Heat dissipation device, heating disc and thin film deposition equipment

Abstract

The invention discloses a heat dissipation device, a heating disc and thin film deposition equipment, the heat dissipation device is used for dissipating heat of the heating disc, the heat dissipation device comprises a heat conduction piece, at least one heat conduction pipe and a cooling assembly, the heat conduction piece is installed on a disc handle of the heating disc, one end of the heat conduction pipe is connected with the heat conduction piece, and the other end of the heat conduction pipe is connected with the cooling assembly. The other end of the heat conduction pipe is connected with the cooling assembly, and the cooling assembly is used for cooling the heat conduction pipe; the heat conduction pipe extends in the radial direction of a disc handle of the heating disc so that the cooling assembly can be away from the heating disc. According to the invention, heat is transferred to an area far away from the heating disc through the heat conduction pipe for heat dissipation, so that heat dissipation in a narrow space near a radio frequency heating rod in the disc handle of the heating disc is avoided, the heat dissipation position is transferred to a nearby open area, the heat dissipation effect is improved, and the reliability of the heating disc is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a heat dissipation device, a heating plate and a thin film deposition device. Background Art

[0002] In modern industrial manufacturing and material processing, radio frequency heating technology is widely used in many fields such as plastic welding, rubber vulcanization, wood drying and semiconductor manufacturing. As one of the core components of the radio frequency heating system, the radio frequency heating rod plays a vital role on the machine. It not only participates in the transmission and conversion of energy as part of the radio frequency circuit, but also directly bears the heat conduction effect from the heating plate (heater). At the same time, the Joule heat generated by the passage of radio frequency current further increases the temperature. In actual operation, the working environment of the radio frequency heating rod is extremely harsh, especially in the absence of effective heat dissipation measures, its surface temperature can quickly rise to more than 200°C. High temperature has many effects on radio frequency heating rods. First, excessively high temperature will cause the welding point between the heating rod and the heating plate to loosen due to the difference in thermal expansion coefficient, affecting the structural stability; secondly, high temperature may accelerate the aging of the insulating material around the heating rod, resulting in a decrease in insulation performance and even a short circuit failure; in addition, continuous high temperature will shorten the service life of the heating rod, increase maintenance costs and downtime, and seriously affect production efficiency. Therefore, ensuring the effective cooling of the radio frequency heating rod has become a key link to ensure the normal operation of the equipment. At present, common cooling methods include natural cooling, forced air cooling (such as using nitrogen blowing) and liquid cooling. However, in actual applications, it is found that for RF heating rods installed in narrow spaces, simple blowing cooling is not ideal. On the one hand, due to space limitations, it is difficult to arrange a large enough fan or duct to achieve effective air flow; on the other hand, the heat exchange efficiency of gases such as nitrogen is relatively low, especially under high heat load conditions, and it is impossible to take away enough heat in time to maintain the appropriate working temperature of the heating rod. Summary of the invention

[0003] The embodiments of the present invention provide a heat dissipation device, a heating plate and a thin film deposition device, which are intended to solve the problem of poor heat dissipation effect of the existing radio frequency heating rod.

[0004] In a first aspect, the present invention provides a heat dissipation device for dissipating heat from a heating plate, the heat dissipation device comprising: a heat conducting member, at least one heat conducting pipe and a cooling assembly, the heat conducting member being mounted on a plate handle of the heating plate, one end of the heat conducting pipe being connected to the heat conducting member, the other end of the heat conducting pipe being connected to the cooling assembly, the cooling assembly being used to cool the heat conducting pipe;

[0005] Wherein, the heat conduction pipe extends radially along the disk handle of the heating disk to keep the cooling assembly away from the heating disk.

[0006] Furthermore, the heat conducting member is a heat conducting ring, and the heat conducting ring is sleeved on the disk handle of the heating disk.

[0007] Furthermore, at least one group of mounting holes is provided on the side wall of the heat conducting component, each group of mounting holes includes a first through hole, a second through hole and a connecting hole, the connecting hole connects the first through hole and the second through hole, and one end of the heat conducting pipe passes through the first through hole, the connecting hole and the second through hole in sequence.

[0008] Further, the first via hole and the second via hole are arranged at intervals on the side wall of the heat conducting member, and the connecting hole is arranged on a side of the side wall of the heat conducting member facing away from the first via hole and the second via hole.

[0009] Furthermore, the heat conduction pipe includes a first pipe segment, a second pipe segment and a connecting pipe segment, both ends of the connecting pipe segment are respectively connected to one end of the first pipe segment and the second pipe segment, the other ends of the first pipe segment and the second pipe segment are connected to the cooling assembly, and the connecting pipe segment surrounds at least a portion of the side wall of the heat conduction component.

[0010] Furthermore, the connecting pipe section is penetrated through the side wall of the heat conducting member.

[0011] Furthermore, the first pipe segment and the second pipe segment are arranged in parallel and spaced apart, and the other ends of the first pipe segment and the second pipe segment extend in the same direction.

[0012] Furthermore, the cooling assembly includes at least one group of air-cooled heat dissipation assemblies, each group of the air-cooled heat dissipation assemblies includes a fan and fins, the fins are arranged on the air inlet side of the fan, and the other end of the heat pipe is inserted into the fins.

[0013] Furthermore, the cooling assembly includes two groups of air-cooled heat dissipation assemblies, and the other end of the heat conduction pipe includes a first pipe segment and a second pipe segment, and the first pipe segment and the second pipe segment are respectively inserted into the fins corresponding to the two groups of air-cooled heat dissipation assemblies.

[0014] Furthermore, the heat conducting member and / or the heat conducting pipe are made of aluminum nitride ceramic material.

[0015] Furthermore, the heat pipe is a closed heat pipe, and a phase-changing cooling medium is provided inside the heat pipe.

[0016] In a second aspect, the present invention further provides a heating plate, comprising: a plate handle, a radio frequency heating rod and a heat dissipation device, wherein the heat dissipation device is the above-mentioned heat dissipation device, the radio frequency heating rod is arranged in the plate handle, and the heat conductive part of the heat dissipation device is installed on the plate handle.

[0017] In a third aspect, the present invention further provides a thin film deposition device, comprising the above-mentioned heating plate.

[0018] The present invention provides a heat dissipation device, a heating plate and a thin film deposition device. The heat dissipation device comprises: a heat conductive member, a heat conductive pipe and a cooling assembly. The heat conductive member is mounted on a plate handle of the heating plate. One end of the heat conductive pipe is connected to the heat conductive member, and the other end of the heat conductive pipe extends in a radial direction of the plate handle of the heating plate in a direction away from the plate handle, thereby away from the heating plate. The cooling assembly is connected to the other end of the heat conductive pipe away from the heating plate, and the cooling assembly dissipates heat from the heat conductive pipe. Thus, heat is transferred to an area away from the heating plate through the heat conductive pipe for further dissipation, thereby avoiding heat dissipation in a narrow space near a radio frequency heating rod inside the plate handle of the heating plate, and transferring the heat dissipation position to a nearby open area, thereby improving the heat dissipation effect and the reliability of the heating plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0020] Figure 1 A schematic diagram of a heat dissipation device according to an embodiment of the present invention is shown;

[0021] Figure 2 An exploded schematic diagram of a heat dissipation device according to an embodiment of the present invention is shown;

[0022] Figure 3 A schematic diagram showing a heat conducting member of a heat dissipation device according to an embodiment of the present invention;

[0023] Figure 4 Another schematic diagram showing a heat conducting member of a heat dissipation device according to an embodiment of the present invention;

[0024] Figure 5 A schematic diagram showing a heat pipe of a heat dissipation device according to an embodiment of the present invention;

[0025] Figure 6 A schematic diagram showing a cooling assembly of a heat dissipation device according to an embodiment of the present invention is shown;

[0026] Reference numerals:

[0027] 1. Heat conducting member; 11. First through hole; 12. Second through hole; 13. Connecting hole; 2. Heat conducting pipe; 21. First pipe section; 22. Second pipe section; 23. Connecting pipe section; 3. Cooling assembly; 31. Fan; 32. Fin; 4. Heating plate; 41. Plate handle; 42. Radio frequency heating rod. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] The directional terms mentioned in the present invention, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", etc., are only referenced to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, but are not used to limit the present invention. In addition, in the drawings, structures with similar or identical structures are represented by the same reference numerals.

[0030] In RF heating equipment, the RF heating rod (Rod) is a key component of the RF circuit. The Rod is used to conduct RF current and form a circuit. When conducting RF current, it will generate quite high heat. It not only undertakes the task of conducting RF current, but also is directly affected by the heat conduction from the heating plate (heater). Due to the existence of this dual heating mechanism, the temperature of the Rod can often rise rapidly to more than 200°C. Such a high temperature will not only cause the welding point between the heater and the rod to loosen, but also cause the insulation material to fail, thus seriously affecting the normal operation and service life of the machine. Therefore, effective cooling of the Rod has become a key link to ensure the stable operation of the RF heating equipment. At present, one of the common cooling methods is to use blowing (such as nitrogen) to reduce the temperature of the Rod. However, this method is not ideal in actual use. On the one hand, due to the narrow space near the Rod, it is difficult for the airflow to form an effective heat dissipation path; on the other hand, the efficiency of blowing cooling is relatively low, and it is difficult to control the temperature of the Rod within a safe range.

[0031] The embodiments of the present invention propose a heat dissipation device, a heating plate and a thin film deposition device, which solve the problem of poor heat dissipation effect of the existing radio frequency heating rod. The heat dissipation position is transferred from a narrow space to an open area through a heat pipe, thereby improving the heat dissipation effect and the reliability of the heating plate.

[0032] The embodiments of the present invention are to solve the above-mentioned problem of poor heat dissipation effect, and the specific ideas are as follows:

[0033] A high thermal conductivity heat conducting member is added near the Rod, and the heat conducting member is installed on the disk handle. Then, one end of a heat conducting pipe is connected to the heat conducting member, and the other end extends in a direction away from the heating disk. The other end is connected to a cooling component at a position away from the heating disk. The cooling component cools the heat conducting pipe and dissipates the heat. The heat generated by the Rod is conducted to a nearby open area through the heat conducting member and the heat conducting pipe. There is no need to dissipate the heat in a narrow space near the Rod, and the heat can be conducted to a nearby open area. A cooling component is set in the open area to dissipate the heat from the heat conducting pipe, thereby improving the heat dissipation efficiency, thereby ensuring that the temperature of the Rod is within a safe range and improving the reliability of the heating disk.

[0034] See also Figure 1-Figure 6 An embodiment of the present invention shows a heat dissipation device for dissipating heat from a heating plate 4, the heat dissipation device comprising: a heat conductive member 1, at least one heat conductive pipe 2 and a cooling assembly 3, the heat conductive member 1 being mounted on a plate handle 41 of the heating plate 4, one end of the heat conductive pipe 2 being connected to the heat conductive member 1, and the other end of the heat conductive pipe 2 being connected to the cooling assembly 3, the cooling assembly 3 being used for cooling the heat conductive pipe 2; wherein the heat conductive pipe 2 extends radially along the plate handle 41 of the heating plate 4 to keep the cooling assembly 3 away from the heating plate 4.

[0035] Specifically, since the radio frequency heating rod 42Rod is installed inside the disk handle 41 of the heating disk 4, the Rod generates a large amount of heat around the disk handle 41, so a heat conductor 1 is arranged near the disk handle 41, and the heat conductor 1 is fixedly installed at the bottom end of the disk handle 41 of the heating disk 4 to conduct the heat generated by the Rod. The heat pipe 2 is a pipe structure with a certain length, one end of which is connected to the heat conductor 1 to receive the heat transferred from the heat conductor 1, and the other end is connected to the cooling component 3 to transfer the heat to the cooling component 3 for cooling and heat dissipation. Among them, the heat pipe 2 extends in the radial direction of the disk handle 41, one end of the heat pipe 2 is connected to the heat conductor 1 on the disk handle 41, and the other end extends in the direction away from the disk handle 41. The length and structure of the heat pipe 2 can be adjusted according to the actual space and heat dissipation requirements of the machine. The cooling component 3 is connected to the other end of the heat pipe 2, and the cooling component 3 is used to cool and dissipate the heat of the heat pipe 2. The cooling assembly 3 can be various cooling structures, such as an air cooling structure, a liquid cooling structure, etc. No matter what kind of cooling structure it is, as long as it can cool the heat of the heat pipe 2, it is not limited here.

[0036] Through this embodiment, the heat in the narrow space near the Rod is transferred to the nearby open area through the heat conductor 1 and the heat pipe 2, and the cooling component 3 is used in the open area to perform cooling and heat dissipation. Therefore, there is no need to set up a heat dissipation structure in the narrow space near the Rod. Instead, the heat dissipation position is transferred to the nearby open area for cooling and heat dissipation, which greatly improves the heat dissipation effect and improves the reliability of the heating plate 4.

[0037] In one embodiment, the heat conducting member 1 and / or the heat conducting tube 2 are made of aluminum nitride ceramic material. Specifically, aluminum nitride (AlN) ceramic is an important inorganic non-metallic material with excellent thermal conductivity, good electrical insulation and chemical stability. It is composed of two elements, aluminum (Al) and nitrogen (N), and has the chemical formula AlN. The thermal conductivity of aluminum nitride ceramic is between 170-230W / m·K, and the thermal conductivity of a single crystal can even be as high as 275W / m·K or more. The thermal conductivity of the heat conducting member 1 of this embodiment can be 310, which makes aluminum nitride one of the materials with the best thermal conductivity, much higher than traditional materials such as copper and silver. Moreover, aluminum nitride has excellent chemical stability at high temperatures and can withstand acid and alkali corrosion; it has high hardness and good mechanical strength and toughness; the resistivity of aluminum nitride is very high, and it is a good electrical insulating material; aluminum nitride has a low thermal expansion coefficient (about 4.5×10 -6 / ℃), and silicon (3.5~4×10 -6 / ℃) and gallium arsenide (6×10 -6 / ℃); aluminum nitride is resistant to high temperatures and can be used in an environment of 2200℃, and is resistant to corrosion by molten metal and stable to acid. Therefore, this embodiment uses an aluminum nitride ceramic heat conducting member 1 and an aluminum nitride ceramic heat conducting pipe 2 to transfer heat, greatly improving the heat conduction efficiency and the heat dissipation effect.

[0038] In one embodiment, the heat pipe 2 is a closed heat pipe, and a phase-change cooling medium is provided inside the heat pipe. Specifically, the heat pipe 2 adopts a heat pipe, which is an efficient heat transfer element, and its thermal conductivity can reach 4000. One end of the heat pipe 2 connected to the heat conductor 1 is the hot end of the heat pipe, and the other end of the heat pipe 2 connected to the cooling component 3 is the cold end of the heat pipe. A certain air pressure is maintained inside the heat pipe, and it is filled with a phase-change cooling medium, which can be water. The hot end of the heat pipe is the evaporation section, and the cold end of the heat pipe is the condensation section. Water absorbs heat and changes into gas in the evaporation section. The gas moves along the heat pipe to the condensation section. The gas dissipates heat through the cooling component 3 in the condensation section and changes into liquid again. The condensed liquid returns to the evaporation section through capillary action. Specifically, first, when the heat generated by the heat conductor 1 is transferred to the evaporation section, the water absorbs heat and quickly evaporates into steam. Since the latent heat of water is large, even if the temperature changes very little, it can absorb a large amount of heat, thereby effectively taking away the heat from the heat source. Then, the evaporated steam moves along the cavity inside the heat pipe to the condensation section. In this process, the steam carries a large amount of heat, but its temperature is relatively low, because the phase change process of water is isothermal, that is, during the evaporation and condensation process, the temperature remains basically unchanged. Then, when the steam reaches the condensation section, it encounters the low temperature environment provided by the cooling component 3, and the steam releases heat and recondenses into liquid. In this process, the heat is transferred to the cooling component 3, achieving effective heat dissipation. Finally, in order to ensure that the phase change cooling medium can circulate continuously, a capillary structure (such as a porous material or a micro-channel) is usually provided inside the heat pipe. These structures draw the condensed liquid from the condensation section back to the evaporation section through capillary action to form a closed circulation system. This design not only ensures the continuous supply of cooling medium, but also improves the heat transfer efficiency of the heat pipe. This embodiment significantly improves the heat transfer efficiency through the heat pipe.

[0039] Reference Figure 1 In one embodiment, the heat conducting member 1 is a heat conducting ring, which is sleeved on the disk handle 41 of the heating disk 4. Specifically, the heat conducting member 1 is a heat conducting ring with an annular structure, which is sleeved on the disk handle 41, so that the contact area between the heat conducting member 1 and the disk handle 41 is larger, and heat can be conducted more effectively, thereby improving the heat transfer efficiency. Moreover, the design of the heat conducting ring makes installation easier, reduces the need for complex fixed structures, and reduces installation costs and time. The annular structure of the heat conducting ring can also better adapt to the shape of the disk handle 41, provide better mechanical stability, and reduce the risk of loosening due to vibration or external force.

[0040] Reference Figure 3In this embodiment, at least one group of mounting holes is provided on the side wall of the heat conducting member 1, and each group of mounting holes includes a first through hole 11, a second through hole 12, and a connecting hole 13. The connecting hole 13 connects the first through hole 11 and the second through hole 12, and one end of the heat conducting tube 2 passes through the first through hole 11, the connecting hole 13, and the second through hole 12 in sequence. Specifically, multiple groups of mounting holes are provided on the side wall of the heat conducting ring (heat conducting member 1), and each group of mounting holes is corresponding to the installation of a heat conducting tube 2. When there are multiple groups of mounting holes, the multiple groups of mounting holes can be provided along the height direction of the disk handle 41, and the multiple heat conducting tubes 2 are also stacked along the height direction of the disk handle 41, and each heat conducting tube 2 is corresponding to the installation of a group of mounting holes. Each group of mounting holes includes three holes, namely, a first through hole 11, a second through hole 12 and a connecting hole 13. The heat pipe 2 passes through the three holes on the heat conductive member 1, so that three contact points are formed between the heat pipe 2 and the heat conductive member 1, increasing the contact area of ​​heat dissipation, thereby significantly improving the heat transfer efficiency, and each contact point is located at a different position of the heat pipe, ensuring that heat can be evenly transferred. Through this embodiment, by increasing the number of contact points, the contact area between the heat pipe 2 and the heat conductive member 1 is significantly increased, so that more heat can be transferred to the heat pipe 2 in a short time, which not only improves the heat transfer efficiency, but also shortens the thermal response time and enhances the heat dissipation capacity.

[0041] Reference Figure 3 and Figure 4 In this embodiment, the first via hole 11 and the second via hole 12 are arranged at intervals on the side wall of the heat conductive member 1, and the connecting hole 13 is arranged on the side of the side wall of the heat conductive member 1 facing away from the first via hole 11 and the second via hole 12. Specifically, the first via hole 11, the second via hole 12 and the connecting hole 13 are respectively arranged at different positions on the side wall of the heat conductive member 1, wherein the first via hole 11 and the second via hole 12 are arranged adjacently and at intervals, and the connecting hole 13 is arranged on the back side, and the connecting hole 13 and the first via hole 11 and the second via hole 12 are arranged radially opposite to each other along the radial direction of the disk handle 41. The connecting hole 13 has a certain length, and the length of the connecting hole 13 corresponds to the distance between the two vias. In this way, when the heat pipe 2 passes through the first through hole 11, the connecting hole 13 and the second through hole 12, a turning structure is formed at one end of the heat pipe 2. A section of the heat pipe 2 in the connecting hole 13 is a turning section, so that the heat pipe 2 can be installed with the heat conductive component 1 around the circumference of the disk handle 41, thereby increasing the contact area between the heat pipe 2 and the heat conductive component 1. On the one hand, the contact heat conduction area is increased, thereby improving the heat transfer efficiency. On the other hand, the contact area used for installation is increased, thereby improving the stability and reliability of the connection.

[0042] Reference Figure 5In one embodiment, the heat conducting pipe 2 comprises a first pipe section 21, a second pipe section 22 and a connecting pipe section 23, the two ends of the connecting pipe section 23 are respectively connected to one end of the first pipe section 21 and the second pipe section 22, the other ends of the first pipe section 21 and the second pipe section 22 are connected to the cooling assembly 3, and the connecting pipe section 23 surrounds at least part of the side wall of the heat conducting member 1. Specifically, the heat conducting pipe 2 of this embodiment is a U-shaped pipe structure, having three pipe sections, namely the first pipe section 21, the second pipe section 22 and the connecting pipe section 23, the first pipe section 21 and the second pipe section 22 are straight pipes, the connecting pipe section 23 is an arc-shaped pipe, one end of the two straight pipes are respectively connected to the two ends of the arc-shaped pipe to form a U-shaped pipe structure. In a specific implementation, the first pipe section 21 is inserted into the first through hole 11, the second pipe section 22 is inserted into the second through hole 12, and the third pipe section is inserted into the connecting hole 13. The connecting hole 13 matches the shape of the connecting section, both of which are arc-shaped. Of course, it is understandable that in other embodiments, the shape of the connection hole 13 and the connection section can also be annular, and those skilled in the art can set it according to specific needs. In this way, the connection pipe section 23 is closely attached to the side wall of the heat conducting member 1 to form an arc channel, which increases the contact area and improves the heat transfer efficiency.

[0043] In this embodiment, the connecting pipe section 23 is inserted into the side wall of the heat-conducting member 1. Specifically, if the heat-conducting pipe 2 is only in contact with the surface of the heat-conducting member 1, the heat transfer path is long and the thermal resistance is large. Then, by partially embedding the connecting pipe section 23 into the interior of the heat-conducting member 1, the heat transfer path can be shortened, heat loss can be reduced, and heat dissipation efficiency can be improved. A portion of the connecting pipe section 23 of this embodiment is designed to be directly embedded in the side wall of the heat-conducting member 1, forming an embedded connection method, which increases the contact area between the heat-conducting member 1 and the heat-conducting pipe 2, making the heat transfer between the two more direct and efficient. In order to achieve this, the side wall of the heat-conducting member 1 needs to be pre-processed with corresponding holes or grooves, such as the connecting hole 13 in the above embodiment, and the connecting pipe section 23 can be inserted into the connecting hole 13 so that the connecting pipe section 23 can be smoothly embedded. Through this embodiment, the connecting pipe section 23 is embedded in the heat conductive part 1, which greatly shortens the heat transfer path and reduces thermal resistance, so that heat can be transferred from the heating plate 4 to the cooling component 3 more quickly, thereby improving the heat dissipation efficiency and enhancing stability, reducing the risk of failure caused by high temperature, and making heat transfer more direct. The requirements for the performance of the cooling component 3 can be reduced to a certain extent, thereby reducing costs.

[0044] In this embodiment, the first pipe segment 21 and the second pipe segment 22 are arranged in parallel and spaced apart, and the other ends of the first pipe segment 21 and the second pipe segment 22 extend in the same direction. Specifically, the first pipe segment 21 and the second pipe segment 22 are arranged in parallel and spaced apart, and the other ends of them extend in the same direction. This layout enables the heat pipe 2 to maximize the use of its length in a limited space while maintaining good heat transfer performance. The parallel spacing arrangement helps to disperse heat and avoid local overheating, while the uniform direction extension facilitates the arrangement and maintenance of the cooling assembly 3. Specifically, the layout of the two pipe segments in parallel and spaced apart, the heat pipe 2 has two heat dissipation paths, so that the heat can be evenly distributed, avoids local overheating, and prolongs the service life of the equipment. At the same time, the uniform direction extension of the two pipe segments facilitates the arrangement and maintenance of the cooling assembly 3, and the cooling assembly 3 can be centrally arranged in a certain area to cool the heat pipe 2, simplifying the installation and commissioning process. Through the structural design of this embodiment, it is possible to provide better heat dissipation performance, maximize the use of available space, and improve heat dissipation efficiency in the case of limited machine space.

[0045] Reference Figure 6In one embodiment, the cooling assembly 3 includes at least one group of air-cooled heat dissipation assemblies, each group of the air-cooled heat dissipation assemblies includes a fan 31 and a fin 32, the fin 32 is arranged on the air inlet side of the fan 31, and the other end of the heat pipe 2 is inserted into the fin 32. Traditional cooling methods such as natural cooling or simple forced air cooling have limited effects on the radio frequency heating rod 42 or the heating plate 4 under high heat load conditions, and it is difficult to meet the needs of efficient heat dissipation. In addition, due to the limited space around the heating plate 4, the traditional large cooling device cannot be installed, so it is necessary to provide a compact and efficient cooling assembly 3. The cooling assembly 3 of this embodiment adopts an air-cooled heat dissipation structure, including at least one group of air-cooled heat dissipation assemblies, each group of air-cooled heat dissipation assemblies includes a fan 31 and a fin 32, the fan 31 has an air inlet side and an air outlet side opposite to each other, and the fin 32 is arranged on the air inlet side. The fin 32 includes a heat dissipation substrate and a plurality of fins, and the plurality of fins are arranged on the heat dissipation substrate at intervals, the fins are close to the air inlet side, and the heat dissipation substrate is far away from the air inlet side. The other end of the heat pipe 2 (the first pipe section 21 and the second pipe section 22) is directly inserted into the fin 32, that is, the heat pipe 2 passes through a number of fins, and the heat pipe 2 is exposed in the air duct formed between the fins, which increases the heat dissipation area of ​​the heat pipe 2. Under the action of the fan 31, the airflow fin 32 enters, taking away the heat from the other end of the heat pipe 2, and the airflow enters the air inlet side of the fan 31, and finally is discharged from the air outlet side of the fan 31, achieving efficient heat transfer. Through this embodiment, firstly, the forced convection provided by the fan 31 enhances the flow of air, which greatly improves the heat exchange efficiency compared with natural convection; secondly, the fin 32 structure increases the surface area in contact with the air, further promoting the dissipation of heat; finally, the good contact between the heat pipe 2 and the fin 32 ensures that the heat can be quickly transferred from the heating plate 4 to the cooling assembly 3, improves the heat dissipation efficiency, ensures the working stability of the heating plate 4, extends the service life of the equipment, and reduces the maintenance cost.

[0046] In this embodiment, the cooling assembly 3 includes two groups of air-cooled heat dissipation assemblies, and the other end of the heat pipe 2 includes a first pipe section 21 and a second pipe section 22, and the first pipe section 21 and the second pipe section 22 are respectively inserted into the fins 32 corresponding to the two groups of air-cooled heat dissipation assemblies. Specifically, a single group of air-cooled heat dissipation assemblies may not be sufficient to cope with high heat loads in extreme cases, especially when the Rod generates a large amount of heat. In addition, if there is only one heat conduction path, heat may be concentrated at a certain point, causing local overheating and difficulty in timely heat dissipation. Therefore, a more decentralized heat dissipation strategy is required to ensure that the entire heat dissipation device can maintain good temperature control under any circumstances. Specifically, the cooling assembly 3 is composed of two groups of air-cooled heat dissipation assemblies, each of which is equipped with an independent fan 31 and fins 32. The other end of the heat pipe 2 is designed as a U-shaped tube structure or a bifurcated structure, forming a first pipe section 21 and a second pipe section 22, which are respectively connected to the fins 32 of the two groups of heat dissipation assemblies. When the heat generated by the Rod is conducted to the heat pipe 2 through the heat conductor 1, it will be separated and transferred in two directions, and finally carried away by the airflow driven by the two fans 31. Such a dual-channel design not only increases the total heat dissipation area, but also makes the heat distribution more uniform, avoiding the problem of single-point overheating. It should be noted that the air outlet sides of the two fans 31 are arranged back to back, so that the hot air is blown out in opposite directions, avoiding interference with the airflow and affecting the heat dissipation. Through this embodiment, the solution of dual-group air-cooled heat dissipation components is adopted, which can further improve the heat dissipation performance on the original basis; on the one hand, the two fans 31 work at the same time, providing a larger air volume and stronger cooling capacity; on the other hand, the heat is evacuated through two independent paths, reducing the formation of local hot spots and improving the stability and reliability of heat dissipation.

[0047] Reference Figure 1 and Figure 2 The embodiment of the present invention further provides a heating plate 4, comprising: a plate handle 41, a radio frequency heating rod 42 and a heat sink, wherein the heat sink is the heat sink of the above embodiment, the radio frequency heating rod 42 is arranged in the plate handle 41, and the heat conducting member 1 of the heat sink is installed on the plate handle 41. The heat sink has been described in detail in the above embodiment, and for the sake of brevity of the specification, it will not be repeated here.

[0048] Through this embodiment, by integrating the RF heating rod 42 in the disk handle 41 of the heating disk 4, and adopting a high-efficiency heat dissipation device including a heat conductor 1, a two-stage heat pipe 2 and a double set of air-cooled heat dissipation components, rapid heat conduction and uniform dispersion are achieved, which significantly reduces the operating temperature of the RF heating rod 42, improves the stability and service life of the heating disk 4, and ensures a compact spatial layout.

[0049] The embodiment of the present invention further provides a thin film deposition device, comprising the heating plate 4 of the above embodiment. The heating plate 4 has been described in detail in the above embodiment, and for the sake of brevity of the description, it will not be repeated here.

[0050] The thin film deposition equipment of this embodiment adopts a heating plate 4 including a high-efficiency heat dissipation device. By optimizing the thermal management of the Rod and the compact design of the heat dissipation structure, the temperature stability of the RF heating rod 42 under high-load operation is ensured, the quality and production efficiency of thin film deposition are improved, and the service life of the equipment is extended.

[0051] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A heat dissipation device for dissipating heat from a heating plate, characterized in that: The heat dissipation device comprises: a heat conducting member, at least one heat conducting pipe and a cooling assembly, wherein the heat conducting member is mounted on the plate handle of the heating plate, one end of the heat conducting pipe is connected to the heat conducting member, and the other end of the heat conducting pipe is connected to the cooling assembly, and the cooling assembly is used to cool the heat conducting pipe; Wherein, the heat conduction pipe extends radially along the disk handle of the heating disk to keep the cooling assembly away from the heating disk.

2. The heat dissipation device according to claim 1, characterized in that: The heat conducting member is a heat conducting ring, and the heat conducting ring is sleeved on the disk handle of the heating disk.

3. The heat dissipation device according to claim 1, characterized in that: At least one group of mounting holes is provided on the side wall of the heat conducting member, each group of mounting holes includes a first through hole, a second through hole and a connecting hole, the connecting hole connects the first through hole and the second through hole, and one end of the heat conducting pipe passes through the first through hole, the connecting hole and the second through hole in sequence.

4. The heat dissipation device according to claim 3, characterized in that: The first via hole and the second via hole are arranged at intervals on the side wall of the heat conducting member, and the connecting hole is arranged on a side of the side wall of the heat conducting member facing away from the first via hole and the second via hole.

5. The heat dissipation device according to claim 1, characterized in that: The heat-conducting pipe includes a first pipe section, a second pipe section and a connecting pipe section, the two ends of the connecting pipe section are respectively connected to one end of the first pipe section and the second pipe section, the other ends of the first pipe section and the second pipe section are connected to the cooling assembly, and the connecting pipe section surrounds at least a portion of the side wall of the heat-conducting component.

6. The heat dissipation device according to claim 5, characterized in that: The connecting pipe section is penetrated through the side wall of the heat conducting member.

7. The heat dissipation device according to claim 5, characterized in that: The first pipe segment and the second pipe segment are arranged in parallel and spaced apart, and the other ends of the first pipe segment and the second pipe segment extend in the same direction.

8. The heat dissipation device according to claim 1, characterized in that: The cooling assembly includes at least one group of air-cooled heat dissipation assemblies, each group of the air-cooled heat dissipation assemblies includes a fan and fins, the fins are arranged on the air inlet side of the fan, and the other end of the heat pipe is inserted into the fins.

9. The heat dissipation device according to claim 8, characterized in that: The cooling assembly includes two groups of air-cooled heat dissipation assemblies, and the other end of the heat conduction pipe includes a first pipe segment and a second pipe segment, and the first pipe segment and the second pipe segment are respectively inserted into the fins corresponding to the two groups of air-cooled heat dissipation assemblies.

10. The heat dissipation device according to any one of claims 1 to 9, characterized in that: The heat conducting member and / or the heat conducting pipe are made of aluminum nitride ceramic material.

11. The heat dissipation device according to any one of claims 1 to 9, characterized in that: The heat pipe is a closed heat pipe, and a phase-changing cooling medium is arranged inside the heat pipe.

12. A heating plate, characterized in that: include: A disk handle, a radio frequency heating rod and a heat sink, wherein the heat sink is the heat sink as described in any one of claims 1 to 11, the radio frequency heating rod is arranged in the disk handle, and the heat conducting part of the heat sink is installed on the disk handle.

13. A thin film deposition device, characterized in that: Comprising the heating plate of claim 12.

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