FPC processing positioning correction method, equipment and storage medium

Abstract

The present application relates to the technical field of FPC processing, and provides a method, device and storage medium for positioning and correcting FPC processing. The FPC processing positioning and correcting method includes: obtaining punching parameters corresponding to the target FPC; determining the reference coordinates corresponding to the reference hole based on the coordinate conversion parameters; determining the punching coordinates corresponding to the punching position based on the reference coordinates and the punching parameters; controlling the punching component to punch the target FPC based on the punching coordinates; obtaining image information corresponding to the target FPC when it is determined that the punching situation of the target FPC is detected; and correcting the coordinate conversion parameters and / or punching parameters when it is determined based on the image information that the actual hole position of the target FPC does not meet the qualified conditions. By adopting the above technical solution, when it is detected that the actual hole position does not meet the qualified conditions during the FPC processing process, the coordinate conversion parameters and / or punching parameters can be corrected, which can help improve the yield rate.

Description

Technical Field

[0001] The present application relates to the technical field of FPC processing, and in particular to an FPC processing positioning correction method, device and storage medium. Background Art

[0002] Flexible printed circuit (FPC) is a thin and flexible electronic component that is widely used in consumer electronics, automotive electronics, medical equipment and other fields. As electronic products develop towards miniaturization and integration, the processing accuracy and reliability of FPC are particularly important. At present, precise positioning is required during the processing of FPC to ensure the accuracy and consistency of the punching position, which is of great significance for improving production efficiency and product quality.

[0003] In the related art, a variety of methods are usually used to achieve positioning and correction during the FPC processing process. For example, a reference point is marked on the FPC by a laser marking machine, and then a visual system is used for positioning; or a mechanical fixture is used to fix the FPC, and a mechanical arm is used for precise positioning.

[0004] However, the positioning methods in related technologies often lack an effective correction mechanism. Once a positioning deviation occurs, it is difficult to detect and correct it in time, which can easily lead to batch quality problems in the product, thereby reducing the product yield rate. Summary of the invention

[0005] In order to help improve the yield rate of the FPC product processing process, the present application provides an FPC processing positioning correction method, device and storage medium.

[0006] In the first aspect, the present application provides a FPC processing positioning correction method, which adopts the following technical solution:

[0007] A method for positioning and correcting FPC processing, the method comprising:

[0008] Obtaining punching parameters corresponding to the target FPC, wherein the punching parameters are used to record the relative position relationship between the punching position on the target FPC and the reference hole;

[0009] Positioning the reference hole based on the coordinate conversion parameters to obtain the reference coordinates corresponding to the reference hole;

[0010] Pre-positioning the punching position based on the reference coordinates and the punching parameters to obtain the punching coordinates corresponding to the punching position;

[0011] Controlling the punching component to punch the target FPC based on the punching coordinates;

[0012] Determining whether to detect the punching condition of the target FPC;

[0013] When it is determined that the punching condition of the target FPC is to be detected, image information corresponding to the target FPC is acquired;

[0014] Determining whether the actual hole position of the target FPC meets a preset qualification condition based on the image information;

[0015] When the actual hole position does not satisfy the qualification condition, the coordinate conversion parameter and / or the punching parameter are corrected.

[0016] By adopting the above technical solution, the punching quality of the FPC can be detected during the FPC processing process, and when it is detected that the actual hole position of the FPC does not meet the qualified conditions, the coordinate transformation parameters and / or punching parameters can be corrected, which can help reduce the probability of unqualified subsequent processed products, and further help improve the yield rate.

[0017] Optionally, before determining whether the actual hole position of the target FPC meets a preset qualification condition based on the image information, the method further includes:

[0018] Controlling the punching assembly to punch holes in the target FPC based on the reference coordinates;

[0019] The determining, based on the image information, whether the actual hole position of the target FPC meets a preset qualification condition includes:

[0020] Determining whether the reference hole position is offset;

[0021] In the case where it is determined that the reference hole position is offset, it is determined that the actual hole position does not meet the qualification condition.

[0022] By adopting the above technical solution, the punching component can be controlled based on the reference coordinates to punch holes in the target FPC, and when the reference hole position is offset after punching, it can be directly determined that the actual hole position does not meet the qualification conditions, without having to detect the actual hole positions corresponding to the punching positions one by one. This can help improve the efficiency of detecting the punching effect.

[0023] Optionally, after determining whether the reference hole position is offset, the method further includes:

[0024] In the case where the reference hole position is not offset, for each of the punching positions, determining whether the punching quality corresponding to the punching position meets a preset quality requirement based on the actual hole position corresponding to the punching position;

[0025] In the case where the drilling quality does not meet the quality requirement, it is determined that the actual hole position does not meet the qualification condition.

[0026] By adopting the above-mentioned technical scheme, it is possible to determine whether the punching quality corresponding to the punching position meets the preset quality requirements based on the actual hole position corresponding to the punching position, and when the punching quality does not meet the quality requirements, it is determined that the actual hole position does not meet the qualified conditions. This can help to discover the actual hole position unqualified due to the punching parameters, so that the errors in the punching parameters can be discovered in time, which can help to improve the yield rate.

[0027] Optionally, determining whether the punching quality corresponding to the punching position meets a preset quality requirement based on the actual hole position corresponding to the punching position includes:

[0028] Determining whether the actual hole position corresponding to the punching position is completely located in the punching area;

[0029] In a case where the actual hole position corresponding to the punching position is completely located in the punching area, determining that the punching quality meets the quality requirement;

[0030] In the case where the actual hole position corresponding to the punching position is not completely located in the punching area, determining whether the actual proportion of the portion of the actual hole position corresponding to the punching position located in the punching area is greater than a preset proportion threshold;

[0031] When the actual specific gravity is less than or equal to the specific gravity threshold, it is determined that the punching quality does not meet the quality requirement.

[0032] By adopting the above technical solution, the offset of the actual hole position can be judged. When the offset is large, it is directly determined that the drilling quality does not meet the quality requirements. This can help reduce the impact of equipment errors on quality judgments, thereby helping to distinguish between parameter errors and equipment errors, and further helping to improve the accuracy of parameter correction judgments.

[0033] Optionally, after determining whether the actual proportion of the actual hole positions corresponding to the punching positions located in the punching area is greater than a preset proportion threshold, the method further includes:

[0034] When the actual specific gravity is greater than the specific gravity threshold, the number of abnormalities corresponding to the punching position is recorded once;

[0035] Determine whether the number of abnormalities corresponding to the punching position is greater than a preset number of abnormal waiting times;

[0036] When the number of abnormalities corresponding to the punching position is greater than the number of abnormal waiting times, it is determined that the punching quality of the punching position does not meet the quality requirement.

[0037] By adopting the above technical solution, for the same punching position, the number of abnormalities corresponding to the punching position will be counted. When the number of abnormalities reaches the number of abnormal waiting times, it means that the deviation of the punching position is most likely caused by the error of the punching parameters. Therefore, in this case, determining that the punching quality does not meet the quality requirements can indicate the adjustment of the punching parameters, which can help reduce the deviation of the punching position in the subsequent processing process, and further help improve the yield rate of the product.

[0038] Optionally, when the number of abnormalities corresponding to the punching position is greater than the number of abnormal waiting times, the method further includes:

[0039] Determine whether there is a risk punching position in each of the punching positions, the corresponding abnormal number of which is less than or equal to the abnormal waiting number and greater than a preset risk waiting number, and the risk waiting number is less than the abnormal waiting number;

[0040] In the case where the risky perforation positions exist, determining whether the number of the risky perforation positions exceeds a preset risk number threshold;

[0041] When the number of the risky perforation positions exceeds the risk number threshold, it is determined that the perforation quality corresponding to each of the risky positions does not meet the requirement.

[0042] By adopting the above technical solution, for the same punching position, the number of abnormalities corresponding to the punching position will be counted. When the number of abnormalities reaches the number of abnormal waiting times, it is determined that the punching quality does not meet the quality requirements. This can indicate the need to adjust the punching parameters, which can help reduce the offset of the actual hole position in subsequent processing, thereby helping to improve the product yield rate.

[0043] Optionally, before determining whether the actual hole position of the target FPC meets a preset qualification condition based on the image information, the method further includes:

[0044] For each of the punching positions, determining whether there is an actual hole position in the punching area corresponding to the punching position;

[0045] In the case where there are actual hole positions in the punching area, the actual hole positions in the punching area are determined as the actual hole positions corresponding to the punching positions, and the step of determining whether the actual hole positions of the target FPC meet the preset qualification conditions based on the image information is performed;

[0046] In the case where there are no actual hole positions in the punching area, determining whether the actual number of punching holes corresponding to the target FPC is the same as the preset number of designed punching holes;

[0047] In the case where the actual number of holes punched is the same as the designed number of holes punched, determining whether there are actual hole positions in a verification area of ​​the punching area, the verification area being adjacent to the punching area;

[0048] In the case where there is an actual hole position in the verification area, determining that the actual hole position does not meet the qualification condition;

[0049] When there is no actual hole position in the verification area, it is determined that the machining process is abnormal.

[0050] By adopting the above-mentioned technical scheme, when it is determined that there are no actual holes in the punching area corresponding to the punching position and the actual number of holes punched is the same as the designed number of holes punched, it can be further determined whether there are actual holes in the verification area of ​​the punching area, and when there are no actual holes in the verification area, it is determined that the processing is abnormal, so that serious errors in the processing process can be discovered in time, thereby avoiding economic losses caused by continuous processing errors.

[0051] Optionally, the determining whether to detect the punching condition of the target FPC includes:

[0052] Determine whether the number of processing times since the last detection has reached the preset waiting times;

[0053] When the number of processing times reaches the waiting number, determining to detect the punching condition of the target FPC;

[0054] When the waiting times are not reached, it is determined not to detect the punching condition of the target FPC.

[0055] By adopting the above technical solution, regular inspection of the drilling situation can be achieved during the processing process, which can help to detect the drilling effect while ensuring the processing efficiency, so that abnormalities in the processing process can be discovered in time, which can help to improve the yield rate of the processing process.

[0056] In the second aspect, the present application provides a FPC processing positioning correction method, which adopts the following technical solution:

[0057] An electronic device, comprising:

[0058] at least one processor;

[0059] Memory;

[0060] At least one application, wherein the at least one application is stored in a memory and configured to be executed by at least one processor, and the at least one application is configured to: execute any one of the FPC processing positioning correction methods provided in the first aspect.

[0061] In a third aspect, the present application provides a computer-readable storage medium, which adopts the following technical solution:

[0062] A computer-readable storage medium stores a computer program, which, when executed in a computer, causes the computer to execute any one of the FPC processing positioning correction methods provided in the first aspect.

[0063] In summary, the present application includes at least one of the following beneficial technical effects:

[0064] 1. The punching quality of FPC can be tested during FPC processing, and when it is detected that the actual hole position of FPC does not meet the qualified conditions, the coordinate conversion parameters and / or punching parameters can be corrected, which can help reduce the probability of unqualified subsequent processed products, and thus help improve the yield rate;

[0065] 2. The punching assembly can be controlled based on the reference coordinates to punch holes in the target FPC. When the reference hole position is offset after punching, it can be directly determined that the actual hole position does not meet the qualification conditions without having to detect the actual hole positions corresponding to the punching positions one by one. This can help improve the efficiency of detecting the punching effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] Figure 1 It is a flow chart of a FPC processing positioning correction method provided in an embodiment of the present application;

[0067] Figure 2 It is a flow chart of another FPC processing positioning correction method provided in an embodiment of the present application;

[0068] Figure 3 It is a flow chart of another FPC processing positioning correction method provided in an embodiment of the present application;

[0069] Figure 4 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0070] In order to make the purpose, technical solutions and advantages of this application more clear, the following Figure 1-4 It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0071] The present application embodiment discloses a FPC processing positioning correction method. Figure 1 , the FPC processing positioning correction method includes the following steps:

[0072] Step 101, obtaining punching parameters corresponding to the target FPC.

[0073] Among them, the punching parameters are used to record the relative position relationship between the punching position on the target FPC and the reference hole. Specifically, the reference hole is the existing hole position on the target FPC, the punching position refers to the position of the target FPC to be punched, and the relative position relationship between the punching position and the reference hole is preset. In one example, the punching parameters include the offset of each punching position relative to the reference hole. In actual implementation, the offset can be expressed by the offset distance in two mutually perpendicular directions (for example: x direction and y direction).

[0074] Step 102: Position the reference hole based on the coordinate conversion parameters to obtain reference coordinates corresponding to the reference hole.

[0075] Specifically, after placing the target FPC on the workbench and before processing the target FPC, the points on the target FPC need to be located to convert the points on the target FPC into device coordinates recognizable by the device, so that the device can control the processing components (such as laser transmitters) based on the device coordinates to achieve precise processing of the processing positions (such as punching positions) on the target FPC.

[0076] In one example, the coordinate conversion parameters include the correspondence between the image coordinates and the device coordinates. The target FPC is imaged by a fixed camera, and the image coordinates of the position corresponding to the reference hole in the captured image are converted into device coordinates recognizable by the device through the coordinate conversion parameters to obtain the reference coordinates.

[0077] Step 103 , pre-positioning the punching position based on the reference coordinates and the punching parameters to obtain the punching coordinates corresponding to the punching position.

[0078] Specifically, since the punching parameters include the relative position relationship between the punching position and the reference hole, and the reference coordinates can accurately indicate the position of the reference hole, the punching coordinates corresponding to the punching position can be accurately determined based on the coordinates and the punching parameters.

[0079] In one example, for each punching position, the reference coordinates are adjusted based on the offset between the punching position and the reference hole recorded in the punching parameters to obtain the punching coordinates corresponding to the punching position.

[0080] Step 104 , controlling the punching component to punch holes in the target FPC based on the punching coordinates.

[0081] In one example, the punching component is a laser emitter. In this case, the laser emitter head of the laser emitter can be controlled to move above the punching position based on the punching coordinates, and the laser emitter can be controlled to work, thereby achieving punching of the target FPC.

[0082] Step 105, determining whether to detect the punching condition of the target FPC.

[0083] In one example, the punching condition is detected at intervals of a preset number of times. Accordingly, determining whether to detect the punching condition of the target FPC includes: determining whether the number of processing times since the last detection has reached the preset waiting number; when the number of processing times reaches the waiting number, determining to detect the punching condition of the target FPC; when the waiting number is not reached, it can be directly determined not to detect the punching condition of the target FPC, or it can be further determined based on other methods whether to detect the punching condition of the target FPC. In this way, regular detection of the punching condition can be achieved during the processing process, which can help to implement detection of the punching effect while ensuring the processing efficiency, so that abnormalities in the processing process can be discovered in time, which can help to improve the yield rate in the processing process. In one example, the number of pending times is 5 times.

[0084] In another example, determining whether to detect the punching condition of the target FPC includes: determining whether a preset number of retests have been performed since the last processing times when it was determined that the actual hole position did not meet the preset conditions; if the number of retests has not been reached, determining to detect the punching condition of the target FPC; if the number of retests has been reached, it can be directly determined not to detect the punching condition of the target FPC, or it can be further determined based on other methods whether to detect the punching condition of the target FPC.

[0085] Step 106 , when it is determined that the punching condition of the target FPC is to be detected, image information corresponding to the target FPC is obtained.

[0086] The image information is pre-set, and the range corresponding to the image information at least includes the area where the punching position of the target FPC is located. In one example, the FPC processing area is captured by a fixedly set image acquisition component to obtain image information corresponding to the target FPC.

[0087] Optionally, when it is determined that the punching condition of the target FPC does not need to be detected, the next FPC is directly processed.

[0088] Step 107 : determining whether the actual hole position of the target FPC meets a preset qualification condition based on the image information.

[0089] Specifically, after the punching assembly is controlled to punch a hole in the target FPC, a corresponding actual hole position is generated on the target FPC, and accordingly, the qualified condition can be set based on the positional relationship between the actual hole position and the punching position. In one example, when the actual hole position and the punching position strictly correspond (for example, they completely overlap or the deviation does not exceed a preset range), it is determined that the actual hole position meets the qualified condition; otherwise, it is determined that the actual hole position does not meet the qualified condition.

[0090] In actual implementation, there may be corresponding marks on the punching positions of the FPC (for example, when the punching position is a pin interface, copper will be plated at the punching position. Since the color of the copper is significantly different from the color of the substrate and the color after punching, the color of the copper can be used as a mark for the punching position). When the positioning is correct, the punching component can punch through the punching mark from the center to achieve punching at the punching position. However, when the positioning is deviated, the actual hole position generated by the punching component may deviate from the punching mark. In this way, it is possible to judge whether the actual hole position meets the preset qualification conditions based on the relative position relationship between the punching position and the punching mark, thereby helping to reduce the difficulty of qualified detection of the actual hole position, and further helping to improve the accuracy of the qualified detection results.

[0091] Step 108: When the actual hole position does not meet the qualification condition, the coordinate conversion parameters and / or the drilling parameters are corrected.

[0092] Specifically, since both the coordinate conversion parameters and the punching parameters will affect the final punching results, when the actual punching position does not meet the qualified conditions, it means that there is an error in at least one of the coordinate conversion parameters and the punching parameters. Therefore, it is necessary to correct the coordinate conversion parameters and / or the punching parameters. In this way, when unqualified processing occurs, the processing parameters can be corrected in time, which can help reduce the probability of unqualified subsequent processed products, and thus help improve the yield rate.

[0093] In one example, when the actual hole position does not meet the qualification conditions, an abnormal prompt message is output to prompt the staff to correct the coordinate conversion parameters and / or drilling parameters.

[0094] Optionally, when the actual hole positions do not meet the qualification conditions, the number of unqualified actual hole positions can be further determined; when the number of unqualified actual hole positions is less than a preset difference number threshold, it is determined to correct the part corresponding to the punching position of the unqualified actual hole positions in the punching parameters; when the number of unqualified actual hole positions is greater than or equal to the difference number threshold, it is determined to correct the coordinate transformation parameters.

[0095] Specifically, when the number of unqualified actual hole positions is small, the unqualified situation is most likely caused by abnormal parameters corresponding to individual punching positions in the punching parameters. Therefore, it is possible to directly determine that the part of the punching parameters corresponding to this punching position needs to be modified. When the number of unqualified actual hole positions is large, the unqualified situation is most likely caused by abnormal coordinate conversion parameters. In this case, the coordinate conversion parameters need to be adjusted first.

[0096] In the above technical solution, it is possible to predict parameter abnormalities in combination with the number of unqualified actual hole positions, which can help accurately guide the correction of parameters, improve the accuracy of parameter correction, and also improve the efficiency of parameter adjustment.

[0097] Furthermore, it is possible to determine the parameter correction method in combination with the positional relationship between the unqualified actual hole positions and the corresponding punching positions. Specifically, when correcting the punching parameters, for each unqualified actual hole position, the part of the punching parameters corresponding to this punching position needs to be corrected based on the positional difference between the actual hole position and the corresponding punching position. When correcting the coordinate conversion parameters, the correction method for the coordinate conversion parameters needs to be determined by comprehensively considering the positional differences between all unqualified actual hole positions and the corresponding punching positions.

[0098] The implementation principle of an FPC processing positioning and calibration method provided by an embodiment of this application is as follows: Obtain the punching parameters corresponding to the target FPC, where the punching parameters are used to record the relative positional relationship between the punching positions on the target FPC and the reference holes; position the reference holes based on the coordinate conversion parameters to obtain the reference coordinates corresponding to the reference holes; pre-position the punching positions based on the reference coordinates and the punching parameters to obtain the punching coordinates corresponding to the punching positions; control the punching component to punch the target FPC based on the punching coordinates; determine whether to detect the punching situation of the target FPC; when it is determined to detect the punching situation of the target FPC, obtain the image information corresponding to the target FPC; determine whether the actual hole positions of the target FPC meet the preset qualified conditions based on the image information; when the actual hole positions do not meet the qualified conditions, correct the coordinate conversion parameters and / or the punching parameters. By adopting the above technical solution, it is possible to detect the punching quality of the FPC during the FPC processing, and when it is detected that the actual hole positions of the FPC do not meet the qualified conditions, correct the coordinate conversion parameters and / or the punching parameters. In this way, when punching is unqualified, the processing parameters can be corrected in a timely manner, which can help reduce the probability of unqualified subsequent processed products and improve the yield.

[0099] In some embodiments, refer to Figure 2, step 107, before determining whether the actual hole position of the target FPC meets the preset qualification condition based on the image information, the following steps are also included:

[0100] Step 201, controlling a punching assembly to punch holes in a target FPC based on a reference coordinate.

[0101] Specifically, the method of controlling the punching assembly to punch holes in the target FPC based on the reference coordinates can be similar to the implementation method of controlling the punching assembly to punch holes in the target FPC based on the punching coordinates in the above step 104, which will not be repeated here.

[0102] Accordingly, step 107, determining whether the actual hole position of the target FPC meets the preset qualification condition based on the image information, includes:

[0103] Step 202, determining whether the reference hole position is offset.

[0104] Specifically, since the reference hole position already exists when the punching component is controlled to punch the target FPC based on the reference coordinates, when the reference coordinates are correct, the punching operation of the punching component will completely pass through the reference hole position and will not have any impact on the target FPC; however, when the reference coordinates deviate, the punching operation of the punching component may affect the area near the reference hole position on the target FPC, thereby causing the reference hole position to shift. Therefore, the accuracy of the reference coordinates can be determined by whether the reference hole position shifts.

[0105] In one example, determining whether the reference hole position is offset includes: determining whether the area of ​​the reference hole position is greater than a preset area threshold; if so, determining that the reference hole position is offset.

[0106] In another example, determining whether the reference hole position is offset includes: determining whether the shape of the reference hole position is a preset standard shape (such as a circle); if not, determining that the reference hole position is offset.

[0107] Step 203: When it is determined that the reference hole position is offset, it is determined that the actual hole position does not meet the qualification condition.

[0108] Specifically, when the reference hole position is offset, that is, there is a deviation in the reference coordinates, and the drilling coordinates are determined based on the reference coordinates. When there is a deviation in the reference coordinates, there is a high probability that the actual hole position has a deviation. Therefore, it can be directly determined that the actual hole position does not meet the qualification conditions.

[0109] Furthermore, since the reference coordinates are obtained by positioning the reference hole based on the coordinate conversion parameters, when there is a deviation in the reference coordinates, it means that there is an error in the coordinate conversion parameters and correction is required. Therefore, it can be further determined that the coordinate conversion parameters need to be corrected.

[0110] Optionally, when it is determined that the reference hole position has not shifted, it can be directly determined whether the actual hole position meets the qualification condition, or it can be determined one by one or by sampling based on other methods whether the actual hole position meets the qualification condition.

[0111] In the above embodiment, the punching assembly can be controlled to punch holes in the target FPC based on the reference coordinates, and when the reference hole position is offset after punching, it can be directly determined that the actual hole position does not meet the qualification conditions, without having to detect the actual hole positions corresponding to the punching positions one by one, which can help improve the efficiency of detecting the punching effect.

[0112] For further information, please refer to Figure 2 , step 202, after determining whether the reference hole position is offset, comprises the following steps:

[0113] Step 204 , when the reference hole position is not offset, for each hole punching position, based on the actual hole position corresponding to the hole punching position, determine whether the hole punching quality corresponding to the hole punching position meets the preset quality requirement.

[0114] Optionally, determine whether the punching quality corresponding to the punching position meets preset quality requirements based on the actual hole position corresponding to the punching position, including: when the actual specific gravity is greater than the specific gravity threshold, determine whether the actual hole position corresponding to the punching position is completely located in the punching area; when the actual hole position corresponding to the punching position is completely located in the punching area, determine that the punching quality meets the quality requirements.

[0115] The punching area is pre-marked on the FPC, and the punching position is located at the center of the corresponding punching area. In actual implementation, the shape of the punching area can be circular, and the diameter is slightly larger than the diameter of the hole, so that the punching effect can be easily verified.

[0116] In one example, when the actual hole position corresponding to the punching position is not completely located within the punching area, it is further determined whether the actual proportion of the actual hole position corresponding to the punching position located within the punching area is greater than a preset proportion threshold; when the actual proportion is less than or equal to the proportion threshold, it is determined that the punching quality does not meet the quality requirements.

[0117] The actual proportion refers to the proportion of the area of ​​the actual hole positions located in the punching area to the total area of ​​the actual hole positions.

[0118] In the above technical solution, it is taken into consideration that control errors may occur in the process of controlling the punching component to perform punching, thereby causing a slight offset in the actual hole position. Therefore, the offset of the actual hole position is further judged. In the case of a large offset, it is directly determined that the punching quality does not meet the quality requirements. This can help reduce the impact of equipment errors on quality judgments, thereby helping to distinguish between parameter errors and equipment errors, and further helping to improve the accuracy of parameter correction judgments.

[0119] Furthermore, in the above scheme, after determining whether the actual proportion of the actual hole position corresponding to the punching position located in the punching area is greater than the preset proportion threshold, it also includes: recording the number of abnormalities corresponding to the punching position once; determining whether the number of abnormalities corresponding to the punching position is greater than the preset abnormal waiting number; when the number of abnormalities corresponding to the punching position is greater than the abnormal waiting number, determining that the punching quality of the punching position does not meet the quality requirements.

[0120] The number of abnormalities corresponding to different punching positions is counted separately. In one example, the number of abnormal waiting times is four.

[0121] Since the offset of the punching position under consideration may be caused by equipment error or error in the punching parameters, in the above further technical scheme, for the same punching position, the number of abnormalities corresponding to the punching position will be counted. When the number of abnormalities reaches the number of abnormal waiting times, it means that the offset of the punching position is most likely caused by errors in the punching parameters. Therefore, in this case, determining that the punching quality does not meet the quality requirements can indicate adjustment of the punching parameters, which can help reduce the offset of the actual hole position in subsequent processing, and further help improve the yield rate of the product.

[0122] In actual implementation, when the number of abnormalities corresponding to the punching position is less than or equal to the number of waiting times, it can also be directly determined that the punching quality does not meet the quality requirements without performing the abnormality number check.

[0123] Furthermore, in the above further scheme, when the number of abnormalities corresponding to the punching position is greater than the number of abnormal waiting times, it also includes: determining whether there are risky punching positions among the various punching positions whose corresponding number of abnormalities is less than or equal to the number of abnormal waiting times and greater than the preset risk waiting times; when there are risky punching positions, determining whether the number of risky punching positions exceeds the preset risk number threshold; when the number of risky punching positions exceeds the risk number threshold, determining that the punching quality corresponding to each risk position does not meet the requirements.

[0124] Among them, the number of risk waiting times is less than the number of abnormal waiting times.

[0125] The difference between the number of punching positions and the risk quantity threshold is not less than 2. For example, if the number of punching positions is 10, the risk quantity threshold is not greater than 8.

[0126] Since the punching parameters need to be corrected when there are punching positions whose corresponding number of exceptions is greater than the number of exception waiting times, the number of risky punching positions with risks is further determined based on the risk waiting times, and when the number of risky punching positions exceeds the risk number threshold, it is determined that the punching quality corresponding to the risk position does not meet the requirements. In this way, in the process of correcting the punching parameters, the part corresponding to the risk position can be corrected at the same time, which can help reduce the number of corrections to the punching parameters and also help ensure the yield rate of the product.

[0127] Step 205: When the drilling quality does not meet the quality requirement, it is determined that the actual hole position does not meet the qualification condition.

[0128] Optionally, in the case where the punching quality does not meet the quality requirements, it can be further determined that the portion of the punching parameters corresponding to the punching position where the punching quality does not meet the quality requirements is corrected. Specifically, since the reference hole position has not shifted, it means that there is no deviation in the coordinate conversion parameters. At this time, the deviation in the punching quality is most likely caused by the deviation in the punching parameters. Therefore, it is necessary to correct the portion of the punching parameters corresponding to the punching position where the punching quality does not meet the quality requirements, which can help improve the accuracy of the punching parameters.

[0129] In the above technical solution, when the reference hole position has not shifted, it is possible to determine whether the punching quality corresponding to the punching position meets the preset quality requirements based on the actual hole position corresponding to the punching position, and when the punching quality does not meet the quality requirements, it is determined that the actual hole position does not meet the qualified conditions. This can help discover the actual hole position that is caused by the punching parameters and thereby promptly discover the errors in the punching parameters, which can help improve the yield rate.

[0130] In some embodiments, reference Figure 3 , step 107, before determining whether the actual hole position of the target FPC meets the preset qualification condition based on the image information, includes the following steps:

[0131] Step 301: for each punching position, determine whether there is an actual hole position in the punching area corresponding to the punching position.

[0132] The punching area is pre-marked on the FPC, and the punching position is located at the center of the corresponding punching area. In actual implementation, the shape of the punching area is circular, and the diameter is slightly larger than the diameter of the hole, so that the punching effect can be easily verified.

[0133] In this embodiment, when there is an actual hole position intersecting with the punching area, it is considered that there is an actual hole position in the punching area.

[0134] Step 302, when there are actual hole positions in the punching area, the actual hole positions in the punching area are determined as the actual hole positions corresponding to the punching positions, and a step of determining whether the actual hole positions of the target FPC meet preset qualification conditions based on the image information is performed, that is, step 107 is executed.

[0135] Step 303: When there are no actual hole positions in the punching area, determine whether the actual number of punching holes corresponding to the target FPC is the same as the preset number of designed punching holes.

[0136] The actual number of holes punched is recorded during the process of punching holes in the target FPC, that is, during the execution of step 104 .

[0137] Step 304 , when the actual number of holes punched is the same as the designed number of holes punched, determine whether there are actual hole positions in the verification area of ​​the punching area.

[0138] The verification area is adjacent to the punching area.

[0139] In this embodiment, when there is an actual hole position intersecting with the verification area, it is considered that there is an actual hole position in the verification area.

[0140] Step 305: When there are actual hole positions in the verification area, directly determine that the actual hole positions do not meet the qualification condition.

[0141] Step 306: If there is no actual hole position in the verification area, it is determined that the machining process is abnormal.

[0142] Specifically, processing abnormalities refer to serious errors that occur during the processing, such as missing holes or serious deviations in the punching positions. When such errors occur, the processed FPC products will obviously not meet the quality standards, so special prompts are required.

[0143] In one example, when the actual number of holes punched is different from the designed number of holes punched, it can also be directly determined that the processing is abnormal.

[0144] Furthermore, when a processing abnormality is determined, the processing of subsequent FPCs can be stopped and abnormal alarm information can be output to prompt the staff to handle the processing abnormality in a timely manner, thereby avoiding economic losses caused by continuous processing errors.

[0145] In the above technical scheme, when it is determined that there are no actual holes in the punching area corresponding to the punching position and the actual number of holes punched is the same as the designed number of holes punched, it can be further determined whether there are actual holes in the verification area of ​​the punching area, and when there are no actual holes in the verification area, it is determined that the processing is abnormal. In this way, serious errors in the processing process can be discovered in time, thereby avoiding economic losses caused by continuous processing errors.

[0146] The present application also provides an electronic device. Figure 4 As shown, Figure 4 The electronic device 400 shown includes: a processor 401 and a memory 403. The processor 401 and the memory 403 are connected, such as through a bus 402. Optionally, the electronic device 400 may also include a transceiver 404. It should be noted that in actual applications, the transceiver 404 is not limited to one, and the structure of the electronic device 400 does not constitute a limitation on the embodiments of the present application.

[0147] Processor 401 may be a CPU (Central Processing Unit), a general-purpose processor, a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), or other programmable logic devices, transistor logic devices, hardware components, or any combination thereof. It may implement or execute various exemplary logic blocks, modules, and circuits described in conjunction with the disclosure of this application. Processor 401 may also be a combination that implements computing functions, such as a combination of one or more microprocessors, a combination of a DSP and a microprocessor, and the like.

[0148] The bus 402 may include a path to transmit information between the above components. The bus 402 may be a PCI (Peripheral Component Interconnect) bus or an EISA (Extended Industry Standard Architecture) bus. The bus 402 may be divided into an address bus, a data bus, etc. For ease of representation, Figure 4 Only one thick line is used in the diagram, but this does not mean that there is only one bus or only one type of bus.

[0149] The memory 403 may be a ROM (Read Only Memory) or other types of static storage devices that can store static information and instructions, a RAM (Random Access Memory) or other types of dynamic storage devices that can store information and instructions, or an EEPROM (Electrically Erasable Programmable Read Only Memory), a disk storage medium or other magnetic storage device, or any other medium that can be used to carry or store desired program codes in the form of instructions or data structures and can be accessed by a computer, but is not limited thereto.

[0150] The memory 403 is used to store the application code for executing the solution of the present application, and the execution is controlled by the processor 401. The processor 401 is used to execute the application code stored in the memory 403 to implement the contents shown in the above method embodiment.

[0151] The electronic devices include, but are not limited to, mobile terminals such as mobile phones, laptop computers, PDAs (personal digital assistants), PADs (tablet computers), etc., and fixed terminals such as digital TVs, desktop computers, etc. It can also be a server terminal, etc. Figure 4 The electronic device shown is merely an example and should not bring any limitation to the functions and scope of use of the embodiments of the present application.

[0152] The embodiment of the present application also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed in a computer, the computer is caused to execute the FPC processing positioning correction method provided in the above embodiment.

[0153] It should be understood that although the steps in the flowchart of the accompanying drawings are shown in sequence according to the instructions of the arrows, these steps are not necessarily performed in the order indicated by the arrows. Unless otherwise clearly stated in this document, the execution of these steps is not strictly limited in order and can be performed in other orders.

[0154] The above are only some implementation methods of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A FPC processing positioning correction method, characterized in that: The method comprises: Obtaining punching parameters corresponding to the target FPC, wherein the punching parameters are used to record the relative position relationship between the punching position and the reference hole position on the target FPC; Positioning the reference hole position based on the coordinate conversion parameters to obtain the reference coordinates corresponding to the reference hole position; Pre-positioning the punching position based on the reference coordinates and the punching parameters to obtain the punching coordinates corresponding to the punching position; Controlling a punching component to punch holes in the target FPC based on the reference coordinates and the punching coordinates; Determining whether to detect the punching condition of the target FPC; When it is determined that the punching condition of the target FPC is to be detected, image information corresponding to the target FPC is acquired; Determining whether the actual hole position of the target FPC meets a preset qualification condition based on the image information; When the actual hole position does not meet the qualified condition, modifying the coordinate conversion parameter and / or the punching parameter; The determining, based on the image information, whether the actual hole position of the target FPC meets a preset qualification condition includes: Determining whether the reference hole position is offset; In the case where the reference hole position is not offset, for each of the punching positions, determining whether the punching quality corresponding to the punching position meets a preset quality requirement based on the actual hole position corresponding to the punching position; In the case where the drilling quality does not meet the quality requirement, determining that the actual hole position does not meet the qualification condition; The correcting of the coordinate conversion parameters and / or the punching parameters includes: Determining the number of actual hole positions that do not meet the qualification condition; When the number of actual hole positions that do not meet the qualification condition is less than a preset difference number threshold, determining to correct a portion of the punching parameters corresponding to the punching positions of the actual hole positions that do not meet the qualification condition; When the number of actual hole positions that do not meet the qualification condition is greater than or equal to the difference number threshold, it is determined to correct the coordinate conversion parameters.

2. The method according to claim 1, characterized in that After determining whether the reference hole position is offset, the method further includes: In the case where it is determined that the reference hole position is offset, it is determined that the actual hole position does not meet the qualification condition.

3. The method according to claim 1, characterized in that The determining, based on the actual hole position corresponding to the hole position, whether the hole quality corresponding to the hole position meets the preset quality requirement includes: Determining whether the actual hole position corresponding to the punching position is completely located in the punching area; In a case where the actual hole position corresponding to the punching position is completely located in the punching area, determining that the punching quality meets the quality requirement; In the case where the actual hole position corresponding to the punching position is not completely located in the punching area, determining whether the actual proportion of the portion of the actual hole position corresponding to the punching position located in the punching area is greater than a preset proportion threshold; When the actual specific gravity is less than or equal to the specific gravity threshold, it is determined that the punching quality does not meet the quality requirement.

4. The method according to claim 3, characterized in that After determining whether the actual proportion of the actual hole positions corresponding to the punching positions located in the punching area is greater than a preset proportion threshold, the method further includes: When the actual specific gravity is greater than the specific gravity threshold, the number of abnormalities corresponding to the punching position is recorded once; Determine whether the number of abnormalities corresponding to the punching position is greater than a preset number of abnormal waiting times; When the number of abnormalities corresponding to the punching position is greater than the number of abnormal waiting times, it is determined that the punching quality of the punching position does not meet the quality requirement.

5. The method according to claim 4, characterized in that When the number of abnormalities corresponding to the punching position is greater than the number of abnormal waiting times, the method further includes: Determine whether there is a risk punching position in each of the punching positions, the corresponding abnormal number of which is less than or equal to the abnormal waiting number and greater than a preset risk waiting number, and the risk waiting number is less than the abnormal waiting number; In the case where the risky perforation positions exist, determining whether the number of the risky perforation positions exceeds a preset risk number threshold; When the number of the risky perforation positions exceeds the risky number threshold, it is determined that the perforation quality corresponding to each of the risky positions does not meet the requirement.

6. The method according to claim 1, characterized in that Before determining whether the actual hole position of the target FPC meets the preset qualification condition based on the image information, the method further includes: For each of the punching positions, determining whether there is an actual hole position in the punching area corresponding to the punching position; In the case where there are actual hole positions in the punching area, the actual hole positions in the punching area are determined as the actual hole positions corresponding to the punching positions, and the step of determining whether the actual hole positions of the target FPC meet the preset qualification conditions based on the image information is performed; In the case where there are no actual hole positions in the punching area, determining whether the actual number of punching holes corresponding to the target FPC is the same as the preset number of designed punching holes; In the case where the actual number of holes punched is the same as the designed number of holes punched, determining whether there are actual hole positions in a verification area of ​​the punching area, the verification area being adjacent to the punching area; In the case where there is an actual hole position in the verification area, determining that the actual hole position does not meet the qualification condition; When there is no actual hole position in the verification area, it is determined that the machining process is abnormal.

7. The method according to claim 1, characterized in that The determining whether to detect the punching condition of the target FPC includes: Determine whether the number of processing times since the last detection has reached the preset waiting times; When the number of processing times reaches the waiting number, determining to detect the punching condition of the target FPC; When the waiting times are not reached, it is determined not to detect the punching condition of the target FPC.

8. An electronic device, characterized in that: The electronic device comprises: at least one processor; Memory; At least one application, wherein the at least one application is stored in a memory and configured to be executed by at least one processor, and the at least one application is configured to: execute the FPC processing positioning correction method according to any one of claims 1 to 7.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed in a computer, the computer is caused to execute the FPC processing positioning correction method according to any one of claims 1 to 7.

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