Semiconductor process chamber and method for detecting position of liquid spray arm

Abstract

The application provides a semiconductor process chamber and a position detection method of a liquid spraying arm. The semiconductor process chamber comprises a cavity, a liquid spraying arm and a chuck. The liquid spraying arm and the chuck are arranged in the cavity. The liquid spraying arm is used for spraying liquid on a wafer carried by the chuck. The semiconductor process chamber further comprises a measuring structure and a plurality of distance measuring sensors. The measuring structure is fixedly arranged on the liquid spraying arm and has a plurality of measuring surfaces. The plurality of distance measuring sensors are used for measuring the distance of the respective measuring surface, so as to determine the position of the measuring structure along the direction perpendicular to each measuring surface, and further determine the position offset of the measuring structure. The semiconductor process chamber provided by the application can determine the position offset of the measuring structure on the liquid spraying arm by measuring the measuring surface of the measuring structure through the plurality of distance measuring sensors, so as to find abnormalities when the perpendicularity of the liquid spraying arm changes, and ensure the cleaning effect of the wafer and the yield of the wafer.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor process equipment, in particular, to a semiconductor process chamber and a position detection method of a liquid spraying arm. BACKGROUND

[0002] In a single wafer cleaning equipment, a liquid spraying arm (ARM) structure plays a role of spraying liquid, and the liquid spraying arm needs to spray liquid to a wafer on a chuck during a process. If the perpendicularity of the liquid spraying arm structure is affected, it will cause uneven distribution of the liquid sprayed on the wafer, affecting the cleaning effect of the wafer and the yield of the wafer, which not only causes irreparable loss to the current product, but also causes a large amount of product waste if not discovered in time. However, the existing single wafer cleaning equipment cannot automatically detect the position of the liquid spraying arm before the liquid spraying arm sprays liquid, so it cannot timely discover the change of the perpendicularity of the liquid spraying arm, resulting in poor wafer cleaning effect and low yield.

[0003] Therefore, how to provide a semiconductor process chamber capable of automatically detecting the position of the liquid spraying arm has become a technical problem to be solved in the field. SUMMARY

[0004] The present application aims to provide a semiconductor process chamber capable of ensuring the accuracy of the position of the liquid spraying arm.

[0005] To achieve the above-mentioned purpose, as one aspect of the present application, a semiconductor process chamber is provided, which comprises a cavity, a liquid spraying arm and a chuck, the liquid spraying arm and the chuck are both arranged in the cavity, the liquid spraying arm is used for spraying liquid on a wafer carried by the chuck, and the semiconductor process chamber further comprises a measuring structure and a plurality of distance measuring sensors, the measuring structure is fixedly arranged on the liquid spraying arm, and the measuring structure has a plurality of measuring surfaces, and the plurality of distance measuring sensors are used for distance measurement on the respective measuring surfaces to determine the position of the measuring structure along the direction perpendicular to each measuring surface, and further determine the position offset of the measuring structure.

[0006] Optionally, the measuring structure comprises at least one measuring block, the measuring block has a pair of measuring surfaces, and the two measuring surfaces are perpendicular to each other, and the semiconductor process chamber comprises a pair of distance measuring sensors, the two distance measuring sensors are respectively opposite to the two measuring surfaces of the measuring block and are used for distance measurement on the measuring surfaces to determine the position offset of the measuring structure.

[0007] Optionally, the measurement structure comprises a pair of the measurement blocks, the measurement blocks further have an abutting surface, the measurement surface and the abutting surface are parallel to the axis of the liquid spraying arm, the abutting surface is formed with a locking groove, the abutting surfaces of the two measurement blocks are combined, and the two locking grooves embrace the two sides of the liquid spraying arm to fix the two measurement blocks on the liquid spraying arm.

[0008] Optionally, the measurement block has a plurality of fixing portions on the two sides along the extension direction of the axis of the liquid spraying arm, and the fixing portions of the two measurement blocks are fixedly connected one by one.

[0009] Optionally, the inner wall of the locking groove is formed with at least one arc-shaped groove extending around the axis of the liquid spraying arm, the arc-shaped grooves of the two measurement blocks are communicated one by one, and the semiconductor process chamber further comprises at least one sealing ring, the sealing ring is sleeved on the liquid spraying arm and is arranged in the arc-shaped groove one by one.

[0010] Optionally, the inner wall of the locking groove is formed with two arc-shaped grooves, the two arc-shaped grooves are arranged at intervals along the extension direction of the axis of the liquid spraying arm, and the semiconductor process chamber comprises a pair of the sealing rings.

[0011] Optionally, the measurement block has a pair of the fixing portions on the two sides along the extension direction of the axis of the liquid spraying arm, and each pair of the fixing portions is arranged on the two sides of the locking groove.

[0012] Optionally, the fixing portion is formed with a mounting hole, and the fixing portions of the two measurement blocks are fixedly connected one by one through threaded fasteners.

[0013] As a second aspect of the present application, a liquid spraying arm position detection method is provided for detecting the position of the liquid spraying arm in the semiconductor process chamber described above, the method comprises:

[0014] According to the ranging values obtained by the plurality of ranging sensors ranging the plurality of measurement surfaces, the position offset of the measurement structure is determined.

[0015] Optionally, the position offset of the liquid spraying arm is determined according to the ranging values obtained by the plurality of ranging sensors ranging the plurality of measurement surfaces, comprising:

[0016] According to the detection ranging values obtained by the two ranging sensors ranging the two measurement surfaces, and the origin ranging values of the two ranging sensors when the liquid spraying arm is in the normal position, the axial offset of the measurement structure along the corresponding two coordinate axes is determined.

[0017] determine the position offset of the measurement structure based on the Pythagorean theorem according to the two axial offsets of the measurement structure

[0018] In the position detection method of the semiconductor process chamber and the liquid spraying arm provided by the application, a measurement structure is arranged on the liquid spraying arm, and the measurement structure has a plurality of measurement surfaces, so that when the perpendicularity of the liquid spraying arm changes, the position of the measurement structure will also change with the swing of the liquid spraying arm, thereby changing the distance between each measurement surface of the measurement structure and the corresponding distance measuring sensor, and then the position offset of the measurement structure can be determined according to the distance measuring results of each distance measuring sensor, and the swing amplitude of the liquid spraying arm is determined, so as to correct the perpendicularity deviation of the liquid spraying arm. The semiconductor process chamber provided by the application can determine the position offset of the measurement structure on the liquid spraying arm through distance measurement of the plurality of measurement surfaces of the measurement structure fixed on the liquid spraying arm by the plurality of distance measuring sensors, so that abnormalities can be found in time when the perpendicularity of the liquid spraying arm changes, and the semiconductor process can be continued under the condition of abnormal position of the liquid spraying arm, thereby ensuring the cleaning effect of the wafer and the yield of the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0019] The accompanying drawings are included to provide a further understanding of the application, and constitute a part of the specification, and together with the specific embodiments below, serve to explain the application, but do not constitute a limitation on the application. In the drawings:

[0020] Figure 1 is a structural schematic diagram of the semiconductor process chamber provided by the embodiment of the application;

[0021] Figure 2 is a structural schematic diagram of the semiconductor process chamber provided by the embodiment of the application;

[0022] Figure 3 is a structural schematic diagram of the semiconductor process chamber provided by the embodiment of the application;

[0023] Figure 4 is Figure 3 is an exploded schematic diagram of the structure in

[0024] Figure 5 is a structural schematic diagram of the measurement structure in the semiconductor process chamber provided by the embodiment of the application;

[0025] Figure 6 is Figure 5 is an exploded schematic diagram of the structure in

[0026] Figure 7 is a top structural schematic diagram of the measurement block in the semiconductor process chamber provided by the embodiment of the application.

[0027] MARKED FOR EXPLANATION:

[0028] 100: cavity

[0029] 200: liquid spraying arm

[0030] 210: vertical section

[0031] 220: horizontal section

[0032] 230: nozzle

[0033] 300: chuck

[0034] 400: measuring structure

[0035] 410: measuring block

[0036] 411: measuring surface

[0037] 412: abutting surface

[0038] 413: locking groove

[0039] 414: arc-shaped groove

[0040] 420: fixing portion

[0041] 430: sealing ring

[0042] 440: threaded fastener

[0043] 441: screw

[0044] 442: nut

[0045] 510: distance measuring sensor

[0046] 520: mounting seat

[0047] 600: driving mechanism DETAILED DESCRIPTION

[0048] The specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely intended to illustrate and explain the present application, and are not intended to limit the present application.

[0049] To solve the above technical problems, as one aspect of the present application, a semiconductor process chamber is provided, which comprises a cavity 100, a liquid spraying arm 200 and a chuck 300, wherein the liquid spraying arm 200 and the chuck 300 are arranged in the cavity 100, and the liquid spraying arm 200 is used to spray liquid on a wafer carried by the chuck 300. Figure 1 As shown in FIG. 1, the semiconductor process chamber comprises a cavity 100, a liquid spraying arm 200 and a chuck 300, wherein the liquid spraying arm 200 and the chuck 300 are arranged in the cavity 100, and the liquid spraying arm 200 is used to spray liquid on a wafer carried by the chuck 300. Figure 2As shown, the semiconductor process chamber further comprises a measuring structure 400 fixedly arranged on the liquid spraying arm 200, and the measuring structure 400 has a plurality of measuring surfaces 411, and the plurality of distance measuring sensors 510 are used to measure the distance of the respective measuring surface 411, so as to determine the position of the measuring structure 400 along the direction perpendicular to the respective measuring surface 411, and then determine the position offset of the measuring structure 400.

[0050] In the semiconductor process chamber provided by the application, the measuring structure 400 is arranged on the liquid spraying arm 200, and the measuring structure 400 has a plurality of measuring surfaces 411, so that when the perpendicularity of the liquid spraying arm 200 changes, the position of the measuring structure 400 will also change with the swing of the liquid spraying arm 200, so that the distance between each measuring surface 411 of the measuring structure 400 and the corresponding distance measuring sensor 510 changes, and then the position offset of the measuring structure 400 (i.e. the deviation between the position of the measuring structure 400 and the initial position when the perpendicularity of the liquid spraying arm 200 is normal) can be determined according to the distance measuring result of each distance measuring sensor 510 to the respective measuring surface 411, and the swing amplitude of the liquid spraying arm 200 is determined, so as to correct the perpendicularity deviation of the liquid spraying arm 200. The semiconductor process chamber provided by the application can determine the position offset of the measuring structure 400 on the liquid spraying arm 200 by distance measuring the plurality of measuring surfaces 411 of the measuring structure 400 fixed on the liquid spraying arm 200 through the plurality of distance measuring sensors 510, so that the abnormality can be found in time when the perpendicularity of the liquid spraying arm 200 changes, and the semiconductor process is avoided to continue under the condition that the position of the liquid spraying arm 200 is abnormal, so as to ensure the cleaning effect of the wafer and the yield of the wafer.

[0051] As an optional embodiment of the application, the distance measuring sensor 510 is an optical distance measuring sensor.

[0052] In order to ensure the accuracy of detecting the position of the liquid spraying arm 200, as a preferred embodiment of the application, as shown in Figures 3 to 7 As shown, the measuring structure 400 comprises at least one measuring block 410, the measuring block 410 has a pair of measuring surfaces 411, and the two measuring surfaces 411 are perpendicular to each other, and as shown in Figure 3 、 Figure 4 As shown, the semiconductor process chamber comprises a pair of distance measuring sensors 510, and the two distance measuring sensors 510 are respectively opposite to the two measuring surfaces 411 of the measuring block 410 and are used to measure the distance of the two measuring surfaces 411, so as to determine the position offset of the liquid spraying arm 200.

[0053] In this embodiment of the invention, two ranging sensors 510 are positioned opposite the two measuring surfaces 411 of the measuring block 410 and perform one-to-one distance measurement on the measuring surfaces 411. The two measuring surfaces 411 being measured are located on the same measuring block 410, thereby ensuring that the two measuring surfaces 411 being measured always remain perpendicular and their relative positions remain unchanged, thus ensuring the accuracy of detecting the position of the liquid spraying arm 200.

[0054] Furthermore, in this embodiment of the invention, the positional offset of the measuring structure 400 is determined by measuring the distances of the two measuring surfaces 411 using two ranging sensors 510. This allows for the construction of a Cartesian coordinate system based on the ranging data from the two ranging sensors 510. Specifically:

[0055] like Figure 2 As shown, taking the ranging direction of one ranging sensor 510 as the x-direction and the ranging direction of the other ranging sensor 510 as the y-direction, under the condition that the verticality of the spray arm 200 is good, ranging can be performed to obtain the origin ranging value X0 between the ranging sensor 510 in the x-direction and the corresponding measuring surface 411, and the origin ranging value Y0 between the ranging sensor 510 in the y-direction and the corresponding measuring surface 411. Therefore, the origin position of the spray arm 200 is A(X0, Y0). In the actual process, the ranging direction in the x-direction... The detection distance measured by the distance sensor 510 is X1, and the detection distance measured by the distance sensor 510 in the y-direction is Y1. Therefore, the detection position of the spray arm 200 is B(X1,Y1). The offset of the spray arm 200 in the X-axis direction is ΔX = |X1 - X0|, and the offset of the spray arm 200 in the Y-axis direction is ΔY = |Y1 - Y0|. Then, according to the Pythagorean theorem, the positional offset of the spray arm 200 relative to the origin (i.e., the position of the measuring structure 400 when the perpendicularity of the spray arm 200 is good) is...

[0056] As a preferred embodiment of the present invention, such as Figures 3 to 6 As shown, the measuring structure 400 includes a pair of measuring blocks 410. Each measuring block 410 also has a mating surface 412. Both the measuring surface 411 and the mating surface 412 are parallel to the axis of the liquid spraying arm 200. A locking groove 413 is formed on the mating surface 412. The mating surfaces 412 of the two measuring blocks 410 are engaged, and the two locking grooves 413 surround the two sides of the liquid spraying arm 200 to fix the two measuring blocks 410 on the liquid spraying arm 200.

[0057] In the embodiment of the present application, the measuring structure 400 comprises a pair of measuring blocks 410, which are fixed by the two sides of the liquid spraying arm 200. In actual use, only the two measuring surfaces 411 of one measuring block 410 face the two distance measuring sensors 510, respectively, and the two distance measuring sensors 510 emit light to the two measuring surfaces 411 and receive the reflected light to measure the distance, thereby determining the position of the measuring structure 400. In addition, the two measuring blocks 410 each have two measuring surfaces 411 perpendicular to each other, so that when one measuring block 410 cannot realize distance measurement due to wear, dirt, or the like, the other measuring block 410 can be rotated to the direction of the measuring block 410 originally used for distance measurement, the positions of the two measuring blocks 410 are exchanged, the other measuring block 410 replaces the originally used measuring block 410, and the measuring surface 411 rotated to face the distance measuring sensor 510 can still normally measure the distance, thereby reducing the maintenance cycle of the measuring block 410 and ensuring the production capacity of the machine.

[0058] As an optional embodiment of the present application, as shown in Figure 2 , the semiconductor process chamber further comprises a plurality of mounting seats 520 fixedly arranged on the inner wall of the cavity 100, and the plurality of distance measuring sensors 510 are fixedly arranged on the plurality of mounting seats 520 one by one.

[0059] As an optional embodiment of the present application, the semiconductor process chamber further comprises a controller configured to determine the position offset of the measuring structure 400 through the distance measurement result of the distance measuring sensor 510.

[0060] In order to improve the safety of the semiconductor process, as a preferred embodiment of the present application, the controller is further configured to issue an alarm and control the semiconductor process chamber to stop the process when the position offset of the measuring structure 400 exceeds a preset offset threshold (i.e., the inclination amplitude of the liquid spraying arm 200 increases to affect the uniformity of the liquid sprayed by the liquid spraying arm 200 to the wafer).

[0061] As an optional embodiment of the present application, as shown in Figure 6 , Figure 7 , the locking groove 413 is a semicylindrical groove.

[0062] As an optional embodiment of the present application, as shown in Figures 4 to 7 , the measuring block 410 has a plurality of fixing portions 420 on the two sides in the extension direction of the liquid spraying arm 200 axis, and the plurality of fixing portions 420 of the two measuring blocks 410 are fixedly connected one by one.

[0063] In order to ensure the stability of the position of the measuring block 410, as a preferred embodiment of the present application, as shown in Figure 6As shown, the inner wall of the locking groove 413 is formed with at least one arc-shaped groove 414 extending around the axis of the liquid spraying arm 200, and the arc-shaped grooves 414 of the two measuring blocks 410 are one-to-one correspondingly connected, and the semiconductor process chamber further comprises at least one sealing ring 430, which is sleeved on the liquid spraying arm 200 and is one-to-one correspondingly arranged in the arc-shaped groove 414.

[0064] In the embodiment of the present application, the sealing ring 430 is further arranged between the inner wall of the locking groove 413 and the surface of the liquid spraying arm 200. The sealing ring can be elastically deformed to tighten the liquid spraying arm 200, thereby preventing the measuring block 410 from slipping off the liquid spraying arm 200 and preventing the measuring block 410 from being twisted around the axis of the liquid spraying arm 200, ensuring the stability of the position of the measuring block 410, and further ensuring the accuracy of the ranging result of the distance sensor 510, and improving the accuracy of the position of the liquid spraying arm 200.

[0065] As an optional embodiment of the present application, the material of the sealing ring 430 comprises Teflon rubber.

[0066] As an optional embodiment of the present application, as shown in Figure 6 As shown, the inner wall of the locking groove 413 is formed with two arc-shaped grooves 414, and the two arc-shaped grooves 414 are arranged at intervals along the extension direction of the axis of the liquid spraying arm 200, and the semiconductor process chamber comprises a pair of sealing rings 430.

[0067] As an optional embodiment of the present application, as shown in Figures 4 to 7 As shown, the two sides of the measuring block 410 along the extension direction of the axis of the liquid spraying arm 200 are respectively provided with a pair of fixing parts 420, and each pair of fixing parts 420 is arranged on the two sides of the locking groove 413.

[0068] As an optional embodiment of the present application, as shown in Figure 6 As shown, the fixing part 420 is formed with a mounting hole, and the plurality of fixing parts 420 of the two measuring blocks 410 are one-to-one correspondingly fixed and connected by the threaded fastener 440.

[0069] As an optional embodiment of the present application, the threaded fastener 440 can be a bolt, specifically, as shown in Figure 6 As shown, the threaded fastener 440 comprises a screw 441 and a nut 442, the screw 441 passes through the mounting holes of the corresponding two fixing parts 420 in sequence and is screwed into the nut 442 to fixedly connect the two fixing parts 420.

[0070] As an optional embodiment of the present application, the material of the measuring block 410 comprises polyvinyl chloride (PVC).

[0071] As an optional embodiment of the present application, as shown inFigure 3 , Figure 4 As shown, the liquid spraying arm 200 includes a vertical section 210, a horizontal section 220 and a nozzle 230. The horizontal section 220 is connected between the vertical section 210 and the nozzle 230. The vertical section 210 and the nozzle 230 are both vertically arranged, and the vertical section 210 and the horizontal section 220 are connected by an arc transition, and the horizontal section 220 and the nozzle 230 are connected by an arc transition.

[0072] As an optional embodiment of the present invention, such as Figures 2 to 4 As shown, the height of the measuring structure 400 is lower than the height of the nozzle.

[0073] As an optional embodiment of the present invention, such as Figure 1 As shown, the semiconductor process chamber also includes a drive mechanism 600, which is connected to the bottom end of the vertical section 210 and is used to drive the liquid spraying arm 200 to rise and fall and rotate around the axis of the vertical section 210.

[0074] As a second aspect of the present invention, a method for detecting the position of a liquid spraying arm 200 is provided, for detecting the position of a liquid spraying arm 200 in a semiconductor process chamber provided in the embodiments of the present invention, the method comprising:

[0075] Based on the distance values ​​obtained by multiple distance sensors 510 measuring the distance to their respective measuring surfaces 411, the position of the measuring structure 400 along the direction perpendicular to each measuring surface 411 is determined, and then the position offset of the measuring structure 400 is determined.

[0076] In the position detection method of the liquid spraying arm 200 provided by the present invention, a measuring structure 400 is provided on the liquid spraying arm 200, and the measuring structure 400 has multiple measuring surfaces 411. So when the verticality of the liquid spraying arm 200 changes, the position of the measuring structure 400 will also change with the swing of the liquid spraying arm 200, thereby changing the distance between each measuring surface 411 of the measuring structure 400 and its corresponding distance sensor 510. Then, the position offset of the measuring structure 400 can be determined according to the distance measurement results of each distance sensor 510. The semiconductor process chamber provided by this invention can measure the distance of multiple measuring surfaces 411 of the measuring structure 400 fixed on the liquid spraying arm 200 by multiple ranging sensors 510, so as to determine the positional offset of the measuring structure 400 on the liquid spraying arm 200. This allows for timely detection of abnormalities when the verticality of the liquid spraying arm 200 changes, preventing the semiconductor process from continuing when the position of the liquid spraying arm 200 is abnormal, thereby ensuring the cleaning effect of the wafer and the wafer yield.

[0077] As an optional embodiment of the present invention, the measuring structure 400 includes a pair of measuring blocks 410. Each measuring block 410 has a mating surface 412 parallel to the axis of the liquid spraying arm 200 and a pair of measuring surfaces 411. The two measuring surfaces 411 of each measuring block 410 are perpendicular to each other. A locking groove 413 is formed on the mating surface 412. The mating surfaces 412 of the two measuring blocks 410 are engaged, and the two locking grooves 413 surround the two sides of the liquid spraying arm 200 to fix the two measuring blocks 410 on the liquid spraying arm 200.

[0078] The semiconductor process chamber includes a pair of ranging sensors 510. The two ranging sensors 510 are used to measure the distance between the two measuring surfaces 411 of the same measuring block 410 in order to determine the positional offset of the measuring structure 400.

[0079] The steps for determining the position of the measuring structure 400 along the direction perpendicular to each measuring surface 411 based on the distance values ​​obtained by multiple distance sensors 510 measuring the distances to their respective measuring surfaces 411, and then determining the position offset of the measuring structure 400, specifically include:

[0080] Based on the detection distance values ​​obtained by the two distance sensors 510 measuring the distances of the two measuring surfaces 411, and the origin distance values ​​of the two distance sensors 510 when the liquid spraying arm 200 is in the normal position, the axial offset of the measuring structure 400 along the corresponding two coordinate axes is determined.

[0081] Based on the two axial offsets of the measuring structure 400, the position offset of the measuring structure 400 is determined using the Pythagorean theorem.

[0082] Specifically, such as Figure 2 As shown, taking the ranging direction of one ranging sensor 510 as the x-direction and the ranging direction of the other ranging sensor 510 as the y-direction, under the condition that the verticality of the spray arm 200 is good, ranging can be performed to obtain the origin ranging value X0 between the ranging sensor 510 in the x-direction and the corresponding measuring surface 411, and the origin ranging value Y0 between the ranging sensor 510 in the y-direction and the corresponding measuring surface 411. Therefore, the origin position of the spray arm 200 is A(X0, Y0). In the actual process, the ranging sensor 510 in the x-direction measures a detection ranging value of X1, and the ranging sensor 510 in the y-direction measures a detection ranging value of Y1. Therefore, the detection position of the measuring structure 400 is B(X1, Y1). The offset of the measuring structure 400 in the x-axis direction is ΔX = |X1 - X0|, and the offset of the measuring structure 400 in the y-axis direction is ΔY = |Y1 - Y0|. Then, according to the Pythagorean theorem, the positional offset of the measuring structure 400 relative to the origin is...

[0083] As a third aspect of the present application, a single wafer cleaning device is provided, comprising the semiconductor process chamber provided by the embodiments of the present application.

[0084] In the single wafer cleaning device provided by the present application, the measuring structure 400 is arranged on the liquid spraying arm 200, and the measuring structure 400 has a plurality of measuring surfaces 411, so that when the perpendicularity of the liquid spraying arm 200 changes, the position of the measuring structure 400 will also change with the swing of the liquid spraying arm 200, thereby changing the distance between each measuring surface 411 of the measuring structure 400 and the corresponding distance measuring sensor 510, and then the position offset of the measuring structure 400 can be determined according to the distance measuring results of each distance measuring sensor 510. The semiconductor process chamber provided by the present application can determine the position offset of the measuring structure 400 by distance measuring the plurality of measuring surfaces 411 of the measuring structure 400 fixed on the liquid spraying arm 200 through the plurality of distance measuring sensors 510, so that the abnormality can be found in time when the perpendicularity of the liquid spraying arm 200 changes, and the semiconductor process can be avoided to continue under the condition of abnormal position of the liquid spraying arm 200, thereby ensuring the cleaning effect of the wafer and the yield of the wafer.

[0085] It can be understood that the above embodiments are only exemplary embodiments for illustrating the principles of the present application, and the present application is not limited thereto. Various modifications and improvements can be made by those skilled in the art without departing from the spirit and essence of the present application, and these modifications and improvements are also considered to be within the protection scope of the present application.

Claims

1. A semiconductor process chamber, the semiconductor process chamber comprising a cavity, a chemical spray arm and a chuck, the chemical spray arm and the chuck each disposed in the cavity, the chemical spray arm for spraying a chemical onto a wafer carried by the chuck, characterized by, The semiconductor process chamber further comprises a measuring structure and a plurality of distance sensors, the measuring structure is fixedly arranged on the liquid spraying arm, and the measuring structure has a plurality of measuring surfaces; the plurality of distance sensors are used for distance measurement of the respective measuring surfaces, so as to determine the position of the measuring structure along the direction perpendicular to each measuring surface, and further determine the position offset of the measuring structure.

2. The semiconductor process chamber of claim 1, wherein, The measuring structure comprises at least one measuring block, the measuring block has a pair of measuring surfaces, and the two measuring surfaces are perpendicular to each other; the semiconductor process chamber comprises a pair of distance sensors, and the two distance sensors are respectively opposite to the two measuring surfaces of the measuring block and are used for distance measurement of the measuring surfaces, so as to determine the position offset of the measuring structure.

3. The semiconductor process chamber of claim 2, wherein, The measuring structure comprises a pair of measuring blocks, the measuring blocks further have abutting surfaces, the measuring surfaces and the abutting surfaces are parallel to the axis of the liquid spraying arm, the abutting surfaces are formed with locking grooves, the abutting surfaces of the two measuring blocks are combined, and the two locking grooves embrace the two sides of the liquid spraying arm, so as to fix the two measuring blocks on the liquid spraying arm.

4. The semiconductor process chamber of claim 3, wherein, The two sides of the measuring block along the extension direction of the axis of the liquid spraying arm are respectively provided with a plurality of fixing parts, and the plurality of fixing parts of the two measuring blocks are fixedly connected one by one.

5. The semiconductor process chamber of claim 4, wherein, At least one arc-shaped groove extending along the axis of the liquid spraying arm is formed on the inner wall of the locking groove, and the arc-shaped grooves of the two measuring blocks are communicated one by one; the semiconductor process chamber further comprises at least one sealing ring, and the sealing ring is sleeved on the liquid spraying arm and is arranged in the arc-shaped groove one by one.

6. The semiconductor process chamber of claim 5, wherein, Two arc-shaped grooves are formed on the inner wall of the locking groove, and the two arc-shaped grooves are arranged at intervals along the extension direction of the axis of the liquid spraying arm; the semiconductor process chamber comprises a pair of sealing rings.

7. The semiconductor process chamber of claim 4, wherein, The two sides of the measuring block along the extension direction of the axis of the liquid spraying arm are respectively provided with a pair of fixing parts, and each pair of fixing parts is arranged on the two sides of the locking groove.

8. The semiconductor process chamber of claim 4, wherein, Mounting holes are formed in the fixing parts, and the plurality of fixing parts of the two measuring blocks are fixedly connected one by one through threaded fasteners.

9. A method of detecting the position of a chemical liquid spraying arm, characterized by, The method for detecting the position of the liquid spraying arm in the semiconductor process chamber of any one of claims 1 to 8 comprises: According to the distance measurement values obtained by the plurality of distance sensors for distance measurement of the respective measuring surfaces, the position of the measuring structure along the direction perpendicular to each measuring surface is determined, and further the position offset of the measuring structure is determined.

10. The method of claim 9, wherein According to the distance measurement values obtained by the plurality of distance sensors for distance measurement of the respective measuring surfaces, the position of the measuring structure along the direction perpendicular to each measuring surface is determined, and further the position offset of the measuring structure is determined. According to the detection distance measurement values obtained by the two distance sensors for distance measurement of the two measuring surfaces, and the original point distance measurement values of the two distance sensors when the liquid spraying arm is in the normal position, the axial offset of the measuring structure along the corresponding two coordinate axes is determined. Based on the two axial offset amounts of the measurement structure, a position offset amount of the measurement structure is determined based on the Pythagorean theorem.

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