Wafer feeding and discharging device

Abstract

The invention belongs to the technical field of semiconductor equipment, and particularly relates to a wafer loading and unloading device, which comprises a rack, a wafer storage module, a wafer loading and unloading module, a wafer loading and unloading module and a wafer loading and unloading module, the wafer transfer positioning module is used for taking, placing and conveying the wafer and can adjust the angle of the wafer; the needle card conveying module is used for taking, placing and moving the heat sink needle cards; the needle card storage module is used for storing a heat sink needle card; and the wafer needle card combination module is arranged on one side of the needle card conveying module and is used for assembling and disassembling the heat sink needle cards. Through the above arrangement, the device can achieve the automatic assembly of the wafer and the heat sink pin card, replaces the manual operation, and improves the production efficiency and stability.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor equipment, and in particular relates to a wafer loading and unloading device. Background Art

[0002] The current method of placing and picking wafers in the pin card carrier is mostly manual operation. The manual operation process is cumbersome and requires a series of manual steps, which increases the difficulty and complexity of the operation and has low production efficiency. The position accuracy and torque size of the manual operation cannot be well controlled, and the stability of the product is poor. Therefore, a wafer loading and unloading device is urgently needed to realize automatic loading and unloading. Summary of the invention

[0003] The purpose of the present invention is to provide a wafer loading and unloading device to solve the above problems.

[0004] To achieve the above object, the present invention provides the following solutions:

[0005] Wafer loading and unloading device, including a frame and mounted on the frame:

[0006] Wafer storage module, used for placing wafers;

[0007] Wafer transfer and positioning module, used for wafer placement and transportation, and capable of adjusting the wafer angle;

[0008] Needle card conveying module, used for taking, placing and moving heat sink needle cards;

[0009] Needle card storage module, used for storing heat sink needle cards;

[0010] The wafer needle card combination module is arranged on one side of the needle card conveying module, and the wafer needle card combination module is used for assembling and disassembling the heat sink needle card.

[0011] Optionally, the wafer storage module includes a wafer plug lifting module, and the wafer plug lifting module includes:

[0012] A card plug is used to carry multiple wafers;

[0013] A servo lifting mechanism is arranged at the bottom of the plug, the fixed end of the servo lifting mechanism is fixedly connected to the frame, and the movable end of the servo lifting mechanism is connected to the bottom of the plug. The servo lifting mechanism is used to lift the plug to facilitate the wafer transfer positioning module to pick up and place the wafer located at the top of the plug.

[0014] Optionally, the wafer transfer positioning module includes:

[0015] Wafer handling robot, used to pick up and move wafers;

[0016] Wafer rotation rough positioning module, used to support the wafer and roughly position the wafer rotation angle;

[0017] The wafer transfer precision positioning module is used to support the wafer and precisely position the wafer rotation angle.

[0018] Optionally, the wafer pick-and-place robot comprises:

[0019] Ceramic suction cups for picking up and placing wafers;

[0020] A transplanting module, wherein the fixed end of the transplanting module is fixedly connected to the frame, and the movable end of the transplanting module is connected to the ceramic suction cup for driving the ceramic suction cup to move.

[0021] Optionally, the wafer rotation coarse positioning module includes:

[0022] A coarse positioning lifting suction cup, used to take out or place the wafer on the ceramic suction cup;

[0023] A lifting module, a fixed end of which is fixed to the frame, and a movable end of which is connected to the rough positioning lifting suction cup, for driving the rough positioning lifting suction cup to move up and down;

[0024] A coarse positioning rotary suction cup is used to take out or place the wafer on the coarse positioning lifting suction cup, and the coarse positioning rotary suction cup rotates the wafer;

[0025] The edge-finding CCD module is fixed on the frame and is located above the coarse positioning rotating chuck. The edge-finding CCD module cooperates with the coarse positioning rotating chuck to determine the wafer rotation angle.

[0026] Optionally, the wafer transfer precision positioning module includes:

[0027] Bernoulli chuck, used to pick and place wafers;

[0028] A linear motor XYR module, a fixed end of which is mounted on the frame, a movable end of which is connected to the Bernoulli suction cup, and the linear motor XYR module is used to adjust the X / Y / R axis position of the Bernoulli suction cup;

[0029] A CCD positioning module is arranged above the middle of the linear motor XYR module and connected to the frame. The CCD positioning module is used to identify the precise positioning of the wafer rotation angle.

[0030] Optionally, the needle card conveying module includes a carrier needle card conveying module, and the carrier needle card conveying module is used for horizontal movement of the heat sink needle card.

[0031] Optionally, the wafer-needle-card combination module includes:

[0032] A needle card heat sink lifting module is arranged below the carrier needle card conveying module and is used to lift the heat sink needle card;

[0033] The carrier screw automatic disassembly module is arranged above the carrier needle card conveying module and is used for assembling and disassembling the heat sink needle card.

[0034] Optionally, the pin card heat sink lifting module includes:

[0035] Heat sink positioning table, used to hold up the heat sink pin card;

[0036] A heat sink lifting mechanism, a fixed end of which is connected to the frame, and a movable end of which is connected to the heat sink positioning platform, for lifting and lowering the heat sink positioning platform;

[0037] The waste suction sleeve is arranged on the heat sink positioning platform.

[0038] Optionally, the probe card storage module includes a probe card material frame lifting module for storing and lifting the heat sink probe card.

[0039] Compared with the prior art, the present invention has the following advantages and technical effects:

[0040] When in use, the wafer is placed in the wafer storage module, and the heat sink needle card is placed in the needle card storage module. The device has two working modes. When in the wafer loading mode, the wafer transfer positioning module takes out the wafer on the wafer storage module and adjusts its rotation angle, and the needle card conveying module takes out the heat sink needle card from the needle card storage module and conveys it to the wafer needle card combination module to be split into two parts, the needle card and the heat sink. The heat sink continues to move to the bottom of the wafer transfer positioning module through the needle card conveying module, and the wafer is placed under the wafer transfer positioning module through the wafer transfer positioning module. After the wafer is placed on the heat sink, the needle card conveying module moves the heat sink to the wafer needle card combination module to assemble the heat sink, wafer and needle card, and then moves them to the needle card storage module; when in wafer removal mode, the heat sink needle card with the wafer is placed in the needle card storage module, and the needle card conveying module moves it to the wafer needle card combination module, removes the needle card, and the heat sink and wafer continue to move to the bottom of the wafer transfer positioning module, and the wafer is sucked from the heat sink by the wafer transfer positioning module and transferred to the wafer storage module for storage. Through the above settings, the automatic assembly of wafers and heat sink needle cards can be realized, replacing manual operations and improving production efficiency and stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative labor:

[0042] Figure 1 It is a schematic diagram of the structure of the present invention;

[0043] Figure 2 This is a schematic diagram of the structure of the wafer plug lifting module of the present invention;

[0044] Figure 3 This is a schematic diagram of the structure of the wafer pick-and-place robot of the present invention;

[0045] Figure 4 This is a schematic diagram of the structure of the wafer rotation coarse positioning module of the present invention;

[0046] Figure 5 This is a schematic diagram of the structure of the wafer transfer precision positioning module of the present invention;

[0047] Figure 6 This is a schematic diagram of the structure of the pin card heat sink lifting module of the present invention;

[0048] Figure 7 This is an action flow chart of placing a wafer into a probe card of the present invention;

[0049] Figure 8 This is a flow chart of the action of taking a wafer out of a probe card according to the present invention;

[0050] Among them, 1. Wafer jammer lifting module; 2. Wafer rotation coarse positioning module; 3. Wafer pick-and-place robot; 4. Wafer transfer fine positioning module; 5. Carrier screw automatic disassembly and assembly module; 6. Needle card heat sink lifting module; 7. Carrier needle card conveying module; 8. Probe card material frame lifting module; 101. Jammer; 103. Servo lifting mechanism; 301. Transplanting module; 303. Ceramic suction cup; 201. Coarse positioning rotating suction cup; 202. Coarse positioning lifting suction cup; 203. Lifting module; 204. Edge-finding CCD module; 401. CCD positioning module; 402. Bernoulli suction cup; 403. Linear motor XYR module; 601. Heat sink positioning table; 602. Waste chip suction sleeve; 603. Heat sink lifting mechanism. DETAILED DESCRIPTION

[0051] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0052] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0053] Reference Figures 1 to 8 The present invention discloses a wafer loading and unloading device, including a frame and:

[0054] Wafer storage module, used for placing wafers;

[0055] Wafer transfer and positioning module, used for wafer placement and transportation, and capable of adjusting the wafer angle;

[0056] Needle card conveying module, used for taking, placing and moving heat sink needle cards;

[0057] Needle card storage module, used for storing heat sink needle cards;

[0058] The wafer needle card combination module is arranged on one side of the needle card conveying module, and the wafer needle card combination module is used for assembling and disassembling the heat sink needle card.

[0059] When in use, the wafer is placed in the wafer storage module, and the heat sink needle card is placed in the needle card storage module. The device has two working modes. When in the wafer loading mode, the wafer transfer positioning module takes out the wafer on the wafer storage module and adjusts its rotation angle, and the needle card conveying module takes out the heat sink needle card from the needle card storage module and conveys it to the wafer needle card combination module to be split into two parts, the needle card and the heat sink. The heat sink continues to move to the bottom of the wafer transfer positioning module through the needle card conveying module. After the wafer is placed on the heat sink through the wafer transfer positioning module, the needle card conveying module moves the heat sink to the wafer needle card combination module to assemble the heat sink, wafer and needle card, and then moves and stores it in the needle card storage module.

[0060] When in the wafer removal mode, the heat sink needle card containing the wafer is placed in the needle card storage module, and the needle card conveying module moves it to the wafer needle card combination module. The needle card is removed, and the heat sink and wafer continue to move to the bottom of the wafer transfer and positioning module. The wafer is sucked from the heat sink by the wafer transfer and positioning module and transferred to the wafer storage module for storage.

[0061] Through the above settings, the automatic assembly of wafers and heat sink pin cards can be realized, replacing manual operations and improving production efficiency and stability.

[0062] As an optional implementation, the wafer storage module includes a wafer plug lifting module 1, and the wafer plug lifting module 1 includes:

[0063] A plug 101 is used to carry multiple wafers;

[0064] The servo lifting mechanism 103 is arranged at the bottom of the plug 101. The fixed end of the servo lifting mechanism 103 is fixedly connected to the frame, and the movable end of the servo lifting mechanism 103 is connected to the bottom of the plug 101. The servo lifting mechanism 103 is used to lift the plug 101 to facilitate the wafer transfer positioning module to pick up and place the wafer located on the top of the plug 101.

[0065] This embodiment takes a 6-inch wafer plug as an example, places the plug 101 into the lifting and positioning area, and realizes the lifting and lowering of the plug 101 through the servo lifting mechanism 103. The sensor detects whether the placement direction of the wafer in the plug 101 meets the requirements, and then scans the wafer placement position, and locates the position to the pick-up and placement position of the wafer transfer positioning module to wait for pick-up and placement.

[0066] As an optional implementation, the wafer transfer positioning module includes:

[0067] Wafer pick-and-place robot 3, used for picking up, placing and moving wafers;

[0068] Wafer rotation rough positioning module 2, used for supporting the wafer and making rough positioning of the wafer rotation angle;

[0069] The wafer transfer precision positioning module 4 is used to support the wafer and precisely position the wafer rotation angle.

[0070] As an optional implementation, the wafer pick-and-place robot 3 includes:

[0071] Ceramic suction cup 303, used for taking and placing wafers;

[0072] The transplanting module 301 has a fixed end fixedly connected to the frame, and a movable end connected to the ceramic suction cup 303 for driving the ceramic suction cup 303 to move.

[0073] The transfer module 301 is used to drive the ceramic suction cup 303 to move horizontally. After the plug 101 with the wafer is lifted into place, the transfer module 301 moves the ceramic suction cup 303 to the bottom of the wafer. Then the servo lifting mechanism 103 lowers the plug 101 and places the wafer on the top of the ceramic suction cup 303. The ceramic suction cup 303 turns on the vacuum to check whether the vacuum threshold reaches the required value. After it is firmly sucked, the transfer module 301 drives the ceramic suction cup 303 to take out the wafer and move it to the top of the wafer rotation coarse positioning module 2.

[0074] As an optional implementation, the wafer rotation coarse positioning module 2 includes:

[0075] A coarse positioning lifting chuck 202 is used to take out or place the wafer on the ceramic chuck 303;

[0076] A jacking module 203, the fixed end of which is fixed to the frame, and the movable end of which is connected to the rough positioning lifting suction cup 202, for driving the rough positioning lifting suction cup 202 to move up and down;

[0077] The coarse positioning rotary suction cup 201 is used to take out or place the wafer on the coarse positioning lifting suction cup 202, and the coarse positioning rotary suction cup 201 rotates the wafer;

[0078] The edge-finding CCD module 204 is fixed on the frame and is located above the coarse positioning rotating chuck 201 . The edge-finding CCD module 204 cooperates with the coarse positioning rotating chuck 201 to determine the wafer rotation angle.

[0079] After the ceramic suction cup 303 moves to above the coarse positioning lifting suction cup 202, the lifting module 203 raises the coarse positioning lifting suction cup 202, lifts the wafer to make it separate from the ceramic suction cup 303, and vacuum sucks the wafer, and the transfer module 301 moves the ceramic suction cup 303 out to facilitate the coarse positioning lifting suction cup 202 to carry the wafer up and down, and the coarse positioning lifting suction cup 202 carries the wafer down to a position close to the coarse positioning rotating suction cup 201, and the coarse positioning lifting suction cup 202 is closed. After the wafer falls into the coarse positioning rotating suction cup 201, the coarse positioning rotating suction cup 201 is opened to vacuum suck the wafer, and the edge-finding CCD module 204 is used to achieve coarse positioning of the wafer.

[0080] As an optional implementation, the wafer transfer precision positioning module 4 includes:

[0081] Bernoulli chuck 402, used for picking up and placing wafers;

[0082] A linear motor XYR module 403, the fixed end of which is mounted on the frame, and a movable end of the linear motor XYR module 403 is connected to the Bernoulli suction cup 402, and the linear motor XYR module 403 is used to adjust the X / Y / R axis position of the Bernoulli suction cup 402;

[0083] The CCD positioning module 401 is disposed above the middle of the linear motor XYR module 403 and connected to the frame. The CCD positioning module 401 is used to identify the precise positioning of the wafer rotation angle.

[0084] After rough positioning, the lifting module 203 and the rough positioning lifting suction cup 202 cooperate to lift the wafer to the suction height of the wafer transfer fine positioning module 4, and the linear motor XYR module 403 drives the Bernoulli suction cup 402 to move and turn on the vacuum. The Bernoulli suction cup 402 sucks the wafer and detects the vacuum value. The rough positioning lifting suction cup 202 turns off the vacuum and resets to the bottom origin. The Bernoulli suction cup 402 moves to the bottom of the CCD positioning module 401, and the linear motor XYR module 403 cooperates with the CCD positioning module 401 to adjust the X / Y / R axis position of the Bernoulli suction cup 402 to achieve wafer fine positioning.

[0085] As an optional implementation, the needle card conveying module includes a carrier needle card conveying module 7, and the carrier needle card conveying module 7 is used for horizontal movement of the heat sink needle card.

[0086] As an optional implementation, the wafer pin card combination module includes:

[0087] The needle card heat sink lifting module 6 is arranged below the carrier needle card conveying module 7 and is used to lift the heat sink needle card;

[0088] The carrier screw automatic disassembly module 5 is arranged above the carrier needle card conveying module 7 and is used for assembling and disassembling the heat sink needle card.

[0089] As an optional implementation, the pin card heat sink lifting module 6 includes:

[0090] The heat sink positioning platform 601 is used to hold the heat sink pin card;

[0091] A heat sink lifting mechanism 603, the fixed end of which is connected to the frame, and the movable end of which is connected to the heat sink positioning platform 601, for lifting and lowering the heat sink positioning platform 601;

[0092] The waste suction sleeve 602 is arranged on the heat sink positioning platform 601 .

[0093] After the carrier needle card conveying module 7 takes out the heat sink probe from the probe card material frame lifting module 8, the carrier needle card conveying module 7 moves the heat sink probe to the bottom of the heat sink positioning platform 601, and the heat sink lifting mechanism 603 drives the heat sink positioning platform 601 to rise and lift the heat sink probe, and turns on the vacuum to adsorb the heat sink, and moves the heat sink needle card to the working range of the carrier screw automatic disassembly module 5. The screws on the heat sink needle card of the carrier screw automatic disassembly module 5 are used to separate the heat sink from the needle card, and the heat sink moves with the heat sink. The positioning table 601 descends to the carrier needle card conveying module 7, and the carrier needle card conveying module 7 moves the heat sink to the bottom of the Bernoulli suction cup 402. After the Bernoulli suction cup 402 is closed, the wafer is safely placed on the heat sink. Then the carrier needle card conveying module 7 moves the heat sink with the wafer to the bottom of the carrier screw automatic disassembly module 5 again, and the heat sink positioning table 601 lifts up the heat sink probe, and the carrier screw automatic disassembly module 5 resets the needle card and the heat sink. At this time, the wafer is installed between the needle card and the heat sink.

[0094] The waste scrap suction sleeve 602 is used to absorb the waste scraps generated when removing the screws.

[0095] As an optional implementation, the probe card storage module includes a probe card material frame lifting module 8 for storing and lifting the heat sink probe card.

[0096] In another working mode, the heat sink needle card with the wafer is placed in the probe card material frame lifting module 8, and the carrier needle card conveying module 7 takes it out and the carrier screw automatic disassembly module 5 removes the needle card. The heat sink with the wafer is moved to the bottom of the Bernoulli suction cup 402 of the wafer transfer precision positioning module 4, and the wafer is adsorbed by the Bernoulli suction cup 402 to be separated from the heat sink, and then transferred to the coarse positioning lifting suction cup 202 and the ceramic suction cup 303 to return to the plug 101.

[0097] The carrier needle card conveying module 7 and the probe card material frame lifting module 8 are both prior art. In this embodiment, the probe card material frame lifting module 8 includes a probe card material frame, a lifting platform, a lifting rod and a camera. The lifting rod is an electric lifting rod. When in use, the material frame is installed on the lifting platform, and the probe card is manually placed in the material frame, and it is confirmed that the material frame detects that the probe card is placed within the moving installation position. When the material frame moves up and down, the camera scans the number of probe cards in the material frame and records the coordinates of each layer.

[0098] The carrier needle card conveying module 7 can be selected as a multi-degree-of-freedom robotic arm, which can grab and convey the probe card from the material frame. As another embodiment, the carrier needle card conveying module 7 includes a stage, a three-axis mobile platform and a gripper, and the stage is moved to the bottom of the probe card by the three-axis mobile platform, and the probe card is fixed by the gripper, and the probe card is conveyed to the designated position by the cooperation of the three-axis mobile platform and the stage.

[0099] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0100] The embodiments described above are only descriptions of the preferred modes of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should all fall within the protection scope determined by the claims of the present invention.

Claims

1. A wafer loading and unloading device, characterized in that: Includes the rack and the following mounted on the rack: Wafer storage module, used for placing wafers; Wafer transfer and positioning module, used for wafer placement and transportation, and capable of adjusting the wafer angle; Needle card conveying module, used for taking, placing and moving heat sink needle cards; Needle card storage module, used for storing heat sink needle cards; The wafer needle card combination module is arranged on one side of the needle card conveying module, and the wafer needle card combination module is used for assembling and disassembling the heat sink needle card.

2. The wafer loading and unloading device according to claim 1, characterized in that: The wafer storage module comprises a wafer plug lifting module (1), and the wafer plug lifting module (1) comprises: A plug (101) is used to carry multiple wafers; A servo lifting mechanism (103) is arranged at the bottom of the plug (101); a fixed end of the servo lifting mechanism (103) is fixedly connected to the frame; a movable end of the servo lifting mechanism (103) is connected to the bottom of the plug (101); the servo lifting mechanism (103) is used to lift the plug (101) so as to facilitate the wafer transfer positioning module to take and place the wafer located at the top of the plug (101).

3. The wafer loading and unloading device according to claim 2, characterized in that: The wafer transfer and positioning module includes: A wafer handling robot (3), used for handling and moving wafers; A wafer rotation rough positioning module (2) is used to support the wafer and roughly position the wafer rotation angle; The wafer transfer precision positioning module (4) is used to support the wafer and precisely position the wafer rotation angle.

4. The wafer loading and unloading device according to claim 3, characterized in that: The wafer pick-and-place robot (3) comprises: A ceramic suction cup (303) for taking and placing wafers; A transplanting module (301), wherein the fixed end of the transplanting module (301) is fixedly connected to the frame, and the movable end of the transplanting module (301) is connected to the ceramic suction cup (303) for driving the ceramic suction cup (303) to move.

5. The wafer loading and unloading device according to claim 4, characterized in that: The wafer rotation coarse positioning module (2) comprises: A coarse positioning lifting suction cup (202) is used to take out a wafer or place it on the ceramic suction cup (303); A lifting module (203), a fixed end of which is fixed to the frame, and a movable end of which is connected to the rough positioning lifting suction cup (202) for driving the rough positioning lifting suction cup (202) to move up and down; A coarse positioning rotating suction cup (201) is used to take out a wafer or place it on the coarse positioning lifting suction cup (202), wherein the coarse positioning rotating suction cup (201) rotates the wafer; An edge-finding CCD module (204) is fixed on the frame and located above the coarse positioning rotating suction cup (201); the edge-finding CCD module (204) cooperates with the coarse positioning rotating suction cup (201) to determine a wafer rotation angle.

6. The wafer loading and unloading device according to claim 4, characterized in that: The wafer transfer precision positioning module (4) comprises: A Bernoulli chuck (402) for picking up and placing wafers; A linear motor XYR module (403), the fixed end of which is mounted on the frame, the movable end of which is connected to the Bernoulli suction cup (402), the linear motor XYR module (403), the linear motor XYR module (403) is used to adjust the X / Y / R axis position of the Bernoulli suction cup (402); A CCD positioning module (401) is arranged above the middle of the linear motor XYR module (403) and connected to the frame. The CCD positioning module (401) is used to identify the precise positioning of the wafer rotation angle.

7. The wafer loading and unloading device according to claim 1, characterized in that: The needle card conveying module comprises a carrier needle card conveying module (7), and the carrier needle card conveying module (7) is used for horizontal movement of the heat sink needle card.

8. The wafer loading and unloading device according to claim 7, characterized in that: The wafer-needle-card combination module comprises: A needle card heat sink lifting module (6), arranged below the carrier needle card conveying module (7), and used for lifting the heat sink needle card; The carrier screw automatic disassembly module (5) is arranged above the carrier needle card conveying module (7) and is used for assembling and disassembling the heat sink needle card.

9. The wafer loading and unloading device according to claim 8, characterized in that: The pin card heat sink lifting module (6) comprises: A heat sink positioning platform (601) is used to hold up the heat sink pin card; A heat sink lifting mechanism (603), a fixed end of which is connected to the frame, and a movable end of which is connected to the heat sink positioning platform (601), for lifting and lowering the heat sink positioning platform (601); The waste suction sleeve (602) is arranged on the heat sink positioning platform (601).

10. The wafer loading and unloading device according to claim 1, characterized in that: The probe card storage module comprises a probe card material frame lifting module (8) for storing and lifting the heat sink probe card.

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