Treatment liquid supply apparatus, substrate treatment apparatus including the same, and method for treating treatment liquid

Abstract

A processing liquid supply apparatus includes: a discharge line through which a processing liquid is discharged from a substrate processing apparatus; a first tank that stores the recovered treatment liquid that has been recovered through the discharge line; a process liquid supply unit that supplies new process liquid to the discharge line through a first transfer line; a first heating unit that is provided between the process liquid supply unit and the discharge line, and that controls the temperature of the new process liquid passing through the first transfer line; and a second tank that resupplies the recovered processing liquid supplied from the first tank through a second transfer line to the substrate processing apparatus through a supply line.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of Korean Patent Application No. 10-2023-0130103 filed in the Korean Intellectual Property Office on September 27, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] Embodiments of the present disclosure relate to a process liquid supply apparatus, a substrate processing apparatus including the process liquid supply apparatus, and a method for processing the process liquid. Background Art

[0004] Generally, in the process of manufacturing a semiconductor substrate, various processing liquids can be used in a wet etching process and a cleaning process to remove a film from the surface of the substrate. The processing liquid discharged after the processing liquid is used in the processing process can be recovered and reused. In this case, since a process of processing the concentration of the processing liquid to a reusable concentration is necessary in order to reuse the liquid, the concentration can be adjusted by supplying new processing liquid to the processing liquid.

[0005] The treatment liquid discharged from the substrate processing equipment can be recovered and stored in a recycling tank, can be moved to the sub-tank and the main tank in sequence, the process of adjusting the concentration can be performed in sequence, and the treatment liquid can be supplied back to the substrate processing equipment. In this process, since the treatment liquid at room temperature is often stored in the recycling tank, the temperature of the treatment liquid can be reduced to about 40 to 50°C (depending on the amount of the liquid and up to about 30 to 40°C), which is lower than the process temperature (about 55°C) required for substrate processing. Here, the temperature can be reduced to about 30 to 40°C. Therefore, a large amount of time may be required to control the temperature of the treatment liquid in the recycling tank and the sub-tank. In addition, since the concentration of the recovered treatment liquid is adjusted while the liquid is sequentially moved to the recycling tank, the sub-tank and the main tank, the time required to control and stabilize the concentration of the treatment liquid may also increase, which may be problematic.

[0006] An embodiment of the present disclosure is to provide a processing liquid supply device, which can quickly adjust the temperature of the processing liquid to a target temperature and stabilize the temperature of the processing liquid before the liquid flows into a recycling tank without a sub-tank for temperature control, as well as a substrate processing device including the processing liquid supply device and a method for processing the processing liquid. Summary of the invention

[0007] According to an embodiment of the present disclosure, a processing liquid supply device includes: a discharge pipeline, through which processing liquid is discharged from a substrate processing device; a first tank, which stores recycled processing liquid recycled through the discharge pipeline; a processing liquid supply unit, which supplies new processing liquid to the discharge pipeline through a first delivery pipeline; a first heating unit, which is arranged between the processing liquid supply unit and the discharge pipeline and controls the temperature of the new processing liquid passing through the first delivery pipeline; and a second tank, which re-supplies the recycled processing liquid supplied from the first tank through a second delivery pipeline to the substrate processing device through a supply pipeline.

[0008] According to an embodiment of the present disclosure, a method for treating a treatment liquid includes: discharging the treatment liquid from a substrate processing device through a discharge pipeline; supplying new treatment liquid to the discharge pipeline through a treatment liquid supply unit; adjusting the temperature of the new treatment liquid supplied to the discharge pipeline by a first heating unit; adjusting the temperature of the recovered treatment liquid recovered into the first tank through the discharge pipeline to a predetermined temperature; and conveying the recovered treatment liquid whose concentration and temperature are controlled to the second tank.

[0009] According to an embodiment of the present disclosure, a substrate processing device includes:

[0010] Craft Room;

[0011] a processing container disposed in the process chamber to accommodate a substrate therein, the processing container including a liquid outlet on a bottom surface thereof and having an open upper portion;

[0012] a supporting unit that supports the substrate and includes a supporting shaft that is disposed in the processing container and rotates and a spin head connected to the supporting shaft;

[0013] a nozzle unit disposed on an outer side of the processing container and including a moving nozzle device that discharges a processing liquid to the substrate; and

[0014] A treatment liquid supply device, the treatment liquid supply device comprising:

[0015] a discharge line connected to the liquid outlet and discharging the treated liquid;

[0016] a first tank storing recovered process liquid recovered through the discharge line;

[0017] a treatment liquid supply unit, the treatment liquid supply unit supplying new treatment liquid to the discharge line through the first delivery line;

[0018] a first heating unit which is disposed between the process liquid supply unit and the discharge line and controls a temperature of the new process liquid passing through the first delivery line; and

[0019] a second tank that resupplies the recovered processing liquid supplied from the first tank through a second delivery line to the substrate processing apparatus through a supply line,

[0020] wherein the discharge line is configured as a pipe for discharging the treatment liquid disposed between the substrate processing device and the first tank, and the first delivery line is configured as a pipe for supplying the new treatment liquid disposed between the treatment liquid supply unit and the discharge line, wherein one end of the discharge line is connected to the substrate processing device, the other end of the discharge line is connected to the first tank, one end of the first delivery line is connected to the treatment liquid supply unit, and the other end of the first delivery line is connected to the discharge line and connected between one end and the other end of the discharge line, wherein the first heating unit is configured as a jacket heater surrounding at least a portion of an outer surface of the first delivery line, and wherein the treatment liquid discharged from the processing container sequentially passes through the first tank and the second tank and is supplied back to the nozzle unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and other aspects, features and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0022] Figure 1 is a cross-sectional view illustrating a substrate processing apparatus according to an embodiment of the present disclosure;

[0023] Figure 2 is a diagram illustrating a processing liquid supply apparatus and a substrate processing apparatus according to an embodiment of the present disclosure;

[0024] Figure 3 is a diagram illustrating a processing liquid supply apparatus and a substrate processing apparatus according to an embodiment of the present disclosure;

[0025] Figure 4 is a diagram illustrating a process liquid supply apparatus and a process liquid of a substrate processing apparatus according to an embodiment of the present disclosure;

[0026] Figure 5 is a diagram illustrating a process liquid supply apparatus and a process liquid of a substrate processing apparatus according to an embodiment of the present disclosure;

[0027] Figure 6is a diagram illustrating a processing liquid supply apparatus and a substrate processing apparatus according to an embodiment of the present disclosure;

[0028] Figure 7 is a diagram illustrating a processing liquid supply apparatus and a substrate processing apparatus according to an embodiment of the present disclosure;

[0029] Figure 8 is a flow chart illustrating a method for treating a process liquid according to an embodiment of the present disclosure; and

[0030] Fig. 9 It is a graphic Figure 8 Flowchart of a method for treating a process liquid is shown in FIG. DETAILED DESCRIPTION

[0031] Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings. Various embodiments will be described with reference to the accompanying drawings. Redundant descriptions and detailed descriptions of known functions and elements that may unnecessarily obscure the subject matter of the present disclosure will be omitted. The same elements will be indicated by the same reference numerals. The terms "upper", "upper portion", "upper end", "lower", "lower portion", "lower end", etc. are indicated relative to the accompanying drawings, and the terms "interior", "exterior", etc. are indicated relative to the periphery of the component, and the terms may vary depending on the direction in which the component is set.

[0032] The terms “include,” “comprise,” “configured to,” or similar terms in the description are used to indicate the presence of features, numbers, steps, operations, elements, parts, or a combination thereof, and do not exclude the possibility of combining or adding one or more features, numbers, steps, operations, elements, parts, or a combination thereof.

[0033] Figure 1 is a cross-sectional view illustrating a substrate processing apparatus according to an embodiment.

[0034] Reference Figure 1 , the substrate processing apparatus 1 can be applied to a cleaning process, and can perform the cleaning process by spraying liquid required for the cleaning process to the substrate via a liquid supply line. However, embodiments thereof are not limited thereto, and the substrate processing apparatus 1 can be applied to various processes in which liquid is provided, such as an etching process.

[0035] The substrate processing apparatus 1 may include a process chamber 100 that processes a substrate W using liquid. In the process chamber 100 , a process may be performed on the substrate W while horizontally maintaining the substrate W. The process chamber 100 may be used to perform various processes on the substrate W using various processing liquids.

[0036] The process chamber 100 may provide a sealed internal space, and the fan filter unit 110 may be installed in the upper portion. The fan filter unit 110 may generate a vertical airflow in the process chamber 100. The fan filter unit 110 may be configured as a unit obtained by modularization of a filter and an air supply fan, and may filter clean air and supply the filtered air into the process chamber 100. The clean air may pass through the fan filter unit 110, may be supplied into the process chamber 100, and may form a vertical airflow. The vertical airflow may provide a uniform airflow on the upper portion of the substrate W, and pollutants (smoke) generated in the process of treating the surface of the substrate W by the treatment fluid may be discharged to the exhaust line 130 through the bowl B of the treatment container 200 together with the air and may be removed, so that a high degree of cleanliness may be maintained in the treatment container.

[0037] The process chamber 100 may include a process area 100a and a maintenance area 100b partitioned by a horizontal partition 101. The maintenance area 100b may be a space in which an exhaust line 130 and an exhaust line 120 connected to the process container 200 are disposed, and the maintenance area 100b may be isolated from the process area 100a in which the substrate W is processed.

[0038] In addition, the substrate processing apparatus 1 may include a processing container 200, a support unit 300, and a nozzle unit 400 in the process chamber 100. The processing container 200 may be installed in the process chamber 100, may have a cylindrical shape including an open upper portion, and may provide a processing space for processing a substrate W. The open upper surface of the processing container 200 may be provided as an output and input channel for the substrate W. Here, the support unit 300 may be provided in the processing space. In this case, the support unit 300 may support the substrate W and may rotate the substrate W when performing a process.

[0039] In addition, the processing container 200 may provide an upper space 200a in which the spin head 310 of the support unit 300 is disposed and a lower space 200b in which the exhaust gas collecting unit 250 is connected to the lower portion to enable forced exhaust. The exhaust gas collecting unit 250 may be connected to the exhaust line 120 extending outside the process chamber 100. In the upper space 200a of the processing container 200, an annular bowl B that enters and absorbs the processing liquid and gas scattered on the rotating substrate W may be arranged in multiple stages. The bowl B may include an exhaust port h that is connected to a common annular space (corresponding to the lower space of the processing container). Here, the bowl B may be a portion into which an airflow including liquid and smoke scattered from the substrate W flows.

[0040] The support unit 300 may be installed in the processing container 200. The support unit 300 may support the substrate W while the process is performed, and may be rotated by the driving member 330 while the process is performed. In addition, the support unit 300 may include a spin head 310 having a circular upper surface. A support shaft 320 supporting the spin head 310 may be connected to a lower portion of the spin head 310, and the support shaft 320 may be rotated by a driving member 330 connected to a lower end thereof. In this case, the driving member 330 may include a motor, and the spin head 310 and the substrate W may rotate as the support shaft 320 is rotated by the driving member 330.

[0041] The nozzle unit 400 may discharge liquid (process liquid, etc.) to the substrate W supported on the support unit 300 . The nozzle unit 400 may be a movable nozzle device 400M or a fixed nozzle device (not shown). A plurality of movable nozzle devices 400M may be installed on the outside of the processing container 200 .

[0042] The chamber fluid collector 500 may include a fluid collection container 510 and a suction portion 520 .

[0043] The fluid collection container 510 may be disposed in the process chamber 100 , and the suction portion 520 may be mounted on the fluid collection container 510 and provide suction force to the fluid collection container 510 to suck liquid in the process chamber 100 .

[0044] As an embodiment, the fluid collection container 510 may have an internal space 510a to form a space in which the liquid in the process chamber 100 is collected, and a plurality of inlet holes 510b may be formed in a portion to allow the liquid in the process chamber 100 to flow. In addition, the suction portion 520 may be configured to provide a suction force to the fluid collection container 510 to suck the liquid in the process chamber 100. That is, the suction portion 520 may be configured to generate a negative pressure in the internal space 510a of the fluid collection container 510. As described above, the internal space 510a of the fluid collection container 510 may be formed at a pressure lower than the external pressure by the suction portion 520, and the fluid collection container 510 may suck the liquid in the process chamber 100 through the inlet holes 510b, so that the liquid generated after the substrate treatment process can be removed from the process chamber 100, and the internal area of ​​the process chamber 100 may be prevented from being contaminated by the salt contained in the liquid.

[0045] In addition, although not shown in the drawings, the suction part 520 may have a structure connected to an environmental exhaust unit. The environmental exhaust unit may be installed in the process chamber 100 to exhaust the gas in the process chamber 100 to the outside of the process chamber 100, and the environmental exhaust unit and the suction part 520 may be connected to each other. In this case, the suction part 520 may provide the necessary suction force for the fluid collection container 510 using the exhaust force of the environmental exhaust unit without having a driving source for generating the suction force. The environmental exhaust unit may be the exhaust line 120 of the above-mentioned substrate processing apparatus 1, or alternatively, may be an exhaust port for exhausting the gas in the process chamber 100.

[0046] In the substrate processing apparatus 1 described above, the processing liquid (or processing liquid) used when performing various processes on the substrate W can be discharged to the outside of the substrate processing apparatus 1 after use. In this case, the used processing liquid can be discharged to the outside of the substrate processing apparatus 1 through a liquid outlet (not shown) provided in the processing container 200 and a discharge line L10 connected thereto. For example, the liquid outlet can be formed on the bottom surface of the processing container 200. In this case, the discharged processing liquid can be recovered in the processing liquid supplying apparatus 1000, 1000a, 1000b, 1000c, 1000d and 1000e included in the substrate processing apparatus 1, and can be processed in the substrate processing apparatus 1 to be reusable. Hereinafter, various processes in which the processing liquid (or processing liquid) is used in the substrate processing apparatus 1 may be referred to as processes for processing the substrate W.

[0047] Treatment liquid supply equipment 1000, 1000a, 1000b, 1000c, 1000d and 1000e can recycle the treatment liquid discharged from substrate treatment equipment 1, and can add new treatment liquid to the treatment liquid (hereinafter referred to as the treatment liquid of recovery), thus adjusting the concentration. In addition, treatment liquid supply equipment 1000, 1000a, 1000b, 1000c, 1000d and 1000e can heat new treatment liquid and the treatment liquid of recovery to process temperature. Through the treatment process, the treatment liquid of recovery can be processed into a reusable state in treatment liquid supply equipment 1000, 1000a, 1000b, 1000c, 1000d and 1000e. The method for handling treatment liquid can be described in more detail below.

[0048] Figure 2 2 is a diagram illustrating a process liquid supply apparatus and a substrate processing apparatus according to an embodiment. Figure 3 2 is a diagram illustrating a process liquid supply apparatus and a substrate processing apparatus according to an embodiment.

[0049] Reference Figure 2, the embodiment (hereinafter, the treatment liquid supplying apparatus 1000 according to Embodiment 1) may include a first tank 1100, a treatment liquid supplying unit 1200, a first heating unit 1300, and a second tank 1400. In addition, the treatment liquid supplying apparatus 1000 may further include a concentration detecting unit 1500 and a control unit 1600.

[0050] The first tank 1100 may recover a treatment liquid discharged after being used in a process of treating a substrate W in the substrate treatment apparatus 1. The first tank 1100 may be connected to a discharge line L10 for discharging the treatment liquid from the substrate treatment apparatus 1. In this case, the discharge line L10 may be a pipe for discharging the treatment liquid provided between the substrate treatment apparatus 1 and the first tank 1100. However, embodiments thereof are not limited thereto, and the discharge line L10 may be, for example, in the form of a hose for moving the treatment liquid. One end of the discharge line L10 may be connected to the substrate treatment apparatus 1, and the other end of the discharge line L10 may be connected to the first tank 1100. In this case, the portion to which one end of the discharge line L10 is connected may be a liquid outlet (not shown) provided in the treatment container 200.

[0051] The discharged treatment liquid may move through the discharge line L10, and may be stored in the first tank 1100. As described above, the treatment liquid recovered into the treatment liquid supply apparatus 1000 may be referred to as recovered treatment liquid.

[0052] For example, the first tank 1100 may include a decompression member (not shown), such as an aspirator. In this case, the process liquid may be moved to the first tank 1100 by reducing the internal pressure of the first tank 1100 by means of the decompression member to generate a pressure difference. As another example, a pump (not shown) may be provided in the discharge line L10, and by operating the pump, the process liquid may pass through the discharge line L10 and may be moved to the first tank 1100. However, embodiments thereof are not limited thereto, and the process liquid may be transported from the substrate processing apparatus 1 to the first tank 1100 in various ways. In this case, the discharge line L10 may include a filter (not shown) to filter the process liquid before moving to the first tank 1100.

[0053] Generally, the processing liquid used in the process of processing the substrate W may include various components, for example, H 2 O 2After the treatment liquid is supplied to the substrate treatment apparatus 1, a portion of the used treatment liquid may be discarded, but another portion of the treatment liquid may be recovered to the first tank 1100. In this case, while performing the process of treating the substrate W, a portion of the DIW may evaporate or TiN contained in the substrate W may be ionized due to the etching process. Therefore, the concentration of Ti ions in the treatment liquid may increase, and the concentration of Ti ions in the treatment liquid may decrease due to various reasons (for example, Ti ions decompose H 2 O 2 ). Therefore, the concentration of Ti ions in the discharged processing liquid may be different from the concentration of Ti ions when supplied to the substrate processing apparatus 1.

[0054] To solve the above problem, the treatment liquid supply unit 1200 can supplement the discharged treatment liquid with new treatment liquid to increase the amount of the treatment liquid, and can adjust the concentration of Ti ions in the treatment liquid by adding. In this case, the treatment liquid supply unit 1200 may include a first delivery line 1210.

[0055] The first delivery line 1210 may be a passage through which the treatment liquid supplied from the treatment liquid supply unit 1200 passes and may be connected to the discharge line L10. The treatment liquid supply unit 1200 may supply new treatment liquid to the discharge line L10 through the first delivery line 1210. Therefore, the concentration of the treatment liquid passing through the discharge line L10 may be adjusted to a predetermined concentration before flowing into the first tank 1100. Here, the newly supplied treatment liquid may include DIW, H 2 O 2 and a mixed liquid of BEOL organic chemicals (post-TiN strips). In addition, the predetermined concentration may be a concentration of Ti ions in the liquid sufficient to allow the processing liquid to be re-supplied to the substrate processing apparatus 1 and reused in the process of processing the substrate W. The predetermined concentration may be, for example, less than 30 ppm.

[0056] The first delivery line 1210 may be a pipe for moving the treatment liquid provided between the treatment liquid supply unit 1200 and the discharge line L10. However, the embodiment thereof is not limited thereto, and the first delivery line 1210 may be, for example, in the form of a hose for moving the treatment liquid. One end of the first delivery line 1210 may be connected to the treatment liquid supply unit 1200. The other end of the first delivery line 1210 may be connected to the discharge line L10, and in this case, the other end of the first delivery line 1210 may be connected to one end of the discharge line L10 [i.e., connected to the end of the substrate processing device 1] and the other end [i.e., connected to the end of the first tank 1100].

[0057] The first heating unit 1300 may control the temperature of the new treatment liquid supplied from the treatment liquid supply unit 1200 before encountering the treatment liquid discharged from the substrate treatment device 1. In this case, the first heating unit 1300 may be disposed between the treatment liquid supply unit 1200 and the discharge line. The first heating unit 1300 may heat the treatment liquid passing through the first delivery line 1210 to a predetermined temperature. The first heating unit 1300 may be, for example, a jacket heater. In this case, the predetermined temperature may be a temperature higher than room temperature, and may be a process temperature that may be used for a process for treating the substrate W, and, for example, the predetermined temperature may be 35°C to 75°C. Preferably, the predetermined temperature may be 55°C±0.5°C, and more preferably 55°C.

[0058] While being used and moved in the substrate processing apparatus 1, the temperature of the discharged processing liquid may decrease, and after being discharged in a state lower than the process temperature above (e.g., room temperature), the processing liquid may move along the discharge line L10. In this case, as described above, a new processing liquid heated to a predetermined temperature may be supplied to the discharge line L10. Therefore, in the discharge line L10, the processing liquid discharged from the substrate processing apparatus 1 may be mixed with the new processing liquid, and the temperature of the discharged processing liquid may be increased. As described above, by adding the new processing liquid in the preheated state, the temperature of the processing liquid may be adjusted for the first time before the processing liquid flows into the substrate first tank 1100. Thereafter, the processing liquid mixed with the processing liquid and whose concentration and temperature are adjusted may flow into the first tank 1100 and may be stored.

[0059] The first tank 1100 may include a second heating unit 1110 and a temperature sensor 1120. The second heating unit 1110 may heat the recovered treatment liquid stored in the first tank 1100, thereby controlling the temperature of the treatment liquid for the second time. The temperature sensor 1120 may measure the temperature of the recovered treatment liquid in the first tank 1100. The temperature sensor 1120 may transmit the temperature measurement value to the control unit 1600, which will be described later. The control unit 1600 may determine whether the temperature of the recovered treatment liquid has reached a predetermined temperature based on the received temperature measurement value. The control unit 1600 may control the second heating unit 1110 based on the determination result.

[0060] For example, when the temperature measurement value of the control unit 1600 is lower than a predetermined temperature, the second heating unit 1110 may heat the recovered treatment liquid stored in the first tank 1100 so that the temperature becomes the predetermined temperature. As another example, when the temperature measurement value is the same as or close to the predetermined temperature, the control unit 1600 may control the second heating unit 1110 to maintain the recovered treatment liquid in the first tank 1100 warm to maintain the predetermined temperature. As described above, the recovered treatment liquid in the first tank 1100 whose temperature and concentration have been adjusted may be moved to the second tank 1400 through the second transfer line U.

[0061] The recovered processing liquid supplied from the first tank 1100 may be temporarily stored in the second tank 1400 before being supplied to the substrate processing apparatus 1 again. In this case, the second tank 1400 may be connected to the first tank 1100 through the second delivery line U. More specifically, the recovered processing liquid whose concentration and temperature have been adjusted in the discharge line L10 and the first tank 1100 may be moved to the second tank 1400 through the second delivery line U, and may be stored. In this case, a delivery pump (not shown) may be installed in the second delivery line U, and the recovered processing liquid may be moved from the first tank 1100 to the second tank 1400.

[0062] The second tank 1400 may resupply the recovered treatment liquid (hereinafter referred to as reprocessed treatment liquid) that has been processed by controlling the concentration and temperature to the substrate processing apparatus 1 through the supply line L20. The supplied reprocessed treatment liquid may be reused in the process of processing the substrate W in the substrate processing apparatus 1.

[0063] The concentration detection unit 1500 can measure the concentration of the recovered treatment liquid. For example, the concentration measured by the concentration detection unit 1500 can be the concentration of Ti ions contained in the recovered treatment liquid. In this case, the concentration detection unit 1500 can include at least one concentration detection pipeline. In the treatment liquid supply device 1000 according to Example 1, the concentration detection unit 1500 can include a concentration detection pipeline (first concentration detection pipeline S10).

[0064] The concentration detection unit 1500 may detect the concentration of the recovered treatment liquid stored in the second tank 1400 through the first concentration detection line S10. In this case, one end of the first concentration detection line S10 may be connected to the concentration detection unit 1500, and the other end of the first concentration detection line S10 may be connected to the supply line L20. In this case, when the recovered treatment liquid stored in the second tank 1100 is discharged through the supply line L20, a portion of the discharged treatment liquid may flow into the concentration detection unit 1500 through the first concentration detection line S10. The concentration detection unit 1500 may detect the concentration of the recovered treatment liquid in the second tank 1400 using the treatment liquid. The concentration detection unit 1500 may transmit a first concentration measurement value to the control unit 1600, which may be a result value of measuring the concentration of the recovered treatment liquid in the second tank 1400.

[0065] The control unit 1600 can adjust the concentration of the recovered treatment liquid stored in the second tank 1400 to maintain constant. More specifically, the control unit 1600 can control the supply amount of the treatment liquid of the treatment liquid supply unit 1200 based on the concentration measurement value measured by the concentration detection unit 1500. In this case, the control unit 1600 can be implemented as, for example, a circuit substrate, a computer chip mounted on the circuit substrate, or software embedded in a computer chip installed on a control computer for the treatment liquid supply device 1000, 1000a, 1000b, 1000c, 1000d and 1000e or in the control computer. Alternatively, the control unit 1600 can be implemented in the form of software embedded in the control computer.

[0066] For example, when the first concentration measurement value received from the concentration detection unit 1500 is lower than a predetermined concentration, the control unit 1600 may increase the supply amount of the treatment liquid supplied to the discharge line L10 by controlling the treatment liquid supply unit 1200. As another example, when the first concentration measurement value received from the concentration detection unit 1500 is higher than a predetermined concentration, the supply amount of the treatment liquid supplied to the discharge line L10 may be reduced by controlling the treatment liquid supply unit 1200. As another example, when the first concentration measurement value received from the concentration detection unit 1500 is a predetermined concentration, the treatment liquid supply unit 1200 may be controlled to maintain the amount of the treatment liquid supplied to the discharge line L10.

[0067] In addition, the control unit 1600 can control the second heating unit 1110 so that the temperature of the recovered treated liquid stored in the first tank 1100 is a predetermined temperature, and in this case, since the method of controlling the second heating unit 1110 based on the temperature measurement value is the same as described above, no repeated description will be provided.

[0068] Reference Figure 3 In the case of a treatment liquid supply device 1000a) and a substrate treatment device 1 according to another embodiment (hereinafter, embodiment 2), the treatment liquid supply unit 1200 may include a plurality of first delivery lines L20. In this case, a plurality of first heating units 1300 may also be provided, and the treatment liquid supplied to the discharge line L10 through each of the first delivery lines L20 may be heated to a predetermined temperature. In this case, the treatment liquid supply unit 1200 may supply the treatment liquid to the discharge line L10 using a portion of the plurality of first delivery lines L20 or the entire first delivery line L20. Therefore, the amount of treatment liquid supplied to the discharge line L10 per unit time may be increased, so that the time required to adjust the concentration of the treatment liquid before flowing into the first tank 1100 may be reduced.

[0069] Figure 4 2 is a diagram illustrating a process liquid supply apparatus and a process liquid of a substrate processing apparatus according to an embodiment.

[0070] Reference Figure 4 , a treatment liquid supplying apparatus 1000b according to another embodiment (hereinafter, Embodiment 3) may include a first tank 1100, a treatment liquid supplying unit 1200, a first heating unit 1300, a second tank 1400, a concentration detecting unit 1500, and a control unit 1600. Since most features may be the same or similar to those of Embodiment 1 described above, a repeated description will not be provided, and the differences will be described.

[0071] In the treatment liquid supply apparatus 1000b according to Embodiment 3, the concentration detection unit 1500 may include two concentration detection lines. In this case, the two concentration detection lines may be referred to as a first concentration detection line S10 and a second concentration detection line S20.

[0072] As in the embodiment 1 described above, the first concentration detection line S10 may be connected to the supply line L20. The concentration detection unit 1500 may measure the concentration of the recovered treatment liquid stored in the second tank 1400 through the first concentration detection line S10. The concentration detection unit 1500 may transmit a first concentration measurement value, which is a result value of measuring the concentration of the recovered treatment liquid in the second tank 1400, to the control unit 1600.

[0073] The second concentration detection line S20 may be connected to the first tank 1100. More specifically, the second concentration detection line S20 may be connected to the second delivery line U, and a portion of the recovered treatment liquid discharged from the first tank 1100 by the delivery pump may flow into the concentration detection unit 1500 through the second delivery line U. The concentration detection unit 1500 may detect the concentration of the recovered treatment liquid stored in the first tank 1100 using the treatment liquid. The concentration detection unit 1500 may transmit a second concentration measurement value, which is a result value of measuring the concentration of the recovered treatment liquid in the first tank 1100, to the control unit 1600.

[0074] The control unit 1600 may adjust the supply amount of the treatment liquid of the treatment liquid supply unit 1200 based on the concentration difference between the recovered treatment liquid stored in the first tank 1100 and the recovered treatment liquid stored in the second tank 1400. In this case, the concentration difference may be calculated using the first concentration measurement value and the second concentration measurement value.

[0075] The control unit 1600 can compare the calculated concentration difference with a predetermined reference value to determine an appropriate supply amount of the treatment liquid to adjust the recovered treatment liquid to a reusable concentration. The predetermined reference value can be a reference value of the Ti ion concentration contained in the recovered treatment liquid, and can be, for example, 30 ppm.

[0076] The control unit 1600 may feedback control the supply amount of the treatment liquid so that the concentration difference may not exceed a predetermined reference value. For example, when the calculated concentration difference exceeds the predetermined reference value, the control unit 1600 may reduce the supply amount of the treatment liquid supplied from the treatment liquid supply unit 1200 to the discharge pipeline L10. Therefore, as the concentration of the recovered treatment liquid stored in the first tank 1100 decreases, the concentration difference relative to the recovered treatment liquid stored in the second tank 1400 may decrease. As another example, when the calculated concentration difference is less than the predetermined reference value, the control unit 1600 may control the treatment liquid supply unit 1200 to maintain the supply amount of the treatment liquid at the current state. As another example, when the calculated concentration difference is a negative (-) value, that is, when the concentration of the recovered treatment liquid in the second tank 1400 is higher than the recovered treatment liquid in the first tank 1100, the control unit 1600 may increase the supply amount of the treatment liquid supplied to the discharge pipeline L10.

[0077] In this case, the control of increasing / decreasing the supply amount of the treatment liquid in the control unit 1600 may be performed by calculating the concentration difference in real time using the first concentration measurement value and the second concentration measurement value continuously measured at predetermined time intervals by the concentration detection unit 1500. By continuously performing the concentration difference calculation and controlling the supply amount of the treatment liquid based on the calculated value, the concentration difference between the recovered treatment liquid concentration in the first tank 1100 and the recovered treatment liquid concentration in the second tank 1400 may be adjusted not to exceed a predetermined reference value.

[0078] Figure 5 2 is a diagram illustrating a process liquid supply apparatus and a process liquid of a substrate processing apparatus according to an embodiment.

[0079] Reference Figure 5 , a treatment liquid supplying apparatus 1000c according to another embodiment (hereinafter, Embodiment 4) may include a first tank 1100, a treatment liquid supplying unit 1200, a first heating unit 1300, a second tank 1400, a concentration detecting unit 1500, and a control unit 1600. Since most of the configurations are the same or similar to those of Embodiment 1 or Embodiment 3 described above, a repeated description will not be provided, and the differences will be described.

[0080] In the case of the treatment liquid supply apparatus 1000c according to Embodiment 4, the concentration detection unit 1500 may include three concentration detection lines. In this case, the three concentration detection lines may be referred to as a first concentration detection line S10, a second concentration detection line S20, and a third concentration detection line S30.

[0081] Similar to Embodiment 1 and Embodiment 3 described above, the first concentration detection line S10 may be connected to the supply line L20, and thus, the concentration detection unit 1500 may measure the concentration of the recovered treatment liquid stored in the second tank 1400. In addition, the second concentration detection line S20 may be connected to the second delivery line U, and thus, the concentration detection unit 1500 may detect the concentration of the recovered treatment liquid stored in the first tank 1100.

[0082] The third concentration detection line S30 may be connected to the discharge line L10. More specifically, one end of the third concentration detection line S30 may be connected to the end of the first delivery line L20, and the other end of the third concentration detection line S30 may be connected to the concentration detection unit 1500. Here, the end of the first delivery line L20 may be a point at which the first delivery line L20 and the discharge line L10 may be connected to each other, and the supplied treatment liquid may begin to flow into the discharge line L10. Using the third concentration detection line S30, the concentration detection unit 1500 may detect the concentration of the treatment liquid at a time point of mixing with the new treatment liquid in the discharge line L10 or immediately after mixing with the new treatment liquid. The concentration detection unit 1500 may transmit a third concentration measurement value to the control unit 1600, and the third concentration measurement value may be a detection result value. In this case, the third concentration measurement value may be measured at predetermined intervals and may be transmitted to the control unit 1600.

[0083] The control unit 1600 may monitor the concentration of the treatment liquid mixed with the new treatment liquid based on the received third concentration measurement values. In addition, the control unit 1600 may monitor the change in the concentration of the treatment liquid in the discharge line L10 by organizing the third concentration measurement values ​​measured at predetermined intervals in a time series.

[0084] The control unit 1600 may adjust the supply amount of the treatment liquid of the treatment liquid supply unit 1200 based on the concentration difference between the recovered treatment liquid stored in the first tank 1100 and the recovered treatment liquid stored in the second tank 1400, which may be the same as or similar to Example 3 described above.

[0085] Figure 6 2 is a diagram illustrating a process liquid supply apparatus and a substrate processing apparatus according to an embodiment.

[0086] Reference Figure 6 , a treatment liquid supplying apparatus 1000d according to another embodiment (hereinafter, Embodiment 5) may include a first tank 1100, a treatment liquid supplying unit 1200, a first heating unit 1300, a second tank 1400, a concentration detecting unit 1500, and a control unit 1600. Since most of the configurations are the same or similar to those of Embodiment 1 described above, a repeated description will not be provided, and the differences will be described.

[0087] In the treatment liquid supplying apparatus 1000d according to Embodiment 5, the treatment liquid supplying unit 1200 may supply new treatment liquid to the second tank 1400. In this case, the first delivery line 1210 may be provided between the treatment liquid supplying unit 1200 and the second tank 1400. More specifically, one end of the first delivery line 1210 may be connected to the treatment liquid supplying unit 1200, and the other end of the first delivery line 1210 may be connected to the second delivery line U. Therefore, the concentration of the new treatment liquid supplied through the first delivery line 1210 may be adjusted to a predetermined concentration by mixing with the recovered treatment liquid passing through the second delivery line U. As described above, the recovered treatment liquid whose concentration has been adjusted by supplying the new treatment liquid before flowing into the second tank 1400 may be supplied to the second tank 1400.

[0088] In this case, the first heating unit 1300 may control the temperature of the recovered process liquid moved from the first tank 1100 to the second tank 1400. More specifically, after being discharged from the first tank 1100, the temperature may be slightly lowered while moving along the second delivery line U. In this case, new process liquid heated to a predetermined temperature may be supplied to the recovered process liquid moving along the second delivery line U. Therefore, the temperature of the recovered process liquid may be stored in the second tank 1400 in a state where the temperature is maintained at a predetermined temperature.

[0089] Figure 7 2 is a diagram illustrating a process liquid supply apparatus and a substrate processing apparatus according to an embodiment.

[0090] Reference Figure 7 , a treatment liquid supplying apparatus 1000e according to another embodiment (hereinafter, Embodiment 6) may include a first tank 1100, a treatment liquid supplying unit 1200, a first heating unit 1300, a second tank 1400, a concentration detecting unit 1500, and a control unit 1600. Since most of the configurations are the same or similar to those of Embodiment 1 described above, a repeated description will not be provided, and the differences will be described.

[0091] In the treatment liquid supply apparatus 1000e according to Embodiment 6, two treatment liquid supply units 1200 may be provided. In this case, one of the two treatment liquid supply units 1200 (e.g., the treatment liquid supply unit on the left side in the figure) may supply new treatment liquid to the discharge line L10 as in the above-described embodiment.

[0092] The other of the two treatment liquid supply units 1200 (for example, the treatment liquid supply unit on the right side of the figure) may be connected to the second delivery line U, and may supply new treatment liquid to the recovered treatment liquid flowing into the second tank 1400. Therefore, the concentration of the new treatment liquid supplied through the first delivery line 1210 may be adjusted by mixing with the recovered treatment liquid passing through the second delivery line U. As described above, the recovered treatment liquid whose concentration has been adjusted by supplying the new treatment liquid may be supplied to the second tank 1400. In this case, the new treatment liquid may be supplied by being heated to a predetermined temperature in the first heating unit 1300 before being supplied to the second delivery line U, which is the same as described above.

[0093] As described above, by adding new treatment liquid to the treatment liquid passing through the discharge line L10 and the recovered treatment liquid passing through the second transfer line U using the two treatment liquid supply units 1200, the concentration difference and the temperature difference between the first tank 1100 and the second tank 1400 can be reduced.

[0094] Figure 8 is a flow chart illustrating a method for treating a process liquid according to an embodiment. Fig. 9 It is a diagram for processing Figure 8 A flow chart of a method for processing a liquid is shown in FIG.

[0095] Reference Figure 8 and Fig. 9 , the method for treating a treatment liquid according to an embodiment may be described below. For ease of description, embodiment 1 will be described.

[0096] First, the processing liquid used in the process of processing the substrate W in the substrate processing apparatus 1 may be discharged through the discharge line L10. More specifically, the processing liquid may be discharged to the substrate W through the nozzle unit 400, and may be discharged through the liquid outlet of the processing container 200 and the discharge line L10 connected thereto. In this case, the temperature of the discharged processing liquid may be lowered while being used and moved in the substrate processing apparatus 1, and may be lower than the process temperature.

[0097] Thereafter, the treatment liquid supply unit 1200 may supply new treatment liquid to the discharge line L10. In this case, the new treatment liquid may be supplied through the first delivery line L20 connected to the discharge line L10. By mixing the new treatment liquid supplied as above with the treatment liquid passing through the discharge line L10, the concentration of the treatment liquid may be adjusted to a predetermined concentration before moving to the first tank 1100.

[0098] Thereafter, the first heating unit 1300 may control the temperature of the treatment liquid passing through the first delivery line L20. In this case, the first heating unit 1300 may heat the new treatment liquid to a predetermined temperature. In this case, the new treatment liquid may be heated to a predetermined temperature and may be stored as the treatment liquid passing through the discharge line L10. Therefore, the temperature may be controlled mainly by increasing the temperature of the treatment liquid discharged through the discharge line L10. Thereafter, the treatment liquid mixed with the new treatment liquid may be stored in the first tank 1100.

[0099] Thereafter, in the first tank 1100, the temperature of the recovered treatment liquid stored therein may be adjusted for a second time. When the recovered treatment liquid is stored in the first tank 1100, the temperature sensor 1120 may measure the temperature of the recovered treatment liquid stored in the first tank 1100. The control unit 1600 may compare the temperature measurement value with a predetermined temperature. In this case, although the heated treatment liquid is added, the temperature of the recovered treatment liquid stored in the first tank 1100 may not reach the predetermined temperature described above, or the temperature may decrease and may become lower than the predetermined temperature during the process of moving along the discharge line L10 after the treatment liquid is added. In this case, the control unit 1600 may control the temperature of the treatment liquid for a second time by heating the recovered treatment liquid in the first tank 1100 using the second heating unit 1110 and raising the temperature to a predetermined temperature.

[0100] Thereafter, the concentration detection unit 1500 may detect whether the concentration of the recovered treatment liquid stored in the first tank 1100 is a predetermined concentration. In this case, when the concentration measurement value of the recovered treatment liquid corresponds to the predetermined concentration, the recovered treatment liquid may be moved to the second tank 1400 through the second delivery line U by the delivery pump. When the concentration measurement value of the recovered treatment liquid does not reach the predetermined concentration, the control unit 1600 may adjust the concentration of the recovered treatment liquid to reach the predetermined concentration by increasing the supply amount of the treatment liquid supplied by the treatment liquid supply unit 1200, and may move the treatment liquid to the second tank 1400.

[0101] Thereafter, the recovered treatment liquid (i.e., reprocessed treatment liquid) whose concentration and temperature have been adjusted may be temporarily stored in the second tank 1400, and may be supplied to the substrate processing apparatus 1 through the supply line L20. In this case, the reprocessed treatment liquid may be supplied back to the nozzle unit 400, and may be used in the process of processing the substrate W. Thereafter, the used reprocessed treatment liquid may be discharged from the substrate processing apparatus 1 as treatment liquid, may be partially discarded, and may also be partially recovered back to the first tank 1100 through the discharge line L10. By supplying new treatment liquid to the recovered treatment liquid, the process of being reused in the substrate supply device 1 may be repeated through the treatment liquid treatment process.

[0102] With respect to the method for treating a treatment liquid, the treatment liquid supplying apparatuses 1000, 1000a, 1000b, 1000c, 1000d, and 1000e, and the substrate treating apparatus 1 including the treatment liquid supplying apparatus according to the above-described embodiments, by supplying new treatment liquid from the substrate treating apparatus 1 to the discharge line L10 from which the treatment liquid is discharged, the concentration of the treatment liquid can be adjusted and stabilized before flowing into the first tank 1100. In addition, before the new treatment liquid flows into the discharge line L10, the temperature can be raised in advance while passing through the first delivery line 1210, can be mixed with the treatment liquid, and can flow into the first tank 1100, so that the time required to control the temperature of the treatment liquid in the first tank 1100 can be reduced, and the overall speed of the process of treating the treatment liquid can be increased.

[0103] According to the aforementioned embodiment, using the process liquid supply device, the substrate processing device including the process liquid supply device, and the method for processing the process liquid, by supplying new process liquid from the substrate processing device to the discharge line from which the process liquid is discharged, before the process liquid flows into the first tank, the concentration of the process liquid can be adjusted to stabilize the liquid. In addition, before the new process liquid flows into the discharge line, the temperature can be raised in advance while passing through the first delivery line, can be mixed with the process liquid, and can flow into the first tank to reduce the time required to control the temperature of the process liquid in the first tank, so that the overall speed of the process of processing the process liquid can be increased.

[0104] While embodiments have been illustrated and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A processing liquid supply device, comprising: a discharge line through which a processing liquid is discharged from the substrate processing apparatus; a first tank storing a recovered treatment liquid, the recovered treatment liquid being recovered through the discharge line; a treatment liquid supply unit, the treatment liquid supply unit supplying new treatment liquid to the discharge line through the first delivery line; a first heating unit, which is disposed between the treatment liquid supply unit and the discharge line and controls the temperature of the new treatment liquid passing through the first delivery line; and a second tank that re-supplies the recovered processing liquid supplied from the first tank through a second transfer line to the substrate processing apparatus through a supply line.

2. The treatment liquid supply device according to claim 1, in, The exhaust line is configured as a pipe provided between the substrate processing apparatus and the first tank for exhausting the processing liquid, and The first delivery pipeline is a pipeline provided between the treatment liquid supply unit and the discharge pipeline for supplying the new treatment liquid.

3. The treatment liquid supply device according to claim 2, in, One end of the exhaust line is connected to the substrate processing equipment, and the other end of the exhaust line is connected to the first tank, and One end of the first delivery line is connected to the treatment liquid supply unit, and the other end of the first delivery line is connected to the discharge line and connected between the one end and the other end of the discharge line.

4. The processing liquid supply device according to claim 3, wherein: The first heating unit surrounds at least a portion of an exterior surface of the first transfer line.

5. The processing liquid supply apparatus according to claim 4, wherein: The first heating unit is configured as a jacket heater.

6. The processing liquid supply apparatus according to claim 3, wherein: The first tank includes: a temperature sensor which is provided in the first tank and measures a temperature of the recovered processing liquid stored in the first tank; and a second heating unit which controls the temperature of the recovered processing liquid stored in the first tank.

7. The processing liquid supply apparatus according to claim 4, further comprising: a concentration detection unit, the concentration detection unit measuring the concentration of the recovered treatment liquid stored in the second tank through a first concentration measurement line, Wherein, one end of the first concentration measurement line is connected to the supply line, and the other end of the first concentration detection line is connected to the concentration detection unit.

8. The treatment liquid supply device according to claim 7, in, The concentration detection unit further measures the concentration of the recovered treatment liquid stored in the first tank through a second concentration detection line, and One end of the second concentration detection pipeline is connected to the second delivery pipeline, and the other end of the second concentration detection pipeline is connected to the concentration detection unit.

9. The processing liquid supply apparatus according to claim 1, wherein: The processing liquid exhausted from the substrate processing apparatus sequentially passes through the first tank and the second tank, and is returned and supplied to the substrate processing apparatus.

10. A method for treating a process liquid, the method comprising: draining the processing liquid from the substrate processing device through a drain line; supplying new process liquid to the discharge line through the process liquid supply unit; regulating the temperature of the new process liquid supplied to the discharge line by a first heating unit; adjusting the temperature of the recovered treated liquid recovered to the first tank through the discharge line to a predetermined temperature; and The recovered treated liquid, the concentration and temperature of which are controlled, is transferred to the second tank.

11. The method according to claim 10, wherein: Supplying new treatment liquid to the discharge line through the treatment liquid supply unit includes adjusting the concentration of the treatment liquid to a predetermined concentration by supplying the new treatment liquid before the treatment liquid flows into the first tank.

12. The method according to claim 11, wherein: Adjusting the temperature of the new treatment liquid supplied to the discharge line by the first heating unit includes heating the new treatment liquid to a predetermined temperature by the first heating unit and supplying the treatment liquid to the discharge line.

13. The method according to claim 12, wherein: Adjusting the temperature of the recovered treatment liquid recovered into the first tank through the discharge line to a predetermined temperature includes heating the recovered treatment liquid to a predetermined temperature by the second heating unit based on a temperature measurement value of the recovered treatment liquid stored in the first tank.

14. The method according to claim 13, wherein: Adjusting the temperature of the recovered treated liquid recovered into the first tank through the discharge pipeline to a predetermined temperature includes: when the temperature measurement value is lower than the predetermined temperature, heating the recovered treated liquid to the predetermined temperature by the second heating unit, and when the temperature measurement value corresponds to the predetermined temperature, maintaining the recovered treated liquid warm to maintain the temperature of the recovered treated liquid.

15. The method according to claim 13, wherein: measuring the concentration of the recovered treatment liquid stored in the second tank; and The amount of process liquid supplied to the drain line is adjusted based on the concentration measurement of the recovered process liquid.

16. The method according to claim 15, wherein: Adjusting the amount of the treatment liquid supplied to the discharge line includes comparing a concentration measurement value of the recovered treatment liquid in the second tank with a predetermined reference value, and increasing or decreasing the supply amount of the treatment liquid.

17. The method according to claim 15, further comprising: measuring a concentration of the recovered process liquid stored in the first tank; and calculating a concentration difference between the recovered treatment liquid in the first tank and the recovered treatment liquid in the second tank, The adjusting the amount of the treatment liquid supplied to the discharge line includes increasing or decreasing the supply amount of the treatment liquid supplied to the discharge line based on the calculated concentration difference.

18. The method according to claim 17, wherein: Adjusting the amount of the treatment liquid supplied to the discharge line includes feedback controlling the supply amount of the treatment liquid so that the concentration difference does not exceed a predetermined reference value.

19. The method according to claim 10, further comprising: The concentration of the process liquid passing through the discharge line is monitored by measuring the concentration of the process liquid at the point where the first delivery line connects to the discharge line.

20. A substrate processing device, comprising: Craft Room; a processing container disposed in the process chamber, accommodating a substrate in the processing container, the processing container including a liquid outlet on a bottom surface of the processing container, and having an open upper portion; a supporting unit that supports the substrate and includes a supporting shaft that is disposed in the processing container and rotates and a spin head connected to the supporting shaft; a nozzle unit disposed on an outer side of the processing container and including a moving nozzle device that discharges a processing liquid to the substrate; and a treatment liquid supply device, the treatment liquid supply device comprising: a discharge pipeline, the discharge pipeline being connected to the liquid outlet and discharging the treatment liquid; a first tank, the first tank storing the recovered treatment liquid, the recovered treatment liquid being the recovered treatment liquid recovered through the discharge pipeline; a treatment liquid supply unit, the treatment liquid supply unit supplying new treatment liquid to the discharge pipeline through a first delivery pipeline; a first heating unit, the first heating unit being disposed between the treatment liquid supply unit and the discharge pipeline and controlling the temperature of the new treatment liquid passing through the first delivery pipeline; and a second tank, the second tank resupplying the recovered treatment liquid supplied from the first tank through a second delivery pipeline to the substrate treatment device through a supply pipeline, wherein the discharge line is configured as a pipeline disposed between the substrate processing device and the first tank for discharging the processing liquid, and the first delivery line is configured as a pipeline disposed between the processing liquid supply unit and the discharge line for supplying the new processing liquid, wherein one end of the discharge line is connected to the substrate processing equipment, the other end of the discharge line is connected to the first tank, one end of the first delivery line is connected to the processing liquid supply unit, and the other end of the first delivery line is connected to the discharge line and connected between the one end and the other end of the discharge line, wherein the first heating unit is configured as a jacket heater surrounding at least a portion of an outer surface of the first transfer line, and The processing liquid discharged from the processing container sequentially passes through the first tank and the second tank and is returned and supplied to the nozzle unit.

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