Integrated electric control structure, heat dissipation method and controller

Abstract

The invention belongs to the technical field of controllers, and provides an integrated electric control structure, a heat dissipation method and a controller, and the electric control structure comprises a capacitor module which is provided with a first cooling flow channel; the heat dissipation modules are arranged on the two sides of the capacitor module, and second cooling flow channels communicated with the first cooling flow channels are arranged in the heat dissipation modules; a semiconductor module within the heat dissipation module; the driving control board is integrated on the bottom surface of the capacitor module and is electrically connected with the semiconductor module; and the filtering assembly is integrated in the capacitor module. Parts such as the capacitor module, the semiconductor module, the heat dissipation module and the driving control panel are integrated, each module does not need to be designed independently, the development cost is reduced, and meanwhile, due to the integrated layout of all the modules, the occupied space is small; besides, through the arrangement of the cooling flow channel, each module can be cooled through a cooling structure, independent cooling design for each module is not needed, and the cost and the occupied space of the equipment are further reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of controllers, and in particular relates to an integrated electric control structure, a heat dissipation method and a controller. Background Art

[0002] With the development of new energy electric vehicles, the vehicle structure system is gradually becoming integrated and lightweight. On this basis, in order to meet the performance of the vehicle system, traditional motor controllers have been gradually eliminated by the market due to the physical integration of their individual components.

[0003] Traditional motor controllers mainly include IGBT (insulated gate bipolar transistor, full name Insulated Gate Bipolar Transistor) power modules, DC-LINK capacitors (DC support capacitors), filter components, drivers, driver control boards (PCB, full name Printed Circuit Board) and other components. These individual components need independent heat dissipation, and the space required for the physical integration of all components is large. In addition, since each component is designed separately, the interface of the component will be different for different projects, which is difficult to unify, resulting in the disadvantage of difficult platform compatibility and no cost advantage.

[0004] In general, the disadvantages of the prior art are as follows:

[0005] 1. High cost: Each module needs to be designed independently, and the development cost is high;

[0006] 2. Large space: The independent layout of the modules means that interfaces need to be connected between the modules. For high-voltage platforms, high requirements for heat dissipation performance are required. Each module also needs independent heat dissipation design. This combination of independent designs results in large-area use of space.

[0007] 3. It cannot be used on other voltage platforms and can only be designed in a sandwich stacking form. When facing other voltage platforms, it is impossible to cancel or add IGBT modules, so it is impossible to achieve compatibility with different voltage platforms. Summary of the invention

[0008] In order to solve at least one problem in the background technology, the present invention provides an integrated electric control structure, a heat dissipation method and a controller.

[0009] In order to achieve the above object, the present invention adopts the following technical solutions:

[0010] An integrated electric control structure, comprising:

[0011] The capacitor module is provided with a first cooling channel;

[0012] A heat dissipation module integrated on both sides of the capacitor module, wherein a second cooling channel is provided in the heat dissipation module, and the second cooling channel is communicated with the first cooling channel;

[0013] A semiconductor module integrated in the heat dissipation module, the semiconductor module is electrically connected to the capacitor module and is located on both sides of the second cooling channel;

[0014] A drive control board integrated on the bottom surface of the capacitor module, the drive control board being electrically connected to the semiconductor module;

[0015] A filter component integrated into the capacitor module.

[0016] Preferably, the capacitor module comprises a capacitor and a capacitor housing;

[0017] The capacitor is located inside the capacitor housing, and the semiconductor module and the heat dissipation module are located on both sides of the capacitor housing;

[0018] The first cooling channel is arranged at two ends inside the capacitor housing, with a water inlet at one end and a water outlet at the other end.

[0019] Preferably, the heat dissipation module comprises a first cover plate, a second cover plate, heat dissipation fins, and an insulating plate;

[0020] The first cover plate and the second cover plate are arranged in parallel, and a fixed base is connected between the two;

[0021] The heat dissipation fin is located between the first cover plate and the second cover plate, and is provided with two layers, one layer is in contact with the first cover plate, and the other side is in contact with the second cover plate;

[0022] The two layers of heat dissipation fins are connected to a base plate through pins, and the second cooling channel is opened in the base plate;

[0023] A sealing base is connected between the second cover plate and the capacitor housing, and the second cooling channel is connected to the first cooling channel through the sealing base;

[0024] The insulating plate is located outside the first cover plate, and the heat dissipation module is locked to the capacitor housing by fasteners.

[0025] Preferably, a bowl-shaped plug is also provided in the heat dissipation module.

[0026] Preferably, in the same layer, a plurality of the heat dissipation fins are arranged at intervals;

[0027] The semiconductor modules are mounted between the spaced heat dissipation fins.

[0028] Preferably, the drive control board is fixed to the bottom surface of the capacitor housing after being welded to the pins of the semiconductor module.

[0029] Preferably, the filter assembly is integrated in a capacitor housing, and includes a first Y capacitor, a second Y capacitor, a first X capacitor, a second X capacitor, a grounding copper bus, a power copper bus and a ferrite;

[0030] The first Y capacitors are symmetrically arranged;

[0031] The second Y capacitor is symmetrically arranged and located on one side of the first Y capacitor;

[0032] The first X capacitor is located between the symmetrical first Y capacitors;

[0033] The second X capacitor is located on one side of the first X capacitor and between the stacked first Y capacitors;

[0034] The first Y capacitor, the second Y capacitor, the first X capacitor, and the second X capacitor are all welded on the filter board;

[0035] The grounding copper bar is connected to the legs of the capacitor housing;

[0036] The power copper busbar is electrically connected to a second Y capacitor;

[0037] The ferrite is installed on one side of the filter board.

[0038] A heat dissipation method, used for the above-mentioned integrated electric control structure, comprises the following steps:

[0039] Passing a cooling medium into the connected first cooling channel and the second cooling channel;

[0040] Performing heat exchange on the capacitor module through the first cooling channel;

[0041] Heat exchange is performed on the semiconductor modules on both sides of the capacitor module through the second cooling channel.

[0042] Preferably, heat exchange is performed on the semiconductor modules on both sides of the capacitor module through the second cooling channel, comprising the following steps:

[0043] Heat is exchanged with the semiconductor module through the heat conducting fins integrated in the heat dissipation module;

[0044] The cooling medium in the second cooling channel exchanges heat with the heat-conducting fins.

[0045] A controller is provided with the above-mentioned integrated electric control structure.

[0046] Beneficial effects of the present invention:

[0047] 1. The present invention integrates the capacitor module, semiconductor module, heat dissipation module and drive control board, and each module does not need to be designed separately, which reduces the development cost. At the same time, due to the integrated layout of each module, the occupied space is small; in addition, by setting the first cooling channel and the second cooling channel, the present invention allows each module to dissipate heat through a cooling structure, without the need for independent heat dissipation design for each module, which further reduces the cost and the occupied space of the equipment;

[0048] 2. The present invention integrates the semiconductor module into the heat dissipation module, wherein the semiconductor module and the heat dissipation fins are arranged at intervals, so the number of semiconductor modules can be installed as needed to be used for different voltage platforms.

[0049] Other features and advantages of the present invention will be described in the following description, and partly become obvious from the description, or be understood by implementing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures pointed out in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0051] Figure 1 A top view of an integrated electric control structure of the present invention is shown;

[0052] Figure 2 A bottom view of an integrated electric control structure of the present invention is shown;

[0053] Figure 3 An internal cross-sectional view of an integrated electric control structure of the present invention is shown;

[0054] Figure 4 Shows Figure 3 Magnified view of area A in the middle;

[0055] Figure 5 A schematic diagram showing the structure of the filter assembly of the present invention is shown;

[0056] Figure 6 A flow chart of the heat dissipation method of the present invention is shown.

[0057] In the figure: 1. capacitor module; 101. capacitor; 102. capacitor housing; 103. water inlet; 104. water outlet; 105. first cooling channel; 2. semiconductor module; 3. heat dissipation module; 301. first cover plate; 302. second cover plate; 303. heat dissipation fin; 304. insulation plate; 305. bowl-shaped plug; 306. fixed base; 307. sealing base; 308. substrate; 309. second cooling channel; 4. fastener; 5. drive control board; 6. filter component; 601. first Y capacitor; 602. second Y capacitor; 603. first X capacitor; 604. second X capacitor; 605. grounding copper bus; 606. power copper bus; 607. ferrite. DETAILED DESCRIPTION

[0058] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0059] An integrated electric control structure, such as Figure 1 As shown, it includes a capacitor module 1 provided with a first cooling channel 105; and a heat dissipation module 3 integrated on both sides of the capacitor module 1, wherein a second cooling channel 309 is provided in the heat dissipation module 3, and the second cooling channel 309 is connected to the first cooling channel 105; and a semiconductor module 2 integrated in the heat dissipation module 3, wherein the semiconductor module 2 is electrically connected to the capacitor module 1 and is located on both sides of the second cooling channel 309; and a drive control board 5 integrated on the bottom surface of the capacitor module 1, wherein the drive control board 5 is electrically connected to the semiconductor module 2; and a filter component 6 integrated in the capacitor module 1.

[0060] It should be noted that Figure 1 The semiconductor module 2 can be selected as an IGBT module, and the drive control board 5 can be a PCB board.

[0061] It needs to be further explained that Figure 1In response to the existing platform's low to high power density and lightweight, integrated usage requirements, the independent capacitor module 1, filter assembly 6, IGBT module, drive control board 5, and heat dissipation module 3 are integrated into one to form an integrated power device. This integrated structure, while solving the heat dissipation problem of each module, also solves the problem of excessive space occupied by physical integrated components to a certain extent. In addition, after the above structure is integrated, heat is dissipated through the first cooling channel 105 and the second cooling channel 309. There is no need to use independent heat dissipation for each module, but heat is uniformly dissipated through the cooling channel, reducing space occupancy.

[0062] Further, in Figure 1 The capacitor module 1 includes a capacitor 101 and a capacitor housing 102; the capacitor 101 is located inside the capacitor housing 102, and includes major components such as a capacitor core and a capacitor copper bar. The semiconductor module 2 and the heat dissipation module 3 are located on both sides of the capacitor housing 102. At the same time, the heat dissipation module 3 can be locked to the capacitor housing 102 by fasteners 4.

[0063] like Figure 2 As shown, the bottom surfaces of the capacitor housing 102 at both ends are provided with water inlets 103 and water outlets 104, and the cooling medium can enter the first cooling channel 105 from the water inlet 103 and finally be discharged from the water outlet 104. Figure 2 The middle drive control board 5 is fixed to the bottom surface of the capacitor housing 102 after being welded to the pins of the semiconductor module 2 .

[0064] like Figure 3 As shown in the figure, the first cooling channel 105 is arranged along the vertical direction and is located at both ends inside the capacitor housing 102, wherein the first cooling channel 105 at one end is connected to the water inlet 103, and the first cooling channel 105 at the other end is connected to the water outlet 104.

[0065] It should be noted that in Figure 3 In the structure, the heat dissipation module 3 is located on both sides of the first cooling channel 105, wherein the second cooling channel 309 is arranged in the horizontal direction, and can form a "mouth"-shaped cooling channel with the first cooling channel 105. The cooling medium enters from the water inlet 103, flows in the cooling channel, and is then discharged from the water outlet 104.

[0066] like Figure 4As shown, the heat dissipation module 3 includes a first cover plate 301, a second cover plate 302, heat dissipation fins 303, and an insulating plate 304. The first cover plate 301 and the second cover plate 302 are arranged in parallel, and a fixed base 306 is connected between the two. The heat dissipation fins 303 are located between the first cover plate 301 and the second cover plate 302, and are provided with two layers, one layer is in contact with the first cover plate 301, and the other side is in contact with the second cover plate 302. The two layers of heat dissipation fins 303 are connected to a substrate 308 through pins, and the second cooling channel is opened in the substrate 308. In addition, a sealing base 307 is connected between the second cover plate 302 and the capacitor housing 102, and the second cooling channel 309 is connected to the first cooling channel 105 through the sealing base 307. The insulating plate 304 is located outside the first cover plate 301, and is used to lock the heat dissipation module 3 to the capacitor housing 102 through the fastener 4.

[0067] It should be noted that through Figure 4 As can be seen from the structure, in the same layer, the heat dissipation fins 303 are arranged at intervals, and the semiconductor module 2 is installed between the spaced heat dissipation fins 303. When the cooling medium flows through the second cooling channel 309, it can absorb the heat of the heat dissipation fins 303, and the heat dissipation fins 303 can conduct the heat of the semiconductor module 2, thereby reducing the temperature of the semiconductor module 2.

[0068] Combination Figure 3 and Figure 4 It can be seen that the heat dissipation module 3 has two groups of 6 semiconductor modules 2 (adapting to different voltage platforms by increasing or canceling the number of semiconductor (IGBT) modules on both sides), which are located on both sides of the capacitor housing 102. In actual project applications, the module selection can be made according to the voltage platform. After the low voltage platform is confirmed, the semiconductor module 2 is selected, and it can be located on one side or both sides of the capacitor housing 102. The heat dissipation fins 303 are connected to the first cover plate 301 and the second cover plate 302 of the heat dissipation module by brazing, so that the overall deformation is small and the workpiece size accuracy is high; the heat dissipation fins 303 are designed as a diamond-shaped Pin-fin structure, and the molding method is machining. Its thermal conductivity and pressure loss are better than those of ordinary cylindrical Pin-fin structures, and the cooling effect is also better than that of ordinary offset heat dissipation fins 303; after the heat dissipation fins 303 are brazed with the first cover plate 301 and the second cover plate 302, the base 3 is fixed. 06 is press-fitted with the heat sink fin 303, and the fixed base 306 plays a fixed supporting role; the insulating plate 304 is located on one side or both sides of the capacitor housing 102, and a boss base is grown on the insulating plate 304, and a threaded insert is embedded inside the base. When the positive and negative power copper busbars inside the capacitor module 101 are connected and fixed with the power terminals of the semiconductor module 2, and the power terminals of the semiconductor module 1 are connected and fixed with the three-phase AC terminals of the electric control, the terminals and the copper busbars can be directly locked to the base insert of the insulating plate 304 through the fasteners 4.

[0069] Furthermore, a bowl-shaped plug 305 is also provided in the heat dissipation module 3 .

[0070] It should be noted that, combined with Figure 2 and Figure 3 It can be seen that the first cooling channel 105 is provided with a water inlet 103 and a water outlet 104, and a sealing port is also provided. The sealing port is also located at both ends of the first cooling channel 105 and forms a "T"-shaped structure with the first cooling channel 105. The sealing port is in the same plane as the first cooling channel 105 and is perpendicular to the water inlet 103 and the water outlet 104. Generally, the sealing port needs to be sealed with a bowl-shaped plug 305 to prevent the coolant from flowing to the outside of the shell.

[0071] like Figure 5 As shown, the filter component 6 is integrated in the capacitor housing 102, including a first Y capacitor 601, a second Y capacitor 602, a first X capacitor 603, a second X capacitor 604, a grounding copper busbar 605, a power copper busbar 606 and a ferrite 607, wherein the first Y capacitor 601 is symmetrically arranged; the second Y capacitor 602 is symmetrically arranged and located on one side of the first Y capacitor 601; the first X capacitor 603 is located between the symmetrical first Y capacitors 601; the second X capacitor 604 is located on one side of the first X capacitor 603 and between the symmetrical first Y capacitors 601; the first Y capacitor 601, the second Y capacitor 602, the first X capacitor 603 and the second X capacitor 604 are all welded on the filter board; the grounding copper busbar 605 is connected to the leg of the capacitor housing 102; the power copper busbar 606 is electrically connected to the second Y capacitor 602; and the ferrite 607 is installed on one side of the filter board.

[0072] Specifically, the filter assembly 6 and the capacitor module 101 share a set of positive and negative copper bars, the filter grounding copper bar 605 is welded to the capacitor housing 102, and then grounded through the capacitor housing 102; the power supply copper bar 606 is welded to the positive and negative terminals inside the capacitor module 101, and power is supplied through the bus current input and output. After the entire filter assembly 6 is welded, it is potted together with the core inside the capacitor 101 and the positive and negative copper bars to form a primary integration of the DC-LINK capacitor-filter assembly.

[0073] It should be noted that after the filter assembly 6 is integrated into the capacitor housing 101 , it can exchange heat with the cooling medium in the first cooling channel 105 , thereby quickly dissipating heat.

[0074] Combination Figure 1-Figure 5, the integration of capacitor module 1 and filter component 6 saves additional injection molding and copper busbar costs; at the same time, platform compatibility means that there is no need to repeat the design when facing new platform projects in the future, saving manual design costs; secondly, filter component 6 adopts CLC topology, which reduces the cost of nanocrystalline magnetic rings compared to conventional LCL topology; in addition, in conventional electronic control design, both filter component 6 and capacitor module 1 require additional heat dissipation structures, so it is necessary to add thermal pads to dissipate heat. In this solution, both capacitor module 1 and filter component 6 are cooled by water cooling, which reduces the cost of parts.

[0075] Based on the same total flow assumption, the Figure 1-Figure 5 Compared with conventional single-sided water cooling, the double-sided water cooling can reduce thermal resistance by 32% after simulation verification, and the water pressure drop is only 35% of that; in addition, conventional single-sided water cooling, DC-LINK capacitors (DC support capacitors) and filter components require additional heat dissipation structures, such as adding thermal pads, and this heat dissipation level is much lower than water cooling. It is estimated that the total output power of this solution can be increased by more than 30%, and the current capacity of the controller can be increased by 50% or more. In addition, the integrated design of the filter component 6 and the DC-LINK capacitor eliminates the need for additional interface space and filter plastic shell space, which reduces the internal space of the motor controller to a certain extent.

[0076] like Figure 6 As shown, a heat dissipation method is used for the above-mentioned integrated electric control structure, comprising the following steps:

[0077] S1: Pass the cooling medium into the connected first cooling channel 105 and the second cooling channel 309. Specifically, cooling water enters from the water inlet 103. Figure 3 The first cooling channel 105 on the left side of the middle, then enters the second cooling channel 309 in the heat dissipation modules 3 on both sides, and finally from Figure 3 The water is discharged from the water outlet 104 on the middle right side.

[0078] S2: performing heat exchange on the capacitor module 1 through the first cooling channel 105. Specifically, the cooling water can absorb the heat generated by various components in the capacitor module 1 after entering the first cooling channel 105.

[0079] S3: The semiconductor modules 2 on both sides of the capacitor module 1 are heat exchanged through the second cooling channel 309. Specifically, after the cooling water enters the second cooling channel 309, it can absorb the heat generated by the IGBT module, and in the process of absorbing heat, the heat exchange is performed with the IGBT module through the heat dissipation fins 303 integrated in the heat dissipation module 3, and the heat exchange is performed with the heat dissipation fins 303 through the cooling medium in the second cooling channel.

[0080] A controller is provided with the above-mentioned integrated electric control structure, heat dissipation method and controller.

[0081] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An integrated electric control structure, characterized in that: include: The capacitor module (1) is provided with a first cooling channel (105); A heat dissipation module (3) integrated on both sides of the capacitor module (1), wherein a second cooling channel (309) is provided in the heat dissipation module (3), and the second cooling channel (309) is connected to the first cooling channel (105); a semiconductor module (2) integrated in the heat dissipation module (3), the semiconductor module (2) being electrically connected to the capacitor module (1) and being located on both sides of the second cooling channel (309); A drive control board (5) integrated on the bottom surface of the capacitor module (1), the drive control board (5) being electrically connected to the semiconductor module (2); A filter component (6) integrated in the capacitor module (1).

2. The integrated electric control structure according to claim 1, characterized in that: The capacitor module (1) comprises a capacitor (101) and a capacitor housing (102); The capacitor (101) is located inside the capacitor housing (102), and the semiconductor module (2) and the heat dissipation module (3) are located on both sides of the capacitor housing (102); The first cooling channel (105) is arranged at two ends inside the capacitor housing (102), with a water inlet (103) being arranged at one end and a water outlet (104) being arranged at the other end.

3. The integrated electric control structure according to claim 2, characterized in that: The heat dissipation module (3) comprises a first cover plate (301), a second cover plate (302), heat dissipation fins (303), and an insulating plate (304); The first cover plate (301) and the second cover plate (302) are arranged in parallel, and a fixed base (306) is connected between the two; The heat dissipation fins (303) are located between the first cover plate (301) and the second cover plate (302), and are provided with two layers, one layer is in contact with the first cover plate (301), and the other side is in contact with the second cover plate (302); The two layers of heat dissipation fins (303) are connected to a base plate (308) via pins, and the second cooling channel (309) is opened in the base plate (308); A sealing base (307) is connected between the second cover plate (302) and the capacitor housing (102), and the second cooling channel (309) is connected to the first cooling channel (105) through the sealing base (307); The insulating plate (304) is located outside the first cover plate (301), and the heat dissipation module (3) and the capacitor housing (102) are locked by a fastener (4).

4. The integrated electric control structure according to claim 3, characterized in that: A bowl-shaped plug (305) is also provided in the heat dissipation module (3).

5. The integrated electric control structure according to claim 3, characterized in that: In the same layer, a plurality of heat dissipation fins (303) are arranged at intervals; The semiconductor module (2) is installed between the spaced heat dissipation fins (303).

6. The integrated electric control structure according to claim 2, characterized in that: The drive control board (5) is fixed to the bottom surface of the capacitor housing (102) after the pins of the semiconductor module (2) are welded.

7. The integrated electric control structure according to claim 2, characterized in that: The filter component (6) is integrated in the capacitor housing (102), and includes a first Y capacitor (601), a second Y capacitor (602), a first X capacitor (603), a second X capacitor (604), a grounding copper busbar (605), a power supply copper busbar (606), and a ferrite (607); The first Y capacitor (601) is symmetrically arranged; The second Y capacitor (602) is symmetrically arranged and located on one side of the first Y capacitor (601); The first X capacitor (603) is located between the symmetrical first Y capacitors (601); The second X capacitor (604) is located on one side of the first X capacitor (603) and between the symmetrical first Y capacitors (601); The first Y capacitor (601), the second Y capacitor (602), the first X capacitor (603), and the second X capacitor (604) are all welded on the filter board; The grounding copper bar (605) is connected to the legs of the capacitor housing (102); The power copper busbar (606) is electrically connected to the second Y capacitor (602); The ferrite (607) is installed on one side of the filter board.

8. A heat dissipation method, used in an integrated electric control structure according to any one of claims 1 to 7, characterized in that: The following steps are involved: Passing a cooling medium into the connected first cooling channel (105) and the second cooling channel (309); Performing heat exchange on the capacitor module (1) through the first cooling channel (105); Heat exchange is performed on the semiconductor modules (2) on both sides of the capacitor module (1) through the second cooling channel (309).

9. A heat dissipation method according to claim 8, characterized in that: Heat exchange is performed on the semiconductor modules (2) on both sides of the capacitor module (1) through the second cooling channel (309), comprising the following steps: Performing heat exchange with the semiconductor module (2) via the heat conducting fins (303) integrated in the heat dissipation module (3); Heat exchange is performed between the cooling medium in the second cooling channel (309) and the heat-conducting fins (303).

10. A controller, characterized in that: An integrated electric control structure according to any one of claims 1 to 7 is installed.

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