Vacuum conveying device and control method of vacuum conveying device

Abstract

A vacuum transfer apparatus for transferring a substrate between a process chamber and a load interlock chamber, the vacuum transfer apparatus being disposed between the process chamber and the load interlock chamber, the vacuum transfer apparatus including a container, a transfer device, an exhaust device, a dew point meter, and a control device. The container is respectively connected with the process chamber and the loading interlocking chamber through gate valves. The carrying device is arranged in the container and used for carrying the substrate between the process chamber and the loading interlocking chamber. The exhaust device is used for exhausting gas in the container. The dew point meter measures the dew point temperature of the gas in the container. The control device determines, on the basis of the dew-point temperature measured by the dew-point meter, whether or not the state is in which the process can be executed, and if the state is in which the process can be executed, the control device notifies a user of the vacuum transfer device of this meaning.

Description

[0001] This application is a divisional application of the Chinese invention patent application with the application date of September 11, 2020, application number 202080062638.1 (PCT / JP2020 / 034506), and invention name “Vacuum conveying device and control method of vacuum conveying device”. Technical Field

[0002] Various aspects and embodiments of the present disclosure relate to a vacuum conveying device and a method for controlling the vacuum conveying device. Background Art

[0003] In recent years, with the miniaturization of wiring patterns, there is a situation where moisture attached to the substrate oxidizes the wiring formed on the substrate and reduces the quality of the wiring. Therefore, in the FOUP (Front Opening Unified Pod) used to transport and store substrates, nitrogen is filled into the interior of the substrate to prevent moisture from adhering to the substrate. In addition, the vacuum transport device is controlled to a low pressure, so that when the substrate is transported in the vacuum transport device, there will not be too much moisture attached to the substrate.

[0004] However, during the period from when the substrate is taken out from the FOUP to when it is transferred to the vacuum transfer device, and during the period from when the substrate is taken out from the vacuum transfer device to when it is stored in the FOUP, a large amount of moisture adheres to the substrate.

[0005] A technique for avoiding the above situation is known in which a micro-environment transport device is provided between the FOUP and the vacuum transport device to maintain a transport path between the FOUP and the vacuum transport device at a low humidity (for example, see Patent Document 1 listed below).

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application Publication No. 2013-115065 Summary of the invention

[0009] Problem that the invention aims to solve

[0010] The present disclosure provides a vacuum transport device capable of reducing moisture attached to a substrate and a control method of the vacuum transport device.

[0011] Solutions for solving problems

[0012] One aspect of the present disclosure is a vacuum transport device, which is arranged between a process chamber and a load lock chamber, and is used to transport a substrate between the process chamber and the load lock chamber. The vacuum transport device includes a container, a transport device, an exhaust device, a dew point meter, and a control device. The container is connected to the process chamber and the load lock chamber respectively via a gate valve. The transport device is arranged in the container, and is used to transport the substrate between the process chamber and the load lock chamber. The exhaust device is used to exhaust the gas in the container. The dew point meter measures the dew point temperature of the gas in the container. The control device determines whether the process is in a state where the process can be executed based on the dew point temperature measured by the dew point meter, and when the process is in a state where the process can be executed, the user of the vacuum transport device is notified of the determination.

[0013] One aspect of the present disclosure is a vacuum transfer device, which is arranged between a process chamber and a load lock chamber and is used to transfer a substrate between the process chamber and the load lock chamber, the vacuum transfer device comprising: a container, which is respectively connected to the process chamber and the load lock chamber via a gate valve; a transfer device, which is arranged in the container and is used to transfer the substrate between the process chamber and the load lock chamber; an exhaust device, which is used to exhaust the gas in the container; a dew point meter, which measures the dew point temperature of the gas in the container; and a control device, which determines whether a process is executable based on the dew point temperature measured by the dew point meter, the control device comprising: a determination unit, after the container is opened to the atmosphere and sealed again, the determination unit determines whether the dew point temperature becomes below a predetermined first temperature ; and a control unit, which determines that the process is capable of being executed when a plurality of predetermined conditions are satisfied, the plurality of predetermined conditions including one of the conditions that the dew point temperature is determined by the determination unit to be below the first temperature, the vacuum conveying device further comprising a gas supply device for supplying an inert gas into the container, the gas supply device comprising a pressure control valve, the exhaust device comprising a first pump and a second pump, the control unit exhausts the gas in the container by operating the first pump and the second pump, and when the pressure in the container becomes below a predetermined first pressure, the control unit controls the pressure control valve while stopping the first pump and operating the second pump so that the pressure in the container becomes a second pressure higher than the first pressure.

[0014] One aspect of the present disclosure is a vacuum transfer device, which is arranged between a process chamber and a load lock chamber and is used to transfer a substrate between the process chamber and the load lock chamber. The vacuum transfer device comprises: a container, which is connected to the process chamber and the load lock chamber respectively via a gate valve; a transfer device, which is arranged in the container and is used to transfer the substrate between the process chamber and the load lock chamber; an exhaust device, which is used to exhaust the gas in the container; a dew point meter, which measures the dew point temperature of the gas in the container; and a control device, which determines whether a process is executable based on the dew point temperature measured by the dew point meter, and the control device has: a determination unit, which is moved to a large size in the container After the air is opened and sealed again, the judgment unit judges whether the dew point temperature has become lower than a predetermined first temperature; and the control unit, when a plurality of predetermined conditions are met, the control unit judges that the process is capable of being executed, the plurality of predetermined conditions including a judgment by the judgment unit that the dew point temperature has become lower than the first temperature as one of the conditions, the vacuum transport device also has a gas supply device for supplying inert gas into the container, the gas supply device has a pressure control valve, and the control unit controls the pressure control valve to make the pressure in the container higher than the pressure in the process chamber before the gate valve between the process chamber and the container is opened.

[0015] One aspect of the present disclosure is a control method for a vacuum transfer device, the vacuum transfer device comprising: a container, which is arranged between a process chamber and a load lock chamber; a transfer device, which is arranged in the container and is used to transfer a substrate between the process chamber and the load lock chamber; and an exhaust device, which is used to exhaust the gas in the container; the control method of the vacuum transfer device includes the following steps: after the container is opened to the atmosphere and then sealed again, determining whether the dew point temperature of the gas in the container measured by a dew point meter arranged in the container is below a predetermined first temperature; and when a plurality of predetermined specified conditions are met, determining that a state in which a process can be executed has been reached, the The predetermined multiple specified conditions include determining that the dew point temperature has become below the first temperature as one of the conditions, the vacuum transport device also has a gas supply device for supplying inert gas into the container, the gas supply device has a pressure control valve, the exhaust device has a first pump and a second pump, and the control method of the vacuum transport device also includes the following steps: exhausting the gas in the container by operating the first pump and the second pump, and when the pressure in the container becomes below a predetermined first pressure, controlling the pressure control valve while stopping the first pump and operating the second pump so that the pressure in the container becomes a second pressure higher than the first pressure.

[0016] One aspect of the present disclosure is a control method for a vacuum transfer device, the vacuum transfer device comprising: a container disposed between a process chamber and a load lock chamber; a transfer device disposed in the container and used to transfer a substrate between the process chamber and the load lock chamber; and an exhaust device for exhausting gas in the container; the control method for the vacuum transfer device comprising the following steps: after the container is opened to the atmosphere and sealed again, determining whether the dew point temperature of the gas in the container measured by a dew point meter disposed in the container is lower than a predetermined first temperature; and determining that a process is able to be executed when a plurality of predetermined conditions are satisfied, the plurality of predetermined conditions including determining that the dew point temperature is lower than the first temperature as one of the conditions, the vacuum transfer device further comprising a gas supply device for supplying an inert gas into the container, the gas supply device having a pressure control valve, the control method for the vacuum transfer device further comprising the following step: controlling the pressure control valve so that the pressure in the container is higher than the pressure in the process chamber before a gate valve between the process chamber and the container is opened.

[0017] Effects of the Invention

[0018] According to various aspects and embodiments of the present disclosure, it is possible to reduce moisture attached to a substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a diagram showing an example of the structure of a film forming system according to an embodiment.

[0020] Figure 2 It is a XX cross-sectional view showing an example of a vacuum transfer apparatus, a load lock chamber, and an atmospheric transfer chamber.

[0021] Figure 3 This is a flowchart showing an example of control of the vacuum transfer device until the start of the process.

[0022] Figure 4 This is a flowchart showing an example of control of the vacuum transfer device when a gate valve between the process chamber and the vacuum transfer device is opened when a process in one process chamber is completed.

[0023] Figure 5 This is a flowchart showing an example of a method for managing the dew point temperature in a container during a process. DETAILED DESCRIPTION

[0024] Hereinafter, embodiments of the vacuum conveying device and the control method of the vacuum conveying device disclosed in the present application with reference to the drawings will be described in detail based on the drawings. In addition, the disclosed vacuum conveying device and the control method of the vacuum conveying device are not limited to the following embodiments.

[0025] In addition, the vacuum transport device is opened to the atmosphere and then sealed, and the pressure in the vacuum transport device is reduced by exhausting the gas in the vacuum transport device. Therefore, although the concentration of the gas in the vacuum transport device is reduced by exhausting, the proportion of moisture contained in the gas in the vacuum transport device is equivalent to that in the outside air. When the miniaturization of the wiring pattern is further developed, sometimes even a small amount of moisture adheres to the wiring, which changes the characteristics of the wiring. Therefore, when the miniaturization of the wiring pattern is further developed, sometimes the characteristics of the wiring change during the process of transporting the substrate in the vacuum transport device.

[0026] Therefore, the present disclosure provides a technology capable of further reducing the amount of moisture attached to a substrate.

[0027] [Film forming system 100]

[0028] Figure 1 1 is a schematic diagram showing an example of a film forming system 100 according to an embodiment of the present disclosure. Figure 2 XX is a cross-sectional view showing an example of the vacuum transfer apparatus 200 , the load lock chamber 102 , and the atmospheric transfer chamber 103 . Figure 1 The XX section and Figure 2 The film forming system 100 is a multi-chamber type vacuum processing system and includes a plurality of process chambers 101 , a plurality of load lock chambers 102 , an atmospheric transfer chamber 103 , a gas supply device 110 , an exhaust device 120 , a control device 130 , and a vacuum transfer device 200 .

[0029] The plurality of process chambers 101 are connected to the four side walls of the vacuum transfer apparatus 200 having a heptagonal planar shape via gate valves G1. Each process chamber 101 performs film formation, etching, or modification on the substrate W transferred into the interior through the vacuum transfer apparatus 200. In the present embodiment, four process chambers 101 are connected to the four side walls of the vacuum transfer apparatus 200 having a heptagonal planar shape, but the number of process chambers 101 connected to the vacuum transfer apparatus 200 may be less than three, or may be more than five.

[0030] A plurality of load lock chambers 102 are connected to the three side walls of the vacuum transfer apparatus 200 via gate valves G2, respectively. Each load lock chamber 102 is connected to an atmospheric transfer chamber 103 via a gate valve G3. When a substrate W is transferred between the atmospheric transfer chamber 103 and the vacuum transfer apparatus 200, the load lock chamber 102 switches between an atmospheric atmosphere and a vacuum atmosphere. In the present embodiment, three load lock chambers 102 are connected to the three side walls of the vacuum transfer apparatus 200, but the number of load lock chambers 102 connected to the vacuum transfer apparatus 200 may be less than two, or may be more than four.

[0031] The vacuum transport device 200 includes a container 201, a transport device 202, a plurality of heaters 203, and a dew point meter 204. The transport device 202 is, for example, a robot arm, and is used to transport the substrate W between each process chamber 101 and each load lock chamber 102. The transport device 202, for example, carries out the substrate W before processing from the load lock chamber 102 and carries it into the process chamber 101. In addition, the transport device 202, for example, carries out the processed substrate W from the process chamber 101 and carries it into the process chamber 101 for performing other processing on the substrate W. In addition, the transport device 202, for example, carries out the processed substrate W from the process chamber 101 and carries it into the load lock chamber 102.

[0032] The heater 203 is, for example, a rod-shaped and embedded in the side wall of the container 201 to heat the side wall of the container 201. As a result, the wall surface of the container 201 is heated, making it easier for water molecules adsorbed on the wall surface of the container 201 to be detached. In addition, the heater 203 may also be embedded in the bottom plate and the top plate of the container 201 to heat the bottom plate and the top plate of the container 201. The power supply and supply stop to the heater 203 are controlled by the control unit 132 in the control device 130.

[0033] The dew point meter 204 is disposed in the container 201 and is used to measure the dew point temperature T of the gas in the container 201. d In the present embodiment, the dew point meter 204 is a capacitance type dew point meter. The dew point temperature T measured by the dew point meter 204 is d The information is output to the control device 130.

[0034] The container 201 is connected to the exhaust device 120 via a pipe 126. The exhaust device 120 includes a TMP (TurboMolecular Pump) 121, a DP (Dry Pump) 122, a valve 123, a valve 124, and a valve 125. The air inlet of the TMP 121 is connected to the pipe 126 via a valve 124, and the exhaust port of the TMP 121 is connected to the DP 122 via a valve 125. In addition, a pipe 127 is connected between the pipe between the valve 125 and the DP 122 and the pipe 126, and the valve 123 is provided on the pipe 127. The DP 122 can exhaust the gas in the container 201 to a vacuum degree of about several Torr. On the other hand, the TMP 121 can exhaust the gas in the container 201 to a vacuum degree of less than 1 Torr. The power consumption of the TMP 121 is greater than that of the DP 122. The TMP 121 , the DP 122 , the valve 123 , the valve 124 , and the valve 125 are controlled by a control unit 132 in the control device 130 .

[0035] The container 201 is connected to the gas supply device 110 via a pipe 113. The gas supply device 110 includes a PCV (Pressure Control Valve) 111 and a gas supply source 112. The gas supply source 112 is a supply source of an inert gas such as nitrogen or a rare gas. The PCV 111 is used to control the amount of inert gas supplied to the container 201 so that the pressure in the container 201 becomes a predetermined pressure. The PCV 111 is controlled by a control unit 132 in the control device 130.

[0036] A plurality of ports 105 for mounting a carrier (FOUP, etc.) C for accommodating substrates W are provided on the side of the atmospheric transfer chamber 103. An alignment chamber 104 for aligning substrates W is provided in the atmospheric transfer chamber 103. In addition, a transfer device 106 such as a robot arm is provided in the atmospheric transfer chamber 103. The transfer device 106 transfers substrates W between the carrier C, the load lock chamber 102, and the alignment chamber 104. A downward flow of low-humidity dry air is formed in the atmospheric transfer chamber 103.

[0037] The control device 130 has a memory, a processor, and an input / output interface. The memory stores a program executed by the processor and a recipe including conditions for each process, etc. The processor executes the program read from the memory and controls each part of the film forming system 100 via the input / output interface based on the recipe stored in the memory.

[0038] The processor of the control device 130 implements the functions of the determination unit 131 and the control unit 132 by executing the program read from the memory. When the container 201 of the vacuum transfer device 200 is sealed after being opened to the atmosphere for installation, maintenance, etc., the determination unit 131 obtains the dew point temperature T from the dew point meter 204. d Then, the determination unit 131 determines the acquired dew point temperature T d Whether it reaches the predetermined first temperature T d1 Below, and at dew point temperature T d Became the first temperature T d1 In the following cases, the control unit 132 is notified of this fact.

[0039] In addition, the determination unit 131 notifies the control unit 132 of the dew point temperature T d Became the first temperature T d1 After that, continue to obtain the dew point temperature T from the dew point meter 204 d Then, the determination unit 131 determines the dew point temperature T d Is it higher than the predetermined second temperature T d2 , and at the dew point temperature T d Higher than the second temperature T d2 In the present embodiment, the second temperature T d2 is higher than the first temperature T d1 In addition, as another method, the first temperature T d1 and the second temperature T d2 The same temperature may also be used.

[0040] The control unit 132 controls each unit of the film forming system 100. For example, the control unit 132 controls the PCV 111, the TMP 121, the DP 122, the valve 123, the valve 124, the valve 125, the heater 203, the gate valve G1, and the gate valve G2, etc., based on the notification from the determination unit 131. The details of the control of the control unit 132 are described in the flowchart described later.

[0041] [Preparation before the process starts]

[0042] Figure 3 This is a flowchart showing an example of control of the vacuum transfer apparatus 200 until the start of a process. For example, when the inside of the vacuum transfer apparatus 200 is sealed after being opened to the atmosphere for installation, maintenance, etc., the control device 130 starts the processing shown in this flowchart.

[0043] First, the control unit 132 starts supplying power to each heater 203 , thereby starting the heater 203 to heat the container 201 ( S100 ).

[0044] Next, the control unit 132 starts exhausting gas through the TMP 121 and the DP 122 (S101). In step S101, the control unit 132 controls the valve 123 to be in a closed state, controls the valves 124 and 125 to be in an open state, and operates the TMP 121 and the DP 122. Thus, the gas in the container 201 is exhausted, and the pressure P in the container 201 is reduced.

[0045] Next, the control unit 132 refers to the measured value of the pressure gauge (not shown) disposed in the container 201 to determine whether the pressure P in the container 201 is lower than the predetermined first pressure P1 (S102). The first pressure P1 is, for example, a pressure lower than 0.01 Torr. When the pressure P in the container 201 is higher than the first pressure P1 (S102: No), the process of step S102 is performed again.

[0046] On the other hand, when the pressure P in the container 201 becomes lower than the first pressure P1 (S102: Yes), the PCV 111 is controlled to start supplying the inert gas into the container 201 (S103). Then, the control unit 132 controls the PCV 111 to control the supply amount of the inert gas so that the pressure P in the container 201 becomes a predetermined second pressure P2 (S104). The second pressure P2 is, for example, a pressure in the range of 1 to 10 Torr.

[0047] Then, the control unit 132 controls the valve 123 to be in an open state, controls the valve 124 to be in a closed state, and stops the TMP 121 (S105). By stopping the TMP 121, the power consumption of the vacuum transfer apparatus 200 can be reduced.

[0048] Here, although the container 201 is sealed, a small amount of external air may enter the container 201 through sealing members such as the connection portion between the container 201 and the process chamber 101 and the connection portion between the container 201 and the load lock chamber 102. When the external air enters the container 201, some water molecules contained in the external air adhere to the inner surface of the container 201. Therefore, there is a case where the amount of water in the container 201 does not drop below a certain level even though the gas in the container 201 is exhausted.

[0049] Therefore, in this embodiment, the gas in the container 201 is exhausted and an inert gas is supplied into the container 201. Thus, water molecules contained in the external air entering the container 201 are suppressed from adhering to the inner surface of the container 201. Thus, water molecules contained in the external air entering the container 201 are quickly exhausted by the exhaust device 120, and the amount of moisture in the container 201 can be further reduced.

[0050] Next, the determination unit 131 determines the dew point temperature T d Whether it becomes the first temperature T d1 Below (S106). At the dew point temperature T d Than the first temperature T d1 If it is high (S106: No), the process shown in step S106 is executed again.

[0051] On the other hand, at the dew point temperature T d Became the first temperature T d1 In the following case (S106: Yes), the determination unit 131 notifies the control unit 132 of the dew point temperature T d Became the first temperature T d1 Next, the control unit 132 stops the power supply to each heater 203, thereby stopping the heating of the container 201 by the heater 203 (S107). Thus, the power consumption of the vacuum transfer device 200 can be reduced.

[0052] Next, the control unit 132 determines whether all the process start conditions are satisfied (S108). The process start conditions include the dew point temperature T in the container 201. d Become the first temperature T d1 In addition to the above, the pressure in each process chamber 101 is adjusted, the temperature is controlled, and a carrier C is provided at the port 105 .

[0053] When at least a part of the process start conditions is not satisfied (S108: No), the determination unit 131 determines the dew point temperature T d Whether it becomes the second temperature T d2 Above (S109). At the dew point temperature T d Below the second temperature T d2 (S109: "No"), the process shown in step S108 is executed again.

[0054] On the other hand, at the dew point temperature T d Becomes the second temperature T d2 In the above case (S109: Yes), the determination unit 131 notifies the control unit 132 of the dew point temperature T d Becomes the second temperature T d2 Above. Dew point temperature T d Becomes the second temperature T d2The above is considered to be due to some reasons such as the weakening of the sealing performance of the sealing member that maintains the airtightness of the container 201, which increases the amount of intrusion of external air. Therefore, the control unit 132 notifies the user of the film forming system 100 of the error (S110). The control unit 132 displays the dew point temperature T on a display device (not shown) or the like. d Becomes the second temperature T d2 As described above, the error is notified to the user of the film forming system 100. Then, the control device 130 ends the processing shown in this flowchart.

[0055] On the other hand, when all conditions for starting the process are satisfied (S108: Yes), the control unit 132 displays a message indicating that the process is ready to start on a display device (not shown), thereby notifying the user of the film forming system 100 that the process can be executed (S111). Then, the control unit 130 ends the processing shown in this flowchart.

[0056] [Control of the Vacuum Transfer Device 200 During Process Execution]

[0057] Figure 4 This is a flowchart showing an example of controlling the vacuum transfer device 200 when the gate valve G1 between the process chamber 101 and the vacuum transfer device 200 is opened when a process in the process chamber 101 is completed. For example, when a specific process on the substrate W in the process chamber 101 is completed, the control device 130 starts the processing shown in this flowchart.

[0058] First, the control unit 132 controls the PCV 111 to increase the pressure P in the container 201 (S200). Then, the control unit 132 refers to the measured value of the pressure gauge (not shown) disposed in the container 201 to determine whether the pressure in the container 201 has reached or exceeded a predetermined third pressure P3 (S201). The third pressure P3 is a pressure that is higher than the pressure in the process chamber 101 and lower than the atmospheric pressure. When the pressure in the container 201 is lower than the third pressure P3 (S201: No), the process shown in step S201 is performed again.

[0059] On the other hand, when the pressure in the container 201 becomes higher than the third pressure P3 (S201: Yes), the control unit 132 controls the gate valve G1 between the process chamber 101 where the specific process is completed and the container 201 to be in an open state, thereby opening the gate valve G1 (S202). Then, the control unit 132 controls the transport device 202 to carry out the substrate W from the process chamber 101 (S203). Then, the control unit 132 controls the gate valve G1 between the process chamber 101 and the container 201 to be in a closed state, thereby closing the gate valve G1 (S204).

[0060] As described above, in this embodiment, the control unit 132 performs control so that the pressure in the container 201 is higher than the pressure in the process chamber 101 before the gate valve G1 is opened. Thus, particles, residual gas, etc. in the process chamber 101 are prevented from entering the container 201 when the gate valve G1 is opened. Thus, particles generated in the process chamber 101 are prevented from entering other process chambers 101 via the container 201.

[0061] Next, the gate valve between the device as the transfer destination of the substrate W and the container 201 is controlled to be in an open state, thereby opening the gate valve (S205). In step S205, when other processes are performed on the substrate W by other process chambers 101, the gate valve G1 between the other process chambers 101 and the container 201 is opened. In addition, when the substrate W is accommodated in the carrier C, the gate valve G2 between the load lock chamber 102 and the container 201 is opened.

[0062] Then, the control unit 132 controls the transfer device 202 to transfer the substrate W into another process chamber 101 or the load lock chamber 102 (S206). Then, the control unit 132 closes the gate valve (S207).

[0063] Next, the control unit 132 controls the PCV 111 to control the supply amount of the inert gas so that the pressure P in the container 201 reaches a predetermined second pressure P2 (S208). Then, the control device 130 ends the processing shown in this flowchart.

[0064] One embodiment has been described above. As described above, the vacuum transport device 200 in this embodiment is arranged between the process chamber 101 and the load lock chamber 102, and is used to transport the substrate W between the process chamber 101 and the load lock chamber 102. The vacuum transport device 200 includes a container 201, a transport device 202, an exhaust device 120, a dew point meter 204, and a control device 130. The container 201 is connected to the process chamber 101 and the load lock chamber 102 respectively via gate valves (G1, G2). The transport device 202 is arranged in the container 201, and is used to transport the substrate W between the process chamber 101 and the load lock chamber 102. The exhaust device 120 is used to exhaust the gas in the container 201. The dew point meter 204 measures the dew point temperature of the gas in the container 201. The control device 130 determines whether the process is executable based on the dew point temperature measured by the dew point meter 204, and if the process is executable, the control device 130 notifies the user of the vacuum transfer apparatus 200 of this fact. Thus, the vacuum transfer apparatus 200 can reduce the moisture attached to the substrate W.

[0065] In the above-mentioned embodiment, the control device 130 includes the determination unit 131 and the control unit 132. After the container 201 is opened to the atmosphere and sealed again, the determination unit 131 determines the dew point temperature T of the gas in the container 201. d Whether it reaches the predetermined first temperature T d1 When all of the predetermined conditions including the dew point temperature T determined by the determination unit 131 are satisfied, the control unit 132 notifies the user of the vacuum transfer device 200 that the process can be executed. d Became the first temperature T d1 The following is one of the conditions. Thus, the vacuum transfer apparatus 200 can reduce the amount of moisture adhering to the substrate W.

[0066] In the above-described embodiment, the control unit 132 determines the dew point temperature T as being 0.0045°C during the period when the substrate W is processed in the process chamber 101. d The predetermined second temperature T d2 In the above case, the control unit 132 notifies the user of the vacuum transfer device 200 of an error. Thus, the vacuum transfer device 200 can prevent the dew point temperature T in the container 201 from exceeding 0. d The substrate W is passed through the container 201 in the state where the substrate W is raised.

[0067] In the above-mentioned embodiment, the heater 203 for heating the inner wall surface of the container 201 is provided in the container 201. In addition, after the inside of the container 201 is opened to the atmosphere and sealed again, the control unit 132 supplies power to the heater 203 to heat the inner wall surface of the container 201. Thus, the water molecules attached to the inner wall surface of the container 201 can be quickly detached, and the water content in the container 201 can be quickly reduced.

[0068] In the above-described embodiment, when the determination unit 131 determines that the dew point temperature T of the gas in the container 201 is d Became the first temperature T d1 In the following cases, the control unit 132 stops the power supply to the heater 203 to stop the heater 203 from heating the inner wall surface of the container 201. In this way, the power consumption of the vacuum transfer apparatus 200 can be reduced.

[0069] The vacuum transfer device 200 of the above embodiment further includes a gas supply device 110 for supplying an inert gas into the container 201. This prevents water molecules contained in the external air entering the container 201 through the sealing member from adhering to the inner surface of the container 201.

[0070] In the above-mentioned embodiment, the gas supply device 110 includes the PCV 111, and the exhaust device 120 includes the TMP 121 and the DP 122. The control unit 132 exhausts the gas in the container 201 by operating the TMP 121 and the DP 122. Then, when the pressure P in the container 201 becomes less than the predetermined first pressure P1, the control unit 132 controls the PCV 111 in a state where the TMP 121 is stopped and the DP 122 is operated so that the pressure in the container 201 becomes the second pressure P2 higher than the first pressure P1. Thus, the moisture in the container 201 can be quickly reduced, and the power consumption of the vacuum transfer device 200 can be reduced.

[0071] In addition, in the above-described embodiment, the control unit 132 controls the PCV 111 so that the pressure in the container 201 is higher than the pressure in the process chamber 101 before the gate valve G1 between the process chamber 101 and the container 201 is opened. Thus, particles, residual gas, etc. in the process chamber 101 are prevented from entering the container 201 when the gate valve G1 between the process chamber 101 and the container 201 is opened.

[0072] In addition, the control method of the vacuum transfer device 200 of the present embodiment includes the following steps: after the container 201 is opened to the atmosphere and then sealed again, determining the dew point temperature T of the gas in the container 201 measured by the dew point meter 204 installed in the container 201. d Whether it reaches the predetermined first temperature T d1 and when all of the predetermined conditions are satisfied, notifying the user of the vacuum transfer device that the process can be executed, wherein the predetermined conditions include determining that the dew point temperature T d Became the first temperature T d1 The following is one of the conditions. Thus, the vacuum transfer apparatus 200 can reduce the amount of moisture adhering to the substrate W.

[0073] [other]

[0074] In addition, the technology disclosed in the present application is not limited to the above-mentioned embodiment, and various modifications can be made within the scope of the gist of the technology.

[0075] For example, in the above-described embodiment, based on the dew point temperature T measured by the dew point meter 204 installed in the container 201 d For example, an oxygen concentration meter for measuring the concentration of oxygen contained in the gas in the container 201 may be provided in the container 201, and the concentration of oxygen contained in the gas in the container 201 may be determined based on the dew point temperature T of the gas in the container 201. d and oxygen concentration to determine whether the process is executable.

[0076] For example, the dew point temperature T of the gas in the container 201 may be d The first temperature T d1 When the oxygen concentration of the gas in the container 201 is less than the first concentration, it is determined that one of the multiple conditions for starting the process is satisfied. In addition, when the dew point temperature T of the gas in the container 201 during the process is lower than the first concentration, it is determined that one of the multiple conditions for starting the process is satisfied. d Higher than the second temperature T d2 When the oxygen concentration of the gas in the container 201 exceeds the second concentration, the user of the film forming system 100 is notified of an error and the process is interrupted. Thus, oxidation of the substrate W by oxygen remaining in the vacuum transfer device 200 is also suppressed.

[0077] In addition, in the above-mentioned embodiment, the description is centered on the management of the dew point temperature of the gas in the container 201 of the vacuum transfer device 200 when the container 201 is sealed after being opened to the atmosphere for installation, maintenance, etc., but the disclosed technology is not limited to this. For example, the management of the dew point temperature in the container 201 may also be performed during the process of performing a process on the substrate W.

[0078] Figure 5 This is a flowchart showing an example of a method for managing the dew point temperature in the container 201 during the process. For example, when the process is started, the control device 130 starts the processing shown in this flowchart.

[0079] First, the determination unit 131 of the control device 130 determines the dew point temperature T outputted from the dew point meter 204. d To determine the dew point temperature T d Whether it reaches the predetermined third temperature T d3 The third temperature T d3 For example, the second temperature T d2 Same as or higher than the second temperature T d2 High temperature. At dew point temperature T d T d3 If the value is lower than the threshold value (S300: No), the process shown in step S300 is executed again.

[0080] On the other hand, at the dew point temperature T d Become the third temperature T d3 In the above case (S300: Yes), the determination unit 131 notifies the control unit 132 of the dew point temperature T d Become the third temperature T d3The control unit 132 interrupts the removal of the substrate W included in the new batch of substrates from the carrier C, and determines whether the processing of the substrate W included in the batch of substrates being transported and being processed is completed (S301). If the processing of the substrate W included in the batch of substrates being processed is not completed (S301: "No"), the processing of the substrate W included in the batch of substrates being processed is continued, and the processing shown in step S300 is performed again.

[0081] On the other hand, when the processing of the substrate W included in the substrate lot being processed is completed (S301: Yes), the control device 130 executes the processing again by Figure 3 The process of steps S100 to S107 described above is performed. Thus, the dew point temperature T of the gas in the container 201 is lowered to d Once again, the first temperature T d1 Next, the control device 130 starts to take out the substrates W included in the next batch of substrates from the carrier C again, and starts to perform the process for the substrates W again ( S302 ). Then, the process shown in step S300 is performed again.

[0082] Thus, even after the process for the substrate W is started, the moisture attached to the substrate W can be kept low. In addition, in step S301, the end of the process is determined in batch units, but the end of the process may be determined in substrate units. That is, when the dew point temperature T is determined in step S300, d Become the third temperature T d3 In the above case, even if the substrate W is from the same batch as the substrate W being transported or processed, the process of taking out a new substrate W from the carrier C is interrupted. Thus, even in the middle of a batch of substrates, the dew point temperature T of the gas in the container 201 can be quickly lowered to T as soon as the processing of the substrate W being transported or processed is completed. d Restore to the first temperature T d1 the following.

[0083] In addition, all aspects of the embodiments disclosed herein are illustrative and non-restrictive. The above embodiments can be implemented in a variety of ways. In addition, the above embodiments can be omitted, replaced, and changed in various ways without departing from the attached claims and their gist.

[0084] Description of Reference Numerals

[0085] C: carrier; G1: gate valve; G2: gate valve; G3: gate valve; W: substrate; 100: film forming system; 101: process chamber; 102: load lock chamber; 103: atmospheric transfer chamber; 104: alignment chamber; 105: port; 106: transfer device; 110: gas supply device; 111: PCV; 112: gas supply source; 113: piping; 120: exhaust device; 121: TMP; 122: DP; 123: valve; 124: valve; 125: valve; 126: piping; 127: piping; 130: control device; 131: determination unit; 132: control unit; 200: vacuum transfer device; 201: container; 202: transfer device; 203: heater; 204: dew point meter.

Claims

1. A vacuum transfer device, disposed between a process chamber and a load lock chamber, for transferring a substrate between the process chamber and the load lock chamber, the vacuum transfer device comprising: a container connected to the process chamber and the load lock chamber respectively via gate valves; a transfer device, which is disposed in the container and is used to transfer a substrate between the process chamber and the load lock chamber; An exhaust device, which is used to exhaust the gas in the container; a dew point meter for measuring the dew point temperature of the gas in the container; as well as a control device for determining whether or not a process is executable based on the dew point temperature measured by the dew point meter, The control device has: a determination unit that determines whether the dew point temperature is equal to or lower than a predetermined first temperature after the container is opened to the atmosphere and then sealed again; and a control unit, wherein the control unit determines that a process is capable of being executed when a plurality of predetermined conditions are satisfied, wherein the plurality of predetermined conditions include, as one of the conditions, determination by the determination unit that the dew point temperature is equal to or lower than the first temperature, The vacuum transport device further comprises a gas supply device for supplying an inert gas into the container. The gas supply device has a pressure control valve, The exhaust device comprises a first pump and a second pump, The control unit operates the first pump and the second pump to discharge the gas in the container. When the pressure in the container becomes lower than a predetermined first pressure, the control unit controls the pressure control valve while stopping the first pump and operating the second pump so that the pressure in the container becomes a second pressure higher than the first pressure.

2. The vacuum conveying device according to claim 1, characterized in that: When the determination unit determines that the dew point temperature is equal to or higher than a predetermined second temperature while the substrate is being processed in the process chamber, the control unit determines that a state in which a process cannot be performed is reached.

3. The vacuum conveying device according to claim 1 or 2, characterized in that: The container is provided with a heater for heating the inner wall surface of the container. After the inside of the container is opened to the atmosphere and then sealed again, the control unit supplies power to the heater to heat the wall surface.

4. The vacuum conveying device according to claim 3, characterized in that: When the determination unit determines that the dew point temperature is equal to or lower than the first temperature, the control unit stops supplying power to the heater to stop heating of the wall surface by the heater.

5. The vacuum conveying device according to claim 1, characterized in that: The control unit controls the pressure control valve so that the pressure in the container is higher than the pressure in the process chamber before the gate valve between the process chamber and the container is opened.

6. A vacuum transfer device, disposed between a process chamber and a load lock chamber, for transferring a substrate between the process chamber and the load lock chamber, the vacuum transfer device comprising: a container connected to the process chamber and the load lock chamber respectively via gate valves; a transfer device, which is disposed in the container and is used to transfer a substrate between the process chamber and the load lock chamber; An exhaust device, which is used to exhaust the gas in the container; a dew point meter for measuring the dew point temperature of the gas in the container; as well as a control device for determining whether or not a process is executable based on the dew point temperature measured by the dew point meter, The control device has: a determination unit that determines whether the dew point temperature is equal to or lower than a predetermined first temperature after the container is opened to the atmosphere and then sealed again; and a control unit, wherein the control unit determines that a process is capable of being executed when a plurality of predetermined conditions are satisfied, wherein the plurality of predetermined conditions include, as one of the conditions, determination by the determination unit that the dew point temperature is equal to or lower than the first temperature, The vacuum transport device further comprises a gas supply device for supplying an inert gas into the container. The gas supply device has a pressure control valve, The control unit controls the pressure control valve so that the pressure in the container is higher than the pressure in the process chamber before the gate valve between the process chamber and the container is opened.

7. A method for controlling a vacuum conveying device, The vacuum conveying device comprises: A container disposed between the process chamber and the load lock chamber; a transfer device, which is disposed in the container and is used to transfer a substrate between the process chamber and the load lock chamber; as well as An exhaust device, which is used to exhaust the gas in the container; The control method of the vacuum conveying device comprises the following steps: After the container is opened to the atmosphere and then sealed again, determining whether the dew point temperature of the gas in the container measured by a dew point meter provided in the container is equal to or lower than a predetermined first temperature; as well as When a plurality of predetermined conditions are satisfied, it is determined that the process is in a state where the process can be executed, wherein the plurality of predetermined conditions include, as one of the conditions, determining that the dew point temperature is equal to or lower than the first temperature. The vacuum transport device further comprises a gas supply device for supplying an inert gas into the container. The gas supply device has a pressure control valve, The exhaust device comprises a first pump and a second pump, The control method of the vacuum conveying device further comprises the following steps: The gas in the container is discharged by operating the first pump and the second pump. When the pressure in the container becomes lower than a predetermined first pressure, the pressure control valve is controlled in a state where the first pump is stopped and the second pump is operated so that the pressure in the container becomes a second pressure higher than the first pressure.

8. A method for controlling a vacuum conveying device, The vacuum conveying device comprises: A container disposed between the process chamber and the load lock chamber; a transfer device, which is disposed in the container and is used to transfer a substrate between the process chamber and the load lock chamber; as well as An exhaust device, which is used to exhaust the gas in the container; The control method of the vacuum conveying device comprises the following steps: After the container is opened to the atmosphere and then sealed again, determining whether the dew point temperature of the gas in the container measured by a dew point meter provided in the container is equal to or lower than a predetermined first temperature; as well as When a plurality of predetermined conditions are satisfied, it is determined that the process is in a state where the process can be executed, wherein the plurality of predetermined conditions include, as one of the conditions, determining that the dew point temperature is equal to or lower than the first temperature. The vacuum transport device further comprises a gas supply device for supplying an inert gas into the container. The gas supply device has a pressure control valve, The control method of the vacuum conveying device further includes the following steps: The pressure control valve is controlled so that the pressure in the container is higher than the pressure in the process chamber before the gate valve between the process chamber and the container is opened.

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