Circuit board

Abstract

The embodiment of the present application provides a circuit board, comprising: at least one crimping hole in the circuit board body, the crimping hole being through from a first surface to a second surface, and a conductive layer being covered on at least part of the inner wall of each crimping hole; and at least part of crimping elements being correspondingly located in the crimping holes, wherein: at least one crimping element has a first crimping part and a second crimping part, the first crimping part is located outside the crimping hole and in contact with the conductive layer, and the first crimping part is made of conductive material, the second crimping part is located in the crimping hole covered with the conductive layer, and the second crimping part is made of at least insulating material in contact with the conductive layer, and / or at least one crimping element has a third crimping part and a fourth crimping part located in the crimping hole, the third crimping part is isolated by the fourth crimping part on both sides and in contact with the conductive layer, and the third crimping part is made of conductive material, and the fourth crimping part is made of insulating material. The problem of low signal integrity of high-speed signals of the circuit board in the related art is at least solved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of electronic products, and specifically, to a circuit board. Background Art

[0002] In PCB designs involving high-speed signal transmission, there's a greater demand for press-fit components. Furthermore, press-fit holes must demonstrate a certain level of signal interference immunity to minimize signal transmission loss. The advantages of the press-fit process include eliminating the need for soldering, reducing electronic product manufacturing costs, enabling quick component replacement and minimizing downtime and repairs. The PCB also eliminates additional thermal strain, preventing secondary soldering that can cause board defects and damage.

[0003] As electronic products gradually develop towards miniaturization and multi-function, the core components of electronic products, PCB boards, are gradually moving towards high density and high-speed signal transmission. Press-fit components are gradually replacing wave soldering components. However, press-fit components have many design defects in high-speed circuit boards and cannot be perfectly used in high-speed PCB board design. The disadvantages of using press-fit components for high-speed PCB design are as follows:

[0004] 1. The physical pins of the crimped components are far apart, resulting in increased differential signal impedance and impedance discontinuity;

[0005] 2. After the press-fit components are crimped onto the PCB, the high-speed signal copper traces on the lower layers of the PCB become thinner and farther apart, resulting in increased differential signal impedance and excessive deviation.

[0006] 3. The fisheye depth requirement for press-fit components is relatively strict. The high-speed signal holes cannot be fully back-drilled, resulting in the high-speed signal stub being too long, causing signal reflection. Or the high-speed signal is not allowed to pass through the third or even fifth layer of the PCB board, resulting in an increase in the number of PCB board layers, which in turn causes an increase in PCB board costs. Summary of the Invention

[0007] An embodiment of the present application provides a circuit board to at least solve the problem of low signal integrity of high-speed signals of the circuit board in the related art.

[0008] According to one embodiment of the present application, a circuit board is provided, comprising: a circuit board body, the circuit board body having a first surface and a second surface relative to each other, and the circuit board body having at least one crimping hole extending from the first surface to the second surface, at least part of the inner wall of each crimping hole being covered with a conductive layer; at least one crimping element, at least part of which is located in the crimping hole in a one-to-one correspondence, wherein: at least one of the crimping elements has a first crimping portion and a second crimping portion, the first crimping portion is located outside the crimping hole and in contact with the conductive layer, and the first crimping portion has a conductive material, the second crimping portion is located in the crimping hole covered with the conductive layer, and the second crimping portion has at least an insulating material in contact with the conductive layer, and / or at least one of the crimping elements has a third crimping portion and a fourth crimping portion located in the crimping hole, the third crimping portion is isolated on both sides of the third crimping portion and in contact with the conductive layer, and the third crimping portion has a conductive material, and the fourth crimping portion has an insulating material.

[0009] In an exemplary embodiment, the first crimping element has a first crimping portion and a second crimping portion, the first crimping portion contacts the first surface, the conductive layer located in the same crimping hole as the first crimping element is a first conductive layer, the first conductive layer extends along the first surface toward the second surface and covers part of the inner wall of the crimping hole, the second crimping portion has a first connecting portion and a first expansion portion, the circuit board body includes at least one first functional layer and at least one second functional layer stacked sequentially along the first surface toward the second surface, wherein: any one of the first functional layers is distributed with a first high-speed signal line in contact with the first conductive layer, the first conductive layer is located on the periphery of the first connecting portion, the first expansion portion is in contact with the inner wall, and / or any one of the second functional layers is distributed with a second high-speed signal line, the circuit board body also includes a conductive portion filled in the crimping hole and in contact with the second high-speed signal line, the conductive portion is located at one end of the crimping hole close to the second surface and in contact with the first conductive layer, the first conductive layer is located on the periphery of the first connecting portion and the first expansion portion and in contact with the first expansion portion.

[0010] In an exemplary embodiment, the second crimping element has the first crimping portion and the second crimping portion, the first crimping portion contacts the second surface, the second crimping portion is an elastic structure, the conductive layer located in the same crimping hole as the second crimping element is a second conductive layer, and the circuit board body includes at least one first functional layer and at least one second functional layer stacked in sequence along the first surface pointing to the second surface, wherein: any one of the first functional layers is distributed with a third high-speed signal line in contact with the second conductive layer, the second conductive layer covers the entire inner wall of the crimping hole, and / or any one of the second functional layers is distributed with a fourth high-speed signal line in contact with the second conductive layer, the second conductive layer extends along the second surface toward the first surface and covers part of the inner wall of the crimping hole.

[0011] In an exemplary embodiment, the elastic structure includes a conductive core and an elastic insulating film, and the elastic insulating film wraps the conductive core, wherein: when the crimping hole provided with the second crimping element has a first length, the conductive core has a plurality of first bending segments connected in sequence; when the crimping hole provided with the second crimping element has a second length greater than the first length, the conductive core has a plurality of second bending segments connected in sequence, and the curvature of the second bending segment is smaller than the curvature of the first bending segment, or the conductive core is a straight segment.

[0012] In an exemplary embodiment, a plurality of third crimping elements respectively have the third crimping portion and the fourth crimping portion and are located in adjacent crimping holes. The conductive layer located in the same crimping hole as the third crimping element is a third conductive layer. The circuit board body includes a plurality of functional layers stacked sequentially, and at least one layer of the functional layer is distributed with a plurality of fifth high-speed signal lines in contact with the third conductive layer. The fifth high-speed signal lines are used to transmit high-speed differential signals. The spacing between adjacent third crimping elements is 0.5 to 0.8 mm.

[0013] In an exemplary embodiment, the third crimping element has a third crimping portion and a fourth crimping portion, the conductive layer located in the same crimping hole as the third crimping element is a third conductive layer, the circuit board body includes multiple functional layers stacked sequentially, at least one layer of the functional layer is distributed with multiple sixth high-speed signal lines in contact with the third conductive layer, the sixth high-speed signal line is used to transmit high-speed differential signals, and the two third crimping portions located in the same crimping hole are connected to the multiple sixth high-speed signal lines through the third conductive layer.

[0014] In an exemplary embodiment, the third crimping element has the third crimping portion and the fourth crimping portion, the fourth crimping portion has the second connecting portion and the second expansion portion connected sequentially along the first direction, each of the third crimping portions covers the second connecting portion and the second expansion portion at the same time, and the thickness of the first part of the third crimping portion covering the second connecting portion is greater than the thickness of the first part of the third crimping portion covering the second expansion portion.

[0015] According to another embodiment of the present application, another circuit board is provided, including: a circuit board body, the circuit board body having a first surface and a second surface relative to each other, and the circuit board body having a plurality of crimping holes extending from the first surface to the second surface, wherein: any two adjacent crimping holes respectively include a first hole segment and a second hole segment that are connected, the aperture of the first hole segment is larger than the aperture of the second hole segment, and the spacing between adjacent first hole segments is smaller than the spacing between adjacent second hole segments, the inner wall of the first hole segment is covered with a conductive layer, the conductive layer includes a first side wall and a second side wall that are relative and connected, the first side wall being located on the side of the second side wall close to the adjacent first hole segment in the same first hole segment, and the thickness of the first side wall being greater than the thickness of the second side wall; at least one crimping element, at least part of the crimping element being located in the crimping hole in a one-to-one correspondence.

[0016] In an exemplary embodiment, the surface of the crimping element located in the first hole segment and in contact with the conductive layer has a first projection on the second surface, the side wall of the first hole segment has a second annular projection on the second surface, and the first projection is located within the area enclosed by the second annular projection and has a line segment with the same curvature as the first projection.

[0017] In an exemplary embodiment, the crimping element includes at least one first crimping element and / or at least one second crimping element, the first crimping element and the second crimping element respectively having a first crimping portion and a second crimping portion, wherein: in the first crimping element, the first crimping portion is located outside the crimping hole and contacts the first surface, and the first crimping portion has a conductive material, the second crimping portion is located in the crimping hole covered with the conductive layer, and the second crimping portion has an insulating material, the conductive layer located in the same crimping hole as the first crimping element is a first conductive layer, the first conductive layer extends along the first surface to the second surface and covers part of the inner wall of the crimping hole, the second crimping portion has a first connecting portion and a first expansion portion, the circuit board body includes at least one first functional layer and at least one second functional layer stacked in sequence along the first surface pointing to the second surface, any one of the first functional layers is distributed with a first high-speed signal line in contact with the first conductive layer, the first conductive layer is located outside the first connecting portion, the first expansion portion is in contact with the inner wall, and / or any A second high-speed signal line is distributed on the second functional layer, and the circuit board body also includes a conductive portion filled in the crimping hole and in contact with the second high-speed signal line, the conductive portion is located at one end of the crimping hole close to the second surface and in contact with the first conductive layer, and the first conductive layer is located on the periphery of the first connecting portion and the first expansion portion and in contact with the first expansion portion; in the second crimping element, the first crimping portion is in contact with the second surface, the second crimping portion is an elastic structure, and the conductive layer located in the same crimping hole as the second crimping element is a second conductive layer. The circuit board body includes at least one first functional layer and at least one second functional layer stacked in sequence along the first surface toward the second surface, any one of the first functional layers is distributed with a third high-speed signal line in contact with the second conductive layer, the second conductive layer covers the entire inner wall of the crimping hole, and / or any one of the second functional layers is distributed with a fourth high-speed signal line in contact with the second conductive layer, and the second conductive layer extends along the second surface toward the first surface and covers part of the inner wall of the crimping hole.

[0018] Through the present application, mainly from the perspective of the entity packaging of the crimping component and the corresponding Printed Circuit Board (PCB) card design, with the PCB card processing and manufacturing and the assembly of the crimping component, a new pin entity structure of the crimping component and the corresponding PCB card design method are proposed, which avoids the PCB card high-speed signal wiring difficulty of the conventional crimping component, increases the high-speed PCB card layer, impedance discontinuity and other problems, thereby improving the high-speed signal transmission quality of the crimping component, reducing the PCB layer and the overall production cost of the electronic product, and facilitating the popularization and use of the crimping component in the high-speed and high-density PCB card. At the same time, the circuit board is mainly applied to the research and development design of server products, and mainly aims at the entity packaging of the high-speed and high-density crimping connector and the corresponding PCB design. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 is a structural schematic diagram of a circuit board according to an embodiment of the present application;

[0020] Figure 2 is a structural schematic diagram of another circuit board according to an embodiment of the present application;

[0021] Figure 3 is a structural schematic diagram of still another circuit board according to an embodiment of the present application;

[0022] Figure 4 is a structural schematic diagram of a first crimping component according to an embodiment of the present application;

[0023] Figure 5 is a structural schematic diagram of a second crimping component according to an embodiment of the present application;

[0024] Figure 6 is a structural schematic diagram of a third crimping component according to an embodiment of the present application;

[0025] Figure 7 is a structural schematic diagram of a third crimping component according to an embodiment of the present application; Figure 3 is a cross-sectional structural schematic diagram of the third crimping component at aa' according to an embodiment of the present application;

[0026] Figure 8 is a cross-sectional structural schematic diagram of a crimping hole according to an embodiment of the present application; Figure 3 is a cross-sectional structural schematic diagram of the crimping hole at aa' according to an embodiment of the present application;

[0027] Figure 9 is a cross-sectional structural schematic diagram of another third crimping component according to an embodiment of the present application; Figure 3 is a cross-sectional structural schematic diagram of the another third crimping component at aa' according to an embodiment of the present application;

[0028] Figure 10 is a structural schematic diagram of another circuit board according to an embodiment of the present application;

[0029] Figure 11 is based on Figure 10 A schematic diagram of the cross-sectional structure of a crimping hole at position bb′ is shown;

[0030] Figure 12 is a structural schematic diagram of another circuit board according to an embodiment of the present application;

[0031] Figure 13 This is a schematic structural diagram of another circuit board according to an embodiment of the present application.

[0032] Among them, the above reference numerals include:

[0033] 1. PCB body; 101. First surface; 102. Second surface; 11. Press-fit hole; 1101. First hole section; 1102. Second hole section; 1103. First side wall; 1104. Second side wall; 111. Conductive layer; 1111. First conductive layer; 1112. Second conductive layer; 1113. Third conductive layer; 20. Press-fit element; 21. First press-fit element; 22. Second press-fit element; 23. Third press-fit element; 221. First press-fit portion; 222. Second press-fit portion; 2221. Third press-fit portion A connecting portion; 2222, a first expansion portion; 2223, a conductive core; 2224, an elastic insulating film; 223, a third crimping portion; 224, a fourth crimping portion; 2241, a second connecting portion; 2242, a second expansion portion; 31, a first high-speed signal line; 32, a second high-speed signal line; 33, a third high-speed signal line; 34, a fourth high-speed signal line; 35, a fifth high-speed signal line; 36, a sixth high-speed signal line; 40, a conductive portion; 50, a backdrilling area; 61, a first projection; 62, a second annular projection. DETAILED DESCRIPTION

[0034] The embodiments of the present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0035] It should be noted that the terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0036] In this embodiment, a circuit board is provided, such as Figures 1 to 2 and Figure 3 As shown, it includes: a circuit board body 1, the circuit board body 1 has a first surface 101 and a second surface 102 opposite to each other, and the circuit board body 1 has at least one crimping hole 11 passing from the first surface 101 to the second surface 102, and at least part of the inner wall of each crimping hole 11 is covered with a conductive layer 111; at least one crimping element 20, at least part of the crimping element 20 is located in the crimping hole 11 in a one-to-one correspondence, wherein: Figures 1 to 2As shown, at least one crimping element 20 has a first crimping portion 221 and a second crimping portion 222, the first crimping portion 221 is located outside the crimping hole 11 and contacts the conductive layer 111, and the first crimping portion 221 has a conductive material, the second crimping portion 222 is located in the crimping hole 11 covered with the conductive layer 111, and the second crimping portion 222 has at least an insulating material in contact with the conductive layer 111, and / or as shown Figure 3 As shown, at least one crimping element 20 has a third crimping portion 223 and a fourth crimping portion 224 located in the crimping hole, the third crimping portion 223 is isolated on both sides by the fourth crimping portion 224 and contacts the conductive layer 111, and the third crimping portion 223 has a conductive material and the fourth crimping portion 224 has an insulating material.

[0037] The above-mentioned circuit board mainly starts from the perspective of the physical packaging of press-fit components and their corresponding printed circuit board (PCB) board design, along with its PCB board processing and assembly of press-fit components, and proposes a new pin physical structure of press-fit components and the corresponding PCB board design method, which avoids the difficulties of high-speed signal wiring of PCB boards with conventional press-fit components, increases the number of high-speed PCB board layers, impedance discontinuity and other problems, thereby improving the high-speed signal transmission quality of press-fit components, while reducing the number of PCB board layers, reducing the overall production cost of electronic products, and facilitating the promotion and use of press-fit components in high-speed and high-density PCB boards. At the same time, the circuit board is mainly used in the research and development and design of server products, mainly for the physical packaging of high-speed and high-density press-fit connector devices and their corresponding PCB design.

[0038] Specifically, the pins of the crimping element are improved. When at least one crimping element includes a first crimping portion and a second crimping portion, the first crimping portion with conductive material is located outside the crimping hole and in contact with the conductive layer, while the second crimping portion with insulating material is located inside the crimping hole. When at least one crimping element includes a third crimping portion and a fourth crimping portion, the third crimping portion with conductive material is isolated on both sides of the crimping hole by the fourth crimping portion with insulating material. After the crimping component is crimped onto a high-speed PCB board, the crimping pins only have a metal connection with the TOP layer of the board, and there is no connection in the through-hole. This allows high-speed routing on any layer of the PCB board and allows back drilling. The PCB board is no longer restricted by the minimum fisheye depth and meets the maximum control requirements of the high-speed signal stub, thereby improving the quality of high-speed signal transmission and signal integrity. At the same time, there is no need to increase the PCB board stacking, thereby reducing the manufacturing cost of the PCB board.

[0039] In one option, Figure 1As shown, the first crimping element 21 has a first crimping portion 221 and a second crimping portion 222, the first crimping portion 221 contacts the first surface 101, the conductive layer 111 located in the same crimping hole 11 as the first crimping element 21 is a first conductive layer 1111, the first conductive layer 1111 extends along the first surface 101 toward the second surface 102 and covers part of the inner wall of the crimping hole 11, the second crimping portion 222 has a first connecting portion 2221 and a first expansion portion 2222, and the circuit board body 1 includes at least one first functional layer and at least one second functional layer stacked in sequence along the first surface 101 pointing to the second surface 102.

[0040] In the above optional solution, any one of the first functional layers may be provided with a first high-speed signal line 31 in contact with the first conductive layer 1111. The first conductive layer 1111 is located on the periphery of the first connecting portion 2221, and the first expansion portion 2222 is in contact with the inner wall. Figure 1 The first crimping element 21 is shown in the left crimping hole 11; any second functional layer can be distributed with a second high-speed signal line 32, and the circuit board body 1 also includes a conductive portion 40 filled in the crimping hole 11 and in contact with the second high-speed signal line 32. The conductive portion 40 is located at one end of the crimping hole 11 close to the second surface 102 and in contact with the first conductive layer 1111. The first conductive layer 1111 is located at the periphery of the first connecting portion 2221 and the first expansion portion 2222 and in contact with the first expansion portion 2222. Figure 1 The first crimping element 21 shown in FIG. 2 is located in the right crimping hole 11 .

[0041] Specifically, the first crimping element of the above scheme is crimped onto the high-speed PCB board, so that the pins of the crimped components have only metal connections with the TOP layer of the board, and the crimping through-holes only play a crimping and fixing role without any connection, which allows the high-speed PCB board to carry out high-speed signal routing on any signal layer and can be back-drilled, no longer restricted by the minimum fisheye depth, and meets the maximum control requirements of the high-speed signal stub, thereby improving the quality of high-speed signal transmission. At the same time, there is no need to increase the PCB board stacking, thereby reducing the manufacturing cost of the PCB board. Figure 1 As can be seen in the figure, the first high-speed signal line 31 is on layer 3 of the PCB, with backdrilling used for the through-holes. The press-fit pin connection point is in the backdrilled area 50, resulting in significant expansion. The second high-speed signal line 3 is on the third-to-last layer of the PCB, eliminating the need for backdrilling. The press-fit pin connection point is in the metal area of ​​the through-hole, resulting in minimal expansion. Both connections meet expansion requirements. Furthermore, the press-fit component pins are connected to the PCB only on the top layer, allowing high-speed signal routing and backdrilling to be performed on any layer of the PCB, meeting stub requirements without increasing the PCB stackup.

[0042] In the above embodiment, the cross-sectional structure of the first crimping element not crimped into the crimping hole of the circuit board body is as follows: Figure 4 As shown, the first crimping element 21 has a first crimping portion 221 and a second crimping portion 222, wherein the first crimping portion 221 can include various shapes such as a sphere, an ellipsoid, or a polyhedron. A first direction A and a second direction B are established, wherein the first direction B is the direction from the first crimping portion 221 to the second crimping portion 222, and the second direction A is perpendicular to the first direction B. The longest diameter of the first crimping portion 221 in the first direction B is 0.35mm to 0.45mm, and the maximum thickness of the first crimping portion 221 in the second direction B is 0.1mm to 0.2mm. The conductive material constituting the first crimping portion can include various materials such as copper, aluminum, silver, carbon film, and lead-tin alloy. The shape and material of the first crimping portion 221 are not specifically limited in this application. The above structure can facilitate the crimping of the crimping component on the PCB board and ensure good contact with the pads on the PCB board. The second crimping portion 222 is made of insulating material including non-metallic material, such as plastic, glass fiber, etc. The thickness of the second crimping portion 222 in the second direction B (i.e., fisheye depth) is 0.65mm to 0.9mm, and the diameter of the first expansion portion in the first direction is 0.3mm to 0.5mm. This range is expanded, so that the first crimping element 21 can be used on PCB boards with different thicknesses. In addition, if Figure 1 As shown, when the first crimping element 21 is crimped into the crimping hole 11, the first expansion portion 2222 has a greater expansion coefficient, providing insulation within the crimping hole 11. In crimping holes 11 that include a backdrilled area 50 (the crimping hole 11 on the left in the figure), the presence of the backdrilled area 50 increases the diameter of the first expansion portion 2222. Even though the first conductive layer 1111 has been backdrilled away at the connection point, resulting in a 0.15-0.2mm increase in the hole diameter at the connection point compared to the non-backdrilled area, the crimped component can still be crimped and installed more securely and reliably.

[0043] Specifically, when the first crimping element is inserted into the crimping hole of the PCB board, the first crimping portion forms metal contact with the first surface (i.e., the TOP layer) of the PCB board, thereby establishing an electrical path for the signal or power supply and achieving efficient signal transmission; the first expansion portion will expand due to its material properties, filling the gap between the crimping hole and the crimping pin, thereby playing an insulating and fixing role, to ensure that the crimping element will not be electrically connected to other layers of the PCB board except for the metal contact points with the TOP layer and the first conductive layer, thus avoiding unwanted short circuits or signal leakage. Since the crimping element only forms a metal connection with the TOP layer and the first conductive layer of the PCB board, and is isolated from the metal parts of other areas in the hole, this allows the backdrilling operation to be performed without damaging the crimping pin, thereby controlling the stub length (backdrilling area) of the via, thereby ensuring impedance continuity, reducing signal reflections, and improving the integrity of high-speed signals.

[0044] In one option, Figure 2 As shown, the second crimping element 22 has a first crimping portion 221 and a second crimping portion 222, the first crimping portion 221 contacts the second surface 102, the second crimping portion 222 is an elastic structure, the conductive layer 111 located in the same crimping hole 11 as the second crimping element 22 is a second conductive layer 1112, and the circuit board body 1 includes at least one first functional layer and at least one second functional layer stacked in sequence along the first surface 101 pointing to the second surface 102.

[0045] In the above optional solution, any one of the first functional layers may be distributed with a third high-speed signal line 33 in contact with the second conductive layer 1112, and the second conductive layer 1112 covers the entire inner wall of the crimping hole 11, such as Figure 2 The second crimping element 22 is shown in the left crimping hole 11; any second functional layer may be distributed with a fourth high-speed signal line 34 in contact with the second conductive layer 1112, and the second conductive layer 1112 extends along the second surface 102 toward the first surface 101 and covers part of the inner wall of the crimping hole 11, as shown in FIG. Figure 2 The second crimping element 22 shown in FIG. 1 is located in the right crimping hole 11 .

[0046] Specifically, in the above scheme, the second press-fit component, when pressed onto the high-speed PCB, only has a metal connection to the bottom layer (the second surface of the PCB body). There is no connection between the top layer (the first surface of the PCB body) and the press-fit hole. This eliminates fisheye depth restrictions, allowing high-speed routing on any layer of the PCB, and backdrilling can begin from the top layer. This allows high-speed signal design to be completed without increasing the number of high-speed PCB layer stacks, reducing PCB manufacturing costs.

[0047] In the above embodiment, the cross-sectional structure of the second crimping element is as follows: Figure 5 As shown, the second crimping element 22 has a first crimping portion 221 and a second crimping portion 222. The first crimping portion 221 can be in various shapes, such as a cone, sphere, ellipsoid, or polyhedron. The maximum diameter of the first crimping portion in the second direction B is 0.3mm to 0.5mm, which is larger than the diameter of the crimping hole on the second surface. The second crimping portion 222 can be elastically stretched and has a length between 1.7 and 2.5mm. The materials used may include conductive and elastic materials, such as fiberglass, plastic, silicone rubber, epoxy resin, and polyester film, and are widely applicable to various PCB thickness requirements. The outer periphery of the crimping tube foot is made of fiberglass or other elastic insulating materials to isolate it from the connection inside the PCB crimping hole.

[0048] Specifically, the second crimping element is designed to have an elastic funnel shape, with a conical head and an elastic insulating material around the cylindrical part. This design allows the crimping pin to be elastically stretched during the process of being pressed into the PCB board, thereby adapting to PCB boards of different thicknesses and enhancing its versatility and adaptability in different application scenarios. When the conical head of the second crimping element is pressed into the PCB board, it will form a firm metal contact with the second surface (BOTTOM layer) of the board, which is the main contact point of the crimping connection. The good formation of the contact point is the key to electrical connection, ensuring the reliable transmission of high-speed signals or power. The elastic insulating material around the crimping pin column will expand during the crimping process, filling the gap between the crimping hole and the crimping pin, playing an insulating and fixing role. The use of this insulating material ensures that the crimping pin will not form any additional electrical connections with other PCB board layers except for the metal contact points with the BOTTOM layer, avoiding the problems of signal short circuit or crosstalk, while ensuring the firm installation of the crimping pin. Since the press-fit pins only form metal contact with the BOTTOM layer of the PCB board, and the rest of the hole is isolated by insulating material, high-speed signal routing can be freely performed on any layer of the PCB board. Backdrilling can be performed starting from the TOP layer to control the stub length of the through hole, ensure the impedance continuity and stability of the entire signal path, reduce signal reflections, and improve signal integrity.

[0049] In one option, Figure 5 As shown, the elastic structure includes a conductive core 2223 and an elastic insulating film 2224, and the elastic insulating film 2224 wraps the conductive core 2223, wherein: Figure 2 As shown, when the crimping hole provided with the second crimping element 22 has a first length, the conductive core 2223 has a plurality of first bending segments connected in sequence; when the crimping hole provided with the second crimping element 22 has a second length greater than the first length, the conductive core has a plurality of second bending segments connected in sequence, and the curvature of the second bending segment is smaller than the curvature of the first bending segment, or the conductive core 2223 is a straight segment.

[0050] In the above embodiment, the conductive core 2223 is usually metal, which makes it difficult to achieve elastic stretching together with the elastic insulating film 2224. However, for the conductive core 2223 in the present application, when used in a thinner PCB board, it can be compressed to form multiple bending segments with a larger curvature, and when used in a thicker PCB board, it can be stretched to form multiple bending segments with a smaller curvature. When stretched to a certain extent, the above conductive core 2223 approaches a straight line segment, so that the elastic insulating film 2224 can be adjusted to have different degrees of bending to adapt to different thicknesses of the PCB board; the use of the elastic insulating film enables the pressed pin column to adapt to different PCB thicknesses when pressed into the PCB board card pressing hole, and at the same time, the gap between the pin and the hole wall is filled by the elastic expansion of the material, providing a stable physical connection, ensuring the reliability of the connection, and avoiding the problems of poor contact or unstable fixation caused by changes in PCB thickness. The outer elastic insulating film isolates the second crimping portion from direct contact with other conductive layers within the PCB crimping hole, preventing short circuits and electrical interference. This prevents short circuits or interference from seriously affecting signal integrity during high-speed signal transmission, leading to data transmission errors or decreased system performance. The internal conductive core forms a solid metal contact point with the bottom (BOTTOM) layer of the PCB, improving signal quality and integrity. Furthermore, because the crimped pins only make contact at the BOTTOM layer, backdrilling can be performed without damaging the connection point, effectively controlling the stub length and further optimizing the impedance matching of the signal path. The separation of the outer elastic insulating film and the internal conductive core within the elastic structure allows high-speed signal routing and backdrilling to be performed on any layer of the PCB, greatly enhancing circuit design flexibility and signal routing freedom.

[0051] In an optional scheme, multiple third crimping elements respectively have a third crimping portion and a fourth crimping portion and are located in adjacent crimping holes. The conductive layer located in the same crimping hole as the third crimping element is the third conductive layer. The circuit board body includes multiple functional layers stacked in sequence. At least one functional layer is distributed with multiple fifth high-speed signal lines in contact with the third conductive layer. The fifth high-speed signal line is used to transmit high-speed differential signals. The spacing between adjacent third crimping elements is 0.5 to 0.8 mm.

[0052] In the above embodiment, in the process of designing high-speed circuits, effective control of impedance matching can reduce signal reflection and improve signal integrity. In the prior art, the spacing of the crimping elements is 0.9 mm. In the above embodiment, the spacing of the third crimping element is reduced to 0.5-0.8 mm, making it closer to the impedance value of the high-speed differential signal line in the conventional design, such as the impedance requirement of 85Ω for the high-speed differential signal line, which can better control the transmission impedance of the high-speed differential signal and maintain the continuity of the high-speed signal impedance. It should be noted that only the impedance at the connection between the crimping pin and the crimping hole of the PCB board is changed here, and the impedance at the non-connection point will still be greater than 85 ohms. At the same time, reducing the distance between the return GND crimping pin can also reduce the impedance, and the method is the same. In addition, the reduction in the spacing of the third crimping element reduces the size of the crimping components, which is beneficial to the miniaturization design of the PCB board and reduces the manufacturing cost of the PCB board.

[0053] In one option, Figure 3 As shown, the third crimping element 23 has a third crimping portion 223 and a fourth crimping portion 224. The conductive layer 111 located in the same crimping hole as the third crimping element 23 is the third conductive layer 1113. The circuit board body 1 includes multiple functional layers stacked in sequence, and at least one functional layer is distributed with multiple sixth high-speed signal lines in contact with the third conductive layer 1113. The sixth high-speed signal line 36 is used to transmit high-speed differential signals, and the two third crimping portions 223 located in the same crimping hole 11 are connected to the multiple sixth high-speed signal lines 36 through the third conductive layer 1113.

[0054] In the above embodiment, the circuit board body 1 comprises multiple functional layers stacked sequentially. At least one of the functional layers includes multiple sixth high-speed signal lines 36 that contact the third conductive layer 1113. Specifically, the third conductive layer 1113 in the press-fit hole 11 is connected to multiple high-speed signal lines. This enables high-speed signal routing across different layers of the PCB. In particular, when the press-fit hole is designed as two metal networks separated by a gap, good signal quality for high-speed signals can be maintained even in complex, multi-layered PCB designs.

[0055] In one option, Figure 6 As shown, the third crimping element 23 has a third crimping portion 223 and a fourth crimping portion 224, the fourth crimping portion 224 has a second connection portion 2241 and a second expansion portion 2242 connected sequentially along the first direction B, each third crimping portion 223 covers the second connection portion 2241 and the second expansion portion 2242 at the same time, and the thickness of the first part of the third crimping portion 223 covering the second connection portion 2241 is greater than the thickness of the first part of the third crimping portion 223 covering the second expansion portion 2242.

[0056] In the above embodiment, the third crimping element has a third crimping portion and a fourth crimping portion. The third crimping portion is isolated on both sides by the fourth crimping portion and contacts the conductive layer, thereby dividing the third crimping element into two parts, with glass fiber isolation used in the middle to isolate it. The third crimping element can be connected to different high-speed signal lines, which can prevent electromagnetic interference (EMI) between differential pairs and between differential pairs and ground lines, and avoid additional coupling that may damage signal integrity. At the same time, it can ensure the impedance matching and continuity of high-speed differential signals in the crimping hole. This design enables the signal to maintain a stable impedance (for example, 85 ohms) during transmission, thereby reducing signal reflection and interference and improving signal quality and stability.

[0057] For example, calculations show that, without changing the conventional crimping element, crimping pin diameter, or crimping pin spacing, to split the high-speed signal crimping pin into a pair of differential signals while meeting the 85Ω impedance requirement, the thickness of the fourth crimping portion needs to be between 0.12 and 0.14 mm; the thickness of the third crimping portion at the non-contact point (i.e., the first portion) is 0.12 mm, and the thickness of the third crimping portion at the contact point (i.e., the second portion) is 0.09 mm. Because the contact point contacts the crimping hole of the PCB board, and the thickness of the third conductive layer in the crimping hole is approximately 0.025 mm, the thickness of the third crimping portion of the second expansion portion of the third crimping element is slightly smaller than the thickness of the third crimping portion of the second connection portion, approximately 0.025 mm.

[0058] In some options, Figure 3 The cross section of the third crimping element 23 at aa′ can be as follows: Figure 7 As shown, the fourth crimping portion 224 separates the third crimping portion 223, and the third crimping portions 223 on both sides of the fourth crimping portion 224 do not contact each other. Figure 3 The cross-sectional view of the crimping hole 11 at aa′ is shown as follows: Figure 8 As shown, the third conductive layer 1113 is located on both sides of the crimping hole 11, and the third conductive layers 1113 on both sides of the crimping hole 11 do not touch each other. When the third crimping portion 223 is inserted into the crimping hole 11 in the circuit board body 1, the third crimping portions 223 on both sides of the third crimping element 23 form an electrical connection with the third conductive layers 1113 on both sides of the crimping hole 11, enabling high-speed signal transmission.

[0059] In the above scheme, the high-speed signal crimping hole is divided into two network signals during the process of crimping the third crimping component onto the corresponding crimping pin package on the high-speed PCB board. During the PCB board processing, other processing techniques and processes are the same as conventional methods. After the through-hole is electroplated with conductive material, a milling cutter is used to mill through the crimping hole from the top and bottom surfaces of the PCB board, disconnecting the third crimping ring. The reflow crimping pins on both sides remain unchanged, and the middle differential pin is divided into two, thus forming a pair of differential signals. This reduces the number of crimping pins on the crimping connector and the size of the crimping component, which is conducive to the miniaturization of the PCB board design.

[0060] In other options, Figure 3 The cross section of the third crimping element 23 at aa′ can be as follows: Figure 9 As shown, the cross-section of the third crimping element 23 is elliptical, the semicircular third conductive layer 1113 on both sides is the positive and negative poles of the high-speed differential signal, and the middle is the fourth crimping part 224; this design is easier to control the high-speed differential signal impedance, and at the same time, there are more isolated fourth crimping parts in the middle, the expansion coefficient is larger, and it is more conducive to the firmness of the crimping.

[0061] According to another embodiment of the present application, Figures 10 to 13 As shown, another circuit board is provided, comprising: a circuit board body 1, the circuit board body 1 having a first surface 101 and a second surface 102 opposite to each other, and a plurality of crimping holes 11 extending from the first surface 101 to the second surface 102, wherein any two adjacent crimping holes 11 respectively include a first hole segment 1101 and a second hole segment 1102 connected to each other, the aperture of the first hole segment 1101 being larger than the aperture of the second hole segment 1102, and the spacing between adjacent first hole segments 1101 being smaller than the spacing between adjacent first hole segments 1101. The spacing between the adjacent second hole segments 1102 is determined, and the inner wall of the first hole segment 1101 is covered with a conductive layer, the conductive layer includes a first side wall 1103 and a second side wall 1104 that are relative and connected to each other, and the first side wall 1103 in the same first hole segment 1101 is located on the side of the second side wall 1104 close to the adjacent first hole segment 1101, and the thickness of the first side wall 1103 is greater than the thickness of the second side wall 1104; at least one crimping element 20, at least part of the crimping element 20 is located in the crimping hole 11 in a one-to-one correspondence.

[0062] Specifically, a thickened first sidewall is formed in the first hole section of the press-fit hole in the aforementioned circuit board, ensuring impedance continuity for high-speed signals in the press-fit hole area, avoiding signal reflections caused by impedance discontinuity, optimizing signal integrity, and improving the transmission quality of high-speed signals. Furthermore, by adjusting the thickness of the first and second sidewalls, as well as the spacing between adjacent first hole ends, the same impedance requirements (e.g., 85Ω) as conventional designs can be achieved, allowing the entire signal chain, from the press-fit pins to the traces on the PCB, to maintain stable impedance characteristics and reduce signal distortion. Furthermore, because the press-fit hole design allows high-speed signals to be routed on any layer, designers have greater freedom when laying out signal lines, allowing for more flexible circuit layout planning without being restricted by the strict location of press-fit components.

[0063] In addition, the above-mentioned press-fit holes can resolve the contradiction between the minimum fisheye depth requirement for the press-fit component pins and the maximum requirement for the backdrilled stub of the high-speed differential signal, avoiding the increase in manufacturing costs caused by the increase in the number of layers of the high-speed PCB board. At the same time, it can also solve the signal integrity problem of high-speed signal transmission caused by the discontinuity of high-speed signal impedance in the high-speed differential signal pins and the press-fit holes of the PCB board.

[0064] In the above embodiment, Figure 10 The schematic projection diagram of the crimping hole 11 at the structure bb′ shown in FIG. Figure 11 As shown, in addition to the connection point, the press-fit hole also includes a semi-deep elliptical slot. This prevents signal reflections caused by impedance discontinuities, optimizes signal integrity, and enhances high-speed signal transmission quality. Furthermore, by increasing the diameter of the first hole segment and reducing the spacing between them, the same 85Ω impedance requirement as conventional designs can be achieved. This ensures a stable impedance across the entire signal chain, from the press-fit pin to the PCB trace, reducing signal distortion.

[0065] In one option, Figure 11 As shown, the surface of the crimping element located in the first hole segment and in contact with the conductive layer has a first projection 61 on the second surface, and the side wall of the first hole segment has a second annular projection 62 on the second surface. The first projection 61 is located within the area enclosed by the second annular projection 62 and has a line segment with the same curvature as the first projection 61.

[0066] In the above scheme, only the high-speed signal press-fit holes are changed, and the return ground press-fit pin press-fit holes remain unchanged; in the high-speed signal press-fit holes, except for the press-fit pin contact points and the high-speed signal stub area, the press-fit pin pad to the high-speed signal routing layer area is changed to a half-depth slot similar to an ellipse, such as Figure 11As shown, one side of the crimping hole and one side of the half-deep slot hole are concentric circles with the crimping pin. The diameter of the half-deep slot hole is 0.3-0.36mm. The diameter of the crimping hole is twice the diameter of the half-deep slot hole, and the width is 0.3-0.36mm. The above scheme can fully ensure the continuity of the impedance of the high-speed signal crimping hole throughout the entire process, avoiding the reflection noise generated during the high-speed signal transmission process caused by impedance discontinuity, thereby causing high-speed signal integrity problems.

[0067] In an exemplary embodiment, Figure 12 As shown, the crimping element 20 includes at least one first crimping element 21, the first crimping element 21 and the second crimping element 22 respectively have a first crimping portion 221 and a second crimping portion 222, in the first crimping element 21, the first crimping portion 221 is located outside the crimping hole and contacts the first surface 101, and the first crimping portion 221 has a conductive material, the second crimping portion 222 is located in the crimping hole 11 covered with a conductive layer 111, and the second crimping portion 222 has an insulating material, the conductive layer 111 located in the same crimping hole 11 as the first crimping element 21 is a first conductive layer 1111, the first conductive layer 1111 extends along the first surface 101 to the second surface 102 and covers part of the inner wall of the crimping hole 11, the second crimping portion 222 has a first connecting portion 2221 and a first expansion portion 2222, and the circuit board body 1 includes at least one first functional layer and at least one second functional layer stacked in sequence along the first surface 101 pointing to the second surface 102.

[0068] In the above exemplary embodiment, any one of the first functional layers may be provided with a first high-speed signal line 31 in contact with the first conductive layer 1111. The first conductive layer 1111 is located on the periphery of the first connecting portion 2221, and the first expansion portion 2222 is in contact with the inner wall. Figure 12 The first crimping element 21 is shown in the left crimping hole 11; any second functional layer can be distributed with a second high-speed signal line 32, and the circuit board body 1 also includes a conductive portion 40 filled in the crimping hole 11 and in contact with the second high-speed signal line 32. The conductive portion 40 is located at one end of the crimping hole 11 close to the second surface 102 and in contact with the first conductive layer 1111. The first conductive layer 1111 is located at the periphery of the first connecting portion 2221 and the first expansion portion 2222 and in contact with the first expansion portion 2222. Figure 12 The first crimping element 21 shown in FIG. 1 is located in the right crimping hole 11 .

[0069] In another exemplary embodiment, Figure 13As shown, the crimping element 20 includes at least one second crimping element 22, in which the first crimping portion 221 contacts the second surface 102, the second crimping portion 222 is an elastic structure, the conductive layer 111 located in the same crimping hole 11 as the second crimping element 22 is a second conductive layer 1112, and the circuit board body 1 includes at least one first functional layer and at least one second functional layer stacked in sequence from the first surface 101 to the second surface 102.

[0070] In the above exemplary embodiment, any one of the first functional layers may be distributed with a third high-speed signal line 33 in contact with the second conductive layer 1112, and the second conductive layer 1112 covers the entire inner wall of the crimping hole 11, such as Figure 13 The second crimping element 22 is shown in the left crimping hole 11; any second functional layer may be distributed with a fourth high-speed signal line 34 in contact with the second conductive layer 1112, and the second conductive layer 1112 extends along the second surface 102 toward the first surface 101 and covers part of the inner wall of the crimping hole 11, as shown in FIG. Figure 13 The second crimping element 22 shown in FIG. 1 is located in the right crimping hole 11 .

[0071] The physical structure of the pins of the press-fit components of the above-mentioned circuit board and the corresponding PCB board design method avoid the difficulties in high-speed signal routing on PCB boards with conventional press-fit components, the increase in high-speed PCB board layers, impedance discontinuity and other problems, thereby improving the high-speed signal transmission quality of press-fit components, while reducing PCB board layers, reducing the overall production cost of electronic products, and facilitating the promotion and use of press-fit components in high-speed, high-density PCB boards. At the same time, the circuit board is mainly used in the research and development and design of server products, mainly for the physical packaging of high-speed, high-density press-fit connector devices and their corresponding PCB design. In addition, it solves the contradiction between the minimum fisheye depth requirement for the press-fit component press-fit pins and the maximum requirement for the high-speed differential signal backdrill stub, avoiding the increase in manufacturing costs caused by the increase in high-speed PCB board layers; at the same time, it solves the problem of high-speed signal transmission signal integrity caused by high-speed signal impedance discontinuity in the high-speed differential signal press-fit pins and PCB board press-fit holes.

[0072] For example, Figure 12 As shown, the first crimping element 21 is crimped to the Figure 10In the crimping hole 11 shown, the problems such as impedance discontinuity between the crimping component 20 and the crimping hole 11, fisheye depth limitation of the crimping device, and high-speed differential signal backdrill stub requirements can be solved. Among them, in the high-speed PCB board processing process, if there are high-speed signal traces on the upper layers of the PCB board, back drilling is used in the conventional process. Due to the minimum fisheye depth requirement, it cannot meet the high-speed signal stub requirements. To solve this problem, the PCB board is first drilled through according to the crimping holes; the second step is to control the depth of the milling groove starting from the TOP layer, and an elliptical slot of the corresponding depth is milled from the TOP layer to the high-speed trace layer; the third step is to electroplate copper on the entire PCB board; the fourth step is to perform back drilling under the condition of meeting the high-speed signal backdrill stub requirements, ignoring the minimum fisheye depth requirement; thereby completing the manufacture of the high-speed PCB board. Meet the various index requirements of crimping components and high-speed differential signals. As Figure 12 The high-speed signals on the right side of the main board are routed on the lower layers of the PCB board, without the need for backdrilling. Because one side of the semi-deep elliptical slot is concentric with the press-fit pin, the expansion coefficient of the press-fit pin expansion point is large, so the press-fit components and the PCB board can still be firmly pressed together.

[0073] For example, the first crimping element 21 is crimped to the Figure 10 The crimping hole 11 shown can ensure continuous impedance control during high-speed differential signal transmission, avoid reflection noise, and enhance signal integrity. At the same time, it avoids the requirements for fisheye depth of crimped pins and back drilling stubs, and does not require additional high-speed PCB board stacking, thereby reducing the manufacturing cost of high-speed PCB boards while ensuring high-speed differential signal transmission performance.

[0074] The above-mentioned circuit board changes the materials of the press-fit tube pin connection column and the expansion point to non-metallic materials, connects only through the TOP layer of the PCB board, eliminates the fisheye depth requirement of the press-fit components, and enables high-speed differential signals to be routed and back-drilled at any layer; by wrapping the press-fit tube pin connection column with non-metallic materials, and at the same time, the connection point is only connected and fixed to the bottom layer of the PCB board, eliminates the fisheye depth requirement of the press-fit components, and enables high-speed differential signals to be routed and back-drilled at any layer; by changing the spacing of the high-speed differential signal press-fit tube pins, the impedance value at the connection point between the press-fit tube pin and the high-speed PCB board meets the high-speed differential signal impedance requirement; by adding a half-depth slot hole in the high-speed signal transmission area at the press-fit through hole of the high-speed PCB board, the impedance consistency and continuity of the high-speed signal transmission area in the press-fit hole are met; by changing the spacing of the press-fit tube pins of the press-fit components and the high-speed signal transmission area at the cartoon hole of the high-speed PCB board Half-depth slots are added to the transmission area to meet the requirements of high-speed signal routing on any layer of the high-speed PCB board, ensuring the continuity of high-speed signal transmission impedance without increasing the PCB board stacking; the high-speed signal press-fit component pin is divided into two and changed into a pair of differential signals, which can maintain the impedance continuity of the high-speed differential signal from the entire press-fit pin to the PCB board, while reducing the number of press-fit connector pins and the size of the press-fit component, which is conducive to the miniaturization design of the PCB board; by changing the connection method between the press-fit component pin and the PCB board and dividing the press-fit pin into two, one high-speed pin transmits a pair of high-speed differential signals at the same time, which can meet the requirements of the high-speed signal transmission impedance continuity from the high-speed press-fit pin in the press-fit component to the high-speed PCB board. At the same time, there is no need to increase the high-speed PCB board stacking, and the high-speed differential signal can be routed and back-drilled on any layer of the PCB board.

[0075] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. A person skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the principles of the present application shall be within the scope of protection of the present application.

Claims

1. A circuit board, characterized in that: include: a circuit board body having a first surface and a second surface opposite to each other, and having at least one crimping hole extending from the first surface to the second surface, wherein at least a portion of an inner wall of each crimping hole is covered with a conductive layer; At least one crimping element, at least a portion of which is located in the crimping hole in a one-to-one correspondence, wherein: At least one of the crimping elements has a first crimping portion and a second crimping portion, the first crimping portion being located outside the crimping hole and in contact with the conductive layer, and the first crimping portion having a conductive material, the second crimping portion being located in the crimping hole covered with the conductive layer, and the second crimping portion having at least an insulating material in contact with the conductive layer, and At least one of the crimping elements has a third crimping portion and a fourth crimping portion located in the crimping hole, the third crimping portion is isolated on both sides by the fourth crimping portion and contacts the conductive layer, and the third crimping portion has a conductive material, and the fourth crimping portion has an insulating material.

2. The circuit board according to claim 1, wherein: The first crimping element has a first crimping portion and a second crimping portion, the first crimping portion contacts the first surface, the conductive layer located in the same crimping hole as the first crimping element is a first conductive layer, the first conductive layer extends from the first surface toward the second surface and covers a portion of the inner wall of the crimping hole, the second crimping portion has a first connecting portion and a first expansion portion, and the circuit board body includes at least one first functional layer and at least one second functional layer stacked sequentially along the first surface toward the second surface, wherein: Any one of the first functional layers is distributed with a first high-speed signal line in contact with the first conductive layer, the first conductive layer is located outside the first connecting portion, the first expansion portion is in contact with the inner wall, and / or A second high-speed signal line is distributed on any layer of the second functional layer, and the circuit board body also includes a conductive part filled in the crimping hole and in contact with the second high-speed signal line. The conductive part is located in the crimping hole, and one end thereof close to the first surface is in contact with the first conductive layer. The first conductive layer is located on the periphery of the first connecting part and the first expansion part and in contact with the first expansion part.

3. The circuit board according to claim 1, wherein: The second crimping element has a first crimping portion and a second crimping portion, the first crimping portion contacts the second surface, the second crimping portion is an elastic structure, the conductive layer located in the same crimping hole as the second crimping element is a second conductive layer, and the circuit board body includes at least one first functional layer and at least one second functional layer stacked in sequence from the first surface to the second surface, wherein: Any layer of the first functional layer is distributed with a third high-speed signal line in contact with the second conductive layer, the second conductive layer covers the entire inner wall of the crimping hole, and / or A fourth high-speed signal line in contact with the second conductive layer is distributed on any layer of the second functional layer. The second conductive layer extends along the second surface toward the first surface and covers a portion of the inner wall of the crimping hole.

4. The circuit board according to claim 3, wherein: The elastic structure includes a conductive core and an elastic insulating film, wherein the elastic insulating film wraps the conductive core, wherein: In a case where the crimping hole provided with the second crimping element has a first length, the conductive core has a plurality of first bending segments connected in sequence; When the crimping hole provided with the second crimping element has a second length greater than the first length, the conductive core has a plurality of second bending segments connected in sequence, and the curvature of the second bending segments is smaller than the curvature of the first bending segments, or the conductive core is a straight segment.

5. The circuit board according to claim 1, wherein: Multiple third crimping elements respectively have the third crimping portion and the fourth crimping portion and are located in adjacent crimping holes. The conductive layer located in the same crimping hole as the third crimping element is a third conductive layer. The circuit board body includes multiple functional layers stacked sequentially, and at least one layer of the functional layer is distributed with multiple fifth high-speed signal lines in contact with the third conductive layer. The fifth high-speed signal line is used to transmit high-speed differential signals. The spacing between adjacent third crimping elements is 0.5~0.8mm.

6. The circuit board according to claim 1, wherein: The third crimping element has a third crimping portion and a fourth crimping portion. The conductive layer located in the same crimping hole as the third crimping element is a third conductive layer. The circuit board body includes multiple functional layers stacked sequentially. At least one of the functional layers is distributed with multiple sixth high-speed signal lines in contact with the third conductive layer. The sixth high-speed signal lines are used to transmit high-speed differential signals, and the two third crimping portions located in the same crimping hole are connected to the multiple sixth high-speed signal lines through the third conductive layer.

7. The circuit board according to claim 6, wherein: The third crimping element has the third crimping portion and the fourth crimping portion, the fourth crimping portion has the second connecting portion and the second expansion portion connected sequentially along the first direction, each of the third crimping portions covers the second connecting portion and the second expansion portion at the same time, and the thickness of the first part of the third crimping portion covering the second connecting portion is greater than the thickness of the first part of the third crimping portion covering the second expansion portion.

8. A circuit board, characterized in that: include: A circuit board body having a first surface and a second surface opposite to each other, and a plurality of crimping holes extending from the first surface to the second surface, wherein: Any two adjacent crimping holes respectively include a first hole segment and a second hole segment that are connected, the aperture of the first hole segment is larger than the aperture of the second hole segment, and the spacing between adjacent first hole segments is smaller than the spacing between adjacent second hole segments, the inner wall of the first hole segment is covered with a conductive layer, the conductive layer includes a first side wall and a second side wall that are opposite and connected, and the thickness of the first side wall is greater than the thickness of the second side wall; at least one crimping element, at least a portion of which is located in the crimping hole in a one-to-one correspondence, The crimping element includes at least one first crimping element, the first crimping element having a first crimping portion and a second crimping portion, in which the first crimping portion is located outside the crimping hole and in contact with the conductive layer, and the first crimping portion has a conductive material, and the second crimping portion is located in the crimping hole covered with the conductive layer, and the second crimping portion has at least an insulating material in contact with the conductive layer.

9. The circuit board according to claim 8, wherein: The surface of the crimping element located in the first hole segment and in contact with the conductive layer has a first projection on the second surface, the side wall of the first hole segment has a second annular projection on the second surface, and the first projection is located within the area enclosed by the second annular projection and has a line segment with the same curvature as the first projection.

10. The circuit board according to claim 8, wherein: In the first crimping element, the conductive layer located in the same crimping hole as the first crimping element is a first conductive layer, the first conductive layer extends along the first surface toward the second surface and covers a portion of the inner wall of the crimping hole, the second crimping portion has a first connecting portion and a first expansion portion, the circuit board body includes at least one first functional layer and at least one second functional layer sequentially stacked along the first surface toward the second surface, any one of the first functional layers is distributed with a first high-speed signal line in contact with the first conductive layer, the first conductive layer is located at the periphery of the first connecting portion, the first expansion portion is in contact with the inner wall, and / or any one of the second functional layers is distributed with a second high-speed signal line, the circuit board body further includes a conductive portion filled in the crimping hole and in contact with the second high-speed signal line, the conductive portion is located at one end of the crimping hole close to the second surface and in contact with the first conductive layer, the first conductive layer is located at the periphery of the first connecting portion and the first expansion portion and in contact with the first expansion portion; The crimping element also includes at least one second crimping element, the second crimping element having a first crimping portion and a second crimping portion, in the second crimping element, the first crimping portion contacts the second surface, the second crimping portion is an elastic structure, the conductive layer located in the same crimping hole as the second crimping element is a second conductive layer, the circuit board body includes at least one first functional layer and at least one second functional layer stacked in sequence along the first surface pointing to the second surface, any one of the first functional layers is distributed with a third high-speed signal line in contact with the second conductive layer, the second conductive layer covers the entire inner wall of the crimping hole, and / or any one of the second functional layers is distributed with a fourth high-speed signal line in contact with the second conductive layer, the second conductive layer extends along the second surface toward the first surface and covers part of the inner wall of the crimping hole.

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