A simulation system and method for a 5G communication circuit board design specification

Abstract

The present invention relates to the field of electromagnetic field simulation technology, and particularly to a simulation system and method applicable to the design specifications of 5G communication circuit boards. The method includes the following steps: obtaining 5G communication circuit board design data, and extracting stack structure data and electrical parameter data according to the 5G communication circuit board design data, so as to obtain stack structure data and electrical parameter data; analyzing the signal propagation path according to the stack structure data and the electrical parameter data, so as to obtain signal propagation path data; obtaining 5G communication circuit board high-frequency characteristic data; performing electromagnetic compatibility simulation analysis according to the 5G communication circuit board high-frequency characteristic data and the electrical parameter data, so as to obtain electromagnetic compatibility simulation data. The present invention reduces the interference risk in high-frequency signal transmission based on electromagnetic field simulation technology and optimizes the performance of the 5G system.

Description

Technical Field

[0001] The present invention relates to the technical field of electromagnetic field simulation, and particularly to a simulation system and method applicable to the design specifications of 5G communication circuit boards. Background Art

[0002] In the aspect of electromagnetic compatibility analysis, traditional design simulation systems mostly rely on static models and simplified assumptions, and cannot fully consider the complex electromagnetic environment in actual operation. Circuit board design specifications are usually based on past experience and fixed parameter settings, lacking a flexible adjustment mechanism for specific application requirements. This incomplete analysis results in unforeseen interference and signal distortion when high-frequency signals are transmitted on the designed circuit board, thus affecting the performance of the entire 5G system. The consideration of circuit board thermal management by traditional methods is often limited to simple power loss calculations, lacking a comprehensive analysis of multi-physical field effects such as heat conduction, convection, and radiation. Therefore, the actual temperature distribution of the circuit board under high-power operating conditions cannot be accurately predicted, leading to thermal failure and component aging, thus shortening the service life of the device. Summary of the Invention

[0003] Based on this, it is necessary for the present invention to provide a simulation method applicable to the design specifications of 5G communication circuit boards to solve at least one of the above technical problems.

[0004] To achieve the above object, a simulation method applicable to the design specifications of 5G communication circuit boards includes the following steps:

[0005] Step S1: Obtain the design data of the 5G communication circuit board, and extract the stack structure data and electrical parameter data according to the design data of the 5G communication circuit board, so as to obtain the stack structure data and electrical parameter data; perform signal propagation path analysis according to the stack structure data and electrical parameter data, so as to obtain signal propagation path data;

[0006] Step S2: Obtain the high-frequency characteristic data of the 5G communication circuit board; perform electromagnetic compatibility simulation analysis according to the high-frequency characteristic data of the 5G communication circuit board and the electrical parameter data, so as to obtain electromagnetic compatibility simulation data;

[0007] Step S3: Perform signal propagation loss analysis on the signal propagation path data according to the electromagnetic compatibility simulation data, so as to obtain signal propagation loss data; perform propagation path optimization according to the signal propagation loss data, so as to obtain signal propagation optimized path data;

[0008] Step S4: Extract the circuit board material characteristics according to the design data of the 5G communication circuit board, so as to obtain circuit board material data; perform high-frequency operation thermal characteristic simulation analysis on the signal propagation optimized path data according to the circuit board material data, so as to obtain circuit board thermal characteristic simulation data;

[0009] Step S5: Perform stack structure signal attenuation analysis on the signal propagation optimization path data based on the thermal characteristic simulation data of the circuit board, so as to obtain stack structure signal attenuation data; perform circuit board stack structure optimization according to the stack structure signal attenuation data, so as to obtain circuit board stack structure optimization data, and upload it to the 5G communication terminal device management platform to execute the circuit board stack structure optimization task.

[0010] By extracting the stack structure and electrical parameter data of the 5G communication circuit board, the present invention can comprehensively understand the design characteristics of the circuit board, lay a foundation for subsequent signal propagation path analysis, ensure the accuracy and comprehensiveness of the design data, make subsequent analysis more accurate, and help discover potential design defects. The combination of high-frequency characteristic data and electrical parameters for electromagnetic compatibility simulation can accurately simulate the performance of the circuit board in a real environment. The analysis helps to identify electromagnetic interference problems in the design, reduce the risk of signal distortion, thereby improving the overall performance of the 5G system. Effective electromagnetic compatibility analysis can ensure that the circuit board design meets industry standards and reduce the cost of later adjustment and redesign. By analyzing the signal propagation loss data, it is possible to clearly identify which paths have higher losses, enabling designers to optimize the signal propagation path, reduce signal attenuation, improve signal integrity and transmission efficiency. The optimized propagation path can improve the transmission quality of 5G signals, thereby effectively improving the user experience. Through the extraction of the circuit board material characteristics and high-frequency operation thermal characteristic simulation analysis, the temperature distribution of the circuit board under actual operating conditions can be accurately predicted, which not only helps to identify thermal problems, but also can optimize the material selection and design structure to improve the thermal management effect, reduce the risk of equipment failure, and thus extend the service life of the equipment.

[0011] Optionally, step S1 is specifically as follows:

[0012] Step S11: Obtain the 5G communication circuit board design data, and perform stack structure data extraction and electrical parameter data extraction according to the 5G communication circuit board design data, so as to obtain stack structure data and electrical parameter data;

[0013] Step S12: Perform signal interlayer propagation coupling analysis according to the stack structure data, so as to obtain signal interlayer propagation coupling data;

[0014] Step S13: Perform signal propagation loss analysis according to the electrical parameter data, so as to obtain signal propagation loss data;

[0015] Step S14: Integrate the signal propagation path according to the signal interlayer propagation coupling data and the signal propagation loss data, so as to obtain signal propagation path data.

[0016] By obtaining the design data of the 5G communication circuit board and extracting the stack-up structure and electrical parameters, it can ensure that the data used is complete and accurate, laying a solid foundation for subsequent analysis, helping to avoid design defects caused by insufficient or inaccurate data. Compared with traditional methods, this data acquisition method can more flexibly adapt to different design requirements, thus reducing the later modification cost caused by improper design. Conducting signal inter-layer propagation coupling analysis can reveal the mutual influence and coupling mechanism between different signal layers. This analysis helps designers understand the electromagnetic interaction between signals on each layer, identify the paths leading to signal interference, and provide guidance for subsequent design optimization. This dynamic analysis method can more comprehensively reflect the complexity of the electromagnetic environment compared with traditional static models, helping to improve the electromagnetic compatibility of the design. According to the signal propagation loss analysis, it can accurately evaluate the signal loss caused by factors such as impedance mismatch and material loss during signal propagation. This process is crucial for 5G systems because the high-frequency characteristics of signals make them more vulnerable to losses during propagation. Through systematic loss analysis, the circuit board design can be optimized, the signal attenuation risk can be reduced, and the stability and integrity of signals under high-frequency conditions can be ensured. By integrating the signal inter-layer propagation coupling data and the signal propagation loss data, it is possible to comprehensively understand the signal propagation path and identify potential interference points or loss areas. This comprehensive analysis can provide a clearer signal flow path for the circuit board design, enabling designers to specifically optimize the signal transmission route, reducing the limitations of relying on experience in traditional design methods, and being able to more flexibly adapt to specific application requirements, improving the performance and reliability of the overall design.

[0017] Optionally, step S12 is specifically as follows:

[0018] Step S121: Extract the signal trace layout characteristics and signal trace geometric characteristics based on the stack-up structure data, so as to obtain the signal trace layout data and the signal trace geometric data;

[0019] Step S122: Construct a signal line layout model based on the signal trace layout data and the signal trace geometric data, so as to obtain the signal line layout model;

[0020] Step S123: Obtain the dielectric constant data of the dielectric layer material;

[0021] Step S124: Conduct electromagnetic field distribution analysis on the signal line layout model according to the dielectric constant data of the dielectric layer material, so as to obtain the electromagnetic field distribution data;

[0022] Step S125: Conduct statistics on the intensity of the electromagnetic field distribution region according to the electromagnetic field distribution data, so as to obtain the high electromagnetic field distribution region data;

[0023] Step S126: Conduct statistics on the signal line spacing according to the signal trace layout data, so as to obtain the data of signal lines with small intervals;

[0024] Step S127: Conduct an intersection operation on the electromagnetic field coupling regions according to the high electromagnetic field distribution data and the data of signal lines with small intervals, so as to obtain the electromagnetic field coupling region data;

[0025] Step S128: Calculate the interlayer coupling strength of the electromagnetic field coupling region data according to the stack structure data, so as to obtain the signal interlayer propagation coupling data.

[0026] By extracting the layout features and geometric features of signal traces, the present invention can systematically analyze the distribution of signal lines in a printed circuit board, which helps to identify the complexity and key features of signal traces, providing an accurate data basis for the subsequent construction of a signal line layout model. This systematic extraction method can effectively improve the accuracy of signal trace design and reduce human errors in design. Based on the signal trace layout and geometric data, a signal line layout model can be constructed to realize the visualization and analysis of printed circuit board design. This model can lay a foundation for subsequent electromagnetic field distribution analysis, enabling designers to comprehensively understand the mutual relationship between signal lines and providing guidance for subsequent optimization, reducing experience-based design, and ensuring that the model can accurately reflect the actual design requirements. Obtaining the dielectric constant data of the dielectric layer material is an important part of electromagnetic field analysis. The dielectric constants of different materials have a direct impact on the propagation characteristics of electromagnetic waves, ensuring that designers can use accurate material properties for analysis, improving the effectiveness of electromagnetic compatibility analysis, and reducing design mistakes caused by inaccurate material characteristics. By performing electromagnetic field distribution analysis on the signal line layout model, the intensity and distribution of the electromagnetic field in the printed circuit board can be obtained, which helps to identify potential interference sources and signal distortion areas, providing data support for subsequent design optimization. Compared with traditional methods, this dynamic analysis can more comprehensively consider the complex electromagnetic environment in actual operation, ensuring the electromagnetic compatibility of the design. By performing intensity statistics on the electromagnetic field distribution area, high electromagnetic field distribution areas can be determined, providing a basis for further design decisions, helping designers identify high-risk areas, and thus taking corresponding design measures to reduce the risks of signal interference and distortion, providing data support for optimized design, and ensuring the stability of the design under high-frequency signal conditions. By statistically analyzing the signal line spacing, the relative positional relationship between signal lines can be understood, which helps to identify coupling areas and potential interference sources, optimize the signal line layout, reduce signal interference, provide a necessary basis for subsequent electromagnetic field coupling area analysis, and improve the accuracy of the design. By performing an intersection operation on the high electromagnetic field distribution area data and the small-spacing signal line data, electromagnetic field coupling areas can be identified, which helps to understand the mutual influence between different signal lines, ensure that signals are not interfered with unnecessarily during transmission, enhance the electromagnetic compatibility of the design, and provide a scientific basis for optimizing the signal transmission path. By calculating the interlayer coupling strength of the electromagnetic field coupling area, the coupling degree between signal layers can be quantitatively analyzed, helping designers understand the degree of interference suffered by signals during propagation between different layers, and then performing effective design optimization, providing strong guarantees for the electromagnetic compatibility and signal integrity of the design, and ensuring the performance of 5G communication printed circuit boards in a complex electromagnetic environment.

[0027] Optionally, step S13 is specifically as follows:

[0028] Step S131: Extract the conductor resistance characteristics and conductor current characteristics based on the electrical parameter data, so as to obtain the conductor resistance data and the conductor current data;

[0029] Step S132: Calculate the dielectric loss based on the conductor resistance data and the conductor current data, so as to obtain the dielectric loss data;

[0030] Step S133: Obtain the characteristic impedance data of the signal source and the incident power data;

[0031] Step S134: Calculate the reflection loss based on the characteristic impedance data of the signal source and the incident power data, so as to obtain the reflection loss data;

[0032] Step S135: Perform a comprehensive calculation of the signal propagation loss based on the dielectric loss data and the reflection loss data, so as to obtain the signal propagation loss data.

[0033] By extracting the resistance characteristics and current characteristics of the conductor, the present invention can obtain more accurate conductor resistance data and conductor current data, which helps to comprehensively understand the electrical characteristics of the signal when it is transmitted in the conductor, provides necessary parameter support for subsequent dielectric loss calculations, and can more accurately reflect the electrical performance of the actual conductor under working conditions compared with traditional methods, improving the reliability of signal integrity analysis. Based on the conductor resistance and current data, the dielectric loss is calculated, which can quantitatively analyze the energy loss when the signal propagates in the medium, provides an important basis for understanding the attenuation of electromagnetic signals in materials, helps designers optimize material selection, ensure that the signal reduces losses during propagation, enhances the scientific nature of printed circuit board design, and is particularly crucial in high-frequency applications. Obtaining the characteristic impedance and incident power data of the signal source can provide necessary inputs for subsequent reflection loss calculations, ensure that designers can use accurate parameters when analyzing the signal source, help identify the impact of the signal source on system performance, enhance the accuracy of the design compared with traditional methods, and reduce potential problems caused by inaccurate signal source characteristics. Calculating the reflection loss based on the characteristic impedance of the signal source and the incident power can quantify the degree of signal reflection at the interface, helps designers understand the energy loss that occurs under specific impedance matching conditions, optimize the design to reduce the reflection loss, thereby improving the signal transmission efficiency, and provides a scientific basis for improving the signal integrity and electromagnetic compatibility of the entire system. By comprehensively calculating the dielectric loss and the reflection loss, comprehensive signal propagation loss data can be obtained, which helps designers identify various loss sources encountered during high-frequency signal transmission, ensure a comprehensive performance evaluation throughout the design process, and help optimize the printed circuit board design by integrating multiple factors to ensure its stability and reliability in a complex electromagnetic environment.

[0034] Optionally, step S2 is specifically as follows:

[0035] Step S21: Obtain the high-frequency characteristic data of the 5G communication circuit board;

[0036] Step S22: Extract the ground wire structure characteristics and the trace length characteristics according to the electrical parameter data, so as to obtain the ground wire structure data and the trace length data;

[0037] Step S23: Construct a simulation model of the communication circuit board based on the ground wire structure data and the trace length data, so as to obtain the simulation model of the communication circuit board;

[0038] Step S24: Perform high-frequency signal electromagnetic simulation on the simulation model of the communication circuit board according to the high-frequency characteristic data of the 5G communication circuit board, so as to obtain high-frequency signal electromagnetic simulation data;

[0039] Step S25: Perform electrical noise analysis according to the high-frequency signal electromagnetic simulation data, so as to obtain electrical noise data;

[0040] Step S26: Locate the electromagnetic interference source according to the high-frequency signal electromagnetic simulation data, so as to obtain electromagnetic interference source data;

[0041] Step S27: Integrate the electromagnetic compatibility simulation data according to the electrical noise data and the electromagnetic interference source data, so as to obtain the electromagnetic compatibility simulation data.

[0042] By obtaining the high-frequency characteristic data of the 5G communication circuit board, it can provide an accurate input basis for subsequent analysis, ensuring that designers can comprehensively understand the behavioral characteristics of the circuit board in high-frequency signal transmission, which helps to formulate more effective design strategies. The acquisition of this data overcomes the deficiency of lacking high-frequency characteristic considerations in traditional methods, thereby improving the scientificity and accuracy of the simulation system. Extracting the ground wire structure and trace length characteristics helps to understand the electrical connection situation and signal propagation characteristics of the circuit board, laying a foundation for the construction of the subsequent communication circuit board simulation model, ensuring that designers can optimize the design based on real data. Compared with the traditional method relying on static models, it enhances the adaptability to complex electromagnetic environments and reduces signal interference caused by improper trace design. Constructing a communication circuit board simulation model based on the ground wire structure and trace length data forms a dynamic model that can truly reflect the performance of the circuit board. This model can simulate the performance of the circuit board under various operating conditions, providing reliable support for design decisions. Compared with traditional simplified models, it can more truly reflect complex electromagnetic phenomena, enhancing the overall compatibility and performance stability of the system. By performing high-frequency signal electromagnetic simulation on the communication circuit board simulation model, electromagnetic behavior data of the circuit board during high-frequency signal transmission can be obtained, providing a comprehensive analysis of signal propagation in the electromagnetic field, ensuring that designers can identify potential interference problems and performance bottlenecks, supplementing the neglect of dynamic signal behavior in traditional analysis, and strengthening the scientific basis of system design. Based on the high-frequency signal electromagnetic simulation data for electrical noise analysis, the noise level existing in the circuit board can be quantified, helping designers understand the impact of noise on signal integrity under specific design conditions, promoting the formulation of noise control measures. Compared with traditional methods, modern noise analysis can provide more detailed noise source localization and suppression suggestions, reducing the risk of interference to signals. By performing electromagnetic interference source localization on the high-frequency signal electromagnetic simulation data, the interference sources affecting the performance of the circuit board can be identified and analyzed, which can help designers identify potential electromagnetic interference problems in the initial stage of design, take measures in advance for optimization, and reduce the risk of repeated modifications during the design cycle. Compared with traditional empirical methods, the use of precise interference source localization technology can significantly improve the efficiency of circuit board design. By integrating the electrical noise data and electromagnetic interference source data, comprehensive electromagnetic compatibility simulation data can be obtained, providing designers with a comprehensive view of electromagnetic compatibility, helping to formulate reasonable optimization plans. Compared with traditional decentralized analysis methods, comprehensive data integration enhances the integrity of system design, ensuring the stable performance of the circuit board under various working conditions.

[0043] Optionally, step S25 is specifically as follows:

[0044] Step S251: Extract the electromagnetic field strength characteristics according to the high-frequency signal electromagnetic simulation data, so as to obtain the electromagnetic field strength data;

[0045] Step S252: Perform a fast Fourier transform on the electromagnetic field strength data to obtain electromagnetic field strength spectrum data;

[0046] Step S253: Conduct spectrum amplitude statistics on the electromagnetic field strength spectrum data to obtain high-amplitude electromagnetic field strength spectrum data;

[0047] Step S254: Perform frequency statistics on the electromagnetic field strength spectrum data to obtain high-frequency electromagnetic field strength spectrum data;

[0048] Step S255: Conduct an intersection operation on the high-amplitude electromagnetic field strength spectrum data and the high-frequency electromagnetic field strength spectrum data to obtain electrical noise data.

[0049] Through the extraction of electromagnetic field strength characteristics based on high-frequency signal electromagnetic simulation data, the present invention can obtain the electromagnetic field strength data of the circuit board under high-frequency working conditions, enabling designers to accurately understand the distribution of the electromagnetic field during signal propagation and providing necessary data support for subsequent analysis. By using the fast Fourier transform (FFT) to analyze the electromagnetic field strength data, the time-domain signal can be converted into frequency-domain information, revealing the frequency characteristics of the electromagnetic field, which helps to identify interference and noise sources existing within a specific frequency range and provides a theoretical basis for optimizing the design. Compared with traditional static models, frequency-domain analysis can more comprehensively reflect the behavior of signals in the electromagnetic environment. Conducting spectrum amplitude statistics on the electromagnetic field strength spectrum data to obtain high-amplitude electromagnetic field strength spectrum data helps designers identify strong interference components in the signal, facilitating subsequent focused attention and control of these high-amplitude frequencies. Performing frequency statistics to obtain high-frequency electromagnetic field strength spectrum data can clarify the intensity characteristics of the electromagnetic field at different frequencies, which provides important references for designers to ensure that the electromagnetic effects of each frequency band can be fully considered during the design process. Conducting an intersection operation on the high-amplitude electromagnetic field strength spectrum data and the high-frequency electromagnetic field strength spectrum data to obtain electrical noise data can accurately identify the electrical noise effects suffered by the circuit board during high-frequency signal transmission, providing a scientific basis for subsequent noise suppression and electromagnetic compatibility optimization.

[0050] Optionally, step S26 is specifically as follows:

[0051] Step S261: Draw an electromagnetic field distribution map based on the high-frequency signal electromagnetic simulation data to obtain an electromagnetic field distribution map;

[0052] Step S262: Trace the radiation path based on the electromagnetic field distribution map to obtain radiation path tracing data;

[0053] Step S263: Classify the paths based on the radiation path tracing data to obtain reflection path data and refraction path data;

[0054] Step S264: Perform signal focusing area statistics on the reflection path data to obtain signal focusing area data;

[0055] Step S265: Perform signal intensity consistent path statistics on the refraction path data to obtain signal intensity consistent path data;

[0056] Step S266: Perform an intersection operation on the electromagnetic interference source area based on the signal focusing area data and the signal intensity consistent path data to obtain electromagnetic interference source data.

[0057] According to the high-frequency signal electromagnetic simulation data, the present invention draws an electromagnetic field distribution map, which can visualize the electromagnetic field distribution on the circuit board, enabling the designer to intuitively identify the distribution characteristics of the electromagnetic field intensity, thereby helping to optimize the signal path design. This kind of visual analysis can more clearly reveal the complexity of the electromagnetic environment and contribute to formulating more effective design strategies. Through radiation path tracking, the path of the electromagnetic wave during propagation can be determined, which helps to analyze the propagation characteristics of the electromagnetic wave in the actual working environment, including its reflection, refraction, and diffraction phenomena, and can more realistically simulate the dynamic changes of the electromagnetic field, enhancing the understanding of signal transmission. Classify the traced radiation paths to obtain the data of the reflection path and the refraction path, enabling the designer to better understand the impact of different paths on signal transmission, contributing to formulating targeted optimization strategies. The path classification provides a multi-dimensional analysis perspective and enhances the accuracy of the design. Performing signal focusing area statistics on the reflection path data helps to identify the intensity focusing situation of the signal in a specific area, which can guide the designer to optimize the signal intensity distribution to ensure that sufficient signal intensity is obtained in the key area, providing a more refined signal management means. Performing signal intensity consistent path statistics on the refraction path data can identify the paths with relatively small signal intensity changes, which helps the designer to ensure the consistency of the signal on the key transmission paths, reducing the risk of signal distortion and improving the stability of signal transmission. Performing an intersection operation on the electromagnetic interference source area based on the signal focusing area data and the signal intensity consistent path data can identify the specific location of the electromagnetic interference source, which is crucial for optimizing the circuit board design, can help the designer take effective measures to reduce the interference impact, improve the electromagnetic compatibility, and provide a clearer and more effective interference source positioning ability.

[0058] Optionally, step S4 is specifically as follows:

[0059] Step S41: Extract the circuit board material characteristics according to the 5G communication circuit board design data to obtain the circuit board material data;

[0060] Step S42: Extract the via position characteristics according to the signal propagation optimized path data to obtain the via position data;

[0061] Step S43: Perform high-frequency operation simulation based on the circuit board material data and via position data to obtain the high-frequency operation data of the circuit board;

[0062] Step S44: Perform thermal characteristic simulation analysis based on the high-frequency operation data of the circuit board to obtain the thermal characteristic simulation data of the circuit board.

[0063] By extracting the characteristics of the circuit board material, the present invention can obtain key parameters such as the dielectric constant and thermal conductivity of the material. These material data are crucial for subsequent high-frequency signal simulation and thermal characteristic analysis, providing more accurate material data support and ensuring the reliability of the design in practical applications. Extracting the via position characteristics of the signal propagation optimization path data helps to accurately determine the key via positions in signal transmission. This information is very important for optimizing signal routing and reducing signal loss, making the via design more scientific and reasonable, and contributing to improving signal integrity. Performing high-frequency operation simulation based on the circuit board material data and via position data can truly reflect the behavior of the circuit board under high-frequency signal transmission, considering the material characteristics and the impact of vias on signals. This enables designers to identify potential problems during the design phase, providing comprehensive operation data support and ensuring the accuracy and effectiveness of the design. By performing thermal characteristic simulation analysis on the high-frequency operation data of the circuit board, the temperature distribution and thermal management characteristics of the circuit board under high-power working conditions can be obtained, which can help designers evaluate the thermal performance of the device, identify the risk of thermal failure in advance, comprehensively consider multi-physical field effects such as heat conduction, convection, and radiation, and improve the understanding of the overall performance of the circuit board.

[0064] Optionally, step S44 is specifically as follows:

[0065] Step S441: Calculate the power loss based on the high-frequency operation data of the circuit board to obtain the power loss data;

[0066] Step S442: Obtain the thermal conductivity data of the circuit board material;

[0067] Step S443: Construct a thermal characteristic simulation model of the circuit board based on the power loss data and the thermal conductivity data of the circuit board material to obtain the thermal characteristic simulation model of the circuit board;

[0068] Step S444: Perform steady-state thermal simulation on the thermal characteristic simulation model of the circuit board based on the power loss data to obtain the steady-state thermal simulation data;

[0069] Step S445: Draw a steady-state thermal simulation hot spot area map based on the steady-state thermal simulation data to obtain the steady-state thermal simulation hot spot area map;

[0070] Step S446: Obtain the safe temperature data of the circuit board material;

[0071] Step S447: Divide the high - hot - spot simulation area of the steady - state thermal simulation hot - spot area map according to the safe temperature data of the circuit board material, so as to obtain the circuit board thermal characteristic simulation data.

[0072] By calculating the power loss of the high - frequency operation data of the circuit board, the actual power consumption of the circuit board in the working state can be obtained in the present invention, which helps to understand the energy efficiency of the circuit board, identify potential energy - wasting areas, provides a more accurate power - loss assessment, and lays a foundation for subsequent thermal - management analysis. Obtaining the thermal - conductivity data of the circuit board material is the key to thermal - management analysis. By accurately understanding the thermal - conductivity characteristics of the material, designers can effectively predict the heat conduction in the material, ensure that the thermal effects are fully considered in the design. This process overcomes the simplified assumptions about the thermal - conductivity characteristics of the material in traditional designs, making the thermal analysis more scientific and reasonable. Constructing a circuit - board thermal - characteristic simulation model based on the power - loss data and thermal - conductivity data can provide a comprehensive thermal - performance assessment. This model can help designers analyze the temperature distribution under specific working conditions, provide a basis for optimizing the design, and make the simulation model more detailed and comprehensive. Conducting a steady - state thermal simulation on the circuit - board thermal - characteristic simulation model can obtain the stable temperature distribution of the circuit board during long - term operation, which helps to identify the hot - spot areas that occur under normal working conditions of the device, provides an optimization scheme for designers to reduce the thermal risk, and pays more attention to the actual working environment of the circuit board. Drawing a steady - state thermal - simulation hot - spot area map based on the steady - state thermal - simulation data can visually display the thermal distribution of the circuit board during operation, enabling designers to quickly identify the thermally sensitive areas, providing an important reference for subsequent heat - dissipation design, and significantly improving designers' understanding of thermal characteristics. Obtaining the safe temperature data of the circuit - board material can provide a safety boundary for thermal management in the design, which is crucial for ensuring that the device will not fail due to overheating during high - load operation. By establishing the safe - temperature standard of the material, it effectively compensates for the deficiencies in the thermal - risk assessment of traditional methods. Dividing the high - hot - spot simulation area of the steady - state thermal - simulation hot - spot area map according to the safe - temperature data can clearly indicate which areas have thermal - failure risks, help to guide the implementation of heat - dissipation design and optimization schemes, ensure the reliability of the circuit board in practical applications, provide a more accurate thermal - risk assessment, and enhance the safety of the design.

[0073] Optionally, this specification also provides a simulation system for the design specification of 5G communication circuit boards, which is used to execute the simulation method for the design specification of 5G communication circuit boards as described above. The simulation system for the design specification of 5G communication circuit boards includes:

[0074] Signal Propagation Path Analysis Module: It is used to obtain the 5G communication circuit board design data, extract the stack-up structure data and electrical parameter data according to the 5G communication circuit board design data, so as to obtain the stack-up structure data and electrical parameter data; perform signal propagation path analysis according to the stack-up structure data and electrical parameter data, so as to obtain signal propagation path data;

[0075] Electromagnetic Compatibility Simulation Module: It is used to obtain the high-frequency characteristic data of the 5G communication circuit board; perform electromagnetic compatibility simulation analysis according to the high-frequency characteristic data of the 5G communication circuit board and the electrical parameter data, so as to obtain electromagnetic compatibility simulation data;

[0076] Signal Propagation Path Optimization Module: It is used to perform signal propagation loss analysis on the signal propagation path data according to the electromagnetic compatibility simulation data, so as to obtain signal propagation loss data; perform propagation path optimization according to the signal propagation loss data, so as to obtain signal propagation optimized path data;

[0077] High-Frequency Operation Thermal Characteristic Simulation Module: It is used to extract the circuit board material characteristics according to the 5G communication circuit board design data, so as to obtain circuit board material data; perform high-frequency operation thermal characteristic simulation analysis on the signal propagation optimized path data according to the circuit board material data, so as to obtain circuit board thermal characteristic simulation data;

[0078] Circuit Board Stack-Up Structure Optimization Module: It is used to perform stack-up structure signal attenuation analysis on the signal propagation optimized path data according to the circuit board thermal characteristic simulation data, so as to obtain stack-up structure signal attenuation data; perform circuit board stack-up structure optimization according to the stack-up structure signal attenuation data, so as to obtain circuit board stack-up structure optimization data, and upload it to the 5G communication terminal device management platform to execute the circuit board stack-up structure optimization task.

[0079] A simulation system for 5G communication circuit board design specifications according to the present invention. This system can implement any simulation method for 5G communication circuit board design specifications of the present invention, and is used as a medium for coordinating the operations and signal transmissions between various modules to complete the simulation method for 5G communication circuit board design specifications. The internal modules of the system cooperate with each other, thereby reducing the interference risk in high-frequency signal transmission and optimizing the performance of the 5G system. Description of the Drawings

[0080] By reading the detailed description of the non-limiting embodiments with reference to the following drawings, other features, purposes and advantages of the present invention will become more obvious:

[0081] Figure 1 It is a schematic flowchart of the steps of the simulation method for 5G communication circuit board design specifications according to the present invention;

[0082] Figure 2It is a detailed step - by - step schematic diagram of step S1 in the present invention;

[0083] Figure 3 It is a detailed step - by - step schematic diagram of step S13 in the present invention;

[0084] The realization of the object of the present invention, its functional features and advantages will be further described with reference to the embodiments and the accompanying drawings. Specific Embodiments

[0085] The technical method of the present invention for the patent will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0086] In addition, the accompanying drawings are only schematic diagrams of the present invention and are not necessarily drawn to scale. The same reference numerals in the figures represent the same or similar parts, and thus their repeated description will be omitted. Some of the block diagrams shown in the figures are functional entities and do not necessarily correspond to physically or logically independent entities. The functional entities can be implemented in software form, or in one or more hardware modules or integrated circuits, or in different networks and / or processor methods and / or microcontroller methods.

[0087] It should be understood that although terms such as "first", "second", etc. may be used here to describe each unit, these units should not be limited by these terms. These terms are only used to distinguish one unit from another. For example, without departing from the scope of the exemplary embodiments, the first unit can be called the second unit, and similarly the second unit can be called the first unit. The term "and / or" used here includes any and all combinations of one or more of the listed related items.

[0088] To achieve the above object, please refer to Figures 1 to 3 , the present invention provides a simulation method applicable to the 5G communication circuit board design specification. The method includes the following steps:

[0089] Step S1: Obtain 5G communication circuit board design data, and extract stack - up structure data and electrical parameter data according to the 5G communication circuit board design data, so as to obtain stack - up structure data and electrical parameter data; Analyze the signal propagation path according to the stack - up structure data and electrical parameter data, so as to obtain signal propagation path data;

[0090] In this embodiment, when obtaining the design data of the 5G communication circuit board, the layer information is extracted from the design database, including key parameters such as material type, thickness, and dielectric constant. The extraction of these data depends on the standardized format of the design files, such as using Gerber files in the IPC standard. Next, the signal propagation path analysis is performed using the extracted stack-up structure data. This analysis uses electromagnetic field simulation tools, such as Ansys HFSS or CST Microwave Studio, to model the signal propagation path. By setting the input signal frequency and amplitude, the propagation of the signal between layers is analyzed, and the propagation delay, phase difference, and amplitude change are calculated, and finally the signal propagation path data is obtained. These data will lay the foundation for subsequent electromagnetic compatibility analysis and signal loss optimization.

[0091] Step S2: Obtain the high-frequency characteristic data of the 5G communication circuit board; perform electromagnetic compatibility simulation analysis based on the high-frequency characteristic data and electrical parameter data of the 5G communication circuit board, so as to obtain electromagnetic compatibility simulation data;

[0092] In this embodiment, the high-frequency characteristic data of the 5G communication circuit board is obtained, mainly including parameters such as signal frequency range, transmission line characteristic impedance, and frequency response. These data are usually obtained by testing the fabricated prototype using high-frequency test instruments, such as a network analyzer (VNA). Subsequently, electromagnetic compatibility simulation is performed using an electromagnetic compatibility simulation analysis tool (such as Keysight EMPro or Altair FEKO). The electrical parameters of the input signal and the obtained high-frequency characteristic data are used to simulate the electromagnetic field distribution, and the electromagnetic interference and noise sources are calculated. Through this analysis, electromagnetic compatibility simulation data is obtained, and these data are used to evaluate the electromagnetic compatibility of the circuit board under high-frequency operation and its impact.

[0093] Step S3: Perform signal propagation loss analysis on the signal propagation path data according to the electromagnetic compatibility simulation data, so as to obtain signal propagation loss data; perform propagation path optimization according to the signal propagation loss data, so as to obtain signal propagation optimized path data;

[0094] In this embodiment, based on the electromagnetic compatibility simulation data, signal propagation loss analysis is performed on the signal propagation path data. A special calculation tool, such as the communication toolbox in Matlab, is used to input the data of the signal propagation path, including parameters such as signal amplitude, propagation distance, and dielectric loss, to calculate the loss of the signal during propagation. The result will be expressed in dB to form signal propagation loss data. Based on the loss data, an optimization algorithm (such as a genetic algorithm or a particle swarm optimization algorithm) is applied to optimize the signal propagation path, reduce unnecessary signal attenuation, and finally obtain signal propagation optimized path data. This process ensures the efficiency and stability of the signal in 5G applications.

[0095] Step S4: Extract the characteristics of the circuit board material based on the 5G communication circuit board design data to obtain the circuit board material data; perform a high-frequency operation thermal characteristic simulation analysis on the signal propagation optimization path data according to the circuit board material data to obtain the circuit board thermal characteristic simulation data;

[0096] In this embodiment, the extraction of the circuit board material characteristics includes obtaining parameters such as its conductivity, thermal conductivity, and dielectric constant. Use material testing instruments (such as thermal analyzers and resistivity testers) to test the material samples to ensure accurate material data is obtained. These data will be used as inputs for the high-frequency operation thermal characteristic simulation analysis. By using finite element analysis software (such as ANSYS or COMSOL), a circuit board thermal model is constructed, and parameters such as power loss and material thermal conductivity are input to simulate the thermal characteristics under high-frequency operation conditions. This analysis helps to evaluate the temperature distribution of the circuit board during high-power operation, providing necessary data support for subsequent thermal management.

[0097] Step S5: Perform a laminated structure signal attenuation analysis on the signal propagation optimization path data according to the circuit board thermal characteristic simulation data to obtain the laminated structure signal attenuation data; optimize the circuit board laminated structure according to the laminated structure signal attenuation data to obtain the circuit board laminated structure optimization data, and upload it to the 5G communication terminal device management platform to execute the circuit board laminated structure optimization task.

[0098] In this embodiment, based on the circuit board thermal characteristic simulation data, a laminated structure signal attenuation analysis is performed. Through a design calculation tool, the thermal simulation results and signal propagation parameters are input to calculate the signal attenuation values under different laminated structures, forming the laminated structure signal attenuation data. Based on this data, an optimization algorithm is used to analyze how to adjust the laminated structure (such as the order, thickness, and material selection of the layers) to minimize signal attenuation and obtain the circuit board laminated structure optimization data. The optimized data will be uploaded to the 5G communication terminal device management platform to implement the optimization task of the circuit board laminated structure, ensuring its efficiency and reliability in practical applications.

[0099] Optionally, step S1 is specifically:

[0100] Step S11: Obtain the 5G communication circuit board design data, and extract the laminated structure data and electrical parameter data according to the 5G communication circuit board design data to obtain the laminated structure data and electrical parameter data;

[0101] In this embodiment, the design data of the 5G communication circuit board is exported from electronic design automation (EDA) software (such as Altium Designer or Cadence). The exported design data contains stack-up structure information, specifically including key parameters such as the material type, thickness, dielectric constant, and conductivity of each layer. After the stack-up structure data is extracted, electrical parameter data extraction is then carried out. These electrical parameters include characteristic impedance, parasitic capacitance, signal transmission delay, etc. To ensure the accuracy of the data, a simulation-based method is adopted, and an electromagnetic simulation tool (such as Ansys HFSS) is used to perform secondary verification on the exported design data, thereby obtaining reliable electrical characteristic data. This process provides the necessary basic data for subsequent signal analysis, ensuring that the value of each parameter is strictly measured and verified.

[0102] Step S12: Perform signal inter-layer propagation coupling analysis based on the stack-up structure data to obtain signal inter-layer propagation coupling data;

[0103] In this embodiment, based on the obtained stack-up structure data, signal inter-layer propagation coupling analysis is carried out. An electromagnetic simulation tool (such as CST Microwave Studio) is used to build a model, and the extracted stack-up structure parameters are input, including dielectric constant, layer thickness, and signal frequency range (for example, from 1 GHz to 10 GHz). By setting the coupling analysis parameters, the coupling degree of the signal between different layers is calculated, and the results will include important indicators such as coupling coefficient and reflection loss. Pay special attention to the coupling effect of each layer through which the current flows. By post-processing the coupling data, effective coupling data is extracted to evaluate the propagation loss of the signal between layers. This step ensures a full understanding of the mutual influence of the signal between different layers and provides data support for subsequent loss analysis.

[0104] Step S13: Perform signal propagation loss analysis based on the electrical parameter data to obtain signal propagation loss data;

[0105] In this embodiment, based on the electrical parameter data, signal propagation loss analysis is carried out. A circuit simulation software (such as Keysight ADS) is used to construct a transmission line model, and the input parameters include characteristic impedance, length of the transmission line, operating frequency, and conductivity of the material, etc. By setting the simulation conditions, the total loss of the signal during transmission is calculated, and these losses include dielectric loss, reflection loss, and radiation loss. Pay special attention to the behavior of high-frequency signals when propagating in materials. Usually, the signal propagation loss data is output in decibels (dB).

[0106] Step S14: Integrate the signal propagation path according to the signal inter-layer propagation coupling data and the signal propagation loss data to obtain signal propagation path data.

[0107] In this embodiment, after obtaining the signal inter-layer propagation coupling data and the signal propagation loss data, signal propagation path integration is performed. A signal processing tool (such as MATLAB) is used to analyze the coupling and loss data, and the weighted average method is used to integrate the coupling loss and propagation loss data. A suitable threshold is set (for example, a signal loss less than -3 dB is an acceptable range), and the signal paths are screened and optimized to form the final signal propagation path data. By analyzing the integrated data, the best signal propagation path is identified to improve the signal integrity and performance of the overall circuit board design. This process ensures the reliability of signal transmission and provides a solid data foundation for subsequent circuit board design optimization.

[0108] Optionally, step S12 is specifically as follows:

[0109] Step S121: Extract the signal trace layout features and the signal trace geometric features according to the stack-up structure data, so as to obtain the signal trace layout data and the signal trace geometric data;

[0110] In this embodiment, the signal trace layout features are extracted according to the stack-up structure data. The 5G communication circuit board design file is opened using EDA software (such as Altium Designer or Cadence), and the layout information of the signal traces is extracted, including the start and end positions, trace widths, trace spacings, and trace shapes of the traces. The extraction of the signal trace geometric features includes geometric parameters such as the curvature, angle, and vertical height relative to other layers of the traces. These data are automatically generated through the script function of the software to ensure the efficiency and accuracy of the extraction process. The obtained signal trace layout data and geometric data will form a detailed database for subsequent analysis and processing.

[0111] Step S122: Construct a signal line layout model according to the signal trace layout data and the signal trace geometric data, so as to obtain the signal line layout model;

[0112] In this embodiment, a signal line layout model is constructed according to the signal trace layout data and the signal trace geometric data. A simulation tool (such as CST Microwave Studio) is used for 3D modeling. The data extracted in the previous step is input, and the layout parameters of the signal lines are defined, such as position, width, and thickness. Then, according to the design requirements and technical standards (for example, the standards of the International Electrotechnical Commission (IEC) or the Institute of Electrical and Electronics Engineers (IEEE)), the model parameters are adjusted to ensure that the model meets the actual design requirements. After the model construction is completed, a preliminary verification is carried out to ensure that all layout data is correct, providing a reliable basis for subsequent electromagnetic field analysis.

[0113] Step S123: Obtain the dielectric constant data of the dielectric layer material;

[0114] In this embodiment, the dielectric constant data of the dielectric layer material is usually obtained from the technical data manuals provided by material suppliers. These data manuals contain parameters such as the dielectric constant (e.g., relative dielectric constant ε_r) and loss tangent (tanδ) of different materials (such as FR-4, RO4350B, etc.). To improve the accuracy of the data, experimental measurements of the materials are carried out. A network analyzer (such as Agilent E5071C) is used to test the dielectric constant of the samples to obtain the frequency response. Finally, the obtained dielectric constant data will be used as input parameters for subsequent electromagnetic field analysis.

[0115] Step S124: Perform electromagnetic field distribution analysis on the signal line layout model according to the dielectric constant data of the dielectric layer material, so as to obtain electromagnetic field distribution data;

[0116] In this embodiment, electromagnetic field distribution analysis is performed on the signal line layout model by using the obtained dielectric constant data of the dielectric layer material. An electromagnetic simulation software (such as Ansys HFSS) is used to set the working frequency range, input the signal line model and dielectric constant parameters, and run the simulation calculation. This process will simulate the electromagnetic field distribution generated when the signal propagates in the signal line and the surrounding dielectric layer. After the analysis is completed, electromagnetic field distribution data, including the distribution of electric field strength (E-field) and magnetic field strength (H-field), is obtained, providing basic data for subsequent statistics and analysis.

[0117] Step S125: Perform statistics on the intensity of the electromagnetic field distribution region according to the electromagnetic field distribution data, so as to obtain high electromagnetic field distribution region data;

[0118] In this embodiment, statistics on the intensity of the electromagnetic field distribution region are performed according to the electromagnetic field distribution data. First, the electric field strength values in the electromagnetic field distribution data are extracted, and the electromagnetic field is divided into regions by setting a threshold (such as the E-field strength is greater than a specific value, for example, 1 V / m). Statistical tools (such as MATLAB) are used to analyze the electric field strength, calculate the electric field strength distribution in each region, and identify the high electromagnetic field distribution regions. The data of these regions will provide an important basis for subsequent electromagnetic field coupling analysis, helping designers understand the coupling effects of signal lines.

[0119] Step S126: Perform statistics on the signal line spacing according to the signal trace layout data, so as to obtain small-spacing signal line data;

[0120] In this embodiment, the signal line spacing is statistically analyzed according to the signal trace layout data. The relative position data of all signal lines is extracted, and the distance between each pair of signal lines is calculated. For each distance data, statistical analysis is performed, and attention is paid to the signal line pairs with a distance less than the preset spacing threshold (such as 0.5 mm). Statistical analysis tools (such as Excel or R language) are used to summarize the data to form a small-spacing signal line data set. The purpose of this step is to identify potential signal line coupling problems and provide a basis for subsequent electromagnetic field coupling region intersection operations.

[0121] Step S127: Perform an electromagnetic field coupling region intersection operation according to the high electromagnetic field distribution data and the small-spacing signal line data, so as to obtain electromagnetic field coupling region data;

[0122] In this embodiment, an electromagnetic field coupling region intersection operation is performed according to the high electromagnetic field distribution data and the small-spacing signal line data. Use logical operation tools (such as MATLAB or Python) to perform an intersection calculation between the high electromagnetic field distribution region and the small-spacing signal line data, and extract the electromagnetic coupling region. This process will present the electromagnetic coupling region in a graphical way, and it is convenient for intuitive analysis by setting visualization parameters (such as color mapping, transparency, etc.). This data provides an accurate regional reference for subsequent signal interlayer propagation coupling calculations.

[0123] Step S128: Calculate the interlayer coupling strength of the electromagnetic field coupling region data according to the stack structure data, so as to obtain signal interlayer propagation coupling data.

[0124] In this embodiment, the interlayer coupling strength of the electromagnetic field coupling region data is calculated according to the stack structure data. First, extract the electromagnetic characteristics of each layer in the stack structure, including dielectric constant, conductivity, etc. By establishing a mathematical model (such as the coupling matrix method), combined with the electromagnetic field coupling region, the interlayer coupling strength is calculated. The calculation result will output the signal interlayer propagation coupling coefficient (such as dB value), so as to evaluate the interference and coupling degree between different signal layers. This data will provide a key reference for subsequent optimization design to ensure the stable performance of the circuit board in high-frequency applications.

[0125] Optionally, step S13 is specifically:

[0126] Step S131: Extract the conductor resistance characteristics and conductor current characteristics according to the electrical parameter data, so as to obtain conductor resistance data and conductor current data;

[0127] In this embodiment, the conductor resistance characteristics and conductor current characteristics are extracted according to the electrical parameter data. First, obtain the electrical parameter data of the circuit board, including information such as the conductivity and geometric dimensions of the material, and use the formula Calculate the conductor resistance, where ρ is the resistivity of the material, L is the length of the conductor, and A is the cross-sectional area of the conductor. The extraction of the conductor current characteristics is determined according to the working conditions in the circuit and the output current of the signal source. Measure the actual current value in the circuit using an oscilloscope or a current probe to ensure accurate conductor current data. These data will serve as an important basis for subsequent dielectric loss calculations.

[0128] Step S132: Calculate the dielectric loss based on the conductor resistance data and the conductor current data to obtain the dielectric loss data;

[0129] In this embodiment, the dielectric loss is calculated based on the conductor resistance data and the conductor current data. Dielectric loss is usually caused by the heat generated when current passes through the dielectric material, and the formula = is used for the calculation, where is the dielectric loss power, I is the conductor current, and R is the conductor resistance. By substituting the conductor current data and the corresponding conductor resistance data into the formula, the dielectric loss data at various frequencies are calculated. Ensure multiple measurements are carried out under different working conditions to improve the reliability of the data and finally obtain stable dielectric loss data, providing a basis for subsequent reflection loss and signal propagation loss calculations.

[0130] Step S133: Obtain the signal source characteristic impedance data and the incident power data;

[0131] In this embodiment, the signal source characteristic impedance data and the incident power data are obtained. The characteristic impedance of the signal source is usually measured through the output port of the signal source. Use an impedance analyzer (such as Agilent E5071C) to directly measure the characteristic impedance of the signal source to ensure an accurate value. The incident power data is measured using a power meter to ensure that this power value is the actual output power of the signal source at the operating frequency. After the data is obtained, multiple measurements are required to eliminate random errors and ensure the repeatability of the data to improve the accuracy of subsequent calculations.

[0132] Step S134: Calculate the reflection loss based on the signal source characteristic impedance data and the incident power data to obtain the reflection loss data;

[0133] In this embodiment, the return loss is calculated based on the signal source characteristic impedance data and the incident power data. The return loss is used to evaluate the matching degree between the signal source impedance and the load impedance, and the formula RL = 20\cdot\log_{10}\left(\frac{Z_0}{Z_L}\right) is adopted, where {Z_0} is the signal source characteristic impedance and {Z_L} is the load impedance. According to the signal source characteristic impedance obtained in the previous step and the impedance value obtained through load measurement, the formula is substituted for calculation. The calculation result will provide the return loss data, which is used to evaluate the efficiency and integrity of signal transmission.

[0134] Step S135: Perform a comprehensive calculation of the signal propagation loss based on the dielectric loss data and the return loss data, so as to obtain the signal propagation loss data.

[0135] In this embodiment, a comprehensive calculation of the signal propagation loss is performed based on the dielectric loss data and the return loss data. The signal propagation loss (Transmission Loss) is usually composed of the dielectric loss and the return loss together, and the formula TL = + RL is used for comprehensive calculation, where TL is the signal propagation loss, is the dielectric loss, and RL is the return loss. Substitute the dielectric loss data and the return loss data obtained in the previous two steps into this formula to calculate the overall signal propagation loss data. These data will be used to analyze the overall performance of the signal during transmission and ensure the effectiveness of the circuit board in high-frequency applications.

[0136] Optionally, step S2 is specifically as follows:

[0137] Step S21: Obtain the high-frequency characteristic data of the 5G communication circuit board;

[0138] In this embodiment, the high-frequency characteristic data of the 5G communication circuit board is obtained. The electromagnetic characteristics of the materials used in the circuit board, including the dielectric constant, loss factor, and conductivity, are extracted from the design documents and material specifications. Use high-frequency measurement equipment (such as a network analyzer) for actual measurement to obtain the S-parameters in the frequency range (for example, from 1 GHz to 40 GHz), especially the reflection coefficient (S11) and the transmission coefficient (S21), to ensure that the measured data can truly reflect the performance of the circuit board at high frequencies. After data acquisition, data processing is required to eliminate measurement errors and ensure that the obtained high-frequency characteristic data can be used for subsequent simulation analysis.

[0139] Step S22: Extract the ground wire structure characteristics and the trace length characteristics according to the electrical parameter data, so as to obtain the ground wire structure data and the trace length data;

[0140] In this embodiment, the ground wire structure features and the trace length features are extracted based on the electrical parameter data. The layout information of the ground wire, including its width, thickness, and relative position to other signal lines, is extracted from the circuit design file. Meanwhile, the trace lengths are measured to ensure that the lengths of each signal trace are accurately recorded. Using Electrical Design Automation (EDA) tools, a data sheet of the ground wire structure and the trace lengths is automatically generated. The extracted data provides a necessary basis for the subsequent construction of the simulation model, ensuring the accuracy and reliability of the electrical characteristic analysis.

[0141] Step S23: Construct a communication circuit board simulation model based on the ground wire structure data and the trace length data, thereby obtaining the communication circuit board simulation model;

[0142] In this embodiment, a communication circuit board simulation model is constructed based on the extracted ground wire structure data and trace length data. Using electromagnetic simulation software (such as HFSS or CST), the extracted data is input to create a three-dimensional model, ensuring that the model includes all important geometric features and material properties. Appropriate boundary conditions and excitation sources are set to simulate the signal transmission characteristics under the actual working environment. After the model is completed, mesh generation is performed to ensure that the mesh density is sufficient to capture the changes in high-frequency signals. Through these steps, an accurate communication circuit board simulation model is finally obtained, providing a basis for subsequent electromagnetic simulation analysis.

[0143] Step S24: Perform high-frequency signal electromagnetic simulation on the communication circuit board simulation model according to the high-frequency characteristic data of the 5G communication circuit board, thereby obtaining high-frequency signal electromagnetic simulation data;

[0144] In this embodiment, the high-frequency characteristic data of the 5G communication circuit board is used to perform high-frequency signal electromagnetic simulation on the communication circuit board simulation model. The electromagnetic simulation software is run, and by setting appropriate frequency ranges and signal excitation conditions, the signal propagation in the circuit board is simulated. During the simulation process, data on reflection, transmission, and other electromagnetic characteristics are recorded, with particular attention paid to the phase change and amplitude change of the signal. These simulation results will show the actual performance of the high-frequency signal in the circuit, helping to identify potential problem areas and providing necessary data support for electrical noise analysis.

[0145] Step S25: Perform electrical noise analysis based on the high-frequency signal electromagnetic simulation data, thereby obtaining electrical noise data;

[0146] In this embodiment, electrical noise analysis is performed based on the electromagnetic simulation data of high-frequency signals. Using the electromagnetic field distribution data extracted by the simulation software, the sources and characteristics of electrical noise are analyzed to identify which signal lines generate interference during the transmission of high-frequency signals. By analyzing the amplitude and phase changes of the signals, the impact of electrical noise on signal integrity is evaluated. Statistical analysis methods are used to calculate the effective value and peak value of electrical noise for subsequent formulation of targeted improvement plans.

[0147] Step S26: Locate the electromagnetic interference source based on the electromagnetic simulation data of high-frequency signals, thereby obtaining electromagnetic interference source data;

[0148] In this embodiment, the electromagnetic interference source is located according to the signal electromagnetic simulation data. Using the electromagnetic field distribution and noise analysis results, the signal lines and components causing interference are determined. An electromagnetic field visualization tool is used to mark the interference source area and analyze its influence on the surrounding signal lines. By cross-analyzing the high-frequency signal propagation path, the location of the interference source and its corresponding influence area are identified to ensure accurate and reliable identification of the interference source, laying a foundation for electromagnetic compatibility analysis.

[0149] Step S27: Integrate the electromagnetic compatibility simulation data based on the electrical noise data and the electromagnetic interference source data, thereby obtaining electromagnetic compatibility simulation data.

[0150] In this embodiment, the electromagnetic compatibility simulation data is integrated based on the electrical noise data and the electromagnetic interference source data. During the integration process, the electrical noise data is combined with the interference source location result to form a comprehensive electromagnetic compatibility analysis model. By performing weighted analysis on the interference from different sources, its impact on the overall performance of the system is evaluated. The electromagnetic compatibility simulation is run to obtain the final simulation results, including EMI indicators and EFT performance evaluation at different frequencies. The integrated electromagnetic compatibility simulation data will provide a basis for optimizing the circuit design to ensure the reliability and stability of the 5G communication circuit board in practical applications.

[0151] Optionally, step S25 is specifically:

[0152] Step S251: Extract the electromagnetic field strength characteristics based on the electromagnetic simulation data of high-frequency signals, thereby obtaining electromagnetic field strength data;

[0153] In this embodiment, electromagnetic field strength feature extraction is performed based on high-frequency signal electromagnetic simulation data. Electromagnetic simulation software (such as HFSS or CST) is used to export electromagnetic field distribution data, which includes electric and magnetic field strength information at specific frequencies. Then, by processing the electromagnetic field data, the electric field strength and magnetic field strength at each key position are extracted to generate a set of electromagnetic field strength data. These data can reflect the distribution characteristics of the electromagnetic field in the circuit and provide a basis for subsequent spectrum analysis, with particular attention paid to the influence of high-frequency signals on the electromagnetic field strength.

[0154] Step S252: Perform a fast Fourier transform on the electromagnetic field strength data to obtain electromagnetic field strength spectrum data;

[0155] In this embodiment, a fast Fourier transform (FFT) is performed on the extracted electromagnetic field strength data to obtain electromagnetic field strength spectrum data. Before performing the FFT, ensure that the electromagnetic field strength data is processed by a window function (such as a Hanning window or a Hamming window) to reduce spectral leakage. Then, use the FFT algorithm to convert the time-domain signal into a frequency-domain signal to obtain the spectrum of the electromagnetic field strength. This spectrum data will display the amplitude and phase information of different frequency components, and can reveal the characteristics of the signal at different frequencies, especially the frequency response of high-frequency signals.

[0156] Step S253: Perform spectrum amplitude statistics on the electromagnetic field strength spectrum data to obtain high-amplitude electromagnetic field strength spectrum data;

[0157] In this embodiment, spectrum amplitude statistics are performed on the electromagnetic field strength spectrum data. By processing the spectrum data, the amplitude of each frequency component is calculated to obtain the amplitude value corresponding to the frequency. Statistical methods such as mean, variance, and peak analysis are used to evaluate the high-amplitude part of the spectrum. The amplitude value is compared with a set threshold (such as 3 dB or 6 dB) to identify the frequency components with amplitudes higher than the threshold. This process will help identify the frequency bands that have a significant impact on electrical noise, facilitating subsequent analysis and optimization.

[0158] Step S254: Perform frequency statistics on the electromagnetic field strength spectrum data to obtain high-frequency electromagnetic field strength spectrum data;

[0159] In this embodiment, frequency statistics are performed on the electromagnetic field strength spectrum data. By analyzing the distribution of each frequency component in the spectrum, the occurrence frequency of different frequency components and their corresponding amplitude values are statistically calculated. The histogram method can be used to group the frequency data to more clearly display the characteristics of the high-frequency electromagnetic field strength spectrum. The frequency data is normalized to ensure the consistency of comparison in different frequency ranges. The high-frequency electromagnetic field strength spectrum data will provide support for subsequent noise analysis, especially focusing on the signal integrity and the frequency range where it is damaged.

[0160] Step S255: Perform an electrical noise spectrum intersection operation based on the high - amplitude electromagnetic field strength spectrum data and the high - frequency electromagnetic field strength spectrum data, thereby obtaining electrical noise data.

[0161] In this embodiment, an electrical noise spectrum intersection operation is performed based on the high - amplitude electromagnetic field strength spectrum data and the high - frequency electromagnetic field strength spectrum data. By comparing the two sets of spectrum data, the intersection region between them is identified, especially focusing on the regions with higher amplitude and higher frequency. During the intersection operation, logical operations (such as AND operation) are applied to ensure that only the frequency components that exist simultaneously in the high - amplitude electromagnetic field spectrum and the high - frequency electromagnetic field spectrum are retained. The finally obtained electrical noise data will reveal the frequency range with the highest interference risk in the circuit, providing clear guidance for subsequent electromagnetic compatibility design and signal integrity optimization.

[0162] Optionally, step S26 is specifically as follows:

[0163] Step S261: Draw an electromagnetic field distribution map based on the high - frequency signal electromagnetic simulation data, thereby obtaining the electromagnetic field distribution map;

[0164] In this embodiment, an electromagnetic field distribution map is drawn based on the high - frequency signal electromagnetic simulation data. Using electromagnetic simulation software (such as ANSYS HFSS or CST Microwave Studio), the electromagnetic simulation results of high - frequency signals are loaded, and the distribution data of the electric field and magnetic field in a specific spatial region are extracted. These data include the electric field strength (expressed in volts per meter) and the magnetic field strength (expressed in amperes per meter). Then, through a three - dimensional visualization tool, the distribution information of the electric field and magnetic field is presented in the form of a color map or a vector map to form an electromagnetic field distribution map. During the drawing process, a color scale is set to distinguish different intensity intervals, ensuring a clear contrast between high - intensity regions and low - intensity regions, providing an intuitive basis for subsequent radiation path analysis.

[0165] Step S262: Trace the radiation path based on the electromagnetic field distribution map, thereby obtaining radiation path tracing data;

[0166] In this embodiment, the radiation path is traced based on the electromagnetic field distribution map. By analyzing the electric field strength and direction in the electromagnetic field distribution map, the main paths of signal radiation are identified. Applying path - tracing algorithms (such as ray - tracing technology), the propagation path of electromagnetic waves from the signal source through different dielectric layers is calculated. During the calculation, the refractive index and reflectivity of the medium are considered to accurately simulate the behavior of signals at the interfaces of different materials. The radiation path tracing data include the specific paths passed by the signal, the refraction and reflection points and their corresponding intensity changes, providing data support for subsequent path classification and signal focusing analysis.

[0167] Step S263: Classify the radiation path according to the radiation path tracking data to obtain the reflection path data and the refraction path data;

[0168] In this embodiment, the radiation path is classified according to the radiation path tracking data. The tracked paths are classified mainly into reflection paths and refraction paths. According to the law of reflection and the law of refraction, specific classification rules are set. For example, when an electromagnetic wave is reflected at an interface, the relationship between the incident angle and the reflection angle is calculated; when refracting, the refraction angle is calculated according to Snell's law. Through these classification rules, the radiation path data is sorted into two groups, respectively recording the relevant information of the reflection path and the refraction path, including the path length, the incident angle, the reflection angle, and the refraction angle. This classification will provide a basis for subsequent signal focusing and intensity consistency analysis.

[0169] Step S264: Statistically analyze the signal focusing area of the reflection path data to obtain the signal focusing area data;

[0170] In this embodiment, the signal focusing area of the reflection path data is statistically analyzed. By analyzing the reflection path, the focusing effect of the signal at different reflection points is calculated. For this purpose, a focusing criterion is set. For example, if the electric field strength near a specific reflection point exceeds a set threshold (such as 10 V / m), then this point is considered as the signal focusing area. Statistically analyze all the reflection paths that meet the conditions, and record the corresponding reflection points and electric field strengths of these paths. Generate the signal focusing area data, which is convenient for subsequent optimization of signal enhancement and electromagnetic interference protection design.

[0171] Step S265: Statistically analyze the paths with consistent signal intensity of the refraction path data to obtain the paths with consistent signal intensity data;

[0172] In this embodiment, the paths with consistent signal intensity of the refraction path data are statistically analyzed. Analyze the electric field strength at each point in the refraction path to ensure that the signal remains relatively stable during propagation. Set a consistency threshold, for example, the signal intensity change does not exceed 5 dB, and identify the refraction paths that meet this standard. The electric field strengths of these paths are relatively consistent, which helps to maintain the integrity of the signal during the entire propagation process. Statistically analyze the refraction paths that meet the conditions to form the paths with consistent signal intensity data, so as to provide support for subsequent interference source analysis.

[0173] Step S266: Perform an intersection operation on the electromagnetic interference source areas according to the signal focusing area data and the paths with consistent signal intensity data to obtain the electromagnetic interference source data.

[0174] In this embodiment, an intersection operation of the electromagnetic interference source region is performed based on the signal focusing region data and the signal intensity consistent path data. The spatial overlap analysis is carried out between the signal focusing region and the signal intensity consistent path to identify the region of their intersection. The geometric intersection algorithm is adopted, and the electric field intensity within the intersection region is confirmed by comparing coordinate points to ensure that this region is a potential electromagnetic interference source. The finally obtained electromagnetic interference source data provides the key region where the signal is interfered during propagation, providing clear guidance for subsequent electromagnetic compatibility analysis and optimization design.

[0175] Optionally, step S4 is specifically as follows:

[0176] Step S41: Extract the characteristics of the circuit board material according to the 5G communication circuit board design data, so as to obtain the circuit board material data;

[0177] In this embodiment, the characteristics of the circuit board material are extracted according to the 5G communication circuit board design data. The electrical and mechanical properties of each material are extracted from the design data, including dielectric constant, conductivity, thermal conductivity, and material thickness. These material data can be obtained through a material database or confirmed through laboratory tests. Then, using a material property extraction tool, the extracted data is classified and sorted to form a detailed circuit board material data set to ensure that the material properties can support high-frequency signal transmission. Finally, the generated data will provide a basic basis for subsequent high-frequency operation simulation and thermal characteristic analysis.

[0178] Step S42: Extract the via position characteristics according to the signal propagation optimized path data, so as to obtain the via position data;

[0179] In this embodiment, the via position characteristics are extracted according to the signal propagation optimized path data. By analyzing the optimized signal propagation path, the necessary via positions in the circuit board design are identified. This process requires using design software (such as Altium Designer or Cadence) to check the layout of the circuit board to ensure that the via positions comply with the design rules. The extraction process includes recording the number, diameter of the vias and their specific coordinates in the circuit diagram. By using a specific threshold, it is ensured that the selection of vias meets the electrical performance requirements, ensuring that high-frequency signals can pass through within an appropriate time, and finally forming a detailed via position data set.

[0180] Step S43: Perform a high-frequency operation simulation according to the circuit board material data and the via position data, so as to obtain the circuit board high-frequency operation data;

[0181] In this embodiment, high-frequency operation simulation is performed based on the circuit board material data and via position data. Select a high-frequency electromagnetic field simulation software (such as ANSYS HFSS or CST Studio) for simulation, and input the circuit board material data and via position data. During the simulation process, set an appropriate frequency range (for example, from 24 GHz to 100 GHz), and apply the electromagnetic wave propagation model to the geometric structure of the circuit board, considering the electromagnetic characteristics of the material. After calculation, the operation data of the circuit board at high frequencies are obtained, including reflection loss, transmission loss, and impedance matching conditions. These data will provide a reference basis for subsequent thermal characteristic simulation.

[0182] Step S44: Perform thermal characteristic simulation analysis based on the high-frequency operation data of the circuit board, so as to obtain the thermal characteristic simulation data of the circuit board.

[0183] In this embodiment, thermal characteristic simulation analysis is performed based on the high-frequency operation data of the circuit board. Use a thermal analysis tool (such as ANSYS Icepak or Flotherm), import the high-frequency operation data of the circuit board into the simulation environment, and set thermal boundary conditions, such as ambient temperature, heat source power, and heat dissipation requirements. Through simulation with thermal simulation software, calculate the thermal distribution and temperature rise of the circuit board during high-frequency signal transmission. The key parameters include the maximum temperature, temperature gradient, and heat flux density, ensuring that they are within the allowable range (for example, the surface temperature of the circuit board does not exceed 85°C). The generated thermal characteristic simulation data of the circuit board will provide an important basis for optimizing the design and heat dissipation strategy.

[0184] Optionally, step S44 is specifically as follows:

[0185] Step S441: Calculate the power loss based on the high-frequency operation data of the circuit board, so as to obtain the power loss data;

[0186] In this embodiment, first, the high-frequency operation data of the circuit board need to be collected, including parameters such as voltage, current, and frequency. These data can be obtained through laboratory tests or on-site monitoring systems. Then, use the power loss calculation formula to calculate the power loss of the circuit board. The power loss calculation formula is as follows: Ploss = I^2 * R * f where P_loss is the power loss, I is the current, R is the resistance of the circuit board, and f is the frequency.

[0187] Step S442: Obtain the thermal conductivity data of the circuit board material;

[0188] In this embodiment, it is necessary to obtain the thermal conductivity data of the circuit board material. The thermal conductivity is a parameter that describes the heat transfer ability of the material, and it determines the amount of heat that the material can transfer per unit time. The thermal conductivity data of the circuit board material can be obtained through laboratory tests or by referring to relevant materials. For example, the thermal conductivity of FR4 material is 0.25 W / mK.

[0189] Step S443: Construct a thermal characteristic simulation model of the circuit board based on the power loss data and the thermal conductivity data of the circuit board material, so as to obtain the thermal characteristic simulation model of the circuit board;

[0190] In this embodiment, the power loss data and the thermal conductivity data of the circuit board material are required to construct the thermal characteristic simulation model of the circuit board. The thermal characteristic simulation model is a mathematical model that describes the thermal behavior of the circuit board, and it can predict the temperature distribution of the circuit board under different conditions. For example, the ANSYS Workbench software can be used to construct the thermal characteristic simulation model of the circuit board. Create the geometric model of the circuit board and define its material and boundary conditions. Use the power loss data and the thermal conductivity data to define the heat source and heat transfer boundary conditions of the circuit board. Finally, run the simulation to obtain the temperature distribution map of the circuit board.

[0191] Step S444: Perform a steady-state thermal simulation on the thermal characteristic simulation model of the circuit board according to the power loss data, so as to obtain the steady-state thermal simulation data;

[0192] In this embodiment, the power loss data is required to perform a steady-state thermal simulation on the thermal characteristic simulation model of the circuit board. Steady-state thermal simulation refers to the thermal simulation carried out under stable conditions, and the purpose is to predict the temperature distribution of the circuit board after long-term operation. For example, the ANSYS Workbench software can be used to perform the steady-state thermal simulation. Define the simulation conditions, including the temperature range and the time step. Then, run the simulation to obtain the temperature distribution map of the circuit board.

[0193] Step S445: Draw a steady-state thermal simulation hot spot area map according to the steady-state thermal simulation data, so as to obtain the steady-state thermal simulation hot spot area map;

[0194] In this embodiment, the hot spot area map needs to be drawn according to the steady-state thermal simulation data. The hot spot area map is a graph that describes the temperature distribution of the circuit board, and it can help engineers quickly identify the hot spot areas of the circuit board. For example, the MATLAB software can be used to draw the hot spot area map. Import the steady-state thermal simulation data. Then, use the graphing tool to draw the hot spot area map. Finally, save the graph file.

[0195] Step S446: Obtain the safe temperature data of the circuit board material;

[0196] In this embodiment, the safe temperature data of the circuit board material needs to be obtained. The safe temperature refers to the highest temperature at which the material will not be damaged under normal use conditions. The safe temperature data of the circuit board material can be obtained through laboratory tests or by referring to relevant materials. For example, the safe temperature of the FR4 material is 125°C.

[0197] Step S447: Divide the steady-state thermal simulation hot spot area map according to the safe temperature data of the circuit board material to obtain the circuit board thermal characteristic simulation data.

[0198] In this embodiment, it is necessary to divide the steady-state thermal simulation hot spot area map according to the safe temperature data of the circuit board material. The high-hot spot simulation area refers to the area where the temperature exceeds the safe temperature, and these areas require special design or improvement. For example, the MATLAB software can be used to divide the high-hot spot simulation area. Import the steady-state thermal simulation hot spot area map. Then, define the safe temperature threshold. Finally, use the graphic tool to divide the high-hot spot simulation area.

[0199] Optionally, this specification also provides a simulation system for the design specification of 5G communication circuit boards, which is used to execute the simulation method for the design specification of 5G communication circuit boards as described above. The simulation system for the design specification of 5G communication circuit boards includes:

[0200] Signal propagation path analysis module: used to obtain the 5G communication circuit board design data, and extract the stack structure data and electrical parameter data according to the 5G communication circuit board design data to obtain the stack structure data and electrical parameter data; perform signal propagation path analysis according to the stack structure data and electrical parameter data to obtain the signal propagation path data;

[0201] Electromagnetic compatibility simulation module: used to obtain the high-frequency characteristic data of the 5G communication circuit board; perform electromagnetic compatibility simulation analysis according to the high-frequency characteristic data and electrical parameter data of the 5G communication circuit board to obtain the electromagnetic compatibility simulation data;

[0202] Signal propagation path optimization module: used to perform signal propagation loss analysis on the signal propagation path data according to the electromagnetic compatibility simulation data to obtain the signal propagation loss data; perform propagation path optimization according to the signal propagation loss data to obtain the signal propagation optimized path data;

[0203] High-frequency operation thermal characteristic simulation module: used to extract the circuit board material characteristics according to the 5G communication circuit board design data to obtain the circuit board material data; perform high-frequency operation thermal characteristic simulation analysis on the signal propagation optimized path data according to the circuit board material data to obtain the circuit board thermal characteristic simulation data;

[0204] Circuit board stack structure optimization module: used to perform stack structure signal attenuation analysis on the signal propagation optimized path data according to the circuit board thermal characteristic simulation data to obtain the stack structure signal attenuation data; perform circuit board stack structure optimization according to the stack structure signal attenuation data to obtain the circuit board stack structure optimization data, and upload it to the 5G communication terminal device management platform to execute the circuit board stack structure optimization task.

[0205] A simulation system for the design specification of 5G communication circuit boards according to the present invention. This system can implement any simulation method for the design specification of 5G communication circuit boards according to the present invention, and is used as a medium for coordinating operations and signal transmission between various modules to complete the simulation method for the design specification of 5G communication circuit boards. The internal modules of the system cooperate with each other, thereby reducing the interference risk in high-frequency signal transmission and optimizing the performance of the 5G system.

[0206] Therefore, from any perspective, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the application documents are intended to be encompassed within the present invention.

[0207] The above are only specific embodiments of the present invention, enabling those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to these embodiments shown herein, but rather to the broadest scope consistent with the principles and novel features invented herein.

Claims

1. A simulation method for 5G communication circuit board design specifications, characterized in that: The following steps are involved: Step S1: Acquire 5G communication circuit board design data, and extract stacking structure data and electrical parameter data according to the 5G communication circuit board design data, so as to obtain stacking structure data and electrical parameter data; perform signal propagation path analysis according to the stacking structure data and electrical parameter data, so as to obtain signal propagation path data. Step S1 is specifically as follows: Step S11: Acquire 5G communication circuit board design data, and extract stacking structure data and electrical parameter data according to the 5G communication circuit board design data, so as to obtain stacking structure data and electrical parameter data; Step S12: performing signal interlayer propagation coupling analysis according to the stacked structure data, thereby obtaining signal interlayer propagation coupling data; Step S13: performing signal propagation loss analysis according to the electrical parameter data, thereby obtaining signal propagation loss data; Step S14: integrating the signal propagation path according to the signal inter-layer propagation coupling data and the signal propagation loss data, thereby obtaining the signal propagation path data; Step S2: obtaining high-frequency characteristic data of the 5G communication circuit board; performing electromagnetic compatibility simulation analysis according to the high-frequency characteristic data and electrical parameter data of the 5G communication circuit board, thereby obtaining electromagnetic compatibility simulation data; Step S3: performing signal propagation loss analysis on the signal propagation path data according to the electromagnetic compatibility simulation data, thereby obtaining signal propagation loss data; performing propagation path optimization according to the signal propagation loss data, thereby obtaining signal propagation optimized path data; Step S4: extracting circuit board material features according to the 5G communication circuit board design data, thereby obtaining circuit board material data; Perform high-frequency operation thermal characteristics simulation analysis on the signal propagation optimization path data according to the circuit board material data, so as to obtain the circuit board thermal characteristics simulation data; Step S5: Perform stacking structure signal attenuation analysis on the signal propagation optimization path data according to the circuit board thermal characteristic simulation data, so as to obtain stacking structure signal attenuation data; optimize the circuit board stacking structure according to the stacking structure signal attenuation data, so as to obtain the circuit board stacking structure optimization data, and upload it to the 5G communication terminal equipment management platform to execute the circuit board stacking structure optimization task.

2. The 5G communication circuit board design specification simulation method according to claim 1 is characterized in that: Step S12 is specifically as follows: Step S121: extracting signal routing layout features and signal routing geometry features according to the stacked structure data, thereby obtaining signal routing layout data and signal routing geometry data; Step S122: constructing a signal line layout model according to the signal line layout data and the signal line geometry data, thereby obtaining a signal line layout model; Step S123: obtaining dielectric constant data of dielectric layer material; Step S124: performing electromagnetic field distribution analysis on the signal line layout model according to the dielectric constant data of the dielectric layer material, thereby obtaining electromagnetic field distribution data; Step S125: performing electromagnetic field distribution area strength statistics according to the electromagnetic field distribution data, thereby obtaining high electromagnetic field distribution area data; Step S126: performing signal line spacing statistics according to the signal routing layout data, thereby obtaining small-interval signal line data; Step S127: performing an electromagnetic field coupling region intersection operation according to the high electromagnetic field distribution region data and the small interval signal line data, thereby obtaining electromagnetic field coupling region data; Step S128: Calculate the interlayer coupling strength of the electromagnetic field coupling region data according to the stacked structure data, thereby obtaining signal interlayer propagation coupling data.

3. The 5G communication circuit board design specification simulation method according to claim 1 is characterized in that: Step S13 is specifically as follows: Step S131: extracting conductor resistance characteristics and conductor current characteristics according to electrical parameter data, thereby obtaining conductor resistance data and conductor current data; Step S132: Calculating dielectric loss according to the conductor resistance data and the conductor current data, thereby obtaining dielectric loss data; Step S133: Acquire signal source characteristic impedance data and incident power data; Step S134: Calculating the reflection loss according to the signal source characteristic impedance data and the incident power data, thereby obtaining the reflection loss data; Step S135: Perform comprehensive calculation of signal propagation loss based on the dielectric loss data and the reflection loss data, so as to obtain signal propagation loss data.

4. The method for simulating the design specification of a 5G communication circuit board according to claim 1, characterized in that: Step S2 is specifically as follows: Step S21: Obtain high-frequency characteristic data of the 5G communication circuit board; Step S22: extracting ground wire structure characteristics and wiring length characteristics according to the electrical parameter data, thereby obtaining ground wire structure data and wiring length data; Step S23: constructing a communication circuit board simulation model according to the ground wire structure data and the wiring length data, thereby obtaining a communication circuit board simulation model; Step S24: performing high-frequency signal electromagnetic simulation on the communication circuit board simulation model according to the high-frequency characteristic data of the 5G communication circuit board, thereby obtaining high-frequency signal electromagnetic simulation data; Step S25: performing electrical noise analysis according to the high-frequency signal electromagnetic simulation data, thereby obtaining electrical noise data; Step S26: locating the electromagnetic interference source according to the high-frequency signal electromagnetic simulation data, thereby obtaining electromagnetic interference source data; Step S27: integrating electromagnetic compatibility simulation data according to the electrical noise data and the electromagnetic interference source data, thereby obtaining electromagnetic compatibility simulation data.

5. The 5G communication circuit board design specification simulation method according to claim 4 is characterized in that: Step S25 is specifically as follows: Step S251: extracting electromagnetic field strength features according to high-frequency signal electromagnetic simulation data, thereby obtaining electromagnetic field strength data; Step S252: performing fast Fourier transform according to the electromagnetic field intensity data, thereby obtaining electromagnetic field intensity spectrum data; Step S253: performing spectrum amplitude statistics according to the electromagnetic field intensity spectrum data, thereby obtaining high-amplitude electromagnetic field intensity spectrum data; Step S254: performing frequency statistics according to the electromagnetic field intensity spectrum data, thereby obtaining high-frequency electromagnetic field intensity spectrum data; Step S255: performing an electrical noise spectrum intersection operation according to the high-amplitude electromagnetic field intensity spectrum data and the high-frequency electromagnetic field intensity spectrum data, thereby obtaining electrical noise data.

6. The method for simulating the design specification of a 5G communication circuit board according to claim 4, characterized in that: Step S26 is specifically as follows: Step S261: Drawing an electromagnetic field distribution map according to the high-frequency signal electromagnetic simulation data, thereby obtaining an electromagnetic field distribution map; Step S262: performing radiation path tracing according to the electromagnetic field distribution diagram, thereby obtaining radiation path tracing data; Step S263: performing path classification according to the radiation path tracing data, thereby obtaining reflection path data and refraction path data; Step S264: performing signal focus area statistics on the reflection path data to obtain signal focus area data; Step S265: performing signal strength consistent path statistics on the refraction path data, thereby obtaining signal strength consistent path data; Step S266: performing an electromagnetic interference source area intersection operation according to the signal focus area data and the signal strength consistent path data, thereby obtaining the electromagnetic interference source data.

7. The method for simulating the design specification of a 5G communication circuit board according to claim 1, characterized in that: Step S4 is specifically as follows: Step S41: extracting circuit board material features according to the 5G communication circuit board design data, thereby obtaining circuit board material data; Step S42: extracting via position features according to the signal propagation optimization path data, thereby obtaining via position data; Step S43: performing high-frequency operation simulation according to the circuit board material data and the via position data, thereby obtaining the circuit board high-frequency operation data; Step S44: performing thermal characteristic simulation analysis based on the high-frequency operation data of the circuit board, thereby obtaining thermal characteristic simulation data of the circuit board.

8. The method for simulating the design specification of a 5G communication circuit board according to claim 7, characterized in that: Step S44 is specifically as follows: Step S441: Calculating power loss according to the high-frequency operation data of the circuit board, thereby obtaining power loss data; Step S442: Acquire thermal conductivity data of circuit board materials; Step S443: constructing a circuit board thermal characteristic simulation model according to the power loss data and the circuit board material thermal conductivity data, thereby obtaining a circuit board thermal characteristic simulation model; Step S444: performing steady-state thermal simulation on the circuit board thermal characteristic simulation model according to the power loss data, thereby obtaining steady-state thermal simulation data; Step S445: drawing a steady-state thermal simulation hotspot area map according to the steady-state thermal simulation data, thereby obtaining a steady-state thermal simulation hotspot area map; Step S446: Obtaining circuit board material safety temperature data; Step S447: dividing the steady-state thermal simulation hotspot area map into high-hotspot simulation areas according to the circuit board material safety temperature data, thereby obtaining the circuit board thermal characteristic simulation data.

9. A simulation system for 5G communication circuit board design specifications, characterized in that: Used to execute the 5G communication circuit board design specification simulation method applicable to claim 1, the 5G communication circuit board design specification simulation system applicable to claim 1 comprises: Signal propagation path analysis module: used to obtain 5G communication circuit board design data, and extract stacking structure data and electrical parameter data according to the 5G communication circuit board design data, so as to obtain stacking structure data and electrical parameter data; perform signal propagation path analysis according to the stacking structure data and electrical parameter data, so as to obtain signal propagation path data; Electromagnetic compatibility simulation module: used to obtain high-frequency characteristic data of 5G communication circuit boards; perform electromagnetic compatibility simulation analysis based on the high-frequency characteristic data and electrical parameter data of 5G communication circuit boards to obtain electromagnetic compatibility simulation data; Signal propagation path optimization module: used to perform signal propagation loss analysis on signal propagation path data according to electromagnetic compatibility simulation data, thereby obtaining signal propagation loss data; perform propagation path optimization according to signal propagation loss data, thereby obtaining signal propagation optimized path data; High-frequency operation thermal characteristics simulation module: used to extract circuit board material characteristics based on 5G communication circuit board design data, so as to obtain circuit board material data; perform high-frequency operation thermal characteristics simulation analysis on signal propagation optimization path data based on circuit board material data, so as to obtain circuit board thermal characteristics simulation data; Circuit board stacking structure optimization module: used to perform stacking structure signal attenuation analysis on signal propagation optimization path data according to circuit board thermal characteristics simulation data, so as to obtain stacking structure signal attenuation data; optimize the circuit board stacking structure according to the stacking structure signal attenuation data, so as to obtain circuit board stacking structure optimization data, and upload it to the 5G communication terminal equipment management platform to execute the circuit board stacking structure optimization task.

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