into the top accommodating chamber and keeping the bottom accommodating chamber sealed, wherein the thermal conductivity of the second top heat-conducting medium is different from the thermal conductivity of the first top heat-conducting medium; Obtaining a second top structure function curve of the chip to be tested; The top transient thermal resistance of the chip to be tested is obtained according to the first top structure function curve and the second top structure function curve.

9. The transient thermal resistance testing method according to claim 8, characterized in that: Before circulating the first top heat-conducting medium into the top accommodating chamber, and transferring the bottom heat-insulating medium into the bottom accommodating chamber, and sealing the bottom accommodating chamber, the following steps are also included: The heat-insulating sidewalls are covered on the side surfaces of the chip to be tested.

10. The transient thermal resistance testing method according to claim 8, characterized in that: The bottom heat insulating medium is air, and the first top heat conducting medium and the second top heat conducting medium are any one of cooling water, cooling oil and cooling air.

11. The transient thermal resistance testing method according to claim 8, characterized in that: The following steps are also included: Circulating and transmitting a first bottom heat-conducting medium into the bottom containing chamber, and transmitting a top heat-insulating medium into the top containing chamber and sealing the top containing chamber; Obtaining a first bottom structure function curve of the chip to be tested; Circulating a second bottom heat-conducting medium into the bottom accommodating chamber and keeping the top accommodating chamber sealed, wherein the thermal conductivity of the first bottom heat-conducting medium is different from the thermal conductivity of the second bottom heat-conducting medium; Obtaining a second bottom structure function curve of the chip to be tested; The bottom transient thermal resistance of the chip to be tested is obtained according to the first bottom structure function curve and the second bottom structure function curve.

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