An all-liquid-cooled server based on a one-in-multiple-out manifold microchannel

Abstract

A kind of all-liquid cooling server based on one-in multi-out manifold microchannel, including mainboard, CPU, memory bar, GPU, hard disk, SSD and power supply;The server is equipped with liquid inlet and liquid outlet on the chassis;CPU is installed with multiple outlet manifold microchannel radiator;Multiple outlet manifold microchannel radiator includes multiple radiator units, and multiple radiator units share a first cooling liquid inlet;First cooling liquid outlet is equipped at radiator unit;Memory bar, GPU, hard disk, SSD and power supply are equipped with heat exchange cooling device;Second cooling liquid inlet and second cooling liquid outlet are equipped on heat exchange cooling device;Cooling liquid flows out from first cooling liquid outlet, flows into heat exchange cooling device through second cooling liquid inlet;Cooling liquid flows out from second cooling liquid outlet, and flows out from liquid outlet.The present application aims to optimize the structure design of liquid cooling system, improve cooling efficiency, reduce liquid flow resistance, ensure the uniformity of cooling effect, so as to realize efficient heat dissipation.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electronic equipment, specifically a full liquid cooling server based on a one-inlet and multiple-outlet manifold microchannel, which aims to evenly distribute the cooling liquid to the four microchannels of a cold plate through a one-inlet and four-outlet structure. Background Art

[0002] With the rapid development of information technology, the computing power of computer servers, especially those in data centers, continues to increase. At the same time, the heat dissipation challenges associated with high-performance computing are becoming increasingly prominent. Traditional air cooling systems are gradually failing to meet the cooling requirements of modern high-density servers. This is especially true given the increasing power consumption of components like processors and graphics cards, making it difficult to achieve efficient heat dissipation solely through air cooling.

[0003] Liquid cooling technology, a superior cooling method to air cooling, rapidly dissipates heat generated by electronic components through the thermal conductivity of liquid. It is widely used in supercomputing centers, big data centers, gaming servers, and other fields. However, existing liquid cooling solutions often rely on simple liquid circulation pipes, which suffer from low heat dissipation efficiency, poor cooling uniformity, and high liquid flow resistance, making them unable to meet the growing cooling needs of high-performance servers.

[0004] Therefore, how to design an efficient, uniform, and low-resistance liquid cooling system has become an important direction for solving the heat dissipation problem of high-performance servers. Summary of the Invention

[0005] The purpose of the present invention is to provide a fully liquid-cooled server based on a one-inlet and multiple-outlet manifold microchannel, aiming to improve cooling efficiency, reduce liquid flow resistance, and ensure uniformity of cooling effect by optimizing the structural design of the liquid cooling system, thereby achieving efficient heat dissipation.

[0006] The technical solution adopted by the present invention is:

[0007] A full liquid-cooled server based on a one-inlet-multiple-outlet manifold microchannel comprises a motherboard and a CPU, a memory stick, a GPU, a hard disk, an SSD and a power supply mounted on the motherboard; a liquid inlet and a liquid outlet are provided on a chassis of the server; a multi-outlet manifold microchannel radiator is installed on the CPU; the multi-outlet manifold microchannel radiator comprises a plurality of radiator units, and the plurality of radiator units share a first cooling liquid inlet; cooling liquid flows in from the liquid inlet and flows into each radiator unit through the first cooling liquid inlet; a first cooling liquid outlet is provided at each radiator unit; a heat exchange cooling device is respectively installed on the memory stick, the GPU, the hard disk, the SSD and the power supply; a second cooling liquid inlet and a second cooling liquid outlet are provided on the heat exchange cooling device; cooling liquid flows out from the first cooling liquid outlet and flows into the heat exchange cooling device through the corresponding second cooling liquid inlet; cooling liquid in the heat exchange cooling device flows out from the second cooling liquid outlet and finally flows out from the liquid outlet.

[0008] Preferably, the multi-outlet manifold microchannel radiator is connected to the motherboard via pins; the multi-outlet manifold microchannel radiator further comprises a cover plate, a mounting box and a VC heat spreader; the lower surface of the VC heat spreader is in direct contact with the CPU; the mounting box is a three-dimensional structure lacking a top surface, and the mounting box is arranged on top of the VC heat spreader; transverse and / or longitudinal partitions are arranged in the cavity of the mounting box; the partitions divide the cavity into a group of cavity units, and a plurality of liquid outlet holes are arranged at intervals corresponding to each cavity unit on the side wall of the mounting box; The outside of the installation box is provided with outlet sleeves corresponding to the multiple liquid outlets of each cavity unit, and the coolant discharged from the multiple liquid outlets is concentrated in the outlet sleeve; the radiator unit is correspondingly installed in the cavity unit; the radiator unit is divided into two layers, the upper layer is the manifold diversion structure layer, and the lower layer is the manifold microchannel structure layer; the cover plate covers the top of the installation box, and the first coolant inlet is set in the middle of the plate surface of the cover plate; the coolant enters the cavity from the first coolant inlet, and is evenly diverted to the manifold microchannel structure layer through the manifold diversion structure layer.

[0009] Preferably, the manifold diversion structure layer is plate-shaped; at least three coolant diversion ports are arranged in parallel and spaced apart on the manifold diversion structure layer, and each coolant diversion port is in the shape of a long strip; coolant sub-outlets are respectively provided at both ends of the portion between each adjacent coolant diversion port on the manifold diversion structure layer; the liquid outlet hole on the mounting box is arranged corresponding to the coolant sub-outlet; the coolant is discharged from the coolant sub-outlet and the corresponding liquid outlet hole after heat exchange through the manifold microchannel structure layer, merges into the outlet sleeve, and is discharged from the outlet of the outlet sleeve.

[0010] Preferably, the manifold microchannel structure layer comprises at least three first flow guide ribs arranged in parallel and spaced apart; the first flow guide ribs are connected to the bottom plate of the mounting box, and the two ends of the first flow guide ribs are connected to the side walls on both sides of the mounting box; the first flow guide ribs are flat rib plates or wave-shaped rib plates or columnar ribs, the rib plate thickness is 1-2mm, and the height is not less than 4mm.

[0011] Preferably, when the heat exchange cooling device is installed on a GPU or a hard disk or an SSD or a power supply, the heat exchange cooling device comprises a flat microchannel radiator; the second cooling liquid inlet and the second cooling liquid outlet are respectively arranged on the flat microchannel radiator.

[0012] Preferably, when the heat exchange cooling device is installed on a memory bank, the heat exchange cooling device comprises a flat microchannel radiator and a liquid collecting cavity; the flat microchannel radiator is attached to the two sides of the memory bank respectively, each flat microchannel radiator is in communication with the liquid collecting cavity, and the second cooling liquid inlet and the second cooling liquid outlet are respectively arranged on the liquid collecting cavity.

[0013] Preferably, the heat exchange cooling device comprises a flat microchannel radiator and a liquid collecting cavity; the flat microchannel radiator is attached to the hardware to be cooled, and the flat microchannel radiator is in communication with the liquid collecting cavity.

[0014] The second cooling liquid inlet and the second cooling liquid outlet are respectively arranged on the liquid collecting cavity.

[0015] Preferably, the flat microchannel radiator is a rectangular solid structure surrounded by a wall plate, and a second flow guide rib is arranged in the internal cavity of the flat microchannel radiator.

[0016] Preferably, the second flow guide rib is provided in multiple groups, the multiple groups of second flow guide ribs are arranged in the cavity of the flat microchannel radiator, and the channel surrounded by the wall plate of the flat microchannel radiator is a Z-shaped channel, an S-shaped channel or a back-shaped channel.

[0017] The present application has at least the following beneficial effects:

[0018] 1. The present application adopts a full-liquid cooling server with one-in and multiple-out manifold microchannels, the heat of the CPU is divided into multiple parts, the cooling liquid can be uniformly distributed to multiple radiator units, the uniformity of the cooling liquid flow is ensured, and the overall heat dissipation efficiency is improved; and each part has a separate cooling liquid outlet, compared with other microchannel radiators, this scheme can avoid the problem that the water temperature at the outlet of the radiator is too high to affect the subsequent heat dissipation.

[0019] 2. Because each component of a fully liquid-cooled server with a single-inlet, multi-outlet manifold microchannel removes only one-Nth of the CPU's heat, the coolant temperature at each component's outlet remains low, allowing heat to be dissipated by other components. This single-inlet, multi-outlet manifold microchannel fully liquid-cooled server makes full liquid cooling possible, avoiding the problem of high coolant outlet temperatures and inability to dissipate heat for other components, as seen with other microchannel radiators.

[0020] 3. Each part of the full liquid cooling server with one-inlet and multiple-outlet manifold microchannels of the present invention adopts a manifold structure, which can reduce the flow distance of the coolant in the radiator, which is beneficial to reduce the resistance loss along the way, thereby reducing the pump work and improving the overall efficiency of the system; in addition, the microchannel design of the present invention ensures that the coolant can contact the heat source to the greatest extent, increases the surface area of ​​heat exchange, thereby enhancing the heat conduction effect and further improving the heat dissipation capacity.

[0021] 4. The server of the present invention adopts a full liquid cooling solution. The CPU, memory bar, GPU, hard disk, SSD, power supply and other modules all adopt liquid cooling, which has high heat dissipation efficiency and low noise than air-cooled servers (or air-liquid hybrid cooling servers); the liquid cooling design has a compact structure and can adapt to the space requirements of high-density servers. It is suitable for various forms of server chassis and has strong adaptability. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 It is a rear view of the overall structure of the full liquid cooling server of the present invention.

[0024] Figure 2 It is a front view of the overall structure of the full liquid cooling server of the present invention.

[0025] Figure 3 This is a schematic diagram of the overall structure of the multi-outlet manifold microchannel radiator in the present invention.

[0026] Figure 4 This is an exploded view of the multi-outlet manifold microchannel radiator of the present invention.

[0027] Figure 5 This is a schematic diagram of the cover structure of the multi-outlet manifold microchannel radiator in the present invention.

[0028] Figure 6 This is a schematic diagram of the outlet sleeve structure of the multi-outlet manifold microchannel radiator in the present invention.

[0029] Figure 7 It is a structural schematic diagram of the radiator unit in the present invention.

[0030] Figure 8 Schematic diagram of the internal flow channel of the radiator unit in the present invention.

[0031] Figure 9 This is a schematic diagram of the internal structure of the flat-plate microchannel radiator in the present invention.

[0032] Figure 10 Schematic diagram of the internal flow channel of the flat-plate microchannel radiator in the present invention.

[0033] Figure 11 This is a schematic diagram of the structure in which the heat exchange device structure of the present invention is arranged on the memory bar.

[0034] Figure 12 Schematic diagram of the heat exchange device and flow channel at the hard disk in the present invention.

[0035] Figure 13 This is a schematic diagram of the structure of the pin connection on the multi-outlet manifold microchannel radiator in the present invention.

[0036] Figure 14 This is a schematic diagram of the overall piping connections and flow channels of the fully liquid-cooled server in the present invention.

[0037] Figure 15 This is a schematic planar structural diagram of the first guide rib installed in the cavity unit in the present invention.

[0038] Reference numerals 1 - motherboard; 2 - liquid inlet; 3 - liquid outlet; 4 - CPU; 5 - memory module; 6 - GPU; 7 - hard disk; 8 - SSD; 9 - power supply; 10 - multi-outlet manifold microchannel radiator; 101 - radiator unit; 11 - cover plate; 12 - manifold diversion structure layer; 13 - manifold microchannel structure layer; 14 - VC heat sink; 15 - outlet sleeve; 16 - first coolant outlet; 17 - liquid collection box, 24 - Flat microchannel radiator; 25 - liquid collecting chamber; 26 - second coolant inlet; 27 - second coolant outlet; 28 - liquid inlet pipe; 29 - liquid outlet pipe; 30 - connecting pipe; 46 - pin; 47 - coolant diversion port; 48 - first guide rib; 49 - coolant sub-outlet; 50 - second guide rib; 111 - first coolant inlet, 51 - mounting box, 52 - partition, 53 - cavity unit, 54 - liquid outlet. DETAILED DESCRIPTION

[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of the present invention.

[0040] As a possible embodiment of the present invention, Figure 1-15 As shown, this fully liquid-cooled server based on a one-inlet, multiple-outlet manifold microchannel includes a motherboard 1 and a CPU 4, a memory stick 5, a GPU 6, a hard disk 7, an SSD 8, and a power supply 9 mounted on the motherboard 1; a liquid inlet 2 and a liquid outlet 3 are provided on the server chassis. Specifically, the motherboard 1 is mounted on the server chassis, and the liquid inlet 2 and the liquid outlet 3 are provided on the server chassis; two CPUs 4 are spaced apart along the middle horizontal axis of the motherboard 1, a memory stick 5 is provided between the two CPUs 4, and a memory stick 5 is provided on each side of the two CPUs 4; two GPUs 6 are provided, located on the front side of the motherboard 1, near the liquid inlet 2 and the liquid outlet 3; the SSD 8 and the power supply 9 are located on the left and right sides of the two GPUs 6, respectively; and the hard disk 7 is provided on the side of the motherboard 1 away from the liquid inlet 2 and the liquid outlet 3.

[0041] A multi-outlet manifold microchannel radiator 10 is installed on the CPU 4; in this embodiment, a multi-outlet manifold microchannel radiator 10 is installed on each CPU 4; the multi-outlet manifold microchannel radiator 10 is connected to the motherboard 1 through a pin 46; the multi-outlet manifold microchannel radiator 10 includes a cover plate 11, an installation box 51, a VC heat spreader 14 and a plurality of radiator units 101; the VC heat spreader 14 Vapor Chamber, also known as vacuum chamber heat spreader heat dissipation, temperature spreader or heat spreader; the lower surface of the VC heat spreader 14 is in direct contact with the CPU 4; the installation box 51 is a three-dimensional structure without a top surface, and the installation box 51 is arranged on the top of the VC heat spreader 14; horizontal and / or vertical partitions 52 are arranged in the cavity of the installation box 51; the partitions 52 divide the cavity into a group of cavity units 53. In this embodiment, transverse and longitudinal partitions 52 are provided in the cavity enclosed by the mounting box 51 and the VC heat spreader 14, and the partitions 52 divide the cavity into four cavity units 53. The radiator unit 101 is correspondingly installed in the cavity unit 53; four radiator units 101 are provided, and are respectively installed in the four cavity units 53. The radiator unit 101 is divided into two layers, the upper layer is the manifold diversion structure layer 12, and the lower layer is the manifold microchannel structure layer 13; a first coolant outlet 16 is provided at each radiator unit 101; the cover plate 11 covers the top of the mounting box 51, and a first coolant inlet 111 is provided in the middle of the plate surface of the cover plate 11; the coolant enters the four cavity units 53 from the first coolant inlet 111, and is evenly diverted to the manifold microchannel structure layer 13 through the manifold diversion structure layer 12. A plurality of liquid outlet holes 54 are arranged at intervals on the side wall of the mounting box 51 corresponding to each cavity unit 53. The liquid outlet holes 54 may be two, three, four, etc., and are two in this embodiment. An outlet sleeve 15 is provided on the outside of the mounting box 51 corresponding to the plurality of liquid outlet holes 54 of each cavity unit 53. The outlet sleeve 15 includes a liquid collecting box 17. The liquid collecting box 17 is a rectangular three-dimensional structure lacking a front side surface. The liquid collecting box 17 is fixedly connected to the front side wall or the rear side wall of the mounting box 51 and covers the two liquid outlet holes 54 therein. The coolant discharged from the plurality of liquid outlet holes 54 is concentrated in the liquid collecting box 17. The first coolant outlet 16 is connected to the middle of the outer side surface of the mounting box 51 for discharging the coolant collected in the liquid collecting box 17.

[0042] The memory stick 5, GPU 6, hard disk 7, SSD 8 and power supply 9 are respectively installed with heat exchange cooling devices; when the heat exchange cooling device is installed on the GPU 6 or hard disk 7 or SSD 8 or power supply 9, the heat exchange cooling device includes a flat microchannel radiator 24; the second coolant inlet 26 and the second coolant outlet 27 are respectively provided on the flat microchannel radiator 24. When the hardware to be cooled is the hard disk 7, and there are at least two hard disks 7 stacked, a flat microchannel radiator 24 is provided between the two adjacent hard disks 7 and on the top of the top hard disk 7, and the upper and lower adjacent flat microchannel radiators 24 are connected, the second coolant inlet 26 is provided on the bottom flat microchannel radiator 24, and the second coolant outlet 27 is provided on the top flat microchannel radiator 24, as shown in FIG. Figure 12 When the heat exchange cooling device is installed on the memory stick 5, the two sides of the memory stick 5 are respectively provided with flat micro-channel radiators 24, and each flat micro-channel radiator 24 is connected to the liquid collecting cavity 25, as shown. Figure 10 As shown, the second coolant inlet 26 and the second coolant outlet 27 are respectively on the liquid collecting chamber 25; the coolant flows out from the first coolant outlet 16 and flows into the heat exchange cooling device through the corresponding second coolant inlet 26; the coolant in the heat exchange cooling device flows out from the second coolant outlet 27 and finally flows out from the liquid outlet 3.

[0043] In this embodiment, a multi-outlet manifold microchannel radiator 10 is provided on each of the two CPUs 4, and there are two first coolant inlets 111 in the entire device, namely first coolant inlet No. 1 and first coolant inlet No. 2; four radiator units 101 are provided in each multi-outlet manifold microchannel radiator 10, and a first coolant outlet 16 is provided on each radiator unit 101; therefore, eight first coolant outlets 16 are provided on the two multi-outlet manifold microchannel radiators 10, namely first coolant outlet No. 1, first coolant outlet No. 2, first coolant outlet No. 3, first coolant outlet No. 4, first coolant outlet No. 5, first coolant outlet No. 6, first coolant outlet No. 7, and first coolant outlet No. 8. At the same time, heat exchange cooling devices are respectively provided on the three memory sticks 5, the two GPUs 6, the hard disk 7, the SSD 8 and the power supply 9, and each heat exchange cooling device is provided with a second coolant inlet 26 and a second coolant outlet 27; a total of eight second coolant inlets 26 and eight second coolant outlets 27, namely, second coolant inlet No. 1 and second coolant outlet No. 1, second coolant inlet No. 2 and second coolant outlet No. 2, second coolant inlet No. 3 and second coolant outlet No. 3, second coolant inlet No. 4 and second coolant outlet No. 4, second coolant inlet No. 5 and second coolant outlet No. 5, second coolant inlet No. 6 and second coolant outlet No. 6, second coolant inlet No. 7 and second coolant outlet No. 7, and second coolant inlet No. 8 and second coolant outlet No. 8.

[0044] In this embodiment, a liquid input pipe 28 is provided between the liquid inlet 2 and the first coolant inlet 111; a connecting pipe 30 is provided between the first coolant outlet 16 and the corresponding second coolant inlet 26; and a liquid output pipe 29 is provided between the second coolant outlet 27 and the liquid outlet 3.

[0045] Therefore, in this embodiment, there are 8 coolant flow pipelines:

[0046] Pipeline 1: liquid inlet 2-first coolant inlet No. 1-first coolant outlet No. 1-second coolant inlet No. 1-second coolant outlet No. 1-liquid outlet 3.

[0047] Pipeline 2: liquid inlet 2-first coolant inlet No. 1-first coolant outlet No. 2-second coolant inlet No. 2-second coolant outlet No. 2-liquid outlet 3.

[0048] Pipeline 3: liquid inlet 2-first coolant inlet No. 1-first coolant outlet No. 3-second coolant inlet No. 3-second coolant outlet No. 3-liquid outlet 3.

[0049] Pipeline 4: liquid inlet 2-first coolant inlet No. 1-first coolant outlet No. 4-second coolant inlet No. 4-second coolant outlet No. 4-liquid outlet 3.

[0050] Pipeline 5: liquid inlet 2-first coolant inlet No. 2-first coolant outlet No. 5-second coolant inlet No. 5-second coolant outlet No. 5-liquid outlet 3.

[0051] Pipeline 6: liquid inlet 2-first coolant inlet No. 2-first coolant outlet No. 6-second coolant inlet No. 6-second coolant outlet No. 6-liquid outlet 3.

[0052] Pipeline 7: liquid inlet 2-first coolant inlet No. 2-first coolant outlet No. 7-second coolant inlet No. 7-second coolant outlet No. 7-liquid outlet 3.

[0053] Pipeline 8: liquid inlet 2-first coolant inlet No. 2-first coolant outlet No. 8-second coolant inlet No. 8-second coolant outlet No. 8-liquid outlet 3.

[0054] In this embodiment, the manifold diversion structure layer 12 is plate-shaped; at least three coolant diversion ports 47 are arranged in parallel and spaced apart on the manifold diversion structure layer 12, and each coolant diversion port 47 is in the shape of a long strip; on the manifold diversion structure layer 12, a coolant sub-outlet 49 is respectively provided at both ends of the portion between each adjacent coolant diversion port 47; the coolant sub-outlet 49 is a strip-shaped groove arranged at the bottom of the portion between adjacent coolant diversion ports 47; the liquid outlet 54 on the mounting box 51 is arranged corresponding to the coolant sub-outlet 49; after heat exchange through the manifold microchannel structure layer 13, the coolant is discharged from the coolant sub-outlet 49 and the corresponding liquid outlet 54, merges into the outlet sleeve 15, and is discharged from the outlet of the outlet sleeve 15.

[0055] In this embodiment, the manifold microchannel structure layer 13 includes at least three first guide ribs 48 arranged in parallel and spaced apart; the first guide ribs 48 are connected to the bottom plate of the mounting box 51, and the two ends of the first guide ribs 48 are respectively connected to the side walls on both sides of the mounting box 51; the first guide ribs 48 are straight ribs or wavy ribs or columnar ribs, the rib thickness is 1-2 mm, and the height is not less than 4 mm.

[0056] In this embodiment, the flat-plate microchannel radiator 24 is a rectangular three-dimensional structure surrounded by wall panels, and second guide ribs 50 are arranged in the internal cavity of the flat-plate microchannel radiator 24; two groups of second guide ribs 50 are provided, and the channels surrounded by the two groups of second guide ribs 50 and the wall panels of the flat-plate microchannel radiator 24 are multi-stage S-shaped channels; the two groups of second guide ribs 50 are respectively connected to the side walls on opposite sides of the flat-plate microchannel radiator 24, and are arranged in staggered intervals; one end of the second guide rib 50 is fixedly connected to the side wall on the corresponding side, and a gap for the circulation of coolant is left between one end of the second guide rib 50 and the side wall on the opposite side; the second guide rib 50 is a straight rib plate or a wavy rib or a columnar rib.

[0057] Of course, in other embodiments, the channel enclosed by the second guide ribs 50 and the sidewalls of the flat microchannel heat sink 24 may also be a multi-stage Z-shaped channel or a U-shaped channel.

[0058] In addition, the above figures are only schematic illustrations of the processes included in the method according to the exemplary embodiment of the present invention, and are not intended to be limiting. It is easy to understand that the processes shown in the above figures do not indicate or limit the time sequence of these processes.

[0059] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A fully liquid-cooled server based on a one-inlet-multiple-outlet manifold microchannel, comprising a motherboard (1) and a CPU (4), a memory stick (5), a GPU (6), a hard disk (7), an SSD (8), and a power supply (9) mounted on the motherboard (1); a liquid inlet (2) and a liquid outlet (3) are provided on the chassis of the server; and the server is characterized in that: The CPU (4) is provided with a multi-outlet manifold microchannel radiator (10); the multi-outlet manifold microchannel radiator (10) includes a plurality of radiator units (101), and the plurality of radiator units (101) share a first cooling liquid inlet (111); the cooling liquid flows in from the liquid inlet (2) and flows into each radiator unit (101) through the first cooling liquid inlet (111); a first cooling liquid outlet (16) is provided at each radiator unit (101); the memory stick (5), GPU (6), hard disk (7), SSD (8) and power supply (9) are respectively provided with a heat exchange cooling device; the heat exchange cooling device is provided with a second cooling liquid inlet (26) and a second cooling liquid outlet (27); the cooling liquid flows out from the first cooling liquid outlet (16) and flows into the heat exchange cooling device through the corresponding second cooling liquid inlet (26); the cooling liquid in the heat exchange cooling device flows out from the second cooling liquid outlet (27) and finally flows out from the liquid outlet (3), the multi-outlet manifold The microchannel radiator (10) is connected to the motherboard (1) via a pin (46); the multi-outlet manifold microchannel radiator (10) further comprises a cover plate (11), a mounting box (51) and a VC heat spreader (14); the lower surface of the VC heat spreader (14) is in direct contact with the CPU (4); the mounting box (51) is a three-dimensional structure lacking a top surface, and the mounting box (51) is arranged on top of the VC heat spreader (14); a transverse and / or longitudinal partition (52) is arranged in the cavity of the mounting box (51) The partition (52) divides the cavity into a group of cavity units (53), and a plurality of liquid outlet holes (54) are arranged at intervals on the side wall of the installation box (51) corresponding to each cavity unit (53); an outlet sleeve (15) is provided on the outside of the installation box (51) and corresponding to the plurality of liquid outlet holes (54) of each cavity unit (53), and the coolant discharged from the plurality of liquid outlet holes (54) is concentrated in the outlet sleeve (15); the radiator unit (101) is correspondingly installed in the cavity unit (53); The radiator unit (101) is divided into two layers, the upper layer is a manifold diversion structure layer (12), and the lower layer is a manifold microchannel structure layer (13); the cover plate (11) covers the top of the installation box (51), and the first coolant inlet (111) is arranged in the middle of the plate surface of the cover plate (11); the coolant enters the cavity through the first coolant inlet (111) and is evenly diverted to the manifold microchannel structure layer (13) through the manifold diversion structure layer (12).

2. The full liquid cooling server based on one-inlet and multiple-outlet manifold microchannel according to claim 1, characterized in that: The manifold diversion structure layer (12) is plate-shaped; at least three coolant diversion ports (47) are arranged in parallel and at intervals on the manifold diversion structure layer (12), and each coolant diversion port (47) is in the shape of a long strip; coolant sub-outlets (49) are respectively arranged at both ends of the portion between each adjacent coolant diversion port (47) on the manifold diversion structure layer (12); the liquid outlet (54) on the mounting box (51) is arranged corresponding to the coolant sub-outlet (49); the coolant is discharged from the coolant sub-outlet (49) and the corresponding liquid outlet (54) after heat exchange through the manifold microchannel structure layer (13), and is merged into the outlet sleeve (15), and is discharged from the outlet of the outlet sleeve (15).

3. The full liquid cooling server based on one-inlet and multiple-outlet manifold microchannel according to claim 1, characterized in that: The manifold microchannel structure layer (13) includes at least three first guide ribs (48) arranged in parallel and spaced apart; the first guide ribs (48) are connected to the bottom plate of the installation box (51), and the two ends of the first guide ribs (48) are respectively connected to the side walls on both sides of the installation box (51); the first guide ribs (48) are straight ribs or wavy ribs or columnar ribs, the rib thickness is 1-2 mm, and the height is not less than 4 mm.

4. The full liquid cooling server based on one-inlet and multiple-outlet manifold microchannels according to claim 1, characterized in that: When the heat exchange cooling device is installed on a GPU (6) or a hard disk (7) or an SSD (8) or a power supply (9), the heat exchange cooling device includes a flat microchannel radiator (24); the second cooling liquid inlet (26) and the second cooling liquid outlet (27) are respectively provided on the flat microchannel radiator (24).

5. The full liquid cooling server based on one-inlet and multiple-outlet manifold microchannels according to claim 1, characterized in that: When the heat exchange cooling device is installed on the memory bar (5), the heat exchange cooling device includes a flat microchannel radiator (24) and a liquid collecting cavity (25); the flat microchannel radiators (24) are respectively attached to both sides of the memory bar (5), each flat microchannel radiator (24) is connected to the liquid collecting cavity (25), and the second cooling liquid inlet (26) and the second cooling liquid outlet (27) are respectively on the liquid collecting cavity (25).

6. The full liquid cooling server based on one-inlet and multiple-outlet manifold microchannels according to claim 5, characterized in that: The flat-plate microchannel radiator (24) is a rectangular three-dimensional structure surrounded by wall panels, and a second flow guide rib (50) is provided in the internal cavity of the flat-plate microchannel radiator (24).

7. The full liquid cooling server based on one-inlet-multiple-outlet manifold microchannel according to claim 6, characterized in that: The second flow guide ribs (50) are provided in multiple groups, and the multiple groups of second flow guide ribs (50) are arranged in the cavity of the flat microchannel radiator (24), and the channels surrounded by the wall panels of the flat microchannel radiator (24) are Z-shaped channels, S-shaped channels, or U-shaped channels.

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