Ceramic structure transformer and process thereof

Abstract

The ceramic structure transformer comprises a sealing box, a PCB is arranged in the sealing box, a sealing cover used for packaging is arranged at the top end of the PCB, pressing devices used for extruding the PCB are symmetrically arranged at the bottom end of the sealing cover, each pressing device comprises a pressing plate used for pressing the PCB, and a spring used for pushing the pressing plate is arranged at the top end of each pressing plate. The bottom end of the PCB is provided with a heat dissipation piece used for heat dissipation. The design of the sealing box, the sealing cover, the packaging column, the packaging screw, the spring and the pressing assembly is utilized, the packaging screw is rotated to enable the sealing cover to be continuously close to the sealing box, the spring is continuously compressed through the combined action of the top end of the PCB and the bottom end of the sealing cover, and therefore the restoring force of the spring pushes the pressing plate to move in the direction close to the PCB; the stacked PCBs are continuously extruded with each other, so that the PCBs cannot shake in the sealing box when the sealing box is mounted, and meanwhile, the packaging columns limit the displacement of the PCBs, so that the stability of the internal structure of the sealing box is realized.

Description

Technical Field

[0001] The invention relates to the field of transformers, and in particular to a ceramic structure transformer and a process thereof. Background Art

[0002] Currently, electronic devices are constantly developing towards smaller size, higher power density and higher efficiency, and transformers are one of the key components in electronic devices.

[0003] The existing transformer mainly uses a skeleton to support the magnetic core. The manufacturing method is to set the magnetic core on the outer wall of the skeleton. The skeleton has a fixed size. Therefore, when installing the PCB board, since the number of PCB boards cannot be confirmed, the top of the PCB board will exceed the outline range of the skeleton during installation, or there will be a sealing gap between the PCB board and the cover plate, resulting in an unstable structure of the transformer. Summary of the invention

[0004] The object of the present invention is to provide a ceramic structure transformer and a process thereof to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a ceramic structure transformer and its process, comprising a sealing box, a PCB board is arranged inside the sealing box, a sealing cover for packaging is arranged at the top of the PCB board, a pressing device for pressing the PCB board is symmetrically arranged at the bottom of the sealing cover, the pressing device comprises a pressing plate for pressing the PCB board, a spring for pushing the pressing plate is arranged at the top of the pressing plate, and a heat sink for heat dissipation is arranged at the bottom of the PCB board.

[0006] Preferably, a rectangular through groove for placing a PCB board is provided on the top of the sealing box, the heat sink includes a ceramic base plate, the bottom end of the PCB board is fixedly connected to the top end of the ceramic base plate, and a packaging screw for connecting the sealing box and the cover is provided on the top of the cover.

[0007] Preferably, the tops of the PCB board and the ceramic base plate are respectively provided with a first circular through groove and a second circular through groove, the bottom end of the inner wall of the rectangular through groove is fixedly connected with a packaging column for inserting the PCB board and the ceramic base plate, the top of the packaging column is provided with a thread groove, the inner wall of the thread groove is provided with a thread, and the bottom of the packaging screw is threadedly inserted and connected with the thread groove.

[0008] Preferably, a circular groove is provided at the top of the cover, and the circular groove is used to accommodate the top of the packaging screw. An insertion hole is provided at the bottom end of the inner wall of the circular groove, and the insertion hole is used to insert the packaging screw.

[0009] Preferably, limiting grooves are respectively provided on both sides of the top of the sealing box, and limiting blocks are respectively fixedly connected to both sides of the bottom end of the sealing cover, and the limiting blocks are plugged into the limiting grooves.

[0010] Preferably, the limiting block and the limiting groove are used to prevent the cover from rotating.

[0011] Preferably, the top and bottom ends of the spring are fixedly connected to the bottom end of the cover and the top end of the pressing plate respectively, and the bottom end of the pressing plate is fixedly connected with a protective layer.

[0012] Preferably, the protective layer is used to prevent the pressing plate from causing damage to the PCB board.

[0013] Preferably, round holes are respectively opened on both sides of the top of the PCB board and the ceramic base plate, vertical pins are fixedly connected in the round holes, and horizontal pins are fixedly connected to the bottom ends of the vertical pins.

[0014] A ceramic structure transformer installation process includes a ceramic structure transformer, and the ceramic structure transformer installation process includes the following steps:

[0015] In the first step, the top end of the ceramic base plate is fixedly connected to the bottom end of the PCB board, and the combination of the multi-layer PCB board and the ceramic base plate is stacked, and inserted outside the package column through the first circular through groove and the second circular through groove;

[0016] In the second step, the vertical pins are inserted into the round holes of the PCB board and the ceramic base plate, fixed by soldering, and then one end of the horizontal pin is fixed to the bottom end of the vertical pin by soldering;

[0017] The third step is to align the limit block at the bottom of the sealing cover with the limit groove at the top of the sealing box, so that the limit block is inserted into the groove of the limit groove, and then the packaging screw is rotated to make the bottom of the packaging screw intersect and connect with the thread of the thread groove;

[0018] The fourth step is to rotate the package screw until it can no longer rotate. At this time, the restoring force of the spring squeezes the PCB board through the protective layer, thereby ensuring the stability of the PCB board and the ceramic bottom plate inside the sealing box.

[0019] Technical effects and advantages of the present invention:

[0020] The present invention utilizes the design of a sealing box, a sealing cover, a sealing column, a sealing screw, a spring and a pressing assembly. By rotating the sealing screw, the sealing cover is continuously moved closer to the sealing box. At this time, the top end of the PCB board and the bottom end of the sealing cover act together to continuously compress the spring, so that the restoring force of the spring pushes the pressing plate to move in a direction close to the PCB board, so that the stacked PCB boards are continuously squeezed against each other, so that when the sealing box is installed, the PCB board will not shake inside the sealing box, and at the same time, the sealing column limits the displacement of the PCB board, so that the internal structure of the sealing box is stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0022] Figure 2 It is a schematic diagram of the formal cross-sectional structure of the present invention.

[0023] Figure 3 For the present invention Figure 2 A is a schematic diagram of the enlarged structure.

[0024] Figure 4 It is a schematic diagram of the side cross-sectional structure of the present invention.

[0025] Figure 5 For the present invention Figure 4 Middle B is a schematic diagram of the enlarged structure.

[0026] In the figure: 1. sealing box; 2. PCB board; 3. ceramic base plate; 4. horizontal pins; 5. sealing cover; 6. packaging screws; 7. packaging column; 8. limit block; 9. spring; 10. pressing plate; 11. protective layer; 12. vertical pins; 13. threaded groove; 14. circular groove; 15. through hole; 16. limit groove; 17. first circular through groove; 18. second circular through groove. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] Embodiment 1, the present invention provides as follows Figure 1-5A ceramic structure transformer and its process shown in the figure include a sealing box 1, a PCB board 2 is arranged inside the sealing box 1, a sealing cover 5 for packaging is arranged on the top of the PCB board 2, a pressing device for pressing the PCB board 2 is symmetrically arranged on the bottom of the sealing cover 5, the pressing device includes a pressing plate 10 for pressing the PCB board 2, a spring 9 for pushing the pressing plate 10 is arranged on the top of the pressing plate 10, and a heat sink for heat dissipation is arranged on the bottom of the PCB board 2.

[0029] Specifically, a rectangular through groove for placing the PCB board 2 is provided on the top of the sealing box 1, the heat sink includes a ceramic bottom plate 3, the bottom end of the PCB board 2 is fixedly connected to the top end of the ceramic bottom plate 3, a packaging screw 6 for connecting the sealing box 1 and the sealing cover 5 is provided on the top of the sealing cover 5, a first circular through groove 17 and a second circular through groove 18 are respectively provided on the top of the PCB board 2 and the ceramic bottom plate 3, a packaging column 7 for inserting the PCB board 2 and the ceramic bottom plate 3 is fixedly connected to the bottom end of the inner wall of the rectangular through groove, a thread groove 13 is provided on the top of the packaging column 7, a thread is provided on the inner wall of the thread groove 13, and the bottom of the packaging screw 6 is screwed to the thread groove 13. The sealing box 1 is connected by a groove, a circular groove 14 is provided on the top of the sealing cover 5, and the circular groove 14 is used to receive the top of the packaging screw 6. The bottom end of the inner wall of the circular groove 14 is provided with an insertion hole 15, and the insertion hole 15 is used to insert the packaging screw 6. Limiting grooves 16 are respectively provided on both sides of the top of the sealing box 1, and limiting blocks 8 are fixedly connected to both sides of the bottom end of the sealing box 5. The limiting blocks 8 are plugged into the limiting grooves 16. The limiting blocks 8 and the limiting grooves 16 are used to prevent the sealing cover 5 from rotating. Circular holes are respectively provided on both sides of the top of the PCB board 2 and the ceramic base plate 3, and vertical pins 12 are fixedly connected in the circular holes. The bottom ends of the vertical pins 12 are fixedly connected to the horizontal pins 4.

[0030] Furthermore, the sealing box 1, the sealing cover 5, the PCB board 2, the lateral pins 4, the packaging column 7 and the vertical pins 12 constitute the existing model P018 series planar transformer, the sealing box 1 and the sealing cover 5 constitute the packaging body, the PCB board 2 is the existing circuit PCB board, the ceramic base plate 3 is a ceramic board with a size corresponding to the PCB board 2, and the outer wall of the ceramic base plate 3 is electrostatically sprayed with circuits in multiple layers, so as to avoid the problem of ceramic fragility. At the same time, a large amount of heat will be generated when the PCB board 2 is working, and the ceramic material can have a good heat dissipation effect. The size of the circular groove 14 is 1.03 times the size of the top of the packaging screw 6, so that when the packaging screw 6 is completely unable to rotate, the top of the packaging screw 6 is completely set inside the circular groove 14, and the insertion hole 15 guides the bottom of the packaging screw 6 to the inside of the thread groove 13 of the packaging column 7, and the position of the thread groove 13 corresponds to the position of the insertion hole 15. The thread inside the thread groove 13 is consistent with the thread of the outer wall of the bottom of the packaging screw 6 The grooves are meshed with each other, the diameter of the second circular through groove 18 is the same as that of the first circular through groove 17, the diameter of the packaging column 7 is 0.95 times the diameter of the first circular through groove 17, the limit block 8 is a rectangular block, the size of the limit groove 16 is 1.03 times the size of the limit block 8, and when the limit block 8 is inserted into the inside of the limit groove 16, when the packaging screw 6 is rotated, under the restriction of the limit block 8, the cover 5 will not rotate with the packaging screw 6, and the packaging box 1 and the cover 5 can be closed by rotating the packaging screw 6 to realize the packaging of the PCB board 2 and the ceramic base plate 3. The horizontal pins 4 and the vertical pins 12 form an existing circuit pin, and the horizontal pins 4 and the vertical pins 12 form an L shape. Through the vertical pins 12, a passage can be formed for the multi-layer PCB board 2, and the horizontal pins 4 are welded to the external circuit board. The spring 9, the pressing plate 10 and the protective layer 11 are a group, symmetrically arranged on both sides of the bottom end of the cover 5, and the limit blocks 8 are symmetrically arranged on both sides of the bottom end of the cover 5.

[0031] Specifically, the top and bottom ends of the spring 9 are fixedly connected to the bottom end of the cover 5 and the top end of the pressing plate 10 respectively. The bottom end of the pressing plate 10 is fixedly connected with a protective layer 11, which is used to prevent the pressing plate 10 from causing damage to the PCB board 2.

[0032] Furthermore, the pressing plate 10 is a metal hard rectangular strip, and the protective layer 11 is a rubber strip, so that when the spring 9 pushes the pressing plate 10, the pressing plate 10 squeezes the PCB board 2, and the protective layer 11 is between the pressing plate 10 and the PCB board 2, and plays a buffering role. At the same time, the protective layer 11 can protect the top of the PCB board 2 from being scratched by the pressing plate 10, thereby protecting the circuit.

[0033] Embodiment 2, a ceramic structure transformer installation process, the ceramic structure transformer installation process includes the following steps:

[0034] In the first step, the top of the ceramic base plate 3 is fixedly connected to the bottom of the PCB board 2, and the combination of the multi-layer PCB board 2 and the ceramic base plate 3 is stacked, and the PCB board 2 and the ceramic base plate 3 are inserted outside the package column 7 through the first circular through groove 17 and the second circular through groove 18;

[0035] In the second step, the vertical pin 12 is inserted into the circular holes of the PCB board 2 and the ceramic base plate 3, and the vertical pin 12 is fixedly connected to the PCB board 2 and the ceramic base plate 3 by soldering, and then one end of the horizontal pin 4 is fixed to the bottom end of the vertical pin 12 by soldering;

[0036] Step 3: Align the limiting block 8 at the bottom of the sealing cover 5 with the limiting groove 16 at the top of the sealing box 1, insert the limiting block 8 into the limiting groove 16, and then rotate the packaging screw 6 to make the bottom of the packaging screw 6 and the thread groove 13 threadably connected;

[0037] In the fourth step, the packaging screw 6 is continuously rotated. The packaging screw 6 drives the cover 5 to continuously move toward the sealing box 1 by squeezing the circular groove 14. While the cover 5 moves, the bottom end of the cover 5 and the bottom end of the PCB board 2 work together to continuously squeeze the spring 9 until the packaging screw 6 can no longer rotate. At this time, the restoring force of the spring 9 pushes the pressing plate 10 to move toward the PCB board 2. The pressing plate 10 drives the protective layer 11, so that the protective layer 11 squeezes the PCB board 2 stacked at the bottom, so that the gap between the stacked PCB boards 2 is continuously reduced, thereby ensuring the stability of the PCB board 2 and the ceramic bottom plate 3 inside the sealing box 1.

[0038] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A ceramic structure transformer, comprising a sealing box (1), wherein a PCB board (2) is arranged inside the sealing box (1), and a sealing cover (5) for packaging is arranged on the top of the PCB board (2), characterized in that: A pressing device for pressing the PCB board (2) is symmetrically arranged at the bottom end of the cover (5), the pressing device comprising a pressing plate (10) for pressing the PCB board (2), a spring (9) for pushing the pressing plate (10) is arranged at the top end of the pressing plate (10), and a heat sink for heat dissipation is arranged at the bottom end of the PCB board (2).

2. A ceramic structure transformer according to claim 1, characterized in that: The top of the sealing box (1) is provided with a rectangular through groove for placing a PCB board (2); the heat sink comprises a ceramic base plate (3); the bottom end of the PCB board (2) is fixedly connected to the top end of the ceramic base plate (3); and the top of the sealing cover (5) is provided with a packaging screw (6) for connecting the sealing box (1) and the sealing cover (5).

3. A ceramic structure transformer according to claim 2, characterized in that: The top ends of the PCB board (2) and the ceramic base plate (3) are respectively provided with a first circular through groove (17) and a second circular through groove (18); the bottom ends of the inner walls of the rectangular through grooves are fixedly connected with a packaging column (7) for inserting the PCB board (2) and the ceramic base plate (3); the top of the packaging column (7) is provided with a thread groove (13); the inner wall of the thread groove (13) is provided with a thread; the bottom of the packaging screw (6) is threadedly inserted and connected with the thread groove (13).

4. A ceramic structure transformer according to claim 2, characterized in that: The top of the cover (5) is provided with a circular groove (14), and the circular groove (14) is used to receive the top of the packaging screw (6). The bottom of the inner wall of the circular groove (14) is provided with an insertion hole (15), and the insertion hole (15) is used to insert the packaging screw (6).

5. The ceramic structure transformer according to claim 1, characterized in that: Limiting grooves (16) are respectively provided on both sides of the top of the sealing box (1), and limiting blocks (8) are respectively fixedly connected to both sides of the bottom end of the sealing cover (5), and the limiting blocks (8) are plugged into the limiting grooves (16).

6. A ceramic structure transformer according to claim 5, characterized in that: The limiting block (8) and the limiting groove (16) are used to prevent the cover (5) from rotating.

7. The ceramic structure transformer according to claim 1, characterized in that: The top and bottom ends of the spring (9) are fixedly connected to the bottom end of the sealing cover (5) and the top end of the pressing plate (10) respectively, and the bottom end of the pressing plate (10) is fixedly connected to a protective layer (11).

8. The ceramic structure transformer according to claim 7, characterized in that: The protective layer (11) is used to prevent the pressing plate (10) from causing damage to the PCB board (2).

9. The ceramic structure transformer according to claim 2, characterized in that: Circular holes are respectively provided on both sides of the top of the PCB board (2) and the ceramic base plate (3), a vertical pin (12) is fixedly connected in the circular hole, and a horizontal pin (4) is fixedly connected to the bottom end of the vertical pin (12).

10. A process for installing a ceramic structure transformer, characterized in that: The ceramic structure transformer according to any one of claims 1 to 9, wherein the installation process of the ceramic structure transformer comprises the following steps: In the first step, the top end of the ceramic base plate (3) is fixedly connected to the bottom end of the PCB board (2), and the combination of the multi-layer PCB board (2) and the ceramic base plate (3) is stacked and inserted into the outside of the packaging column (7) through the first circular through groove (17) and the second circular through groove (18); In the second step, the vertical pin (12) is inserted into the circular holes of the PCB board (2) and the ceramic base plate (3), the vertical pin (12) is fixed by soldering, and one end of the horizontal pin (4) is fixed to the bottom end of the vertical pin (12) by soldering; The third step is to align the limiting block (8) at the bottom end of the sealing cover (5) with the limiting groove (16) at the top of the sealing box (1), so that the limiting block (8) is inserted into the groove of the limiting groove (16), and then the packaging screw (6) is rotated so that the bottom of the packaging screw (6) is threadedly connected with the thread groove (13); The fourth step is to rotate the packaging screw (6) until it can no longer rotate. At this time, the restoring force of the spring (9) squeezes the PCB board (2) through the protective layer (11), thereby ensuring the stability of the PCB board (2) and the ceramic base plate (3) inside the sealing box (1).

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