Electronic equipment, circuit board module and packaging method thereof

Abstract

The invention provides electronic equipment, a circuit board module and a packaging method thereof. The packaging method comprises the steps that a circuit board is provided, and the circuit board comprises a printed circuit board and a plurality of electronic components installed on the printed circuit board; coating glue on at least part of the electronic components and curing to form an insulating layer; and coating shielding material glue on the plurality of electronic components and curing to form an electromagnetic protection layer. According to the packaging method of the circuit board module provided by the embodiment of the invention, the dispensing of the insulating layer is firstly carried out, then the dispensing of the electromagnetic protection layer is carried out, and finally the two protection layers are formed in a curing manner, so that the packaging method replaces an original shielding cover with two layers of materials, and redundant space is saved, so that the space of a whole machine is optimized, and the packaging efficiency is improved. Therefore, more design space is provided for stacking devices in the electronic equipment, and the overall thickness of the electronic equipment can be reduced.

Description

Technical Field

[0001] The present application relates to the technical field of electronic device circuit board packaging, and specifically to an electronic device, a circuit board module and a packaging method thereof. Background Art

[0002] The trend of thinner and lighter devices is getting stronger. With the continuous increase of battery capacity, the current focus is on thinning materials such as battery cover and display cover. However, due to the limitation of material technology, it is impossible to thin infinitely. Therefore, it is necessary to explore new technologies in various links. The current PCB (printed circuit board) stacking solution is mainly designed using the shielding cover process.

[0003] See also Figure 1 , Figure 1 It is a packaging structure of a conventional circuit board module, in which 10a marked in the figure represents a PCB board, 10b represents an electronic component, 10c represents a metal shielding cover, and 10d represents a thermal conductive gel. This solution protects the chip (electronic component) inside with a shielding cover, which plays a role in shielding structural stress and EMC (i.e. the abbreviation of Electromagnetic Compatibility, which refers to the ability of a device or system to operate in accordance with requirements in its electromagnetic environment and not produce intolerable electromagnetic interference to any device in its environment). The disadvantages of this structure are: on the one hand, it limits the thickness of the whole machine and cannot be further thinned; on the other hand, the shielding cover is not flexible enough, resulting in the existence of a lot of redundant space (such as the space marked 10e in the figure), and the heat dissipation effect is also relatively poor. Summary of the invention

[0004] A first aspect of an embodiment of the present application provides a packaging method for a circuit board module, the packaging method comprising:

[0005] A circuit board is provided, wherein the circuit board comprises a printed circuit board and a plurality of electronic components mounted on the printed circuit board;

[0006] Applying glue to at least a portion of the electronic components and curing the glue to form an insulating layer;

[0007] Shielding material glue is applied to the plurality of electronic components and cured to form an electromagnetic protection layer.

[0008] In a second aspect, an embodiment of the present application provides a circuit board module, and the circuit board module is packaged using the packaging method described in the above embodiment.

[0009] In a third aspect, an embodiment of the present application provides an electronic device, which includes a housing, a functional device and the circuit board module described in the above embodiment; the functional device and the circuit board module are respectively connected to the housing, the functional device is electrically connected to the circuit board module, and the circuit board module is used to control the functional device.

[0010] The packaging method of the circuit board module provided in the embodiment of the present application first dispenses the insulating layer, then dispenses the electromagnetic protection layer, and finally forms two protective layers by curing. The packaging method replaces the original shielding cover with two layers of material and saves redundant space, thereby optimizing the space of the entire machine, allowing more design space for stacking devices inside the electronic device, and at the same time is beneficial to reducing the overall thickness of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0012] Figure 1 It is a packaging structure of a conventional circuit board module;

[0013] Figure 2 It is a flow chart of an embodiment of a packaging method of a circuit board module of the present application;

[0014] Figure 3 is a schematic diagram of the structure of the circuit board in the embodiment of the present application;

[0015] Figure 4 It is a schematic diagram of the structure of some electronic components on the circuit board after forming an insulating layer in the embodiment of the present application;

[0016] Figure 5 This is a schematic diagram of the top view of the structure of an embodiment of the circuit board of the present application;

[0017] Figure 6 It is a structural schematic diagram of an embodiment of the circuit board module packaged in the present application;

[0018] Figure 7 is a schematic diagram of the top view of another embodiment of the circuit board of the present application;

[0019] Figure 8 It is a flow chart of another embodiment of the packaging method of the circuit board module of the present application;

[0020] Fig. 9It is a structural schematic diagram of another embodiment of the circuit board module of the present application after packaging;

[0021] Fig.10 It is a structural schematic diagram of an embodiment of the electronic device of the present application;

[0022] Fig.11 yes Fig.10 A schematic cross-sectional view of the structure of the electronic device at FF in the embodiment;

[0023] Fig.12 It is a schematic diagram of the structural composition block diagram of an embodiment of the electronic device of the present application. DETAILED DESCRIPTION

[0024] The present application is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application rather than all embodiments, and all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0025] The terms "first", "second", and "third" in the embodiments of the present application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", and "third" can expressly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of the present application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. The terms "including" and "having" in the embodiments of the present application and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or components inherent to these processes, methods, products, or devices.

[0026] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0027] As used herein, "electronic devices" (or simply "terminals") include, but are not limited to, devices configured to receive / send communication signals via a wireline connection (e.g., via a public switched telephone network (PSTN), a digital subscriber line (DSL), a digital cable, a direct cable connection, and / or another data connection / network) and / or via a wireless interface (e.g., for a cellular network, a wireless local area network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and / or another communication terminal). Communication terminals configured to communicate via a wireless interface may be referred to as "wireless communication terminals", "wireless terminals" or "mobile terminals". Examples of mobile terminals include, but are not limited to, satellite or cellular phones; personal communication system (PCS) terminals that may combine cellular radiotelephones with data processing, fax, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, organizers, calendars, and / or global positioning system (GPS) receivers; and conventional laptop and / or palmtop receivers or other electronic devices that include radiotelephone transceivers. A mobile phone is an electronic device equipped with a cellular communication module.

[0028] The present application provides a packaging method for a circuit board module. Figure 2 , Figure 2 This is a flow chart of an embodiment of a packaging method for a circuit board module of the present application. It should be noted that the circuit board module obtained by the packaging method in the present application can be used in electronic devices including mobile phones, tablet computers, laptop computers, wearable devices, etc. The packaging method includes but is not limited to the following steps.

[0029] Step S100: providing a circuit board.

[0030] Please also read Figure 3 , Figure 3 It is a structural schematic diagram of a circuit board in an embodiment of the present application, wherein the circuit board 110 includes a printed circuit board 111 and a plurality of electronic components 112 mounted on the printed circuit board 111, wherein the plurality of electronic components 112 may include active devices and passive devices, etc., for example, may include chips, sensors, capacitors, resistors, etc. The detailed features of this part are within the scope of understanding of those skilled in the art and will not be repeated here.

[0031] Please continue reading Figure 1 The packaging method in this embodiment further includes step S200, applying glue to at least part of the electronic components and curing the glue to form an insulating layer.

[0032] Please also read Figure 4 , Figure 4It is a schematic diagram of the structure after some electronic components on the circuit board form an insulating layer in the embodiment of the present application, wherein the purpose of the insulating layer 120 is to solve the problem of short circuit of the resistor, capacitor and inductor on the printed circuit board 111. Because the next process is conductive material. Step S200 can be specifically to use a dispensing machine to spray liquid insulating material, and then form an insulating layer 120 through high temperature curing. Specifically, it can be used in a curing furnace and stand in an environment of 60℃-120℃ for 5-10 minutes.

[0033] Before this step, the x-ray detection area can be defined to scan the front and back of the entire circuit board and identify the devices or areas that need insulation protection, usually the locations of connectors, such as cameras, displays, batteries, RC devices, BTB areas, etc.

[0034] See also Figure 5 , Figure 5 This is a schematic diagram of the top view of an embodiment of the circuit board of the present application, wherein the area marked A in the figure may be an area that does not require insulation treatment, and the area marked B in the figure may be an area that requires insulation treatment. Because not all areas of the devices on the circuit board need to be insulated, for the main chip like BB / DDR, which has an epoxy resin shielding layer on it, there is no need for insulation treatment, such as the marked area A. The glue dispenser dispenses glue according to the patern shown in the identified and marked area B, thereby achieving the purpose of insulating the RC and inductor devices on the circuit board.

[0035] Optionally, the material of the insulating layer in this embodiment is an organic high molecular polymer, such as high molecular polyethylene polymer, polyvinyl chloride, polypropylene, etc. The thickness of the insulating layer 120 is 50-100um, and can be specifically 50um, 55um, 58um, 60um, 72um, 85um, 90um, 100um, etc. Different thicknesses are designed according to different materials of the insulating layer and different insulating positions.

[0036] Optionally, see Figure 1 The packaging method in this embodiment further includes step S300, coating shielding material glue on multiple electronic components and curing to form an electromagnetic protection layer.

[0037] See also Figure 6 , Figure 6This is a schematic diagram of the structure of an embodiment of the circuit board module package of the present application. In this step, the shielding material glue can be conductive particles doped in organic high molecular polymers, and at least one or more material particles of graphite, silver, copper, aluminum, and iron doped in olefin polymers, wherein the metal particles can be nano-scale particles. The thickness of the electromagnetic shielding layer 130 is 20-200um, and can be 20um, 35um, 50um, 60um, 100um, 125um, 150um, 200um, etc. Different thicknesses are selected and designed according to different materials of the electromagnetic shielding layer and different shielding positions.

[0038] Because the devices on the circuit board are divided into baseband chips and radio frequency devices, there is mutual electromagnetic interference between them. Therefore, in addition to the protection of the insulation layer, a shielding layer is also required. Please refer to Figure 7 , Figure 7 This is a schematic diagram of the top structure of another embodiment of the circuit board of the present application. The areas marked C and D in the figure may be baseband areas, and the area marked E in the figure is the radio frequency area. Among them, there is mutual radio frequency interference between the baseband area and the radio frequency area, so shielding is required. Areas C and D can be taken as a whole to make an electromagnetic shielding layer 130a, and area E can be made into an electromagnetic shielding layer 130b. With the same process principle, we need to use a dispensing machine to apply the shielding material glue through a specific pattern to form multiple independent electromagnetic shielding layers. Specifically, it can be to use a curing furnace after applying the shielding material glue and let it stand in an environment of 60℃-120℃ for 5-10 minutes.

[0039] The packaging method of the circuit board module provided in the embodiment of the present application first dispenses the insulating layer, then dispenses the electromagnetic protection layer, and finally forms two protective layers by curing. The packaging method replaces the original shielding cover with two layers of material and saves redundant space, thereby optimizing the space of the entire machine, allowing more design space for stacking devices inside the electronic device, and at the same time is beneficial to reducing the overall thickness of the electronic device.

[0040] See also Figure 8 , Figure 8 It is a flow chart of another embodiment of the packaging method of the circuit board module of the present application, and the packaging method includes but is not limited to the following steps.

[0041] Step S100: providing a circuit board.

[0042] Please continue reading Figure 2 The circuit board 110 includes a printed circuit board 111 and a plurality of electronic components 112 mounted on the printed circuit board 111, wherein the plurality of electronic components 112 may include active components and passive components, such as chips, sensors, capacitors, resistors, and the like.

[0043] Please continue reading Figure 8 The packaging method in this embodiment further includes step S200, applying glue to at least part of the electronic components and curing the glue to form an insulating layer.

[0044] Please also read Fig. 9 , Fig. 9 It is a structural schematic diagram of another embodiment of the circuit board module package of the present application, wherein the purpose of the insulating layer 120 is to solve the problem of short circuit of the resistor, capacitor and inductor on the printed circuit board 111. Because the next process is conductive material. Step S200 can be specifically to use a dispensing machine to spray liquid insulating material, and then form the insulating layer 120 through high temperature curing. Specifically, it can be to use a curing oven after applying the glue and let it stand in an environment of 60℃-120℃ for 5-10 minutes.

[0045] Before this step, you can define the x-ray inspection area, scan the front and back of the entire circuit board and identify which devices or areas need insulation protection, usually the location of connectors, such as cameras, displays, batteries, RC devices, BTB areas, etc. You can continue to refer to Figure 5 , the area marked A in the figure may be an area that does not require insulation treatment, while the area marked B in the figure may be an area that requires insulation treatment. Because not all areas of the devices on the circuit board need to be insulated, for the main chip like BB / DDR, which has an epoxy resin shielding layer, no insulation treatment is required, such as the marked area A. The glue dispenser dispenses glue according to the patern shown in the identified and marked area B, thereby achieving the purpose of insulating the resistor-capacitor-inductor devices on the circuit board. Optionally, the material of the insulating layer in this embodiment is an organic polymer, such as a high molecular weight polyethylene polymer, polyvinyl chloride, polypropylene, etc. Among them, the thickness of the insulating layer 120 is 50-100um, and specifically can be 50um, 55um, 58um, 60um, 72um, 85um, 90um, 100um and other values. Different thicknesses are selected and designed according to different materials of the insulating layer and different insulation positions.

[0046] Optionally, see Figure 8 The packaging method in this embodiment further includes step S300, coating shielding material glue on multiple electronic components and curing to form an electromagnetic protection layer.

[0047] In this step, the shielding material glue can be conductive particles doped in organic high molecular polymers, and at least one or more material particles of graphite, silver, copper, aluminum, and iron doped in olefin polymers, wherein the metal particles can be nanoscale particles. The thickness of the electromagnetic shielding layer 130 is 20-200um, and can be 20um, 35um, 50um, 60um, 100um, 125um, 150um, 200um and other values. Different thicknesses are designed according to different materials of the electromagnetic shielding layer and different shielding positions. Because the devices on the circuit board are divided into baseband chips and radio frequency devices, there is mutual electromagnetic interference between them. Therefore, in addition to the protection of the insulating layer, a shielding layer protection is also required. Please continue to refer to Figure 7 , the area marked C and D in the figure can be the baseband area, and the area marked E in the figure is the radio frequency area. Among them, there is mutual radio frequency interference between the baseband area and the radio frequency area, so shielding is required. Area C and area D can be taken as a whole to make an electromagnetic protection layer 130a, and area E can make an electromagnetic protection layer 130b. With the same process principle, we need to use a dispensing machine to apply the shielding material glue through a specific pattern to form one or more independent electromagnetic protection layers. Specifically, after applying the shielding material glue, a curing oven is used, and it is allowed to stand in an environment of 60℃-120℃ for 5-10 minutes.

[0048] Please continue reading Figure 8 and Fig. 9 , different from the above-mentioned embodiment, the packaging method in this embodiment further includes step S400, forming a protective layer on the electromagnetic shielding layer.

[0049] The protective layer 140 may be formed by a material and method similar to the insulating layer 120, or may be formed by spraying or the like. The protective layer 140 is mainly used to protect the electromagnetic shielding layer and improve the heat dissipation efficiency. In some embodiments, the protective layer 140 may be formed by applying glue and curing it.

[0050] The packaging method of the circuit board module provided in the embodiment of the present application first dispenses the insulating layer, then dispenses the electromagnetic protection layer, and finally forms two layers of protection by curing. The packaging method replaces the original shielding cover with two layers of material, and saves redundant space, thereby optimizing the space of the whole machine, allowing more design space for stacking devices inside the electronic device, and at the same time facilitating the overall thickness of the electronic device. In addition, by forming a protective layer outside the electromagnetic protection layer, the purpose of protecting the electromagnetic protection layer and improving the heat dissipation efficiency can be achieved.

[0051] Furthermore, the present application also provides an electronic device, which may include a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. Fig.10 and Fig.11 , Fig.10 is a structural diagram of an embodiment of the electronic device of the present application, Fig.11 yes Fig.10 The schematic cross-sectional view of the structure of the electronic device at FF in the embodiment, the electronic device in this embodiment may include a display screen 30 , a housing 10 , a circuit board module 20 , a middle frame 40 and a functional device 50 .

[0052] Optionally, the display screen 30 in this embodiment cooperates with the housing 10 (which may be a back cover) and the middle frame 40 to form a receiving cavity 1000, the circuit board module 20 is disposed in the receiving cavity 1000, the functional device 50 includes but is not limited to a camera, a sensor, a speaker, a flash, etc. (within the understanding of those skilled in the art, and will not be listed and described in detail here), the circuit board module 20 is electrically connected to the display screen 30 and the functional device 50, and is used to control the working state of the display screen 30 and the functional device 50. The detailed structure of the circuit board module 20 can be found in the relevant description of the aforementioned embodiment, and will not be repeated here.

[0053] See also Fig.12 , Fig.12 It is a schematic diagram of the structural composition block diagram of an embodiment of an electronic device of the present application. The electronic device can be a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. The mobile phone is used as an example in the diagram of this embodiment. The structure of the electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (which may be the display screen 30 in the above embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980 (which may be the circuit board module 20 in the above embodiment) and a power supply 990, etc. Among them, the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960 and the wifi module 970 are respectively connected to the processor 980; the power supply 990 is used to provide power to the entire electronic device 10.

[0054] Specifically, the RF circuit 910 is used to receive and send signals; the memory 920 is used to store data instruction information; the input unit 930 is used to input information, which may specifically include a touch panel 931 and other input devices 932 such as operation buttons; the display unit 940 may include a display panel 941, etc.; the sensor 950 includes an infrared sensor, a laser sensor, etc., for detecting user approach signals, distance signals, etc.; the speaker 961 and the microphone (or microphone) 962 are connected to the processor 980 through the audio circuit 960 for receiving and sending sound signals; the wifi module 970 is used to receive and transmit wifi signals, and the processor 980 is used to process data information of the electronic device. For the specific structural features of the electronic device, please refer to the relevant description of the above embodiment, which will not be described in detail here.

[0055] In the electronic device in this embodiment, the circuit board module is first glued on the insulating layer, then glued on the electromagnetic protection layer, and finally two protective layers are formed by curing. This packaging method replaces the original shielding cover with two layers of material and saves redundant space, thereby optimizing the space of the entire machine, allowing more design space for stacking devices inside the electronic device, and at the same time helping to reduce the overall thickness of the electronic device.

[0056] The above descriptions are only some embodiments of the present application, and do not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A packaging method for a circuit board module, characterized in that: The packaging method comprises: A circuit board is provided, wherein the circuit board comprises a printed circuit board and a plurality of electronic components mounted on the printed circuit board; Applying glue to at least a portion of the electronic components and curing the glue to form an insulating layer; Shielding material glue is applied to the plurality of electronic components and cured to form an electromagnetic protection layer.

2. The packaging method according to claim 1, characterized in that: The shielding material glue is an organic high molecular polymer doped with conductive particles.

3. The packaging method according to claim 2, characterized in that: The shielding material glue is a material particle of at least one or more of graphite, silver, copper, aluminum, and iron doped in an olefin polymer.

4. The packaging method according to claim 1, characterized in that: The thickness of the electromagnetic protection layer is 20-200um.

5. The packaging method according to claim 1, characterized in that: The material of the insulating layer is organic high polymer.

6. The packaging method according to claim 5, characterized in that: The material of the insulating layer is high molecular weight polyethylene polymer.

7. The packaging method according to claim 5, characterized in that: The thickness of the insulating layer is 50-100 um.

8. The packaging method according to claim 1, characterized in that: The packaging method further comprises: forming a protective layer on the electromagnetic shielding layer.

9. A circuit board module, characterized in that: The circuit board module is packaged by the packaging method described in any one of claims 1 to 8.

10. An electronic device, characterized in that: The electronic device includes a shell, a functional device and the circuit board module described in claim 9; the functional device and the circuit board module are respectively connected to the shell, the functional device is electrically connected to the circuit board module, and the circuit board module is used to control the functional device.

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