Flexible servo platform and chip mass transfer device

Abstract

The flexible servo platform comprises a platform body, a substrate is arranged on the top surface of the platform body, a chip body is arranged on the top surface of the substrate through soldering tin, a transfer plate is arranged on the top surface of the platform body, the chip body and the transfer plate are located on the same plane, and a mechanical arm is movably arranged on the side face of the platform body. The device further comprises an auxiliary orientation mechanism and an auxiliary transfer mechanism, the auxiliary orientation mechanism is arranged on the bottom face of one side of the mechanical arm, the auxiliary transfer mechanism is arranged on the side face of the auxiliary orientation mechanism, and the auxiliary orientation mechanism carries out centering alignment on the chips through rotation of four L-shaped clamping plates so as to ensure that the chips can be aligned with holes formed in the bottom face of the auxiliary frame. Therefore, the stability of the chip in the transferring process is guaranteed, falling of the chip is avoided, the working efficiency is improved, the auxiliary transferring mechanism can blow air around the chip, it is guaranteed that all parts of the chip are subjected to the uniform hot air effect, and then the situation of insufficient temperature is avoided.

Description

Technical Field

[0001] The present invention relates to the field of chip transfer, in particular to a flexible servo platform and a chip mass transfer device. Background Art

[0002] The flexible servo platform is a device that integrates advanced servo technology and robot systems, with high flexibility and precision. It can meet the needs of modern industrial manufacturing for high efficiency and customization, especially in high-end applications such as chip manufacturing and electronic product assembly.

[0003] In traditional processes, mechanical pricking method is usually used to achieve mass transfer of chips. However, the process flow of mechanical pricking method will greatly limit the transfer speed of chips, and the motion platform will inevitably start and stop frequently, which will increase the loss of the motion platform. The jitter derived from starting and stopping will greatly reduce the accuracy of packaging. In addition, the traditional pricking method will stretch the crystal film when pricking the chip, so that other chips around the pricking chip will also be stretched, thereby causing the risk of chip falling. The present invention adopts vacuum adsorption method to transfer chips in large quantities.

[0004] When a vacuum suction nozzle is used to adsorb and transfer the chip, during the transfer process, when the vacuum adsorption force is not sufficient to firmly fix the chip, the chip is likely to fall off, resulting in transfer failure. In addition, when a vacuum suction nozzle is used to adsorb the chip, the position of the chip cannot be adjusted according to the position of the receiving groove on the receiving substrate. This will cause the chip to be misaligned with the receiving groove after being placed in the receiving groove, thereby generating a bending moment, which in turn increases the stress of the chip. This stress will cause the chip to be damaged or its performance to degrade in subsequent processes.

[0005] In addition, when using a receiving substrate to receive the transferred chip, it is usually necessary to heat the entire substrate to melt the solder in the substrate receiving groove and place the chip in the receiving groove. The overall heating of the receiving substrate will cause thermal stress in the receiving substrate. Due to the temperature difference of various parts of the substrate and the different thermal expansion coefficients of the materials, stress will be generated inside the substrate when the substrate is basically heated as a whole. These stresses can cause problems such as deformation, cracking of the substrate or chip falling off.

[0006] Therefore, a flexible servo platform and a chip mass transfer device are proposed to solve the above problems. Summary of the invention

[0007] In view of this, the technical problem to be solved by the present invention is to propose a flexible servo platform and a chip mass transfer device to solve the problem that the prior art cannot adjust the position of the chip according to the position of the receiving groove on the receiving substrate and the overall heating of the receiving substrate will cause thermal stress in the receiving substrate.

[0008] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a flexible servo platform and a chip mass transfer device, comprising: a platform body, a substrate is arranged on the top surface of the platform body, a chip body is arranged on the top surface of the substrate through solder, a transfer plate is arranged on the top surface of the platform body, and the chip body and the transfer plate are located in the same plane, a mechanical arm is movably arranged on the side of the platform body, and also includes an auxiliary orientation mechanism and an auxiliary transfer mechanism, the auxiliary orientation mechanism is arranged on the bottom surface of one side of the mechanical arm, and the auxiliary transfer mechanism is arranged on the side of the auxiliary orientation mechanism;

[0009] The auxiliary orientation mechanism is used to correct the position of the chip body;

[0010] The auxiliary transfer mechanism is used to heat and liquefy the solder around the chip body.

[0011] As an improvement, the auxiliary orientation mechanism also includes a first telescopic rod, which is arranged on the side of the robotic arm, and the bottom surface of the first telescopic rod is fixedly connected to the first auxiliary plate, and the bottom surface of the first auxiliary plate is rotatably connected to the auxiliary frame, and the bottom surface of the auxiliary frame is fixedly connected to the connecting frame, and the bottom surface of the connecting frame is provided with a hole, and the hole is connected to a vacuum adsorption device, and the middle part of the connecting frame is rotatably connected to a rotating column, and the rotating column is provided with an arc groove, and the second telescopic rod is fixedly connected to the four sides of the connecting frame.

[0012] As an improvement, the interior of the rotating column is slidably connected to a sliding rod, a contact 1 is provided at the bottom end of the sliding rod, a sensor is fixedly connected to the top end of the inner wall of the rotating column, a third telescopic rod is fixedly connected to the top end of the inner wall of the rotating column, and the third telescopic rod is located below the sensor, and a reset spring is fixedly connected between the sliding rod and the top surface of the inner wall of the rotating column.

[0013] As an improvement, the top outer surface of the rotating column is fixedly connected to a connecting plate, the bottom surface of the connecting plate is rotatably connected to a connecting rod, the end of the connecting rod away from the connecting plate is rotatably connected to a slider, and the slider is slidably connected to the bottom surface of the connecting frame, and the two ends of the bottom surface of the slider are rotatably connected to L-shaped clamps.

[0014] As an improvement, a pawl is fixedly connected to the top surface of the rotating column, a ratchet is meshed on the outer surface of the pawl, and the ratchet is fixedly connected to the bottom surface of the auxiliary frame.

[0015] As an improvement, the auxiliary transfer mechanism includes an air bin, which is fixedly connected to the bottom surface of the first auxiliary plate, the top surface of the air bin is fixedly connected to a first air inlet pipe, the top surface of the air bin is fixedly connected to a second air inlet pipe, and the first air inlet pipe and the second air inlet pipe are located in the same plane.

[0016] As an improvement, the gas bin is rotatably connected to a rotating plate inside, the bottom end of the rotating plate is fixedly connected to a first cylinder, and the first cylinder and the rotating plate are located at the same center point, a threaded groove is provided inside the first cylinder, and a slide plate is slidably connected in the threaded groove, and a second contact is provided on the bottom surface of the inner wall of the first cylinder.

[0017] As an improvement, the bottom surface of the gas bin is rotatably connected to a worm via a support plate, and the side surface of the support plate is fixedly connected to a first rectangular frame, the center of the first rectangular frame is rotatably connected to a worm gear, the worm gear is meshingly connected to the first rectangular frame, the center of the first rectangular frame is fixedly connected to a second rectangular frame, the bottom end of the second rectangular frame is fixedly connected to a nozzle, a connecting pipe is fixedly connected to the circular arc surface of the nozzle, and the end of the connecting pipe away from the nozzle is fixedly connected to the bottom surface of the gas bin.

[0018] Compared with the prior art, the present invention provides a flexible servo platform and a chip mass transfer device, which has the following beneficial effects:

[0019] 1. The two sliders can be driven to move toward each other by the rotation of the connecting plate, and the chip can be centered by the rotation of the four L-shaped clamping plates to ensure that the chip is aligned with the hole opened on the bottom surface of the auxiliary frame, thereby avoiding uneven adsorption force on the chip as a whole when the chip is adsorbed, ensuring the stability of the chip during the transfer process, preventing it from falling, and thus increasing work efficiency.

[0020] 2. The chip squeezes the sliding rod to drive the four second telescopic rods to extend, thereby pressing the substrate around the chip to prevent the substrate from being pulled when the chip to be transferred is adsorbed, thereby avoiding the simultaneous positional shift of other chips around the chip to ensure the stability of the next chip transfer. When the chip is transferred, the second telescopic rods around the chip remain extended, which can also protect the edge of the chip to prevent damage due to friction or collision during the transfer process.

[0021] 3. Through the rotation of the worm, the worm wheel and the second rectangular frame can be driven to swing back and forth, thereby blowing air around the chip body, thereby ensuring that all parts of the chip body are evenly affected by hot air, thereby avoiding local overheating or insufficient temperature. Reciprocating air blowing can also make the solder better wet the chip pins and reduce welding defects such as cold welding and false welding. In addition, when cold air is transported through the second air inlet pipe, reciprocating air blowing can accelerate the air flow on the surface of the chip body, thereby improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a three-dimensional side view of the overall structure of the present invention;

[0023] Figure 2 For the present invention Figure 1 A schematic diagram of the structure enlargement in the middle;

[0024] Figure 3 This is a schematic diagram of the auxiliary orientation mechanism structure of the present invention;

[0025] Figure 4 This is a schematic diagram of the internal structure of the auxiliary frame of the present invention;

[0026] Figure 5 This is a schematic diagram of the internal structure of the rotating column of the present invention;

[0027] Figure 6 This is a schematic diagram of the ratchet connection structure of the present invention;

[0028] Figure 7 It is a structural schematic diagram of the auxiliary transfer mechanism of the present invention;

[0029] Figure 8 This is a schematic diagram of the connection relationship structure of the auxiliary rotating plate of the present invention;

[0030] Fig. 9 It is a schematic diagram of the internal structure of the first cylinder of the present invention.

[0031] In the figure:

[0032] 1. Platform body; 11. Substrate; 12. Chip body; 13. Transfer plate; 14. Robotic arm;

[0033] 2. Auxiliary orientation mechanism; 21. First telescopic rod; 22. First auxiliary plate; 23. Auxiliary frame; 24. Connecting frame; 25. Second telescopic rod; 26. Rotating column; 27. Sliding rod; 28. Sensor; 29. ​​Third telescopic rod; 210. Connecting plate; 211. Ratchet; 212. Ratchet; 213. Connecting rod; 214. Sliding block; 215. L-shaped clamping plate;

[0034] 3. Auxiliary transfer mechanism; 31. Air chamber; 32. First air inlet pipe; 33. Second air inlet pipe; 34. Turn plate; 35. First cylinder; 36. Slide plate; 37. Worm; 38. Worm wheel; 39. First rectangular frame; 310. Second rectangular frame; 311. Connecting pipe; 312. Nozzle. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] The present invention is further described in detail below based on the accompanying drawings and embodiments.

[0037] Example

[0038] Please refer to Figures 1 to 6 As shown:

[0039] In order to solve the problems mentioned in the technical solution, the embodiment of the present application provides a flexible servo platform and a chip mass transfer device, including: a platform body 1, a substrate 11 is arranged on the top surface of the platform body 1, a chip body 12 is arranged on the top surface of the substrate 11 through solder, a transfer plate 13 is arranged on the top surface of the platform body 1, and the chip body 12 and the transfer plate 13 are located in the same plane, a mechanical arm 14 is movably arranged on the side of the platform body 1, and also includes an auxiliary orientation mechanism 2 and an auxiliary transfer mechanism 3, the auxiliary orientation mechanism 2 is arranged on the bottom surface of one side of the mechanical arm 14, and the auxiliary transfer mechanism 3 is arranged on the side of the auxiliary orientation mechanism 2;

[0040] The auxiliary orientation mechanism 2 is used to correct the position of the chip body 12;

[0041] The auxiliary orientation mechanism 2 also includes a first telescopic rod 21, which is arranged on the side of the mechanical arm 14. The bottom surface of the first telescopic rod 21 is fixedly connected to the first auxiliary plate 22, and the bottom surface of the first auxiliary plate 22 is rotatably connected to the auxiliary frame 23. The bottom surface of the auxiliary frame 23 is fixedly connected to the connecting frame 24. The bottom surface of the connecting frame 24 is provided with holes, and the holes are connected to the vacuum adsorption device. The middle part of the connecting frame 24 is rotatably connected to a rotating column 26, and the rotating column 26 is provided with an arc groove. The connecting frame 24 is fixedly connected to the second telescopic rod 25 around it.

[0042] The interior of the rotating column 26 is slidably connected with a slide rod 27, and a contact 1 is provided at the bottom end of the slide rod 27. The top of the inner wall of the rotating column 26 is fixedly connected with a sensor 28. The top of the inner wall of the rotating column 26 is fixedly connected with a third telescopic rod 29, and the third telescopic rod 29 is located below the sensor 28. A return spring is fixedly connected between the slide rod 27 and the top surface of the inner wall of the rotating column 26.

[0043] The top outer surface of the rotating column 26 is fixedly connected to a connecting plate 210, the bottom surface of the connecting plate 210 is rotatably connected to a connecting rod 213, the end of the connecting rod 213 away from the connecting plate 210 is rotatably connected to a slider 214, and the slider 214 is slidably connected to the bottom surface of the connecting frame 24, and the two ends of the bottom surface of the slider 214 are rotatably connected to L-shaped clamps 215.

[0044] A pawl 211 is fixedly connected to the top surface of the rotating column 26 , a ratchet 212 is meshed on the outer surface of the pawl 211 , and the ratchet 212 is fixedly connected to the bottom surface of the auxiliary frame 23 .

[0045] Among them: the top surface of the transfer plate 13 is provided with a receiving groove, and solder is placed in the receiving groove, a shock absorbing mechanism is provided between the first telescopic rod 21 and the mechanical arm 14, a hole is provided on the bottom surface of the connecting frame 24, and the hole is connected to the vacuum adsorption device, the rotating column 26 is provided with an arc groove, and the slide rod 27 slides in the arc groove, the top of the slide rod 27 is provided with a disc, and the bottom end of the slide rod 27 is provided with a contact 1, and is electrically connected to the second telescopic rod 25, that is, the chip touches the contact 1, and the contact 1 is The rubber material will not cause damage to the chip. The second telescopic rod 25 is extended to press against the substrate 11, and at this time the second telescopic rod 25 can still be squeezed and contracted. The sensor 28 is electrically connected to the third telescopic rod 29. When the sensor 28 senses the sliding rod 27, the third telescopic rod 29 is extended, the pawl 211 cannot drive the ratchet 212 to rotate when it rotates clockwise, and the pawl 211 drives the ratchet 212 to rotate when it rotates counterclockwise. The ratchet 212 is controlled to rotate by the control unit, and the third telescopic rod 29 is contracted.

[0046] Compared with the prior art, through the implementation of this embodiment, the rotation of the connecting plate 210 can drive the two sliders 214 to move toward each other, and the chip can be centered by the rotation of the four L-shaped clamps 215 to ensure that the chip is aligned with the hole opened on the bottom surface of the auxiliary frame 23, thereby avoiding uneven adsorption force on the entire chip when the chip is adsorbed, ensuring the stability of the chip during the transfer process, preventing it from falling, and thereby increasing work efficiency.

[0047] For further examples, please refer to Figures 7 to 9 As shown:

[0048] The auxiliary transfer mechanism 3 is used to heat and liquefy the solder around the chip body 12 .

[0049] The auxiliary transfer mechanism 3 includes an air bin 31, which is fixedly connected to the bottom surface of the first auxiliary plate 22, and the top surface of the air bin 31 is fixedly connected to a first air inlet pipe 32, and the top surface of the air bin 31 is fixedly connected to a second air inlet pipe 33, and the first air inlet pipe 32 and the second air inlet pipe 33 are located in the same plane.

[0050] The air bin 31 is rotatably connected to a rotating plate 34, the bottom end of which is fixedly connected to a first cylinder 35, and the first cylinder 35 and the rotating plate 34 are located at the same center point. A threaded groove is provided inside the first cylinder 35, and a slide plate 36 is slidably connected inside the threaded groove. A contact 2 is provided on the bottom surface of the inner wall of the first cylinder 35.

[0051] The bottom surface of the gas chamber 31 is rotatably connected to a worm 37 through a support plate, and a first rectangular frame 39 is fixedly connected to the side surface of the support plate, a worm wheel 38 is rotatably connected to the center of the first rectangular frame 39, the worm wheel 38 is meshingly connected to the first rectangular frame 39, a second rectangular frame 310 is fixedly connected to the center of the first rectangular frame 39, a nozzle 312 is fixedly connected to the bottom end of the second rectangular frame 310, a connecting pipe 311 is fixedly connected to the circular arc surface of the nozzle 312, and one end of the connecting pipe 311 away from the nozzle 312 is fixedly connected to the bottom surface of the gas chamber 31.

[0052] Among them: the first air inlet pipe 32 is used to input hot air, the second air inlet pipe 33 is used to input cold air, the interior of the first cylinder 35 is provided with a threaded groove, and a slide plate 36 is slidably connected in the threaded groove, and a contact point 2 is provided on the bottom surface of the inner wall of the first cylinder 35. The contact point 2 is electrically connected to the worm 37, that is, when the slide plate 36 touches the contact point 2, the worm 37 rotates, and the connecting pipe 311 is a hose.

[0053] Compared with the prior art, through the implementation of this embodiment, the rotation of the worm 37 can drive the worm wheel 38 and the second rectangular frame 310 to swing back and forth, thereby blowing air around the chip body 12, thereby ensuring that each part of the chip body 12 is subjected to uniform hot air action, thereby avoiding local overheating or insufficient temperature. The reciprocating blowing can also make the solder better wet the chip pins and reduce welding defects such as cold welding and false welding. In addition, when cold air is transported through the second air inlet pipe 33, the reciprocating blowing can accelerate the air flow on the surface of the chip body 12, thereby improving the heat dissipation efficiency.

[0054] Everything in the above example works like this:

[0055] In the initial state: the sliding rod 27 is located at the bottom end of the rotating column 26 .

[0056] The following is the working process of the auxiliary orientation mechanism 2 correcting the position of the chip body 12:

[0057] When in use, the auxiliary orientation mechanism 2 is moved to the top of the chip body 12 to be moved by the movement of the mechanical arm 14, and since a shock absorbing mechanism is arranged between the mechanical arm 14 and the chip body 12, when the mechanical arm 14 moves, there is almost no vibration effect on the chip body 12, ensuring the smooth movement of the chip body 12. Subsequently, the mechanical arm 14 controls the auxiliary orientation mechanism 2 to move downward. When the auxiliary orientation mechanism 2 moves downward, the slide bar 27 will first touch the chip body 12. Since a contact 1 is arranged at the bottom end of the slide bar 27 and is electrically connected to the second telescopic rod 25, when the chip touches the contact 1, and the contact 1 is made of rubber, it will not cause damage to the chip. The second telescopic rod 25 is extended to press the substrate 11, and at this time the second telescopic rod 25 can still be squeezed and contracted. By pressing the substrate 11, it can be avoided that the substrate 11 is pulled when the chip to be transferred is adsorbed, thereby avoiding the positional displacement of other chips around the chip at the same time, so as to ensure the stability of the next chip transfer.

[0058] Then the slide bar 27 continues to be pressed down, and since the rotating column 26 has an arc groove, the slide bar 27 slides in the arc groove, that is, when the slide bar 27 is pressed and slides upward, the rotating column 26 rotates accordingly, and the rotating column 26 rotates to drive the connecting plate 210 fixedly connected to it to rotate, and the connecting plate 210 rotates to drive the connecting rod 213 rotatably connected to its two ends to rotate, thereby driving the two sliders 214 to slide toward each other. When the two sliders 214 slide toward each other, they drive the L-shaped clamping plate 215 to slide toward each other. Since the bottom surface of the connecting frame 24 has a hole, and the hole is connected to the vacuum adsorption equipment, the L-shaped clamping plate 215 is connected to the L-shaped clamping plate 214. The plates 215 slide towards each other to center the chip body 12 so that it is located at the bottom hole of the connecting frame 24. Since a disc is provided at the top of the slide bar 27, when the slide bar 27 slides to the top of the inner wall of the rotating column 26, the sensor 28 will be sensed, and then the third telescopic rod 29 will be driven to extend, and the slide bar 27 will be stuck and unable to move down. At this time, the second telescopic rod 25 is in an extended state, and the L-shaped clamping plate 215 is in a clamping state for the chip body 12. Then the vacuum adsorption device is driven to adsorb the chip body 12, and the driving device can adjust the position of the chip body 12 according to needs.

[0059] Finally, the chip body 12 is moved to the top of the transfer plate 13 by the robot arm 14. When the chip body 12 is transferred, the second telescopic rods 25 around the chip body 12 remain extended, thereby protecting the edge of the chip and preventing damage due to friction or collision during the transfer process. The L-shaped clamp 215 is in a clamping state for the chip body 12, which cooperates with the vacuum adsorption to further ensure the stability of the movement of the chip body 12.

[0060] Please refer to the above working process Figures 1 to 6 .

[0061] The following is the working process of the auxiliary transfer mechanism 3 heating and liquefying the solder around the chip body 12:

[0062] When in use, since the top surface of the transfer plate 13 is provided with a receiving groove, and solder is placed in the receiving groove, that is, when the chip body 12 is moved above the receiving groove, hot air is input through the first air inlet pipe 32, and at this time, the rotating plate 34 will also rotate accordingly. Through the rotation of the rotating plate 34, a rotating airflow can be generated in the air bin 31, thereby generating a stronger airflow disturbance effect, which helps to accelerate the heat exchange process around the chip when heating the chip, thereby improving the heating effect and heat dissipation efficiency, and can also balance the internal stress of the air bin 31, improve the stability and reliability of the equipment, and then, the rotating airflow is transported to the nozzle 312 through the connecting pipe 311, thereby heating the chip body 12;

[0063] When the rotating plate 34 rotates, the first cylinder 35 will also rotate. Since a thread groove is provided inside the first cylinder 35, and a slide plate 36 is slidably connected in the thread groove, a second contact is provided on the bottom surface of the inner wall of the first cylinder 35, and the second contact is electrically connected to the worm 37, that is, when the slide plate 36 touches the second contact, the worm 37 rotates, that is, the rotation of the first cylinder 35 causes the slide plate 36 to touch the second contact, thereby driving the worm 37 to rotate, and the rotation of the worm 37 drives the worm wheel 38 meshing with it to swing, and the swing of the worm wheel 38 drives the second rectangular frame 310 fixedly connected to it to swing together, thereby driving the nozzle 312 to swing, thereby reciprocating air blowing is performed around the chip body 12, thereby ensuring that each part of the chip body 12 is subjected to uniform hot air action, thereby avoiding local overheating or insufficient temperature, and reciprocating air blowing can also make the solder better wet the chip pins, reducing welding defects such as cold welding and false welding.

[0064] After the solder is liquefied, the second telescopic rod 25 is retracted through the driving device so that the slide bar 27 is no longer blocked, and a spring is fixedly connected between the slide bar 27 and the rotating column 26. When the slide bar 27 is no longer blocked, the spring pushes the slide bar 27 to move downward, so that the L-shaped clamp 215 no longer clamps the chip body 12. Subsequently, the chip body 12 is placed inside the receiving groove through the robotic arm 14, and the vacuum adsorption device is closed to complete the chip transfer.

[0065] Please refer to the above working process Figures 7 to 9 .

[0066] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0067] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. Flexible servo platform and chip mass transfer device, including: A platform body (1), wherein a substrate (11) is disposed on the top surface of the platform body (1), a chip body (12) is disposed on the top surface of the substrate (11) via solder, a transfer plate (13) is disposed on the top surface of the platform body (1), and the chip body (12) and the transfer plate (13) are located in the same plane, a mechanical arm (14) is movably disposed on the side of the platform body (1), and the platform body (1) is characterized in that it also includes an auxiliary orientation mechanism (2) and an auxiliary transfer mechanism (3), wherein the auxiliary orientation mechanism (2) is disposed on the bottom surface of one side of the mechanical arm (14), and the auxiliary transfer mechanism (3) is disposed on the side of the auxiliary orientation mechanism (2); The auxiliary orientation mechanism (2) is used to correct the position of the chip body (12); The auxiliary transfer mechanism (3) is used to heat and liquefy the solder around the chip body (12).

2. The flexible servo platform and chip mass transfer device according to claim 1, characterized in that: The auxiliary orientation mechanism (2) further comprises a first telescopic rod (21), the first telescopic rod (21) being arranged on the side of the mechanical arm (14), the bottom surface of the first telescopic rod (21) being fixedly connected to a first auxiliary plate (22), the bottom surface of the first auxiliary plate (22) being rotatably connected to an auxiliary frame (23), the bottom surface of the auxiliary frame (23) being fixedly connected to a connecting frame (24), the bottom surface of the connecting frame (24) being provided with a hole, and the hole being connected to a vacuum adsorption device, the middle part of the connecting frame (24) being rotatably connected to a rotating column (26), the rotating column (26) being provided with an arc groove, and the four sides of the connecting frame (24) being fixedly connected to a second telescopic rod (25).

3. The flexible servo platform and chip mass transfer device according to claim 2, characterized in that: The interior of the rotating column (26) is slidably connected to a slide rod (27), a contact 1 is provided at the bottom end of the slide rod (27), a sensor (28) is fixedly connected to the top end of the inner wall of the rotating column (26), a third telescopic rod (29) is fixedly connected to the top end of the inner wall of the rotating column (26), and the third telescopic rod (29) is located below the sensor (28), and a return spring is fixedly connected between the slide rod (27) and the top surface of the inner wall of the rotating column (26).

4. The flexible servo platform and chip mass transfer device according to claim 3, characterized in that: The outer surface of the top end of the rotating column (26) is fixedly connected to a connecting plate (210), the bottom surface of the connecting plate (210) is rotatably connected to a connecting rod (213), one end of the connecting rod (213) away from the connecting plate (210) is rotatably connected to a sliding block (214), and the sliding block (214) is slidably connected to the bottom surface of the connecting frame (24), and both ends of the bottom surface of the sliding block (214) are rotatably connected to L-shaped clamping plates (215).

5. The flexible servo platform and chip mass transfer device according to claim 4, characterized in that: A pawl (211) is fixedly connected to the top surface of the rotating column (26), a ratchet (212) is meshed on the outer surface of the pawl (211), and the ratchet (212) is fixedly connected to the bottom surface of the auxiliary frame (23).

6. The flexible servo platform and chip mass transfer device according to claim 2, characterized in that: The auxiliary transfer mechanism (3) comprises an air bin (31), the air bin (31) is fixedly connected to the bottom surface of the first auxiliary plate (22), the top surface of the air bin (31) is fixedly connected to a first air inlet pipe (32), the top surface of the air bin (31) is fixedly connected to a second air inlet pipe (33), and the first air inlet pipe (32) and the second air inlet pipe (33) are located in the same plane.

7. The flexible servo platform and chip mass transfer device according to claim 6, characterized in that: The gas bin (31) is rotatably connected to a rotating plate (34) inside, and the bottom end of the rotating plate (34) is fixedly connected to a first cylinder (35), and the first cylinder (35) and the rotating plate (34) are located at the same center point, a thread groove is provided inside the first cylinder (35), and a slide plate (36) is slidably connected inside the thread groove, and a second contact is provided on the bottom surface of the inner wall of the first cylinder (35).

8. The flexible servo platform and chip mass transfer device according to claim 7, characterized in that: The bottom surface of the gas chamber (31) is rotatably connected to a worm (37) via a support plate, and a first rectangular frame (39) is fixedly connected to the side surface of the support plate; a worm wheel (38) is rotatably connected to the center of the first rectangular frame (39), and the worm wheel (38) is meshingly connected to the first rectangular frame (39); a second rectangular frame (310) is fixedly connected to the center of the first rectangular frame (39); a nozzle (312) is fixedly connected to the bottom end of the second rectangular frame (310); a connecting pipe (311) is fixedly connected to the circular arc surface of the nozzle (312), and one end of the connecting pipe (311) away from the nozzle (312) is fixedly connected to the bottom surface of the gas chamber (31).

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