Wafer conveying device

Abstract

The invention discloses a wafer conveying device. The wafer conveying device comprises a shell which is provided with a conveying cavity, and the conveying cavity is used for containing a wafer; the rotating seat can be rotatably mounted in the conveying cavity, and the rotating seat is used for bearing the wafer and driving the wafer to rotate; the multiple sets of offset detection assemblies are arranged in the circumferential direction of the rotating base at intervals, the distances between the offset detection assemblies and the rotating base are equal, and the offset detection assemblies are used for cooperatively detecting the coaxiality of the wafer and the rotating base; and the rotation detection assembly and the rotation seat are arranged in a spaced mode, the rotation detection assembly is located between any two sets of adjacent offset detection assemblies, and the rotation detection assembly is used for detecting the circumferential relative position of the wafer relative to the rotation detection assembly. According to the wafer conveying device provided by the invention, the actual state of the wafer can be effectively detected.

Description

Technical Field

[0001] The present application belongs to the field of wafer processing technology, and in particular, relates to a wafer conveying device. Background Art

[0002] Wafer transfer is an important process in the chip processing. Currently, wafers are mostly transferred through the wafer transfer chamber of the transfer device. The wafer has a preset state in the transfer chamber. During the transfer process, the wafer must be kept in the preset state so that the wafer can enter the subsequent processing steps in the required state.

[0003] However, in actual operation, it was found that after the wafer enters the transfer chamber, its actual state cannot be guaranteed. It may be offset or rotated relative to the preset state. If it directly enters the subsequent processing steps at this time, it will affect the quality of the finished wafer.

[0004] Therefore, how to accurately understand whether the actual state of the wafer in the transfer chamber is consistent with the preset state has become a problem that needs to be solved urgently in this field. Summary of the invention

[0005] The present application provides a wafer conveying device that can effectively detect the actual status of the wafer.

[0006] The present application provides a wafer conveying device, wherein the wafer conveying device comprises:

[0007] A housing having a transfer cavity, wherein the transfer cavity is used to accommodate wafers;

[0008] A rotating seat, rotatably mounted in the transfer chamber, the rotating seat being used to carry the wafer and drive the wafer to rotate;

[0009] A plurality of groups of offset detection components are arranged at intervals along the circumference of the rotating seat, and the distance between each group of the offset detection components and the rotating seat is equal, and each group of the offset detection components is used to cooperate in detecting the coaxiality of the wafer and the rotating seat;

[0010] A rotation detection component is spaced apart from the rotating seat and located between any two groups of adjacent offset detection components. The rotation detection component is used to detect the circumferential relative position of the wafer relative to the rotation detection component.

[0011] The wafer conveying device as described above, wherein the housing comprises:

[0012] A bottom shell having an opening formed on one side along the axial direction of the wafer;

[0013] The shell cover is detachably and sealably mounted on the opening. The bottom shell and the shell cover are combined to form the transmission chamber. The rotating seat is mounted on the bottom plate of the bottom shell.

[0014] The wafer conveying device as described above, wherein the deviation detection component comprises:

[0015] A first transmitter, mounted on the housing cover, the first transmitter being used to emit a first optical signal;

[0016] a first receiver, mounted on the bottom plate of the bottom shell, the first receiver and the first transmitter being arranged opposite to each other along the axial direction of the wafer, and the first receiver being used to receive the first optical signal;

[0017] So that when the first receivers of each group of the deviation detection components can receive the first optical signal emitted by the corresponding first transmitter, it is confirmed that the wafer is coaxial with the rotating seat;

[0018] When the first receivers of any group of the deviation detection components do not receive the first optical signal emitted by the corresponding first transmitter, it is confirmed that the wafer is not coaxial with the rotating base.

[0019] The wafer conveying device as described above, wherein the rotation detection component comprises:

[0020] A second transmitter, mounted on the housing cover, the second transmitter being used to emit a second optical signal;

[0021] A second receiver is mounted on the bottom plate of the bottom shell, the second receiver and the second transmitter are arranged opposite to each other along the axial direction of the wafer, and the second receiver is used to receive the second optical signal;

[0022] A detection area is provided at the periphery of the wafer, and the detection area can allow the second optical signal to pass through;

[0023] So that when the second receivers can receive the second optical signal, it is confirmed that the wafer has not rotated;

[0024] When the second receiver does not receive the second optical signal, it is confirmed that the wafer has rotated.

[0025] In the wafer conveying device as described above, the offset detection components are provided in at least three groups, and the three groups of the offset detection components are evenly spaced along the circumference of the wafer; and the rotation detection component is provided between any two groups of the offset detection components.

[0026] The wafer conveying device as described above, wherein mounting holes are provided on the shell cover and the bottom plate of the bottom shell, and the mounting holes penetrate along the axial direction of the wafer;

[0027] The first transmitter, the second transmitter and the second receiver are all arranged outside the shell, and the first transmitter and the second transmitter are respectively installed at the mounting hole of the shell cover through a group of mounting components, and the second receiver is installed at the mounting hole of the bottom plate of the bottom shell through a group of mounting components. The first optical signal can be transmitted to the transmission cavity through the corresponding mounting hole on the shell cover, and the second optical signal can pass through the mounting hole on the shell cover and the corresponding mounting hole on the bottom plate of the bottom shell.

[0028] The wafer conveying device as described above, wherein the mounting component comprises:

[0029] A sealing seat connected to the shell cover, wherein the sealing seat is provided with a light-transmitting hole penetrating along the axial direction of the wafer, and the light-transmitting hole corresponds to the mounting hole along the axial direction of the wafer;

[0030] A transparent plate, a sealing clamp, is arranged between the sealing seat and the shell cover;

[0031] A support seat is connected to a side of the sealing seat facing away from the shell cover, and the support seat is used to carry the first transmitter or the second transmitter.

[0032] The wafer conveying device as described above, wherein the mounting member further comprises a calibration element, the calibration element is mounted on a side of the sealing seat away from the shell cover, and the calibration element and the first transmitter, or the calibration element and the second transmitter are located on the same side of the support seat;

[0033] The calibration element is provided with a calibration hole. Along the axial direction of the wafer, the projection of the calibration hole falls into the projection of the light-transmitting hole. The calibration hole is used to calibrate the propagation direction of the first optical signal or the second optical signal.

[0034] The wafer conveying device as described above, wherein the support seat is provided with a connecting hole, the through direction of the connecting hole is perpendicular to the axial direction of the wafer, and the first transmitter and the second transmitter are respectively installed in the corresponding connecting hole through a connecting piece;

[0035] The connection hole is a strip-shaped hole extending along the axial direction of the wafer.

[0036] The wafer conveying device as described above, wherein the support seat is provided with at least one adjusting top screw, the adjusting top screw is screwed to the support seat, and the adjusting top screw can reciprocate along the through direction of the connecting hole;

[0037] One end of the adjusting screw is in contact with the first transmitter or the second transmitter. The adjusting screw can be used to adjust the angle between the first transmitter and the support base or the angle between the second transmitter and the support base, thereby adjusting the propagation direction of the first optical signal or the second optical signal.

[0038] The wafer conveying device of the present application can be used to carry the wafer and drive the wafer to rotate by setting a rotating seat in the conveying cavity of the shell. The real-time state of the wafer can be detected during the rotation of the wafer. Specifically, the preset state of the wafer is set to be coaxial between the wafer and the rotating seat during design. By setting an offset detection component, the coaxiality between the wafer and the rotating seat can be effectively detected. If it is detected that the wafer and the rotating seat are not coaxial, it is determined that the real-time state of the wafer is offset relative to the preset state, and the position of the wafer needs to be adjusted when entering the subsequent process; by setting a rotation detection component, it is possible to detect whether the real-time state of the wafer is rotated relative to the preset state. If the wafer rotates, the rotation angle of the wafer can be detected in cooperation with the rotating seat and the wafer can be rotated back to the preset state, so as to ensure that the wafer can enter the subsequent processing process in the required preset state, thereby ensuring the quality of the finished wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solution of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0040] Figure 1 A schematic structural diagram of a wafer conveying device according to an embodiment of the present application;

[0041] Figure 2 An exploded view of a wafer conveying device according to an embodiment of the present application;

[0042] Figure 3 An exploded view of a partial structure of a wafer conveying device according to an embodiment of the present application;

[0043] Figure 4 It is another partial structure explosion diagram of the wafer conveying device according to the embodiment of the present application;

[0044] Figure 5 It is a schematic structural diagram of a calibration element of a mounting structure of a wafer conveying device according to an embodiment of the present application.

[0045] Description of Figure Numbers:

[0046] 1. Shell; 11. Bottom shell; 12. Shell cover; 121. Mounting hole; 13. Transmission chamber; 14. Sealing element;

[0047] 2. Rotating seat;

[0048] 3. offset detection component; 31. first transmitter; 32. first receiver; 33. first optical signal;

[0049] 4. Rotation detection component; 41. Second transmitter; 42. Second receiver; 43. Second optical signal;

[0050] 5. Mounting component; 51. Sealing seat; 511. Light-transmitting hole; 52. Transparent plate; 53. Sealing ring; 54. Support seat; 541. Connecting hole; 542. Adjusting top screw; 55. Calibration element; 551. Light-calibrating hole. DETAILED DESCRIPTION

[0051] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0052] The transfer of wafers is an important process in the chip processing. Currently, wafers are mostly transferred through the wafer transfer chamber of the transfer device. The wafer has a preset state in the transfer chamber 13. During the transfer process, the wafer must be kept in the preset state so that the wafer can enter the subsequent processing steps in the required state. The preset state mainly includes two aspects. On the one hand, it is the position of the wafer in the wafer transfer chamber, and on the other hand, it is the relative position of the wafer itself along its circumference. It is necessary to ensure that the wafer meets the requirements in both aspects before entering the subsequent processing steps.

[0053] Currently, the position of the wafer in the wafer transfer chamber is determined by aligning the alignment device outside the wafer transfer chamber, and then the wafer is placed in the wafer transfer chamber by the robot. Since the robot needs to transport the wafer in different paths, the position of the wafer may change during the transportation process, so the actual state of the wafer in the wafer transfer chamber may change, and it may be offset or rotated relative to the preset state.

[0054] like Figure 1 and Figure 2 As shown, the present application provides a wafer conveying device, wherein the wafer conveying device includes a shell 1, a rotating base 2, a plurality of groups of offset detection components 3 and at least one group of rotation detection components 4.

[0055] The housing 1 has a sealed transfer chamber 13, which is used to accommodate wafers and provide a sealed transfer space for the wafers, thereby ensuring the cleanliness and vacuum degree of the wafer transfer environment.

[0056] The rotating seat 2 is rotatably installed in the transmission chamber 13. The rotating seat 2 can be driven by a motor or manually to achieve rotation.

[0057] The rotating seat 2 is used to carry the wafer and position the wafer inside the transfer chamber 13 to prevent the wafer from moving in the transfer chamber 13 and being damaged by collision. The rotating seat 2 can drive the wafer to rotate to cooperate with the offset detection component 3 and the rotation detection component 4 to detect the wafer, and at the same time adjust the circumferential relative position of the wafer to prompt the wafer to adjust to a preset state.

[0058] Each group of offset detection components 3 is arranged at intervals along the circumference of the rotating seat 2, and the distance between each group of offset detection components 3 and the rotating seat 2 is equal, so that each group of offset detection components 3 cooperates with each other to detect the coaxiality of the wafer and the rotating seat 2. If the wafer is coaxial with the rotating seat 2, the actual state of the wafer has not shifted relative to the preset state. If the wafer is not coaxial with the rotating seat 2, the actual state of the wafer has shifted relative to the preset state. At this time, the wafer needs to be adjusted before entering the subsequent processing steps.

[0059] The rotation detection component 4 is spaced apart from the rotating base 2 and is located between any two adjacent groups of offset detection components 3. The rotation detection component 4 is used to detect the circumferential relative position of the wafer relative to the rotation detection component 4 to determine whether the actual state of the wafer has rotated relative to the preset state. If the actual state of the wafer has rotated relative to the preset state, the wafer also needs to be adjusted before entering the subsequent processing steps.

[0060] The wafer conveying device of the present application is provided with a rotating seat 2 in the conveying chamber 13 of the shell 1, which can be used to carry the wafer and drive the wafer to rotate. The real-time state of the wafer can be detected during the rotation of the wafer. Specifically, the preset state of the wafer is set to be coaxial with the rotating seat 2 during design. By providing an offset detection component 3, the coaxiality between the wafer and the rotating seat 2 can be effectively detected. If it is detected that the wafer and the rotating seat 2 are not coaxial, it is determined that the real-time state of the wafer is offset relative to the preset state, and the position of the wafer needs to be adjusted when entering the subsequent process; by providing a rotation detection component 4, it is possible to detect whether the real-time state of the wafer is rotated relative to the preset state. If the wafer rotates, the rotating seat 2 can be cooperated to detect the rotation angle of the wafer and rotate the wafer back to the preset state, so as to ensure that the wafer can enter the subsequent processing process in the required preset state, thereby ensuring the quality of the finished wafer.

[0061] like Figure 1 and Figure 2 As shown, the wafer conveying device provided by the present application, wherein the shell 1 includes a bottom shell 11 and a shell cover 12 .

[0062] The bottom shell 11 is formed with an opening on one side along the axial direction of the wafer, forming an open box-shaped structure.

[0063] The shell cover 12 is detachably and sealably mounted on the opening, and the bottom shell 11 and the shell cover 12 enclose a transmission chamber 13. Optionally, the bottom shell 11 and the shell cover 12 are sealed by an annular seal 14 to ensure the sealing of the transmission chamber 13.

[0064] The installation between the bottom shell 11 and the shell cover 12 needs to ensure a certain positioning accuracy. Specifically, a positioning connection is provided between the bottom shell 11 and the shell cover 12 through a plurality of positioning pins.

[0065] The rotating seat 2 is mounted on the bottom plate of the bottom shell 11. Optionally, the rotating seat 2 is a circular rotating disk, which can ensure that the wafer is evenly stressed when in contact with the wafer, thereby preventing the wafer from being damaged due to uneven stress.

[0066] like Figure 2 As shown, in the wafer conveying device provided by the present application, the deviation detection component 3 includes a first transmitter 31 and a first receiver 32. Optionally, the first transmitter 31 may be a laser transmitter, and the first receiver 32 may be a laser receiver.

[0067] The first transmitter 31 is installed on the housing cover 12 , and the first transmitter 31 is used to emit a first optical signal 33 .

[0068] The first receiver 32 is mounted on the bottom plate of the bottom shell 11 . The first receiver 32 and the first transmitter 31 are arranged opposite to each other along the axial direction of the wafer. The first receiver 32 is used for receiving the first optical signal 33 .

[0069] Optionally, after the shell cover 12 and the bottom shell 11 are assembled, the first transmitter 31 can be fine-tuned to adjust the propagation direction of the first optical signal 33 to ensure that the first optical signal 33 can be transmitted to the first receiver 32 and detected by the first receiver 32. By determining whether the first receiver 32 detects the first optical signal 33, it can be detected whether the wafer is offset relative to the preset state.

[0070] Specifically, the distance between each group of offset detection components 3 and the rotation center of the rotating seat 2 is slightly larger than the radius of the wafer. When the first receiver 32 of each group of offset detection components 3 can receive the first light signal 33 emitted by the corresponding first transmitter 31, it can be determined that the center of the wafer coincides with the rotation center of the rotating seat 2. At this time, the wafer is coaxial with the rotating seat 2, and the real-time state of the wafer has not shifted relative to the preset state.

[0071] When the first receiver 32 of any group of offset detection components 3 does not receive the first light signal 33 emitted by the corresponding first transmitter 31, it means that the first light signal 33 of the group of offset detection components 3 is blocked by the wafer during the rotation of the wafer. It can be determined that the center of the wafer is offset from the rotation center of the rotating seat 2. At this time, the wafer is not coaxial with the rotating seat 2, and the real-time state of the wafer is offset relative to the preset state.

[0072] like Figure 2 As shown, in the wafer conveying device provided by the present application, the rotation detection component 4 includes a second transmitter 41 and a second receiver 42. Optionally, the second transmitter 41 may be a micrometer transmitter, and the second receiver 42 may be a micrometer receiver.

[0073] The second transmitter 41 is installed on the housing cover 12 , and the second transmitter 41 is used for sending a second optical signal 43 .

[0074] The second receiver 42 is mounted on the bottom plate of the bottom housing 11 . The second receiver 42 and the second transmitter 41 are arranged opposite to each other along the axial direction of the wafer. The second receiver 42 is used for receiving the second optical signal 43 .

[0075] Optionally, after the shell cover 12 and the bottom shell 11 are assembled, the second transmitter 41 can be fine-tuned to adjust the propagation direction of the second optical signal 43 to ensure that the second optical signal 43 can be transmitted to the second receiver 42 and detected by the second receiver 42. By determining whether the second receiver 42 detects the second optical signal 43, it can be detected whether the wafer is rotated relative to the preset state.

[0076] Specifically, a detection area is provided at the periphery of the wafer, and the detection area can allow the second light signal 43 to pass through; optionally, the detection area can be a gap, or a transparent area, which can allow the second light signal 43 to pass through smoothly.

[0077] According to the preset state and the position of the rotating detection component 4, the circumferential relative position of the detection area is determined to ensure that under the preset state, the detection area and the rotating detection component 4 are relatively arranged along the axial direction of the wafer. At this time, the second receiver 42 can receive the second optical signal 43, so it can be determined that the real-time state of the wafer has not rotated relative to the preset state.

[0078] When the second receiver 42 does not receive the second optical signal 43, it can be determined that the detection area is offset from the rotation detection component 4 and is not arranged relative to the axial direction of the wafer. At this time, the second optical signal 43 is blocked by the wafer, and it can be determined that the real-time state of the wafer has rotated relative to the preset state.

[0079] like Figure 1 and Figure 2As shown, the wafer conveying device provided by the present application is provided with at least three groups of offset detection components 3, and the three groups of offset detection components 3 are evenly spaced along the circumference of the wafer. The three groups of offset detection components 3 can effectively detect the offset of the wafer along any radial direction, thereby ensuring the comprehensiveness and accuracy of the detection and avoiding missed detection.

[0080] The rotation detection component 4 is arranged between any two groups of offset detection components 3 to ensure that it corresponds to the detection area under the preset state of the wafer.

[0081] like Figure 1 and Figure 2 As shown, the wafer conveying device provided by the present application, wherein mounting holes 121 are opened on the shell cover 12 and the bottom plate of the bottom shell 11, and the mounting holes 121 pass through along the axial direction of the wafer; the first transmitter 31, the second transmitter 41 and the second receiver 42 are all arranged on the outside of the shell 1, and the first transmitter 31 and the second transmitter 41 are respectively installed at a mounting hole 121 of the shell cover 12 through a group of mounting components 5, and the second receiver 42 is installed at the mounting hole of the bottom plate of the bottom shell through a group of mounting components 5. In the embodiment of the present application, the shell cover 12 is used as the installation base of the first transmitter 31 and the second transmitter 41, and the bottom plate of the bottom shell 11 is used as the installation base of the second receiver 42. Installing the first transmitter 31, the second transmitter 41 and the second receiver 42 on the outside of the shell 1 has the advantages of easy adjustment, maintenance and replacement.

[0082] The first optical signal 33 can be transmitted to the transmission cavity 13 through the corresponding mounting hole 121, and the second optical signal 43 can pass through the mounting hole 121 on the shell cover 12 and the corresponding mounting hole on the bottom plate of the bottom shell 11 to ensure the smooth transmission of the first optical signal 33 and the second optical signal 43, and avoid interference of the shell cover 12 with the transmission of the first optical signal 33 and the second optical signal 43.

[0083] like Figure 3 and Figure 4 As shown, the wafer conveying device provided by the present application, wherein the mounting component 5 includes a sealing seat 51, a transparent plate 52 and a supporting seat 54, the sealing seat 51 realizes the sealing of the mounting hole 121, the transparent plate 52 realizes the smooth propagation of the first optical signal 33 and the second optical signal 43 from the outside of the shell 1 to the inside of the shell 1, and the supporting seat 54 realizes the installation of the first transmitter 31 and the second transmitter 41.

[0084] The sealing seat 51 is connected to the shell cover 12, and a light-transmitting hole 511 is provided on the sealing seat 51 and passes through the axial direction of the wafer. The light-transmitting hole 511 corresponds to the mounting hole 121 along the axial direction of the wafer; optionally, along the axial direction of the wafer, the projection of the light-transmitting hole 511 coincides with the projection of the mounting hole 121, or the projection of the mounting hole 121 falls into the projection of the light-transmitting hole 511, so as to ensure that the mounting hole 121 can be fully exposed to the light-transmitting hole 511, thereby preventing the sealing seat 51 from obstructing the transmission of the first optical signal 33 and the second optical signal 43.

[0085] The transparent plate 52 is sealed and clamped between the sealing seat 51 and the shell cover 12; along the axial direction of the wafer, the projection of the mounting hole 121 and the projection of the light-transmitting hole 511 both fall into the projection of the transparent plate 52, and a sealing ring 53 is clamped between the transparent plate 52 and the sealing seat 51 and between the transparent plate 52 and the shell cover 12. The sealing ring 53 between the transparent plate 52 and the sealing seat 51 is arranged around the light-transmitting hole 511, and the sealing ring 53 between the transparent plate 52 and the shell cover 12 is arranged around the mounting hole 121. By arranging the sealing ring 53, the mounting hole 121 can be effectively sealed, the friction between the transparent plate 52 and the shell cover 12 and between the transparent plate 52 and the sealing member 14 is increased, and the position of the transparent plate 52 is maintained. At the same time, the sealing ring 53 can also provide buffer protection for the transparent plate 52 to avoid the transparent plate 52 from directly contacting with the shell cover 12 or the sealing seat 51 and being worn.

[0086] The support base 54 is connected to the side of the sealing base 51 away from the shell cover 12, and the support base 54 is used to carry the first launcher 31 or the second launcher 41. Optionally, a part of the support base 54 is connected to the sealing base 51, and the other part is a plate-like structure parallel to the axial direction of the wafer, and the plate-like structure serves as the installation base of the first launcher 31 and the second launcher 41.

[0087] Optionally, each group of offset detection components 3 can be provided with multiple first transmitters 31, and the multiple first transmitters 31 are arranged at radial intervals of the wafer at the relative positions of the corresponding offset detection components 3 and the wafer to adapt to wafers of different sizes. Each first transmitter 31 can share one first receiver 32, or each first transmitter 31 can be equipped with a first receiver 32 separately.

[0088] When each set of the deviation detection components 3 is provided with a plurality of first emitters 31 , the plurality of first emitters 31 are disposed at intervals on the support base 54 , and the plurality of first emitters 31 are disposed at intervals along the radial direction at corresponding positions of the wafer.

[0089] like Figure 5As shown, the wafer conveying device provided by the present application, wherein the mounting component 5 also includes a calibration element 55, the calibration element 55 is installed on the side of the sealing seat 51 away from the shell cover 12, and the calibration element 55 and the first transmitter 31, or the calibration element 55 and the second transmitter 41 are located on the same side of the support seat 54; the calibration element 55 is used to calibrate the propagation direction of the first optical signal 33 and the second optical signal 43, so that in a preset state the first optical signal 33 can be successfully received by the first receiver 32, and the second optical signal 43 can be successfully received by the second receiver 42.

[0090] Specifically, a calibration hole 551 is provided on the calibration element 55. Along the axial direction of the wafer, the projection of the calibration hole 551 falls into the projection of the light-transmitting hole 511. The aperture of the calibration hole 551 is slightly larger than the beam diameter of the corresponding first light signal 33 or the second light signal 43. If the first light signal 33 or the second light signal 43 can pass through the corresponding calibration hole 551 smoothly, it can be received by the corresponding first receiver 32 or the second receiver 42. If the first light signal 33 and the second light signal 43 cannot pass through the corresponding calibration hole 551 smoothly, they cannot be received by the corresponding first receiver 32 or the second receiver 42. At this time, it is necessary to adjust the position of the first transmitter 31 or the second transmitter 41 on the corresponding support seat 54 to change the propagation direction of the first light signal 33 or the second light signal 43 until the first light signal 33 and the second light signal 43 can pass through the corresponding calibration hole 551.

[0091] Alternatively, if Figure 3 As shown, the wafer conveying device provided by the present application, wherein a connecting hole 541 is provided on the supporting seat 54, the through direction of the connecting hole 541 is perpendicular to the axial direction of the wafer, and the first launcher 31 and the second launcher 41 are respectively installed in the corresponding connecting hole 541 through connecting parts; so as to realize the installation of the first launcher 31 and the second launcher 41 on the supporting seat 54.

[0092] Alternatively, if Figure 3 As shown, the connecting hole 541 is a strip hole extending along the axial direction of the wafer. By adjusting the position of the connecting member in the connecting hole 541, the position of the first emitter 31 or the second emitter 41 along the axial direction of the wafer can be adjusted to provide a positive effect in the process of adjusting the propagation paths of the first optical signal 33 and the second optical signal 43.

[0093] like Figure 3 and Figure 4 As shown, the wafer conveying device provided by the present application, wherein at least one adjusting top screw 542 is provided on the supporting seat 54, the adjusting top screw 542 is screwed to the supporting seat 54, and the adjusting top screw 542 can reciprocate along the through direction of the connecting hole 541.

[0094] One end of the adjusting screw 542 is in contact with the first emitter 31 or the second emitter 41. By adjusting the screwing position of the screw 542 on the support base 54, the distance or angle between the first emitter 31 and the support base 54, as well as the distance or angle between the second emitter 41 and the support base 54 can be adjusted, thereby adjusting the propagation direction of the first optical signal 33 or the second optical signal 43.

[0095] Optionally, three adjustment top screws 542 are provided on the support seat 54 corresponding to each first launcher 31 or second launcher 41. The three adjustment top screws 542 are arranged in a triangular pattern, that is, the connecting lines between the three adjustment top screws 542 form a triangle. During the adjustment process, it is necessary to ensure that the three adjustment top screws 542 are all in contact with the corresponding first launcher 31 or second launcher 41, so as to achieve precise adjustment and provide reliable and stable support for the first launcher 31 or the second launcher 41.

[0096] The wafer conveying device of the present application is provided with a rotating seat 2 in the conveying chamber 13 of the shell 1, which can be used to carry the wafer and drive the wafer to rotate. The real-time state of the wafer can be detected during the rotation of the wafer. Specifically, the preset state of the wafer is set to be coaxial with the rotating seat 2 during design. By providing an offset detection component 3, the coaxiality between the wafer and the rotating seat 2 can be effectively detected. If it is detected that the wafer and the rotating seat 2 are not coaxial, it is determined that the real-time state of the wafer is offset relative to the preset state, and the position of the wafer needs to be adjusted when entering the subsequent process; by providing a rotation detection component 4, it is possible to detect whether the real-time state of the wafer is rotated relative to the preset state. If the wafer rotates, the rotating seat 2 can be cooperated to detect the rotation angle of the wafer and rotate the wafer back to the preset state, so as to ensure that the wafer can enter the subsequent processing process in the required preset state, thereby ensuring the quality of the finished wafer.

[0097] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0098] The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of this application.

Claims

1. A wafer conveying device, characterized in that: The wafer conveying device comprises: A housing (1) having a transfer chamber (13), wherein the transfer chamber (13) is used to accommodate wafers; A rotating seat (2) is rotatably mounted in the transfer chamber (13), and the rotating seat (2) is used to carry the wafer and drive the wafer to rotate; A plurality of groups of offset detection components (3) are arranged at intervals along the circumference of the rotating seat (2), and the distance between each group of the offset detection components (3) and the rotating seat (2) is equal. Each group of the offset detection components (3) is used to cooperate in detecting the coaxiality between the wafer and the rotating seat (2); A rotation detection component (4) is arranged at a distance from the rotating seat (2) and is located between any two groups of adjacently arranged offset detection components (3), and the rotation detection component (4) is used to detect the circumferential relative position of the wafer relative to the rotation detection component (4).

2. The wafer conveying device according to claim 1, characterized in that: The housing (1) comprises: A bottom shell (11) is formed with an opening on one side along the axial direction of the wafer; The shell cover (12) is detachably and sealably mounted on the opening. The bottom shell (11) and the shell cover (12) enclose the transmission chamber (13). The rotating seat (2) is mounted on the bottom plate of the bottom shell (11).

3. The wafer conveying device according to claim 2, characterized in that: The deviation detection component (3) comprises: A first transmitter (31) is mounted on the housing cover (12), and the first transmitter (31) is used to emit a first optical signal (33); A first receiver (32) mounted on a bottom plate of the bottom shell (11), the first receiver (32) and the first transmitter (31) being arranged opposite to each other along the axial direction of the wafer, and the first receiver (32) being used to receive the first optical signal (33); so that when the first receivers (32) of each group of the deviation detection components (3) can receive the first optical signal (33) emitted by the corresponding first transmitter (31), it is confirmed that the wafer is coaxial with the rotating seat (2); When the first receivers (32) of any group of the offset detection components (3) do not receive the first optical signal (33) emitted by the corresponding first transmitter (31), it is confirmed that the wafer is not coaxial with the rotating seat (2).

4. The wafer conveying device according to claim 3, characterized in that: The rotation detection component (4) comprises: A second transmitter (41) is mounted on the housing cover (12), and the second transmitter (41) is used to emit a second optical signal (43); a second receiver (42) mounted on a bottom plate of the bottom shell (11), the second receiver (42) and the second transmitter (41) being arranged opposite to each other along the axial direction of the wafer, the second receiver (42) being used to receive the second optical signal (43); A detection area is provided at the periphery of the wafer, and the detection area is capable of allowing the second optical signal (43) to pass through; so that when the second receiver (42) can receive the second optical signal (43), it is confirmed that the wafer has not rotated; When the second receiver (42) does not receive the second optical signal (43), it is confirmed that the wafer has rotated.

5. The wafer conveying device according to any one of claims 1 to 4, characterized in that: The offset detection components (3) are provided with at least three groups, and the three groups of the offset detection components (3) are evenly spaced along the circumference of the wafer; the rotation detection component (4) is provided between any two groups of the offset detection components (3).

6. The wafer conveying device according to claim 4, characterized in that: The shell cover (12) and the bottom plate of the bottom shell (11) are provided with mounting holes (121), and the mounting holes (121) penetrate along the axial direction of the wafer; The first transmitter (31), the second transmitter (41) and the second receiver (42) are all arranged outside the shell (1), and the first transmitter (31) and the second transmitter (41) are respectively installed at the installation hole (121) of a shell cover (12) through a group of installation components (5), and the second receiver (42) is installed at the installation hole of the bottom plate of the bottom shell (11) through a group of installation components (5). The first optical signal (33) can be transmitted to the transmission cavity (13) through the corresponding installation hole (121) on the shell cover (12), and the second optical signal (43) can pass through the installation hole (121) on the shell cover (12) and the corresponding installation hole on the bottom plate of the bottom shell (11).

7. The wafer conveying device according to claim 6, characterized in that: The mounting member (5) comprises: A sealing seat (51) connected to the shell cover (12), the sealing seat (51) being provided with a light-transmitting hole (511) penetrating along the axial direction of the wafer, the light-transmitting hole (511) corresponding to the mounting hole (121) along the axial direction of the wafer; A transparent plate (52) is sealed and clamped between the sealing seat (51) and the shell cover (12); A support seat (54) is connected to a side of the sealing seat (51) facing away from the shell cover (12), and the support seat (54) is used to support the first transmitter (31) or the second transmitter (41).

8. The wafer conveying device according to claim 7, characterized in that: The mounting component (5) further comprises a calibration element (55), wherein the calibration element (55) is mounted on a side of the sealing seat (51) facing away from the housing cover (12), and the calibration element (55) and the first transmitter (31), or the calibration element (55) and the second transmitter (41) are located on the same side of the support seat (54); The calibration element (55) is provided with a calibration hole (551), and along the axial direction of the wafer, the projection of the calibration hole (551) falls into the projection of the light-transmitting hole (511), and the calibration hole (551) is used to calibrate the propagation direction of the first optical signal (33) or the second optical signal (43).

9. The wafer conveying device according to claim 7 or 8, characterized in that: The support seat (54) is provided with a connecting hole (541), the penetration direction of the connecting hole (541) is perpendicular to the axial direction of the wafer, and the first emitter (31) and the second emitter (41) are respectively installed in the corresponding connecting hole (541) through a connecting piece; The connection hole (541) is a strip-shaped hole extending along the axial direction of the wafer.

10. The wafer conveying device according to claim 9, characterized in that: At least one adjusting top screw (542) is provided on the support seat (54), the adjusting top screw (542) is screwed to the support seat (54), and the adjusting top screw (542) can reciprocate along the through direction of the connecting hole (541); One end of the adjusting top screw (542) is in contact with the first emitter (31) or the second emitter (41), and the angle between the first emitter (31) and the support seat (54) or the angle between the second emitter (41) and the support seat (54) can be adjusted by the adjusting top screw (542), thereby adjusting the propagation direction of the first optical signal (33) or the second optical signal (43).

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