Power module heat dissipation structure and power module packaging structure

Abstract

The embodiment of the invention discloses a power module heat dissipation structure and a power module packaging structure. The power module heat dissipation structure is provided with a sealed space, the sealed space is used for placing N power modules, and the value of N comprises an integer greater than or equal to 1; the phase change insulating liquid is located in the sealed space, and the sum of the volume of the phase change insulating liquid and the volume of the power module is smaller than the volume of the sealed space; the phase-change insulating liquid is used for absorbing heat of the power module from a liquid state to a gas state, and the phase-change insulating liquid is used for transferring the heat out of the sealed space and then changing the heat from the gas state to the liquid state. According to the technical scheme, the heat dissipation capability of the power module heat dissipation structure is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a power module heat dissipation structure and a power module packaging structure. Background Art

[0002] The HPD (Hybrid PACK Drive Module) power module with existing automotive-grade IGBT or SiC MOSFET is a compact power module for traction applications in hybrid and electric vehicles. It provides a scalable power range of 100kW to 250kW within the 750V and 1200V levels.

[0003] The power module heat dissipation structure adopts a single-sided direct water cooling heat dissipation method, which supports high-power applications. However, the single-sided direct water cooling heat dissipation structure has limited heat dissipation for the power module. Summary of the invention

[0004] The present invention provides a power module heat dissipation structure and a power module packaging structure to improve the heat dissipation capacity of the power module heat dissipation structure.

[0005] According to one aspect of the present invention, a power module heat dissipation structure is provided, which is provided with a sealed space.

[0006] The sealed space is used to place N power modules, where the value of N includes an integer greater than or equal to 1;

[0007] Phase-change insulating liquid, the phase-change insulating liquid is located in the sealed space, the sum of the volume of the phase-change insulating liquid and the volume of the power module is less than the volume of the sealed space; the phase-change insulating liquid is used to absorb the heat of the power module and change from liquid to gas, and the phase-change insulating liquid is used to transfer the heat out of the sealed space and then change from gas to liquid.

[0008] According to another aspect of the present invention, there is provided a power module packaging structure, comprising any power module heat dissipation structure described in the present invention and N power modules, wherein the value of N includes an integer greater than or equal to 1;

[0009] The power module is fixed to the power module heat dissipation structure and dissipates heat through the power module heat dissipation structure.

[0010] The embodiment of the present invention provides a power module heat dissipation structure and a power module packaging structure. The power module heat dissipation structure is provided with a sealed space, a power module is provided in the sealed space, and a phase-change insulating liquid is provided in the sealed space, so that active heat dissipation is realized, the transient heat dissipation capability of the power module heat dissipation structure is improved, and the robustness and reliability of the power module are improved. The heat dissipation process of the phase-change insulating liquid is as follows: the heat generated by the power module during operation is transferred to the phase-change insulating liquid in contact with the power module, the phase-change insulating liquid reaches the boiling point after absorbing the heat, the phase-change insulating liquid undergoes a liquid-gas phase change, and the phase-change insulating liquid is transformed from a liquid state to a gas state. The gaseous phase-change insulating liquid contacts other structures or media outside the sealed space, and after releasing the heat out of the sealed space, the phase-change insulating liquid undergoes a secondary phase change, and is transformed from a gas state to a liquid state.

[0011] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0013] Figure 1 is a schematic structural diagram of a power module heat dissipation structure provided by an embodiment of the present invention;

[0014] Figure 2 yes Figure 1 Partial structural diagram of the structure of the medium power module, phase change insulating liquid and second heat sink. DETAILED DESCRIPTION

[0015] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0016] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0017] In order to improve the heat dissipation capability of the power module heat dissipation structure, the embodiment of the present invention provides the following technical solutions:

[0018] Figure 1 is a schematic structural diagram of a power module heat dissipation structure provided by an embodiment of the present invention, Figure 2 yes Figure 1 Partial structural diagram of the structure of the medium power module, phase change insulating liquid and the second heat sink, refer to Figure 1 Combined with Figure 2 The power module heat dissipation structure is provided with a sealed space, the sealed space is used to place N power modules 200, and the value of N includes an integer greater than or equal to 1; the phase change insulating liquid 500, the phase change insulating liquid 500 is located in the sealed space, and the sum of the volume of the phase change insulating liquid 500 and the volume of the power module 200 is less than the volume of the sealed space; the phase change insulating liquid 500 is used to absorb the heat of the power module 200 and change from liquid to gas, and the phase change insulating liquid 500 is used to transfer the heat out of the sealed space and then change from gas to liquid.

[0019] Exemplarily, the phase-change insulating fluid 500 includes fluorinated fluid and silicone oil.

[0020] The power module heat dissipation structure provided in the embodiment of the present invention is provided with a sealed space, a power module 200 is provided in the sealed space, and a phase-change insulating liquid 500 is provided in the sealed space, so that active heat dissipation is realized, the transient heat dissipation capability of the power module heat dissipation structure is improved, and the robustness and reliability of the power module are improved. Among them, the phase-change heat dissipation process of the phase-change insulating liquid 500 is as follows: the heat generated by the power module 200 during operation is transferred to the phase-change insulating liquid 500 in contact with the power module 200, and the phase-change insulating liquid 500 reaches the boiling point after absorbing the heat, and the phase-change insulating liquid 500 undergoes a liquid-gas phase change, and the phase-change insulating liquid 500 is transformed from a liquid state to a gas state. The gaseous phase-change insulating liquid 500 contacts other structures or media outside the sealed space, and after releasing the heat out of the sealed space, the phase-change insulating liquid 500 undergoes a secondary phase change, and is transformed from a gas state to a liquid state.

[0021] Optionally, based on the above technical solution, Figure 1 and Figure 2 As shown, the sealed space is a space formed by the first heat sink 100, the second heat sink 300 and the sealed connection assembly 400. The sealed connection assembly 400 is located between the first heat sink 100 and the second heat sink 300 and surrounds the power module 200. The phase change insulating liquid 500 is used to transfer heat to the second heat sink 300 and then change from gas to liquid.

[0022] Optionally, the sealing connection assembly 400 includes an injection molded shell and a sealant, wherein the injection molded shell is a high temperature resistant injection molded shell, and the heat generated by the power module 200 is not sufficient to cause the injection molded shell to deform. The injection molded shell is formed by a high temperature injection molding process and is arranged around the power module 200. A threaded hole is provided in the injection molded shell, and is threadedly connected to the first radiator 100 and the second radiator 300 by fasteners such as screws and a sealant to achieve a sealed connection between the injection molded shell and the first radiator 100 and the second radiator 300. The sealant is used to seal the gap between the injection molded shell and the first radiator 100 and the second radiator 300.

[0023] Optionally, the power module 200 is fixed to one side of the first heat sink 100 by large-area welding or sintering process. The signal terminal of the power module 200 is bonded to the signal terminal of the injection molded housing by copper wire or aluminum wire, and the power terminal of the power module 200 is fixed to the power terminal of the injection molded housing by ultrasonic bonding or laser welding.

[0024] Among them, the phase change insulating liquid 500 located in the sealed space between the sealed connection component 400, the power module 200 and the second heat sink 300 is an active heat dissipation structure. Active heat dissipation is achieved through the high-temperature phase change of the phase change insulating liquid 500, so that the junction temperature of the power module 200 is constant and adjustable, thereby reducing the thermal resistance of the power chip in the power module 200.

[0025] Optionally, based on the above technical solution, a first coolant channel 101 is arranged inside the first radiator 100, and a plurality of first heat dissipation pin fins 102 are arranged inside the first coolant channel 101; one side of the first radiator 100 is used to fix N power modules 200, and the value of N includes an integer greater than or equal to 1.

[0026] The first heat dissipation pin-fin 102 is a pin-fin structure, which can improve the heat dissipation effect when the coolant passes through.

[0027] Specifically, a first coolant channel 101 is provided in the first radiator 100, and a plurality of first heat dissipation pin fins 102 are provided in the first coolant channel 101. When the coolant flows through the first coolant channel 101, the coolant absorbs the heat dissipated by the power module 200, and the provision of the plurality of first heat dissipation pin fins 102 further improves the heat dissipation effect of the coolant.

[0028] Optionally, based on the above technical solution, a second coolant channel 301 is provided inside the second radiator 300 , and a plurality of second heat dissipation pin fins 302 are provided inside the second coolant channel 301 ; the second radiator 300 is located on the side of the N power modules 200 away from the first radiator 100 .

[0029] The second heat dissipation pin-fin 302 is a pin-fin structure, which can improve the heat dissipation effect when the coolant passes through.

[0030] Specifically, a second cooling liquid channel 301 is provided in the second radiator 300, and a plurality of second heat dissipation pin fins 302 are provided in the second cooling liquid channel 301. When the cooling liquid flows through the second cooling liquid channel 301, the cooling liquid absorbs the heat dissipated by the power module 200, and the provision of the plurality of second heat dissipation pin fins 302 further improves the heat dissipation effect of the cooling liquid. The phase change heat dissipation process of the phase change insulating liquid 500 is as follows: the heat generated by the power module 200 during operation is transferred to the phase change insulating liquid 500 in contact with the power module 200, and the phase change insulating liquid 500 reaches the boiling point after absorbing the heat, and the phase change insulating liquid 500 undergoes a liquid-gas phase change, and the phase change insulating liquid 500 is transformed from a liquid state to a gas state. After the gaseous phase change insulating liquid 500 contacts the second radiator 300, the heat is released to the second radiator 300, and the phase change insulating liquid 500 undergoes a secondary phase change, and is transformed from a gas state to a liquid state, and the second radiator 300 dissipates heat through the cooling liquid and the second heat dissipation pin fins 302.

[0031] The power module heat dissipation structure provided in the embodiment of the present invention is provided with three heat dissipation structures, namely a first heat sink 100, a second heat sink 300 and a phase change insulating liquid 500 located in a sealed space between a sealed connection component 400, a power module 200 and the second heat sink 300, thereby realizing active heat dissipation and automatic flow and heat equalization of the coolant, improving the transient heat dissipation capability of the power module heat dissipation structure, and improving the robustness and reliability of the power module.

[0032] Optionally, based on the above technical solution, the power module heat dissipation structure further includes a first side coolant channel 600 and a second side coolant channel 700; the first side coolant channel 600 is used to connect the inlet of the first coolant channel 101 and the inlet of the second coolant channel 301; the second side coolant channel 700 is used to connect the outlet of the first coolant channel 101 and the outlet of the second coolant channel 301. Specifically, the above technical solution realizes that the coolant flows in through the first coolant channel 101, flows through the second coolant channel 301 through the first side coolant channel 600, and then the coolant flows out through the second side coolant channel 700 and the outlet of the second coolant channel 301.

[0033] Optionally, on the basis of the above technical solution, the power module heat dissipation structure further includes a first heat sink substrate 103, a first heat sink shell 104, a second heat sink substrate 303, a second heat sink shell 304, a first side heat sink inner shell 601, a first side heat sink shell 602, a second side heat sink inner shell 701 and a second side heat sink shell 702; the first coolant channel 101 is located between the first heat sink substrate 103 and the first heat sink shell 104, and the first heat dissipation pin fins 102 are located on the surface of the first heat sink substrate 103 facing the first heat sink shell 104; the second coolant channel 301 is located between the second heat sink substrate 303 and the second heat sink shell 304, and the second heat dissipation pin fins 302 are located on the surface of the second heat sink substrate 303 facing the second heat sink shell 304; the sealing connection component 400 is located between the first heat sink substrate 103 and the second The first side radiator substrate 303; the first side cooling liquid channel 600 is located between the first side radiator inner shell 601 and the first side radiator outer shell 602, the first side radiator inner shell 601 is located on the side of the sealing connection component 400 away from the sealed space and is sealed with the first radiator substrate 103 and the second radiator substrate 303, the first side radiator outer shell 602 is sealed with the first radiator outer shell 104 and the second radiator outer shell 304; the second side cooling liquid channel 700 is located between the second side radiator inner shell 701 and the second side radiator outer shell 702, the second side radiator inner shell 701 is located on the side of the sealing connection component 400 away from the sealed space and is sealed with the first radiator substrate 103 and the second radiator substrate 303, the second side radiator outer shell 702 is sealed with the first radiator outer shell 104 and the second radiator outer shell 304.

[0034] Specifically, the above technical solution realizes sealing the first coolant channel 101, the second coolant channel 301, the first side coolant channel 600 and the second side coolant channel 700 inside the power module heat dissipation structure. Optionally, the sealing connection involved in the power module heat dissipation structure can be achieved by fasteners such as screws and sealants. The housing in the power module heat dissipation structure can be made of a material with good thermal conductivity to enhance the heat dissipation effect.

[0035] Optionally, the first radiator shell 104, the second radiator shell 304, the first side radiator inner shell 601, the first side radiator shell 602, the second side radiator inner shell 701 and the second side radiator shell 702 can be made of aluminum alloy, which has good heat dissipation effect. The first radiator substrate 103, the first heat dissipation pin fins 102, the second radiator substrate 303 and the second heat dissipation pin fins 302 can be made of copper with good heat dissipation performance.

[0036] Optionally, based on the above technical solution, Figure 1 As shown, a plurality of signal terminals 800 are provided on a side of the second heat sink 300 away from the power module 200 , and the signal terminals 800 are used to connect with external electrical components; the signal terminals 800 are electrically connected to the power module 200 ; and the external electrical components are located on a side of the second heat sink 300 away from the power module 200 .

[0037] Specifically, the external electrical component can be a device such as a driver board transformer. While the external electrical component is electrically connected to the power module 200 through the signal terminal 800, the heat dissipation of the external electrical component can be achieved through the second heat sink 300, thereby improving its electrical performance. When the external electrical component is a driver board transformer, the driving capability of the driver board transformer can be improved.

[0038] The embodiment of the present invention also provides a power module packaging structure. Figure 1 and Figure 2 As shown, the power module packaging structure includes any power module heat dissipation structure described in the embodiments of the present invention and N power modules 200, where the value of N includes an integer greater than or equal to 1; the power module 200 is fixed to the power module heat dissipation structure and dissipates heat through the power module heat dissipation structure.

[0039] In the power module heat dissipation structure of the power module packaging structure provided by the embodiment of the present invention, the power module 200 is arranged in the sealed space formed by the first heat sink and the second heat sink and the sealed connection component 400, and the phase change insulating liquid 500 is arranged in the sealed space, so as to realize active heat dissipation, improve the transient heat dissipation capacity of the power module heat dissipation structure, and improve the robustness and reliability of the power module. Among them, the phase change heat dissipation process of the phase change insulating liquid 500 is as follows: the heat generated by the power module 200 when working is transferred to the phase change insulating liquid 500 in contact with the power module 200, and the phase change insulating liquid 500 reaches the boiling point after absorbing the heat, and the phase change insulating liquid 500 undergoes a liquid-gas phase change, and the phase change insulating liquid 500 is transformed from a liquid state to a gas state. After the gaseous phase change insulating liquid 500 contacts the second support structure 002, the heat is released to the second support structure 002, and the phase change insulating liquid 500 undergoes a secondary phase change, and is transformed from a gas state to a liquid state.

[0040] Optionally, based on the above technical solution, the power module 200 includes a substrate 201, multiple power chips 202, a plastic encapsulation layer 203, a bonding strip 204 and multiple strip bonding pin fins 205; the power chip 202 is located on one side of the substrate 201; the bonding strip 204 is electrically connected to the power chip 202, and is used to achieve interconnection between multiple power chips 202; the strip bonding pin fins 205 are electrically connected to the bonding strip 204 and are in contact with the sealed space and the phase change insulating liquid 500; the plastic encapsulation layer 203 is located on the side of the power chip 202 away from the substrate 201, and covers the power chip 202 and the bonding strip 204; the power module 200 is fixed to one side of the first heat sink 100 through the substrate 201.

[0041] Optionally, the substrate 201 includes a direct bonded copper (DBC) ceramic substrate or an active metal brazing (AMB) ceramic substrate. The electrodes or pads of the power chip 202 are fixed to one side of the substrate 201 by a sintering or welding process. The power chip 202 is packaged by a conditional bonding (Clip Bond) process, and the bonding strip 204 is welded to the pins of the power chip 202 to achieve interconnection between multiple power chips 202. The clip pin-fin 205 is connected to the bonding strip 204 through a welding process and is arranged to protrude toward the sealed space, and is used to transfer the heat generated by the power chip 202 to the phase-change insulating liquid 500. After the phase-change insulating liquid 500 absorbs the heat, it reaches the boiling point temperature, and the phase-change insulating liquid 500 undergoes a liquid-gas phase change, and the phase-change insulating liquid 500 is transformed from a liquid state to a gas state. After the gaseous phase-change insulating liquid 500 contacts the second heat sink 300, it releases the heat to the second heat sink 300, and the phase-change insulating liquid 500 undergoes a secondary phase change, from a gas state to a liquid state, and the second heat sink 300 dissipates heat through the coolant and the second heat dissipation pin-fin 302. The plastic encapsulation layer 203 is located on the side of the power chip 202 away from the substrate 201, and covers the power chip 202 and the bonding strip 204, exposing the clip pin-fin 205, and completing the packaging of the power chip 202.

[0042] In the above technical solution, the plastic sealing layer 203 completes the first packaging structure of the power module 200; the sealing connection component 400 is located between the first heat sink 100 and the second heat sink 300, and is used to seal and connect the first heat sink 100 and the second heat sink 300, completing the second packaging structure of the power module 200; the above two-layer packaging structure enables the power chip 202 to be in a two-layer sealed environment, isolating it from external water vapor, salt spray, etc., reducing the impact of extreme conditions on the power chip 202, and improving the robustness and reliability of the power module 200.

[0043] In summary, the upper surfaces of the power chips 202 inside the power module 200 (including a substrate 201, multiple power chips 202, a plastic sealing layer 203, a bonding strip 204 and multiple strip bonding pin fins 205 and other components, which are interconnected by welding or sintering) are interconnected by strip bonding pin fins 205. After plastic sealing, the strip bonding pin fins 205 are partially immersed in the phase change insulating liquid 500 in the upper sealed space. A phase change insulating liquid with a suitable boiling point is selected, and endothermic phase change is used to replace traditional heat conduction methods to achieve rapid heat transfer. The second heat sink 300 is responsible for re-liquefying the vaporized phase change insulating liquid 500 by condensation to form a liquid-gas-liquid circuit, so that the junction temperature of the power module 200 is constant and adjustable, thereby reducing the thermal resistance of the power chip 202 in the power module 200.

[0044] Optionally, based on the above technical solution, the power chip 202 includes a metal-oxide semiconductor field effect transistor power chip (MOSFET power chip) or an insulated gate bipolar transistor power chip (IGBT power chip).

[0045] Optionally, based on the above technical solution, the metal-oxide semiconductor field effect transistor power chip includes a silicon carbide metal-oxide semiconductor field effect transistor power chip (SiC MOSFET power chip) or a gallium nitride metal-oxide semiconductor field effect transistor power chip (GaN MOSFET power chip).

[0046] Optionally, based on the above technical solution, the insulated gate bipolar transistor power chip includes a silicon carbide insulated gate bipolar transistor power chip (SiC IGBT power chip) or a gallium nitride insulated gate bipolar transistor power chip (GaNIGBT power chip).

[0047] Exemplarily, the pad connecting the MOSFET power chip to the drain is fixed to one side of the substrate 201 by a sintering or welding process, the pad connecting the MOSFET power chip to the source is welded to the strip bonding pin fin 205, and then the power chip 202 is sealed by the plastic sealing layer 203.

[0048] Specifically, the power chip 202 includes any one of a SiC MOSFET power chip, a GaN MOSFET power chip, a SiC IGBT power chip, and a GaN IGBT power chip, which has the advantages of high withstand voltage, low on-resistance, and high frequency, and enhances the electrical performance of the power chip 202 .

[0049] Optionally, based on the above technical solution, the power module 200 includes a half-bridge power module, the value of N is 3, and 3 power modules constitute a three-phase full-bridge power module.

[0050] The three power modules 200 include a U-phase half-bridge power module, a V-phase half-bridge power module, and a W-phase half-bridge power module.

[0051] The heat dissipation structure of the three-phase full-bridge power module includes a first radiator 100 provided with a first heat dissipation pin fin 102 and a second radiator 300 provided with a second heat dissipation pin fin 302. The inverter cooling circulation water channel leads to the coolant channels of the first radiator 100 and the second radiator 300 respectively. The inverter coolant is diverted through the first radiator 100 and the second radiator 300, and circulates continuously to take away the heat generated by the power module 200: when the three-phase full-bridge power module operates normally (current <250A, 55℃<Tj<120℃), the inverter coolant flow rate is 8L / min, the flow rate diverted to the first radiator 100 is 7L / min, and the flow rate diverted to the second radiator 300 is 1L / min. At this time, the heat dissipation path of the three-phase full-bridge power module mainly relies on the first radiator 100. When the three-phase full-bridge power module is running at peak conditions (current>400A, 175℃>Tj>150℃), the inverter coolant flow rate increases to 10L / min, the flow rate diverted to the first radiator 100 is 8L / min, and the flow rate diverted to the second radiator 300 is 2L / min. The heat dissipation path is the built-in insulating liquid phase change and double-sided coolant circulation heat dissipation, which greatly reduces the high heat generated by short-term high current peak conditions. Among them, the junction temperature is the actual operating temperature of the power module 200.

[0052] The power module packaging structure provided in the embodiment of the present invention realizes active heat dissipation and automatic flow and heat distribution of the coolant and double-sided heat dissipation through the power module heat dissipation structure, thereby improving the transient heat dissipation capability of the power module heat dissipation structure, reducing transient thermal resistance, and improving the robustness and reliability of the power module. In addition, the power module heat dissipation structure also has the following beneficial effects: a phase-change insulating liquid is poured between the power module side frame and the second heat sink, and heat transfer is completed by transient and rapid absorption of heat when the phase change occurs at a constant boiling point of the coolant, thereby realizing active heat dissipation, stabilizing the junction temperature of the power module, and reducing the thermal resistance of the power module or power device at high loss; automatic flow and heat distribution of the power module are realized through active heat dissipation;

[0053] The heat dissipation structure on the top of the power module can cool down the driver board transformer and driver;

[0054] By increasing or decreasing the number of power chips inside the power module, a wider current range can be covered to meet the application requirements of customers in different power segments; compared with existing power modules, the same current output capacity can be guaranteed while reducing the number of chips used, reducing product costs, reducing the module packaging volume, and improving power density; improving transient loss heat dissipation capacity, which can reduce the junction temperature rise caused by the high heat generated by the short-term high current peak condition of the power module or power device, and improve the short-circuit capacity of the power module or power device; double-layer sealing of the power chip can reduce the impact of extreme conditions on the power chip, and improve the tolerance of the high temperature and high humidity bias test system (H3TRB) and the high voltage, high temperature and high humidity bias test system (HV-H3TRB), and the low voltage, high temperature and high humidity bias test system (LV-H3TRB); through the active heat dissipation and automatic heat equalization functions of the power module or power device, the defect of uneven distribution of the on-resistance (Rdson) can be compensated; the copper busbar terminal adopts laser welding technology, which has high production efficiency, flexible assembly and high reliability; Pin2Pin replacement is carried out with HPD water channel interface, and IGBT is currently used Customers of HPD modules and SiCHPD modules can directly replace them; the double-layer sealing structure isolates external water vapor, salt spray, etc., and is salt spray, moisture-proof and waterproof; it is suitable for high power density and high performance application scenarios, which helps to improve the application efficiency of the client; signals and large currents are transmitted through copper busbars, which reduces the parasitic inductance of power modules or power devices, reduces the size of power modules or power devices, and reduces product costs; the power chip works at a high frequency, reduces switching losses, reduces energy losses, thereby increasing current density and enhancing system reliability and life.

[0055] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0056] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A power module heat dissipation structure, characterized in that: A sealed space is provided, wherein the sealed space is used to place N power modules, and the value of N includes an integer greater than or equal to 1; Phase-change insulating liquid, the phase-change insulating liquid is located in the sealed space, the sum of the volume of the phase-change insulating liquid and the volume of the power module is less than the volume of the sealed space; the phase-change insulating liquid is used to absorb the heat of the power module and change from liquid to gas, and the phase-change insulating liquid is used to transfer the heat out of the sealed space and then change from gas to liquid.

2. The power module heat dissipation structure according to claim 1, characterized in that: The sealed space is a space formed by the first heat sink, the second heat sink and the sealed connection assembly, and the sealed connection assembly is located between the first heat sink and the second heat sink and surrounds the power module; The phase-change insulating liquid is used to change from a gaseous state to a liquid state after transferring heat to the second heat sink.

3. The power module heat dissipation structure according to claim 2, characterized in that: A first cooling liquid channel is arranged inside the first radiator, and a plurality of first cooling pin-fins are arranged inside the first cooling liquid channel; one side of the first radiator is used for fixing the N power modules.

4. The power module heat dissipation structure according to claim 3, characterized in that: A second coolant channel is provided inside the second heat sink, and a plurality of second heat dissipation pin fins are provided inside the second coolant channel; the second heat sink is located on a side of the N power modules away from the first heat sink.

5. The power module heat dissipation structure according to claim 4, characterized in that: The power module heat dissipation structure further includes a first side cooling liquid channel and a second side cooling liquid channel; The first side coolant channel is used to connect the inlet of the first coolant channel and the inlet of the second coolant channel; The second side coolant channel is used to connect the outlet of the first coolant channel and the outlet of the second coolant channel.

6. The power module heat dissipation structure according to claim 5, characterized in that: The power module heat dissipation structure also includes a first heat sink substrate, a first heat sink shell, a second heat sink substrate, a second heat sink shell, a first side heat sink inner shell, a first side heat sink shell, a second side heat sink inner shell and a second side heat sink shell; The first coolant channel is located between the first radiator substrate and the first radiator shell, and the first heat dissipation pin fin is located on a surface of the first radiator substrate facing the first radiator shell; The second coolant channel is located between the second radiator substrate and the second radiator shell, and the second heat dissipation pin fins are located on a surface of the second radiator substrate facing the second radiator shell; The sealing connection assembly is located between the first heat sink substrate and the second heat sink substrate; The first side coolant channel is located between the first side radiator inner shell and the first side radiator outer shell, the first side radiator inner shell is located on a side of the sealing connection component away from the sealed space and is sealedly connected to the first radiator substrate and the second radiator substrate, and the first side radiator outer shell is sealedly connected to the first radiator outer shell and the second radiator outer shell; The second side coolant channel is located between the second side radiator inner shell and the second side radiator outer shell, the second side radiator inner shell is located on the side of the sealing connection component away from the sealed space and is sealed connected to the first radiator substrate and the second radiator substrate, and the second side radiator outer shell is sealed connected to the first radiator outer shell and the second radiator outer shell.

7. The power module heat dissipation structure according to claim 2, characterized in that: A plurality of signal terminals are provided on a side of the second heat sink away from the power module, wherein the signal terminals are used to connect to external electrical components; the signal terminals are electrically connected to the power module; The external electrical component is located at a side of the second heat sink away from the power module.

8. A power module packaging structure, characterized in that: The power module heat dissipation structure comprises any one of claims 1 to 7 and N power modules, wherein the value of N comprises an integer greater than or equal to 1; The power module is fixed to the power module heat dissipation structure and dissipates heat through the power module heat dissipation structure.

9. The power module packaging structure according to claim 8, characterized in that: The power module includes a substrate, a plurality of power chips, a plastic encapsulation layer, a bonding strip and a plurality of strip bonding pin-fins; The power chip is located on one side of the substrate; The bonding strip is electrically connected to the power chip to realize interconnection between multiple power chips; The strip bonding pin-fin is connected to the bonding strip and faces in contact with the phase-change insulating liquid; The plastic packaging layer is located on a side of the power chip away from the substrate and covers the power chip and the bonding strip; The power module is fixed to one side of the first heat sink through the substrate.

10. The power module packaging structure according to claim 9, characterized in that: The power chip includes a metal-oxide semiconductor field effect transistor power chip or an insulated gate bipolar transistor power chip.

11. The power module packaging structure according to claim 10, characterized in that: The metal-oxide semiconductor field effect transistor power chip includes a silicon carbide metal-oxide semiconductor field effect transistor power chip or a gallium nitride metal-oxide semiconductor field effect transistor power chip.

12. The power module packaging structure according to claim 10, characterized in that: The insulated gate bipolar transistor power chip includes a silicon carbide insulated gate bipolar transistor power chip or a gallium nitride insulated gate bipolar transistor power chip.

13. The power module packaging structure according to claim 8, characterized in that: The power module includes a half-bridge power module, the value of N is 3, and 3 power modules constitute a three-phase full-bridge power module.

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