Circuit board assembly and electronic equipment

Abstract

The invention discloses a circuit board assembly and electronic equipment. The circuit board assembly comprises a circuit board which comprises a first conductive part and a second conductive part which are arranged at an interval; the first shielding cover covers the outer surface of the circuit board to form a first shielding cavity; the component comprises a load chip and at least one first capacitor, the input end and the output end of the load chip are electrically connected to the first conductive part and the second conductive part respectively, the load chip is arranged in the first shielding cavity, one of the input end and the output end of the first capacitor is connected with one first conductive part, and the other one of the input end and the output end of the second capacitor is connected with the other second conductive part. And the other one of the input end and the output end of the first capacitor is connected with the first shielding cover and is connected to the second conductive part through the first shielding cover.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a circuit board assembly and an electronic equipment. Background Art

[0002] With the development of electronic devices, the complexity of chip functions has increased, resulting in more and more power rails, which has led to an increase in the wiring density of PCB (Printed Circuit Board) and a decrease in the available layout space for components.

[0003] How to optimize the AC impedance structure of the circuit system within the limited PCB layout space is an urgent problem to be solved. Summary of the invention

[0004] The embodiments of the present application provide a circuit board assembly and an electronic device, which can optimize the AC impedance structure of the circuit system within a limited PCB layout space.

[0005] In a first aspect, an embodiment of the present application provides a circuit board assembly, comprising: a circuit board, comprising a first conductive portion and a second conductive portion arranged at intervals; a first shielding cover, covering the outer surface of the circuit board to form a first shielding cavity; components, comprising a load chip and at least one first capacitor, the input end and the output end of the load chip are electrically connected to the first conductive portion and the second conductive portion, respectively, and the load chip is arranged in the first shielding cavity, wherein one of the input end and the output end of the first capacitor is connected to a first conductive portion, and the other of the input end and the output end of the first capacitor is connected to the first shielding cover, and is connected to the second conductive portion through the first shielding cover.

[0006] In a second aspect, an embodiment of the present application provides an electronic device, comprising the circuit board assembly of the embodiment of the first aspect above.

[0007] Thus, in the circuit board assembly and electronic device provided in the embodiments of the present application, the circuit board assembly includes a circuit board, a first shielding cover and components, the circuit board includes a first conductive part and a second conductive part arranged at intervals, the first shielding cover covers the outer surface of the circuit board to form a first shielding cavity, the components include a load chip and at least one first capacitor, the input end and the output end of the load chip are respectively electrically connected to the first conductive part and the second conductive part to form a loop, the load chip is arranged in the first shielding cavity, the first shielding cavity shields the influence of external electromagnetic waves on the load chip and the electromagnetic waves generated by the load chip radiate outward, and one of the input end and the output end of the first capacitor is connected to the first conductive part, the other of the input end and the output end of the first capacitor is connected to the first shielding cover, and is connected to the second conductive part through the first shielding cover to form a complete loop.

[0008] Therefore, in the embodiment of the present application, the first capacitor is connected through the first shielding cover and the second conductive part, and one of the input end and the output end of the first capacitor is reused for the first shielding cover to be connected to the circuit board, thereby saving the layout area of ​​one of the input end and the output end of the first capacitor on the surface of the circuit board and reducing the layout area of ​​a single first capacitor on the circuit board. Then, a larger number and / or capacity of first capacitors can be arranged on the circuit board to optimize the power supply ground AC impedance of the circuit system. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solution of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0010] Figure 1 A schematic diagram of the structure of a circuit board assembly in some embodiments of the present application;

[0011] Figure 2 A schematic diagram of the structure of a circuit board assembly in some embodiments of the present application;

[0012] Figure 3 A schematic diagram of the structure of a circuit board assembly in some embodiments of the present application;

[0013] Figure 4 The impedance-frequency curve diagram of the circuit board assembly of some embodiments of the present application;

[0014] Figure 5 A schematic diagram of the structure of a circuit board assembly in some embodiments of the present application;

[0015] Figure 6 This is a schematic diagram of the structure of the circuit board assembly of some embodiments of the present application.

[0016] Description of Figure Numbers:

[0017] 100. Circuit board assembly;

[0018] 110, circuit board; 111, first conductive part; 112, second conductive part; 113, first via hole; 114, second via hole; 120, first shielding cover; 130, components; 131, load chip; 132, first capacitor; 133, voltage stabilizing module; 134, second capacitor; 140, second shielding cover; X, first direction. DETAILED DESCRIPTION

[0019] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0020] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0021] In the description of the present application, it should be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "middle", "back", "left", "right", "clockwise", "counterclockwise", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0022] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0023] See also Figure 1 and Figure 2 , Figure 1 A schematic diagram of the structure of a circuit board assembly 100 according to some embodiments of the present application; Figure 2 Schematic diagram of the structure of the circuit board assembly 100 according to some embodiments of the present application.

[0024] First, as Figure 1 and Figure 2As shown, an embodiment of the present application provides a circuit board assembly 100, the circuit board assembly 100 includes a circuit board 110, a first shielding cover 120 and a component 130, the circuit board 110 includes a first conductive portion 111 and a second conductive portion 112 arranged at intervals; the first shielding cover 120 covers the outer surface of the circuit board 110 to form a first shielding cavity; the component 130 includes a load chip 131 and at least one first capacitor 132, the input end and the output end of the load chip 131 are electrically connected to the first conductive portion 111 and the second conductive portion 112 respectively, and the load chip 131 is arranged in the first shielding cavity, wherein one of the input end and the output end of the first capacitor 132 is connected to a first conductive portion 111, and the other of the input end and the output end of the first capacitor 132 is connected to the first shielding cover 120, and is connected to the second conductive portion 112 through the first shielding cover 120.

[0025] In the circuit board assembly 100 and the electronic device provided in the embodiment of the present application, the circuit board assembly 100 includes a circuit board 110, a first shielding cover 120 and a component 130, the circuit board 110 includes a first conductive part 111 and a second conductive part 112 arranged at intervals, the first shielding cover 120 covers the outer surface of the circuit board 110 to form a first shielding cavity, the component 130 includes a load chip 131 and at least one first capacitor 132, the input end and the output end of the load chip 131 are respectively electrically connected to the first conductive part 111 and the second conductive part 112 to form a loop, the load chip 131 is arranged in the first shielding cavity, the first shielding cavity shields the influence of external electromagnetic waves on the load chip 131 and the electromagnetic waves generated by the load chip 131 radiate outward, and one of the input end and the output end of the first capacitor 132 is connected to the first conductive part 111, and the other of the input end and the output end of the first capacitor 132 is connected to the first shielding cover 120, and is connected to the second conductive part 112 through the first shielding cover 120 to form a complete loop. Therefore, in the embodiment of the present application, the first capacitor 132 is connected through the first shielding cover 120 and the second conductive portion 112, and one of the input end and the output end of the first capacitor 132 is reused for the first shielding cover 120 to be connected to the circuit board 110, thereby saving the layout area of ​​one of the input end and the output end of the first capacitor 132 on the surface of the circuit board 110, reducing the layout area of ​​a single first capacitor 132 on the circuit board 110, and then a larger number and / or capacity of first capacitors 132 can be arranged on the circuit board 110 to optimize the power supply ground AC impedance of the circuit system.

[0026] The AC impedance in the power supply system refers to the impedance characteristics of the power supply under the AC signal, which directly affects the stability, efficiency and performance of the power supply system. In the power supply system, by adding or adjusting the value, size and position of the decoupling capacitor, the high-frequency noise and AC impedance in the system can be reduced, and the response speed of the power supply system to high-frequency current can be improved, thereby improving the stability and anti-interference ability of the entire system.

[0027] The circuit system of the electronic device includes a PDN (Power Delivery Network). The PDN is a circuit path that delivers power from a voltage regulator module 133 (VRM) to a load chip 131. Current flows from the voltage regulator module 133 to the load chip 131 through the power plane of the PDN, and then flows back from the load chip 131 to the voltage regulator module 133 through the ground plane of the PDN.

[0028] PDN mainly controls DC impedance and AC impedance, among which AC impedance is strongly correlated with the capacitance, quantity, and position of the decoupling capacitor. In the embodiment of the present application, the first capacitor 132 can be a decoupling capacitor. In the prior art, due to the tight surface space of the circuit board 110, it is difficult to set a sufficient number or capacitance of decoupling capacitors to optimize the AC impedance. Therefore, the embodiment of the present application adjusts the matching relationship between the first capacitor 132 and the first shielding cover 120, and changes the layout of the components 130 on the circuit board 110, so as to set more decoupling capacitors of a larger number or capacity within the limited layout space of the circuit board 110 to optimize the AC impedance.

[0029] The circuit board 110 includes a first conductive part 111 and a second conductive part 112, one of which is a power supply network and the other is a reference ground. The circuit board 110 includes two outer surfaces on both sides in the thickness direction thereof, and the component 130 is arranged on one outer surface. The first conductive part 111 and the second conductive part 112 are located between the two outer surfaces, and the two are arranged inside the circuit board 110 at intervals. The component 130 can be connected to the first conductive part 111 or the second conductive part 112 through a via. The first conductive part 111 can be a metal wire or a metal plane, and the second conductive part 112 is the same.

[0030] The first shielding cover 120 is made of metal and covers the surface of the circuit board 110 to form a first shielding cavity. The specific shape and size of the first shielding cover 120 can be designed by yourself. For example, the first shielding cover 120 is in a cubic or cylindrical shape.

[0031] The component 130 may further include a voltage stabilizing module 133, and the input and output ends of the voltage stabilizing module 133 and the load chip 131 are electrically connected to the first conductive part 111 and the second conductive part 112, respectively. Exemplarily, the first conductive part 111 is a power supply network, and the second conductive part 112 is a reference ground. The current flows from the output end of the voltage stabilizing module 133 to the first conductive part 111, and reaches the input end of the load chip 131 through the first conductive part 111. The current reaches the load chip 131, and flows to the second conductive part 112 through the output end of the load chip 131, and flows to the input end of the voltage stabilizing module 133 through the second conductive part 112.

[0032] The first capacitor 132 may be a decoupling capacitor, one of the input end and the output end of the first capacitor 132 is directly connected to the first conductive part 111 through a via provided on the circuit board 110, the other of the input end and the output end of the first capacitor 132 is connected to the surface of the first shielding cover 120 by welding or conductive bonding, the first shielding cover 120 is connected to the second conductive part 112, and thus the first capacitor 132 is electrically connected to the second conductive part 112 through the first shielding cover 120. The first conductive part 111 is a power supply network, and the second conductive part 112 is a reference ground; or the first conductive part 111 is a reference ground, and the second conductive part 112 is a power supply network.

[0033] Optionally, a partial area where the first shielding cover 120 contacts the circuit board 110 is provided with a via, and a wire is arranged on the surface of the first shielding cover 120, one end of the wire is connected to the second conductive part 112 through the via, and the other end of the wire is connected to the first capacitor 132, so as to adapt to the situation where the first shielding cover 120 cannot be connected to the first conductive part 111 and the second conductive part 112.

[0034] Only one of the input end and the output end of the first capacitor 132 needs to be connected to the surface of the circuit board 110, so more first capacitors 132 can be arranged within the unit surface area of ​​the circuit board 110. The specifications and size of a single first capacitor 132 can be designed by oneself.

[0035] The first capacitor 132 may be disposed outside the first shielding cavity, and the first capacitor 132 is connected to the outer surface of the first shielding cover 120 , so that the volume of the first shielding cover 120 can be reduced to save the layout area of ​​the circuit board 110 .

[0036] In some embodiments, Figure 2 As shown, the first capacitor 132 is disposed in the first shielding cavity.

[0037] In these embodiments, the first capacitor 132 is disposed in the first shielding cavity, which helps to reduce the distance between the first capacitor 132 and the load chip 131. The first capacitor 132 is close to the input end of the load chip 131 to effectively reduce the loop inductance, effectively reduce the AC impedance of the PDN, and improve the stability of the power supply system.

[0038] The first capacitor 132 is disposed in the first shielding cavity, and the first capacitor 132 is connected to the inner surface of the first shielding cover 120 .

[0039] Optionally, a plurality of first capacitors 132 are disposed on the circuit board 110 , and each of the first capacitors 132 is located in the first shielding cavity, or some of the first capacitors 132 are located in the first shielding cavity, and other first capacitors 132 are located outside the first shielding cavity.

[0040] See also Figure 3 , Figure 3 Schematic diagram of the structure of the circuit board assembly 100 according to some embodiments of the present application.

[0041] In some embodiments, Figure 2 and Figure 3 As shown, the input end and the output end of the first capacitor 132 are arranged relatively to each other in the first direction X, and the one of the input end and the output end of the first capacitor 132 that is away from the circuit board 110 is connected to the first shielding cover 120 along the first direction X, and the first direction X is the thickness direction of the circuit board 110.

[0042] In these embodiments, the input end and the output end of the first capacitor 132 are arranged relative to each other in the first direction X, and the one of the input end and the output end of the first capacitor 132 that is away from the circuit board 110 is connected to the first shielding cover 120 along the first direction X to reduce the projection area of ​​the first capacitor 132 on the surface of the circuit board 110, so that more first capacitors 132 can be arranged on the surface of the circuit board 110 to optimize the AC impedance and improve the stability of the power supply system.

[0043] The input end and the output end of the first capacitor 132 are arranged opposite to each other in the first direction X. The first capacitor 132 is connected to the first shielding cover 120 along the first direction X, and the first capacitor 132 is in an upright state as a whole.

[0044] Exemplarily, the first capacitor 132 includes two end faces arranged opposite to each other, and a side face connected between the end faces, the projection area of ​​the side face of the first capacitor 132 on the surface of the circuit board 110 is larger than the projection area of ​​the end face on the surface of the circuit board 110, and the input end and the output end of the first capacitor 132 are respectively located at the two ends. In the related art, the input end and the output end of the first capacitor 132 are both connected to the circuit board 110, then the layout area of ​​the first capacitor 132 is at least the positive projection area of ​​the side face of the first capacitor 132 on the surface of the circuit board 110; in the embodiment of the present application, the first capacitor 132 is erected along the first direction X, one end of the first capacitor 132 is connected to the circuit board 110, and the other end is connected to the first shielding cover 120 along the first direction X, then the positive projection of the first capacitor 132 on the surface of the circuit board 110 is the projection of its end face, and the area occupied on the surface of the circuit board 110 is smaller.

[0045] This also reduces the distance between the first capacitor 132 and the shielding cover in the first direction X. When the first capacitor 132 and the first shielding cover 120 are connected via a wire, the electrical connection between the two can be achieved via a shorter wire.

[0046] See also Figure 4 , Figure 4 The impedance-frequency curve of the circuit board assembly according to some embodiments of the present application.

[0047] In some embodiments, Figure 3 and Figure 4 As shown, the component 130 includes a plurality of first capacitors 132 arranged at intervals.

[0048] In these embodiments, the component 130 includes a plurality of first capacitors 132 arranged at intervals, and the AC impedance is further optimized by setting the plurality of first capacitors 132; or the large-capacitance first capacitor 132 is replaced by a plurality of small capacitors in parallel, which can reduce the ESR (equivalent series resistance) of the capacitor while meeting the capacitance requirements, effectively reduce high-frequency noise and provide better energy storage capacity, and help improve the stability, efficiency and anti-interference ability of the power supply system.

[0049] ESR is the internal resistance of the capacitor, which causes energy loss when current passes through the capacitor. A smaller ESR can effectively reduce high-frequency noise and provide better energy storage capacity.

[0050] Attached Figure 4 Attached is a schematic diagram of ESR changes after replacing the large-capacitance first capacitor 132 with multiple small capacitors in parallel. Figure 4 Here, “N capacitors are connected in parallel” means at least two capacitors are connected in parallel.

[0051] In the embodiment of the present application, by adjusting the connection relationship between the first capacitor 132 and the first shielding cover 120, the layout area required for the first capacitor 132 on the circuit board 110 can be reduced, so that a first capacitor 132 with a larger size and a larger capacitance can be set on the original circuit board 110; or a larger number of first capacitors 132 can be set to increase the overall capacitance of the first capacitor 132. Alternatively, the original large-capacitance first capacitor 132 with a larger size can be replaced with a plurality of small-capacitance first capacitors 132 connected in parallel, and the plurality of small-capacitance first capacitors 132 connected in parallel can meet the capacitance requirements and reduce the ESR of the capacitor. Specifically, the capacitance and size of each first capacitor 132 can be designed by yourself.

[0052] Optionally, a plurality of the first capacitors 132 are arranged in an array along the length direction and / or the width direction of the circuit board 110 .

[0053] See also Figure 5 , Figure 5 Schematic diagram of the structure of the circuit board assembly 100 according to some embodiments of the present application.

[0054] In some embodiments, Figure 5 As shown, the first capacitor 132 is arranged on the side of the load chip 131 away from the circuit board 110, one of the input end and the output end of the first capacitor 132 is connected to the first conductive part 111 through the load chip 131, and the other of the input end and the output end of the first capacitor 132 is connected to the second conductive part 112 through the first shielding cover 120.

[0055] In these embodiments, the first capacitor 132 is arranged on a side of the load chip 131 away from the circuit board 110, and one of the input end and the output end of the first capacitor 132 is connected through the load chip 131 and the first conductive portion 111 to reduce the distance between the first capacitor 132 and the output end of the load chip 131 to reduce the loop inductance, reduce the AC impedance of the PDN, and optimize the stability of the power supply system; the other of the input end and the output end of the first capacitor 132 is connected through the first shielding cover 120 and the second conductive portion 112 to reduce the setting area of ​​the first capacitor 132 on the circuit board 110, so that more components 130 can be set on the circuit board 110.

[0056] The first capacitor 132 is disposed on a side of the load chip 131 away from the circuit board 110 , that is, the first capacitor 132 is fixed on the load chip 131 in a POP (Package-on-Package) manner.

[0057] Optionally, the input end of the first capacitor 132 is connected to the power supply network through the input end of the load chip 131 , and the output end of the first capacitor 132 is connected to the reference ground through the first shielding cover 120 , so that the first capacitor 132 is closer to the input end of the load chip 131 .

[0058] Optionally, the plurality of first capacitors 132 are disposed on a side of the load chip 131 facing away from the circuit board 110 .

[0059] Optionally, the first capacitor 132 is disposed on a side of the load chip 131 away from the circuit board 110 , and the first capacitor 132 is connected to the first shielding cover 120 along the first direction X to reduce the size of the wire between the first capacitor 132 and the first shielding cover 120 .

[0060] In some embodiments, Figure 3 As shown, at least two first via holes 113 are disposed on the circuit board 110 , and the first shielding cover 120 is connected to the first conductive portion 111 through each of the first via holes 113 .

[0061] In these embodiments, at least two first vias 113 are provided on the circuit board 110, the first capacitor 132 is connected to the first shielding cover 120, and the first shielding cover 120 is connected to the first conductive portion 111 through each of the first vias 113. The provision of multiple first vias 113 helps to reduce the connection impedance so that the first capacitor 132 can better adjust the AC impedance.

[0062] Exemplarily, the first shielding cover 120 is rectangular, four first vias 113 are provided on the circuit board 110, and the four first vias 113 are provided one-to-one corresponding to the four long sides of the rectangle; or the first shielding cover 120 is circular, and multiple first vias 113 are evenly spaced along a circular path.

[0063] In some embodiments, Figure 3 As shown, the second conductive portion 112 is a reference ground, and the output end of the first capacitor 132 is connected to the reference ground through the first shielding cover 120 .

[0064] In these embodiments, the second conductive portion 112 is a reference ground, and the first capacitor 132 is connected to the reference ground through the first shielding cover 120, which can reduce the area occupied by the first capacitor 132 on the surface of the circuit board 110, and the first shielding cover 120 is connected to the reference ground, so that the first shielding cover 120 has a good shielding effect.

[0065] Specifically, the first conductive part 111 is a power network, the second conductive part 112 is a reference ground, the input end of the first capacitor 132 is connected to the power network, and the output end of the first capacitor 132 is connected to the reference ground through the first shielding cover 120 .

[0066] See also Figure 6 , Figure 6 Schematic diagram of the structure of the circuit board assembly 100 according to some embodiments of the present application.

[0067] In some embodiments, Figure 3 and Figure 6 As shown, the circuit board assembly 100 also includes a second shielding cover 140, which covers the outer surface of the circuit board 110 to form a second shielding cavity, and the voltage stabilizing module 133 is arranged in the second shielding cavity. The component 130 also includes a second capacitor 134, and one of the input end and the output end of the second capacitor 134 is connected to a first conductive part 111, and the other of the input end and the output end of the second capacitor 134 is connected to the second shielding cover 140, and is connected to the second conductive part 112 through the second shielding cover 140.

[0068] In these embodiments, the voltage stabilizing module 133 is arranged in a second shielding cavity formed by the second shielding cover 140, and the second shielding cavity shields the influence of external electromagnetic waves on the voltage stabilizing module 133 and the electromagnetic waves generated by the voltage stabilizing module 133 from radiating outward. The component 130 also includes a second capacitor 134, and the second capacitor 134 can be an energy storage capacitor. The second capacitor 134 is used to balance the current of the circuit system. One of the input end and the output end of the second capacitor 134 is connected to a first conductive part 111, and the other of the input end and the output end of the second capacitor 134 is connected to the second shielding cover 140, and is connected to the second conductive part 112 through the second shielding cover 140, so as to save the layout area of ​​one of the input end and the output end of the second capacitor 134 on the surface of the circuit board 110, and reduce the layout area of ​​a single second capacitor 134 on the circuit board 110, so that more number and / or capacity of second capacitors 134 can be arranged on the circuit board 110 to optimize the power supply ground AC impedance of the circuit system.

[0069] One of the input end and the output end of the second capacitor 134 is directly connected to the first conductive part 111 through a via provided on the circuit board 110, and the other of the input end and the output end of the second capacitor 134 is connected to the surface of the second shielding cover 140 by welding or conductive bonding, and the second shielding cover 140 is connected to the second conductive part 112, so that the second capacitor 134 is electrically connected to the second conductive part 112 through the second shielding cover 140.

[0070] Optionally, the second capacitor 134 may be disposed outside the second shielding cavity and connected to the outer surface of the second shielding cover 140 ; ​​or the second capacitor 134 may be disposed inside the second shielding cavity and connected to the inner surface of the second shielding cover 140 .

[0071] In some embodiments, Figure 3As shown, the second capacitor 134 is arranged in the second shielding cavity, the input end and the output end of the second capacitor 134 are relatively arranged in the thickness direction of the circuit board 110, and the one of the input end and the output end of the second capacitor 134 away from the circuit board 110 is connected to the second shielding cover 140 along the thickness direction of the circuit board 110.

[0072] In these embodiments, the second capacitor 134 is disposed in the second shielding cavity, and the input end and the output end of the second capacitor 134 are relatively arranged in the thickness direction of the circuit board 110. The input end and the output end of the second capacitor 134 that are away from the circuit board 110 are connected to the second shielding cover 140 along the thickness direction of the circuit board 110 to reduce the projection area of ​​the second capacitor 134 on the surface of the circuit board 110, so that more second capacitors 134 can be arranged on the surface of the circuit board 110 to optimize the AC impedance and improve the stability of the power supply system.

[0073] Optionally, the first conductive portion 111 is a power supply network, the second conductive portion 112 is a reference ground, and the second capacitor 134 is connected to the reference ground through the second shielding cover 140 .

[0074] Optionally, the second shielding cover 140 is connected to the second conductive portion 112 through a plurality of via holes disposed on the circuit board 110 .

[0075] Optionally, a plurality of second capacitors 134 may be disposed at intervals in the second shielding cavity. Exemplarily, the plurality of second capacitors 134 are arranged in an array along the length and / or width direction of the circuit board 110 .

[0076] In some embodiments, Figure 3 As shown, at least two second via holes 114 are disposed on the circuit board 110 , and the second shielding cover 140 is connected to the first conductive portion 111 through each of the second via holes 114 .

[0077] In these embodiments, at least two second vias 114 are provided on the circuit board 110, the second capacitor 134 is connected to the second shielding cover 140, and the second shielding cover 140 is connected to the first conductive portion 111 through each second via 114. The provision of multiple second vias 114 helps to reduce the connection impedance, so that the second capacitor 134 can better adjust the AC impedance.

[0078] Exemplarily, the second shielding cover 140 is rectangular, and four second vias 114 are provided on the circuit board 110, and the four second vias 114 are provided one-to-one with the four long sides of the rectangular second shielding cover 140; or the second shielding cover 140 is circular, and multiple second vias 114 are evenly spaced along a circular path.

[0079] In some embodiments, Figure 3As shown, the second conductive portion 112 is a reference ground, and the output end of the second capacitor 134 is connected to the reference ground through the second shielding cover 140 .

[0080] In these embodiments, the second conductive portion 112 is a reference ground, and the second capacitor 134 is connected to the reference ground via the second shielding cover 140, which can reduce the area occupied by the second capacitor 134 on the surface of the circuit board 110, and the second shielding cover 140 is connected to the reference ground, so that the second shielding cover 140 has a good shielding effect.

[0081] Specifically, the first conductive part 111 is a power network, the second conductive part 112 is a reference ground, the input end of the second capacitor 134 is connected to the power network, and the output end of the second capacitor 134 is connected to the reference ground through the second shielding cover 140 .

[0082] In a second aspect, an embodiment of the present application provides an electronic device, comprising the circuit board assembly of the embodiment of the first aspect above.

[0083] Since the electronic device provided in the second aspect embodiment of the present application includes the circuit board assembly of any one of the first aspect embodiments mentioned above, the electronic device provided in the second aspect embodiment of the present application has the beneficial effects of the circuit board assembly of any one of the first aspect embodiments mentioned above, which will not be repeated here.

[0084] The electronic devices in the embodiments of the present application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, laptops, televisions, driving recorders, and other devices with circuit board components.

[0085] The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of this application.

Claims

1. A circuit board assembly, characterized in that: include: The circuit board comprises a first conductive portion and a second conductive portion which are spaced apart from each other; A first shielding cover, covering the outer surface of the circuit board to form a first shielding cavity; The component comprises a load chip and at least one first capacitor, wherein the input end and the output end of the load chip are electrically connected to the first conductive part and the second conductive part respectively, and the load chip is arranged in the first shielding cavity. One of the input end and the output end of the first capacitor is connected to the first conductive part, and the other of the input end and the output end of the first capacitor is connected to the first shielding cover and connected to the second conductive part through the first shielding cover.

2. The circuit board assembly according to claim 1, characterized in that: The circuit board assembly further includes a second shielding cover, wherein the second shielding cover covers the outer surface of the circuit board to form a second shielding cavity. The components also include a voltage stabilizing module and at least one second capacitor. The voltage stabilizing module is arranged in the second shielding cavity. The input and output ends of the voltage stabilizing module are electrically connected to the first conductive part and the second conductive part respectively. One of the input and output ends of the second capacitor is connected to one of the first conductive parts, and the other of the input and output ends of the second capacitor is connected to the second shielding cover and connected to the second conductive part through the second shielding cover.

3. The circuit board assembly according to claim 1, characterized in that: The first capacitor is disposed in the first shielding cavity.

4. The circuit board assembly according to claim 3, characterized in that: The input end and the output end of the first capacitor are arranged opposite to each other in a first direction, and one of the input end and the output end of the first capacitor away from the circuit board is connected to the first shielding cover along the first direction, and the first direction is the thickness direction of the circuit board.

5. The circuit board assembly according to claim 3, characterized in that: The first capacitor is arranged on a side of the load chip away from the circuit board, one of the input end and the output end of the first capacitor is connected to the first conductive part through the load chip, and the other of the input end and the output end of the first capacitor is connected to the second conductive part through the first shielding cover.

6. The circuit board assembly according to claim 2, characterized in that: The second capacitor is arranged in the second shielding cavity, the input end and the output end of the second capacitor are arranged relatively to each other in the thickness direction of the circuit board, and the one of the input end and the output end of the second capacitor away from the circuit board is connected to the second shielding cover along the thickness direction of the circuit board.

7. The circuit board assembly according to claim 1, characterized in that: At least two first via holes are provided on the circuit board, and the first shielding cover is connected to the first conductive part through each of the first via holes.

8. The circuit board assembly according to claim 1, wherein: The second conductive portion is a reference ground, and the output end of the first capacitor is connected to the reference ground through the first shielding cover.

9. The circuit board assembly according to claim 2, characterized in that: At least two second via holes are provided on the circuit board, and the second shielding cover is connected to the first conductive part through each of the second via holes.

10. The circuit board assembly according to claim 2, characterized in that: The second conductive portion is a reference ground, and the output end of the second capacitor is connected to the reference ground through the second shielding cover.

11. An electronic device, characterized in that: A circuit board assembly comprising any one of claims 1 to 10.

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