Temperature detection circuit and method for an IGBT module

Abstract

The present application provides a temperature detection circuit and method for an IGBT module, relating to the field of electronic technology. The temperature detection circuit includes: a drive board and multiple adapter boards. On the drive board, there are arranged: a drive power supply and a first detection unit. On each adapter board, there is arranged a second detection unit. The second detection units on the multiple adapter boards are respectively used to connect the temperature detection ends of multiple IGBT modules. The second detection units on the multiple adapter boards are cascaded in sequence through signal wire harnesses. The second detection unit of the last-stage adapter board among the multiple adapter boards is connected to the first detection unit on the drive board through a signal wire harness. The first detection unit is further used to connect to a client device, and the drive power supply is used to connect to the drive ends of multiple IGBT modules. Thus, it is applicable to various IGBT module temperature detection structures and reduces the circuit cost.

Description

Technical Field

[0001] The present application relates to the field of electronic technologies, and in particular, to a temperature detection circuit and method for an IGBT module. Background Art

[0002] In the prior art, for temperature sampling of a multi-level and multi-parallel IGBT (Insulate-Gate Bipolar Transistor) module, there are problems of high cost, complex wiring, and many wire harnesses. Especially for a module in which an NTC (Negative Temperature Coefficient) thermistor is connected to the E pole (emitter) of the IGBT lower tube, there is a lack of an accurate sampling and transmission scheme for realizing all-temperature sampling.

[0003] In the prior art, a multi-channel analog switch selector and a phase-shifted pulse are used to realize time-division modulation of multi-channel signals, and temperature sampling of a multi-parallel IGBT module is achieved through a single data bus. However, an FPGA (Field Programmable Gate Array) is required for demodulation to restore the original data, and the device cost is high; and when three or more IGBTs are in parallel, the NTC sampling ends of each IGBT module have a long path to the voltage-frequency conversion circuit, and the NTC analog signal is vulnerable to conduction and radiation interference in the on-site use environment, affecting the sampling accuracy.

[0004] In the prior art, a main single board and a slave single board are also used in combination for NTC sampling transmission. The output end of the isolation optocoupler is used as the output end of the main single board. However, when the transmission line is interfered, error data is easily generated; at the same time, an additional NTC data wire harness is also added. In order to meet the high-voltage insulation requirements of the wire harness, the wire harness needs to be protected by an insulating sleeve. However, this sleeve requires manual operation of the sleeve, increasing the additional production cost; IGBT power drivers are often used in high-reliability scenarios, such as wind power and rail transit. Compared with conventional connectors, they also need to meet the requirements of anti-corrosion, anti-vibration, plugging resistance, and high-temperature resistance. Therefore, the overall cost of the connector and the wire harness is relatively high. The front-end and back-end microcontroller programs of this scheme are inconsistent. Due to the different numbers of NTC samplings of each microcontroller and the different cascaded positions, a large number of program firmware versions need to be maintained, which also increases the software maintenance and management cost.

[0005] Moreover, the methods in the prior art can only be applicable to modules with basic isolation of the IGBT built-in NTC, cannot be applicable to modules in which the NTC is connected to the E pole of the IGBT lower tube, and an additional isolated power supply is required to separately supply power to the NTC sampling part, with complex design and inconvenient use. Summary of the Invention

[0006] The purpose of the present application is to provide a temperature detection circuit and method for an IGBT module to solve the problems that the temperature detection circuit in the prior art cannot adapt to all IGBT structures and other issues in view of the deficiencies in the above-mentioned prior art.

[0007] To achieve the above objective, the technical solutions adopted in the embodiments of the present application are as follows:

[0008] In a first aspect, the embodiments of the present application provide a temperature detection circuit for an IGBT module. The temperature detection circuit includes: a drive board and a plurality of adapter boards. On the drive board, there are provided: a drive power supply and a first detection unit. On each adapter board, there is provided a second detection unit. The second detection units on the plurality of adapter boards are respectively used to connect the temperature detection terminals of a plurality of IGBT modules. The second detection units on the plurality of adapter boards are cascaded in sequence through signal harnesses. The second detection unit of the last-stage adapter board among the plurality of adapter boards is connected to the first detection unit on the drive board through a signal harness;

[0009] The first detection unit is further used to connect to a client device, and the drive power supply is used to connect to the drive terminals of the plurality of IGBT modules.

[0010] Optionally, a first connector is further provided on the drive board, and a second connector and a third connector are further provided on each adapter board;

[0011] The second detection unit on each adapter board is connected to the second connector and the third connector. The second connector of one adapter board among two adjacent adapter boards is connected to the third connector of the other adapter board through a communication line in the signal harness;

[0012] The second connector of the last adapter board is connected to the first connector on the drive board through a communication line of the signal harness, and the first connector is connected to the first detection unit.

[0013] Optionally, the first detection unit includes: a first control unit, and the receiving interface of the first control unit is connected to the first connector;

[0014] A signal isolator is further provided on the drive board. Among them, the sending interface of the first control unit is connected to the client device through the signal isolator.

[0015] Optionally, the first detection unit further includes: a power isolator, and the drive power supply is connected to the first connector through the power isolator;

[0016] The first connector is further connected to the second connector of the last adapter board through a drive line in the signal harness;

[0017] The second connector on each of the adapter boards is also connected to the third connector through a driving wire; the second connector of one of the adapter boards is also connected to the third connector on the other adapter board through the driving wire in the signal harness.

[0018] The second connector on each of the adapter boards is also connected to the power supply terminal of the second detection unit, and the driving output terminal of the second detection unit is also used to connect to the driving terminal of the IGBT module corresponding to each adapter board.

[0019] Optionally, the first detection unit further includes: a first configuration unit, and the first configuration unit is connected to the input / output interface of the first control unit.

[0020] Optionally, the second detection unit includes: a second control unit and a sampling unit. The input end of the sampling unit is used to connect to the temperature detection end of an IGBT module, the output end of the sampling unit is connected to the analog-to-digital conversion interface of the second control unit, the receiving interface of the second control unit is connected to the second connector, and the sending interface of the second control unit is connected to the third connector.

[0021] Optionally, the second detection unit further includes: a power supply unit; the input end of the power supply unit is connected to the second connector, the first output end of the power supply unit is connected to the power supply interface of the second control unit, and the second output end of the power supply unit is the driving output end of the second detection unit, which is used to connect to the driving terminal of the IGBT module corresponding to each adapter board.

[0022] Optionally, the second detection unit further includes: a second configuration unit, and the second configuration unit is connected to the input / output interface of the second control unit.

[0023] In a second aspect, an embodiment of the present application provides a temperature detection method, which is applied to the temperature detection circuit according to any one of the first aspects; the method includes:

[0024] The second detection unit on any one of the adapter boards in the temperature detection circuit acquires the temperature sampling data of the IGBT module corresponding to each adapter board.

[0025] If the second detection unit on any one of the adapter boards also receives the temperature data packet transmitted by the second detection unit on the previous-level adapter board, then the second detection unit on any one of the adapter boards parses the temperature data packet to obtain at least one temperature data frame.

[0026] The second detection unit on any one of the adapter boards transmits the temperature sampling data and the at least one temperature data frame to the second detection unit on the next-level adapter board or the first detection unit on the driving board in the temperature detection circuit.

[0027] Optionally, the second detection unit on any one of the adapter boards transmits the temperature sampling data and the at least one temperature data frame to the second detection unit on the next-level adapter board or the first detection unit on the drive board in the temperature detection circuit, including:

[0028] After the second detection unit on any one of the adapter boards updates the identification information corresponding to the at least one temperature data frame, it packs the updated at least one temperature data frame and the temperature sampling data and transmits them to the second detection unit on the next-level adapter board or the first detection unit on the drive board in the temperature detection circuit.

[0029] Compared with the prior art, the present application has the following beneficial effects:

[0030] The present application provides a temperature detection circuit and method for an IGBT module. The temperature detection circuit includes: a drive board and a plurality of adapter boards. The drive board is provided with: a drive power supply and a first detection unit. Each adapter board is provided with a second detection unit. The second detection units on the plurality of adapter boards are respectively used to connect the temperature detection ends of a plurality of IGBT modules. The second detection units on the plurality of adapter boards are cascaded in sequence through signal harnesses. The second detection unit of the last-level adapter board among the plurality of adapter boards is connected to the first detection unit on the drive board through a signal harness; the first detection unit is further used to connect to a client device, and the drive power supply is used to connect to the drive ends of a plurality of IGBT modules. Thus, it is applicable to various IGBT module temperature detection structures, facilitating the detection of the IGBT module temperature, improving the temperature detection efficiency. Each second detection unit is exactly the same, reducing the maintenance cost of the detection unit. There is no need to add an isolation power supply, reducing the connection harnesses and the circuit cost. Description of the Drawings

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0032] Figure 1 It is a schematic diagram of a temperature detection circuit for an IGBT module provided by an embodiment of the present application;

[0033] Figure 2 It is a schematic diagram of another temperature detection circuit for an IGBT module provided by an embodiment of the present application;

[0034] Figure 3 It is a schematic diagram of a temperature detection method provided by an embodiment of the present application;

[0035] Figure 4 This is a schematic diagram of the configuration unit provided by the embodiment of the present application.

[0036] Icons: 1 - drive board, 2 - adapter board, 11 - drive power supply, 12 - first detection unit, 21 - second detection unit, 13 - first connector, 22 - second connector, 23 - third connector, 121 - first control unit, 14 - signal isolator, 15 - power isolator, 122 - first configuration unit, 211 - second control unit, 212 - sampling unit, 213 - power supply unit, 214 - second configuration unit. Detailed implementation manners

[0037] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Apparently, the described embodiments are some, but not all, of the embodiments of the present application. Usually, the components of the embodiments of the present application described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0038] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but merely represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the scope of protection of the present application.

[0039] It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0040] In addition, terms such as "first" and "second" are used for descriptive purposes only and cannot be construed as indicating or implying relative importance.

[0041] It should be noted that, without conflict, the features in the embodiments of the present application can be combined with each other.

[0042] The following explains a temperature detection circuit of an IGBT module provided by the embodiment of the present application through specific embodiments. Figure 1 This is a schematic diagram of a temperature detection circuit of an IGBT module provided by the embodiment of the present application.

[0043] As Figure 1 shown, the temperature detection circuit includes: a drive board 1 and a plurality of adapter boards 2.

[0044] The driving board 1 is provided with a driving power supply 11 and a first detection unit 12. Each adapter board 2 is provided with a second detection unit 21. The second detection units 21 on multiple adapter boards 2 are respectively used to connect the temperature detection ends of multiple IGBT modules. The second detection units 21 on multiple adapter boards 2 are cascaded in sequence through signal wire harnesses. The second detection unit 21 of the last-stage adapter board 2 among multiple adapter boards 2 is connected to the first detection unit 12 on the driving board 1 through a signal wire harness.

[0045] The first detection unit 12 is also used to connect to a client device, and the driving power supply 11 is used to connect to the driving ends of multiple IGBT modules.

[0046] Among them, in order to improve the utilization rate of components and reduce costs, the driving board 1 and multiple adapter boards 2 adopt the existing driving boards and adapter boards corresponding to multiple IGBT modules, and add as few new components as possible.

[0047] The second detection unit 21 on each adapter board 2 is used to detect the temperature of the IGBT module corresponding to this adapter board 2. Exemplarily, the second detection unit 21 is connected to the NTC of the IGBT module. The connection method in this embodiment can connect the NTC in any form, and is applicable to both IGBT modules with basic isolation from the NTC and IGBT modules with the NTC connected to the E pole of the IGBT lower tube, improving the applicability of the temperature detection circuit.

[0048] Each second detection unit 21 detects the temperature sampling data of the IGBT module and transmits the temperature sampling data to the second detection unit 21 in the next-stage adapter board 2. If the current second detection unit 21 also receives the temperature data transmitted by the second detection unit 21 in the previous-stage adapter board 2, it will pack and transmit this temperature data together with the current temperature sampling data to the second detection unit 21 in the next-stage adapter board 2. The second detection unit 21 in the last-stage adapter board 2 packs and transmits this temperature data together with the current temperature sampling data to the first detection unit 12 in the driving board 1.

[0049] The first detection unit 12 in the driving board 1 uploads the received temperature data to the client device, so that the client device can determine the actual temperature of multiple IGBT modules based on this temperature data and perform further control processing.

[0050] Among them, the data transmission between detection units is carried out by signal wire harnesses. The signal wire harness is also used to transmit the electric energy of the driving power supply 11 to the first detection unit 12 and multiple second detection units 21. The communication data line and the driving electric energy signal share the wire harness, saving the cost of new wire harnesses, insulating sleeves and high-voltage insulated isolation power supplies.

[0051] Such as Figure 1As shown, multiple adapter boards 2 are sorted from right to left. The rightmost adapter board 2 is the first stage, and the leftmost adapter board 2 is the last stage. The transmission of temperature data is also sequentially transmitted from right to left to the first detection unit 12.

[0052] Thus, it is applicable to various IGBT module temperature detection structures, facilitating the detection of IGBT module temperature, improving the temperature detection efficiency. Each second detection unit is exactly the same, reducing the maintenance cost of the detection unit. There is no need to add a new isolation power supply, reducing the connection wire harness and the circuit cost.

[0053] In summary, in this embodiment, the temperature detection circuit includes: a drive board and multiple adapter boards. On the drive board, there are provided: a drive power supply and a first detection unit. On each adapter board, there is a second detection unit. The second detection units on multiple adapter boards are respectively used to connect the temperature detection ends of multiple IGBT modules. The second detection units on multiple adapter boards are cascaded in sequence through signal wire harnesses. The second detection unit of the last-stage adapter board among multiple adapter boards is connected to the first detection unit on the drive board through a signal wire harness; the first detection unit is further used to connect to a client device, and the drive power supply is used to connect to the drive ends of multiple IGBT modules. Thus, it is applicable to various IGBT module temperature detection structures, facilitating the detection of IGBT module temperature, improving the temperature detection efficiency. Each second detection unit is exactly the same, reducing the maintenance cost of the detection unit. There is no need to add a new isolation power supply, reducing the connection wire harness and the circuit cost.

[0054] Based on the above Figure 1 corresponding embodiment, the embodiment of the present application further provides another temperature detection circuit for an IGBT module. Figure 2 It is a schematic diagram of another temperature detection circuit for an IGBT module provided by the embodiment of the present application.

[0055] As Figure 2 shown, a first connector 13 is further provided on the drive board 1, and a second connector 22 and a third connector 23 are further provided on each adapter board 2.

[0056] The second detection unit 21 on each adapter board 2 is connected to the second connector 22 and the third connector 23. The second connector 22 of one adapter board 2 among two adjacent adapter boards 2 is connected to the third connector 23 of the other adapter board 2 through a communication line in the signal wire harness.

[0057] The second connector 22 of the last adapter board 2 is connected to the first connector 13 on the drive board 1 through a communication line of the signal wire harness, and the first connector 13 is connected to the first detection unit 12.

[0058] It should be noted that the third connector 23 on the last adapter board 2 is not connected to any port.

[0059] In summary, in this embodiment, a first connector is further provided on the drive board, and a second connector and a third connector are further provided on each adapter board; the second detection unit on each adapter board is connected to the second connector and the third connector, and the second connector on one of the adjacent two adapter boards is connected to the third connector on the other adapter board through the communication line in the signal harness; the second connector on the last adapter board is connected to the first connector on the drive board through the communication line of the signal harness, and the first connector is connected to the first detection unit. Thus, by setting the connectors, the connection of the signal harness is more standardized, which is convenient for accurately transmitting temperature data.

[0060] Continuing to refer to Figure 2 , in another embodiment of the present application, the first detection unit 12 includes: a first control unit 121, and the receiving interface of the first control unit 121 is connected to the first connector 13.

[0061] A signal isolator 14 is further provided on the drive board 1, wherein the sending interface of the first control unit 121 is connected to the client device through the signal isolator 14.

[0062] The first control unit 121 is configured to receive the temperature data sent by the second detection unit 21 in the last-stage adapter board 2, and transmit the temperature data to the client device through the signal isolator 14.

[0063] Exemplarily, the first control unit 121 is an MCU (Micro Controller Unit, micro control unit). The signal isolator 14 is a signal isolation device such as a capacitive coupling or magnetic coupling. It performs high-voltage insulation isolation on the primary and secondary sides while transmitting signals to ensure human-machine safety.

[0064] In summary, in this embodiment, the first detection unit includes: a first control unit, and the receiving interface of the first control unit is connected to the first connector; a signal isolator is further provided on the drive board, wherein the sending interface of the first control unit is connected to the client device through the signal isolator. Thus, the isolated transmission of temperature data is realized.

[0065] Continuing to refer to Figure 2 , in another embodiment of the present application, the first detection unit 12 further includes: a power isolator 15, and the drive power supply 11 is connected to the first connector 13 through the power isolator 15.

[0066] The first connector 13 is further connected to the second connector 22 on the last adapter board 2 through the drive line in the signal harness.

[0067] The second connector 22 on each adapter board 2 is also connected to the third connector 23 through a drive line; the second connector 22 of one adapter board 2 is also connected to the third connector 23 on another adapter board 2 through a drive line in the signal harness.

[0068] The second connector 22 on each adapter board 2 is also connected to the power supply terminal of the second detection unit 21, and the drive output terminal of the second detection unit 21 is also used to connect to the drive terminal of the IGBT module corresponding to each adapter board 2.

[0069] Exemplarily, the drive power supply 11 is a drive secondary power supply, where the primary side is the low-voltage side and the secondary side is the high-voltage side. The drive power supply 11 supplies power to the first detection unit 12 and multiple second detection units 21 through a power isolator 15, and the drive power supply 11 is also used to drive the IGBT module. By using the drive secondary power supply of the IGBT module and combining the signal harness and the drive line into one, the circuit and harness costs are reduced.

[0070] In summary, in this embodiment, the first detection unit further includes: a power isolator, the drive power supply is connected to the first connector through the power isolator; the first connector is also connected to the second connector on the last adapter board through a drive line in the signal harness; the second connector on each adapter board is also connected to the third connector through a drive line; the second connector of one adapter board is also connected to the third connector on another adapter board through a drive line in the signal harness; the second connector on each adapter board is also connected to the power supply terminal of the second detection unit, and the drive output terminal of the second detection unit is also used to connect to the drive terminal of the IGBT module corresponding to each adapter board. Thus, the circuit cost is reduced.

[0071] Continue to refer to Figure 2 , in another embodiment of the present application, the first detection unit 12 further includes: a first configuration unit 122, and the first configuration unit 122 is connected to the input / output interface of the first control unit 121.

[0072] Exemplarily, the first configuration unit 122 can be a low-level unit, and the low-level unit is a grounded resistor for transmitting a low-level signal to the first control unit 121 to indicate that the first control unit 121 does not need to perform temperature sampling. The first configuration unit 122 can also be a high-level unit, and the high-level unit is a pull-up resistor. One end of the pull-up resistor is connected to the input / output interface of the first control unit 121, and the other end is connected to the drive power supply for transmitting a high-level signal to the first control unit 121. The high-level signal indicates that the first control unit 121 needs to perform temperature sampling. That is, whether the first detection unit 12 performs temperature sampling is determined by the first configuration unit 122. If the first control unit 121 needs to perform temperature sampling, it is connected to the corresponding IGBT module in the same connection manner as the second detection unit 21.

[0073] Continuing to refer to Figure 2 , in another embodiment of the present application, the second detection unit 21 includes: a second control unit 211 and a sampling unit 212.

[0074] The input end of the sampling unit 212 is used to connect to the temperature detection end of an IGBT module, the output end of the sampling unit 212 is connected to the analog-to-digital conversion interface of the second control unit 211, the receiving interface of the second control unit 211 is connected to the second connector 22, and the sending interface of the second control unit 211 is connected to the third connector 23.

[0075] The sampling unit 212 collects the voltage signal of the temperature detection end (NTC) of the IGBT module, and the sampling unit 212 transmits the collected voltage signal to the analog-to-digital conversion interface of the second control unit 211, so that the second control unit 211 obtains the collected temperature data, and the second control unit 211 then sends it through the third connector 23.

[0076] Exemplarily, the second control unit 211 is an MCU, and the sampling unit 212 is an NTC sampling circuit. Thus, only the second control unit 211 and the sampling unit 212 need to be newly set, without setting too many components, reducing the circuit cost.

[0077] In summary, in this embodiment, the second detection unit includes: a second control unit and a sampling unit. The input end of the sampling unit is used to connect to the temperature detection end of an IGBT module, the output end of the sampling unit is connected to the analog-to-digital conversion interface of the second control unit, the receiving interface of the second control unit is connected to the second connector, and the sending interface of the second control unit is connected to the third connector. Thus, the circuit cost is reduced.

[0078] Continuing to refer to Figure 2 , in another embodiment of the present application, the second detection unit 21 further includes: a power supply unit 213.

[0079] The input end of the power supply unit 213 is connected to the second connector 22, the first output end of the power supply unit 213 is connected to the power supply interface of the second control unit 211, and the second output end of the power supply unit 213 is the drive output end of the second detection unit 21, which is used to connect to the drive end of the IGBT module corresponding to each adapter board 2.

[0080] Among them, the power supply unit 213 is the existing power supply on the adapter board 2, which is used to provide drive electrical signals to the IGBT module, reducing the circuit cost. Based on the existing power supply, the power supply unit 213 obtains electrical energy from the second connector 22, supplies power to the second control unit 211, and supplies power to the adjacent adapter board 2 through the second control unit 211, the third connector 23, and the signal wire harness, and transmits in this way, so as to realize power supply to all adapter boards 2.

[0081] In summary, in this embodiment, the second detection unit further includes: a power supply unit; the input end of the power supply unit is connected to the second connector, the first output end of the power supply unit is connected to the power interface of the second control unit, and the second output end of the power supply unit is the drive output end of the second detection unit, which is used to connect the drive ends of the IGBT modules corresponding to each adapter board. Thus, the circuit cost is reduced.

[0082] Continuing to refer to Figure 2 , in another embodiment of the present application, the second detection unit 21 further includes: a second configuration unit 214, and the second configuration unit 214 is connected to the input / output interface of the second control unit 211.

[0083] Exemplarily, the second configuration unit 214 is a high-level unit, and the high-level unit is a pull-up resistor. One end of the pull-up resistor is connected to the input / output interface of the second control unit 211, and the other end is connected to the power supply unit 213, which is used to transmit a high-level signal to the second control unit 211, and the high-level signal is used to indicate that the second control unit 211 needs to perform temperature sampling.

[0084] In summary, in this embodiment, the second detection unit further includes: a second configuration unit, and the second configuration unit is connected to the input / output interface of the second control unit. Thus, the circuit cost is reduced.

[0085] The following explains a temperature detection method provided by the embodiments of the present application through specific embodiments. Figure 3 It is a schematic diagram of a temperature detection method provided by the embodiments of the present application.

[0086] As Figure 3 shown, it is applied to the temperature detection circuit in any of the above embodiments; the method includes:

[0087] S101. The second detection unit on any adapter board in the temperature detection circuit acquires the temperature sampling data of the IGBT module corresponding to each adapter board.

[0088] The second detection unit performs analog-to-digital conversion on the analog voltage signal at the temperature detection end of the detected IGBT module to obtain the temperature sampling data of the IGBT module.

[0089] S102. If the second detection unit on any adapter board also receives the temperature data packet transmitted by the second detection unit on the previous-level adapter board, the second detection unit on any adapter board parses the temperature data packet to obtain at least one temperature data frame.

[0090] As can be seen from the above embodiments, multiple adapter boards are cascaded from right to left. Therefore, the first adapter board can only send the temperature sampling data collected by itself to the second detection unit on the next-level adapter board, and does not receive the temperature data packet from the previous-level adapter board. However, in addition to the temperature sampling data collected, other adapter boards can also receive the temperature data packets transmitted by the second detection unit of the previous-level adapter board.

[0091] In order to accurately transmit the temperature data, it is necessary to parse the temperature data packet to obtain at least one temperature data frame, so as to facilitate subsequent sorting processing of the current temperature sampling data and temperature data frames.

[0092] S103. The second detection unit on any adapter board transmits the temperature sampling data and at least one temperature data frame to the second detection unit on the next-level adapter board or the first detection unit on the drive board in the temperature detection circuit.

[0093] In order to accurately transmit the temperature data, the temperature sampling data and at least one temperature data frame are sorted according to the cascading order of the collected adapter boards. The sorted temperature sampling data and at least one temperature data frame are then transmitted continuously.

[0094] If the current adapter board is not the last-level adapter board, the sorted temperature sampling data and at least one temperature data frame are transmitted to the second detection unit on the next level. If the current adapter board is the last-level adapter board, the sorted temperature sampling data and at least one temperature data frame are transmitted to the first detection unit.

[0095] Thus, it is applicable to a variety of IGBT module temperature detection structures, facilitating accurate detection of the IGBT module temperature, improving the temperature detection efficiency. Each second detection unit has exactly the same software and hardware parts, reducing the maintenance cost of the detection unit, eliminating the need for new isolated power supplies, reducing the connection wire harness, and lowering the circuit cost.

[0096] In summary, in this embodiment, the second detection unit on any adapter board in the temperature detection circuit obtains the temperature sampling data of the IGBT module corresponding to each adapter board; if the second detection unit on any adapter board also receives the temperature data packet transmitted by the second detection unit of the previous-level adapter board, the second detection unit on any adapter board parses the temperature data packet to obtain at least one temperature data frame; the second detection unit on any adapter board transmits the temperature sampling data and at least one temperature data frame to the second detection unit on the next-level adapter board or the first detection unit on the drive board in the temperature detection circuit. Thus, it is applicable to a variety of IGBT module temperature detection structures, facilitating accurate and comprehensive detection of the temperatures of each IGBT module, improving the temperature detection efficiency, each second detection unit being exactly the same, reducing the maintenance cost of the detection unit, eliminating the need for new isolated power supplies, reducing the connection wire harness, and lowering the circuit cost.

[0097] Based on the above Figure 3 On the basis of the corresponding embodiment, in another embodiment of the present application, the second detection unit on any adapter board transmits the temperature sampling data and at least one temperature data frame to the second detection unit on the next-level adapter board or the first detection unit on the drive board in the temperature detection circuit, including:

[0098] After the second detection unit on any adapter board updates the identification information corresponding to at least one temperature data frame, it packs the updated at least one temperature data frame and the temperature sampling data and transmits them to the second detection unit on the next-level adapter board or the first detection unit on the drive board in the temperature detection circuit.

[0099] Exemplarily, each frame of temperature data includes: a frame header, identification information, temperature data, and a check byte. The frame header is used to determine the starting position of the data frame. The identification information is used to represent the identity information of the IGBT module detected by the second detection unit. The temperature data is the temperature of the IGBT module detected by the second detection unit. The check byte is used to check for error codes during transmission. By filtering abnormal data frames through a transmission protocol that includes a fixed frame header and a check byte, false alarms are not easily generated and the reliability is strong.

[0100] When the first adapter board collects temperature sampling data, it adds the temperature sampling data to the temperature data frame and sets the identification information of the temperature sampling data collected by the first adapter board to 1.

[0101] When the second adapter board collects temperature sampling data, it adds the temperature sampling data to the received temperature data frame, sets the identification information of the temperature sampling data collected by the second adapter board to 1, and modifies the identification information of the temperature sampling data collected by the first adapter board to 2. It should be noted that each time the identification information is modified, the check byte corresponding to the identification information is synchronously modified.

[0102] When the third adapter board collects temperature sampling data, it adds the temperature sampling data to the received temperature data frame, sets the identification information of the temperature sampling data collected by the third adapter board to 1, and modifies the identification information of the temperature sampling data collected by the second adapter board to 2 and the identification information of the temperature sampling data collected by the first adapter board to 3. It should be noted that each time the identification information is modified, the check byte corresponding to the identification information is synchronously modified.

[0103] When the fourth adapter board collects temperature sampling data, add the temperature sampling data to the received temperature data frame, set the identification information of the temperature sampling data collected by the fourth adapter board to 1, and modify the identification information of the temperature sampling data collected by the third adapter board to 3, modify the identification information of the temperature sampling data collected by the second adapter board to 2, and modify the identification information of the temperature sampling data collected by the first adapter board to 1. It should be noted that each time the identification information is modified, the check byte corresponding to the identification information is synchronously modified.

[0104] And so on. Each time the identification information is updated, set the identification information of the temperature sampling data corresponding to the current adapter board to 1, and increment the identification information of the remaining data frames by 1. Thus, the data frames in the temperature data finally received by the first detection unit are arranged in the order of the adapter boards from left to right, which is convenient to determine the IGBT module corresponding to the temperature data according to the identification information of the data frames and the actual order of the physical wiring.

[0105] Exemplarily, when transmitting the temperature data frame, transmit one temperature data frame at intervals of a preset time, and send the temperature data frames one by one.

[0106] In summary, in this embodiment, after the second detection unit on any adapter board updates the identification information corresponding to at least one temperature data frame, the updated at least one temperature data frame and the temperature sampling data are packed and transmitted to the second detection unit on the next-level adapter board or the first detection unit on the drive board in the temperature detection circuit. Thus, it is convenient to determine the IGBT module corresponding to the temperature data according to the identification information of the data frames.

[0107] Furthermore, when the adapter board performs temperature acquisition and data transmission, in essence, the second control unit in the adapter board performs temperature acquisition and data transmission.

[0108] Furthermore, Figure 4 is a schematic diagram of the configuration unit provided by the embodiment of the present application. As Figure 4 shown, the configuration unit can be configured as a high-level unit or a low-level unit.

[0109] It should be noted that each component and the connection method between components in the present application are prior arts and are not described in detail, which will not cause unclear situations.

[0110] The above are only the preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application. It should be noted that similar reference numerals and letters indicate similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. The above are only the preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A temperature detection circuit for an IGBT module, characterized in that: The temperature detection circuit comprises: a driving board and a plurality of adapter boards, wherein the driving board is provided with: a driving power supply and a first detection unit, each adapter board is provided with a second detection unit, the second detection units on the plurality of adapter boards are respectively used to connect to the temperature detection ends of a plurality of IGBT modules, the second detection units on the plurality of adapter boards are sequentially cascaded through a signal harness, and the second detection unit of the last-stage adapter board among the plurality of adapter boards is connected to the first detection unit on the driving board through a signal harness; The first detection unit is also used to connect to a client device, and the driving power supply is used to connect to the driving ends of the multiple IGBT modules; The driving board is also provided with a first connector, and each adapter board is also provided with a second connector and a third connector; The second detection unit on each adapter board is connected to the second connector and the third connector, and the second connector of one adapter board of two adjacent adapter boards is connected to the third connector on the other adapter board through a communication line in a signal harness; The second connector on the last adapter board is connected to the first connector on the driver board through the communication line of the signal harness, and the first connector is connected to the first detection unit; The first detection unit includes: a power isolator and a first control unit, the driving power supply is connected to the first connector through the power isolator; the receiving interface of the first control unit is connected to the first connector; The first connector is also connected to the second connector on the last adapter board via a driving line in the signal harness; The second connector on each adapter board is also connected to the third connector via a driving line; the second connector on one adapter board is also connected to the third connector on another adapter board via a driving line in the signal harness; The second connector on each adapter board is also connected to the power supply end of the second detection unit, and the driving output end of the second detection unit is also used to connect to the driving end of the IGBT module corresponding to each adapter board; The second detection unit includes: a second control unit and a power supply unit, the receiving interface of the second control unit is connected to the second connector, and the sending interface of the second control unit is connected to the third connector; the input end of the power supply unit is connected to the second connector, the first output end of the power supply unit is connected to the power interface of the second control unit, and the second output end of the power supply unit is the driving output end of the second detection unit, which is used to connect the driving end of the IGBT module corresponding to each adapter board.

2. The temperature detection circuit according to claim 1, characterized in that: The driving board is also provided with: a signal isolator, wherein the sending interface of the first control unit is connected to the client device through the signal isolator.

3. The temperature detection circuit according to claim 2, characterized in that: The first detection unit further includes: a first configuration unit, and the first configuration unit is connected to an input and output interface of the first control unit.

4. The temperature detection circuit according to claim 1, characterized in that: The second detection unit includes: a sampling unit, the input end of the sampling unit is used to connect to the temperature detection end of an IGBT module, and the output end of the sampling unit is connected to the analog-to-digital conversion interface of the second control unit.

5. The temperature detection circuit according to claim 4, characterized in that: The second detection unit further includes: a second configuration unit, and the second configuration unit is connected to the input and output interface of the second control unit.

6. A temperature detection method, characterized in that: Applicable to the temperature detection circuit described in any one of claims 1 to 5 above; the method comprises: The second detection unit on any adapter board in the temperature detection circuit obtains temperature sampling data of the IGBT module corresponding to each adapter board; If the second detection unit on any of the adapter boards also receives a temperature data packet transmitted by the second detection unit of the previous adapter board, the second detection unit on any of the adapter boards parses the temperature data packet to obtain at least one temperature data frame; The second detection unit on any adapter board transmits the temperature sampling data and the at least one temperature data frame to the second detection unit on the next-level adapter board or the first detection unit on the driving board in the temperature detection circuit.

7. The method according to claim 6, characterized in that The second detection unit on any adapter board transmits the temperature sampling data and the at least one temperature data frame to the second detection unit on the next-level adapter board or the first detection unit on the driver board in the temperature detection circuit, including: After the second detection unit on any adapter board updates the identification information corresponding to the at least one temperature data frame, the updated at least one temperature data frame and the temperature sampling data are packaged and transmitted to the second detection unit on the next-level adapter board or the first detection unit on the driver board in the temperature detection circuit.

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