Heat dissipation module, electronic equipment and heat dissipation method

Abstract

The invention discloses a heat dissipation module, electronic equipment and a heat dissipation method, and relates to the technical field of electronic equipment, and the electronic equipment can give consideration to light and thin design and heat dissipation performance. The heat dissipation module comprises a heat conduction plate, a soaking piece and a first flow channel, and the heat conduction plate is used for being in heat conduction connection with a heating element. The soaking piece is located on the side, away from the heating element, of the heat-conducting plate and is in heat conduction connection with the heat-conducting plate. The first flow channel is located between the heat conduction plate and the soaking piece, part of the inner wall of the first flow channel is formed by the heat conduction plate, and a cooling medium is arranged in the first flow channel.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and in particular to a heat dissipation module, an electronic device and a heat dissipation method. Background Art

[0002] With the development of electronic equipment technology, users have higher and higher requirements for the performance of electronic equipment, such as laptops. The heat dissipation capacity of the heat dissipation module directly determines the maximum power consumption level that the electronic equipment can achieve, that is, the performance of the electronic equipment. In order to improve the heat dissipation performance of the heat dissipation module, the volume of the heat dissipation module has to be increased accordingly. In this way, the heat dissipation module will occupy a large space, which is not conducive to the realization of the lightweight design of the electronic equipment. Summary of the invention

[0003] The present application provides a heat dissipation module, an electronic device and a heat dissipation method. The heat dissipation module can take into account both lightweight design and heat dissipation performance, which is beneficial to improving the performance of the electronic device.

[0004] In a first aspect, the present application provides a heat dissipation module, which includes a heat conducting plate, a heat spreader, and a first flow channel, wherein the heat conducting plate is used for thermally conducting connection with a heating element. The heat spreader is located on a side of the heat conducting plate away from the heating element, and is thermally conducting connection with the heat conducting plate. The first flow channel is located between the heat conducting plate and the heat spreader, wherein the heat conducting plate has a first surface facing the heat spreader, the first flow channel extends on the first surface, a portion of the inner wall of the first flow channel is formed by the first surface, and a cooling medium is provided in the first flow channel.

[0005] Compared with separately setting up a pipeline to form the first flow channel, the heat conduction path of this embodiment does not need to pass through the pipeline used to form the first flow channel. Part of the heat conduction plate forms the inner wall of the first flow channel to facilitate direct heat conduction between the heat conduction plate and the cooling medium. As a result, the cooling medium can directly absorb the heat on the heat conduction plate, and the thermal resistance is also smaller, and the heat dissipation efficiency is improved. Furthermore, part of the inner wall of the first flow channel is formed by the heat conduction plate, and only part of the inner wall of the pipeline needs to be separately set to connect with the heat conduction plate to form the first flow channel, thereby saving the space occupied by the heat dissipation module, which is conducive to the thinning and miniaturization of the heat dissipation module, and further conducive to the thinning and miniaturization of electronic equipment.

[0006] In a possible implementation of the first aspect, part of the inner wall of the first flow channel is formed by a heat spreader. In this way, the cooling medium in the first flow channel can also be in direct contact with the heat spreader, and the heat of the cooling medium can be directly transferred to the heat spreader, so the thermal resistance is also smaller, and the heat dissipation efficiency is improved. Compared with the heat conduction connection between the heat conduction plate and the heat spreader, the first flow channel is added between the heat conduction plate and the heat spreader in this embodiment. Under the premise of maintaining the original heat conduction path, the cooling medium in the first flow channel can further absorb heat, thereby improving the heat dissipation effect of the heat dissipation module.

[0007] Compared with separately setting up a pipeline to form the first flow channel, the heat conduction path of this embodiment does not need to pass through the pipeline used to form the first flow channel. Part of the heat conduction plate and part of the heat spreader form the inner wall of the first flow channel, so that the cooling medium is directly heat-conducted with the heat conduction plate and the heat spreader, thereby reducing the thermal resistance. Furthermore, part of the inner wall of the first flow channel is formed by the heat spreader, and only part of the inner wall of the pipeline needs to be separately set up to connect with the heat conduction plate and the heat spreader to form the first flow channel, thereby saving the space occupied by the heat dissipation module, facilitating the thinning and miniaturization of the heat dissipation module, and further facilitating the thinning and miniaturization of the electronic equipment.

[0008] In a possible implementation of the first aspect, part of the inner wall of the first flow channel is formed by a heat spreader. In this way, the cooling medium in the first flow channel can also directly contact the heat spreader, and the heat of the cooling medium can be directly transferred to the heat spreader, so that the thermal resistance is also smaller and the heat dissipation efficiency is improved.

[0009] In a possible implementation of the first aspect, the heat conducting plate has a first surface facing the heat spreader, the first surface is provided with a first groove, and the opening of the first groove faces the heat spreader. The heat spreader has a second surface facing the heat conducting plate, the second surface covers the opening of the first groove, and forms a first flow channel with the first groove. On the premise that the heat dissipation module is located in the electronic device and occupies the same space, the setting of the first groove can increase the volume of the first flow channel, and thus the volume of the cooling medium in the first flow channel is also larger. During the use of the electronic device, the cooling medium can absorb more heat, which is beneficial to improve the heat dissipation efficiency of the heat dissipation module, and thus improve the performance of the electronic device. On the premise that the volume of the first flow channel is certain, the setting of the first groove can further reduce the space occupied by the heat dissipation module in the electronic device, which is beneficial to the thinning and miniaturization of the heat dissipation module, and thus is beneficial to the thinning and miniaturization of the electronic device.

[0010] In a possible implementation of the first aspect, a second groove is provided on the second surface, and the orthographic projection of the second groove on the first surface overlaps with the first groove, and the first groove and the second groove form a first flow channel. On the premise that the heat dissipation module is located in the electronic device and occupies the same space, the provision of the second groove can increase the volume of the first flow channel, and thus the volume of the cooling medium in the first flow channel is also larger. During the use of the electronic device, the cooling medium can absorb more heat, which is beneficial to improve the heat dissipation efficiency of the heat dissipation module, and thus improve the performance of the electronic device. On the premise that the volume of the first flow channel is certain, the provision of the second groove can further reduce the space occupied by the heat dissipation module in the electronic device, which is beneficial to the thinning and miniaturization of the heat dissipation module, and thus is beneficial to the thinning and miniaturization of the electronic device.

[0011] In a possible implementation of the first aspect, the heat conducting plate has a first surface facing the heat spreader. The heat spreader has a second surface facing the heat conducting plate, the second surface is provided with a second groove, the opening of the second groove faces the heat conducting plate, the first surface covers the opening of the second groove, and forms a closed cavity with the second groove, and the closed cavity forms a first flow channel.

[0012] In a possible implementation of the first aspect, a second flow channel is formed in the heat conducting plate, and the entire inner wall of the second flow channel is formed by the heat conducting plate. The second flow channel is connected to the first flow channel. In this way, the heat dissipation module absorbs heat by providing multiple groups of flow channels, that is, the first flow channel and the second flow channel absorb heat together, thereby improving the heat dissipation efficiency of the heat dissipation module and further improving the performance of the electronic device.

[0013] In a possible implementation of the first aspect, in the thickness direction of the heat conducting plate, at least a portion of the second flow channel is spaced apart from the first flow channel. In this way, the heat dissipation module absorbs heat by providing multiple groups of flow channels, that is, the first flow channel and the second flow channel absorb heat together, thereby improving the heat dissipation efficiency of the heat dissipation module and further improving the performance of the electronic device.

[0014] In a possible implementation of the first aspect, the heat conducting plate includes a first part and a second part which are stacked, the first part is located on the side of the second part which is away from the heat spreader, the thickness of the first part is greater than or equal to 0.5 microns, and the first flow channel is located on the second part. The heat of the heating element is first conducted to the first part, and the first part conducts the heat to the entire heat conducting plate, that is, the heat is conducted to the second part through the first part, and the second part is used to form the first flow channel and the second flow channel, and the cooling medium in the first flow channel and the second flow channel absorbs heat to achieve heat dissipation. In this way, it is beneficial to improve the efficiency of heat conduction of the heating element, thereby improving the heat dissipation efficiency of the heat dissipation module, and further improving the performance of the electronic device.

[0015] In a possible implementation manner of the first aspect, a thickness of the first part in the first direction is greater than or equal to 0.5 micrometers.

[0016] In a possible implementation of the first aspect, a third flow channel is formed in the heat spreader, and the third flow channel is connected to the first flow channel. In this way, the heat dissipation module absorbs heat by providing multiple groups of flow channels, that is, the first flow channel, the second flow channel and the third flow channel absorb heat together, thereby improving the heat dissipation efficiency of the heat dissipation module and further improving the performance of the electronic device.

[0017] In a possible implementation of the first aspect, the first flow channel is serpentine or spiral. In this way, within a limited volume, the serpentine or spiral flow channel can further increase the volume of the first flow channel, the second flow channel, and the third flow channel, and further increase the volume of the cooling medium, so that the heat dissipation efficiency of the heat dissipation module is further improved, which is also conducive to improving the performance of the electronic device.

[0018] In a possible implementation of the first aspect, the first flow channel includes a plurality of sub-segments that are interconnected, and the sub-segments extend along an extension path of the heat spreader. Thus, compared with the first flow channel extending along other directions of the heat spreader, the first flow channel extending along the extension path of the heat spreader can increase the length of each sub-segment of the first flow channel and reduce the process difficulty.

[0019] In a possible implementation of the first aspect, the heat conduction plate further includes a liquid inlet channel and a liquid outlet channel, the liquid inlet channel and the liquid outlet channel are respectively connected to the first flow channel, the liquid inlet channel runs through the first surface and the third surface, and the liquid outlet channel runs through the first surface and the third surface.

[0020] In a possible implementation of the first aspect, the heat dissipation module further includes a driving device, which is used to drive the cooling medium to circulate. In this way, the cooling medium absorbs heat, so that the heat of the heat conducting plate is reduced, and the driving device drives the cooling medium to circulate in the first flow channel, the second flow channel, and the third flow channel, thereby achieving an effect of accelerating heat transfer.

[0021] In a possible implementation of the first aspect, the heat dissipation module further includes a first connecting pipeline, the number of heat conducting plates is at least two, and the first flow channels of adjacent heat conducting plates are connected through the first connecting pipeline. In this way, the first flow channels are arranged on multiple heat conducting plates, and the heat on the heat conducting plates is absorbed by the multiple first flow channels, which further increases the total volume of the first flow channels, and the volume of the cooling medium in the first flow channels is also larger. The first flow channels absorb more heat together, which improves the heat dissipation efficiency of the heat dissipation module, thereby improving the performance of the electronic device.

[0022] In a possible implementation of the first aspect, the heat dissipation module further includes a heat sink, the heat spreader includes an evaporation section and a condensation section, the evaporation section is thermally connected to the heat conduction plate, and the condensation section is thermally connected to the heat sink. In this way, the first flow channel extends to the heat sink, and the heat sink dissipates heat from the cooling medium in the first flow channel, further improving the heat dissipation efficiency of the heat dissipation module, thereby improving the performance of the electronic device.

[0023] In a possible implementation manner of the first aspect, the heat dissipation module further includes a second connecting pipeline, the second connecting pipeline is located between the condensing section and the radiator, and the second connecting pipeline is connected to the first flow channel.

[0024] In a possible implementation of the first aspect, the heat sink includes a plurality of heat sink fins, and the plurality of heat sink fins are arranged at intervals, which is beneficial to increasing the heat dissipation area of ​​the heat sink, thereby improving the heat dissipation performance of the heat dissipation module, and thus improving the performance of the electronic device.

[0025] In a possible implementation of the first aspect, the heat dissipation module further includes a fan, and the heat sink is located at a fan outlet of the fan. In this way, after the airflow blown out from the fan outlet exchanges heat with the heat sink, it can be directly blown to the heat dissipation hole, thereby reducing the flow resistance of the airflow and facilitating the reduction of the noise of the heat dissipation module. At the same time, the heat exchange efficiency between the airflow and the heat sink can be improved, further improving the heat dissipation performance of the heat dissipation module.

[0026] In a second aspect, the present application further provides a heat dissipation module, which includes a heat conducting plate, a heat spreader, and a first flow channel, wherein the heat conducting plate is used for thermally connecting with a heating element. The heat spreader is located on a side of the heat conducting plate away from the heating element and is thermally connected with the heat conducting plate. The first flow channel is located between the heat conducting plate and the heat spreader, and a portion of the inner wall of the first flow channel is formed by the heat spreader, and a cooling medium is provided in the first flow channel.

[0027] In a third aspect, the present application further provides an electronic device, which includes a housing, a heating element and the above-mentioned heat dissipation module, wherein the housing has a storage space, the heating element is arranged in the storage space, and the heat conduction plate of the heat dissipation module is thermally connected to the heating element.

[0028] In a possible implementation manner of the third aspect, the electronic device further includes a circuit board, the heating element is disposed on the circuit board, and the heating device includes a CPU and a GPU.

[0029] In a fourth aspect, the present application further provides a heat dissipation method, which is applied to the above-mentioned electronic device, and the method comprises:

[0030] When the electronic device enters the overclocking mode, the driving device is controlled to start, and the driving device drives the cooling medium to flow in the first flow channel;

[0031] Acquire a first temperature, where the first temperature is a temperature of one of the accommodation space, the heating element, the heat conducting plate, and the heat spreader;

[0032] determining whether the first temperature reaches a threshold temperature;

[0033] If the first temperature is lower than the threshold temperature, the driving device stops working; if the first temperature is higher than the threshold temperature, the driving device continues working.

[0034] In a possible implementation manner of the fourth aspect, the threshold temperature is greater than or equal to 50 degrees and less than or equal to 80 degrees. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A schematic diagram of the structure of an electronic device provided in some embodiments of the present application;

[0036] Figure 2 for Figure 1 A three-dimensional diagram of a keyboard host of the electronic device shown;

[0037] Figure 3 For along Figure 2 A cross-sectional view of the stereogram shown in FIG. 1 at line AA;

[0038] Figure 4 for Figure 3 The schematic diagram of the structure of the heat dissipation module when the keyboard host 2 is viewed from the F1 direction is shown in FIG.

[0039] Figure 5a for Figure 4 A schematic diagram of the structure of the heat conduction structure in the heat dissipation module shown in FIG.

[0040] Figure 5b for Figure 5a A schematic structural diagram of a heat conducting plate in the heat conducting structure shown;

[0041] Figure 5c Structural schematic diagrams of some further heat-conducting structures provided in some embodiments of the present application;

[0042] Figure 6 For along Figure 5a Cross-section at the midline BB;

[0043] Figure 7 A schematic diagram of the structure of a heat dissipation module provided in some embodiments of the present application;

[0044] Figure 8 for Figure 7 The structure schematic diagram of the liquid cooling device shown is cut along the CC line;

[0045] Fig. 9 for Figure 5a A schematic structural diagram of another heat conducting plate of the heat dissipation module shown;

[0046] Fig.10 for Figure 5a A schematic structural diagram of another heat conducting plate of the heat dissipation module shown;

[0047] Fig.11 for Figure 5a A schematic structural diagram of another heat spreader of the heat dissipation module shown;

[0048] Fig.12 for Figure 5a A schematic structural diagram of another heat conducting plate of the heat dissipation module shown;

[0049] Fig.13for Figure 5a A front view of a heat conducting plate of the heat dissipation module shown;

[0050] Fig.14 for Figure 5a A schematic structural diagram of another heat spreader of the heat dissipation module shown;

[0051] Fig.15a for Figure 5a A schematic structural diagram of another heat conducting plate of the heat dissipation module shown;

[0052] Fig.15b for Figure 5a A schematic structural diagram of another heat conducting plate of the heat dissipation module shown;

[0053] Fig.15c for Figure 5a A schematic structural diagram of another heat conducting plate of the heat dissipation module shown;

[0054] Fig.15d A schematic diagram of the structure of a heat dissipation module provided in some other embodiments of the present application;

[0055] Fig.16a for Figure 5a A schematic structural diagram of another heat conducting plate of the heat dissipation module shown;

[0056] Fig.16b for Fig.16a A schematic diagram of the structure of the back side of one of the heat conducting plates shown;

[0057] Fig.16c This is a schematic diagram of the structure of the connection between the heat conducting plate and the driving device in some embodiments of the present application;

[0058] Fig.16d for Figure 5a A schematic structural diagram of another heat conducting plate of the heat dissipation module shown;

[0059] Fig.17 for Figure 4 A schematic diagram of the structure of the heat sink in the heat dissipation module shown in ;

[0060] Fig.18 for Figure 4 A schematic diagram of the structure of a fan in a heat dissipation module shown;

[0061] Fig.19 This is a comparison chart of the temperature rise time for the CPU to reach the limit temperature when the electronic device of the present application has the above-mentioned heat dissipation module and when it does not. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] 100. Electronic equipment; 1. Display; 2. Keyboard host;

[0064] 21, housing; 21a, accommodating space; 211, C housing; 212, D housing;

[0065] 22. middle board; 23. keyboard; 231. fixed board; 232. key; 24. main board;

[0066] 25, heat dissipation module; 251, heat conduction structure; 2511, heat conduction plate; 2511a, first surface; A1, first area; A2, second area; a, first part; b, second part; 2511b, third surface; 2511c, first groove;

[0067] 2511c, first heat conducting plate; 2511d, second heat conducting plate; 2511e, first connecting pipeline; 2511f, third area; 2511g, fourth area; 2511h, step portion;

[0068] 2512, heat-sparing member; 2512a, tube shell; 2512b, liquid wick; 2512c, end cover; 2512d, evaporation section; 2512e, condensation section; 2512f, condensation section; 2512g, working liquid; 2512h, second surface; 2512i, second groove;

[0069] C, third area; D, fourth area; 252, radiator; 252a, heat dissipation substrate; 252b, heat dissipation fins; 252c, heat dissipation channel; 253, fan; 2531, fan outlet;

[0070] 26, first flow channel; 26a, liquid inlet; 26b, liquid outlet; 26c, subsection;

[0071] 261. Second flow channel; 263. Third flow channel; 27. Liquid cooling device; 271. Pipeline; 272. Flow channel; 273. Cooling medium; 28. Driving device; 281. Inlet; 282. Outlet; 283. Liquid inlet pipeline; 284. Liquid outlet pipeline; 3. Heating element. DETAILED DESCRIPTION

[0072] In the embodiments of the present application, the terms "first", "second", "third", and "fourth" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", "third", and "fourth" may explicitly or implicitly include one or more of the features.

[0073] In the embodiments of the present application, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0074] In the embodiments of the present application, "and / or" is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0075] The present application provides an electronic device, which is a type of electronic device with a heat dissipation module. Specifically, the electronic device includes but is not limited to mobile phones, tablet personal computers, laptop computers, personal digital assistants (PDAs), personal computers, notebooks, vehicle-mounted devices, wearable devices, and other electronic devices.

[0076] See also Figure 1 , Figure 1 The electronic device 100 is a schematic diagram of the structure of some embodiments of the present application. In this embodiment, the electronic device 100 is a notebook computer. Specifically, the electronic device 100 includes a display 1 and a keyboard host 2.

[0077] The display 1 is used to display images, videos, etc. The keyboard host 2 is rotatably connected to the display 1. The keyboard host 2 is used to input instructions and data, and according to the input instructions and data, controls the display 1 to display images and videos. At the same time, the keyboard host 2 is also used to play voice or music.

[0078] The electronic device 100 can switch between an open state and a closed state. When the electronic device 100 is in the open state, the display 1 and the keyboard host 2 form an angle greater than 0° and less than 180°. When the electronic device 100 is in the closed state, the display 1 covers the keyboard host 2, and the display surface of the display 1 is opposite to the keyboard surface of the keyboard host 2.

[0079] In order to facilitate the description of the following embodiments, an XYZ coordinate system is established for the keyboard host 2. Specifically, the extension direction of the rotation axis of the keyboard host 2 and the display 1 is defined as the X-axis direction, the thickness direction of the keyboard host 2 is defined as the Z-axis direction, and the direction perpendicular to both the X-axis direction and the Z-axis direction is defined as the Y-axis direction. It is understandable that the coordinate system setting of the keyboard host 2 can be flexibly set according to actual needs, and no specific limitation is made here.

[0080] See also Figure 2 , Figure 2 for Figure 1 The three-dimensional diagram of the keyboard host 2 of the electronic device 100 is shown. Figure 3 For along Figure 2 The sectional view of the stereogram shown in FIG. 2 is at the AA line. It should be noted that “at the AA line” refers to the plane where the AA line is located. The description of similar figures in the following text should be understood in the same way and will not be repeated in the following text. In this embodiment, the keyboard host 2 includes a housing 21, a middle plate 22, a keyboard 23, a main board 24 and a heat dissipation module 25.

[0081] It should be noted that Figure 2-Figure 3 Only some components of the keyboard host 2 are schematically shown, and the actual shapes, sizes, positions and structures of these components are not subject to the present invention. Figure 2 and Figure 3 and the accompanying drawings below.

[0082] The housing 21 is used to protect the internal structure of the keyboard host 2. The housing 21 can be a whole structure or can be formed by assembling multiple parts. Figure 2-Figure 3 The housing 21 includes a C housing (palm rest cover) 211 and a D housing (bottom cover) 212. The C housing 211 and the D housing 212 are matched to form an internal accommodation space 21a of the housing 21. The C housing 211 and the D housing 212 can be fixed by snapping, gluing, or threading, which is not specifically limited here.

[0083] The middle plate 22 is located in the internal accommodation space 21a of the housing 21. The middle plate 22 is fixed to the inner surface of the C shell 211 by gluing, clamping, threading, riveting, etc. In other embodiments, the middle plate 22 can also be fixed to the inner surface of the D shell 212. The material of the middle plate 22 includes but is not limited to plastic and metal. The middle plate 22 is used as a supporting "skeleton" for the electronic components in the keyboard host 2. The keyboard 23 and the heat dissipation module 25 are fixed to the middle plate 22 directly or indirectly.

[0084] The keyboard 23 is used to input commands and data. The keyboard 23 includes a fixed plate 231 and a plurality of keys 232 connected to the fixed plate 231. Figure 3, the fixing plate 231 is fixed on the middle plate 22 .

[0085] The motherboard 24 is used to integrate control chips. The control chips may include a central processing unit (CPU), a graphics processing unit (GPU), an application processor (AP), a double data rate synchronous dynamic random access memory (DDR), and a universal flash storage (UFS).

[0086] The heat dissipation module 25 is disposed in the accommodation space 21a, and is used to dissipate heat from the heating element 3 in the electronic device 100 to ensure the normal operation of the electronic device 100. Exemplarily, the heating element 3 may include but is not limited to the CPU, GPU on the motherboard 24, and various chips in the electronic device 100. That is, the heat dissipation module 25 may be used to cool down at least one of the CPU, GPU on the motherboard 24, and various chips in the electronic device 100. Please refer to Figure 3 The heat dissipation module 25 is fixed on the mainboard 24 and is thermally connected to the CPU, GPU and various chips.

[0087] The heat dissipation module 25 is described in detail below.

[0088] See also Figure 4 , Figure 4 for Figure 3 , a schematic diagram of the structure of the heat dissipation module 25 when the keyboard host 2 is viewed from the F1 direction. The heat dissipation module 25 includes a heat-conducting structure 251 and a radiator 252. The heat-conducting structure 251 is connected to the heating element 3 by thermal conduction. Specifically, the heat-conducting structure 251 and the heating element 3 can be connected by welding, bonding, screw connection, rivet connection, etc. The heat-conducting structure 251 and the heating element 3 can be connected by direct contact to achieve heat conduction connection. A heat transfer structure can also be set between the heat-conducting structure 251 and the heating element 3 to achieve heat conduction connection, wherein the heat transfer structure can be thermal grease, thermal adhesive, etc. This embodiment and the following embodiments are described by taking the example that the heat-conducting structure 251 and the heating element 3 can be connected by direct contact to achieve heat conduction connection. The heat-conducting structure 251 is used to conduct the heat of the heating element 3 to the radiator 252. In this way, when the electronic device 100 is running, the heat generated by the heating element 3 can be transferred to the radiator 252 through the heat-conducting structure 251, and the above heat will be discharged to the outside of the electronic device 100 through the radiator 252.

[0089] Please also read Figure 4 and Figure 5a, Figure 5a for Figure 4 Schematic diagram of the structure of the heat-conducting structure 251 in the heat dissipation module 25 shown in . The heat-conducting structure 251 includes a heat-conducting plate 2511 and a heat-scaling member 2512. The heat-conducting plate 2511 is thermally connected to the heating element 3, and the heat-conducting plate 2511 is thermally connected to the heat-scaling member 2512. Optionally, the material of the heat-conducting plate 2511 can be metal. Specifically, the material of the heat-conducting plate 2511 can be silver, copper, aluminum, zinc, etc., and the above materials all have good thermal conductivity. In this embodiment, the material of the heat-conducting plate 2511 is copper as an example for illustration, but this is not a special limitation of the present application. Metal copper has good thermal conductivity and high ductility. The heat-conducting plate 2511 is prepared by using metal copper material. While ensuring the thermal conductivity of the heat-conducting plate 2511, the heat-conducting plate 2511 can be made thin, which reduces the occupied space of the heat-conducting plate 2511, and can take into account the heat dissipation efficiency and thin design of the electronic device 100 at the same time.

[0090] Please continue reading Figure 5a , the heat conducting plate 2511 can be formed into a sheet structure, and the heat conducting plate 2511 can be a square, oval, circular, runway-shaped, special-shaped structure, etc., and the specific shape of the heat conducting plate 2511 is not limited in the present application. The heating element 3 includes a fourth surface, and the fourth surface faces the heat conducting plate 2511. The fourth surface is in direct contact with the heat conducting plate 2511 to achieve a thermal conduction connection between the heating element 3 and the heat conducting plate 2511. The orthographic projection of the heating element 3 on the plane where the heat conducting plate 2511 is located can be located in the heat conducting plate 2511 to ensure that all fourth surfaces can be in direct contact with the heat conducting plate 2511. In this way, it can be ensured that there is sufficient contact area between the heating element 3 and the heat conducting plate 2511, so that the heat on the heating element 3 can be quickly transferred to the radiator 252 through the heat conducting structure 251, which is conducive to improving the heat dissipation efficiency.

[0091] The heat conducting plate 2511 can be fixed on the motherboard 24 and connected to the CPU, GPU, etc. on the motherboard 24 through heat conduction. Figure 5a The heat conducting plate 2511 includes a first surface 2511a and a third surface 2511b facing each other. The heat conducting plate 2511 is located between the heating element 3 and the heat spreader 2512, the first surface 2511a faces the heat spreader, and the third surface 2511b faces the heating element 3. The heat conducting plate 2511 is thermally connected to the heat spreader 2512 and the heating element 3 respectively. Exemplarily, the heat conducting plate 2511 can be fixed to the main board 24 by gluing, clamping, threading, etc.

[0092] There can be multiple heat conducting plates 2511 , and the number of heat conducting plates 2511 is determined according to the number and positions of the heating elements 3 . Figure 5aThe number of heat conducting plates 2511 in the heat dissipation module 25 shown is two, and the two heat conducting plates 2511 are arranged in the accommodation space at intervals, and the positions of the two heat conducting plates 2511 are set according to the positions of different heating elements 3. However, this is not a special limitation of the present application, and in some other embodiments, the number of heat conducting plates 2511 can also be three, four, five, etc.

[0093] See also Figure 5b , Figure 5b for Figure 5a The schematic diagram of the structure of the heat-conducting plate 2511 in the heat-conducting structure 251 shown. Take one of the heat-conducting plates 2511 as an example. As mentioned above, in order to improve the heat-conducting efficiency between the heating element 3 and the heat-conducting plate 2511, the heating element 3 and the heat-conducting plate 2511 are connected by direct contact to achieve heat conduction. Due to the different thicknesses of different heating elements 3, after the heat-conducting plate 2511 contacts the fourth surface of the heating element 3, the various parts of the heat-conducting plate 2511 are in different planes, that is, the various parts of the heat-conducting plate 2511 have different heights on the Z axis. Therefore, the heat-conducting plate 2511 is not an absolutely flat plate-like structure.

[0094] Specifically, after the heat conducting plate 2511 contacts the heating element 3, according to the different heights of the heat conducting plate 2511 in the Z-axis direction, the heat conducting plate 2511 may include a third region 2511f and a fourth region 2511g, wherein the third region 2511f contacts the heating element 3 with a thinner thickness, and the fourth region 2511g contacts the heating element 3 with a thicker thickness, and a height difference is formed between the third region 2511f and the fourth region 2511g. The heat conducting plate 2511 also includes a step portion 2511h, which is disposed between the third region 2511f and the fourth region 2511g, so as to connect the regions of the heat conducting plate 2511 with different heights into one.

[0095] Please also read Figure 4 and Figure 5a , the heat spreader 2512 includes an evaporation section 2512d and a condensation section 2512f, and the condensation section 2512f is located at both ends of the extension direction of the evaporation section 2512d. Among them, the evaporation section 2512d is connected to the heat conduction plate 2511 by thermal conduction, and the condensation section 2512f is connected to the radiator 252 by thermal conduction. Specifically, the orthographic projection of the evaporation section 2512d in the Z-axis direction overlaps with the heat conduction plate 2511, and the orthographic projection of the condensation section 2512f on the Z-axis overlaps with the radiator 252. In this way, the heat of the heating element 3 is transferred to the heat conduction plate 2511, the heat of the heat conduction plate 2511 is transferred to the evaporation section 2512d of the heat spreader 2512, the heat of the evaporation section 2512d is transferred to the condensation section 2512f, and then transferred to the radiator 252 through the condensation section 2512f, which is conducive to improving the heat dissipation efficiency.

[0096] Figure 5a The example in which the number of the heat conducting plate 2511 and the heat spreading member 2512 is two is used for explanation. Figure 5c , Figure 5c Schematic diagrams of structures of some further heat-conducting structures 251 provided in some embodiments of the present application. Figure 5c The heat-conducting structure 251 only includes a heat spreader 2512 and a heat-conducting plate 2511 . In this way, the heat dissipation module 25 can be prevented from occupying too much space, which is conducive to making the electronic device 100 thinner and lighter.

[0097] The heat spreader 2512 may be a heat pipe or a heat spreader. Figure 6 , Figure 6 For along Figure 5a The cross-sectional view of the middle BB line. In this embodiment, the heat-distributing member is a heat pipe. The heat pipe includes a tube shell 2512a, a liquid wick 2512b and an end cap 2512c. The tube shell 2512a is formed into a hollow structure, and the liquid wick 2512b covers the inner wall of the tube shell 2512a. After the tube is evacuated to a negative pressure, it is filled with an appropriate amount of working liquid, so that the capillary porous material of the liquid wick close to the inner wall of the tube is filled with liquid, and then sealed by the end cap 2512c. When one end of the heat pipe (that is, the evaporation section) is heated, the liquid in the liquid wick evaporates and vaporizes, and the steam flows to the other end (that is, the condensation section) under a small pressure difference, releases heat and condenses into liquid, and the liquid then flows back to the evaporation section along the porous material by the action of capillary force. In this way, the cycle operation achieves a rapid heat transfer effect, and is evenly distributed to the radiator 252, and then the heat energy is dissipated through the air, thereby improving the heat dissipation efficiency of the electronic device 100 to a certain extent.

[0098] In some embodiments, please refer to Figure 6 The heat pipe is formed into a flat tube. "Flat tube" refers to a sheet or plate-shaped heat pipe, that is, the heat pipe is in the thickness direction, that is, Figure 6 The thickness in the Z-axis direction is small. In this way, the space occupied by the heat pipe in the Z-axis direction can be reduced, which is conducive to realizing the lightweight design of electronic equipment.

[0099] In other embodiments, the heat spreader 2512 may also be a heat spreader plate. The heat spreader 2512 is a vacuum cavity with a microstructure on the inner wall. The heat spreader 2512 is made of copper and the vacuum cavity is filled with coolant. When heat is conducted from the heat source to the evaporation section, the coolant in the vacuum cavity begins to vaporize after being heated in a low vacuum environment. At this time, it absorbs heat energy and expands rapidly in volume. The gas phase cooling medium quickly fills the entire vacuum cavity. When the gas phase working medium contacts a relatively cold area, condensation will occur. The heat accumulated during evaporation is released through the condensation phenomenon. The condensed coolant will return to the evaporation heat source through the microstructured capillary channels. This operation will be repeated in the cavity to achieve a rapid heat transfer effect, and evenly distributed to the radiator 252, and then the heat energy will be dissipated through the air, thereby improving the heat dissipation efficiency of the electronic equipment to a certain extent.

[0100] In order to further improve the heat dissipation effect of the electronic device 100, the heat dissipation module 25 may further include a liquid cooling device 27. The heat dissipation module 25 improves the heat dissipation effect by adding the liquid cooling device 27. Specifically, the liquid cooling device 27 may be connected to the heating element 3 by thermal conduction, and may also be connected to the heat conducting plate 2511 by thermal conduction, directly or indirectly absorbing the heat of the heating element 3, thereby improving the heat dissipation effect of the heat dissipation module 25, and further improving the performance of the electronic device 100.

[0101] The liquid cooling device 27 is further described below. Figure 7 and Figure 8 , Figure 7 A schematic diagram of the structure of the heat dissipation module 25 provided in some embodiments of the present application. Figure 8 for Figure 7 The structure schematic diagram of the liquid cooling device 27 cut along the CC line is shown. For example, the liquid cooling device 27 can be connected to the heat conducting plate 2511 by thermal conduction. Specifically, the liquid cooling device 27 can be connected to the first surface 2511a of the heat conducting plate 2511 and fixed to the heat conducting plate 2511. The liquid cooling device 27 can be fixed to the heat conducting plate 2511 by welding, bonding, or detachable connection. The liquid cooling device 27 may include a pipeline 271 and a flow channel 272 arranged in the pipeline 271, and the flow channel 272 is provided with a cooling medium 273, and the heat of the heating element 3 is directly or indirectly absorbed by the cooling medium 273.

[0102] The liquid cooling device 27 can be used continuously when the electronic device 100 is in normal working state, and can also be used only in high power consumption working mode. It should be noted that the "high power consumption working mode" here means that in this working mode, the electronic device 100 instantly increases the power consumption of the CPU in order to improve the computing power of the CPU, thereby improving the performance of the electronic device 100. The instantaneous increase in the power consumption of the CPU by the electronic device 100 will cause the temperature of the chip to rise rapidly. When the temperature of the electronic device 100 reaches the limit temperature, the electronic device 100 stops the high power consumption working mode. Under the temperature limit, the high power consumption working mode of the electronic device 100 is short, which affects the performance of the electronic device 100. For example, the high power consumption working mode can be the overclocking mode of the electronic device 100. The "overclocking mode" means that the electronic device 100 increases the operating frequency of the CPU and the graphics card, and works at a higher frequency state to increase the working speed of the computer.

[0103] In the high power consumption working mode, the liquid cooling device 27 can delay the time taken for the temperature of the electronic device 100 to rise to the limit temperature, thereby extending the time the electronic device 100 is in the high power consumption working mode and improving the performance of the electronic device 100.

[0104] It is worth noting that the above only exemplifies the working effect of the liquid cooling device 27 when the electronic device 100 is in a high power consumption working mode, but this does not represent a special limitation on the present application. In other words, in addition to this, the liquid cooling device 27 can also be used in other working modes of the electronic device 100, and the liquid cooling device 27 can further improve the heat dissipation effect of the electronic device 100, thereby improving the working performance of the electronic device 100.

[0105] However, the liquid cooling device 27 disposed on the heat conducting plate 2511 will occupy a portion of the accommodation space 21a of the electronic device 100, that is, the portion of the liquid cooling device 27 protruding from the first surface 2511a. With the development of thinning and miniaturization of the electronic device 100, the accommodation space 21a of the electronic device 100 is getting smaller and smaller, and it is more difficult to install the liquid cooling device 27 in a smaller accommodation space 21a. If the accommodation space 21a is increased in order to reduce the installation difficulty of the liquid cooling device 27, the thinning and miniaturization of the electronic device 100 cannot be satisfied. In addition, the heat conduction path of the heat of the heating element 3 to the liquid cooling device 27 is that the heat of the heating element 3 is firstly heat-conducted to the heat conducting plate 2511, and the heat of the heat conducting plate 2511 is then heat-conducted to the pipe 271 of the liquid cooling device 27, and then heat-conducted to the cooling medium 273 inside the pipe 271 after passing through the inner wall of the pipe 271, and the heat of the heating element 3 is absorbed by the cooling medium 273. After the above heat conduction process, the heat needs to pass through multiple components, and the thermal resistance in the heat conduction also increases. "Thermal resistance" refers to the resistance encountered when heat is transferred inside an object by heat conduction, which is also called thermal resistance. The greater the thermal resistance, the lower the efficiency of heat transfer.

[0106] To solve the above problems, see Fig. 9 , Fig. 9 for Figure 5a A schematic structural diagram of another heat conducting plate 2511 of the heat dissipation module 25 shown. The present application also provides a heat dissipation module 25. The difference between the heat dissipation module 25 in this embodiment and the above-mentioned heat dissipation module 25 is that the heat dissipation module 25 in this embodiment also includes a first flow channel 26. Specifically, the heat dissipation module 25 includes a heat conducting plate 2511, a heat equalizing member 2512 and a first flow channel 26, and the heat conducting plate 2511 is used for thermal conduction connection with the heating element 3. The heat equalizing member 2512 is located on the side of the heat conducting plate 2511 away from the heating element 3, and is thermally connected to the heat conducting plate 2511. The position, shape and structural construction of the heat equalizing member 2512 and the heat conducting plate 2511 are consistent with the above-mentioned heat equalizing member 2512 and the heat conducting plate 2511, and will not be repeated here.

[0107] The first flow channel 26 is located between the heat conducting plate 2511 and the heat balancing member 2512, and part of the inner wall of the first flow channel 26 is formed by the heat conducting plate 2511. The first flow channel 26 extends on the first surface 2511a, and a cooling medium 273 is provided in the first flow channel 26. Compared with the case where the pipeline 271 is provided separately to form the first flow channel 26, the heat conduction path of the present embodiment does not need to pass through the pipeline 271 used to form the first flow channel 26, and part of the heat conducting plate 2511 forms the inner wall of the first flow channel 26 to facilitate direct heat conduction between the heat conducting plate 2511 and the cooling medium 273. As a result, the cooling medium 273 can directly absorb the heat on the heat conducting plate 2511, and the thermal resistance is also smaller, and the heat dissipation efficiency is improved. Furthermore, part of the inner wall of the first flow channel 26 is formed by the heat conducting plate 2511, and only part of the inner wall of the pipeline 271 needs to be separately set to connect with the heat conducting plate 2511 to form the first flow channel 26, thereby saving the space occupied by the heat dissipation module 25, which is beneficial to the thinning and miniaturization of the heat dissipation module 25, and further beneficial to the thinning and miniaturization of the electronic device 100.

[0108] The cross-section of the first flow channel 26 may be in a circular, elliptical, square, triangular, or irregular shape, etc. This application takes the cross-section of the first flow channel 26 as a circular shape as an example for explanation, but this does not represent a special limitation on this application. The cooling medium 273 may be pure water, deionized water, ethylene (propylene) glycol aqueous solution, etc. This application takes the cooling medium 273 as pure water as an example for explanation, but this does not represent a special limitation on this application.

[0109] In some embodiments, based on the above embodiments, part of the inner wall of the first flow channel 26 is also formed by the heat equalizer 2512. In this way, the cooling medium 273 in the first flow channel 26 can also be in direct contact with the heat equalizer 2512, and the heat of the cooling medium 273 can be directly thermally transferred to the heat equalizer 2512, so the thermal resistance is also smaller, and the heat dissipation efficiency is improved. Compared with the heat conduction plate 2511 directly connected to the heat equalizer 2512 by thermal conduction, the first flow channel 26 is added in this embodiment and arranged between the heat conduction plate 2511 and the heat equalizer 2512. Under the premise of maintaining the original heat conduction path, the cooling medium 273 in the first flow channel 26 can further absorb heat, thereby improving the heat dissipation effect of the heat dissipation module 25.

[0110] Compared with separately setting up the pipeline 271 to form the first flow channel 26, the heat conduction path of this embodiment does not need to pass through the pipeline 271 used to form the first flow channel 26. Part of the heat conducting plate 2511 and part of the heat equalizing member 2512 form the inner wall of the first flow channel 26, so that the cooling medium 273 is directly heat-conducted with the heat conducting plate 2511 and the heat equalizing member 2512, thereby, the thermal resistance is smaller. Furthermore, part of the inner wall of the first flow channel 26 is formed by the heat equalizing member 2512, and only part of the inner wall of the pipeline 271 needs to be separately set up to connect with the heat conducting plate 2511 and the heat equalizing member 2512 to form the first flow channel 26, thereby saving the space occupied by the heat dissipation module 25, which is conducive to the thinning and miniaturization of the heat dissipation module 25, and further conducive to the thinning and miniaturization of the electronic device 100.

[0111] The specific structure and arrangement of the first flow channel 26 are described in detail below.

[0112] In some embodiments, please refer to Fig. 9 The heat conducting plate 2511 has a first surface 2511a facing the heat spreader 2512, and a third surface 2511b opposite to the first surface 2511a. The first surface 2511a is provided with a first groove 2511c, and the first groove 2511c is formed by the first surface 2511a being recessed in a direction close to the third surface 2511b. The opening of the first groove 2511c is located on the first surface 2511a and faces the heat spreader 2512. The opening of the first groove 2511c is closed to form a first flow channel 26. The first groove 2511c can be processed by etching, machining, etc.

[0113] See also Fig.10 , Fig.10 for Figure 5a A schematic diagram of the structure of another heat spreader 2512 of the heat dissipation module 25 shown. The heat spreader 2512 has a second surface 2512h facing the heat conducting plate 2511, the second surface 2512h covers the opening of the first groove 2511c, and forms a closed cavity with the first groove 2511c, and the closed cavity forms the first flow channel 26. The heat spreader 2512 can be welded to the first surface 2511a to close the opening of the first groove 2511c to form the first flow channel 26. The welding method can adopt laser welding, resistance welding, brazing and other welding methods. In this embodiment, the brazing welding method can be adopted. The brazing technology is to use a material with a lower melting point than the parent material as a brazing material, heat the weldment and the brazing material to a temperature higher than the melting point of the brazing material but lower than the melting temperature of the parent material (so that the parent material remains in a solid state), and use the wetting effect of the liquid brazing material to fill the joint gap. In this way, the problem of deformation of the heat conducting plate 2511 caused by high temperature during welding can be avoided.

[0114] On the premise that the heat dissipation module 25 occupies the same space in the electronic device 100, the setting of the first groove 2511c can increase the volume of the first flow channel 26, and thus the volume of the cooling medium 273 in the first flow channel 26 is also larger. During the use of the electronic device 100, the cooling medium 273 can absorb more heat, which is conducive to improving the heat dissipation efficiency of the heat dissipation module 25, and thus improving the performance of the electronic device 100. On the premise that the volume of the first flow channel 26 is certain, the setting of the first groove 2511c can further reduce the space occupied by the heat dissipation module 25 in the electronic device 100, which is conducive to the thinning and miniaturization of the heat dissipation module 25, and thus is conducive to the thinning and miniaturization of the electronic device 100.

[0115] See also Fig.11 , Fig.11 for Figure 5a A schematic diagram of the structure of another heat spreader 2512 of the heat dissipation module 25 is shown. In some embodiments, the heat spreader 2512 includes a second surface 2512h facing the first surface 2511a, the second surface 2512h is provided with a second groove 2512i, the orthographic projection of the second groove 2512i on the first surface 2511a overlaps with the first groove 2511c, the first groove 2511c and the second groove 2512i enclose a closed cavity, and the closed cavity forms a first flow channel 26. The "overlap" here includes the following four situations: first, a part of the orthographic projection of the second groove 2512i on the first surface 2511a overlaps with a part of the first groove 2511c; second, a part of the orthographic projection of the second groove 2512i on the first surface 2511a overlaps with the entire first groove 2511c; third, the entire orthographic projection of the second groove 2512i on the first surface 2511a overlaps with a part of the first groove 2511c; fourth, the orthographic projection of the second groove 2512i on the first surface 2511a completely overlaps with the first groove 2511c.

[0116] The cross section of the first groove 2511c can be square, semicircular, trapezoidal, etc., and the cross section of the second groove 2512i can be square, semicircular, trapezoidal, etc. The shape of the cross section of the first groove 2511c can be the same as or different from the shape of the cross section of the second groove 2512i. In this embodiment, the shape of the cross section of the first groove 2511c is consistent with the shape of the cross section of the second groove 2512i. The shape of the cross section of the first groove 2511c is semicircular, and the diameter of the cross section of the first groove 2511c is equal to the diameter of the cross section of the second groove 2512i. This is only an exemplary description and is not a special limitation of the present application. The first surface 2511a is welded to the second surface 2512h to close the first groove 2511c and the second groove 2512i to prevent the cooling medium 273 in the first groove 2511c and the second groove 2512i from leaking out.

[0117] On the premise that the heat dissipation module 25 occupies the same space in the electronic device 100, the second groove 2512i can increase the volume of the first flow channel 26, and thus the volume of the cooling medium 273 in the first flow channel 26 is also larger. During the use of the electronic device 100, the cooling medium 273 can absorb more heat, which is beneficial to improving the heat dissipation efficiency of the heat dissipation module 25, and thus improving the performance of the electronic device 100. On the premise that the volume of the first flow channel 26 is certain, the second groove 2512i can further reduce the space occupied by the heat dissipation module 25 in the electronic device 100, which is beneficial to the thinning and miniaturization of the heat dissipation module 25, and thus is beneficial to the thinning and miniaturization of the electronic device 100.

[0118] It is worth noting that the second groove 2512i in this embodiment can be a further improvement on the basis of the above embodiment, and can also be used as a separate embodiment. When used as a separate embodiment, the heat conducting plate 2511 may not be provided with the first groove 2511c, and the heat conducting plate 2511 directly covers the second groove 2512i of the heat equalizing member 2512 to form the first flow channel 26.

[0119] See also Fig.12 , Fig.12 for Figure 5aA schematic diagram of the structure of another heat conducting plate 2511 of the heat dissipation module 25 shown. In some embodiments, a second flow channel 261 is formed in the heat conducting plate 2511, and the second flow channel 261 is connected to the first flow channel 26. The first surface 2511a includes a first area A1 and a second area A2 connected to the first area A1. Among them, the first area A1 is the area opposite to the first surface 2511a and the second surface 2512h, that is, the orthographic projection of the first area A1 on the second surface 2512h is located in the second surface 2512h. Specifically, the first area A1 can be the area of ​​the first surface 2511a that fits the second surface 2512h. The first flow channel 26 is arranged in the first area A1. In some embodiments, the second flow channel 261 is arranged in the heat conducting plate 2511 opposite to the second area A2, that is, the orthographic projection of the second flow channel 261 on the second surface 2512h is located in the second area A2. In this way, the heat dissipation module 25 absorbs heat by providing multiple groups of flow channels 272 , that is, the first flow channel 26 and the second flow channel 261 absorb heat together, thereby improving the heat dissipation efficiency of the heat dissipation module 25 and further improving the performance of the electronic device 100 .

[0120] See also Fig.13 , Fig.13 for Figure 5a The front view of the heat conducting plate 2511 of the heat dissipation module 25 is shown in FIG. Fig.13 In the Z-axis direction, at least part of the second flow channel 261 is spaced apart from the first flow channel 26. A multi-layer three-dimensional flow channel 272 is formed inside the heat conducting plate 2511, so that the total volume of the first flow channel 26 and the second flow channel 261 is further increased, and the volume of the cooling medium 273 in the first flow channel 26 and the second flow channel 261 is also larger. The first flow channel 26 and the second flow channel 261 absorb more heat together, thereby improving the heat dissipation efficiency of the heat dissipation module 25, and further improving the performance of the electronic device 100.

[0121] In some embodiments, the arrangement direction of the heat conducting plate 2511 and the heat spreader 2512 is a first direction, that is, a thickness direction of the heat conducting plate 2511. Fig.13 In the Z-axis direction, the heat conducting plate 2511 includes a first portion a and a second portion b stacked along a first direction, the first portion a is close to the heating element 3 and is thermally connected to the heating element 3, and the second portion b is close to the heat spreader 2512. The thickness d1 of the first portion a is greater than or equal to 0.5 microns.

[0122] The first part a is a solid structure without a hollow structure inside. The heat conducting plate 2511 is connected to the heating element 3 by thermal conduction through the first part a. The first part a conducts the heat of the heating element 3 to the whole of the heat conducting plate 2511 more evenly. If the heat conducting plate 2511 is connected to the heating element 3 by thermal conduction through a hollow structure or the first flow channel 26 is arranged on a side close to the heating element 3, it will cause the problem of uneven heat conduction between the heat conducting plate 2511 and the heating element 3. In addition, the thermal resistance of the first part a is smaller than the thermal resistance of the cooling medium 273. The heat conducting connection between the heat conducting plate 2511 and the heating element 3 by the first part a can also improve the efficiency of heat conduction between the heat conducting plate 2511 and the heating element 3, thereby helping to improve the heat dissipation efficiency of the heat dissipation module 25.

[0123] The second part b is located on the side of the first part a away from the heating element 3, and the first part a and the second part b can be an integral structure. The first flow channel 26 and the second flow channel 261 are arranged in the second part b, and part of the inner wall of the second part b forms the inner wall of the first flow channel 26. The heat of the heating element 3 is firstly conducted to the first part a, and the first part a conducts the heat to the whole of the heat conducting plate 2511, that is, the heat is conducted to the second part b through the first part a, and the second part b is used to form the first flow channel 26 and the second flow channel 261, and the cooling medium 273 in the first flow channel 26 and the second flow channel 261 absorbs heat to achieve heat dissipation. In this way, it is conducive to improving the efficiency of heat conduction of the heat of the heating element 3, thereby improving the heat dissipation efficiency of the heat dissipation module 25, and further improving the performance of the electronic device 100.

[0124] In some embodiments, see Fig.14 , Fig.14 for Figure 5a A schematic diagram of the structure of another heat spreader 2512 of the heat dissipation module 25 shown. A third flow channel 263 is also formed in the heat spreader 2512, and the third flow channel 263 is connected to the first flow channel 26. Specifically, the heat spreader 2512 may include a third region C and a fourth region D connected to the third region C, wherein the third region C is the region of the heat spreader 2512 opposite to the heat conducting plate 2511, that is, the orthographic projection of the third region C on the heat conducting plate 2511 overlaps with the first surface 2511a, or the orthographic projection of the third region C on the heat conducting plate 2511 overlaps with the first region A1. The portion of the heat spreader 2512 used to form the first flow channel 26 is located in the third region C. The third flow channel 263 may be arranged in the fourth region D to expand the cooling area of ​​the cooling medium 273. In this way, the heat dissipation module 25 absorbs heat by setting up multiple groups of flow channels 272, that is, the first flow channel 26, the second flow channel 261 and the third flow channel 263 absorb heat together, thereby improving the heat dissipation efficiency of the heat dissipation module 25 and further improving the performance of the electronic device 100.

[0125] In some embodiments, see Fig.15a , Fig.15b and Fig.15c , Fig.15a for Figure 5a A schematic structural diagram of another heat conducting plate 2511 of the heat dissipation module 25 shown; Fig.15b for Figure 5a A schematic structural diagram of another heat conducting plate 2511 of the heat dissipation module 25 shown; Fig.15c for Figure 5a A schematic diagram of the structure of another heat conducting plate 2511 of the heat dissipation module 25 shown. The first flow channel 26, the second flow channel 261 and the third flow channel 263 can extend along a straight line or a curve. Specifically, the first flow channel 26 is S-shaped or spiral, the second flow channel 261 is S-shaped or spiral, and the third flow channel 263 is S-shaped or spiral. The extension paths of the first flow channel 26, the second flow channel 261 and the third flow channel 263 can be the same or different. In this way, within a limited volume, the serpentine or spiral flow channel 272 can further increase the volume of the first flow channel 26, the second flow channel 261 and the third flow channel 263, and further increase the volume of the cooling medium 273. Therefore, the heat dissipation efficiency of the heat dissipation module 25 is further improved, which is also conducive to improving the performance of the electronic device 100.

[0126] Please also read Fig.15d and Fig.16a , Fig.16a for Figure 5a A schematic diagram of the structure of another heat conducting plate 2511 of the heat dissipation module 25 shown. The first flow channel 26 includes a plurality of interconnected sub-segments 26c, and the sub-segment 26c extends along the extension path of the heat equalizer 2512. The extension path of the heat equalizer 2512 refers to the path from the evaporation section 2512d to the condensation section 2512f. Specifically, the extension path of the heat equalizer 2512 can be the upper edge or the lower edge of the heat equalizer 2512 in the Y-axis direction. In other words, the extension path of the sub-segment 26c can be consistent with the extension path of the upper edge or the lower edge. The length of the heat equalizer 2512 on the extension path is larger than the width direction dimension of the heat equalizer 2512. In this way, compared with the first flow channel 26 extending along other directions of the heat equalizer, the first flow channel 26 extends along the extension path of the heat equalizer 2512, which can increase the length of each sub-segment 26c of the first flow channel 26 and reduce the process difficulty. Since the width of the heat spreader 2512 in the Y-axis direction is small, the first flow channel 26 can only be processed into a plurality of small curved segments, which is difficult to process and also increases the flow resistance of the cooling medium in the first flow channel 26. The first flow channel 26 may also include a plurality of connecting segments, and two adjacent sub-segments 26c are connected through the connecting segments.

[0127] In some embodiments, please refer to Fig.15d , Fig.16aand Fig.16b , Fig.15d A schematic diagram of the structure of a heat dissipation module 25 provided in some other embodiments of the present application; Fig.16b for Fig.16a The schematic diagram of the structure of the back side of one of the heat conducting plates 2511 shown. The heat conducting plate 2511 also includes a liquid inlet channel and a liquid outlet channel, and the liquid inlet channel and the liquid outlet channel are respectively connected to the first flow channel 26. The heat conducting plate 2511 also includes a third surface 2511b opposite to the first surface 2511a, the liquid inlet channel runs through the first surface 2511a and the third surface 2511b, and the liquid outlet channel runs through the first surface 2511a and the third surface 2511b. The liquid inlet channel extends to the third surface 2511b to form a liquid inlet 26a, and the liquid outlet channel extends to the third surface 2511b to form a liquid outlet 26b. The cooling medium 273 in the first flow channel 26 can achieve the exchange of the cooling medium 273 through the liquid inlet 26a and the liquid outlet 26b. In one embodiment, the liquid inlet 26a and the liquid outlet 26b can be set on the third surface 2511b. The first surface 2511a is used to form a first flow channel 26. Compared with the first surface 2511a, the third surface 2511b has a larger area for setting the liquid inlet 26a and the liquid outlet 26b. The liquid inlet 26a and the liquid outlet 26b are set on the third surface, which can also avoid interference with the heat equalizer 2512 during installation, further facilitating the layout of electronic components inside the electronic device 100.

[0128] However, this is not a special limitation of the present application, that is, the liquid inlet 26a and the liquid outlet 26b can also be arranged on the first surface 2511a and the side of the heat conducting plate 2511, where the side refers to the surface of the heat conducting plate 2511 connecting the first surface 2511a and the third surface 2511b.

[0129] For further information, please refer back to Figure 4 , and please also refer to Fig.16c , Fig.16c This is a schematic diagram of the structure of the connection between the heat conducting plate 2511 and the driving device 28 in some embodiments of the present application. Fig.16c Figure a is a front view of the heat conducting plate 2511, and Figure b is a rear view of the heat conducting plate 2511. The heat dissipation module 25 also includes a driving device 28, which is used to drive the cooling medium 273 to circulate. Please continue to refer to Fig.15dThe driving device 28 includes an inlet 281 and an outlet 282, wherein the inlet 281 is connected to the liquid outlet 26b, and the outlet 282 is connected to the liquid inlet 26a. The driving device 28 can be a circulation pump, a booster pump, etc. In this way, the cooling medium 273 absorbs heat, so that the heat of the heat conducting plate 2511 is reduced, and the driving device 28 drives the cooling medium 273 to circulate in the first flow channel 26, the second flow channel 261 and the third flow channel 263, thereby achieving the effect of accelerating heat transfer.

[0130] Please continue reading Fig.16c The heat dissipation module 25 further includes a liquid inlet pipeline 283 and a liquid outlet pipeline 284. The driving device 28 includes an inlet 281 and an outlet 282. The liquid inlet pipeline 283 is connected between the outlet 282 and the liquid inlet channel, and the liquid outlet pipeline 284 is connected between the inlet 281 and the liquid outlet channel. The cooling medium flows out through the outlet of the driving device 28 and enters the liquid inlet pipeline 283, and then the cooling medium is connected to the first flow channel 26 through the liquid inlet pipeline 283. After the cooling medium flowing through the first flow channel 26 flows out through the liquid outlet channel, it returns to the driving device 28 through the liquid outlet pipeline 284, and the above process is circulated to absorb heat.

[0131] In some embodiments, please refer back to Fig.16a , the heat dissipation module 25 also includes a first connecting pipeline 2511e, the number of heat conducting plates 2511 is at least two, and the first flow channels 26 of adjacent heat conducting plates 2511 are connected through the first connecting pipeline 2511e. Specifically, the heat conducting plate 2511 may include a first heat conducting plate 2511c and a second heat conducting plate 2511d, and the first flow channels 26 are provided in the first heat conducting plate 2511c and the second heat conducting plate 2511d. The first channel 26 of the first heat conducting plate 2511c is connected with the first flow channel 26 of the second heat conducting plate 2511d through the first connecting pipeline 2511e, and the first connecting pipeline 2511e can be a hose, a copper pipe, etc. In this application, the first connecting pipeline 2511e is described as a hose, but this does not represent a special limitation on this application. The number of the heat conducting plates 2511 is N, and the adjacent heat conducting plates 2511 are connected via the first connecting pipes 2511 e, and the number of the first connecting pipes 2511 e is N-1.

[0132] In this way, the first flow channels 26 are set on multiple heat conducting plates 2511, and the heat on the heat conducting plates 2511 is absorbed by the multiple first flow channels 26, thereby further increasing the total volume of the first flow channels 26. The volume of the cooling medium 273 in the first flow channels 26 is also larger. The first flow channels 26 absorb more heat together, thereby improving the heat dissipation efficiency of the heat dissipation module 25, and further improving the performance of the electronic device 100.

[0133] In some other embodiments, the liquid outlet pipeline 284 is connected between the outlet 282 and the liquid inlet channel, and the liquid inlet pipeline 283 can also be connected to the inlet 281 and an end of the first connecting pipeline 2511e away from the first flow channel 26.

[0134] The heat sink 252 in the heat dissipation module 25 is described in detail below.

[0135] In some embodiments, please refer back to Figure 4 The heat dissipation module 25 further includes a heat sink 252, and the heat spreader 2512 has a condensation section 2512e, which is thermally connected to the heat sink 252. The condensation section 2512f of the heat spreader 2512 forms the condensation section 2512e.

[0136] See also Fig.17 , Fig.17 for Figure 4 Schematic diagram of the structure of the heat sink 252 in the heat dissipation module 25 shown in . The heat sink 252 may include a heat dissipation substrate 252a and a plurality of heat dissipation fins 252b, the heat dissipation substrate 252a is thermally connected to the condensation section 2512f of the heat spreader 2512, each heat dissipation fin 252b is fixed on the heat dissipation substrate 252a, and a plurality of heat dissipation fins 252b are arranged at intervals on the heat dissipation substrate 252a. Exemplarily, the heat dissipation substrate 252a is formed into a rectangular plate-like structure. The length direction of the heat dissipation substrate 252a is parallel to the X-axis direction, the width direction of the heat dissipation substrate 252a is parallel to the Y-axis direction, and the width direction of the heat dissipation substrate 252a is parallel to the Z-axis direction.

[0137] A plurality of heat dissipation fins 252b may be arranged at intervals in the length direction of the heat dissipation substrate 252a. A heat dissipation channel 252c is defined between two adjacent heat dissipation fins 252b. When air flows through the heat dissipation channel 252c, it can exchange heat with the heat dissipation fins 252b, and then the heat on the heat dissipation fins 252b can be brought to the outside of the electronic device 100 through the air.

[0138] Optionally, each heat dissipation fin 252b is arranged perpendicular to the heat dissipation substrate 252a. In this way, the structure of the radiator 252 can be made more compact, which is conducive to increasing the heat dissipation area of ​​the radiator 252, and then the heat dissipation performance of the heat dissipation module 25 can be improved to improve the performance of the electronic device 100. It is understandable that the heat dissipation substrate 252a and the heat dissipation fin 252b can be an integrated structure or a split structure. In addition, the radiator 252 is used to dissipate the heat on the heating element 3. When this demand is met, the radiator 252 can also be other structures, not limited to the present embodiment.

[0139] Please return to Fig.16d , Fig.16d for Figure 5aA schematic diagram of the structure of another heat conducting plate 2511 of the heat dissipation module 25 shown. In some embodiments, the heat dissipation module 25 may also include a second connecting pipeline 271, the second connecting pipeline 271 is located between the condensing section 2512e and the radiator 252, and the second connecting pipeline 271 is connected to the first flow channel 26. When the cooling medium 273 flows to the heat conducting plate 2511 and the heat equalizing member 2512, the heat on the heat conducting plate 2511 and the heat equalizing member 2512 is absorbed. Driven by the driving device 28, the cooling medium 273 circulates in the first flow channel 26, and the cooling medium 273 after absorbing part of the heat flows to the radiator 252. The temperature of the cooling medium 273 is higher than the temperature of the radiator 252, and heat is exchanged between the cooling medium 273 and the radiator 252. During the heat exchange process, the temperature of the cooling medium 273 decreases. Driven by the driving device 28 , the cooling medium 273 continues to flow back to the heat conducting plate 2511 and the heat equalizing member 2512 , and continues the above-mentioned heat absorption process.

[0140] In this way, the first flow channel 26 extends to the radiator 252 , and the radiator 252 dissipates heat from the cooling medium 273 in the first flow channel 26 , further improving the heat dissipation efficiency of the heat dissipation module 25 , thereby improving the performance of the electronic device 100 .

[0141] In some embodiments, the liquid inlet pipeline 283 can also be connected to the outlet 282 and the second connecting pipeline 271, and the liquid outlet pipeline 284 can also be connected to the inlet 281 and one end of the first flow channel 26. The driving device 28 drives the cooling medium to flow in the first flow channel 26, so that the cooling medium 273 absorbs heat, so that the heat of the heat conducting plate 2511 is reduced, and the driving device 28 drives the cooling medium 273 to circulate in the first flow channel 26, the second flow channel 261 and the third flow channel 263, so as to achieve the effect of accelerating heat transfer.

[0142] In some other embodiments, the liquid inlet pipeline 283 and the liquid outlet pipeline 284 can be set on any section of the pipeline connected to the first flow channel 26 to ensure that the driving device 28 drives the cooling medium to flow in the first flow channel 26.

[0143] In some embodiments, please refer back to Figure 4 In order to further improve the heat dissipation performance of the heat dissipation module 25, the heat dissipation module 25 further includes a fan 253. Fig.18 , Fig.18 for Figure 4 The fan 253 in the heat dissipation module 25 is shown in the structure diagram. The fan 253 has a fan 253 inlet 281 and a fan outlet 2531 , and the heat sink 252 is located at the fan outlet 2531 of the fan 253 .

[0144] The fan 253 is arranged in the accommodating space 21a, and the housing 21 of the electronic device 100 also includes a heat dissipation hole and an air inlet. The inlet 281 of the fan 253 is connected to the air inlet, the fan outlet 2531 is connected to the heat dissipation hole, and the radiator 252 is located between the fan outlet 2531 and the heat dissipation hole. The fan 253 is used to drive the airflow from the air inlet to the heat dissipation hole. In this way, driven by the fan 253, the airflow enters the accommodating space 21a from the air inlet, and flows to the fan outlet 2531 through the fan 253 inlet 281 of the fan 253, and the airflow blown out from the fan outlet 2531 flows to the heat dissipation hole after heat exchange with the radiator 252, and is discharged to the outside of the electronic device 100 through the heat dissipation hole. Therefore, by providing the fan 253, the airflow rate in the accommodating space 21a can be increased, thereby improving the heat dissipation performance of the heat dissipation module 25.

[0145] Optionally, the fan outlet 2531 is arranged opposite to the heat dissipation hole. That is, the orthographic projection of the fan outlet 2531 on the plane where the heat dissipation hole is located overlaps with the fan outlet 2531. In this way, after the airflow blown out from the fan outlet 2531 exchanges heat with the radiator 252, it can be blown directly to the heat dissipation hole, which reduces the flow resistance of the airflow and is conducive to reducing the noise of the heat dissipation module 25. At the same time, it can improve the heat exchange efficiency between the airflow and the radiator 252, further improving the heat dissipation performance of the heat dissipation module 25.

[0146] In some embodiments, please refer back to Figure 5a , there are two heat spreaders 2512 and two heat spreaders 252, respectively. For the convenience of description, the two heat spreaders 2512 are respectively referred to as "first heat spreader" and "second heat spreader", and the two heat spreaders 252 are respectively referred to as "first heat spreader" and "second heat spreader". The evaporation section 2512d of the first heat spreader 2512 and the evaporation section 2512d of the second heat spreader 2512 are both connected to the heat conducting plate 2511, and the evaporation section 2512d of the first heat spreader 2512 and the evaporation section 2512d of the second heat spreader 2512 are spaced apart from each other. The condensation section 2512f of the first heat spreader 2512 and the condensation section 2512f of the second heat spreader 2512 extend in directions away from each other. The first radiator is connected to the condensation section 2512f of the first heat spreader 2512, and the second radiator is connected to the condensation section 2512f of the second heat spreader 2512. Therefore, by providing two heat spreaders 2512 (ie, a first heat spreader 2512 and a second heat spreader 2512 ) and two heat sinks 252 (ie, a first heat sink and a second heat sink), the heat dissipation performance of the heat dissipation module 25 can be improved, thereby improving the performance of the electronic device 100 .

[0147] When the heat dissipation module 25 is in use, the heat dissipation method of the heat dissipation module 25 includes the following steps:

[0148] The central processing unit detects the overclocking mode of the electronic device 100 and controls the driving device 28 to start, and the driving device 28 drives the cooling medium 273 to flow in the first flow channel 26 .

[0149] The central processing unit obtains a first temperature, which is the temperature of the heating element. The first temperature can be detected by setting a temperature sensor, and the temperature sensor measures the first temperature in real time.

[0150] If the first temperature is less than the threshold temperature, the drive device 28 is controlled to stop working; if the first temperature is greater than the threshold temperature, the drive device 28 continues to work. There are two specific situations here. First, if the first temperature is less than or equal to the threshold temperature, the drive device 28 is controlled to stop working; if the first temperature is greater than the threshold temperature, the drive device 28 continues to work. Second, if the first temperature is less than the threshold temperature, the drive device 28 is controlled to stop working; if the first temperature is greater than or equal to the threshold temperature, the drive device 28 continues to work. One of the above two situations can be selected. The threshold temperature can be greater than or equal to 50 degrees and less than or equal to 80 degrees.

[0151] The temperature rise time of the CPU reaching the limit temperature is tested when the electronic device 100 has the heat dissipation module 25 or not. Fig.19 And Table 1, Fig.19 It is a comparison chart of the temperature rise time for the CPU to reach the limit temperature when the electronic device 100 of the present application has the above-mentioned heat dissipation module 25 and does not have the above-mentioned heat dissipation module 25. Table 1 compares the temperature rise time of the existing heat dissipation module 25 and the above-mentioned heat dissipation module 25. Fig.19 The curve No. 1 in the figure refers to the temperature rise time curve of the CPU reaching the limit temperature when the heat dissipation module 25 is provided. Fig.19 The curve No. 2 in the figure refers to the temperature rise time curve of the CPU reaching the limit temperature when the existing heat dissipation module 25 is provided. The basic power consumption of the electronic device 100 is 10W, and the power consumption of the overclocking mode is set to 15W. First, operate under the basic power consumption condition to make the CPU chip reach a basic temperature of about 90°C, and then operate the CPU chip under the power consumption of the overclocking mode. Take 98.2°C as the limit temperature of the CPU. Observe the temperature rise time to reach 98.2°C with or without the above-mentioned heat dissipation module 25, and the temperature rise time to reach 98.2°C after setting the above-mentioned heat dissipation module 25. After the electronic device 100 is in the power consumption of the overclocking mode, the above-mentioned heat dissipation module 25 starts to work, and the heat dissipation module 25 dissipates the heat for the electronic device 100. The time for the electronic device 100 to heat up to 98.2°C under the heat dissipation effect of the heat dissipation module 25 reaches 337s, which increases the high-power operation time by 100s compared with the system without liquid cooling.

[0152] Therefore, the heat dissipation efficiency of the heat dissipation module 25 is higher, which is conducive to improving the performance of the electronic device 100. After the electronic device 100 reaches the limit temperature of 98.2°C, it enters the basic power consumption working state. At this time, the temperature of the electronic device 100 is still at a relatively high temperature, and the heat dissipation module 25 continues to work until the temperature of the electronic device 100 drops to the threshold temperature, and the heat dissipation module 25 stops working. After the electronic device 100 enters the next round of overclocking mode, the heat dissipation module 25 repeats the above working process.

[0153] Table 1 Comparison of the heating time between the existing heat dissipation module and the above heat dissipation module

[0154] Existing heat dissipation module Having the above heat dissipation module Initial temperature / ℃ 88.7 88.2 First time / s 0 0 Limit temperature / ℃ 98.2 98.2 Heating time / s 237 337

[0155] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0156] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation module, characterized in that: include: Heat conducting plate; A heat spreader, the heat spreader is located on one side of the heat conducting plate and is thermally connected to the heat conducting plate; A first flow channel, wherein the first flow channel is located between the heat conducting plate and the heat equalizing member; The heat conducting plate has a first surface facing the heat equalizing member, the first flow channel extends on the first surface, a portion of the inner wall of the first flow channel is formed by the first surface, and a cooling medium is arranged in the first flow channel.

2. The heat dissipation module according to claim 1, characterized in that: Part of the inner wall of the first flow channel is formed by the heat equalizing member.

3. The heat dissipation module according to claim 1 or 2, characterized in that: The first surface is provided with a first groove, the opening of the first groove faces the heat equalizing member, and the opening of the first groove is closed to form the first flow channel.

4. The heat dissipation module according to claim 3, characterized in that: The heat spreader has a second surface facing the heat conducting plate, the second surface covers the opening of the first groove and forms the first flow channel with the first groove.

5. The heat dissipation module according to claim 4, characterized in that: The second surface is provided with a second groove, the orthographic projection of the second groove on the first surface overlaps with the first groove, and the first groove and the second groove enclose the first flow channel.

6. The heat dissipation module according to claim 2, characterized in that: The heat conducting plate has a first surface facing the heat spreader; The heat spreader has a second surface facing the heat conducting plate, the second surface is provided with a second groove, the opening of the second groove faces the heat conducting plate, and the first surface covers the opening of the second groove and forms the first flow channel with the second groove.

7. The heat dissipation module according to any one of claims 1 to 6, characterized in that: A second flow channel is formed in the heat conducting plate, the entire inner wall of the second flow channel is formed by the heat conducting plate, and the second flow channel is connected to the first flow channel.

8. The heat dissipation module according to claim 7, characterized in that: In the thickness direction of the heat conducting plate, at least a portion of the second flow channel is spaced apart from the first flow channel.

9. The heat dissipation module according to any one of claims 1 to 8, characterized in that: The heat conducting plate comprises a first part and a second part which are stacked, the first part is located on a side of the second part away from the heat spreader, the thickness of the first part is greater than or equal to 0.5 microns, and the first flow channel is located on the second part.

10. The heat dissipation module according to any one of claims 1 to 9, characterized in that: A third flow channel is formed in the heat equalizing member, and the third flow channel is connected to the first flow channel.

11. The heat dissipation module according to any one of claims 1 to 10, characterized in that: The first flow channel includes a plurality of sub-segments that are interconnected, and the sub-segments extend along an extension path of the heat equalizing member.

12. The heat dissipation module according to any one of claims 1 to 11, characterized in that: The heat conducting plate further comprises a liquid inlet channel and a liquid outlet channel, and the liquid inlet channel and the liquid outlet channel are respectively connected to the first flow channel.

13. The heat dissipation module according to claim 12, characterized in that: The heat conducting plate further includes a third surface disposed opposite to the first surface, the liquid inlet channel runs through the first surface and the third surface, and the liquid outlet channel runs through the first surface and the third surface.

14. The heat dissipation module according to claim 12, characterized in that: The heat conducting plate further includes a third surface disposed opposite to the first surface, and a side surface connected between the first surface and the third surface, and the liquid inlet channel and the liquid outlet channel are disposed on the side surface.

15. The heat dissipation module according to any one of claims 12 to 14, characterized in that: The heat dissipation module also includes a driving device, which is connected to the first flow channel and is used to drive the cooling medium to circulate.

16. The heat dissipation module according to claim 15, characterized in that: The heat dissipation module also includes a liquid inlet pipeline and a liquid outlet pipeline, the driving device includes an inlet and an outlet, the liquid inlet pipeline is connected between the outlet and the liquid inlet channel, and the liquid outlet pipeline is connected between the inlet and the liquid outlet channel.

17. The heat dissipation module according to any one of claims 1 to 16, characterized in that: The heat dissipation module further includes a first connecting pipeline. The number of the heat conducting plates is at least two, and the first flow channels of adjacent heat conducting plates are connected through the first connecting pipeline.

18. The heat dissipation module according to any one of claims 1 to 17, characterized in that: The heat dissipation module also includes a radiator, and the heat equalizing element includes an evaporation section and a condensation section. The evaporation section is thermally connected to the heat conduction plate, and the condensation section is thermally connected to the radiator.

19. The heat dissipation module according to claim 18, characterized in that: The heat dissipation module further includes a second connecting pipeline, which is located between the condensing section and the radiator, and is communicated with the first flow channel.

20. The heat dissipation module according to claim 19, characterized in that: The heat dissipation module also includes a driving device, which is connected to the second connecting pipeline and is used to drive the cooling medium to circulate.

21. A heat dissipation module, characterized in that: include: A heat conducting plate, the heat conducting plate being used for heat conduction connection with the heating element; A heat spreader, the heat spreader is located on a side of the heat conducting plate away from the heating element and is thermally connected to the heat conducting plate; The first flow channel is located between the heat conducting plate and the heat equalizing member, and a portion of the inner wall of the first flow channel is formed by the heat equalizing member. A cooling medium is arranged in the first flow channel.

22. An electronic device, characterized in that: include: A housing having a receiving space; The heat dissipation module according to any one of claims 1 to 21; A heating element is disposed in the accommodating space, the heating element is located on a side of the heat conducting plate away from the heat spreading member, and is thermally connected to the heat conducting plate.

23. A heat dissipation method, characterized in that: Applied to electronic equipment, the electronic equipment comprises a housing, a heating element and a heat dissipation module, the housing has a containing space; the heating element and the heat dissipation module are arranged in the containing space; the heat dissipation module comprises a heat conducting plate, a heat spreader, a first flow channel and a driving device, the heat conducting plate is used for heat conduction connection with the heating element; the heat spreader is located on a side of the heat conducting plate away from the heating element and is heat conduction connected with the heat conducting plate; the first flow channel is located between the heat conducting plate and the heat spreader, and part of the inner wall of the first flow channel is formed by the heat conducting plate, and a cooling medium is arranged in the first flow channel; The driving device is used to drive the cooling medium to circulate; The method comprises: When the electronic device enters the overclocking mode, controlling the driving device to start, the driving device drives the cooling medium to flow in the first flow channel; Acquire a first temperature, where the first temperature is the temperature of the heating element; If the first temperature is lower than the threshold temperature, the driving device is controlled to stop working; if the first temperature is higher than the threshold temperature, the driving device continues to work.

24. The method according to claim 23, characterized in that The threshold temperature is greater than or equal to 50 degrees and less than or equal to 80 degrees.

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