Chip packaging structure and domain controller

Abstract

The invention discloses a chip packaging structure and a domain controller, and the chip packaging structure comprises a heating chip; the substrate is used for bearing the heating chip; the heat dissipation cover covers the substrate, so that the heating chip is located in a containing space defined by the substrate, the inner bottom wall of the heat dissipation cover and the inner side wall of the heat dissipation cover; the heat-conducting medium is clamped between the first surface, deviating from the substrate, of the heating chip and the first area of the inner bottom wall; the reinforcing structure abuts against a second area, except the first area, of the inner bottom wall, the reinforcing structure further abuts against the inner side wall, and the second surface, facing the heating chip, of the reinforcing structure meets the conditions that the distance between the part closer to the inner side wall and the second area is larger, and the distance between the part farther away from the inner side wall and the second area is smaller. According to the embodiment of the invention, the heat dissipation performance of the chip packaging structure can be ensured.

Description

Technical Field

[0001] The present disclosure relates to chip technology, and in particular to a chip packaging structure and a domain controller. Background Art

[0002] At present, chip packaging structures are widely used. The type of chip packaging structure can be, for example, a flip chip ball grid array (FCBGA) type. In the related art, the heat dissipation performance of the chip packaging structure is poor. How to improve the heat dissipation performance of the chip packaging structure is a problem worthy of attention for those skilled in the art. Summary of the invention

[0003] In order to solve the above technical problems, the present disclosure provides a chip packaging structure and a domain controller.

[0004] According to one aspect of an embodiment of the present disclosure, there is provided a chip packaging structure, including:

[0005] Heating chip;

[0006] A substrate, the substrate carrying the heat generating chip;

[0007] A heat dissipation cover, the heat dissipation cover covers the substrate so that the heat generating chip is located in a receiving space surrounded by the substrate, the inner bottom wall of the heat dissipation cover and the inner side wall of the heat dissipation cover;

[0008] A heat-conducting medium, the heat-conducting medium being sandwiched between a first surface of the heat-generating chip facing away from the substrate and a first area of ​​the inner bottom wall;

[0009] A reinforcing structure, wherein the reinforcing structure abuts against a second area of ​​the inner bottom wall except the first area, and the reinforcing structure also abuts against the inner side wall. The second surface of the reinforcing structure facing the heat generating chip satisfies: the closer the part is to the inner side wall, the greater the distance from the second area is, and the farther the part is from the inner side wall, the smaller the distance from the second area is.

[0010] According to another aspect of an embodiment of the present disclosure, a domain controller is provided, comprising the above chip packaging structure.

[0011] Based on the chip packaging structure and domain controller provided by the above-mentioned embodiments of the present disclosure, the substrate can carry the heating chip, and the heat dissipation cover and the substrate can be covered to encapsulate the heating chip in the accommodation space surrounded by the substrate, the inner bottom wall of the heat dissipation cover and the inner side wall of the heat dissipation cover. Since the heat-conducting medium is sandwiched between the first surface of the heating chip away from the substrate and the first area of ​​the inner bottom wall of the heat dissipation cover, the heat generated by the heating chip can be quickly conducted to the heat dissipation cover through the heat-conducting medium for heat dissipation. Since the reinforcing structure abuts against the second area of ​​the inner bottom wall of the heat dissipation cover and the inner side wall of the heat dissipation cover, and the second surface of the reinforcing structure facing the heating chip meets the target conditions, it is conducive to forming a triangular stable structure in the accommodation space, or forming a triangular-like stable structure, thereby improving the stiffness of the heat dissipation cover and even the entire chip packaging structure. For the chip packaging structure applied to the domain controller, during the packaging process, thermal reflow treatment is often required, and after the packaging process is completed, a series of pressure tests are often required. It should be noted that the thermal expansion coefficients of the materials of the heat-generating chip and the substrate are usually not matched. If the rigidity of the chip packaging structure is not enough, the substrate is very likely to warp after the heat reflow treatment, which will cause the heat dissipation cover and the heat-conducting medium to be delaminated, affecting the heat conduction efficiency, thereby reducing the heat dissipation performance of the chip packaging structure. In addition, during the pressure test, the fixture used to implement the pressure test will apply pressure on the heat dissipation cover, causing both the heat dissipation cover and the heat-conducting medium to deform. When the pressure is removed, the deformation recovery capabilities of the heat dissipation cover and the heat-conducting medium are inconsistent, which will also cause the heat dissipation cover and the heat-conducting medium to be delaminated, affecting the heat conduction efficiency, thereby reducing the heat dissipation performance of the chip packaging structure. In the embodiments of the present disclosure, by setting the strengthening structure, the rigidity of the heat dissipation cover and even the entire chip packaging structure can be improved, which is not only conducive to reducing the warping of the substrate caused by the heat reflow treatment, but also conducive to reducing the deformation amount that the heat dissipation cover and the heat-conducting medium need to recover after the pressure is unloaded, thereby reducing the degree of delamination between the heat dissipation cover and the heat-conducting medium, ensuring the heat conduction efficiency, and ensuring the heat dissipation performance of the chip packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic structural diagram of a chip packaging structure provided by some exemplary embodiments of the present disclosure.

[0013] Figure 2 It is a schematic structural diagram of a chip packaging structure provided by other exemplary embodiments of the present disclosure.

[0014] Figure 3 It is a schematic structural diagram of a chip packaging structure provided by some further exemplary embodiments of the present disclosure.

[0015] Figure 4 Schematic diagram of a chip packaging structure provided by some further exemplary embodiments of the present disclosure.

[0016] Figure 5 Schematic diagram of the composition of the inner bottom wall of the heat dissipation cover in some exemplary embodiments of the present disclosure.

[0017] Figure 6 is a schematic diagram of a reinforcement structure in some exemplary embodiments of the present disclosure.

[0018] Figure 7 Schematic diagram of a chip packaging structure provided by some further exemplary embodiments of the present disclosure.

[0019] Figure 8-1 is a schematic layout diagram of multiple reinforcement structures in some exemplary embodiments of the present disclosure.

[0020] Figure 8-2 is a schematic layout diagram of multiple reinforcement structures in some other exemplary embodiments of the present disclosure.

[0021] Fig. 9 It is a schematic diagram of finite element simulation results in some exemplary embodiments of the present disclosure. DETAILED DESCRIPTION

[0022] Below, the exemplary embodiments according to the present disclosure will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments of the present disclosure, and it should be understood that the present disclosure is not limited to the exemplary embodiments described here.

[0023] In the description of the present disclosure, the terms "up", "down", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present disclosure.

[0024] In the description of the present disclosure, unless otherwise clearly specified and limited, the terms "installation", "connection", "fixation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0025] An embodiment of the present disclosure provides a chip packaging structure.

[0026] Optionally, the chip packaging structure can be applied to a domain controller. It is understandable that the domain controller is a core component for implementing technologies such as assisted driving and unmanned driving in vehicles. The domain controller is a highly integrated complex circuit system. For example, the domain controller can be a circuit system that integrates a power module, a control module, a sensor module, an electronic control unit, etc.

[0027] Of course, according to actual needs, the chip packaging structure can also be applied to other devices or systems besides the domain controller, and the present disclosure does not limit this. For ease of understanding, the following description is based on the case where the chip packaging structure is applied to the domain controller as an example.

[0028] like Figures 1 to 4 As shown, the chip packaging structure includes:

[0029] Heat generating chip 10;

[0030] A substrate 20 , the substrate 20 carries the heat generating chip 10 ;

[0031] The heat dissipation cover 30 is covered with the substrate 20 so that the heat generating chip 10 is located in the accommodation space surrounded by the substrate 20, the inner bottom wall 305 of the heat dissipation cover 30 and the inner side wall 307 of the heat dissipation cover 30;

[0032] The heat-conducting medium 40 is sandwiched between the first surface 101 of the heat-generating chip 10 facing away from the substrate 20 and the first area 3051 of the inner bottom wall 305;

[0033] The reinforcing structure 50 abuts against the second area 3053 of the inner bottom wall 305 except the first area 3051. The reinforcing structure 50 also abuts against the inner side wall 307. The second surface 501 of the reinforcing structure 50 facing the heat generating chip 10 satisfies the following target conditions: the closer the portion to the inner side wall 307 is, the greater the distance from the second area 3053 is, and the farther the portion from the inner side wall 307 is, the smaller the distance from the second area 3053 is.

[0034] Optionally, the heat generating chip 10 may be a chip that generates a large amount of heat during operation. For example, the heat generating chip 10 may be an intelligent driving chip.

[0035] Optionally, the substrate 20 may be a support for mounting components, and may also be referred to as a carrier of components. The components mentioned here may include, but are not limited to, a heating chip 10, an electronic component 60 mentioned below, and the like. The substrate 20 may carry the heating chip 10 on its top surface, and the heating chip 10 may be fixed to the substrate 20. For example, a plurality of micro-bumps 102 may be provided at the lower end of the heating chip 10, and the micro-bumps 102 may be welded to the substrate 20 to achieve the fixing of the heating chip 10 on the substrate 20.

[0036] Optionally, the heat dissipation cover 30 may be a cover structure having the functions of heat transfer, support, and assisting in forming a receiving space. The heat dissipation cover 30 may include:

[0037] A heat spreader 308, the heat spreader 308 comprises an upper surface and a lower surface arranged in parallel;

[0038] The base 309 extends from the lower surface of the heat spreader 308 in a direction away from the upper surface of the heat spreader 308 . The base 309 has a central through hole 3092 . The central through hole 3092 is a square hole. The bottom wall of the central through hole 3092 is flush with the lower surface of the heat spreader 308 .

[0039] When the heat dissipation cover 30 is composed of the above structure, the bottom wall of the central through hole 3092 can be used as the inner bottom wall 305 of the heat dissipation cover 30, and the side wall of the central through hole 3092 can be used as the inner side wall 307 of the heat dissipation cover 30. The heat spreader 308, the base 309, and the substrate 20 can be arranged in a central position, and the lower surface of the base 309 and the upper surface of the substrate 20 can be bonded by the adhesive 70, so that the heat dissipation cover 30 and the substrate 20 can be covered, and accordingly, the substrate 20, the inner bottom wall 305 of the heat dissipation cover 30, and the inner side wall 307 of the heat dissipation cover 30 can enclose a receiving space for receiving the heat generating chip 10.

[0040] Optionally, the heat-conducting medium 40 may be a medium with good thermal conductivity, and the heat-conducting medium 40 may also be called a thermal interface material. The heat-conducting medium 40 may include but is not limited to silica gel, thermal grease, thermal gel, etc. The heat-conducting medium 40 may be sandwiched between the first surface 101 of the heating chip 10 away from the substrate 20 and the first area 3051 of the inner bottom wall 305 of the heat dissipation cover 30. The first surface 101 of the heating chip 10 away from the substrate 20 may be the upper surface of the heating chip 10. The first area 3051 of the inner bottom wall 305 of the heat dissipation cover 30 may be the projection area of ​​the heating chip 10 on the inner bottom wall 305 of the heat dissipation cover 30, and the projection area may be a rectangular area. The remaining area of ​​the inner bottom wall 305 of the heat dissipation cover 30 except the first area 3051 may be collectively referred to as the second area 3053. The specific composition of the inner bottom wall 305 of the heat dissipation cover 30 may be referred to. Figure 5 .

[0041] Optionally, the reinforcement structure 50 may be a structure capable of increasing the rigidity of the heat dissipation cover 30 and even the entire chip packaging structure. The reinforcement structure 50 may include a second surface 501 facing the heat generating chip 10. The second surface 501 may be either a plane or a curved surface, and the curved surface may be either a convex surface or a concave surface. The remaining components of the reinforcement structure 50 except the second surface 501 may all be located in the space defined by the second region 3053, the inner side wall 307 and the second surface 501. The second surface 501 may meet the target conditions mentioned above. For example, Figure 1 As shown, the second surface 501 may include part B1, part B2 and part B3, wherein part B1 is closest to the inner wall 307 and part B3 is farthest from the inner wall 307. Then, part B1 is at the largest distance from the second area 3053, part B2 is at the second smallest distance from the second area 3053, and part B3 is at the smallest distance from the second area 3053.

[0042] In one example, the reinforcement structure 50 may be a solid structure. The reinforcement structure 50 may be similar to Figure 6 The reinforcing rib shown has a pentahedral structure; wherein one straight side of the reinforcing rib can abut against the second region 3053 , another straight side of the reinforcing rib can abut against the inner wall 307 , and the outer surface of the oblique side of the reinforcing rib can serve as the second surface 501 .

[0043] In another example, the reinforcing structure 50 may be a hollow structure, and the reinforcing structure 50 may be an inclined reinforcing plate; wherein one end of the reinforcing plate may abut against the second area 3053, and the other end of the reinforcing plate may abut against the inner wall 307, and an outer surface of the reinforcing plate may serve as the second surface 501.

[0044] In the embodiment of the present disclosure, the substrate 20 can carry the heating chip 10, and the heat dissipation cover 30 and the substrate 20 can be covered to encapsulate the heating chip 10 in the accommodation space surrounded by the substrate 20, the inner bottom wall 305 of the heat dissipation cover 30, and the inner side wall 307 of the heat dissipation cover 30. Since the heat-conducting medium 40 is sandwiched between the first surface 101 of the heating chip 10 facing away from the substrate 20 and the first area 3051 of the inner bottom wall 305 of the heat dissipation cover 30, through the heat conduction effect of the heat-conducting medium 40, the heat generated by the heating chip 10 can be quickly conducted to the heat dissipation cover 30 through the heat-conducting medium 40 for heat dissipation. For example, after being conducted to the heat dissipation cover 30, the heat can be further conducted to a radiator (such as a finned radiator) in contact with the outer wall of the heat dissipation cover 30, and then dissipated to the external environment through the radiator. Since the reinforcing structure 50 abuts against the second area 3053 of the inner bottom wall 305 of the heat dissipation cover 30 and the inner side wall 307 of the heat dissipation cover 30, and the second surface 501 of the reinforcing structure 50 facing the heat generating chip 10 meets the target condition, it is beneficial to form a triangular stable structure in the accommodation space (see Figure 1 , Figure 2 ), or form a stable triangle-like structure (see Figure 3 , Figure 4 ), thereby improving the rigidity of the heat dissipation cover 30 and even the entire chip packaging structure.

[0045] For the chip packaging structure used in the domain controller, during the packaging process, a heat reflow treatment (for example, a heat reflow treatment at a temperature of up to 260 degrees Celsius) is often required. After the packaging process is completed, a series of stress tests (for example, Burn In, Final Test, System Level Test, etc.) are often required. It should be noted that the thermal expansion coefficients of the materials of the heat-generating chip 10 and the substrate 20 are usually not matched. If the rigidity of the chip packaging structure is not enough, the substrate 20 is very easy to warp after the heat reflow treatment, which will cause the heat dissipation cover 30 and the heat-conducting medium 40 to be delaminated, affecting the heat conduction efficiency, thereby reducing the heat dissipation performance of the chip packaging structure. In addition, during the stress test, the fixture used to implement the stress test will apply pressure on the heat dissipation cover 30, causing both the heat dissipation cover 30 and the heat-conducting medium 40 to deform. When the pressure is removed, the deformation recovery capabilities of the heat dissipation cover 30 and the heat-conducting medium 40 are inconsistent, which will also cause the heat dissipation cover 30 and the heat-conducting medium 40 to be delaminated, affecting the heat conduction efficiency, thereby reducing the heat dissipation performance of the chip packaging structure. In the embodiment of the present disclosure, by setting up the reinforcement structure 50, the stiffness of the heat dissipation cover 30 and even the entire chip packaging structure can be improved, which is not only beneficial to reducing the warping of the substrate 20 caused by the heat reflow process, but also beneficial to reducing the deformation amount that the heat dissipation cover 30 and the heat conductive medium 40 need to recover after the pressure is unloaded, thereby reducing the degree of stratification between the heat dissipation cover 30 and the heat conductive medium 40, ensuring the heat conduction efficiency, and ensuring the heat dissipation performance of the chip packaging structure.

[0046] In some optional examples, such as Figures 1 to 4 As shown, the chip packaging structure also includes:

[0047] The electronic component 60 is carried by the substrate 20 , and there is a gap between the electronic component 60 and the reinforcement structure 50 .

[0048] Optionally, the electronic components 60 may include, but are not limited to, resistors, capacitors, inductors, diodes, transistors, etc., which are not listed here one by one. The number of electronic components 60 may be two, three, four, or more than four, which are not listed here one by one. For ease of understanding, only a single electronic component 60 is further introduced below.

[0049] Optionally, the substrate 20 may carry an electronic component 60 on its top surface, and the electronic component 60 may be fixed to the substrate 20. For example, the electronic component 60 may be fixed to the substrate 20 by welding.

[0050] In the embodiment of the present disclosure, there is a gap between the electronic components 60 carried by the substrate 20 and the reinforcement structure 50, that is, the electronic components 60 are not in direct contact with the reinforcement structure 50, which means that the reinforcement structure 50 can avoid the electronic components 60 to prevent the reinforcement structure 50 from affecting the electronic components 60. This is conducive to ensuring the normal and reliable operation of the electronic components 60 and even the entire chip packaging structure.

[0051] In some optional examples, such as Figure 1 , Figure 2 As shown, the second surface 501 is a plane, and the slope of the plane is adapted to the structural parameters of the electronic component 60 and the layout of the electronic component 60 relative to the substrate 20 , so as to facilitate a gap between the electronic component 60 and the reinforcement structure 50 .

[0052] Optionally, the structural parameters of the electronic component 60 may include, but are not limited to, shape parameters, size parameters, etc. of the electronic component 60. The shape parameter may be used to characterize that the electronic component 60 is cylindrical, rectangular, sheet-shaped, etc., which are not listed here one by one. If the shape parameter is used to characterize that the electronic component 60 is cylindrical, the size parameter may include diameter and height. If the shape parameter is used to characterize that the electronic component 60 is rectangular, the size parameter may include length, width, and height.

[0053] Optionally, the layout of the electronic components 60 relative to the substrate 20 may be used to characterize the arrangement position of the electronic components 60 on the substrate 20. As an example, the arrangement position may be characterized by two-dimensional coordinates.

[0054] It should be noted that if the second surface 501 is a plane, the structural parameters of the electronic components 60 are fixed, and the layout of the electronic components 60 relative to the substrate 20 is fixed, when the second surface 501 adopts different slopes, the size of the space between the second surface 501 and the electronic components 60 is different. If the second surface 501 is a plane, the slope of the second surface 501 is fixed, and the structural parameters of the electronic components 60 are fixed, when the electronic components 60 adopt different layouts relative to the substrate 20 (for example, when the electronic components 60 move horizontally to the left or right), the size of the space between the second surface 501 and the electronic components 60 is different. If the second surface 501 is a plane, the slope of the second surface 501 is fixed, and the layout of the electronic components 60 relative to the substrate 20 is fixed, when the structural parameters of the electronic components 60 are different (for example, the height is doubled or reduced by half), the size of the space between the second surface 501 and the electronic components 60 is different.

[0055] As can be seen from the discussion in the previous paragraph, when the second surface 501 is a plane, the slope of the second plane 501, the structural parameters of the electronic component 60, and the layout of the electronic component 60 relative to the substrate 20 may all affect the size of the space between the second surface 501 and the electronic component 60. In view of this, the slope of the second plane 501 can be set to be compatible with the structural parameters of the electronic component 60 and the layout of the electronic component 60 relative to the substrate 20, so that the reinforcement structure 50 and the electronic component 60 do not contact each other, but maintain a certain gap. In this way, the reinforcement structure 50 can effectively avoid the electronic component 60, which is conducive to ensuring the normal and reliable operation of the electronic component 60 and even the entire chip packaging structure.

[0056] In some optional examples, such as Figure 3 , Figure 4 As shown, the second surface 501 is a curved surface, and the curvature of the curved surface is adapted to the structural parameters of the electronic component 60 and the layout of the electronic component 60 relative to the substrate 20 , so as to facilitate a gap between the electronic component 60 and the reinforcement structure 50 .

[0057] Optionally, the structural parameters of the electronic component 60 and the layout of the electronic component 60 relative to the substrate 20 may refer to the relevant introduction above, and will not be repeated here.

[0058] It should be noted that if the second surface 501 is a curved surface, the structural parameters of the electronic component 60 are fixed, and the layout of the electronic component 60 relative to the substrate 20 is fixed, when the second surface 501 adopts different curvatures, the size of the space between the second surface 501 and the electronic component 60 is different. If the second surface 501 is a curved surface, the curvature of the second surface 501 is fixed, and the structural parameters of the electronic component 60 are fixed, when the electronic component 60 adopts different layouts relative to the substrate 20 (for example, when the electronic component 60 moves horizontally to the left or right), the size of the space between the second surface 501 and the electronic component 60 is different. If the second surface 501 is a curved surface, the curvature of the second surface 501 is fixed, and the layout of the electronic component 60 relative to the substrate 20 is fixed, when the structural parameters of the electronic component 60 are different (for example, the height is doubled or reduced by half), the size of the space between the second surface 501 and the electronic component 60 is different.

[0059] As can be seen from the discussion in the previous paragraph, when the second surface 501 is a curvature, the curvature of the second plane 501, the structural parameters of the electronic component 60, and the layout of the electronic component 60 relative to the substrate 20 may all affect the size of the space between the second surface 501 and the electronic component 60. In view of this, the curvature of the second plane 501 can be set to be compatible with the structural parameters of the electronic component 60 and the layout of the electronic component 60 relative to the substrate 20, so that the reinforcement structure 50 and the electronic component 60 do not contact each other, but maintain a certain gap. In this way, the reinforcement structure 50 can effectively avoid the electronic component 60, which is conducive to ensuring the normal and reliable operation of the electronic component 60 and even the entire chip packaging structure.

[0060] In some optional examples, such as Figure 7 As shown, the reinforcement structure 50 is a solid structure, and the reinforcement structure 50 is provided with a weight-reducing groove 505 whose notch is located on the second surface 501. The setting position of the weight-reducing groove 505 on the reinforcement structure 50 corresponds to the setting position of the electronic component 60 on the substrate 20. The electronic component 60 partially extends into the weight-reducing groove 505, and there is a gap between the part extending into the weight-reducing groove 505 and the inner wall of the weight-reducing groove 505.

[0061] Optionally, the setting position of the weight-reducing groove 505 on the reinforcement structure 50 corresponds to the setting position of the electronic component 60 on the substrate 20, which can be understood as follows: if the setting position of the weight-reducing groove 505 on the reinforcement structure 50 is projected onto the upper surface of the substrate 20 to obtain the projection position, the projection position and the setting position of the electronic component 60 on the substrate 20 can be the same or substantially the same position.

[0062] In the embodiment of the present disclosure, when the reinforcing structure 50 is a solid structure, the weight of the chip packaging structure can be reduced by setting the weight-reducing groove 505 while ensuring the overall rigidity of the chip packaging structure. In addition, the electronic component 60 can be partially extended into the weight-reducing groove 505, and there is a gap between the part extending into the weight-reducing groove 505 and the inner wall of the weight-reducing groove 505, so that on the one hand, the electronic component 60 can be accommodated, and on the other hand, a certain gap can be maintained between the reinforcing structure 50 and the electronic component 60. Therefore, by using the embodiment of the present disclosure, by reusing the weight-reducing groove 505, the reinforcing structure 50 can effectively avoid the electronic component 60, which is conducive to ensuring the normal and reliable operation of the electronic component 60 and even the entire chip packaging structure.

[0063] In some optional examples, such as Figures 1 to 4 As shown, there is a gap between the reinforcement structure 50 and the heat-conducting medium 40 , and there is a gap between the reinforcement structure 50 and the heat-generating chip 10 .

[0064] It should be noted that the gap size between the reinforcement structure 50 and the heat-conducting medium 40, and the gap size between the reinforcement structure 50 and the heat-generating chip 10 can be set according to actual needs while ensuring the rigidity of the chip packaging structure, and the present disclosure does not limit this.

[0065] In the embodiment of the present disclosure, the reinforcing structure 50 and the heat-conducting medium 40 may not be in direct contact, but a certain gap may be maintained. Similarly, the reinforcing structure 50 and the heat-generating chip 10 may not be in direct contact, but a certain gap may be maintained. In this way, the force on the reinforcing structure 50 will not be transmitted to the heat-conducting medium 40 and the heat-generating chip 10, which is conducive to avoiding the delamination of the heat-conducting medium 40 and the heat-generating chip 10 caused by the force, thereby ensuring the heat dissipation performance of the chip packaging structure.

[0066] In some optional examples, the height of the projection of the reinforcement structure 50 on the inner sidewall 307 is less than or equal to the height of the inner sidewall 307 .

[0067] Optionally, the heat dissipation cover 30 may include: a heat spreader 308 and a base 309 , and the height of the inner wall 307 may be understood as the protruding height of the base 309 relative to the heat spreader 308 .

[0068] like Figure 1 , Figure 3 As shown, the height of the projection of the reinforcement structure 50 on the inner sidewall 307 can be equal to the height of the inner sidewall 307. In this way, it can be considered that the reinforcement structure 50 is connected to the lower surface of the base 309, and the size of the reinforcement structure 50 can be as large as possible, which is conducive to ensuring the rigidity of the chip packaging structure.

[0069] like Figure 2 , Figure 4As shown, the height of the projection of the reinforcing structure 50 on the inner side wall 307 can be less than the height of the inner side wall 307. In this way, it can be considered that the reinforcing structure 50 is not connected to the lower surface of the base 309, compared to Figure 1 , Figure 3 In the illustrated case, the size of the reinforcement structure 50 is relatively small, so that more space can be left between the reinforcement structure 50 and the substrate 20 , which is conducive to the reinforcement structure 50 avoiding the electronic components 60 .

[0070] In some optional examples, there are multiple reinforcement structures 50 , and the multiple reinforcement structures 50 are symmetrically distributed relative to the first area 3051 .

[0071] Alternatively, if the reinforcement structure 50 is a solid structure, such as Figure 8-1 As shown, at least one reinforcing structure 50 may be respectively distributed on the front side, the rear side, the left side, and the right side of the first region 3051. If the reinforcing structure 50 is a hollow structure, such as Figure 8-2 As shown, a reinforcement structure 50 may be distributed on the front side, the rear side, the left side, and the right side of the first area 3051 , respectively.

[0072] In the embodiment of the present disclosure, the rigidity of the chip packaging structure can be effectively improved through the joint action of multiple reinforcement structures 50. In addition, the multiple reinforcement structures 50 can be symmetrically distributed relative to the first area 3051, which is conducive to ensuring the overall force uniformity of the chip packaging structure.

[0073] In some optional examples, the heat dissipation cover 30 and the reinforcement structure 50 can be integrally formed. For example, the heat dissipation cover 30 and the reinforcement structure 50 can be integrally cut and formed. In this way, the manufacturing process of the heat dissipation cover 30 and the reinforcement structure 50 is simple and the processing cost is low. Of course, the heat dissipation cover 30 and the reinforcement structure 50 can also be formed separately and then fixed together by welding or other methods.

[0074] In some optional examples, the heat dissipation cover 30 can be made of copper material. For example, the heat dissipation cover 30 can be made of red copper (i.e. pure copper) material or brass (i.e. copper alloy) material. It is understandable that copper material has good heat dissipation performance. Thus, the heat dissipation cover 30 made of copper material is conducive to ensuring the heat dissipation performance of the chip packaging structure.

[0075] In some optional examples, the heat dissipation cover 30 may be a cover structure plated with an anti-oxidation layer. For example, the heat dissipation cover 30 may be a cover structure plated with a nickel layer. The thickness of the nickel layer may be between 2 microns and 9 microns. For example, the thickness of the nickel layer may be 2 microns, 3 microns, 6 microns, 7 microns, 9 microns, etc., which are not listed here one by one. By setting the anti-oxidation layer, the heat dissipation cover 30 can be prevented from oxidative corrosion, which is conducive to improving the service life of the heat dissipation cover 30.

[0076] In some optional examples, at least two heating chips 10 are located in the same accommodation space. For example, two, three or more heating chips 10 can be accommodated in the same accommodation space. In this way, different heating chips 10 can share the same heat dissipation cover 30 and the same reinforcement structure 50, which is conducive to saving materials and reducing manufacturing costs. Of course, only one heating chip 10 can be accommodated in the same accommodation space.

[0077] In some optional examples, the following process flow may be used to manufacture a chip packaging structure:

[0078] (1) The heating chip 10 is interconnected with the substrate 20 by a flip-chip process. For example, the micro-bumps 102 provided at the lower end of the heating chip 10 can be welded to the substrate 20 to achieve interconnection between the heating chip 10 and the substrate 20.

[0079] (2) After the interconnected heat generating chip 10 and substrate 20 are baked at 125 degrees Celsius for 1 to 2 hours, plasma cleaning is performed.

[0080] (3) Fill the gap between the lower end of the heat generating chip 10 and the substrate 20 with bottom filling glue through a dispensing process, and continue to bake at 125 degrees Celsius for 1 to 2 hours to solidify the bottom filling glue.

[0081] (4) Through the glue dispensing process, the heat conductive medium 40 is coated on the upper surface of the heat generating chip 10, and the adhesive 70 is coated on the edge of the upper surface of the substrate 20. Then, the integrally formed heat dissipation cover 30 and the reinforcement structure 50 are turned upside down on the substrate 20, and then baked at 150 degrees Celsius for 1 to 2 hours to cure the adhesive 70.

[0082] Optionally, the length of the heat generating chip 10 may be 18 mm, the width may be 16 mm, and the thickness may be 0.775 mm. The length and width of the substrate 20 may be 37.5 mm, and the thickness may be 1.3175 mm. The thickness of the heat conducting medium 40 may be 100 μm. The thickness of the heat spreader 308 included in the heat dissipation cover 30 may be 1 mm. The second surface 501 of the reinforcement structure 50 may be a flat surface or a curved surface. Figure 1 , Figure 2 In the case of the plane shown, the reinforcement structure 50 can also be called a triangular reinforcement structure. Figure 3 , Figure 4 In the case of the curved surface shown, the reinforcement structure 50 may also be referred to as a rounded corner reinforcement structure.

[0083] The inventors found through finite element simulation that during the pressure test, when the test pressure is 876N (Newton), the compression deformation of the standard heat spreader in the related art can be referred to Fig. 9 The curve 910 in FIG. 1 shows the compression deformation of the heat spreader 308 included in the heat dissipation cover 30 in the embodiment of the present disclosure. Fig. 9 Curve 920 in . Fig. 9 The horizontal axis in represents the position along the diagonal line of the heat spreader surface. Fig. 9 The vertical axis in the figure represents the compressive deformation. Fig. 9 It can be seen that the maximum deformation of the standard heat spreader in the related art is 70 microns, while the maximum deformation of the heat spreader 308 included in the heat dissipation cover 30 in the embodiment of the present disclosure is 43 microns. It is obvious that the compressive resistance of the heat spreader 308 is improved by 38% compared with the standard heat spreader. Therefore, it is beneficial to reduce the deformation amount that the heat spreader 308 and the heat conductive medium 40 need to recover after pressure unloading, thereby alleviating the degree of stratification between the heat spreader 308 and the heat conductive medium 40.

[0084] The inventors also found through finite element simulation that the warping of the substrate in the related art at 25 degrees Celsius and 260 degrees Celsius is 108 microns and 50 microns respectively, while the warping of the substrate 20 in the embodiment of the present disclosure at 25 degrees Celsius and 260 degrees Celsius is 101 microns and 47 microns respectively. It is obvious that the warping of the substrate 20 is reduced by 6% compared with the substrate in the related art, which is beneficial to alleviate the degree of stratification between the heat spreader 308 and the thermal conductive medium 40.

[0085] In summary, the embodiments of the present disclosure can improve the rigidity of the chip packaging structure, solve the delamination problem between the heat dissipation cover 30 and the heat conductive medium 40, thereby improving the heat conduction efficiency and ensuring the heat dissipation performance of the chip packaging structure.

[0086] The embodiment of the present disclosure also provides a domain controller, including the chip packaging structure in any of the above embodiments. The specific implementation of the chip packaging structure can refer to the above introduction. Since the chip packaging structure has the above technical effects, the domain controller including the chip packaging structure also has corresponding technical effects, which will not be repeated here.

[0087] It should be noted that the various optional embodiments and optional implementation methods disclosed above can be flexibly selected and combined as needed to achieve corresponding functions and effects, and the present disclosure does not list them one by one.

[0088] The basic principles of the present disclosure are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present disclosure are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present disclosure. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, and are not limitations. The above details do not limit the present disclosure to the necessity of adopting the above specific details to be implemented.

[0089] Each embodiment in this specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referenced to each other.

[0090] Those skilled in the art may make various changes and modifications to the present disclosure without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the present disclosure claims and their equivalents, the present disclosure is also intended to include these modifications and variations.

Claims

1. A chip packaging structure, comprising: Heat generating chip (10); A substrate (20), the substrate (20) carrying the heat generating chip (10); a heat dissipation cover (30), the heat dissipation cover (30) covering the substrate (20) so that the heat generating chip (10) is located in a receiving space surrounded by the substrate (20), an inner bottom wall (305) of the heat dissipation cover (30) and an inner side wall (307) of the heat dissipation cover (30); A heat-conducting medium (40), the heat-conducting medium (40) being sandwiched between a first surface (101) of the heat-generating chip (10) facing away from the substrate (20) and a first area (3051) of the inner bottom wall (305); A reinforcing structure (50), wherein the reinforcing structure (50) abuts against a second area (3053) of the inner bottom wall (305) other than the first area (3051), and the reinforcing structure (50) also abuts against the inner side wall (307). The second surface (501) of the reinforcing structure (50) facing the heat generating chip (10) satisfies the following conditions: the closer the portion is to the inner side wall (307), the greater the distance from the second area (3053), and the farther the portion is from the inner side wall (307), the smaller the distance from the second area (3053).

2. The chip packaging structure according to claim 1, further comprising: An electronic component (60), the substrate (20) carries the electronic component (60), and a gap is provided between the electronic component (60) and the reinforcement structure (50).

3. The chip packaging structure according to claim 2, wherein: The second surface (501) is a plane, and the slope of the plane is adapted to the structural parameters of the electronic component (60) and the layout of the electronic component (60) relative to the substrate (20), so as to facilitate a gap between the electronic component (60) and the reinforcement structure (50).

4. The chip packaging structure according to claim 2, wherein: The second surface (501) is a curved surface, the curvature of which is adapted to the structural parameters of the electronic component (60) and the layout of the electronic component (60) relative to the substrate (20), so as to facilitate a gap between the electronic component (60) and the reinforcement structure (50).

5. The chip packaging structure according to claim 2, wherein: The reinforcing structure (50) is a solid structure, and the reinforcing structure (50) is provided with a weight-reducing groove (505) whose notch is located on the second surface (501); the setting position of the weight-reducing groove (505) on the reinforcing structure (50) corresponds to the setting position of the electronic component (60) on the substrate (20); the electronic component (60) partially extends into the weight-reducing groove (505), and there is a gap between the part extending into the weight-reducing groove (505) and the inner wall of the weight-reducing groove (505).

6. The chip packaging structure according to claim 1, wherein: There is a gap between the reinforcement structure (50) and the heat-conducting medium (40), and there is a gap between the reinforcement structure (50) and the heat-generating chip (10).

7. The chip packaging structure according to any one of claims 1 to 6, wherein: The height of the projection of the reinforcing structure (50) on the inner side wall (307) is less than or equal to the height of the inner side wall (307); and / or, The number of the reinforcing structures (50) is multiple, and the multiple reinforcing structures (50) are symmetrically distributed relative to the first area (3051).

8. The chip packaging structure according to any one of claims 1 to 6, wherein: The heat dissipation cover (30) and the reinforcement structure (50) are integrally formed; and / or, The heat dissipation cover (30) is made of copper material; and / or, The heat dissipation cover (30) is a cover structure plated with an anti-oxidation layer.

9. The chip packaging structure according to any one of claims 1 to 6, wherein: At least two of the heating chips (10) are located in the same accommodation space.

10. A domain controller, comprising the chip packaging structure according to any one of claims 1-9.

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