Condenser and heat exchange system

Abstract

The invention relates to the technical field of heat exchange, in particular to a condenser and a heat exchange system. The condenser comprises an upper shell, a lower shell and a heat exchange unit, the upper shell comprises an upper cavity and an air inlet pipe, the air inlet pipe is used for being communicated with the upper cavity, the lower shell comprises a flow guide wall, a side wall and a liquid outlet pipe, and the flow guide wall and the side wall form a lower cavity. The flow guide wall is used for guiding condensate in the lower cavity from one end of the lower cavity to the other end of the lower cavity, and the liquid outlet pipe is connected to the other end of the lower cavity and communicated with the flow guide wall. And the heat exchange unit is used for communicating the upper chamber with the lower chamber. Condensate in the condenser can flow out quickly, so that accumulation of the condensate in the condenser is reduced, and the heat dissipation performance of the electronic equipment is guaranteed.

Description

Technical Field

[0001] The present application relates to the field of heat exchange technology, and in particular to a condenser and a heat exchange system. Background Art

[0002] In the prior art, electronic devices usually need to use a heat exchange system to dissipate heat from the electronic devices inside the electronic devices to ensure the stability of the electronic devices and the service life of the electronic devices. The heat dissipation device generally includes an evaporator and a condenser. The evaporator and the condenser are connected through a pluggable device. The evaporator contacts the electronic device, and the working fluid in the evaporator is vaporized to absorb the heat generated by the electronic device. The vaporized working fluid enters the condenser, and the condenser liquefies the vaporized working fluid to form a condensate, which then flows back to the evaporator.

[0003] In the actual working process, the evaporator and electronic devices are installed on a single board of the electronic equipment, and the single board is installed in the housing of the electronic equipment in a pluggable manner. When the single board is plugged in or out, the evaporator and condenser need to be separated, and a new single board is installed, and the evaporator on the new single board is connected to the original condenser to form a new heat exchange system. In this process, there will be a problem that the total amount of working fluid in the evaporator on the new single board is too much or too little different from the total amount of working fluid in the original condenser, which will affect the heat dissipation performance of the electronic equipment. Summary of the invention

[0004] The embodiments of the present application provide a condenser and a heat exchange system, in which the condensate in the condenser can flow out quickly to reduce the accumulation of condensate in the condenser, thereby ensuring that the total amount of working fluid in the heat exchange system changes little, thereby ensuring the heat dissipation performance of the electronic equipment.

[0005] In the first aspect, the condenser in the present application includes an upper shell, a lower shell and a heat exchange unit, the upper shell includes an upper chamber and an air inlet pipe, and the air inlet pipe is used to communicate with the upper chamber. The lower shell includes a guide wall, a side wall and a liquid outlet pipe, the guide wall and the side plate constitute the lower chamber, and the heat exchange unit connects the upper chamber and the lower chamber. The guide wall is used to guide the condensate in the lower chamber from one end of the lower chamber to the other end, the liquid outlet pipe is connected to the other end of the lower chamber, and the liquid outlet pipe is connected to the guide wall. In this way, the condensate flows from the heat exchange unit to the lower chamber, and the condensate in the lower chamber will flow along the guide wall to the other end of the lower chamber. Since the liquid outlet pipe is connected to the other end of the lower chamber and is connected to the guide wall, the condensate on the guide wall quickly flows out through the liquid outlet pipe, thereby reducing the accumulation of condensate in the condenser and ensuring the heat dissipation performance of the electronic equipment.

[0006] In one embodiment, the guide wall may be in a stepped shape, with the highest step of the ladder connected to one end of the lower chamber, and the lowest step of the ladder connected to the other end of the lower chamber. In this manner, the liquid level of the condensate on the surface of the highest step of the ladder is higher than the liquid level of the condensate on the surface of the lowest step of the ladder, and the condensate on the surface of the highest step of the ladder flows toward the lowest step of the ladder, which can increase the outflow speed of the condensate and better reduce the amount of condensate in the lower chamber.

[0007] In another embodiment, the guide wall may include a bottom wall and an inclined wall located above the bottom wall, wherein the inclined wall is inclined from one end of the lower chamber to the other end of the lower chamber. When the condensate flows onto the inclined wall, the condensate will flow along the inclined wall to the other end of the lower chamber under the action of gravity, and be discharged through the liquid outlet pipe located at the other end of the lower chamber, so as to increase the discharge speed of the condensate.

[0008] In one embodiment, the bottom wall may include a first step and a second step, wherein the first step is higher than the second step. The first step is close to one end of the lower chamber, and the second step is close to the other end of the lower chamber. This makes the inclination direction of the inclined wall better, and can increase the speed of condensate outflow to reduce the amount of condensate in the lower chamber.

[0009] In another embodiment, the guide wall may include a bottom wall and a plurality of bosses located on the bottom wall, and the heights of the plurality of bosses gradually decrease from one end of the lower chamber to the other end of the lower chamber. The raised structure in the lower chamber occupies part of the space of the lower chamber. After an equal amount of condensate flows into the lower chamber, the liquid level in the lower chamber is higher, which can increase the speed at which the condensate flows out to reduce the amount of condensate in the lower chamber. In addition, the condensate on the surface of the higher boss will flow to the surface of the lower boss under the action of gravity, which can also increase the speed at which the condensate flows out to reduce the amount of condensate in the lower chamber.

[0010] For example, from one end of the lower chamber to the other end of the lower chamber, only one boss may be provided on the bottom wall, and the boss is at a certain distance from the side of the other end of the lower chamber and the other end of the lower chamber. The provision of the boss can reduce the space inside the lower chamber and make the condensate in the lower chamber converge to the other end of the lower chamber, so as to increase the speed of the condensate flowing out.

[0011] In one embodiment, the bottom wall includes a liquid outlet, the liquid outlet is located at the other end of the lower chamber, and the liquid outlet pipe is connected to the liquid outlet. In this manner, the liquid outlet is located on the side of the bottom wall close to the other end of the lower chamber, and the liquid outlet pipe is connected to the liquid outlet, which can ensure that the condensate at the other end of the lower chamber can be quickly discharged through the liquid outlet pipe, so as to reduce the residual condensate in the lower chamber.

[0012] In one embodiment, the side of the guide wall facing the heat exchange unit may be a curved surface, and the curved surface angle relative to the horizontal plane gradually increases from one end of the lower chamber to the other end of the lower chamber, so as to ensure that the side of the guide wall facing the heat exchange unit is a curved surface and no condensate is accumulated between the guide wall and the side wall.

[0013] In one embodiment, the heat exchange unit includes a plurality of flat tubes, which are arranged in parallel and spaced apart, one end of the flat tube is connected to the upper chamber, and the other end of the flat tube is connected to the lower chamber. The flat tube is used to liquefy the vaporized working medium, and the formed condensate flows along the inner wall of the flat tube to the lower chamber.

[0014] In order to increase the liquefaction speed of the vaporized working medium, heat dissipation fins may be fixedly connected to at least a portion of the flat tubes, so that the vaporized working medium can release heat quickly.

[0015] In a second aspect, a heat exchange system is provided, which includes an evaporator, a steam pipe, a liquid return pipe and a condenser in any technical solution of the first aspect, one end of the steam pipe is detachably connected to the air inlet pipe of the condenser, the other end of the steam pipe is connected to the evaporator, one end of the liquid return pipe is detachably connected to the liquid outlet pipe of the condenser, and the other end of the liquid return pipe is connected to the evaporator.

[0016] Optionally, a plug-in structure may be provided between the liquid return pipe and the liquid outlet pipe to make the liquid return pipe and the liquid outlet pipe detachable. A plug-in structure may also be provided between the steam pipe and the air inlet pipe to make the steam pipe and the air inlet pipe detachable. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A diagram showing an application scenario of a heat exchange system provided in an embodiment of the present application being applied to electronic equipment;

[0018] Figure 2 A cross-sectional view of a condenser provided in an embodiment of the present application;

[0019] Figure 3 Another cross-sectional view of a condenser provided in an embodiment of the present application;

[0020] Figure 4 Another cross-sectional view of a condenser provided in an embodiment of the present application;

[0021] Figure 5 Another cross-sectional view of a condenser provided in an embodiment of the present application;

[0022] Figure 6 Another cross-sectional view of a condenser provided in an embodiment of the present application;

[0023] Figure 7 Another cross-sectional view of a condenser provided in an embodiment of the present application;

[0024] Figure 8 Another cross-sectional view of a condenser provided in an embodiment of the present application;

[0025] Fig. 9 Another cross-sectional view of a condenser provided in an embodiment of the present application;

[0026] Fig.10 Another cross-sectional view of the condenser provided in the embodiment of the present application.

[0027] Reference numerals:

[0028] 10-cabinet; 11-single board; 12-back board; 20-evaporator; 21-steam pipe; 22-return liquid pipe; 30-condenser; 31-inlet pipe; 32-liquid outlet pipe; 300-upper shell; 301-upper chamber; 310-lower shell; 311-lower chamber; 312-guide wall; 313-side wall; 3120-bottom wall; 31201-first step; 31202-second step; 31203-liquid outlet; 3121-inclined wall; 3122-boss; 320-heat exchange unit; 40-plug-in structure. DETAILED DESCRIPTION

[0029] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings.

[0030] When the heat exchanger system composed of an evaporator and a condenser dissipates heat for electronic devices on a single board in an electronic device, the total amount of the working fluid in the heat exchange system needs to be maintained within a set range to ensure the heat exchange efficiency of the heat exchange system.

[0031] In the prior art, a single board in an electronic device is installed in a pluggable manner in the housing of the electronic device. When the single board is plugged in or out, the evaporator and the condenser need to be separated, and a new single board is installed. The evaporator on the new single board is connected to the original condenser to form a new heat exchange system. In this process, when the total amount of the working fluid in the new heat exchange system is greater than the set range, the thermal resistance of the steam during evaporation and the thermal resistance during condensation will increase, resulting in the problem of limited heat dissipation capacity of the electronic device and high operating temperature of the electronic device. When the total amount of the working fluid in the heat exchange system is less than the set range, there is not enough working fluid in the evaporator for heat dissipation, which will cause the electronic device to heat up rapidly, increasing the possibility of over-temperature damage to the electronic device.

[0032] Therefore, a new condenser is urgently needed to speed up the flow of the working fluid in the condenser to the evaporator, so that the total amount of working fluid in the new heat exchange system formed by replacing the single plate and the evaporator will change less.

[0033] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to be limiting of the present application. As used in the specification and appended claims of the present application, the singular expressions "a", "an", "said", "above", "the" and "this" are intended to also include expressions such as "one or more", unless there is a clear contrary indication in the context.

[0034] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0035] Figure 1 The application of the heat exchange system provided for the implementation of this application includes a scene diagram of an electronic device, and the electronic device may be a base station, a terminal device, a routing device, a server, a vehicle-mounted device or a data center. Figure 1 The electronic device includes a cabinet 10, the cabinet 10 includes a back panel 12, and a single board 11 plugged into the back panel 12. The heat exchange system includes an evaporator 20 and a condenser 30, the air outlet of the evaporator 20 is connected to a steam pipe 21, the liquid inlet of the evaporator 20 is connected to a liquid return pipe 22, and the condenser 30 has an air inlet pipe 31 and a liquid outlet pipe 32. The air inlet pipe 31 is connected to the steam pipe 21 through a plug-in structure 40, and the liquid outlet pipe 32 is connected to the liquid return pipe 22 through a plug-in structure 40. More specifically, the condenser 30 is fixed in the cabinet 10, the evaporator 20 and the chip are both fitted and mounted on the single board 11, and the heat exchange system can dissipate heat from the chip on the single board 11.

[0036] In one embodiment, the plug-in structure 40 may be specifically an adapter. When the adapter is used to detachably connect the liquid outlet pipe 32 and the liquid return pipe 22, the adapter may be connected to the side of the liquid outlet pipe 32 facing the liquid return pipe 22, or the adapter may be connected to the side of the liquid return pipe 22 facing the liquid outlet pipe 32. When the adapter is used to detachably connect the air inlet pipe 31 and the steam pipe 21, the adapter may be connected to the side of the steam pipe 21 facing the air inlet pipe 31, or the adapter may be connected to the side of the air inlet pipe 31 facing the steam pipe 21.

[0037] When working, a working medium flows in the heat exchange system to cool the chip. Specifically, the working medium in the evaporator 20 is used to absorb the heat generated by the chip, thereby cooling the chip. The working medium in the evaporator 20 vaporizes after absorbing the heat, and the vaporized working medium enters the air inlet pipe 31 through the steam pipe 21. The vaporized working medium enters the condenser 30 through the air inlet pipe 31 and liquefies in the condenser 30. The liquefied working medium returns to the evaporator 20 through the liquid outlet pipe 32 and the liquid return pipe 22 to complete the cycle, thereby continuously cooling the chip.

[0038] The working fluid refers to the medium used in various machines to realize the conversion of heat energy and other forms of energy, also known as thermodynamic working fluid. The working fluid is generally a fluid (gas and liquid). For example, the working fluid can be kerosene, water and other common working fluids.

[0039] After working for a certain period of time, the single board 11 needs to be plugged in and out of the cabinet 10. At this time, the condenser 30 and the evaporator 20 need to be separated by the plug-in structure 40. In the embodiment of the present application, since the guide wall 312 in the condenser 30 can guide the condensate from one end of the lower chamber 311 to the other end of the lower chamber 311. The liquid outlet pipe 32 is connected to the other end of the lower chamber 311, the condensate can quickly converge to one side of the liquid outlet pipe 32, so that the condensate in the condenser 30 can quickly flow back to one side of the evaporator 20, thereby reducing the amount of condensate in the condenser 30. When the new single board with the evaporator 20 is installed in the cabinet 10 and cooperates with the condenser 30, the total amount of working fluid in the new heat exchange system formed changes less, thereby ensuring the stability of the performance of the heat exchange system.

[0040] The structure of the condenser is introduced below.

[0041] Figure 2 A cross-sectional view of a condenser provided in an embodiment of the present application. Figure 2The condenser may include an upper shell 300, a lower shell 310 and a heat exchange unit 320. The upper shell 300 includes an upper chamber 301 and an air inlet pipe 31, and the air inlet pipe 31 is connected to the upper chamber 301. The lower shell 310 may include a guide wall 312, a side wall 313 and a liquid outlet pipe 32, and the guide wall 312 and the side wall 313 constitute a lower chamber 311. The upper shell 300 and the lower shell 310 are arranged relative to each other along the first direction X, and the heat exchange unit 320 is used to connect the upper chamber 301 and the lower chamber 311. The guide wall 312 is used to guide the condensate in the lower chamber 311 from one end of the lower chamber 311 to the other end. The liquid outlet pipe 32 is connected to the other end of the lower chamber 311, and the liquid outlet pipe 32 is connected to the guide wall 312. The vaporized working medium enters the upper chamber 301 through the air inlet pipe, and in the process of flowing to the lower chamber 311 through the heat exchange unit 320, the vaporized working medium is liquefied and flows to the lower chamber 311 under the action of gravity. The condensate in the lower chamber 311 is guided to the other end of the lower chamber 311 under the action of the guide wall 312. Since the liquid outlet pipe 32 is connected to the other end of the lower chamber 311 and communicates with the guide wall 312, the condensate on the guide wall 312 can quickly flow out through the liquid outlet pipe 32, thereby reducing the accumulation of condensate in the condenser. The heat dissipation performance of the electronic equipment is guaranteed.

[0042] In one embodiment, continue to refer to Figure 2 The guide wall 312 may be in a stepped shape, with the highest step of the ladder connected to one end of the lower chamber 311, and the lowest step of the ladder connected to the other end of the lower chamber 311. When the condensate formed in the heat exchange unit 320 flows into the lower chamber 311, the condensate will converge from the highest step of the ladder to the lowest step of the ladder, thereby increasing the outflow speed of the condensate to reduce the amount of condensate in the lower chamber 311.

[0043] It is worth mentioning that the number of steps included in the stepped flow guide wall 312 can be adjusted according to actual needs. The stepped flow guide wall 312 can be formed by a die-casting process.

[0044] In one embodiment, Figure 3 Another cross-sectional view of a condenser provided in an embodiment of the present application. Figure 3The guide wall 312 may include a bottom wall 3120 and an inclined wall 3121 located above the bottom wall 3120, and the inclined wall 3121 is inclined from one end of the lower chamber 311 to the other end of the lower chamber 311. The inclined wall 3121 is fixed to the bottom wall 3120. The setting of the inclined wall 3121 can reduce the space in the lower chamber 311. An equal amount of liquefied working fluid (condensate) flows into the lower chamber 311 and directly contacts the side of the inclined wall 3121 facing the heat exchange unit 320, which will make the liquid level of the working fluid in the lower chamber 311 higher. And the side of the inclined wall 3121 facing the heat exchange unit 320 is an inclined surface, and the condensate on the inclined wall 3121 quickly converges to the other end of the lower chamber 311 and flows out through the liquid outlet pipe 32 connected to the guide wall 312. The outflow speed of the condensate can be increased to reduce the amount of condensate in the lower chamber 311.

[0045] In one embodiment, Figure 4 Another cross-sectional view of a condenser provided in an embodiment of the present application. Figure 4 , the guide wall 312 may include a bottom wall 3120 and an inclined wall 3121 located above the bottom wall 3120, and the inclined wall 3121 is inclined from one end of the lower chamber 311 to the other end of the lower chamber 311. The bottom wall 3120 may include a first step 31201 and a second step 31202. The first step 31201 is close to one end of the lower chamber 311, and the second step 31202 is close to the other end of the lower chamber 311, and along the first direction X, the first step 31201 is higher than the second step 31202. In one embodiment, the inclined wall 3121 is located on a side of the first step 31201 facing the heat exchange unit 320. And along the projection of the first direction X, the inclined wall 3121 completely covers the side of the first step 31201 facing the heat exchange unit 320. The setting of the inclined wall 3121 can reduce the space in the lower chamber 311. The same amount of liquefied working fluid (condensate) flows into the lower chamber 311 and directly contacts the side of the inclined wall 3121 facing the heat exchange unit 320, which will make the liquid level of the working fluid in the lower chamber 311 higher. The side of the inclined wall 3121 facing the heat exchange unit 320 is an inclined surface, and the condensate on the inclined wall 3121 quickly converges to one end of the second step 31202 and flows out through the liquid outlet pipe 32 connected to the second step 31202. The outflow speed of the condensate can be increased to reduce the amount of condensate in the lower chamber 311.

[0046] In one embodiment, Figure 5 Another cross-sectional view of a condenser provided in an embodiment of the present application. Figure 5, the guide wall 312 may include a bottom wall 3120 and a boss 3122 on the bottom wall 3120, one boss 3122 is connected to one end of the lower chamber 311, and one boss 3122 is at a certain distance from the other end of the lower chamber 311. From one end of the lower chamber 311 to the other end of the lower chamber 311, the height of the boss 3122 remains unchanged. It can be understood that the surface of the boss 3122 away from the bottom wall 3120 is a plane. The space between the side of the boss 3122 away from the bottom wall 3120 and the top wall of the lower chamber 311 is small, and the condensed working fluid flows into the top of the boss 3122 and then flows into the gap between the boss 3122 and the lower chamber 311. The condensate is gathered in the gap between the boss 3122 and the lower chamber 311, and flows out through the liquid outlet pipe 32 connected to the other end of the lower chamber 311. To increase the speed of condensate discharge. In addition, the arrangement of the boss 3122 can reduce the accommodation space in the lower chamber 311 and increase the liquid level of the condensate in the lower chamber 311 so that the condensate can flow out quickly through the liquid outlet pipe.

[0047] In one embodiment, Figure 6 Another cross-sectional view of a condenser provided in an embodiment of the present application. Figure 6 , the guide wall 312 may include a bottom wall 3120, a boss 3122 and an inclined wall 3121, wherein the boss 3122 is located on the bottom wall 3120, and the inclined wall 3121 is located on the side of the boss 3122 away from the bottom wall 3120, and along the projection of the first direction X, the inclined wall 3121 is entirely located in the boss 3122. Among them, the boss 3122 is connected to one end of the lower chamber 311, and there is a certain distance between the boss 3122 and the other end of the lower chamber 311. The arrangement of the boss 3122 and the inclined wall 3121 reduces the spatial volume of the lower chamber 311, and the condensate will flow along the inclined wall 3121 to the gap between the boss 3122 and the other end of the lower chamber 311, and flow out through the liquid outlet pipe 32 connected to the other end of the lower chamber 311 to increase the speed of condensate discharge. In this manner, the inclined wall 3121 is disposed on a boss 3122 , which can be understood as a side of the boss 3122 facing the heat exchange unit 320 being an inclined surface.

[0048] In one embodiment, Figure 7 Another cross-sectional view of a condenser provided in an embodiment of the present application. Figure 7, the guide wall 312 may include a bottom wall 3120 and a plurality of bosses 3122 located on the bottom wall 3120, and the height of the plurality of bosses 3122 gradually decreases from one end of the lower chamber 311 to the other end of the lower chamber 311. Among them, the side of each boss 3122 away from the bottom wall 3120 is a plane. In this embodiment, the arrangement of the plurality of bosses 3122 can increase the liquid level of the condensate in the lower chamber 311. The condensate will flow along the side of the plurality of bosses 3122 away from the bottom wall 3120 to the bosses with lower heights, so that the condensate gathers in the gap between the bosses 3122 and the lower chamber 311, and flows out through the liquid outlet pipe 32 connected to the other end of the lower chamber 311. In this way, the speed at which the condensate flows out of the lower chamber 311 is increased, and the amount of condensate in the lower chamber 311 is reduced.

[0049] Figure 8 Another cross-sectional view of the condenser is provided for the embodiment of the present application, referring to Figure 8 , the guide wall 312 may include a bottom wall 3120, a plurality of bosses 3122 and a plurality of inclined walls 3121, the plurality of bosses 3122 are located on the bottom wall 3120, and a side of each boss 3122 away from the bottom wall 3120 is provided with an inclined wall 3121. Among them, from one end of the lower chamber 311 to the other end of the lower chamber 311, the height of the plurality of bosses 3122 provided with the inclined wall 3121 gradually decreases. In this embodiment, the arrangement of the plurality of bosses 3122 provided with the inclined wall 3121 can increase the liquid level of the condensate in the lower chamber 311. The condensate will flow along the side of the plurality of bosses 3122 away from the bottom wall 3120 to the bosses with lower heights, so that the condensate gathers in the gap between the bosses 3122 and the lower chamber 311, and flows out through the liquid outlet pipe 32 connected to the other end of the lower chamber 311. The speed of the condensate flowing out of the lower chamber 311 is increased, and the amount of condensate in the lower chamber 311 is reduced. In this way, the inclined wall 3121 is disposed on a boss 3122, and it can be understood that the side of a boss 3122 facing the heat exchange unit 320 is an inclined surface.

[0050] In one embodiment, the shape of the lower chamber can be one of cylindrical, rectangular or rhombus. The shape of the upper chamber can also be one of cylindrical, rectangular or rhombus.

[0051] In one embodiment, Fig. 9 Another cross-sectional view of the condenser is provided for the embodiment of the present application, referring to Fig. 9 , the side of the guide wall 312 facing the heat exchange unit 320 may be a curved surface a, and the curved surface angle of the side of the guide wall 312 facing the heat exchange unit 320 relative to the horizontal plane gradually increases from one end of the lower chamber 311 to the other end of the lower chamber 311. This ensures that the side of the guide wall 312 facing the heat exchange unit 320 is the curved surface a, and no condensate is accumulated between the guide wall 312 and the side wall 313.

[0052] In one embodiment, continue to refer to Figure 2 to Figure 9 , the liquid outlet pipe 32 is connected to the side wall 313. The liquid outlet pipe 32 is flush with the other end of the guide wall 312 close to the lower chamber 311. After the condensate flows into the lower chamber 311, due to the setting of the guide wall 312, the condensate in the lower chamber 311 will flow along the guide wall 312 to the liquid outlet pipe 32. Among them, the lowest end of the liquid outlet pipe 32 is flush with the other end of the guide wall 312 close to the lower chamber 311, which can also make the condensate flow out of the lower chamber 311 quickly to reduce the amount of condensate in the lower chamber 311. In some embodiments, in a direction perpendicular to the first direction, the liquid outlet pipe 32 partially overlaps with the other end of the guide wall 312 close to the lower chamber 311, so as to increase the speed at which the condensate flows out through the liquid outlet pipe 32.

[0053] In one embodiment, Fig.10 Another cross-sectional view of the condenser is provided for the embodiment of the present application, referring to Fig.10 , the guide wall 312 may include a bottom wall 3120, the bottom wall 3120 may include a liquid outlet 31203, the liquid outlet 31203 is located at the other end of the lower chamber 311, and the liquid outlet pipe 32 is connected to the liquid outlet 31203, so that the liquid outlet pipe 32 is connected to the lower chamber 311. The guide wall 312 guides the condensate in the lower chamber 311 to the other end of the lower chamber 311, and the liquid outlet 31203 is located at the other end of the bottom wall 3120, so that the condensate in the lower chamber 311 flows to the liquid outlet pipe 32 through the liquid outlet 31203, and the condensate is discharged from the lower chamber 311 through the liquid outlet pipe 32. In this way, the opening of the liquid outlet pipe 32 is set at the other end of the guide wall 312 close to the lower chamber 311 to ensure the speed at which the condensate is discharged from the lower chamber 311.

[0054] In one embodiment, the liquid outlet pipe can be connected to the center of the guide wall. The boss is distributed from the water inlet of the liquid outlet pipe to the side wall of the lower chamber, and the boss is an annular boss. When there are multiple bosses, the multiple bosses can be connected in sequence. The side of each boss away from the bottom wall is an inclined surface, and the inclined surface is inclined toward the position occupied by the liquid outlet pipe to increase the speed of liquid discharge from the lower chamber.

[0055] In one embodiment, the heat exchange unit includes a plurality of flat tubes, which are arranged at intervals. One end of each flat tube is connected to the upper chamber, and the other end of the flat tube is connected to the lower chamber, so that the vaporized working medium flows through the flat tube to the lower chamber. The vaporized working medium releases heat and liquefies during the process of passing through the flat tube. The liquefied working medium is condensed liquid, and the condensed liquid flows along the flat tube to the lower chamber. In one embodiment, each flat tube is fixedly connected with a heat dissipation fin to increase the liquefaction speed of the working medium vaporized through the flat tube.

[0056] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A condenser, characterized in that: include: An upper shell, comprising an upper chamber and an air inlet pipe communicating with the upper chamber; The lower shell comprises a flow guide wall, a side wall and a liquid outlet pipe, wherein the flow guide wall and the side wall constitute a lower chamber; The guide wall is used to guide the condensate in the lower chamber from one end to the other end of the lower chamber, and the liquid outlet pipe is connected to the other end of the lower chamber and communicates with the guide wall; A heat exchange unit is used to connect the upper chamber and the lower chamber.

2. The condenser according to claim 1, characterized in that The guide wall is in a stepped shape, the highest step of the ladder is connected to one end of the lower chamber, and the lowest step of the ladder is connected to the other end of the lower chamber.

3. The condenser according to claim 1, characterized in that The guide wall comprises a bottom wall and an inclined wall located above the bottom wall, and the inclined wall is inclined from one end of the lower chamber to the other end of the lower chamber.

4. The condenser according to claim 3, characterized in that The bottom wall is stepped, and includes a first step and a second step, wherein the first step is higher than the second step, the first step is close to one end of the lower chamber, and the second step is close to the other end of the lower chamber.

5. The condenser according to claim 1, characterized in that The guide wall includes a bottom wall and a plurality of bosses located on the bottom wall, and the heights of the plurality of bosses gradually decrease from one end of the lower chamber to the other end of the lower chamber.

6. The condenser according to claim 1, characterized in that The guide wall includes a bottom wall and a boss located on the bottom wall, wherein the boss is connected to one end of the lower chamber, and the boss is spaced apart from the other end of the lower chamber.

7. The condenser according to any one of claims 3 to 6, characterized in that: The bottom wall comprises a liquid outlet, the liquid outlet is located at the other end of the lower chamber, and the liquid outlet pipe is communicated with the liquid outlet.

8. The condenser according to claim 1, characterized in that A surface of the guide wall facing the heat exchange unit is a curved surface, and a curved surface angle of the curved surface relative to a horizontal plane gradually increases from one end of the lower chamber to the other end of the lower chamber.

9. The condenser according to any one of claims 1 to 8, characterized in that: The heat exchange unit includes a plurality of flat tubes, which are arranged in parallel and spaced apart, one end of each flat tube is communicated with the upper chamber, and the other end of each flat tube is communicated with the lower chamber.

10. The condenser according to claim 9, characterized in that At least some of the flat tubes are fixedly connected with heat dissipation fins.

11. A heat exchange system, characterized in that: It comprises an evaporator, a steam pipe, a liquid return pipe and a condenser as claimed in any one of claims 1 to 10, wherein one end of the steam pipe is detachably connected to the air inlet pipe of the condenser, the other end of the steam pipe is connected to the evaporator, one end of the liquid return pipe is detachably connected to the liquid outlet pipe of the condenser, and the other end of the liquid return pipe is connected to the evaporator.

12. The heat exchange system according to claim 11, characterized in that: The heat exchange system comprises two plug-in structures, one of which connects the steam pipe and the air inlet pipe in a detachable manner, and the other of which connects the liquid return pipe and the liquid outlet pipe in a detachable manner.

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