Method and system for synchronously heating and separating upper module and lower module of thermal shaping optical module mold

Abstract

The invention relates to the field of optical communication technology, and discloses a method and a system for synchronously heating and separating an upper module and a lower module of a thermal shaping optical module mould, which comprises the following steps of: firstly, acquiring material characteristic data of the optical module mould, analyzing a heating application scene, configuring heating power parameters of the upper module and the lower module, and constructing a synchronous heating simulation environment; analyzing temperature change data in a simulation environment, calculating a temperature rise rate parameter and a temperature balance degree so as to explore a synchronous temperature rise effect under different initial temperature differences and inquire a thermal stress change condition, then adjusting a separation guiding device according to thermal stress, planning an operation process of synchronous temperature rise and separation, and finally constructing a synchronous control system so as to realize synchronous temperature rise and separation. And monitoring a control state and analyzing execution data so as to formulate a mold maintenance scheme. The synchronous control quality of the thermal shaping optical module mold can be improved.

Description

Technical Field

[0001] The invention relates to a method and system for synchronously heating and separating upper and lower modules of a heat-shaping optical module mould, and belongs to the field of optical communication technology. Background Art

[0002] At a time when the optical communication industry is booming, optical modules are core components in optical communication systems, and the precision of their manufacturing process is directly related to the performance and reliability of the entire communication system. Thermal shaping optical module molds play a pivotal role in the production process of optical modules, especially in ensuring the precise molding and fit of precision components inside optical modules.

[0003] At present, the traditional operation method of thermal shaping optical module molds still has defects. On the one hand, during the heating process, the upper and lower modules often adopt an asynchronous heating method. This method is very likely to cause uneven thermal stress of the mold due to the temperature difference between the upper and lower modules, which in turn leads to internal structural stress concentration, warping and deformation of the molded optical module. Problems such as serious impact on the optical and electrical performance of the optical module cause the product failure rate to rise sharply in subsequent communication tests; on the other hand, after the mold processing is completed, the separation operation of the upper and lower modules lacks precise synchronous control, which easily causes mechanical pulling during demolding, causing scratches and damage to the precise surface of the molded optical module, thereby reducing the product yield. Therefore, a method for synchronous heating and separation of the upper and lower modules of a thermal shaping optical module mold is needed to improve the synchronous control quality of the thermal shaping optical module mold. Summary of the invention

[0004] The present invention provides a method and system for synchronously heating and separating upper and lower modules of a heat-shaping optical module mold, the main purpose of which is to improve the synchronous control quality of the heat-shaping optical module mold.

[0005] To achieve the above purpose, the present invention provides a method for synchronously heating and separating the upper and lower modules of a heat-shaping optical module mold, comprising: Obtain material property data corresponding to the optical module mold to be processed, analyze the heating application scenario corresponding to the optical module mold to be processed based on the material property data, configure heating power parameters of the upper and lower modules corresponding to the optical module mold to be processed according to the heating application scenario, and construct a synchronous heating simulation environment corresponding to the optical module mold to be processed based on the heating power parameters; Analyze the temperature change data corresponding to the upper and lower modules in the synchronous temperature rise simulation environment, query the temperature rise rate parameters in the temperature change data, and calculate the temperature balance of the upper and lower modules during the temperature rise process based on the temperature rise rate parameters; Based on the temperature balance, analyzing the synchronous heating effect of the optical module mold to be processed under different initial temperature difference conditions, and based on the synchronous heating effect, querying the thermal stress change of the optical module mold to be processed during the test; Based on the change of the thermal stress, the separation guide device corresponding to the upper and lower modules is adjusted, based on the adjusted separation guide device, the interference factors of the upper and lower modules in the synchronous heating and separation process are queried, and based on the interference factors, the operation process corresponding to the synchronous heating and separation of the upper and lower modules is planned; Based on the operation process, a synchronous control system corresponding to the heating and separation of the optical module mold to be processed is constructed; based on the synchronous control system, the synchronous control state corresponding to the optical module mold to be processed is monitored, and the control execution data under the synchronous control state is analyzed; based on the control execution data, a mold maintenance plan corresponding to the heating and separation of the optical module mold to be processed is formulated.

[0006] Optionally, analyzing the heating application scenario corresponding to the optical module mold to be processed based on the material characteristic data includes: Performing hierarchical analysis on the material characteristic data to obtain a hierarchical data group; Identify sensitive attribute elements corresponding to each layer of data in the hierarchical data group; Based on the sensitive attribute elements, calculating the temperature adaptability value of the optical module mold to be processed under different heating methods; Based on the temperature adaptation value, analyzing the internal heat transfer curve corresponding to the optical module mold to be processed; extracting key temperature nodes in the internal heat transfer curve; Based on the key temperature nodes, a heating application scenario corresponding to the optical module mold to be processed is constructed.

[0007] Optionally, the calculating, based on the sensitive attribute element, the temperature adaptability value of the optical module mold to be processed under different heating modes includes: The temperature adaptability value of the optical module mold to be processed under different heating methods is calculated using the following formula: Among them, TA represents the temperature adaptability value of the optical module mold to be processed under different heating methods, n represents the number of elements corresponding to the sensitive attribute element, i represents the number index corresponding to the sensitive attribute element, represents the standard value of the i-th sensitive attribute element under a specific heating method, represents the measured value of the i-th sensitive attribute element during the actual heating process, represents the measurement error value of the i-th sensitive attribute element, t represents the heating time, represents the number of heating methods corresponding to different heating methods, j represents the number index corresponding to different heating methods, represents the heating power value corresponding to the jth heating mode, Indicates the temperature state ratio corresponding to the jth heating method.

[0008] Optionally, the step of constructing a synchronous heating simulation environment corresponding to the optical module mold to be processed based on the heating power parameter includes: Performing spectrum analysis on the heating power parameter to obtain power spectrum data; Performing filtering on the power spectrum data to obtain filtered spectrum data; Extracting features from the filtered spectrum data to obtain a spectrum feature vector; Based on the frequency spectrum feature vector, setting the initial temperature rise condition corresponding to the optical module mold to be processed; Based on the initial temperature rise condition, a synchronous temperature rise simulation environment corresponding to the optical module mold to be processed is constructed.

[0009] Optionally, analyzing the temperature change data corresponding to the upper and lower modules in the synchronous temperature rise simulation environment includes: Discretizing the data in the synchronous heating simulation environment to obtain a discrete temperature sequence; Performing trend fitting on the discrete temperature sequence to obtain a temperature trend curve; Identifying a temperature mutation point in the temperature trend curve; Based on the temperature mutation point, dividing the temperature stages corresponding to the upper and lower modules; The temperature variation data corresponding to the temperature stage is analyzed.

[0010] Optionally, the calculating, based on the heating rate parameter, the temperature balance of the upper and lower modules during the heating process includes: The temperature balance of the upper and lower modules during the heating process is calculated using the following formula: Wherein, TE represents the temperature balance of the upper and lower modules during the heating process, q represents the total number of temperature sampling points during the heating process, and k represents the number index corresponding to the temperature sampling points. represents the heating rate of the upper module at the kth sampling point, represents the heating rate of the lower module at the kth sampling point, c represents the number of factors corresponding to the heating rate parameter, v represents the number index corresponding to the influencing factor, Indicates the factor weight value corresponding to the vth influencing factor.

[0011] Optionally, querying the thermal stress change of the optical module mold to be processed during the test based on the synchronous heating effect includes: Quantitatively evaluating the synchronous heating effect to obtain a quantitative heating index; Based on the temperature rise quantitative index, dividing the temperature sensitive area corresponding to the optical module mold to be processed; Arrange strain gauges in the temperature sensitive area to obtain a strain gauge arrangement scheme; collecting a temperature strain data set in the strain gauge arrangement scheme; Based on the temperature strain data set, the thermal stress change of the optical module mold to be processed during the test is queried.

[0012] Optionally, the planning of the operation flow of synchronous heating and separation of the upper and lower modules based on the interference factors includes: Query the source of the interference factor; Based on the source of the factors, identifying existing operation features corresponding to the upper and lower modules; Marking the key operation identifier corresponding to the existing operation feature; Analyze the optimizable links corresponding to the key operation identifiers; Based on the optimizable links, the operational procedures for synchronous heating and separation of the upper and lower modules are planned.

[0013] Optionally, based on the operation process, a synchronous control system for corresponding heating and separation of the optical module mold to be processed is constructed, including: Determine various key parameters in the heating and separation operations of the optical module mold to be processed; Sorting out the corresponding mutual influence relationships between the key parameters; Collecting initial synchronization data corresponding to the optical module mold to be processed; Determine a synchronization setting value corresponding to the optical module mold to be processed according to the mutual influence relationship and the initial synchronization data; Based on the synchronization setting value, a synchronization control system for corresponding heating and separation of the optical module mold to be processed is constructed.

[0014] In order to solve the above problems, the present invention also provides a system for synchronously heating and separating the upper and lower modules of a heat-shaping optical module mold, the system comprising: An environment construction module is used to obtain material property data corresponding to the optical module mold to be processed, analyze the heating application scenario corresponding to the optical module mold to be processed based on the material property data, configure the heating power parameters of the upper and lower modules corresponding to the optical module mold to be processed according to the heating application scenario, and construct a synchronous heating simulation environment corresponding to the optical module mold to be processed based on the heating power parameters; A balance calculation module is used to analyze the temperature change data corresponding to the upper and lower modules in the synchronous heating simulation environment, query the heating rate parameters in the temperature change data, and calculate the temperature balance of the upper and lower modules during the heating process based on the heating rate parameters; A thermal stress calculation module, used to analyze the synchronous heating effect of the optical module mold to be processed under different initial temperature difference conditions based on the temperature balance, and query the thermal stress change of the optical module mold to be processed during the test based on the synchronous heating effect; A process planning module, used to adjust the separation guide device corresponding to the upper and lower modules based on the change of the thermal stress, query the interference factors of the upper and lower modules in the synchronous heating and separation process based on the adjusted separation guide device, and plan the operation process corresponding to the synchronous heating and separation of the upper and lower modules based on the interference factors; A plan formulation module is used to construct a synchronous control system for heating and separation of the optical module mold to be processed based on the operation process; based on the synchronous control system, monitor the synchronous control state of the optical module mold to be processed, and analyze the control execution data under the synchronous control state; based on the control execution data, formulate a mold maintenance plan for heating and separation of the optical module mold to be processed.

[0015] Compared with the problems described in the background technology, the present invention can accurately plan the processing technology by obtaining the material property data corresponding to the optical module mold to be processed, and select appropriate cutting, grinding and other methods according to the hardness, toughness and other properties of the material to improve production efficiency. Secondly, it helps to optimize the mold design. Understanding the thermal expansion coefficient of the material can avoid deformation and other problems caused by temperature changes, and improve the quality of the mold. By analyzing the temperature change data corresponding to the upper and lower modules in the synchronous heating simulation environment, the present invention can intuitively understand the dynamic process of heating of the upper and lower modules, accurately grasp the rate and trend of temperature rise, timely discover possible temperature differences, and take measures in advance to avoid thermal stress problems caused by temperature differences. Furthermore, based on the temperature balance, the present invention analyzes the synchronous heating effect of the optical module mold to be processed under different initial temperature difference conditions, and can accurately control the heating consistency of the mold under various initial temperature differences to ensure the molding of the optical module. The quality is stable, and the influence of different initial temperature differences on the heating effect can be predicted in advance, providing a basis for optimizing the heating process, reducing mold damage and product defects caused by temperature differences. Furthermore, the present invention adjusts the separation guide device corresponding to the upper and lower modules based on the thermal stress change, which can match the performance of the separation guide device with the thermal stress condition, avoid deformation or damage of the device caused by thermal stress, and help optimize the separation process of the upper and lower modules, reduce the jamming or deviation caused by uneven thermal stress, and improve the accuracy and efficiency of separation. Finally, based on the operation process, the present invention constructs a synchronous control system for the heating and separation of the optical module mold to be processed, which can ensure the accuracy and stability of the heating and separation operations, and strictly follow the planned operation process. Execution can effectively improve production efficiency, and through synchronous control of each link, reduce unnecessary waiting time and error correction time, making the entire production process smoother. Therefore, the synchronous heating and separation method and system of the upper and lower modules of the thermal shaping optical module mold provided by the embodiment of the present invention can improve the synchronous control quality of the thermal shaping optical module mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic flow chart of a method for synchronously heating and separating upper and lower modules of a heat-shaping optical module mold provided by an embodiment of the present invention; Figure 2 A schematic diagram of a module for realizing a system for synchronously heating and separating upper and lower modules of a heat shaping optical module mold provided by an embodiment of the present invention.

[0017] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings in conjunction with the embodiments. DETAILED DESCRIPTION

[0018] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0019] The embodiment of the present application provides a method for synchronously heating up and separating the upper and lower modules of a heat-shaping optical module mold. The execution subject of the method for synchronously heating up and separating the upper and lower modules of a heat-shaping optical module mold includes but is not limited to at least one of the electronic devices such as a server and a terminal that can be configured to execute the method provided in the embodiment of the present application. In other words, the method for synchronously heating up and separating the upper and lower modules of a heat-shaping optical module mold can be executed by software or hardware installed in a terminal device or a server device. The server includes but is not limited to: a single server, a server cluster, a cloud server or a cloud server cluster, etc.

[0020] Embodiment 1: Reference Figure 1 FIG. 1 is a flow chart of a method for synchronously heating and separating the upper and lower modules of a heat shaping optical module mold provided by an embodiment of the present invention. In this embodiment, the method for synchronously heating and separating the upper and lower modules of a heat shaping optical module mold includes: S1. Obtain material property data corresponding to the optical module mold to be processed, analyze the heating application scenario corresponding to the optical module mold to be processed based on the material property data, configure the heating power parameters of the upper and lower modules corresponding to the optical module mold to be processed according to the heating application scenario, and construct a synchronous heating simulation environment corresponding to the optical module mold to be processed based on the heating power parameters.

[0021] By acquiring the material property data corresponding to the optical module mold to be processed, the present invention can accurately plan the processing technology, select appropriate cutting, grinding and other methods according to the hardness, toughness and other properties of the material, and improve production efficiency. Secondly, it helps to optimize the mold design. Understanding the thermal expansion coefficient of the material can avoid deformation caused by temperature changes and improve the mold quality.

[0022] Among them, the optical module mold to be processed refers to a mold for manufacturing optical modules that is about to undergo a specific synchronous heating and separation processing process in the optical module production process. It is a mold used to perform thermal shaping operations on precision components inside the optical module. This mold includes an upper module and a lower module. Under the traditional operation mode, there are problems such as uneven thermal stress caused by asynchronous heating of the upper and lower modules and lack of precise synchronous control during separation; the material property data refers to various property information related to the material of the optical module mold to be processed, including but not limited to the thermal conductivity of the material, which determines the ability of the material to conduct heat and has a key influence on the transfer of heat between the upper and lower modules of the mold during the heating process; the thermal expansion coefficient, which is related to the change in mold size when the temperature changes, which helps to estimate the mold deformation that may be caused by heating; there are also data such as the melting point and specific heat capacity of the material. Optionally, the acquisition of material property data corresponding to the optical module mold to be processed can be achieved through experimental testing methods, such as: tensile test, thermal analysis experiment and other methods.

[0023] Furthermore, based on the material property data, the present invention analyzes the heating application scenario corresponding to the optical module mold to be processed, can accurately adapt the heating power, and determine the appropriate heating rate and power according to the thermal properties of the material, thereby avoiding mold damage or optical module molding defects caused by improper heating.

[0024] Among them, the heating application scenario refers to a comprehensive and specific mold heating implementation plan that is drawn up after comprehensive consideration of many factors such as key temperature nodes and material properties, covering heating equipment selection, heating rate setting, heating time control, and temperature monitoring methods.

[0025] As an embodiment of the present invention, the heating application scenario corresponding to the optical module mold to be processed is analyzed based on the material characteristic data, including: performing layered analysis on the material characteristic data to obtain a layered data group; identifying sensitive attribute elements corresponding to each layer of data in the layered data group; based on the sensitive attribute elements, calculating the temperature adaptation value of the optical module mold to be processed under different heating methods; based on the temperature adaptation value, analyzing the internal heat transfer curve corresponding to the optical module mold to be processed; extracting key temperature nodes in the internal heat transfer curve; based on the key temperature nodes, constructing the heating application scenario corresponding to the optical module mold to be processed.

[0026] The hierarchical data group refers to a group of hierarchical data sets formed by dividing the material characteristic data according to different characteristic categories, influence levels or data sources. For example, it can be layered according to major categories such as thermophysical properties and mechanical properties. The thermophysical properties are further divided into small categories such as thermal conductivity and specific heat capacity. Each small category contains corresponding data, which together constitute a hierarchical data group; the sensitive attribute elements refer to the characteristic elements represented by key data in the hierarchical data group that are extremely sensitive to temperature changes and heating process responses and can significantly affect mold performance, molding quality, and the effects of heating and separation operations; the temperature adaptation value is It refers to the quantitative value of the ideal temperature range and change rate that the optical module mold to be processed can withstand and adapt to under different heating methods such as conduction heating, radiation heating, convection heating, etc., by combining material properties through specific algorithms or models; the internal heat transfer curve refers to a curve drawn with time as the horizontal axis and the temperature difference or heat transfer rate between different positions inside the mold as the vertical axis; the key temperature node refers to the temperature value corresponding to the special time point in the internal heat transfer curve that corresponds to the key physical changes of the mold (such as the beginning of material phase change, thermal stress mutation, etc.), has a significant impact on the molding quality, or marks the transition of the heating stage.

[0027] Furthermore, the hierarchical analysis of the material characteristic data can be achieved through a classification method based on data features, such as: classifying and stratifying according to the physical meaning of the material characteristic data, the degree of influence on the heating process and other characteristics, so as to obtain a hierarchical data group; the identification of sensitive attribute elements corresponding to each layer of data in the hierarchical data group can be achieved through a principal component analysis method, such as: the principal component analysis method can help find the principal components that contribute more to the data variance, and the material characteristic elements corresponding to these principal components can be used as sensitive attribute elements; the calculation of the temperature adaptation value of the optical module mold to be processed under different heating methods can be achieved through the following calculation formula; the analysis of the optical module mold to be processed The corresponding internal heat transfer curve can be realized by the finite volume method, such as: dividing the optical module mold to be processed into multiple control volumes, and using the finite volume method to calculate the temperature change in each control volume, and then obtaining the heat transfer curve inside the entire mold; the extraction of the key temperature nodes in the internal heat transfer curve can be realized by a peak detection algorithm, such as: in the heat transfer curve, when the material reaches the melting point, the temperature will temporarily remain unchanged to form a platform. The temperature value corresponding to this platform can be found by the peak detection algorithm, which is the key temperature node; the construction of the heating application scenario corresponding to the optical module mold to be processed can be realized by an optimization algorithm, such as: genetic algorithm, particle swarm optimization algorithm and other algorithms.

[0028] As an embodiment of the present invention, the calculating, based on the sensitive attribute element, the temperature adaptability value of the optical module mold to be processed under different heating methods includes: The temperature adaptability value of the optical module mold to be processed under different heating methods is calculated using the following formula: Among them, TA represents the temperature adaptability value of the optical module mold to be processed under different heating methods, n represents the number of elements corresponding to the sensitive attribute element, i represents the number index corresponding to the sensitive attribute element, represents the standard value of the i-th sensitive attribute element under a specific heating method, represents the measured value of the i-th sensitive attribute element during the actual heating process, represents the measurement error value of the i-th sensitive attribute element, t represents the heating time, represents the number of heating methods corresponding to different heating methods, j represents the number index corresponding to different heating methods, represents the heating power value corresponding to the jth heating mode, Indicates the temperature state ratio corresponding to the jth heating method.

[0029] In detail, the temperature adaptability value refers to a comprehensive consideration indicator, which is used to evaluate the adaptability and tolerance of the optical module mold to be processed to temperature changes under different heating methods, as well as the influence of this adaptability on the mold performance and the optical module molding quality. It integrates the performance of various sensitive attribute elements of the mold material under different heating conditions, and is a quantitative value that can reflect the overall temperature adaptability of the mold; the standard value refers to the ideal value range or specific value determined for each sensitive attribute element under a specific heating method based on a large amount of experimental data, theoretical research, and industry experience. It represents the target value that the sensitive attribute element should have in order to achieve the best performance and optical module molding quality under this heating method; the measurement error value refers to the difference between the measurement result and the true value due to the accuracy limitation of the measuring instrument, the interference of the measuring environment (such as temperature fluctuations, electromagnetic interference, etc.), and operating factors in the actual measurement of the sensitive attribute elements. Deviation degree; The heating time refers to the length of time from the start of the heating operation on the optical module mold to reaching a specific heating stage (such as the mold reaching the preset molding temperature, completing a certain heat treatment process step, etc.) or the end of the entire heating process; The heating power value refers to the power of the heating equipment to provide heat to the optical module mold under a specific heating method. It determines the amount of energy input to the mold per unit time, and directly affects the heating rate, temperature uniformity and final temperature level of the mold. Different heating methods (such as resistance heating, induction heating, infrared heating, etc.) can have different heating power values; The temperature state ratio refers to the ratio of the time that the mold is in different temperature ranges or temperature states to the total heating time under a certain heating method. It is used to describe the relative time distribution of each temperature stage during the entire heating process of the mold, which can reflect the temperature change rhythm of the heating process and the influence weight of different temperature stages on the temperature adaptability of the mold.

[0030] According to the heating application scenario, the present invention configures the heating power parameters of the upper and lower modules of the optical module mold to be processed, which can ensure the adaptation of the heating rhythm of the upper and lower modules, accurately reduce the temperature difference, greatly reduce the risk of uneven thermal stress, avoid structural defects after the optical module is formed, and ensure the stability of optical and electrical performance.

[0031] Among them, the upper and lower modules refer to two key parts in the mold structure of the heat-shaping optical module, which cooperate with each other to realize the hot pressing molding of the optical module assembly. The upper module is usually located at the top, responsible for applying a certain pressure and coordinating heat transfer, and the lower module is located at the bottom, which plays a supporting role and jointly constructs a closed heat-shaping space with the upper module. The two are closely fitted and linked to ensure that the optical module is precisely formed under precise thermal environment and pressure conditions; the heating power parameter refers to the energy supply index set to drive the upper and lower modules to achieve the expected heating effect, specifically covering the electric power value provided to each module per unit time, which is determined based on material properties and heating application scenarios. For example, for mold materials with low thermal conductivity, a relatively high heating power can be configured to ensure that the module is heated to a suitable temperature range within a specified time, thereby accurately controlling the heat shaping process. Optionally, the heating power parameters corresponding to the upper and lower modules of the optical module mold to be processed can be configured through finite element analysis tools, such as ANSYS, COMSOL and other tools.

[0032] Furthermore, based on the heating power parameters, the present invention constructs a synchronous heating simulation environment corresponding to the optical module mold to be processed, which can predict the temperature distribution during the heating process in advance. Through simulation, the heating trajectories of the upper and lower modules at different powers can be intuitively seen, which helps to optimize the setting of the heating power parameters and avoid uneven temperature caused by improper power in actual operation.

[0033] Among them, the synchronous heating simulation environment refers to a virtual environment constructed by simulation means, which is used to simulate the synchronous heating process of the optical module mold to be processed under given heating power parameters. This environment takes into account the material properties, geometric shape, thermal conductivity characteristics, boundary conditions and other factors of the mold, and can simulate the temperature changes of various parts of the mold during the heating process in real time, as well as the transfer and distribution of temperature inside the mold.

[0034] As an embodiment of the present invention, based on the heating power parameters, constructing a synchronous heating simulation environment corresponding to the optical module mold to be processed, includes: performing spectral analysis on the heating power parameters to obtain power spectrum data; filtering the power spectrum data to obtain filtered spectrum data; performing feature extraction on the filtered spectrum data to obtain a spectrum feature vector; based on the spectrum feature vector, setting the initial heating conditions corresponding to the optical module mold to be processed; based on the initial heating conditions, constructing a synchronous heating simulation environment corresponding to the optical module mold to be processed.

[0035] The power spectrum data refers to the result obtained after spectrum analysis of the heating power parameters, which shows the distribution of the heating power at different frequencies. Specifically, the signal of the heating power changing with time is converted into a representation in the frequency domain by Fourier transform and other methods, which contains information such as each frequency component and its corresponding power amplitude; the filtered spectrum data refers to the spectrum data obtained after filtering the power spectrum data. The purpose of filtering is to remove noise or unnecessary frequency components in the power spectrum data, so that the obtained data can better reflect the key information and main features of the mold heating process; the spectrum feature vector refers to a vector composed of key features that can characterize the mold heating characteristics extracted from the filtered spectrum data. These features may include main frequency components, spectrum peak positions, spectrum bandwidths, power spectrum densities, etc.; the initial heating condition refers to the temperature state of the optical module mold to be processed at the beginning of the synchronous heating simulation environment, which is set based on the spectrum feature vector, and covers factors such as the thermal inertia of the mold. A suitable initial temperature is determined according to the mold heating characteristics reflected by the spectrum feature vector, so as to more accurately simulate the actual heating process of the mold.

[0036] Furthermore, the spectral analysis of the heating power parameters can be achieved through the fast Fourier transform method, such as: the heating power parameter signal in the time domain can be converted into power spectrum data in the frequency domain; the filtering processing of the power spectrum data can be achieved through a filtering algorithm, such as: median filtering, low-pass filtering and other algorithms; the feature extraction of the filtered spectrum data can be achieved through a feature extraction model, such as: Word2Vec, GloVe and other models; the setting of the initial heating conditions corresponding to the optical module mold to be processed can be achieved through a regression analysis model, such as: linear regression model, neural network and other models; the construction of the synchronous heating simulation environment corresponding to the optical module mold to be processed can be achieved through an environment construction tool, such as: ABAQUS, OpenFOAM and other tools.

[0037] S2. Analyze the temperature change data corresponding to the upper and lower modules in the synchronous temperature rise simulation environment, query the temperature rise rate parameters in the temperature change data, and calculate the temperature balance of the upper and lower modules during the temperature rise process based on the temperature rise rate parameters.

[0038] By analyzing the temperature change data corresponding to the upper and lower modules in the synchronous temperature rise simulation environment, the present invention can intuitively understand the dynamic process of the upper and lower module heating, accurately grasp the rate and trend of temperature rise, timely discover possible temperature differences, and take measures in advance to avoid thermal stress problems caused by temperature differences.

[0039] Among them, the temperature change data refers to detailed information covering the temperatures of the upper and lower modules in each temperature stage, including quantitative indicators such as the starting temperature, ending temperature, heating rate, temperature fluctuation amplitude, and the temperature connection changes between different stages.

[0040] As an embodiment of the present invention, the analysis of the temperature change data corresponding to the upper and lower modules in the synchronous heating simulation environment includes: discretizing the data in the synchronous heating simulation environment to obtain a discrete temperature sequence; performing trend fitting on the discrete temperature sequence to obtain a temperature trend curve; identifying the temperature mutation points in the temperature trend curve; based on the temperature mutation points, dividing the temperature stages corresponding to the upper and lower modules; and analyzing the temperature change data corresponding to the temperature stages.

[0041] Among them, the discrete temperature sequence refers to the temperature data of the upper and lower modules recorded continuously in the synchronous heating simulation environment, which are extracted according to specific time intervals or sampling rules to form a discrete distribution and time-ordered temperature value set; the temperature trend curve refers to a smooth curve that can reflect the general trend of temperature by using a fitting algorithm (such as the least squares method to fit a straight line or a polynomial curve) to the discrete temperature sequence with time as the horizontal axis; the temperature mutation point refers to the special points on the temperature trend curve where the slope suddenly changes drastically, the temperature value jumps sharply, and deviates from the normal variation range of adjacent points. These points usually mean abnormal conditions in the heating process, such as instantaneous fluctuations in heating power, sudden changes in the thermal conductivity characteristics of mold materials, etc.; the temperature stage refers to the different time periods into which the entire heating process of the upper and lower modules is divided according to the temperature mutation point. The temperature changes in each stage show relatively uniform characteristics, such as the initial slow heating stage, the stable and rapid heating stage, and the fine-tuning stage near the target temperature.

[0042] Furthermore, the discretization processing of the data in the synchronous heating simulation environment can be achieved through an equidistant sampling method, such as: setting the temperature values ​​of the upper and lower modules to be recorded every 10 seconds, so that the continuous temperature data in the simulation process is converted into a series of discrete data sequences; the trend fitting of the discrete temperature sequence can be achieved through a trend fitting algorithm, such as: linear fitting, polynomial fitting and other algorithms; the identification of the temperature mutation point in the temperature trend curve can be achieved through a sliding window method, such as: calculating the standard deviation in each window, and marking it as a mutation point when it exceeds the threshold; the division of the temperature stages corresponding to the upper and lower modules can be achieved through a clustering algorithm, such as: K-means, DBSCAN and other algorithms; the analysis of the temperature change data corresponding to the temperature stage can be achieved through data analysis tools, such as: Python, R language and other tools.

[0043] The present invention helps to accurately control the heating process of the optical module mold by querying the heating rate parameter in the temperature change data, adjusts the heating power according to the accurate heating rate, and avoids affecting the molding quality of the precision components in the mold due to too fast or too slow heating.

[0044] The heating rate parameter refers to the value of the mold temperature increase per unit time during the heating process of the optical module mold, usually expressed in the form of ℃ / min, etc., which reflects the speed of the mold temperature rise. Optionally, the query of the heating rate parameter in the temperature change data can be achieved through a parameter query tool, such as: Origin, SigmaPlot and other tools.

[0045] Furthermore, the present invention calculates the temperature balance of the upper and lower modules during the heating process based on the heating rate parameters, can monitor the temperature difference changes between the upper and lower modules in real time, accurately control the uniformity of the overall heating of the mold, avoid local overheating or overcooling, ensure the stability of the optical module mold structure, and reduce deformation caused by uneven thermal stress.

[0046] Among them, the temperature balance refers to a comprehensive indicator used to measure the corresponding uniformity of temperature distribution of the upper and lower modules during the heating process. It is calculated by considering the difference in heating rates of the upper and lower modules at multiple temperature sampling points and combining the influencing factors of the heating rate parameters and their weights. The smaller the value, the better the temperature balance of the upper and lower modules during the heating process, and vice versa.

[0047] As an embodiment of the present invention, the calculating the temperature balance of the upper and lower modules during the heating process based on the heating rate parameter includes: The temperature balance of the upper and lower modules during the heating process is calculated using the following formula: Wherein, TE represents the temperature balance of the upper and lower modules during the heating process, q represents the total number of temperature sampling points during the heating process, and k represents the number index corresponding to the temperature sampling points. represents the heating rate of the upper module at the kth sampling point, represents the heating rate of the lower module at the kth sampling point, c represents the number of factors corresponding to the heating rate parameter, v represents the number index corresponding to the influencing factor, Indicates the factor weight value corresponding to the vth influencing factor.

[0048] In detail, the temperature sampling point refers to a specific time or position point selected during the heating process for measuring and recording the temperature. These points are usually selected at a certain time interval or set at a key position of the mold so as to comprehensively and accurately reflect the temperature change during the entire heating process; the heating rate refers to the value of the temperature increase per unit time, which reflects the speed of the temperature rise of the object. For the upper and lower modules, the heating rate is the speed at which the temperature of the upper module or the lower module changes with time at a specific temperature sampling point; the influencing factors refer to those factors that will affect the heating rate of the upper and lower modules, and thus affect the temperature balance. These factors may include the material properties of the mold (such as thermal conductivity, specific heat capacity, etc.), the structural design of the mold (such as the thickness and shape of the upper and lower modules, etc.), the heating method (such as the location of the heating source, power distribution, etc.) and the surrounding environmental conditions (such as air flow, heat dissipation, etc.); the factor weight value refers to the value assigned to reflect the degree of influence of each influencing factor on the temperature balance. The larger the weight value, the more significant the influence of the influencing factor on the temperature balance, and vice versa.

[0049] S3. Based on the temperature balance, analyze the synchronous heating effect of the optical module mold to be processed under different initial temperature difference conditions, and based on the synchronous heating effect, query the thermal stress change of the optical module mold to be processed during the test.

[0050] Based on the temperature balance, the present invention analyzes the synchronous heating effect of the optical module mold to be processed under different initial temperature difference conditions, can accurately control the heating consistency of the mold under various initial temperature differences, ensure the stable molding quality of the optical module, and can predict in advance the influence of different initial temperature differences on the heating effect, provide a basis for optimizing the heating process, and reduce mold damage and product defects caused by temperature differences.

[0051] Among them, different initial temperature difference conditions refer to the temperature differences between the upper and lower modules or different parts of the optical module mold to be processed when the temperature starts to rise. These differences can be a variety of different numerical combinations, for example, the initial temperature of the upper module is 20°C, and the initial temperature of the lower module is 25°C, which is an initial temperature difference condition; or the initial temperature of the center of the mold is 30°C, and the initial temperature of the edge is 28°C, which is also a different initial temperature difference condition; the synchronous heating effect refers to the degree of synchronization and consistency of the temperature rise of various parts of the mold (such as upper and lower modules or different areas) during the heating process, including whether the temperature rise rate is similar, whether the time to reach the target temperature is basically the same, and the change of the temperature difference of each part during the heating process. Optionally, the analysis of the synchronous heating effect of the optical module mold to be processed under different initial temperature difference conditions can be achieved through multiple groups of comparative experimental methods, such as: by comparing the time for the temperature of each part to reach the same target temperature under different initial temperature difference conditions, the change curve of the temperature difference during the heating process, etc., to analyze the synchronous heating effect.

[0052] Furthermore, based on the synchronous heating effect, the present invention queries the thermal stress changes of the optical module mold to be processed during the test, and can accurately control the thermal stress distribution of the mold caused by uneven heating, timely discover potential stress concentration points, prevent mold deformation and damage, optimize the heating strategy according to the thermal stress changes, improve the service life and stability of the mold, and ensure the production quality of the optical module.

[0053] The thermal stress variation refers to the change in the size and direction of the thermal stress in each part of the optical module mold to be processed over time during the test heating stage. By converting and analyzing the temperature strain data set, the distribution of thermal stress at different times and locations can be obtained, and the stress concentration point and its change trend can be clearly identified.

[0054] As an embodiment of the present invention, based on the synchronous heating effect, querying the thermal stress change of the optical module mold to be processed during the test, including: quantitatively evaluating the synchronous heating effect to obtain a heating quantitative index; dividing the temperature sensitive area corresponding to the optical module mold to be processed based on the heating quantitative index; arranging strain gauges in the temperature sensitive area to obtain a strain gauge arrangement scheme; collecting a temperature strain data set in the strain gauge arrangement scheme; based on the temperature strain data set, querying the thermal stress change of the optical module mold to be processed during the test.

[0055] Among them, the temperature rise quantitative index refers to the digital embodiment of the synchronous heating effect, which is calculated by comprehensively considering factors such as temperature difference and heating rate difference, such as calculating the standard deviation of the heating rate of different parts, or the absolute value of the difference between the temperature of each part and the average temperature at a specific time point; the temperature sensitive area refers to the area that responds significantly to temperature changes on the optical module mold to be processed based on the temperature rise quantitative index, usually in places with uneven heating, such as places with large temperature gradients and obvious differences in heating rates, such as corners of the mold, and joints of different materials; the strain gauge layout scheme refers to the specific plan for reasonably arranging strain gauges in the temperature sensitive area, which determines the number, position, and pasting direction of strain gauges. For example, at the stress concentration point or key connection part of the temperature sensitive area, the strain gauge is pasted along the main direction of stress to ensure that the mold deformation caused by temperature change can be accurately measured; the temperature strain data set refers to the strain data set that changes with temperature collected by the strain gauge during the mold test. These data reflect the slight deformation caused by temperature changes in the temperature sensitive area, covering the strain values ​​of strain gauges at different times and positions.

[0056] Furthermore, the quantitative evaluation of the synchronous heating effect can be achieved through a quantitative evaluation tool, such as: built-in functions AVERAGE, STDEV, etc. in Excel; the division of the temperature-sensitive areas corresponding to the optical module mold to be processed can be achieved through a method based on temperature gradient, such as: measuring the temperature at different positions of the mold, calculating the temperature difference between adjacent positions, and the area with a large temperature difference is often the temperature sensitive area; the arrangement of strain gauges in the temperature sensitive area can be achieved through an equidistant arrangement method, such as: when there is a demand for the overall strain condition of the temperature sensitive area, the method of equidistant arrangement of strain gauges can be adopted; the acquisition of the temperature strain data set in the strain gauge arrangement scheme can be achieved through a multi-round acquisition method, such as: each time the temperature is raised to the same termination temperature, the strain gauge data is collected, and a more comprehensive temperature strain data set can be obtained under different initial conditions; the query of the thermal stress change of the optical module mold to be processed during the test can be achieved through a finite element analysis tool, such as: ANSYS, ABAQUS and other tools.

[0057] S4. Based on the change of thermal stress, the separation guide device corresponding to the upper and lower modules is adjusted; based on the adjusted separation guide device, the interference factors of the upper and lower modules during the synchronous heating and separation process are queried; based on the interference factors, the operation process corresponding to the synchronous heating and separation of the upper and lower modules is planned.

[0058] The present invention adjusts the separation guide devices corresponding to the upper and lower modules based on the thermal stress changes, so that the performance of the separation guide devices can match the thermal stress conditions, avoiding deformation or damage of the devices due to thermal stress, helping to optimize the separation process of the upper and lower modules, reducing the jamming or deviation caused by uneven thermal stress, and improving the accuracy and efficiency of separation.

[0059] Among them, the separation guide device refers to a key component in the optical module mold, which is usually composed of a guide column, a guide sleeve and related positioning structures. After the optical module is produced, the upper and lower modules need to be separated to take out the product. The function of the separation guide device is to provide a precise guide path for the relative movement of the upper and lower modules during the module separation process to ensure that they are separated steadily and smoothly along a predetermined trajectory. Optionally, the adjustment of the separation guide device corresponding to the upper and lower modules can be achieved through a genetic algorithm, such as: through the iterative process of the genetic algorithm, the optimal design scheme is searched to obtain a separation guide device that adapts to changes in thermal stress.

[0060] Furthermore, the present invention, based on the adjusted separation guide device, queries the interference factors of the upper and lower modules during the synchronous heating and separation process, and can detect potential problems in advance, such as collision risks or guide deviations caused by thermal expansion differences, thereby avoiding failures in actual production and reducing scrap rates.

[0061] Among them, the interference factors refer to all elements that can have a negative impact on the process and results of adjusting the upper and lower module separation guide device based on the change of thermal stress, covering temperature and humidity fluctuations and impurity mixing at the environmental level, the non-uniformity of mold material properties, size and installation errors in the manufacturing process, changes in material properties caused by thermal cycles, and external equipment vibrations, etc. Optionally, the query of the interference factors in the process of synchronous heating and separation of the upper and lower modules can be achieved through non-destructive testing equipment, such as: ultrasonic flaw detectors, X-ray detectors and other tools.

[0062] Furthermore, based on the interference factors, the present invention plans the operational procedures for the synchronous heating and separation of the upper and lower modules, which can avoid risks in advance. By considering interference factors such as temperature fluctuations and uneven material properties, more targeted measures can be formulated to avoid problems such as collisions and jams during operation, thereby reducing equipment damage and production delays.

[0063] Among them, the operating process refers to a set of detailed operating steps and specifications for the synchronous heating and separation of the upper and lower modules, which are formulated based on the optimizable links. It clarifies every action, every parameter setting and operation sequence from the beginning of heating to the final module separation.

[0064] As an embodiment of the present invention, the operation process of synchronous heating and separation of the upper and lower modules is planned based on the interference factor, including: querying the source of the factor corresponding to the interference factor; identifying the existing operation characteristics corresponding to the upper and lower modules based on the source of the factor; marking the key operation identifiers corresponding to the existing operation characteristics; analyzing the optimizable links corresponding to the key operation identifiers; and planning the operation process of synchronous heating and separation of the upper and lower modules based on the optimizable links.

[0065] Among them, the source of the factors refers to the origin of various factors that interfere with the synchronous heating and separation process of the upper and lower modules, which can cover multiple aspects, such as equipment failure due to equipment aging and improper maintenance; environmental factors may come from unstable temperature and humidity in the workshop, strong electromagnetic interference in the surrounding area; differences in material properties may be due to different batches of raw materials, lax quality control, etc.; the existing operation characteristics refer to the characteristics and manifestations presented in the current synchronous heating and separation operation of the upper and lower modules. For example, the heating rate, heating method, mechanical action characteristics during separation, contact status between modules, etc.; the key operation identifier refers to the marking of those parts of the existing operation characteristics that have a greater impact on the synchronous heating and separation process and are more critical. These identifiers can be specific operation steps, operation parameters or operation actions. For example, a key temperature control point in the heating process, a specific mechanical motion trajectory during separation, etc.; the optimizable link refers to the operation steps or process parts that can be improved and enhanced through in-depth analysis of the key operation identifiers. For example, if it is found that the heating rate is too fast and causes uneven thermal stress, then adjusting the heating rate is an optimizable link; or if it is found that there is a jam in the mechanical action during separation, optimizing the mechanical structure or adjusting the operation mode is an optimizable link.

[0066] Furthermore, the query of the source of the factor corresponding to the interference factor can be achieved through an association rule mining algorithm, such as: using the FP-Growth algorithm to mine the association between different variables in the data, find out those factors that are closely related to the interference phenomenon, and thus determine the source of the factor; the identification of the existing operation features corresponding to the upper and lower modules can be achieved through feature recognition tools, such as: Splunk, ELK Stack and other tools; the marking of the key operation identifiers corresponding to the existing operation features can be achieved through rule engine tools, such as: Drools, CLIPS and other tools; the analysis of the optimizable links corresponding to the key operation identifiers can be achieved through a particle swarm optimization algorithm, such as: continuously adjusting the position of particles through a particle swarm optimization algorithm, searching for the optimal parameter combination, and thus determining the optimizable links; the planning of the operation process corresponding to the synchronous heating and separation of the upper and lower modules can be achieved through a process planning tool, such as: Visio, VSM and other tools.

[0067] S5. Based on the operation process, a synchronous control system corresponding to the heating and separation of the optical module mold to be processed is constructed; based on the synchronous control system, the synchronous control state corresponding to the optical module mold to be processed is monitored, and the control execution data under the synchronous control state is analyzed; based on the control execution data, a mold maintenance plan corresponding to the heating and separation of the optical module mold to be processed is formulated.

[0068] Based on the operating process, the present invention constructs a synchronous control system for the corresponding heating and separation of the optical module mold to be processed, which can ensure the accuracy and stability of the heating and separation operations, and strictly execute them according to the planned operating process, which can effectively improve production efficiency. By synchronously controlling each link, unnecessary waiting time and error correction time are reduced, making the entire production process smoother.

[0069] Among them, the synchronous control system refers to a comprehensive system that integrates hardware equipment, control algorithms and software programs. It aims to accurately and coordinately control the heating and separation processes of the optical module mold to be processed based on the synchronous set values. The system monitors the actual values ​​of key parameters in real time through sensors, compares them with the synchronous set values, and then adjusts the action of the actuator according to the preset control algorithm by the controller to ensure that the heating and separation operations always remain in the best synchronous state.

[0070] As an embodiment of the present invention, based on the operation process, a synchronous control system for heating and separation of the optical module mold to be processed is constructed, including: determining various key parameters in the heating and separation operations of the optical module mold to be processed; sorting out the corresponding mutual influence relationships between the various key parameters; collecting initial synchronization data corresponding to the optical module mold to be processed; determining the synchronization setting value corresponding to the optical module mold to be processed based on the mutual influence relationship and the initial synchronization data; and constructing a synchronous control system for heating and separation of the optical module mold to be processed based on the synchronization setting value.

[0071] Among them, the key parameters refer to the variables that play a decisive role in the stability, accuracy and product quality of the whole process during the heating and separation operations of the optical module mold to be processed, such as heating power, heating rate, target temperature in the heating stage; separation speed, separation force, relative displacement between modules in the separation stage; the mutual influence relationship refers to the internal connection of interaction and mutual restriction between the key parameters, such as the size of the heating power will affect the heating rate, and the heating rate will affect the thermal stress distribution inside the mold, thereby affecting the separation force required for separation; too fast a separation speed may cause vibration of the mold, which in turn affects the temperature uniformity during the heating process; the initial The step data refers to the basic data related to the heating and separation of the optical module mold to be processed, which is collected before the construction of the synchronous control system, including the initial temperature distribution of the mold, the initial position of each component, the current operating status of the equipment, etc.; the synchronization setting value refers to the target value used to guide the synchronization of heating and separation operations based on the mutual influence relationship between various key parameters and the initial synchronization data. For example, according to the initial temperature of the mold, the expected heating rate and the optimal temperature conditions required for separation, the heating power setting values ​​at different stages of the heating process are determined; combined with the mold structure and material properties, as well as the initial position data, the optimal separation speed and separation force setting values ​​during separation are determined.

[0072] Furthermore, the determination of the key parameters in the heating and separation operations of the optical module mold to be processed can be achieved through an experimental design method, such as: using the response surface method (RSM) to conduct experiments to obtain the key parameters; the sorting out of the corresponding mutual influence relationships between the key parameters can be achieved through a structural equation model, such as: (and examples of the methods, tools or algorithms that can be implemented therein are given, and it is important to remember that the mutual influence relationships are finally obtained); the collection of the initial synchronization data corresponding to the optical module mold to be processed can be achieved through a sensor network, such as: using temperature sensors and pressure sensors for real-time data collection to obtain initial synchronization data; the determination of the synchronization set value corresponding to the optical module mold to be processed can be achieved through an optimization algorithm, such as: using a genetic algorithm (GA) to optimize parameters to obtain the synchronization set value; the construction of a synchronization control system corresponding to the heating and separation of the optical module mold to be processed can be achieved through a PID control algorithm, such as: using a PID controller to design a control strategy to obtain a synchronization control system.

[0073] The present invention is based on the synchronous control system, monitors the synchronous control state corresponding to the optical module mold to be processed, and analyzes the control execution data under the synchronous control state, so as to timely discover abnormal conditions in the control process, such as the heating rate deviating from the set value or the separation action being uncoordinated, so as to make rapid adjustments and ensure the accuracy and stability of mold processing.

[0074] Among them, the synchronous control state refers to the real-time working situation presented by the mutual cooperation and coordinated operation of various links in the process of heating up and separating the optical module mold to be processed according to the setting of the synchronous control system. It covers whether the current heating rate of the mold meets expectations, whether the temperature is stable in the set range, and whether the speed, force, displacement, etc. of the separation action are accurately matched with the heating process. For example, when the temperature rises to a specific stage, whether the separation device can be started at the predetermined time and method, and whether the dynamic changes of various parameters in the whole process are within the controllable range, all of which reflect the synchronous control state; the control execution data refers to the various sensors and execution data generated when the synchronous control system is running. The actual working data fed back by the actuator include the real-time temperature value of the mold collected by the temperature sensor, the pressure applied during the separation process measured by the pressure sensor, the module movement distance and speed recorded by the displacement sensor, etc. At the same time, it also involves the actual action response data after the actuator receives the control instruction, such as the actual power output of the heating element, the speed change of the drive motor, etc. Optionally, the monitoring of the synchronous control state corresponding to the optical module mold to be processed can be achieved through a state monitoring tool, such as: SPSS, MATLAB and other tools; the analysis of the control execution data under the synchronous control state can be achieved through a data analysis tool, such as: SAS, R language and other tools.

[0075] Furthermore, based on the control execution data, the present invention formulates a mold maintenance plan corresponding to the heating and separation of the optical module mold to be processed, which can accurately locate the abnormal parts of the mold during the heating and separation links, and carry out targeted maintenance work according to the actual wear and aging degree, etc., to avoid excessive maintenance or insufficient maintenance. This not only extends the service life of the mold and reduces the replacement frequency, but also ensures the continuity of production, thereby reducing the downtime caused by mold failure.

[0076] Among them, the mold maintenance plan refers to a comprehensive plan formulated to ensure the long-term stable and efficient operation of the optical module mold to be processed. The plan covers aspects such as daily inspection, regular maintenance, fault repair, and replacement strategies for key components of the mold. The plan formulated based on the control execution data will clarify the specific content and time nodes of maintenance according to the actual performance of the mold during the heating and separation process. For example, for heating areas where high temperature abnormalities frequently occur, more frequent temperature sensor calibration and heating element inspection are arranged; if there is a jam in the separation link, determine whether the guide device needs to be lubricated or the worn parts need to be replaced based on relevant force data. Optionally, the mold maintenance plan corresponding to the heating and separation of the optical module mold to be processed can be achieved through a plan generation tool, such as: AutoCAD, SolidWorks and other tools.

[0077] Compared with the problems described in the background technology, the present invention can accurately plan the processing technology by obtaining the material property data corresponding to the optical module mold to be processed, and select appropriate cutting, grinding and other methods according to the hardness, toughness and other properties of the material to improve production efficiency. Secondly, it helps to optimize the mold design. Understanding the thermal expansion coefficient of the material can avoid deformation and other problems caused by temperature changes, and improve the quality of the mold. By analyzing the temperature change data corresponding to the upper and lower modules in the synchronous heating simulation environment, the present invention can intuitively understand the dynamic process of heating of the upper and lower modules, accurately grasp the rate and trend of temperature rise, timely discover possible temperature differences, and take measures in advance to avoid thermal stress problems caused by temperature differences. Furthermore, based on the temperature balance, the present invention analyzes the synchronous heating effect of the optical module mold to be processed under different initial temperature difference conditions, and can accurately control the heating consistency of the mold under various initial temperature differences to ensure the molding of the optical module. The quality is stable, and the influence of different initial temperature differences on the heating effect can be predicted in advance, providing a basis for optimizing the heating process, reducing mold damage and product defects caused by temperature differences. Furthermore, the present invention adjusts the separation guide device corresponding to the upper and lower modules based on the thermal stress change, which can match the performance of the separation guide device with the thermal stress condition, avoid deformation or damage of the device caused by thermal stress, and help optimize the separation process of the upper and lower modules, reduce the jamming or deviation caused by uneven thermal stress, and improve the accuracy and efficiency of separation. Finally, based on the operation process, the present invention constructs a synchronous control system for the heating and separation of the optical module mold to be processed, which can ensure the accuracy and stability of the heating and separation operations, and strictly follow the planned operation process. Execution can effectively improve production efficiency, and through synchronous control of each link, reduce unnecessary waiting time and error correction time, making the entire production process smoother. Therefore, the synchronous heating and separation method and system of the upper and lower modules of the thermal shaping optical module mold provided by the embodiment of the present invention can improve the synchronous control quality of the thermal shaping optical module mold.

[0078] Embodiment 2: like Figure 2 The figure shows a functional module diagram of a system for synchronously heating and separating upper and lower modules of a heat shaping optical module mold according to the present invention.

[0079] The synchronous heating and separation system 200 of the upper and lower modules of the heat shaping optical module mold described in the present invention can be installed in an electronic device. According to the functions to be implemented, the synchronous heating and separation system of the upper and lower modules of the heat shaping optical module mold can include an environment construction module 201, a balance calculation module 202, a thermal stress calculation module 203, a process planning module 204 and a program formulation module 205. The module described in the present invention can also be called a unit, which refers to a series of computer program segments that can be executed by an electronic device processor and can complete fixed functions, which are stored in the memory of the electronic device.

[0080] In the embodiment of the present invention, the functions of each module / unit are as follows: The environment construction module 201 is used to obtain material property data corresponding to the optical module mold to be processed, analyze the heating application scenario corresponding to the optical module mold to be processed based on the material property data, configure the heating power parameters of the upper and lower modules corresponding to the optical module mold to be processed according to the heating application scenario, and construct a synchronous heating simulation environment corresponding to the optical module mold to be processed based on the heating power parameters; The balance calculation module 202 is used to analyze the temperature change data corresponding to the upper and lower modules in the synchronous heating simulation environment, query the heating rate parameters in the temperature change data, and calculate the temperature balance of the upper and lower modules during the heating process based on the heating rate parameters; The thermal stress calculation module 203 is used to analyze the synchronous heating effect of the optical module mold to be processed under different initial temperature difference conditions based on the temperature balance, and query the thermal stress change of the optical module mold to be processed during the test based on the synchronous heating effect; The process planning module 204 is used to adjust the separation guide device corresponding to the upper and lower modules based on the change of the thermal stress, query the interference factors of the upper and lower modules in the synchronous heating and separation process based on the adjusted separation guide device, and plan the operation process of the synchronous heating and separation of the upper and lower modules based on the interference factors; The plan formulation module 205 is used to construct a synchronous control system corresponding to the heating and separation of the optical module mold to be processed based on the operation process, monitor the synchronous control state corresponding to the optical module mold to be processed based on the synchronous control system, and analyze the control execution data under the synchronous control state, and formulate a mold maintenance plan corresponding to the heating and separation of the optical module mold to be processed based on the control execution data.

[0081] In detail, the modules in the synchronous heating and separation system 200 for the upper and lower modules of the heat shaping optical module mold in the embodiment of the present invention are used in the same manner as described above. Figure 1 The thermal shaping optical module mold upper and lower modules synchronously heated and separated by the same technical means and can produce the same technical effect, which will not be repeated here.

[0082] It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present invention.

Claims

1. A method for synchronously heating and separating the upper and lower modules of a heat-shaping optical module mold, characterized in that: The method comprises: Obtain material property data corresponding to the optical module mold to be processed, analyze the heating application scenario corresponding to the optical module mold to be processed based on the material property data, configure heating power parameters of the upper and lower modules corresponding to the optical module mold to be processed according to the heating application scenario, and construct a synchronous heating simulation environment corresponding to the optical module mold to be processed based on the heating power parameters; Analyze the temperature change data corresponding to the upper and lower modules in the synchronous temperature rise simulation environment, query the temperature rise rate parameters in the temperature change data, and calculate the temperature balance of the upper and lower modules during the temperature rise process based on the temperature rise rate parameters; Based on the temperature balance, analyzing the synchronous heating effect of the optical module mold to be processed under different initial temperature difference conditions, and based on the synchronous heating effect, querying the thermal stress change of the optical module mold to be processed during the test; Based on the change of the thermal stress, the separation guide device corresponding to the upper and lower modules is adjusted, based on the adjusted separation guide device, the interference factors of the upper and lower modules in the synchronous heating and separation process are queried, and based on the interference factors, the operation process corresponding to the synchronous heating and separation of the upper and lower modules is planned; Based on the operation process, a synchronous control system corresponding to the heating and separation of the optical module mold to be processed is constructed; based on the synchronous control system, the synchronous control state corresponding to the optical module mold to be processed is monitored, and the control execution data under the synchronous control state is analyzed; based on the control execution data, a mold maintenance plan corresponding to the heating and separation of the optical module mold to be processed is formulated.

2. The method for synchronously heating and separating the upper and lower modules of the heat-shaping optical module mold according to claim 1, characterized in that: The step of analyzing the heating application scenario corresponding to the optical module mold to be processed based on the material characteristic data includes: Performing hierarchical analysis on the material characteristic data to obtain a hierarchical data group; Identify sensitive attribute elements corresponding to each layer of data in the hierarchical data group; Based on the sensitive attribute elements, calculating the temperature adaptability value of the optical module mold to be processed under different heating methods; Based on the temperature adaptation value, analyzing the internal heat transfer curve corresponding to the optical module mold to be processed; extracting key temperature nodes in the internal heat transfer curve; Based on the key temperature nodes, a heating application scenario corresponding to the optical module mold to be processed is constructed.

3. The method for synchronously heating and separating the upper and lower modules of the heat-shaping optical module mold according to claim 2, characterized in that: The step of calculating the temperature adaptability value of the optical module mold to be processed under different heating modes based on the sensitive attribute element includes: The temperature adaptability value of the optical module mold to be processed under different heating methods is calculated using the following formula: Among them, TA represents the temperature adaptability value of the optical module mold to be processed under different heating methods, n represents the number of elements corresponding to the sensitive attribute element, i represents the number index corresponding to the sensitive attribute element, represents the standard value of the i-th sensitive attribute element under a specific heating method, represents the measured value of the i-th sensitive attribute element during the actual heating process, represents the measurement error value of the i-th sensitive attribute element, t represents the heating time, represents the number of heating methods corresponding to different heating methods, j represents the number index corresponding to different heating methods, represents the heating power value corresponding to the jth heating mode, Indicates the temperature state ratio corresponding to the jth heating method.

4. The method for synchronously heating and separating the upper and lower modules of the heat-shaping optical module mold according to claim 1, characterized in that: The step of constructing a synchronous heating simulation environment corresponding to the optical module mold to be processed based on the heating power parameter includes: Performing spectrum analysis on the heating power parameter to obtain power spectrum data; Performing filtering on the power spectrum data to obtain filtered spectrum data; Extracting features from the filtered spectrum data to obtain a spectrum feature vector; Based on the frequency spectrum feature vector, setting the initial temperature rise condition corresponding to the optical module mold to be processed; Based on the initial temperature rise condition, a synchronous temperature rise simulation environment corresponding to the optical module mold to be processed is constructed.

5. The method for synchronously heating and separating the upper and lower modules of the heat-shaping optical module mold according to claim 1, characterized in that: The analyzing the temperature change data corresponding to the upper and lower modules in the synchronous temperature rise simulation environment includes: Discretizing the data in the synchronous heating simulation environment to obtain a discrete temperature sequence; Performing trend fitting on the discrete temperature sequence to obtain a temperature trend curve; Identifying a temperature mutation point in the temperature trend curve; Based on the temperature mutation point, dividing the temperature stages corresponding to the upper and lower modules; The temperature variation data corresponding to the temperature stage is analyzed.

6. The method for synchronously heating and separating the upper and lower modules of the heat-shaping optical module mold according to claim 1, characterized in that: The calculating, based on the heating rate parameter, the temperature balance of the upper and lower modules during the heating process comprises: The temperature balance of the upper and lower modules during the heating process is calculated using the following formula: Wherein, TE represents the temperature balance of the upper and lower modules during the heating process, q represents the total number of temperature sampling points during the heating process, and k represents the number index corresponding to the temperature sampling points. represents the heating rate of the upper module at the kth sampling point, represents the heating rate of the lower module at the kth sampling point, c represents the number of factors corresponding to the heating rate parameter, v represents the number index corresponding to the influencing factor, Indicates the factor weight value corresponding to the vth influencing factor.

7. The method for synchronously heating and separating the upper and lower modules of the heat-shaping optical module mold according to claim 1, characterized in that: The step of querying the thermal stress change of the optical module mold to be processed during the test based on the synchronous heating effect includes: Quantitatively evaluating the synchronous heating effect to obtain a quantitative heating index; Based on the temperature rise quantitative index, dividing the temperature sensitive area corresponding to the optical module mold to be processed; Arrange strain gauges in the temperature sensitive area to obtain a strain gauge arrangement scheme; collecting a temperature strain data set in the strain gauge arrangement scheme; Based on the temperature strain data set, the thermal stress change of the optical module mold to be processed during the test is queried.

8. The method for synchronously heating and separating the upper and lower modules of a heat-shaping optical module mold according to claim 1, characterized in that: The planning of the operation flow of synchronous heating and separation of the upper and lower modules based on the interference factors includes: Query the source of the interference factor; Based on the source of the factors, identifying existing operation features corresponding to the upper and lower modules; Marking the key operation identifier corresponding to the existing operation feature; Analyze the optimizable links corresponding to the key operation identifiers; Based on the optimizable links, the operational procedures for synchronous heating and separation of the upper and lower modules are planned.

9. The method for synchronously heating and separating the upper and lower modules of a heat-shaping optical module mold according to claim 1, characterized in that: Based on the operation process, a synchronous control system for heating and separating the optical module mold to be processed is constructed, including: Determine various key parameters in the heating and separation operations of the optical module mold to be processed; Sorting out the corresponding mutual influence relationships between the key parameters; Collecting initial synchronization data corresponding to the optical module mold to be processed; Determine a synchronization setting value corresponding to the optical module mold to be processed according to the mutual influence relationship and the initial synchronization data; Based on the synchronization setting value, a synchronization control system for corresponding heating and separation of the optical module mold to be processed is constructed.

10. A system for synchronously heating and separating the upper and lower modules of a heat-shaping optical module mold, characterized in that: The system comprises: An environment construction module is used to obtain material property data corresponding to the optical module mold to be processed, analyze the heating application scenario corresponding to the optical module mold to be processed based on the material property data, configure the heating power parameters of the upper and lower modules corresponding to the optical module mold to be processed according to the heating application scenario, and construct a synchronous heating simulation environment corresponding to the optical module mold to be processed based on the heating power parameters; A balance calculation module is used to analyze the temperature change data corresponding to the upper and lower modules in the synchronous heating simulation environment, query the heating rate parameters in the temperature change data, and calculate the temperature balance of the upper and lower modules during the heating process based on the heating rate parameters; A thermal stress calculation module, used to analyze the synchronous heating effect of the optical module mold to be processed under different initial temperature difference conditions based on the temperature balance, and query the thermal stress change of the optical module mold to be processed during the test based on the synchronous heating effect; A process planning module, used to adjust the separation guide device corresponding to the upper and lower modules based on the change of the thermal stress, query the interference factors of the upper and lower modules in the synchronous heating and separation process based on the adjusted separation guide device, and plan the operation process corresponding to the synchronous heating and separation of the upper and lower modules based on the interference factors; A plan formulation module is used to construct a synchronous control system for heating and separation of the optical module mold to be processed based on the operation process; based on the synchronous control system, monitor the synchronous control state of the optical module mold to be processed, and analyze the control execution data under the synchronous control state; based on the control execution data, formulate a mold maintenance plan for heating and separation of the optical module mold to be processed.

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