Circuit board with self-heating function, electronic component and pressure transmitter

Abstract

The invention provides a circuit board with a self-heating function, an electronic component and a pressure transmitter, the circuit board is used for heat preservation of an electronic component, and the circuit board comprises a self-heating board body suitable for installing the electronic component; the auxiliary heating module is arranged on the self-heating plate body and is suitable for wrapping the electronic element together with the self-heating plate body; the self-heating plate body and the auxiliary heating module can convert electric energy into heat so as to preserve the heat of the electronic element; the electronic assembly comprises the circuit board and the electronic assembly. According to the invention, the operation stability and service reliability of the pressure transmitter in an extreme temperature environment can be improved.

Description

Technical Field

[0001] The invention relates to the technical field of low-temperature environment pressure transmitters, and in particular to a circuit board, an electronic component and a pressure transmitter with a self-heating function. Background Art

[0002] When the existing pressure transmitter faces an extreme low temperature environment, the performance of the electronic components in the circuit board will significantly decrease, resulting in a significant reduction in the stability and reliability of the measurement results. This problem is particularly prominent when the temperature drops below -45°C. At present, the operating temperature range of most pressure transmitters is limited to above -45°C. Below this temperature threshold, the working state of the electronic components on the circuit board will be affected by the low temperature, which in turn affects the performance of the entire transmitter. In addition, since pressure transmitters generally use a current signal of 4 to 20 mA based on the HART communication protocol for data transmission, this means that the current that can be supplied to the heating device is very limited. If you try to heat the circuit board through an external heating device, it may not only be insufficient to generate enough heat, but it may also cause the pressure transmitter to work abnormally or even be damaged.

[0003] Therefore, existing pressure transmitters face the dual challenges of performance degradation and reduced reliability in cryogenic environments, which limits their application possibilities in a wider range of environmental conditions. Summary of the invention

[0004] The object of the present invention is to provide a circuit board, an electronic component and a pressure transmitter with a self-heating function, so as to improve the operating stability and service reliability of the pressure transmitter in an extreme temperature environment.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A circuit board with self-heating function, used for heat preservation of electronic components, characterized in that the circuit board comprises:

[0007] A self-heating plate body suitable for mounting the electronic components;

[0008] A secondary heating module, disposed on the self-heating plate, and suitable for wrapping the electronic component together with the self-heating plate;

[0009] The self-heating plate and the auxiliary heating module can convert electrical energy into heat to keep the electronic components warm.

[0010] In some embodiments of the present invention, the self-heating plate comprises:

[0011] substrate;

[0012] A substrate green oil layer at least partially covers the substrate, and the electronic component is suitable for being arranged on the substrate green oil layer;

[0013] A substrate heating element, comprising a first substrate heating element and a second substrate heating element, wherein one side of the first substrate heating element is covered by the substrate green oil layer and the other side is covered by the substrate, and one side of the second substrate heating element is fixed on the substrate and the other side passes through the substrate green oil layer to be suitable for contacting with the electronic component;

[0014] Wherein, the first substrate heating element and the second substrate heating element can both convert electrical energy into heat, the first substrate heating element is used to keep the self-heating plate warm, and the second substrate heating element is suitable for keeping the electronic components warm.

[0015] In some embodiments of the present invention, the self-heating plate has at least one of the following characteristics:

[0016] The substrate is made of glass fiber reinforced epoxy resin with a thickness of 1.6 to 2 μm;

[0017] The green oil layer of the substrate is made of epoxy resin or acrylic resin or acrylic resin, and has a thickness of 9 to 11 μm;

[0018] The substrate heating element is a copper foil, aluminum foil or silver foil with a thickness of 30 to 40 μm and made by a calendering process.

[0019] In some embodiments of the present invention, the wiring form of the substrate heating element is serpentine routing.

[0020] In some embodiments of the present invention, the auxiliary heating module includes:

[0021] Flexible substrates;

[0022] Auxiliary heating element;

[0023] Coating layer;

[0024] Wherein, a side of the flexible substrate facing away from the auxiliary heat generating element is suitable for contacting with the electronic component.

[0025] In some embodiments of the present invention, the auxiliary heating module further includes:

[0026] The auxiliary heat screen printing layer is arranged on a side of the coating layer away from the flexible substrate.

[0027] In some embodiments of the present invention, the secondary heating module has at least one of the following features:

[0028] The flexible substrate is made of polyimide and has a thickness of 32 to 36 μm;

[0029] The auxiliary heating element is a copper foil, aluminum foil, or silver foil with a thickness of 30 to 40 μm and made by a calendering process;

[0030] The coating layer is made of polyimide and has a thickness of 8 to 12 μm;

[0031] The auxiliary heat screen printing layer is made of heat curing text ink with a thickness of 18 to 22 μm.

[0032] In some embodiments of the present invention, the wiring form of the auxiliary heating element is serpentine routing.

[0033] In some embodiments of the present invention, the circuit board further comprises:

[0034] A heat preservation module is arranged on a side of the auxiliary heating module away from the self-heating plate;

[0035] Preferably, the thermal insulation module is made of aerogel or polyurethane, with a thickness of 16 to 20 mm.

[0036] In some embodiments of the present invention, the circuit board further comprises:

[0037] The temperature control circuit module is arranged on the self-heating plate and is used to monitor the temperature of the electronic components so as to adjust the heating power of the self-heating plate and / or the auxiliary heating module.

[0038] In some embodiments of the present invention, the temperature control circuit module includes:

[0039] At least one of an STM32 series microcontroller and an MSP430 series microcontroller, used to realize the logic control of the whole circuit;

[0040] Metal film resistors, used to form a voltage divider with the thermistor so that the microcontroller can read the temperature value, and also used as pull-down resistors to prevent the base from floating;

[0041] Thermistor, used to adjust its own resistance value according to temperature, so as to combine with the metal film resistor and output different voltages through voltage division;

[0042] The STM32 series microcontroller and the MSP430 series microcontroller, the metal film resistor and the thermistor are electrically connected. The thermistor changes its resistance value according to the ambient temperature, and then forms a voltage divider circuit together with the metal film resistor to output a voltage signal to the STM32 series microcontroller and the MSP430 series microcontroller, and the voltage signal is converted into a set temperature by the STM32 series microcontroller and the MSP430 series microcontroller.

[0043] In order to achieve the above object, the present invention also provides the following technical solutions:

[0044] An electronic component, comprising:

[0045] The above-mentioned circuit board; and

[0046] The electronic component is wrapped between the self-heating board body and the auxiliary heating module of the circuit board.

[0047] In some embodiments of the present invention, the electronic component is at least one of a chip and a crystal oscillator.

[0048] In order to achieve the above object, the present invention also provides the following technical solutions:

[0049] A pressure transmitter, characterized in that the pressure transmitter comprises the above-mentioned circuit board, or comprises the above-mentioned electronic component;

[0050] The pressure transmitter also includes a pressure measuring assembly, which is electrically connected to an electronic component disposed on the circuit board.

[0051] Further areas of applicability will become apparent from the description provided in the present disclosure.

[0052] The description and specific examples in this summary are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.

[0053] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0054] 1. The present invention provides a circuit board, an electronic component and a pressure transmitter with a self-heating function. The circuit board can achieve self-heating to heat the chip and the crystal oscillator and keep them within a healthy operating temperature range. Even under extremely low temperature conditions, the heating method provided by the present invention can ensure that the circuit board of the pressure transmitter has strong operating stability and service reliability, thereby broadening the application scenario of the pressure transmitter using the self-heating technology and enhancing the performance of the pressure transmitter under harsh weather conditions.

[0055] 2. The present invention directly heats the chip through the circuit board self-heating technology, which can effectively maintain the chip and the crystal oscillator in a healthy working temperature range, thereby enhancing the operating stability and reliability of the pressure transmitter in an extreme low temperature environment such as below -45°C;

[0056] 3. Compared with traditional external heating devices, the self-heating technology provided by the present invention generates heat directly on the circuit board, which effectively reduces the dissipation loss that may occur during a long transmission process and significantly reduces the overall energy consumption;

[0057] 4. Because the circuit board self-heating technology provided by the present invention can keep the chip in a healthy operating temperature range at all times, it can significantly reduce the disturbance effect of temperature fluctuation on the measurement results of the pressure transmitter, thereby significantly improving the measurement accuracy of the pressure transmitter using this self-heating technology;

[0058] 5. The circuit board self-heating technology provided by the present invention reduces the reliance on external heating devices, thereby reducing the risk of overall system failure caused by failure of external heating devices, thereby enhancing the durability and maintainability of the overall system;

[0059] 6. The circuit board self-heating technology provided by the present invention can quickly respond to environmental temperature changes by controlling the circuit module, thereby timely adjusting the heating state of the circuit board to ensure that the pressure transmitter can respond quickly when the ambient temperature fluctuates and can always maintain the best working state. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some implementation plans of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0061] Figure 1 A cross-sectional view of a circuit board and an electronic component with a self-heating function provided in a first embodiment of the present invention;

[0062] Figure 2 A top view of a circuit board and an electronic component with a self-heating function provided in a second embodiment of the present invention;

[0063] Figure 3 A circuit diagram of a circuit board with self-heating function provided by a third embodiment of the present invention.

[0064] Description of Reference Numerals

[0065] 1-circuit board; 11-self-heating board body; 111-substrate; 112-substrate green oil layer; 113-substrate heating element; 1131-first substrate heating element; 1132-second substrate heating element; 114-substrate silk screen layer; 12-secondary heating module; 121-flexible substrate; 122-auxiliary heating element; 123-film layer; 124-auxiliary heating silk screen layer; 13-insulation module; 14-temperature control circuit module;

[0066] 2- Electronic components. DETAILED DESCRIPTION

[0067] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative work belong to the scope of protection of the present invention. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0068] Any specific numerical value disclosed herein (including the endpoint of the numerical range) is not limited to the exact value of the numerical value, but should be understood to also cover values ​​close to the exact value, such as all possible numerical values ​​within the range of ±5% of the exact value. In addition, for the disclosed numerical range, the endpoint values ​​of the range, the endpoint values ​​and the specific point values ​​in the range, and the specific point values ​​can be arbitrarily combined to obtain one or more new numerical ranges, and these new numerical ranges should also be regarded as specifically disclosed herein.

[0069] The terms used in the present disclosure are only intended to describe specific exemplary embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "a kind of" and "the" as used in the present disclosure may be intended to also include plural forms. The terms "comprise", "include", "contain" and "have" are inclusive, thus illustrating the presence of the features, elements, compositions, steps, integers, operations and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or their collections. Although the open term "comprise" should be understood as a non-limiting term for describing and claiming the various embodiments described in the present disclosure, in some aspects, the term may be alternatively understood as a more restrictive and limited term, such as "consisting of..." or "consisting essentially of..." Thus, for any given embodiment of a narration composition, material, component, element, feature, integer, operation and / or process step, the present disclosure also particularly includes an embodiment consisting of or essentially consisting of such a composition, material, component, element, feature, integer, operation and / or process step. In the case of “consisting of,” alternative embodiments exclude any additional compositions, materials, components, elements, features, integers, operations and / or process steps, while in the case of “consisting essentially of,” any additional compositions, materials, components, elements, features, integers, operations and / or process steps that materially affect the basic and novel characteristics are excluded from such embodiments, but any compositions, materials, components, elements, features, integers, operations and / or process steps that do not materially affect the basic and novel characteristics may be included in the embodiments.

[0070] Any method steps, processes, and operations described in the present disclosure should not be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless expressly identified as a certain order of performance. It should also be understood that additional or alternative steps may be used unless otherwise stated.

[0071] In this application, except for the contents explicitly described, any matters or items not mentioned are directly applicable to those known in the art without any changes. Moreover, any embodiment described in this disclosure can be freely combined with one or more other embodiments described in this disclosure, and the technical solutions or technical ideas formed thereby are regarded as part of the original disclosure or original record of this application, and should not be regarded as new contents that have not been disclosed or anticipated in this disclosure, unless a person skilled in the art considers that the combination is obviously unreasonable.

[0072] Unless otherwise specified, the terms used herein have the same meaning as commonly understood by those skilled in the art. If a term is defined herein and its definition is different from the commonly understood meaning in the art, the definition herein shall prevail.

[0073] First aspect

[0074] See also Figure 1 and Figure 2 The present invention provides a circuit board 1 with a self-heating function, which is used to keep electronic components 2 warm. The circuit board 1 includes: a self-heating plate body 11, suitable for installing the electronic components 2; an auxiliary heating module 12, which is arranged on the self-heating plate body 11 and is suitable for wrapping the electronic components 2 together with the self-heating plate body 11; wherein the self-heating plate body 11 and the auxiliary heating module 12 can convert electrical energy into heat to keep the electronic components 2 warm.

[0075] The circuit board self-heating technology provided by the present invention integrates the heat source with the circuit board, reduces the dependence on external heating devices, thereby reducing the risk of overall system failure caused by failure of external heating devices, and further enhances the durability and maintainability of the overall system.

[0076] The present invention directly heats the chip through the circuit board self-heating technology, which can effectively maintain the chip and crystal oscillator within a healthy working temperature range, thereby enhancing the operating stability and reliability of the pressure transmitter in an extreme low temperature environment such as below -45°C; compared with traditional external heating equipment, the self-heating circuit board provided by the present invention generates heat directly on the circuit board, which effectively reduces the dissipation loss that may occur in a longer transmission process and significantly reduces the overall energy consumption.

[0077] See also Figure 1In some embodiments of the present invention, the self-heating plate body 11 includes: a substrate 111; a substrate green oil layer 112, at least partially covering the substrate 111, and the electronic component 2 is suitable for being arranged on the substrate green oil layer 112; a substrate heating body 113, including a first substrate heating body 1131 and a second substrate heating body 1132, wherein one side of the first substrate heating body 1131 is covered by the substrate green oil layer 112, and the other side is covered by the substrate 111, one side of the second substrate heating body 1132 is fixed on the substrate 111, and the other side passes through the substrate green oil layer 112 to be suitable for contacting the electronic component 2; wherein the first substrate heating body 1131 and the second substrate heating body 1132 can both convert electrical energy into heat, the first substrate heating body 1131 keeps the self-heating plate body 11 warm, and the second substrate heating body 1132 is suitable for keeping the electronic component 2 warm.

[0078] The function of the substrate green oil layer 112 is insulation protection.

[0079] In some embodiments of the present invention, a silk-screen pattern is provided on the side of the substrate green oil layer 112 facing away from the substrate 111, for identification and information recording and communication. Specifically, the silk-screen pattern can be printed on the substrate green oil layer by conventional silk-screen printing technology. It is worth noting that in some embodiments, machine vision recognition technology is used to produce the above-mentioned self-heating circuit board through an automated production line. At this time, the device with visual recognition capability can make corresponding feedback actions according to the silk-screen pattern to achieve efficient and reliable automated production.

[0080] In some embodiments of the present invention, the substrate 111 of the self-heating plate body 11 is made of glass fiber reinforced epoxy resin with a thickness of 1.6-2 μm.

[0081] In some embodiments of the present invention, the substrate green oil layer 112 of the self-heating plate body 11 is made of epoxy resin or acrylic resin, and has a thickness of 9-11 μm.

[0082] In some embodiments of the present invention, the material of the silk screen printing on the self-heating plate 11 is thermosetting text ink with a thickness of 18-22 μm.

[0083] In some embodiments of the present invention, the substrate heating element 113 of the self-heating plate 11 is a copper foil with a thickness of 30 to 40 μm and produced by a calendering process, which has a good heat generation effect.

[0084] In some embodiments of the present invention, the substrate heating element 113 of the self-heating plate 11 is aluminum foil with a thickness of 30-40 μm.

[0085] In some embodiments of the present invention, the substrate heating element 113 of the self-heating plate 11 is a silver foil with a thickness of 30-40 μm.

[0086] See also Figure 2 In some embodiments of the present invention, the wiring form of the substrate heating element 113 is a serpentine wiring, which has a better heat generation effect; of course, in other embodiments, other patterns and forms of wiring methods can also be used.

[0087] See also Figure 1 and Figure 2 In some embodiments of the present invention, the auxiliary heating module 12 includes: a flexible substrate 121; an auxiliary heating element 122; and a coating layer 123 stacked in sequence; wherein the side of the flexible substrate 121 away from the auxiliary heating element 122 is suitable for contacting the electronic component 2.

[0088] It is worth noting that, in some embodiments of the present invention, the substrate 111 in the self-heating plate body 11 can also be made of a flexible material like the flexible substrate 121 .

[0089] In some embodiments of the present invention, the auxiliary heating module 12 further includes: an auxiliary heating silk screen layer 124, which is arranged on the side of the coating layer 123 away from the flexible substrate 121. It is worth noting that the auxiliary heating silk screen layer 124 can be used for identification and information recording and communication; specifically, the silk screen pattern can be printed on the coating layer by conventional silk screen technology. It is worth noting that in some embodiments, machine vision recognition technology is used to produce the above-mentioned self-heating circuit board through an automated production line. At this time, the device with visual recognition ability can make corresponding feedback actions according to the silk screen pattern to achieve efficient and reliable automated production. In addition, since the electronic components 2 including chips and crystal oscillators are covered at the bottom by the auxiliary heating module 12, in order to facilitate personnel identification and understanding, the auxiliary heating silk screen layer 124 can be used to understand relevant information including the setting position of the chip and crystal oscillator and the specification parameters and models.

[0090] In some embodiments of the present invention, the flexible substrate 121 of the auxiliary heating module 12 is made of polyimide and has a thickness of 32-36 μm.

[0091] In some embodiments of the present invention, the auxiliary heating element 122 of the auxiliary heating module 12 is a copper foil with a thickness of 30 to 40 μm and manufactured by a calendering process.

[0092] In some embodiments of the present invention, the auxiliary heating element 122 of the auxiliary heating module 12 is aluminum foil, preferably with a thickness of 30-40 μm.

[0093] In some embodiments of the present invention, the auxiliary heating element 122 of the auxiliary heating module 12 is a silver foil, preferably with a thickness of 30-40 μm.

[0094] In some embodiments of the present invention, the coating layer 123 is made of polyimide and has a thickness of 8-12 μm.

[0095] In some embodiments of the present invention, the auxiliary thermal screen printing layer 124 is made of thermal curing text ink with a thickness of 18-22 μm.

[0096] In some embodiments of the present invention, the wiring form of the auxiliary heating element 122 is a serpentine wiring; of course, in other embodiments, other patterns and forms of wiring can also be used.

[0097] In some embodiments of the present invention, the auxiliary heating module 12 and the self-heating plate body 11 may be fixed by screws or by gluing.

[0098] In some embodiments of the present invention, the substrate heating element 113 and the auxiliary heating element 122 can share the same microcontroller and the same power supply; in other embodiments, two independent power supplies and the same microcontroller can be used to control the substrate heating element 113 and the auxiliary heating element 122.

[0099] In some embodiments of the present invention, the circuit board 1 further includes: a heat preservation module 13, which is arranged on a side of the auxiliary heating module 12 away from the self-heating board body 11. The heat preservation module 13 can prevent the heat from escaping, thereby further improving the heat preservation effect of the electronic components 2 including the chip and the crystal oscillator.

[0100] In some embodiments of the present invention, the thermal insulation module 13 is made of aerogel or polyurethane, and has a thickness of 16 to 20 mm.

[0101] In some embodiments of the present invention, the circuit board 1 also includes: a temperature control circuit module 14, which is arranged on the self-heating board body 11, and is used to monitor the temperature of the electronic component 2 to adjust the heating power of the self-heating board body 11 and / or the auxiliary heating module 12.

[0102] See also Figure 3In some embodiments of the present invention, the temperature control circuit module 14 includes: a microcontroller U1, wherein the microcontroller U1 is at least one of an STM32 series microcontroller and an MSP430 series microcontroller, and is used to realize the logic control of the entire circuit; a metal film resistor R1, which is used to form a voltage divider with a thermistor so that the microcontroller can read the temperature value; a metal film resistor R2, which is used as a pull-down resistor to avoid the base being suspended; a thermistor A, which is used to adjust its own resistance value according to the temperature, so as to combine with the metal film resistor R1 and output different voltages by voltage division; wherein the STM32 series microcontroller and the MSP430 series microcontroller, the metal film resistor and the thermistor are electrically connected, the thermistor changes its resistance value according to the ambient temperature, and then forms a voltage divider circuit with the metal film resistor to output a voltage signal to the STM32 series microcontroller and the MSP430 series microcontroller, and the voltage signal is converted into a set temperature by the STM32 series microcontroller and the MSP430 series microcontroller. Through the above-mentioned microcontroller U1, the circuit board self-heating technology provided by the present invention can keep the chip in a healthy operating temperature range at all times, which can significantly reduce the disturbance effect of temperature fluctuations on the pressure transmitter measurement results, thereby significantly improving the measurement accuracy of the pressure transmitter using this self-heating technology. The circuit board self-heating technology provided by the present invention can quickly respond to environmental temperature changes by controlling the circuit module, thereby timely adjusting the heating state of the circuit board to ensure that the pressure transmitter can quickly respond to environmental temperature fluctuations and can always maintain the best working state.

[0103] See also Figure 2 In some embodiments of the present invention, any one of the STM32 series microcontroller and the MSP430 series microcontroller is connected in series with the above copper foil; in other embodiments, any one of the STM32 series microcontroller and the MSP430 series microcontroller is connected in parallel with the above copper foil; the specific methods can be adjusted and combined according to actual design requirements.

[0104] The present invention provides a circuit board with a self-heating function, which can achieve self-heating through the circuit board to heat the chip and the crystal oscillator and keep them warm within a healthy operating temperature range; even under extremely low temperature conditions, the heating method provided by the present invention can ensure that the circuit board of the pressure transmitter has strong operating stability and service reliability, thereby broadening the application scenario scope of the pressure transmitter that uses the self-heating technology, and can enhance the performance of the pressure transmitter under harsh weather conditions.

[0105] It is worth noting that the specific color of "silk screen" and "silk screen layer" recorded in the specification of the present invention can be white or other colors, so as to play a role of obvious identification, convenient reading for personnel and automatic recognition by machines according to actual needs.

[0106] Second aspect

[0107] The present invention provides an electronic assembly, which includes: a circuit board 1 as described above; and an electronic component 2 which is coated between a self-heating plate body 11 and a secondary heating module 12 of the circuit board 1 .

[0108] In some embodiments of the present invention, the electronic component 2 is at least one of a chip and a crystal oscillator.

[0109] It is worth noting that the pressure transmitter provided by the present invention adopts the above-mentioned circuit board with self-heating function, so that various electronic components including chips and crystal oscillators can be kept warm within a healthy operating temperature range in an extremely low temperature environment, which significantly improves the overall performance of the electronic components, has good weather resistance and significant service robustness.

[0110] The third aspect

[0111] The present invention provides a pressure transmitter, which includes the above-mentioned circuit board 1, or includes the above-mentioned electronic component; the pressure transmitter also includes a pressure measuring component, and the pressure measuring component is electrically connected to the electronic component 2 arranged on the circuit board 1.

[0112] Exemplarily, the above-mentioned pressure measuring component may specifically be a pressure measuring membrane box, which can be used to measure the pressure of the medium to be measured.

[0113] It is worth noting that the pressure transmitter provided by the present invention adopts the above-mentioned circuit board with self-heating function, so that various electronic components in the transmitter including chips and crystal oscillators can be kept warm within a healthy operating temperature range in an extremely low temperature environment, which significantly improves the overall performance of the pressure transmitter, has good weather resistance and significant service robustness.

[0114] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims. In addition, the specification uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. The content of this specification should not be understood as a limitation of the present invention.

Claims

1. A circuit board (1) with self-heating function, used for heat preservation of electronic components (2), characterized in that: The circuit board (1) comprises: A self-heating plate (11) suitable for mounting the electronic component (2); A secondary heating module (12), arranged on the self-heating plate (11), and suitable for wrapping the electronic component (2) together with the self-heating plate (11); The self-heating plate (11) and the auxiliary heating module (12) are capable of converting electrical energy into heat to keep the electronic component (2) warm.

2. The circuit board (1) according to claim 1, characterized in that: The self-heating plate (11) comprises: substrate(111); A substrate green oil layer (112) at least partially covers the substrate (111), and the electronic component (2) is suitable for being arranged on the substrate green oil layer (112); A substrate heating element (113), comprising a first substrate heating element (1131) and a second substrate heating element (1132), wherein one side of the first substrate heating element (1131) is covered by the substrate green oil layer (112), and the other side is covered by the substrate (111); one side of the second substrate heating element (1132) is fixed to the substrate (111), and the other side passes through the substrate green oil layer (112) so as to be suitable for contacting the electronic component (2); The first substrate heating element (1131) and the second substrate heating element (1132) are both capable of converting electrical energy into heat; the first substrate heating element (1131) is used to keep the self-heating plate (11) warm, and the second substrate heating element (1132) is suitable for keeping the electronic component (2) warm.

3. The circuit board (1) according to claim 2, characterized in that: The self-heating plate (11) has at least one of the following characteristics: The substrate (111) is made of glass fiber reinforced epoxy resin and has a thickness of 1.6 to 2 μm; The substrate green oil layer (112) is made of epoxy resin or acrylic resin and has a thickness of 9 to 11 μm; The substrate heating element (113) is a copper foil, or an aluminum foil, or a silver foil with a thickness of 30 to 40 μm and made by a calendering process.

4. The circuit board (1) according to claim 2 or 3, characterized in that: The wiring form of the substrate heating element (113) is serpentine wiring.

5. The circuit board (1) according to claim 1, characterized in that: The auxiliary heating module (12) comprises: A flexible substrate (121); Auxiliary heating element (122); A coating layer (123); Wherein, the side of the flexible substrate (121) facing away from the auxiliary heat generating element (122) is suitable for contacting with the electronic component (2).

6. The circuit board (1) according to claim 5, characterized in that: The secondary heating module (12) further comprises: The auxiliary heat screen printing layer (124) is arranged on a side of the coating layer (123) away from the flexible substrate (121).

7. The circuit board (1) according to claim 6, characterized in that: The secondary heating module (12) has at least one of the following characteristics: The flexible substrate (121) is made of polyimide and has a thickness of 32 to 36 μm; The auxiliary heat generating element (122) is a copper foil, or an aluminum foil, or a silver foil, with a thickness of 30 to 40 μm and made by a calendering process; The coating layer (123) is made of polyimide and has a thickness of 8 to 12 μm; The auxiliary heat screen printing layer (124) is made of heat curing text ink and has a thickness of 18 to 22 μm.

8. The circuit board (1) according to any one of claims 5 to 7, characterized in that: The wiring form of the auxiliary heating element (122) is a serpentine wiring.

9. The circuit board (1) according to claim 1, characterized in that: The circuit board (1) further comprises: A heat preservation module (13) is arranged on a side of the auxiliary heating module (12) away from the self-heating plate (11); Preferably, the thermal insulation module (13) is made of aerogel or polyurethane and has a thickness of 16 to 20 mm.

10. The circuit board (1) according to claim 2 or 5, characterized in that: The circuit board (1) further comprises: The temperature control circuit module (14) is arranged on the self-heating plate (11) and is used to monitor the temperature of the electronic component (2) so as to adjust the heating power of the self-heating plate (11) and / or the auxiliary heating module (12).

11. The circuit board (1) according to claim 10, characterized in that: The temperature control circuit module (14) comprises: At least one of an STM32 series microcontroller and an MSP430 series microcontroller, used to realize the logic control of the whole circuit; Metal film resistors, used to form a voltage divider with the thermistor so that the microcontroller can read the temperature value, and also used as pull-down resistors to prevent the base from floating; Thermistor, used to adjust its own resistance value according to temperature, so as to combine with the metal film resistor and output different voltages through voltage division; The STM32 series microcontroller and the MSP430 series microcontroller, the metal film resistor and the thermistor are electrically connected. The thermistor changes its resistance value according to the ambient temperature, and then forms a voltage divider circuit together with the metal film resistor to output a voltage signal to the STM32 series microcontroller and the MSP430 series microcontroller, and the voltage signal is converted into a set temperature by the STM32 series microcontroller and the MSP430 series microcontroller.

12. An electronic component, characterized in that: The electronic components include: The circuit board (1) according to any one of claims 1 to 11; and The electronic component (2) is wrapped between the self-heating plate body (11) and the auxiliary heating module (12) of the circuit board (1).

13. The electronic component according to claim 12, characterized in that: The electronic component (2) is at least one of a chip and a crystal oscillator.

14. A pressure transmitter, characterized in that: The pressure transmitter comprises a circuit board (1) as claimed in any one of claims 1 to 11, or comprises an electronic component as claimed in claim 12 or 13; The pressure transmitter also includes a pressure measuring assembly, which is electrically connected to an electronic component (2) disposed on the circuit board (1).

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