Position calibration method

Abstract

The embodiment of the invention provides a position calibration method used for calibrating drying equipment, the drying equipment further comprises a bearing disc, a spraying rod and a supporting arm, the bearing disc is used for bearing a wafer when the drying equipment dries the wafer, the spraying rod is used for spraying fluid to the wafer, the spraying rod is arranged on the supporting arm, and the supporting arm is used for adjusting the position of the spraying rod; the position calibration method comprises a calibration disc and a nozzle pointing piece. The calibration disc is used for being assembled between the spraying rod and the bearing disc and is parallel to the bearing disc, and the side face, close to the spraying rod, of the calibration disc is provided with an identification area. The nozzle pointing part is detachably connected to the spray rod and provided with a tip located on the spray path of the spray rod, the spray rod drives the tip of the nozzle pointing part to be aligned with the identification area by adjusting the position of the spray rod on the supporting arm, and position calibration is conducted on a nozzle of the spray rod. According to the scheme, the difficulty of position calibration of the spraying rod is reduced.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of wafer drying technology, and in particular to a position calibration method. Background Art

[0002] In order to improve the surface quality of semiconductor wafers, the wafers must be dried after cleaning to remove impurities such as deionized water spots or residues on the wafer surface as much as possible, and to avoid defects in the wafer caused by impurities on the wafer surface.

[0003] The current drying equipment includes a chamber, a tray and a spray rod. The tray and the spray rod are located in the chamber. During the use of the drying equipment, the wafer to be dried can be fixed on the tray so that the wafer is fixed in the chamber, and then the spray rod is automatically controlled to move to the initial position, and the movement of the spray rod is controlled from the initial position. At the same time, the rotation of the tray is controlled, and the spray rod is made to spray fluid to the wafer to achieve cleaning and drying of the wafer.

[0004] However, the above process requires accurate correction of the initial position of the spray bar. Currently, the staff directly observes whether the fluid sprayed by the spray bar falls on the preset area of ​​the disk. Since the wafer needs to be placed between the nozzle of the spray bar and the disk, the distance between the nozzle of the spray bar and the disk is large and the space in the cavity is limited. Therefore, the position error between the estimated fluid landing point and the preset area is large, making the calibration process more difficult. Summary of the invention

[0005] In view of this, an embodiment of the present application provides a position calibration method to at least partially solve the above-mentioned problem.

[0006] According to a first aspect of an embodiment of the present application, a position calibration method is provided for calibrating a drying device, wherein the drying device further comprises a carrying plate, a spray rod and a support arm, wherein the carrying plate is used to carry wafers when the drying device dries the wafers, the spray rod is used to spray fluid onto the wafers, the spray rod is arranged on the support arm, and the support arm is used to adjust the position of the spray rod; the position calibration method comprises a calibration plate and a nozzle pointing member; the calibration plate is used to be assembled between the spray rod and the carrying plate and is parallel to the carrying plate, and a marking area is arranged on a side of the calibration plate close to the spray rod; the nozzle pointing member is detachably connected to the spray rod, and the nozzle pointing member has a tip located on the spray path of the spray rod, and the position of the spray rod on the support arm is adjusted so that the spray rod drives the tip of the nozzle pointing member to align with the marking area, thereby performing position calibration on the nozzle of the spray rod.

[0007] According to a second aspect of an embodiment of the present application, a position calibration method is provided, which is implemented based on the position calibration method described in the first aspect above, and the position calibration method includes: installing the calibration plate on the carrying plate; installing the nozzle pointing member on the spray rod; and adjusting the position of the spray rod on the support arm so that the spray rod drives the tip of the nozzle pointing member to move until the tip is aligned with the marking area on the calibration plate.

[0008] In an embodiment of the present application, when calibrating the position of the nozzle of the spray rod by a position calibration method, the calibration plate can be first installed on the carrying plate, and then the position of the spray rod can be adjusted by the support arm until the nozzle of the spray rod moves to the vicinity of the marking area on the calibration plate, and then the nozzle pointing piece can be installed on the spray rod, and then the position of the spray rod on the support arm can be adjusted so that the spray rod drives the tip to move to the marking area with the tip aligned with the marking area to achieve position calibration of the nozzle of the spray rod. After the tip is aligned with the marking area, the spray rod and the support arm can be relatively fixed, the calibration plate can be removed from the carrying plate, the wafer can be installed on the carrying plate, and the nozzle pointing piece can be removed from the spray rod so that the wafer can be dried subsequently. Therefore, before drying the wafer, the position calibration of the nozzle of the spray rod is achieved by observing whether the tip of the nozzle pointing piece is aligned with the marking area on the calibration disk. The tip of the nozzle pointing piece is on the gas injection path of the spray rod, so that the distance between the tip of the nozzle pointing piece and the calibration disk is smaller, and thus the error of estimating whether the tip of the nozzle pointing piece is aligned with the marking area on the calibration disk through observation is smaller, that is, the position calibration of the nozzle of the spray rod is more accurate, thereby reducing the difficulty of calibrating the position of the spray rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0010] Figure 1 It is a structural schematic diagram of a drying device according to an embodiment of the present application; Figure 2 It is a flowchart of a position calibration solution of an embodiment of the present application; Figure 3 is a schematic diagram of the positions of various components during the calibration process of an embodiment of the present application; Figure 4 is a schematic diagram of the structure of a calibration disk according to an embodiment of the present application; Figure 5 is a schematic structural diagram of a nozzle pointing member according to an embodiment of the present application; Figure 6 is a schematic diagram of a detection base in a parallel position according to an embodiment of the present application; Figure 7 is a schematic diagram of another embodiment of the present application in which the detection base is not in a parallel position; Figure 8 It is a flow chart of a position calibration solution according to another embodiment of the present application.

[0011] Description of reference numerals: 1. Carrying plate; 2. Spray rod; 21. First straight rod; 22. Second straight rod; 3. Calibration plate; 31. Marking area; 32. Support column; 321. Detection seat; 4. Nozzle pointing piece; 41. Tip; 42. Clamp; 5. Cavity; 6. Retaining ring; 61. Target side; 7. Support rod. DETAILED DESCRIPTION

[0012] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0013] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0014] An embodiment of the present application provides a position calibration method for calibrating a drying device. The drying device may be a drying device that performs drying operations based on the Marangoni effect or a drying device based on rotary drying, etc. Drying devices involving nozzles are all within the protection scope of the present application.

[0015] Figure 1 Schematic diagram of a drying device according to an embodiment of the present application. Figure 1As shown, the drying device also includes a carrier plate 1, a spray rod 2 and a support arm. The carrier plate 1 can be a disc-shaped, and the carrier plate 1 is used to carry the wafer when the drying device dries the wafer, and is also used to drive the wafer to rotate around the axis of the wafer when the drying device dries the wafer. The spray rod 2 is used to spray fluid to the wafer when the drying device dries the wafer. The spray rod 2 is arranged on the support arm, and the position of the spray rod 2 on the support arm can be adjusted before the drying device dries the wafer. The support arm is used to adjust the position of the spray rod 2 before the drying device dries the wafer and when the drying device dries the wafer. The position calibration method is used to calibrate the initial position of the nozzle of the spray rod 2 before the drying device dries the wafer, so as to calibrate the initial landing point of the fluid sprayed by the spray rod 2 on the wafer installed on the carrier plate 1 when the drying device dries the wafer, and after the calibration is completed, the calibration plate and other components used are removed from the drying device. Among them, the fluid sprayed by the spray rod 2 can be liquid or gas, etc. The liquid can be deionized water or a rinsing liquid containing deionized water, etc., and the gas can be a dry gas containing surfactant components, etc. The embodiment of the present application does not limit the specific composition of the fluid sprayed by the spray rod 2.

[0016] Before using the drying device to dry the wafer, the position of the nozzle of the spray bar 2 must first be calibrated using a position calibration method. It should be noted that the calibration method provided in this application can be completed before the drying device leaves the factory, or it can be completed during the interval between drying wafers after leaving the factory. After one calibration, the drying device can be used continuously, and whether to calibrate again can be determined based on whether the drying effect is poor.

[0017] The specific process of calibration can be as follows: control the calibration disk to move and fix it on the carrying disk, and be parallel to the carrying disk, and an identification area is set on the side of the calibration disk close to the spray rod; control the nozzle pointing member to move and be installed on the spray rod, and the nozzle pointing member has a tip located on the spray path of the spray rod; adjust the position of the spray rod on the support arm through the driving device, so that the spray rod drives the tip of the nozzle pointing member to move until the signal acquisition device determines that the tip is aligned with the identification area on the calibration disk.

[0018] The position of the spray rod 2 is adjusted by the support arm, and the position of the spray rod 2 on the support arm is adjusted until the tip is determined to be aligned with the marking area on the calibration disk through the signal acquisition device, and then the adjustment of the position of the spray rod 2 on the drive device is stopped to realize the position calibration of the nozzle of the spray rod 2; then the relevant components used in the position calibration method are removed from the drying equipment, and then the drying equipment is used to dry the wafer. The specific drying process can be as follows: fix the wafer to be dried on the carrier plate 1, control the carrier plate 1 to drive the wafer to rotate around the axis of the wafer, and control the spray rod 2 to spray fluid to the wafer, and reciprocate the position of the spray rod 2 by the support arm to control the spray rod 2 to spray fluid to the wafer while the wafer and the spray rod 2 are in relative motion, thereby achieving the drying of the wafer.

[0019] The position calibration method is described in detail below through multiple embodiments.

[0020] Figure 2 is a schematic diagram of a position calibration method according to an embodiment of the present application. Figure 3 Figure 1 is a schematic diagram of the positions of various components during the calibration process. Figure 2 As shown, the position calibration method includes: S1. Control the calibration plate to move and fix it on the carrier plate and make it parallel to the carrier plate.

[0021] A marking area is provided on the side of the calibration plate close to the spray boom.

[0022] In this embodiment, the size of the calibration plate is the same as that of the wafer. During calibration, the calibration plate can be transferred to the drying device by a robot in the device in a similar manner to transferring the wafer, and the calibration plate can be controlled to move and fixedly installed on the carrier plate.

[0023] S2. Control the movement of the nozzle pointing part and install it on the spray boom.

[0024] The nozzle director has a tip that is located in the spray path of the spray boom.

[0025] The nozzle pointing member may be connected to the calibration plate via a mechanical arm, or the nozzle pointing member and the calibration plate may be fixed on the same base, and the nozzle pointing member may be disposed on the base via a moving platform.

[0026] S3. Adjust the position of the spray rod on the support arm through the driving device so that the spray rod drives the tip of the nozzle pointing member to move until the signal acquisition device determines that the tip is aligned with the marking area on the calibration disk.

[0027] In this embodiment, the driving device can be a driving device for adjusting the spray rod in the drying device. After the calibration plate is fixed on the carrier plate, the mobile platform can be controlled to control the movement of the nozzle pointing member and install it on the spray rod. After it is installed on the spray rod, the mobile platform releases the position limit of the nozzle pointing member, and the connecting member on the mobile platform adapted to the nozzle pointing member moves with the nozzle pointing member; or, after the calibration plate is fixed on the carrier plate, the mechanical arm can be controlled to control the movement of the nozzle pointing member and install it on the spray rod. After it is installed on the spray rod, the mechanical arm releases the joint lock to release the position limit of the nozzle pointing member, and the mechanical arm is driven by the nozzle pointing member.

[0028] In another implementation, after the nozzle pointing member is controlled to move and installed on the spray boom, the mechanical arm or mobile platform used to fix the nozzle pointing member can be reused as a driving device to control the movement of the nozzle pointing member and drive the spray boom to move synchronously.

[0029] During the process of the spray rod driving the tip of the nozzle pointing member to move, the signal can be continuously collected by the signal acquisition device until it is determined that the tip is aligned with the marking area on the calibration disk. The signal acquisition device can be specifically a camera, which is used to photograph the nozzle pointing member and the marking area, and can automatically identify whether the tip is aligned with the marking area based on the photographed image, or present the photographed image to the staff, who can determine whether the tip is aligned with the marking area.

[0030] In addition, after the calibration is completed, the calibration disk and other components used are removed from the drying equipment. The process of removing the calibration disk and the nozzle pointing member can be the opposite of the installation process.

[0031] like Figure 3 As shown, the main components other than the drying equipment involved in the position calibration method include a calibration plate 3 and a nozzle pointing member 4; the shape of the calibration plate 3 is almost the same as the shape and size of the wafer to be dried, and the calibration plate 3 is used to be assembled between the spray rod 2 and the carrier plate 1. The calibration plate 3 is parallel to the carrier plate 1. When the calibration plate 3 is assembled between the spray rod 2 and the carrier plate 1, it can be detachably connected to the carrier plate 1. For example, a positioning column can be provided on the side of the calibration plate 3 close to the carrier plate 1, and a positioning hole can be provided on the side of the carrier plate 1 close to the calibration plate 3. The calibration plate 3 and the carrier plate 1 are plugged together through the positioning column and the positioning hole. Specifically, it can be as follows Figure 4 As shown, the calibration plate 3 is fixedly connected to a positioning column a on the side close to the carrier plate 1. Based on this, the side of the carrier plate 1 close to the calibration plate 3 is provided with a positioning hole plugged with the positioning column a; the calibration plate 3 is provided with an identification area 31 on the side close to the spray rod 2. The size of the identification area 31 can be set according to the size of the nozzle of the spray rod 2. For example, the identification area 31 can be a circular area with a diameter of 1mm to 5mm; the nozzle pointing member 4 can be detachably connected to the spray rod 2, for example, it is clamped on the spray rod 2, etc. Figure 5 As shown, the nozzle pointing member 4 has a tip 41 located on the injection path of the spray rod 2. The portion of the nozzle pointing member 4 other than the tip 41 may be cylindrical or tubular. The tip 41 is integrally connected to one end of the cylindrical or tubular portion. The length of the nozzle pointing member 4 may be 0.2 mm to 0.7 mm. When the position of the nozzle of the spray rod 2 is calibrated, the position of the spray rod 2 on the support arm may be adjusted so that the spray rod 2 drives the tip 41 of the nozzle pointing member 4 to align with the marking area 31.

[0032] It should be noted that the spray rod 2 may be provided with one or more, and a single spray rod 2 may have one or more nozzles. For example, two spray rods 2 are provided, each spray rod 2 has a nozzle, the fluid ejected from the nozzle of the first spray rod 2 is liquid, and the fluid ejected from the nozzle of the second spray rod 2 is gas; when multiple spray rods 2 are provided, or one spray rod 2 is provided and the spray rod 2 has multiple nozzles, an identification area 31 corresponding to each nozzle is provided on the side of the calibration disk 3 away from the spray rod 2. The following text takes the case where each spray rod 2 has one nozzle as an example for explanation.

[0033] In an embodiment of the present application, when calibrating the position of the nozzle of the spray rod 2 by a position calibration method, the calibration plate 3 can be first installed on the carrying plate 1, and then the position of the spray rod 2 can be adjusted by the support arm until the nozzle of the spray rod 2 moves to the vicinity of the marking area 31 on the calibration plate 3, and then the nozzle pointing member 4 is installed on the spray rod 2, and then the position of the spray rod 2 on the support arm is adjusted so that the spray rod 2 drives the tip 41 to move until the tip 41 is aligned with the marking area 31, so as to realize the position calibration of the nozzle of the spray rod 2. After the tip 41 is aligned with the marking area 31, the spray rod 2 and the support arm can be relatively fixed, the calibration plate 3 can be removed from the carrying plate 1, the wafer can be fixed to the carrying plate 1, and the nozzle pointing member 4 can be removed from the spray rod 2 so that the wafer can be dried subsequently. Therefore, before drying the wafer, the position calibration of the nozzle of the spray rod 2 is achieved by observing whether the tip 41 of the nozzle pointing member 4 is aligned with the marking area 31 on the calibration disk 3. The tip 41 of the nozzle pointing member 4 is on the gas injection path of the spray rod 2, so that the distance between the tip 41 of the nozzle pointing member 4 and the calibration disk 3 is small, and thus the error of estimating whether the tip 41 of the nozzle pointing member 4 is aligned with the marking area 31 on the calibration disk 3 is small, that is, the position calibration of the nozzle of the spray rod 2 is more accurate, thereby reducing the difficulty of position calibration of the spray rod 2.

[0034] Furthermore, the embodiments of the present application can also make the initial landing point of the fluid on the wafer slightly different from the ideal landing point when the wafer is dried, and thus the landing path of the fluid on the wafer slightly different from the ideal landing path when the wafer is dried, thereby achieving more comprehensive drying of the wafer surface, reducing the possibility of defects such as defects in the center area of ​​the wafer, defects in the edge area or random defects, and improving the quality of the wafer after drying.

[0035] In one possible implementation, Figure 1 As shown, the drying device further comprises a box-shaped cavity 5 and an annular retaining ring 6. The retaining ring 6 may be annular. The axis of the retaining ring 6, the axis of the calibration disk 3 and the axis of the carrier disk 1 coincide. The retaining ring 6 is fixedly connected in the cavity 5. The calibration disk 3 and the carrier disk 1 are located in the space surrounded by the retaining ring 6. The wall of the cavity 5 may be provided with an escape opening ( Figure 1 The cavity 5 in the cavity has hidden part of the wall of the cavity 5, and the hidden wall includes a wall with an avoidance opening); a translation drive member is provided on the cavity 5, and the translation drive member is used to drive the supporting plate 1 to move relative to the retaining ring 6 in a direction perpendicular to the supporting plate 1. The translation drive member can be a cylinder or a screw, etc., which is not limited to the embodiment of the present application.

[0036] In the embodiment of the present application, when the calibration plate 3 is mounted on the carrier plate 1, the carrier plate 1 can be driven by the translation drive to move from the space surrounded by the retaining ring 6 to the space outside the retaining ring 6, and then the calibration plate 3 is connected to the carrier plate 1. After the connection is completed, the carrier plate 1 is driven by the translation drive to drive the calibration plate 3 from the space outside the retaining ring 6 to the space surrounded by the retaining ring 6; when the calibration plate 3 is removed from the carrier plate 1, the carrier plate 1 can be driven by the translation drive to drive the calibration plate 3 from the space surrounded by the retaining ring 6 to the space outside the retaining ring 6, and then the calibration plate 3 is removed from the carrier plate 1, and the wafer to be dried is fixed on the carrier plate 1, and then the carrier plate 1 is driven by the translation drive to drive the calibration plate 3 from the space outside the retaining ring 6 to the space surrounded by the retaining ring 6. Therefore, by setting the translation drive to drive the carrier plate 1 to move relative to the retaining ring 6 in a direction perpendicular to the carrier plate 1, it is convenient to load and unload the calibration plate 3 on the carrier plate 1, and improve the efficiency of loading and unloading the calibration plate 3.

[0037] In one possible implementation, Figure 6 and Figure 7 As shown, a plurality of support columns 32 are arranged along the circumference of the calibration disk 3 at the edge of the side surface of the calibration disk 3 away from the supporting disk 1, and the support columns 32 can be integrally connected to the calibration disk 3 or fixedly connected, etc. The end surface of the support column 32 away from the calibration disk 3 is located outside the space surrounded by the retaining ring 6 or is flush with the target side 61 of the retaining ring 6, wherein the target side 61 of the retaining ring 6 is an annular side of the retaining ring 6, and the calibration disk 3 is closer to the target side 61 of the retaining ring 6 relative to the supporting disk 1; a detection seat 321 is arranged on the end surface of the support column 32 away from the calibration disk 3, and the detection seat 321 can be in the shape of a long strip, which is not limited in the embodiment of the present application, and the first end of the detection seat 321 is opposite to the target side 61 of the retaining ring 6.

[0038] In the examples of this application, see Figure 8 When the position of the spray rod 2 is calibrated by the position calibration method, after the calibration plate 3 is installed on the carrier plate 1, and before the position of the spray rod 2 is adjusted by the support arm so that the nozzle of the spray rod 2 moves to the vicinity of the marking area 31 on the calibration plate 3, the position calibration method also includes: S4, collecting the distance between the first end of the detection seat and the target side of the retaining ring through the signal acquisition device to detect the parallelism of the carrier plate relative to the retaining ring.

[0039] By testing the distance between the first end of the detection seat 321 and the target side 61 of the retaining ring 6, and according to the distance between the first end of each detection seat 321 and the target side 61 of the retaining ring 6, the parallelism of the calibration disk 3 relative to the retaining ring 6 is determined. When the parallelism is poor (for example, when the flatness of the plane composed of all the detection seats 321 is greater than or equal to 0mm to 0.08mm), the rotating part that drives the carrier plate 1 to rotate can be adjusted (for example, the rotating part is a motor, and a corresponding gasket can be added between the motor seat included in the motor and the motor body) to adjust the parallelism of the carrier plate 1 relative to the retaining ring 6, thereby adjusting the parallelism of the calibration disk 3 relative to the retaining ring 6. Therefore, the parallelism of the calibration disk 3 relative to the retaining ring 6 can be improved through the detection seat 321, and then the parallelism of the wafer relative to the retaining ring 6 during drying can be improved.

[0040] It should be noted that before or when the translation drive drives the carrier plate 1 to drive the calibration plate 3 to move relative to the retaining ring 6 in a direction perpendicular to the carrier plate 1, the first end of the detection seat 321 can be moved relative to the retaining ring 6 to a position to avoid the retaining ring 6.

[0041] In one possible implementation, Figure 6 and Figure 7 As shown, schematic diagrams showing the detection seat 321 in a parallel position and a non-parallel position are respectively shown, the detection seat 321 is magnetically attracted to the end face of the support column 32 away from the calibration disk 3, and the magnetic attraction force of each detection seat 321 can be in the range of 1N to 5N; the second end of the detection seat 321 is rotatably connected to the end face of the support column 32 away from the calibration disk 3, and the direction of the rotation axis of the second end of the detection seat 321 rotatably connected to the support column 32 is perpendicular to the axial direction of the calibration disk 3, and the second end of the detection seat 321 is used for driving the carrier disk 1 to drive the calibration disk 3 from the space surrounded by the retaining ring 6 to the outside of the space surrounded by the retaining ring 6 during the process of the translation drive member driving the carrier disk 1 to drive the calibration disk 3 to move from the space surrounded by the retaining ring 6 to the space surrounded by the retaining ring 6. When the end face of the support column 32 away from the calibration disk 3 is located in the space surrounded by the retaining ring 6, under the extrusion force of the retaining ring 6 on the first end of the detection seat 321, the detection seat 321 rotates relative to the support column 32, and the detection seat 321 rotates from the parallel position to the non-parallel position, so that the first end of the detection seat 321 can avoid the retaining ring 6.

[0042] Therefore, when the calibration disk 3 drives the detection seat 321 to move relative to the retaining ring 6, the first end of the detection seat 321 can automatically avoid the retaining ring 6, which can reduce the possibility of damage to the detection seat 321 and the retaining ring 6 due to accidental touch.

[0043] In a possible implementation, the side of the calibration disk 3 close to the spray rod 2 is frosted. Therefore, the frosted surface of the calibration disk 3 can reduce the interference caused by ambient light, so that the marking area 31 is easier to observe in the box-shaped cavity 5.

[0044] Optionally, the identification plate can adopt a PVC (Polyvinyl chloride) transparent frosted appearance, and the identification area 31 can be made by opening a hole on the back of the identification plate (i.e., the part of the identification plate close to the carrier plate 1) to inject a clean paint with high color and background recognition, thereby reducing contamination to the internal chamber of the box-shaped cavity 5, and using colored paint to assist in determining the position of the tip 41, further reducing the difficulty of calibration.

[0045] Optionally, the nozzle pointing member 4 may be made of materials such as POM (Polyoxymethylene) or PPS (Polyphenylene sulfide), which have the advantages of being pollution-free and self-lubricating.

[0046] In a possible implementation, the position calibration method further includes: controlling the nozzle pointing member 4 to move in a direction parallel to the gas injection path of the spray rod 2 and to be slidably connected to the spray rod 2 .

[0047] The sliding distance can be in millimeter order, for example, 0 mm to 15 mm. Thus, during the installation of the nozzle pointing member 4, the nozzle pointing member 4 can be slid relative to the spray rod 2 according to the distance between the nozzle and the calibration disk 3 to adjust the distance between the tip 41 of the nozzle pointing member 4 and the nozzle of the spray rod 2, thereby improving the applicability of the nozzle pointing member 4.

[0048] In one possible implementation, Figure 1 and Figure 3 As shown, the spray rod 2 includes a first straight rod 21, the first straight rod 21 is a cylindrical rod, and the length direction of the first straight rod 21 is parallel to the gas injection path of the spray rod 2; step S2 includes: setting the nozzle pointing member clamp at any position outside the first straight rod.

[0049] The nozzle pointing member 4 is connected to a clamp 42 . The clamp 42 and the nozzle pointing member 4 can be connected by fixed connection, detachable connection or integral connection. The clamp 42 is used to be clamped at any position outside the first straight rod 21 .

[0050] In the embodiment of the present application, the nozzle pointing member 4 can slide relative to the spray rod 2 by clamping the clamp 42 at different positions outside the first straight rod 21. In addition, the nozzle pointing member 4 is connected to the spray rod 2 by clamping the clamp 42, which can facilitate the connection between the nozzle pointing member 4 and the spray rod 2.

[0051] Optionally, the clamp may include two clamping plates, with a hinge shaft and a torsion spring connected between the two clamping plates to achieve the clamping function of the clamp, and the clamping force of the clamp may be between 0.12 NM and 0.2 NM.

[0052] In one possible implementation, Figure 1 As shown, the spray rod 2 also includes a second straight rod 22, the second straight rod 22 has a cylindrical rod shape, and the length direction of the second straight rod 22 is perpendicular to the length direction of the first straight rod 21; the first end of the second straight rod 22 is connected to the first end of the first straight rod 21, and the second end of the first straight rod 21 is the nozzle of the spray rod 2; step S3 includes: adjusting the length of the second straight rod extending out of the support arm and the angle of rotation relative to the support arm, driving the tip of the nozzle pointing member to move until the tip is aligned with the marking area on the calibration disk.

[0053] In the embodiment of the present application, when adjusting the position of the spray rod 2 on the support arm, the second straight rod 22 can be extended and retracted relative to the support arm, and the second straight rod 22 can be rotated relative to the support arm to adjust the rotation of the second straight rod 22 relative to the support arm, thereby achieving fine-tuning of the position of the nozzle relative to the support arm. As a result, the tip 41 can be more easily aligned with the identification area 31, further reducing the difficulty of position calibration of the spray rod 2.

[0054] In one possible implementation, Figure 1 and Figure 3 As shown, the support arm includes a support rod 7, and the driving device reuses the rotating driving member of the drying equipment; the support rod 7 is located outside the side of the calibration plate 3 away from the carrier plate 1, and the support rod 7 is located outside the space surrounded by the retaining ring 6, the length direction of the support rod 7 is parallel to the length direction of the second straight rod 22, the second end of the second straight rod 22 is slidably connected to the first end of the support rod 7 along the length direction of the second straight rod 22, and the second end of the second straight rod 22 is rotatably connected to the first end of the support rod 7 around the axis of the second straight rod 22, and a locking member is provided on the support rod 7, and the locking member is used to relatively fix the second straight rod 22 and the support rod after the tip 41 is aligned with the marking area 31 7, so that the spray rod 2 and the support rod 7 are relatively fixed when the wafer is dried. The specific structure of the locking member is not limited in the embodiment of the present application; the second end of the support rod 7 is rotatably connected to the cavity 5 around a direction perpendicular to the length direction of the support rod 7; the rotating drive member is connected to the support rod 7, and the rotating drive member is connected to the cavity 5. The rotating drive member is used to drive the support rod 7 to rotate relative to the cavity 5 during the process of adjusting the spray rod 2 to drive the tip 41 to move, so that the spray rod 2 drives the tip 41 of the nozzle pointing member 4 to align with the marking area 31. The rotating drive member is such as a motor, and the accuracy of the rotation of the support rod 7 relative to the cavity 5 can be 0.1° to 0.3°.

[0055] In the embodiment of the present application, during the process of calibrating the nozzle position of the spray rod 2, when adjusting the position of the spray rod 2 through the support arm, the rotating drive member is controlled to drive the bracket rod 7 to rotate relative to the cavity 5, and then the bracket rod 7 can drive the spray rod 2 to move. The support arm has a simple structure, is easy to implement and has low cost.

[0056] In a possible implementation, the rotary drive member is also used to drive the support rod 7 to rotate relative to the chamber 5 when the drying device dries the wafer.

[0057] In the embodiment of the present application, when the position of the spray rod 2 is adjusted by the support arm during the process of drying the wafers, the rotating drive member is controlled to drive the support rod 7 to rotate relative to the cavity 5, and then the support rod 7 can drive the spray rod 2 to move. Therefore, at least part of the method of adjusting the position of the spray rod 2 in the process of calibrating the nozzle position of the spray rod 2 and the method of adjusting the position of the spray rod 2 in the process of drying the wafers are both realized by the support rod 7, which can make the support arm smaller in size, simpler in structure, and lower in cost.

[0058] Through the position calibration method provided in this embodiment, the time consumption of the nozzle calibration process can be reduced by nearly 10 times, which greatly improves the nozzle calibration efficiency, improves the equipment maintenance efficiency, and reduces the influence of the staff's subjective judgment on the calibration results, thereby more than doubling the nozzle calibration accuracy.

[0059] The specific implementation of the above-mentioned position calibration method has been described in the above-mentioned device embodiment, and will not be repeated here in the embodiment of the present application.

[0060] It should be noted that the position calibration method of this embodiment is implemented based on the position calibration method in the aforementioned device embodiment and has the beneficial effects of the corresponding device embodiment, which will not be repeated here.

[0061] It should be noted that, in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise a ..." do not exclude the existence of other identical factors in the process, method, article or device including the elements.

[0062] Finally, it should be noted that the above are only preferred embodiments of the present invention, which are only used to illustrate the technical solution of the present invention, and are not used to limit the protection scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention are included in the protection scope of the present invention.

Claims

1. A position calibration method, characterized in that: Used to calibrate a drying device, the drying device comprising a carrier plate, a spray rod and a support arm, the carrier plate is used to carry wafers when the drying device dries the wafers, the spray rod is used to spray fluid to the wafers, the spray rod is arranged on the support arm, and the support arm is used to adjust the position of the spray rod; The position calibration method includes a calibration disk and a nozzle pointing member; Position calibration methods include: The calibration plate is controlled to move and be fixedly mounted on the carrying plate and is parallel to the carrying plate, and a marking area is provided on the side of the calibration plate close to the spray rod; A nozzle pointing member is controlled to move and is installed on the spray bar, wherein the nozzle pointing member has a tip located on the spray path of the spray bar; The position of the spray rod on the support arm is adjusted by a driving device, so that the spray rod drives the tip of the nozzle pointing member to move until the signal acquisition device determines that the tip is aligned with the marking area on the calibration disk.

2. The method according to claim 1, characterized in that The nozzle pointing member is controlled to move in a direction parallel to the gas spray path of the spray bar and is slidably connected to the spray bar.

3. The method according to claim 2, characterized in that The spray bar comprises a first straight bar, the length direction of the first straight bar is parallel to the gas injection path of the spray bar, and the nozzle pointing member is installed on the spray bar, comprising: The nozzle pointing member is clamped at any position outside the first straight rod.

4. The method according to claim 3, characterized in that The spray rod further comprises a second straight rod, a first end of the second straight rod is connected to the first end of the first straight rod, a second end of the second straight rod is connected to the support arm, and the second end of the first straight rod is a nozzle of the spray rod; The method of adjusting the position of the spray rod on the support arm so that the spray rod drives the tip of the nozzle pointing member to move until the tip is aligned with the marking area on the calibration disk includes: The length of the second straight rod extending out of the support arm and the rotation angle relative to the support arm are adjusted to drive the tip of the nozzle pointing member to move until the tip is aligned with the marking area on the calibration disk.

5. The method according to claim 4, characterized in that The drying device further comprises a cavity, the support arm comprises a support rod, and the driving device comprises a rotating driving member; The length direction of the support rod is parallel to the length direction of the second straight rod, the second end of the second straight rod is slidably connected to the first end of the support rod along the length direction of the second straight rod, and the second end of the second straight rod is rotatably connected to the first end of the support rod around the axis of the second straight rod, a locking member is provided on the support rod, and the locking member is used to relatively fix the second straight rod and the support rod after the tip is aligned with the identification area, and the second end of the support rod is rotatably connected to the cavity around a direction perpendicular to the length direction of the support rod; The rotating drive member is connected to the support rod, and the rotating drive member is connected to the cavity. The rotating drive member is used to drive the support rod to rotate relative to the cavity, so that the spray rod drives the tip of the nozzle pointing member to align with the marking area.

6. The method according to claim 5, characterized in that The rotating driving member is also used to drive the support rod to rotate relative to the cavity when the drying device dries the wafer.

7. The method according to claim 1, characterized in that The drying device further comprises a box-shaped cavity and an annular retaining ring, wherein the retaining ring is connected to the cavity, and the calibration plate and the carrying plate are located in a space surrounded by the retaining ring; The cavity is provided with a translation driving member, and the translation driving member is used to drive the carrying plate to move relative to the retaining ring along a direction perpendicular to the carrying plate.

8. The method according to claim 7, characterized in that A plurality of support columns are arranged along the circumference of the calibration disk at the edge of the side surface of the calibration disk away from the carrier disk, and the end surface of the support column away from the calibration disk is located outside the space surrounded by the retaining ring or flush with the target side of the retaining ring, wherein the target side of the retaining ring is an annular side of the retaining ring, and the calibration disk is closer to the target side of the retaining ring than the carrier disk; A detection seat is provided on the end surface of the support column away from the calibration disk, and a first end of the detection seat is opposite to the target side of the retaining ring; The method further comprises: The signal acquisition device is used to acquire the parallelism of the detection seat so as to detect the parallelism of the carrier plate.

9. The method according to claim 8, characterized in that The detection seat is magnetically attracted to the end surface of the support column away from the calibration disk; The second end of the detection seat is rotatably connected to the support column. The second end of the detection seat is used to rotate relative to the support column under the squeezing force of the retaining ring on the first end of the detection seat during the process in which the translation drive drives the carrying plate to drive the calibration plate to move, when the end face of the support column away from the calibration plate is located in the space surrounded by the retaining ring.

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