Heat dissipation assembly

Abstract

The invention provides a heat dissipation assembly which is applied to electronic equipment, the electronic equipment comprises a first substrate and a second substrate opposite to the first substrate, and a first component on the first substrate is connected with a second component on the second substrate through a connector. The heat dissipation assembly comprises a heat dissipation substrate and a through hole structure. The heat dissipation substrate is in contact with the first substrate, is used for dissipating heat of the first substrate and is provided with a through hole corresponding to the connector; the through hole structure comprises a hole column corresponding to the through hole, a first sealing cover formed by extending from one end of the hole column and a second sealing cover formed by extending from the other end of the hole column; wherein the connector is connected with the first component and the second component through the through hole and the hole column, the first sealing cover seals and wraps a connecting area of the connector and the first component, and the second sealing cover seals and wraps a connecting area of the connector and the second component. Under the condition that the packaging requirements of small space and high sealing performance of the electronic equipment are met, heat dissipation with higher efficiency is provided for components in the electronic equipment.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electronic equipment, and in particular to a heat dissipation component. Background Art

[0002] As electronic devices develop towards miniaturization, high power and high integration, the heat generated by components is also increasing.

[0003] How to achieve better heat dissipation performance under the small space and high sealing packaging requirements of electronic equipment is a technical problem to be solved by this application. Summary of the invention

[0004] The purpose of the present application is to provide a heat dissipation assembly for electronic equipment, which can provide more efficient heat dissipation for components in the electronic equipment while meeting the packaging requirements of small space and high sealing of the electronic equipment.

[0005] In order to achieve the above-mentioned object, an embodiment of the present application provides a heat dissipation assembly, which is applied to an electronic device, wherein the electronic device includes a first substrate and a second substrate arranged opposite to the first substrate, a first component on the first substrate is connected to a second component on the second substrate through a connector, and the heat dissipation assembly includes:

[0006] a heat dissipation substrate, in contact with the first substrate, for dissipating heat from the first substrate; wherein the heat dissipation substrate is provided with a through hole corresponding to the connector;

[0007] A through hole structure, comprising a hole column corresponding to the through hole, a first sealing cover extending from one end of the hole column, and a second sealing cover extending from the other end of the hole column;

[0008] The connector connects the first component and the second component through the through hole and the hole column, the first sealing cover seals and covers the connection area between the connector and the first component, and the second sealing cover seals and covers the connection area between the connector and the second component.

[0009] The present application provides a heat dissipation assembly for electronic equipment. Specifically, the present application sets the electronic equipment as a multi-substrate structure. That is, the electronic equipment includes a first substrate and a second substrate arranged opposite to each other, and the first component on the first substrate is connected to the second component of the second substrate through a connector. Among them, the first component on the first substrate is the main heat dissipation object. Correspondingly, the through-hole structure includes a hole column, a first sealing cover extending from one end of the hole column, and a second sealing cover extending from the other end of the hole column. The connector connects the first component and the second component through the hole column, and the first sealing cover can seal the connection area between the connector and the first component, and the second sealing cover seals the connection area between the connector and the second component, so that the connector, the first component and the second component are sealed inside the through-hole structure. Based on the design of the through-hole structure, the hole column is closely contacted with the first substrate and the second substrate by the first sealing cover and the second sealing cover extending out, respectively, and the quality of its sealing performance depends only on the connection between the first sealing cover and the first substrate, and the connection between the second sealing cover and the second substrate. For the structure of the porous column, it is avoided that any of the hole columns is in poor contact with the first substrate and / or the second substrate, thereby destroying the sealing of the entire through-hole structure. In addition, the through-hole structure can also support the first substrate and the second substrate, which itself is also an indispensable structural design for multi-substrate electronic devices. In this way, the entire heat dissipation assembly will not occupy too much additional space in the electronic device, and can provide heat dissipation for components under the small space and high sealing packaging requirements of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0011] Figure 1 This is a schematic diagram of the first structure of the heat dissipation component of the embodiment of the present application.

[0012] Figure 2 This is a second structural schematic diagram of the heat dissipation component of the embodiment of the present application.

[0013] Figure 3 This is a third structural schematic diagram of the heat dissipation component of the embodiment of the present application.

[0014] Figure 4 This is a schematic diagram of the first structure of the heat dissipation component in the specific implementation of the embodiment of the present application.

[0015] Figure 5This is a second structural schematic diagram of the heat dissipation component in the specific implementation of the embodiment of the present application.

[0016] Figure 6 This is a third structural schematic diagram of the heat dissipation component of the embodiment of the present application during specific implementation.

[0017] Figure 7 This is a fourth structural schematic diagram of the heat dissipation component in the specific implementation of the embodiment of the present application.

[0018] Figure 8 This is a fifth structural schematic diagram of the heat dissipation component in the specific implementation of the embodiment of the present application. DETAILED DESCRIPTION

[0019] As electronic devices become smaller and smaller and their performance becomes more and more powerful, how to provide good heat dissipation for internal components under the requirements of small space and high sealing packaging has always been a difficult problem to solve in the industry.

[0020] To this end, the present application aims to provide a heat dissipation component for electronic equipment, which can achieve relatively optimal heat dissipation and sealing performance while occupying a relatively small space.

[0021] In order to enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this specification.

[0022] refer to Figure 1 As shown, the electronic device of the present application adopts a multi-substrate structure, including: a first substrate and a second substrate arranged opposite thereto, and a first component on the first substrate is connected to a second component on the second substrate via a connector. Correspondingly, the heat dissipation assembly of the present application includes: a heat dissipation substrate and a through-hole structure.

[0023] The heat dissipation substrate is in contact with the first substrate and is used to dissipate heat for the first substrate (including the first component). In addition, a through hole corresponding to the connector is provided on the heat dissipation substrate, and the connector needs to penetrate the heat dissipation substrate through hole to connect the first component and the second component.

[0024] The through hole structure includes a hole column corresponding to the through hole, a first sealing cover extending from one end of the hole column, and a second sealing cover extending from the other end of the hole column. The hole column, the first sealing cover and the second sealing cover can be integrally formed by a die-casting process.

[0025] The connector connects the first substrate and the second substrate through the heat dissipation substrate and the hole column of the through-hole structure, the first sealing cover seals and covers the connection area between the connector and the first component, and the second sealing cover seals and covers the connection area between the connector and the second component.

[0026] based on Figure 1 As shown, in this embodiment, the main heat-generating components (i.e., the first components) can be integrated on the first substrate, and the heat dissipation substrate is responsible for dissipating the heat of the first components. At the same time, the first components, the second components, and the connectors that need to be electrically connected are completely sealed by the integrated through-hole structure, thereby meeting the packaging requirements of small spaces of electronic devices.

[0027] It should be understood that there can be multiple connectors in this embodiment. That is, the hole column corresponds to the connector one by one, and the first sealing cover and the second sealing cover are both formed by the extension of multiple hole columns. Based on the design of this through-hole structure, each hole column is in contact with the first substrate through the first sealing cover, and is in contact with the second substrate through the second sealing cover. The sealing performance of the through-hole structure only depends on the connection between the first sealing cover and the first substrate, and the connection between the second sealing cover as a whole and the second substrate. If each hole column is in direct contact with the first substrate and the second substrate, it is difficult to ensure the stability of the seal. For example, the number of hole columns is 10, and the upper and lower end faces of the hole column are a total of 20. If one of the 20 end faces is poorly connected, the sealing of the entire through-hole structure will be destroyed.

[0028] The heat dissipation assembly of this embodiment is applied to any electronic device that can adopt a multi-substrate structure. For example, base station antenna devices, mobile phones, PADs, etc. Taking the base station antenna device as an example, the main heat-generating components of the base station (such as: transceiver chips, power supplies, filters, and power amplifiers, etc.) can be arranged on the first substrate to be cooled by the heat dissipation substrate; the components of the base station that generate less or no heat (such as transceiver antennas) can be arranged on the second substrate.

[0029] It should be noted that Figure 2 The structure shown is only used to illustrate the heat dissipation component of this embodiment. In practical applications, if the second component on the second substrate also has heat dissipation requirements, the heat dissipation component can refer to Figure 2 As shown, a heat dissipation substrate may be correspondingly arranged on the second substrate.

[0030] In addition, if the heat dissipation area of ​​the first substrate is large, the heat dissipation substrate can be appropriately set to be larger. Figure 3As shown, the projection A formed by the heat dissipation substrate on the first substrate covers the projection B formed by the first sealing cover on the first substrate. The heat dissipation substrate and the through-hole structure are independent structures. The heat dissipation substrate is provided with a hollow area matching the contour of the first sealing cover. The first sealing cover penetrates the heat dissipation substrate through the hollow area to contact the first substrate. Figure 3 In the structure shown, the sealing performance of the through-hole structure can still be guaranteed while the area of ​​the heat dissipation substrate is appropriately increased.

[0031] The practical application structure of the heat dissipation assembly of this embodiment is described in detail below.

[0032] refer to Figure 4 and Figure 5 As shown, the electronic device of this embodiment mainly includes: a first substrate 10, a heat dissipation component 20, and a second substrate 30. The first substrate 10 is abutted against the second substrate 30 through the heat dissipation component 20.

[0033] The first substrate 10 includes a housing unit 101 and a single board unit 102 provided with components; the second substrate 30 includes a protective shell 301 and a single board unit 302 provided with components. The single board unit 102 and the single board unit 302 transmit signals through the connector 40; the heat dissipation component 20 connects the first substrate 10 and the second substrate 30, and can dissipate heat for the components on the single board unit 102 of the first substrate.

[0034] The heat dissipation assembly is composed of a through-hole structure 201, a heat dissipation substrate 202 and a sealing ring (or sealant) 203. The heat dissipation substrate 202 is provided with a plurality of heat dissipation teeth 2021 arranged at intervals to increase the heat dissipation efficiency of the components on the single board unit 102. Figure 6 As shown, the through hole structure 201 includes a hole column 20111, a first sealing cover 20112 extending from one end of the hole column 20111, and a second sealing cover 20113 extending from the other end of the hole column 20111. The cross section of the hole column 20111 is I-shaped to enhance the support of the through hole structure 201 for the first substrate 10 and the second substrate 30. The sealing ring 203 is assembled on the upper part of the through hole structure 201, that is, the second sealing cover is pressed and contacted with the second substrate through the sealing ring 203 to achieve waterproofing between the internal channel of the hole column 20111 and the second substrate 30. Similarly, the first sealing cover 20112 can also be pressed and contacted with the first substrate 10 through the sealing ring 20, which will not be repeated here.

[0035] It should be noted that the end surface connected between the second sealing cover 20113 and the second substrate 30 is an integral whole (the first sealing cover and the first substrate are not repeated), so only one sealing ring 20 is needed to complete the pressing. That is, the sealing performance of the second sealing cover 20113 and the second substrate 30 depends on the yield of this sealing ring 20. If each hole column 20111 is in direct contact with the second substrate 30, a sealing ring 20 must be configured at the end surface connected between each hole column 20111 and the second substrate 30 to complete the pressing, wherein as long as there is a problem with the sealing ring 20 on any end surface (falling off, deformation, etc.), the overall sealing performance of the through-hole structure 201 will be destroyed. Obviously, the design of the through-hole structure 201 of this embodiment can greatly improve the yield during production, and therefore has a high practical value.

[0036] Further references Figure 7 As shown, at least a portion of the gap area (i.e., ventilation holes) between the hole columns 20111 is arranged opposite to the gap area between the heat dissipation teeth 2021 (the larger the relative area of ​​the gap areas, the better), and the extension direction of the plurality of heat dissipation teeth 2021 is consistent with the airflow direction of the ventilation holes between the hole columns 20111 ( Figure 7 In the direction indicated by the arrow), the ventilation resistance is reduced, thereby effectively improving the heat dissipation efficiency of the heat dissipation tooth 2021. When the cross section of the hole column 20111 is an I-shaped, the ventilation hole formed between the hole columns 20111 is a special-shaped window structure that is small at the top and large at the bottom, ensuring that the ventilation area of ​​the ventilation hole is maximized while meeting the assembly space of the connector 40, thereby improving the heat dissipation efficiency of the whole machine. It should be noted that the tooth structure of the heat dissipation tooth 2021 can be V-teeth, straight teeth, helical teeth, etc., which are not specifically limited in this article. However, as a preferred embodiment, the tooth structure of the heat dissipation tooth 2021 should be matched with the ventilation hole to avoid increasing the ventilation resistance.

[0037] In addition, the through-hole structure 201 and the heat dissipation substrate 202 are independent structures and can be formed by gluing or laser welding, etc., and the sealing effect can be achieved without adding other sealing treatments. Figure 8 As shown, the heat dissipation substrate 202 is provided with a hollow area matching the contour of the first sealing cover 20112. The first sealing cover 20112 penetrates the heat dissipation substrate 202 through the hollow area, and is directly sealed and connected with the heat dissipation substrate 202 through a friction welding process (or a cold pressing process). Similarly, there is no need to add other sealing treatments to achieve the sealing effect.

[0038] In summary, the present application provides a heat dissipation assembly for electronic equipment. Specifically, the present application sets the electronic equipment as a multi-substrate structure. That is, the electronic equipment includes a first substrate and a second substrate arranged relatively to each other, and the first component on the first substrate is connected to the second component of the second substrate through a connector. Among them, the first component on the first substrate is the main heat dissipation object. Correspondingly, the through-hole structure includes a hole column, a first sealing cover extending from one end of the hole column, and a second sealing cover extending from the other end of the hole column. The connector connects the first component and the second component through the hole column, and the first sealing cover can seal and cover the connection area between the connector and the first component, and the second sealing cover seals and covers the connection area between the connector and the second component, so that the connector, the first component and the second component are sealed inside the through-hole structure. Based on the design of the through-hole structure, the first sealing cover and the second sealing cover extending from the hole column are in close contact with the first substrate and the second substrate respectively, and the sealing performance is only determined by the connection between the first sealing cover and the first substrate, and the connection between the second sealing cover and the second substrate. For the structure of the porous column, it is avoided that any of the hole columns has poor contact with the first substrate and / or the second substrate, thereby destroying the sealing of the entire through-hole structure. In addition, the through-hole structure can also support the first substrate and the second substrate, which is itself an indispensable structural design for multi-substrate electronic devices. In this way, the entire heat dissipation assembly will not occupy too much additional space in the electronic device, and can provide heat dissipation for components under the packaging requirements of small space and high sealing of electronic devices.

[0039] The above is a description of a specific embodiment of the specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0040] The above are only embodiments of this specification and are not intended to limit this specification. For those skilled in the art, this specification may be subject to various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this specification shall be included in the scope of the claims of this specification. In addition, all other embodiments obtained by ordinary technicians in this field without creative work shall fall within the scope of protection of this document.

Claims

1. A heat dissipation assembly, applied to an electronic device, the electronic device comprising a first substrate and a second substrate arranged opposite to the first substrate, a first component on the first substrate being connected to a second component on the second substrate via a connector, characterized in that: The heat dissipation component comprises: a heat dissipation substrate, in contact with the first substrate, for dissipating heat from the first substrate; wherein the heat dissipation substrate is provided with a through hole corresponding to the connector; A through hole structure, comprising a hole column corresponding to the through hole, a first sealing cover extending from one end of the hole column, and a second sealing cover extending from the other end of the hole column; The connector connects the first component and the second component through the through hole and the hole column, the first sealing cover seals and covers the connection area between the connector and the first component, and the second sealing cover seals and covers the connection area between the connector and the second component.

2. The heat dissipation assembly according to claim 1, characterized in that: There are a plurality of connectors, the hole columns correspond to the connectors one by one, and the first sealing cover and the second sealing cover are both formed by the common extension of a plurality of the hole columns.

3. The heat dissipation assembly according to claim 1 or 2, characterized in that: The hole column, the first sealing cover and the second sealing cover are integrally formed.

4. The heat dissipation assembly according to claim 2, characterized in that: The heat dissipation substrate is provided with a plurality of heat dissipation teeth arranged at intervals, and the extension direction of the plurality of heat dissipation teeth is consistent with the air flow direction between the hole columns.

5. The heat dissipation assembly according to claim 4, characterized in that: At least a portion of the gap regions between the hole columns is arranged opposite to the gap regions between the heat dissipation teeth.

6. The heat dissipation assembly according to claim 1, characterized in that: The heat dissipation substrate and the through-hole structure are independent structures. The projection of the heat dissipation substrate on the first substrate covers the projection of the first sealing cover on the first substrate. The heat dissipation substrate is provided with a hollow area matching the contour of the first sealing cover. The first sealing cover passes through the heat dissipation substrate through the hollow area to contact the first substrate.

7. The heat dissipation assembly according to claim 6, characterized in that: The portion of the first sealing cover that passes through the heat dissipation substrate is sealed and connected to the heat dissipation substrate by friction welding or cold pressing.

8. The heat dissipation assembly according to claim 1 or 2, characterized in that: The cross section of the hole column is in an I-shape.

9. The heat dissipation assembly according to claim 1 or 2, characterized in that: The first sealing cover is pressed and contacted with the first substrate through a sealing ring or a sealing glue; and / or, The second sealing cover is pressed and contacted with the second substrate through a sealing ring or a sealing glue.

10. The heat dissipation assembly according to claim 1 or 2, characterized in that: The second substrate is provided with a transceiver antenna, and the first substrate is provided with a driving device of the transceiver antenna.

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