Cooling system and method, to-be-cooled equipment, electronic equipment and storage medium

Abstract

The embodiment of the invention provides a heat dissipation system and method, equipment to be subjected to heat dissipation, electronic equipment and a storage medium. The system comprises a piezoelectric heat dissipation device, a natural heat dissipation device, a temperature sensor and a control unit, the piezoelectric heat dissipation device and the natural heat dissipation device are arranged on the heat source, and the control unit is electrically connected with the temperature sensor and the piezoelectric heat dissipation device; the temperature sensor detects the heat source temperature; the natural heat dissipation device performs natural heat dissipation; the piezoelectric heat dissipation device conducts natural heat dissipation and conducts airflow heat dissipation through the piezoelectric effect. The control unit obtains the temperature of the heat source, and controls the piezoelectric heat dissipation device to operate and generate airflow when the temperature of the heat source is larger than or equal to a preset temperature threshold value, so that the natural heat dissipation device and the piezoelectric heat dissipation device conduct airflow heat dissipation. And under the condition that the temperature of the heat source is smaller than the temperature threshold value, the piezoelectric heat dissipation device is controlled to stop running, and the natural heat dissipation device and the piezoelectric heat dissipation device conduct natural heat dissipation. According to the embodiment of the invention, the heat dissipation effect and the user experience are improved.

Description

Technical Field

[0001] The present disclosure relates to the field of cryptographic technology, and in particular to a heat dissipation system, method, device to be cooled, electronic device and storage medium. Background Art

[0002] Today's electronic products are characterized by powerful functions and small size, especially wireless home products, such as routers, switches, optical modem devices, etc., which are very powerful. Televisions, computers, tablets, mobile phones, etc. need to be connected to routers, switches, etc., especially home router products. Almost all smart devices are associated with routers or optical modem devices. Therefore, these products have the characteristics of high power consumption and high heat generation during use. Summary of the invention

[0003] Embodiments of the present disclosure provide a heat dissipation system, method, device to be cooled, electronic device, and storage medium.

[0004] In a first aspect, an embodiment of the present disclosure provides a heat dissipation system, comprising: a piezoelectric heat dissipation device, a natural heat dissipation device, a temperature sensor, and a control unit; the piezoelectric heat dissipation device and the natural heat dissipation device are arranged on a heat source of a device to be cooled, and the control unit is electrically connected to the temperature sensor and the piezoelectric heat dissipation device, respectively;

[0005] The temperature sensor is configured to detect the temperature of the heat source;

[0006] The natural heat dissipation device is configured to perform natural heat dissipation;

[0007] The control unit is configured to obtain the temperature of the heat source, and when the temperature of the heat source is greater than or equal to a preset temperature threshold, control the piezoelectric heat dissipation device to operate and generate airflow, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform airflow heat dissipation; when the temperature of the heat source is less than the temperature threshold, control the piezoelectric heat dissipation device to stop operating, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform natural heat dissipation.

[0008] In a second aspect, an embodiment of the present disclosure provides a heat dissipation method, based on the heat dissipation system, applied to a control unit of the heat dissipation system, the method comprising:

[0009] Obtain the heat source temperature of the device to be cooled;

[0010] When the temperature of the heat source is greater than or equal to a preset temperature threshold, the piezoelectric heat dissipation device of the heat dissipation system is controlled to operate and generate airflow, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform airflow heat dissipation; when the temperature of the heat source is less than the temperature threshold, the piezoelectric heat dissipation device is controlled to stop operating, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform natural heat dissipation.

[0011] In a third aspect, an embodiment of the present disclosure provides a device to be cooled, including: the cooling system described above.

[0012] In a fourth aspect, an embodiment of the present disclosure provides an electronic device, the electronic device comprising:

[0013] one or more processors;

[0014] A memory having one or more programs stored thereon, wherein when the one or more programs are executed by the one or more processors, the one or more processors implement the heat dissipation method;

[0015] One or more input / output I / O interfaces are connected between the processor and the memory and are configured to implement information interaction between the processor and the memory.

[0016] In a fifth aspect, an embodiment of the present disclosure provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program implements the heat dissipation method when executed by a processor.

[0017] The heat dissipation system of the disclosed embodiment dissipates heat through a piezoelectric heat dissipation device (capable of airflow heat dissipation and natural heat dissipation) and a natural heat dissipation device (natural heat dissipation), thereby ensuring the heat dissipation effect and being able to quickly dissipate heat for the product. The airflow heat dissipation achieved by the piezoelectric heat dissipation device generates airflow through the piezoelectric effect, and the vibration noise caused by the piezoelectric effect is extremely small, so that the product can also achieve a silent effect during airflow heat dissipation, thereby improving the user experience. In addition, compared with fan lamp heat dissipation equipment, the piezoelectric heat dissipation device is small in size, occupies less space, has a long life, is not easy to damage, and is convenient for use in small products such as routers and optical modem equipment. The heat dissipation system also includes a control unit, which can adjust the heat dissipation scheme according to the temperature of the heat source (using airflow heat dissipation and natural heat dissipation, or only using natural heat dissipation), realizing the intelligent control of the heat dissipation system, so that when the temperature is high, it can quickly dissipate heat and cool down, thereby ensuring the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In the accompanying drawings of the embodiments of the present disclosure:

[0019] Figure 1 A block diagram of the heat dissipation system provided in an embodiment of the present disclosure;

[0020] Figure 2 A block diagram of the composition of a piezoelectric heat dissipation device provided in an embodiment of the present disclosure;

[0021] Figure 3 A schematic diagram of a first heat sink provided in an embodiment of the present disclosure being disposed on a second heat sink;

[0022] Figure 4 A schematic diagram of the correspondence between different temperature levels and different swing frequency levels and window opening and closing conditions in a heat source temperature rise scenario provided by an embodiment of the present disclosure;

[0023] Figure 5 A schematic diagram of the correspondence between different temperature levels, different swing frequency levels and window opening and closing conditions in a heat source temperature drop scenario provided by an embodiment of the present disclosure;

[0024] Figure 6 A connection diagram of a window opening control device provided in an embodiment of the present disclosure;

[0025] Figure 7 A block diagram of the window opening control device provided in an embodiment of the present disclosure;

[0026] Figure 8 A flow chart of a heat dissipation method provided in an embodiment of the present disclosure;

[0027] Fig. 9 A block diagram of a device to be cooled provided by an embodiment of the present disclosure;

[0028] Fig.10 A block diagram of the electronic device provided in the embodiment of the present disclosure;

[0029] Fig.11 A block diagram of the computer-readable storage medium provided for an embodiment of the present disclosure. DETAILED DESCRIPTION

[0030] In order to enable those skilled in the art to better understand the technical solution of the present disclosure, the communication perception data processing method and computer-readable storage medium provided by the embodiments of the present disclosure are described in detail below in conjunction with the accompanying drawings.

[0031] The present disclosure will be described more fully below with reference to the accompanying drawings, but the embodiments shown may be embodied in different forms, and the present disclosure should not be construed as being limited to the embodiments set forth below. On the contrary, the purpose of providing these embodiments is to make the present disclosure thorough and complete, and will enable those skilled in the art to fully understand the scope of the present disclosure.

[0032] The accompanying drawings of the embodiments of the present disclosure are used to provide a further understanding of the embodiments of the present disclosure, and constitute a part of the specification, and are used together with the detailed embodiments to explain the present disclosure, and do not constitute a limitation of the present disclosure. By describing the detailed embodiments with reference to the accompanying drawings, the above and other features and advantages will become more apparent to those skilled in the art.

[0033] In the absence of conflict, the various embodiments of the present disclosure and the various features therein may be combined with each other.

[0034] The terms used in the present disclosure are only used to describe specific embodiments and are not intended to limit the present disclosure. The term "and / or" as used in the present disclosure includes any and all combinations of one or more related enumerated items. The singular forms "one" and "the" as used in the present disclosure are also intended to include plural forms, unless the context clearly indicates otherwise. The terms "including", "made of..." as used in the present disclosure specify the presence of the features, wholes, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or groups thereof.

[0035] Unless otherwise defined, all terms (including technical and scientific terms) used in this disclosure have the same meaning as commonly understood by those of ordinary skill in the art. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and this disclosure, and will not be interpreted as having an idealized or overly formal meaning unless explicitly defined in this disclosure.

[0036] Today's electronic products are characterized by powerful functions and small size, especially wireless home products, such as routers, switches, optical modem devices, etc., which are very powerful. Televisions, computers, tablets, mobile phones, etc. need to be connected to routers, switches, etc., especially home router products. Almost all smart devices are associated with routers or optical modem devices. The characteristics of this type of home product are high power consumption and severe heat generation, which usually makes users feel hot to the touch and even makes users worry about product safety issues.

[0037] As the size of home products becomes smaller and smaller, users are paying more and more attention to the heat generated by the devices. Poor heat dissipation will cause heat to accumulate in the shell, directly affecting the actual performance and lifespan of the product, and even affecting the user's actual experience. Therefore, a good heat dissipation system can effectively improve the product's service life and actual performance, and give customers a good experience.

[0038] The current heat dissipation architecture of home products (such as home routers) is mainly natural heat dissipation or forced heat dissipation structure. The natural heat dissipation structure mainly relies on heat sinks to dissipate heat and radiate the heat inside the chip and structure. The forced heat dissipation mainly adds a fan device to the heat sink to dissipate heat and quickly take away the heat on the heat sink, which can effectively reduce the temperature of the entire device.

[0039] The natural heat dissipation device is simple, and basically all of them are to add various shapes of heat sinks to the circuit, such as: flat heat sinks, toothed heat sinks and other devices. Since the characteristics of home-end products are that the products are silent and noiseless, in order to achieve this feature, most of the current equipment uses natural heat dissipation devices, all relying on a single heat sink for heat dissipation. The disadvantage is that the heat dissipation capacity is limited for high-power devices. Some high-end products generally use forced heat dissipation, adding fans on the basis of heat sinks, and quickly radiating the heat from the heat sink through the fans, but the disadvantages are that the fans are noisy when running for a long time, have a short lifespan, and are easily damaged. The home-end products have a relatively long service life, and once the fan is abnormal, it will cause the equipment to overheat and cause damage.

[0040] The disclosed embodiment scheme takes into account the stability and silent characteristics of home products (the router or optical modem device is noise-free) and provides a new heat dissipation solution. This heat dissipation solution not only solves the slow natural heat dissipation problem, but also solves the overheating problem of the product. It can effectively reduce the power consumption and temperature of the product and ensure the stability of the product system.

[0041] The heat dissipation system of the embodiment of the present disclosure can be applied to any product that needs heat dissipation, especially products that need to achieve silent heat dissipation, which may include but are not limited to vehicle-mounted equipment, user equipment (UE), mobile devices, computing devices, etc., wherein the user equipment may include but is not limited to home-side communication transfer equipment (e.g., routers, optical modems, etc.), home appliances, etc. The heat dissipation method of the embodiment of the present disclosure can be implemented by a processor calling a computer-readable program instruction stored in a memory, or can be implemented by a server.

[0042] The following is a detailed introduction to the embodiments of the present disclosure.

[0043] The present disclosure provides a heat dissipation system A, such as Figure 1 As shown, it may include: a piezoelectric heat dissipation device 1, a natural heat dissipation device 2, a temperature sensor 3 and a control unit 4; the piezoelectric heat dissipation device 1 and the natural heat dissipation device 2 are arranged on a heat source 5 of a device to be cooled B, and the control unit 4 is electrically connected to the temperature sensor 3 and the piezoelectric heat dissipation device 1 respectively;

[0044] A temperature sensor 3 may be configured to detect the temperature of a heat source;

[0045] The natural heat dissipation device 2 can be configured to perform natural heat dissipation;

[0046] The piezoelectric heat dissipation device 1 can be configured to perform natural heat dissipation and airflow heat dissipation through the piezoelectric effect;

[0047] The control unit 4 can be configured to obtain the heat source temperature, and when the heat source temperature is greater than or equal to a preset temperature threshold, control the piezoelectric heat dissipation device 1 to operate and generate airflow, so that the natural heat dissipation device 2 and the piezoelectric heat dissipation device 1 perform airflow heat dissipation; when the heat source temperature is less than the temperature threshold, control the piezoelectric heat dissipation device 1 to stop operating, so that the natural heat dissipation device 2 and the piezoelectric heat dissipation device 1 perform natural heat dissipation.

[0048] In the embodiment of the present disclosure, the heat source 5 may include but is not limited to: a PCB (printed circuit board) of the device to be cooled and a heat generating component, such as a chip, disposed on the PCB. The type, quantity, shape, size, structure, etc. of the heat source 5 are not limited here.

[0049] In the embodiments of the present disclosure, there is no limitation on the composition structures of the piezoelectric heat dissipation device 1 and the natural heat dissipation device 2. Any equipment or device that can achieve natural heat dissipation can be used as the natural heat dissipation device 2, and any equipment or device that achieves heat dissipation through the piezoelectric effect can be used as the piezoelectric heat dissipation device 1.

[0050] In the embodiment of the present disclosure, the natural heat dissipation device 2 may include but is not limited to a flat plate heat sink and a toothed heat sink.

[0051] In the disclosed embodiment, the location, number, layout, etc. of the piezoelectric heat dissipation device 1 and the natural heat dissipation device 2 on the heat source 5 are not limited and can be defined according to needs.

[0052] In the embodiments of the present disclosure, Figure 2 As shown, the piezoelectric heat dissipation device 1 may include but is not limited to: at least one swingable first heat sink 11, a piezoelectric sheet 12 for driving the first heat sink 11 to swing, and a piezoelectric power supply device 13; the first heat sink 11 is connected to the piezoelectric sheet 12, and the piezoelectric sheet 12 is electrically connected to the piezoelectric power supply device 13; the control unit 4 is electrically connected to the piezoelectric power supply device 13; the natural heat dissipation device 2 may include at least one second heat sink 21.

[0053] In the disclosed embodiment, the piezoelectric sheet 12 may be a metal sheet or a thin sheet containing metal, and may be powered by a piezoelectric power supply device 13 . The piezoelectric sheet 12 may vibrate after being powered on, thereby driving the first heat sink 11 to swing.

[0054] In the embodiment of the present disclosure, in order to minimize the sound generated by the vibration of the piezoelectric sheet 12 , the piezoelectric sheet 12 may be made of a sound-absorbing material, or a sound-absorbing material may be disposed on the piezoelectric sheet 12 .

[0055] In the embodiment of the present disclosure, the piezoelectric sheet 12 and the first heat sink 11 can be integrated or separately arranged. When integrated, the first heat sink 11 can be directly connected to the piezoelectric power supply device 13 as the piezoelectric sheet 12, so that the first heat sink 11 vibrates after being energized. When separately arranged, the piezoelectric sheet 12 and the first heat sink 11 are each an individual, the first heat sink 11 is connected to the piezoelectric sheet 12, and the piezoelectric sheet 12 is connected to the piezoelectric power supply device 13.

[0056] In the embodiment of the present disclosure, the first heat sink 11 may include one or more pieces, and the second heat sink 21 may include one or more pieces. The number of the first heat sink 11 and the second heat sink 21 is not limited herein.

[0057] In the embodiment of the present disclosure, the first heat sink 11 and / or the second heat sink 21 can be directly or indirectly connected to the heat source 5 to conduct the heat generated by the heat source 5 and dissipate it. For example, the first heat sink 11 and the second heat sink 21 can be arranged on the heat source 5 through a preset heat dissipation pad.

[0058] In the embodiment of the present disclosure, the first heat sink 11 may be directly disposed on the heat source 5 , may be disposed on the heat source 5 via a heat dissipation pad, or may be disposed on the second heat sink 21 .

[0059] In the disclosed embodiment, the first heat sink 11 can be arranged on one side, the upper part, the top end, etc. of the heat source 5 and / or the second heat sink 21. The detailed arrangement method, position, quantity, etc. of the first heat sink 11 are not limited here.

[0060] In the embodiments of the present disclosure, Figure 3 , which is a schematic diagram of the first heat sink 11 being arranged on the second heat sink 21 . Figure 3 Multiple second heat sinks 21 (for example, 21-1, 21-2, 21-3, ..., 21-n, where n is a positive integer) are arranged in parallel, and one side of each second heat sink 21 is connected to a first heat sink 11 (for example, 11-1, 11-2, 11-3, ..., 11-n), and multiple first heat sinks 11 are all connected to the piezoelectric sheet 12.

[0061] In the embodiment of the present disclosure, since the first heat sink 11 needs to have a swinging space, no matter where the first heat sink 11 is disposed, a swinging space must be reserved for the first heat sink 11, and a swingable portion can be reserved for the first heat sink 11, for example, the first heat sink 11 can be partially suspended on the heat source and / or the second heat sink 21.

[0062] In the embodiment of the present disclosure, for example, the second heat sink 21 can be selected as a toothed heat sink, and a portion of the plurality of first heat sinks 11 can be arranged on the plurality of teeth of the toothed heat sink, and can be arranged on the upper part or top part of the plurality of teeth so that the airflow can carry away the heat in the upper space of the toothed heat sink through swinging.

[0063] In the embodiment of the present disclosure, when there are multiple first heat sinks 11, each first heat sink 11 can be connected to a piezoelectric sheet 12, or multiple first heat sinks 11 can be connected to the same piezoelectric sheet 12. The number of piezoelectric sheets 12 is not limited.

[0064] In the disclosed embodiment, the piezoelectric sheet 12 is usually thin. In order to enable the piezoelectric sheet 12 to drive the first heat sink 11 to swing when vibrating, the first heat sink 11 is set to be thin. The detailed thickness of the first heat sink 11 is not limited here, and it is sufficient to be able to follow the vibration of the piezoelectric sheet 12. The first heat sink 11 can be a flexible heat sink, which is convenient for increasing the swing amplitude, driving a larger airflow, and enhancing the heat dissipation effect.

[0065] In the embodiment of the present disclosure, based on the above settings, the temperature of the heat source 5 can be monitored in real time or periodically through the temperature sensor 3, and the control unit 4 can control the power supply or power off of the piezoelectric heat dissipation device 1 according to the detected heat source temperature, so as to achieve the purpose of controlling the operation or stop of the piezoelectric heat dissipation device 1, thereby controlling the first heat sink 11 in the piezoelectric heat dissipation device 1 to swing or stop, so that the piezoelectric heat dissipation device 1 can realize two heat dissipation modes: airflow heat dissipation and natural heat dissipation.

[0066] In the embodiments of the present disclosure, for example, when the temperature of the heat source is greater than or equal to a preset temperature threshold, the piezoelectric heat dissipation device 1 is controlled to operate and generate airflow, so that the heat conducted by the natural heat dissipation device 2 and the piezoelectric heat dissipation device 1 can be carried away by the airflow, thereby achieving airflow heat dissipation and natural heat dissipation; when the temperature of the heat source is less than the temperature threshold, the piezoelectric heat dissipation device 1 is controlled to stop operating, so that the natural heat dissipation device 2 and the piezoelectric heat dissipation device 1 can perform natural heat dissipation.

[0067] In the embodiment disclosed herein, through this embodiment scheme, natural heat dissipation can be performed when the temperature of the heat source 5 is low, and air flow heat dissipation and natural heat dissipation can be performed when the temperature of the heat source 5 is high, thereby achieving the purpose of saving energy when the temperature is low and quickly cooling down when the temperature is high.

[0068] In the embodiment of the present disclosure, the control unit 4 controls the piezoelectric heat dissipation device 1 to operate and generate airflow, so that the natural heat dissipation device 2 and the piezoelectric heat dissipation device 1 perform airflow heat dissipation, including:

[0069] Control the piezoelectric power supply device 13 to supply power to the piezoelectric sheet 12, so that the piezoelectric sheet 12 vibrates to drive the first heat sink 11 to swing, and the airflow generated by the swing takes away the heat of the first heat sink 11 and the second heat sink 21;

[0070] The control unit 4 controls the piezoelectric heat dissipation device 13 to stop running, so that the natural heat dissipation device 2 and the piezoelectric heat dissipation device 1 perform natural heat dissipation, including:

[0071] The piezoelectric power supply device 13 is controlled to cut off the power to the piezoelectric piece 12 , so that the piezoelectric piece 12 stops vibrating and the first heat sink 11 stops swinging, and the first heat sink 11 and the second heat sink 21 dissipate heat naturally.

[0072] In the embodiment of the present disclosure, the control unit 4 controls the power supply or power off of the piezoelectric heat dissipation device 1, and is mainly used to control the piezoelectric power supply device 13 to power on or power off the piezoelectric sheet 12. The piezoelectric sheet 12 will vibrate when powered on, and will stop vibrating when powered off.

[0073] In the disclosed embodiment, the control unit 4 can also be configured to adjust the supply voltage of the piezoelectric power supply device 13 according to the temperature of the heat source, and adjust the swing frequency of the first heat sink 11 by changing the supply voltage.

[0074] In the disclosed embodiment, the heat source temperature can be divided into multiple levels, and the power supply voltage of the piezoelectric power supply device 13 can also be set to multiple levels accordingly, so that the swing frequency of the first heat sink 11 has multiple levels accordingly.

[0075] In the embodiment of the present disclosure, multiple levels can be respectively or even correspondingly divided according to the increase or decrease of the heat source temperature. The levels divided in the heat source temperature increase scene and the heat source temperature decrease scene can be the same or different.

[0076] In the embodiments of the present disclosure, Figure 4 , Figure 5 As shown, for example, in the scenario where the heat source temperature rises, 6 levels can be set, such as 75°C, 85°C, 95°C, 105°C, 115°C, and 125°C, and the swing frequencies corresponding to the temperatures of 75°C, 85°C, 95°C, 105°C, 115°C, and 125°C can be 0HZ, 0HZ, 30HZ, 40HZ, 50HZ, and 50HZ, respectively. In the scenario where the heat source temperature drops, 6 levels can be set, such as 75°C, 85°C, 95°C, 105°C, 115°C, and 125°C, and the swing frequencies corresponding to the temperatures of 125°C, 115°C, 105°C, 95°C, 85°C, and 75°C can be 50HZ, 50HZ, 40HZ, 30HZ, 0HZ, and 0HZ, respectively.

[0077] In the embodiments of the present disclosure, Figure 6 As shown, the heat dissipation system A may further include: a window opening control device 6; the window opening control device 6 is electrically connected to the control unit 4;

[0078] The device B to be cooled may include a housing 7, and the housing 7 may be provided with at least one window 71 and a window baffle 72 for covering the window 71;

[0079] The window opening control device 6 may be configured to control the movement of the window baffle 72 under the control of the control unit 4 to open the window 71 or close the window 71 .

[0080] In the embodiment of the present disclosure, in order to improve the heat dissipation effect, at least one window 71 can be set on the device B to be cooled for ventilation, and the shape, size, number and position of the window can be defined according to needs.

[0081] In the embodiment of the present disclosure, in order to prevent too much dust from accumulating inside the device B to be cooled due to the electrostatic effect after the window 71 is opened, thereby affecting the performance of the device, a window baffle 72 for shielding the window 71 can be provided. The window baffle 72 can be provided as a movable structure. When the window 71 needs to be opened, the window baffle 72 can be moved away from the window 71. When the window 71 does not need to be opened, the window baffle 72 can be shielded to the window 71. The situation where the window 71 needs to be opened may include but is not limited to the situation where the temperature of the heat source 5 is too high and rapid heat dissipation is required. By providing the window baffle 72, the purpose of rapid heat dissipation and avoiding dust can be taken into account.

[0082] In the embodiment of the present disclosure, the control unit 4 can also be configured to perform a first control on the window opening control device 6 to control the window baffle 72 to open the window 71 when the heat source temperature is greater than or equal to the temperature threshold; and to perform a second control on the window opening control device 6 to control the window baffle 72 to close the window 71 when the heat source temperature is less than the temperature threshold.

[0083] In the embodiment of the present disclosure, according to the foregoing content, it can be known that when the temperature of the heat source is greater than or equal to a preset temperature threshold, the piezoelectric heat dissipation device 1 can be controlled to operate and generate airflow, so that the heat conducted by the natural heat dissipation device 2 and the piezoelectric heat dissipation device 1 can be taken away by the airflow, thereby realizing airflow heat dissipation and natural heat dissipation; after the piezoelectric heat dissipation device 1 generates airflow, if the outer shell 7 is in a closed state at this time, for example, the window 71 is not opened, the airflow will only flow inside the outer shell 7 and cannot exchange heat with the outside air, thereby failing to achieve the purpose of rapid heat dissipation. Therefore, airflow heat dissipation cannot be truly realized. At this time, it is necessary to control (such as the first control mentioned above) the window opening control device 6 to control the window baffle 72 to open the window 71.

[0084] In the disclosed embodiment, when the temperature of the heat source is less than the temperature threshold, the piezoelectric heat dissipation device 1 is controlled to stop running, so that the natural heat dissipation device 2 and the piezoelectric heat dissipation device 1 can dissipate heat naturally. Since the temperature of the heat source 5 is not high at this time, the natural heat dissipation device 2 and the piezoelectric heat dissipation device 1 can dissipate heat naturally. Therefore, even if there is a shell at this time, the shell 7 can be slowly heat-exchanged with the external environment to achieve natural heat dissipation. At this time, the window opening control device 6 can also be controlled (such as the second control mentioned above) to control the window baffle 72 to open the window 71. Whether the window 71 needs to be opened can be determined by selecting a suitable control strategy according to the needs.

[0085] In the embodiments of the present disclosure, Figure 7 As shown, the window opening control device 6 may include but is not limited to: a relay 61, a spring 62 and a relay power supply device 63;

[0086] The first end of the window baffle 72 is connected to the first end of the spring 62, and the second end of the spring 62 is fixed to the housing 7;

[0087] The second end of the window baffle 72 is connected to the moving contact of the relay 61;

[0088] The relay 61 is electrically connected to the relay power supply device 63;

[0089] The relay power supply device 63 is electrically connected to the control unit 4 .

[0090] In the embodiment of the present disclosure, the control unit 4 performs a first control on the window opening control device 6 to control the window baffle 72 to open the window 71, including:

[0091] Control the relay power supply device 63 to supply power to the relay 61, so that the window baffle 72 is pulled to move in the first direction by the relay 61 to open the window 71;

[0092] The control unit 4 performs a second control on the window opening control device 6 to control the window baffle 72 to close the window 71, including:

[0093] The relay power supply device 63 is controlled to cut off the power to the relay 61 , so that the spring 62 pulls the window baffle 72 to move in the second direction through the relay 61 to close the window 71 .

[0094] In the embodiment of the present disclosure, a connecting rod can be provided on the window baffle 72, and the rod body of the connecting rod is fixed on the window baffle 72. One end of the connecting rod is connected to the spring 62, and the other end is connected to the moving contact of the relay 61, so that when the relay 61 is energized and the moving contact is attracted to the static contact, the connecting rod will be pulled, and the connecting rod drives the window baffle 72 to move; similarly, when the relay 61 loses power and the moving contact and the static contact are released, the connecting rod is pulled back by the spring, and the connecting rod drives the window baffle 72 to return to its original position.

[0095] In the embodiment of the present disclosure, when one side of the shell 7 includes multiple windows 71, the multiple windows 71 can respectively correspond to a window baffle 72, and these window baffles 72 can be connected by the above-mentioned connecting rod so that when the connecting rod moves, all of these window baffles 72 are driven to move together.

[0096] In the embodiment of the present disclosure, when the temperature sensor 3 detects that the temperature of the heat source is greater than or equal to the temperature threshold, the control unit 4 controls the piezoelectric power supply device 13 to output voltage to the piezoelectric sheet 12, and the piezoelectric sheet 12 starts to vibrate, driving the first heat sink 11 to swing; and the control unit 4 controls the relay power supply device 63 to output voltage to the relay 61. When the relay 61 has voltage, the window block 72 will be sucked, and the window 71 will be opened. Through the window 71, the airflow formed by the swing of the first heat sink 11 flows out and takes the heat out, which can effectively solve the problem of high-power heat dissipation. When the temperature sensor 3 detects that the temperature of the heat source is less than the temperature threshold, the control unit 4 controls the piezoelectric power supply device 13 to stop supplying power to the piezoelectric sheet 12, the piezoelectric sheet 12 stops vibrating, the first heat sink 11 stops swinging, and the first heat sink 11 dissipates heat naturally, and the control unit 4 controls the relay power supply device 63 to stop supplying power to the relay 61. When the relay 61 has no voltage, the window block 72 will be released, and the window block 72 will be pulled back by the spring 62, and the window 71 will be closed.

[0097] The present disclosure also provides a heat dissipation method. Figure 8 As shown, based on the heat dissipation system A, the method is applied to the control unit of the heat dissipation system A, and includes steps S11-S12:

[0098] S11, obtaining the heat source temperature of the printed circuit board of the device to be cooled;

[0099] S12. When the temperature of the heat source is greater than or equal to a preset temperature threshold, the piezoelectric heat dissipation device of the heat dissipation system is controlled to operate and generate airflow, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform airflow heat dissipation; when the temperature of the heat source is less than the temperature threshold, the piezoelectric heat dissipation device is controlled to stop operating, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform natural heat dissipation.

[0100] In the embodiment of the present disclosure, controlling the piezoelectric heat dissipation device of the heat dissipation system to operate and generate airflow so that the natural heat dissipation device and the piezoelectric heat dissipation device perform airflow heat dissipation may include:

[0101] The piezoelectric power supply device that controls the piezoelectric heat dissipation device supplies power to the piezoelectric sheet of the piezoelectric heat dissipation device, causing the piezoelectric sheet to vibrate to drive the first heat dissipation sheet of the piezoelectric heat dissipation device to swing. The airflow generated by the swing takes away the heat of the first heat dissipation sheet and the second heat dissipation sheet of the natural heat dissipation device.

[0102] In the embodiment of the present disclosure, controlling the piezoelectric heat dissipation device to stop running so that the natural heat dissipation device and the piezoelectric heat dissipation device perform natural heat dissipation includes:

[0103] The piezoelectric power supply device is controlled to cut off power to the piezoelectric piece, so that the piezoelectric piece stops vibrating and the first heat sink stops swinging, and the first heat sink and the second heat sink perform natural heat dissipation.

[0104] In the embodiment of the present disclosure, the method may further include:

[0105] The power supply voltage of the piezoelectric power supply device is adjusted according to the temperature of the heat source, and the swing frequency of the first heat sink is adjusted by changing the power supply voltage.

[0106] In the embodiment of the present disclosure, the method may further include:

[0107] When the heat source temperature is greater than or equal to the temperature threshold, the window opening control device of the heat dissipation system is first controlled to control the window baffle of the device to be cooled to open the window on the shell of the device to be cooled; when the heat source temperature is less than the temperature threshold, the window opening control device is second controlled to control the window baffle to close the window.

[0108] In an embodiment of the present disclosure, a first control is performed on a window opening control device of a heat dissipation system to control a window baffle of a device to be cooled to open a window on a housing of the device to be cooled, including:

[0109] The relay power supply device for controlling the window opening control device supplies power to the relay of the window opening control device, so as to pull the window baffle to move in the first direction through the relay closure to open the window;

[0110] The window opening control device is subjected to a second control to control the window baffle to close the window, including:

[0111] The control relay power supply device cuts off the power of the relay, so that the spring of the window opening control device pulls the window baffle to move in the second direction through the release of the relay to close the window.

[0112] In the embodiments of the present disclosure, any embodiments of the aforementioned heat dissipation system are applicable to the embodiments of the heat dissipation method and will not be described in detail here.

[0113] The present disclosure also provides a device B to be cooled, such as Fig. 9 As shown, it may include: a heat source 5 and the heat dissipation system A described above.

[0114] The present disclosure also provides an electronic device 100, such as Fig.10 As shown, the electronic device may include:

[0115] One or more processors 101;

[0116] A memory 102 storing one or more programs, when the one or more programs are executed by the one or more processors 101, the one or more processors 101 implement the heat dissipation method;

[0117] One or more input / output I / O interfaces 103 are connected between the processor 101 and the memory 102 and are configured to implement information exchange between the processor 101 and the memory 102 .

[0118] Among them, the processor 101 is a device with data processing capabilities, including but not limited to a central processing unit (CPU) and the like; the memory 102 is a device with data storage capabilities, including but not limited to random access memory (RAM, more specifically SDRAM, DDR, etc.), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory (FLASH); the I / O interface (read-write interface) 103 is connected between the processor 101 and the memory 102, and can realize information interaction between the processor 101 and the memory 102, including but not limited to a data bus (Bus) and the like.

[0119] In some embodiments, the processor 101 , the memory 102 , and the I / O interface 103 are connected to each other via a bus 104 , and further connected to other components of the computing device.

[0120] The present disclosure also provides a computer-readable storage medium 200, such as Fig.11 As shown, the computer-readable storage medium 200 stores a computer program, and when the computer program is executed by the processor, the heat dissipation method is implemented.

[0121] Those skilled in the art will appreciate that all or some of the steps, systems, and functional modules / units in the apparatus disclosed above may be implemented as software, firmware, hardware, or a suitable combination thereof.

[0122] In hardware implementations, the division between functional modules / units mentioned in the above description does not necessarily correspond to the division of physical components; for example, one physical component may have multiple functions, or one function or step may be performed by several physical components in cooperation.

[0123] Some physical components or all physical components may be implemented as software executed by a processor, such as a central processing unit (CPU), a digital signal processor or a microprocessor, or implemented as hardware, or implemented as an integrated circuit, such as an application-specific integrated circuit. Such software may be distributed on a computer-readable medium, which may include a computer storage medium (or non-temporary medium) and a communication medium (or temporary medium). As known to those of ordinary skill in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules or other data). Computer storage media include, but are not limited to, random access memory (RAM, more specifically SDRAM, DDR, etc.), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory (FLASH) or other disk storage; read-only compact disk (CD-ROM), digital versatile disk (DVD) or other optical disk storage; magnetic cassettes, magnetic tapes, disk storage or other magnetic storage; any other medium that can be used to store desired information and can be accessed by a computer. Furthermore, it is well known to those skilled in the art that communication media typically embodies computer readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.

[0124] The present disclosure has disclosed example embodiments, and although specific terms are employed, they are used and should be interpreted only in a general illustrative sense and not for limiting purposes. In some instances, it will be apparent to those skilled in the art that, unless otherwise expressly stated, features, characteristics, and / or elements described in conjunction with a particular embodiment may be used alone or in combination with features, characteristics, and / or elements described in conjunction with other embodiments. Therefore, those skilled in the art will appreciate that various changes in form and detail may be made without departing from the scope of the present disclosure as set forth in the appended claims.

Claims

1. A heat dissipation system, characterized in that: include: Piezoelectric heat dissipation device, natural heat dissipation device, temperature sensor and control unit; The piezoelectric heat dissipation device and the natural heat dissipation device are arranged on the heat source of the device to be cooled, and the control unit is electrically connected to the temperature sensor and the piezoelectric heat dissipation device respectively; The temperature sensor is configured to detect the temperature of the heat source; The natural heat dissipation device is configured to perform natural heat dissipation; The piezoelectric heat dissipation device is configured to perform natural heat dissipation and airflow heat dissipation through the piezoelectric effect; The control unit is configured to obtain the temperature of the heat source, and when the temperature of the heat source is greater than or equal to a preset temperature threshold, control the piezoelectric heat dissipation device to operate and generate airflow, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform airflow heat dissipation; when the temperature of the heat source is less than the temperature threshold, control the piezoelectric heat dissipation device to stop operating, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform natural heat dissipation.

2. The heat dissipation system according to claim 1, characterized in that: The piezoelectric heat sink comprises at least one swingable first heat sink, a piezoelectric sheet for driving the first heat sink to swing, and a piezoelectric power supply device; The first heat sink is connected to the piezoelectric sheet, and the piezoelectric sheet is electrically connected to the piezoelectric power supply device; the control unit is electrically connected to the piezoelectric power supply device; the natural heat dissipation device includes at least one second heat sink; The control unit controls the piezoelectric heat dissipation device to operate and generate airflow, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform airflow heat dissipation, including: Controlling the piezoelectric power supply device to supply power to the piezoelectric sheet, so that the piezoelectric sheet vibrates to drive the first heat sink to swing, and the airflow generated by the swing takes away the heat of the first heat sink and the second heat sink; The control unit controls the piezoelectric heat dissipation device to stop running, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform natural heat dissipation, including: The piezoelectric power supply device is controlled to cut off power to the piezoelectric piece, so that the piezoelectric piece stops vibrating and the first heat sink stops swinging, and the first heat sink and the second heat sink perform natural heat dissipation.

3. The heat dissipation system according to claim 2, characterized in that: The control unit is further configured to adjust the supply voltage of the piezoelectric power supply device according to the temperature of the heat source, so as to adjust the oscillation frequency of the first heat sink by changing the supply voltage.

4. The heat dissipation system according to claim 2, characterized in that: The first heat sink is disposed on the second heat sink; and / or, The piezoelectric sheet and the first heat sink are integrated, and the first heat sink serves as the piezoelectric sheet.

5. The heat dissipation system according to any one of claims 1 to 4, characterized in that: Also includes: Window opening control device; The window opening control device is electrically connected to the control unit; The device to be cooled comprises a housing, the heat source is located inside the housing, and the housing is provided with at least one window and a window baffle for covering the window; The window opening control device is configured to control the movement of the window baffle under the control of the control unit to open or close the window.

6. The heat dissipation system according to claim 5, characterized in that: The control unit is further configured to perform a first control on the window opening control device to control the window baffle to open the window when the heat source temperature is greater than or equal to the temperature threshold; and to perform a second control on the window opening control device to control the window baffle to close the window when the heat source temperature is less than the temperature threshold.

7. The heat dissipation system according to claim 6, characterized in that: The window opening control device comprises: a relay, a spring and a relay power supply device; The first end of the window baffle is connected to the first end of the spring, and the second end of the spring is fixed to the housing; The second end of the window baffle is connected to the moving contact of the relay; The relay is electrically connected to a relay power supply device; The relay power supply device is electrically connected to the control unit.

8. The heat dissipation system according to claim 7, characterized in that: The control unit performs a first control on the window opening control device to control the window baffle to open the window, including: Controlling the relay power supply device to supply power to the relay, so as to pull the window baffle to move in a first direction through the relay being attracted to open the window; The control unit performs a second control on the window opening control device to control the window baffle to close the window, including: The relay power supply device is controlled to cut off power to the relay, so that the spring pulls the window baffle to move in the second direction through the release of the relay to close the window.

9. A heat dissipation method, characterized in that: Based on the heat dissipation system according to any one of claims 1 to 8, applied to a control unit of the heat dissipation system, the method comprises: Obtain the heat source temperature of the device to be cooled; When the temperature of the heat source is greater than or equal to a preset temperature threshold, the piezoelectric heat dissipation device of the heat dissipation system is controlled to operate and generate airflow, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform airflow heat dissipation; when the temperature of the heat source is less than the temperature threshold, the piezoelectric heat dissipation device is controlled to stop operating, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform natural heat dissipation.

10. The heat dissipation method according to claim 9, characterized in that: The controlling the piezoelectric heat dissipation device of the heat dissipation system to operate and generate airflow so that the natural heat dissipation device and the piezoelectric heat dissipation device perform airflow heat dissipation includes: Controlling the piezoelectric power supply device of the piezoelectric heat dissipation device to supply power to the piezoelectric sheet of the piezoelectric heat dissipation device, so that the piezoelectric sheet vibrates to drive the first heat dissipation sheet of the piezoelectric heat dissipation device to swing, and the airflow generated by the swing takes away the heat of the first heat dissipation sheet and the second heat dissipation sheet of the natural heat dissipation device; The controlling the piezoelectric heat dissipation device to stop running so that the natural heat dissipation device and the piezoelectric heat dissipation device perform natural heat dissipation includes: The piezoelectric power supply device is controlled to cut off power to the piezoelectric piece, so that the piezoelectric piece stops vibrating and the first heat sink stops swinging, and the first heat sink and the second heat sink perform natural heat dissipation.

11. The heat dissipation method according to claim 10, characterized in that: The method further comprises: The power supply voltage of the piezoelectric power supply device is adjusted according to the temperature of the heat source, and the swing frequency of the first heat sink is adjusted by changing the power supply voltage.

12. The heat dissipation method according to any one of claims 9 to 11, characterized in that: The method further comprises: When the temperature of the heat source is greater than or equal to the temperature threshold, the window opening control device of the heat dissipation system is first controlled to control the window baffle of the device to be cooled to open the window on the housing of the device to be cooled; when the temperature of the heat source is less than the temperature threshold, the window opening control device is second controlled to control the window baffle to close the window.

13. The heat dissipation method according to claim 12, characterized in that: The first control of the window opening control device of the heat dissipation system to control the window baffle of the device to be cooled to open the window on the housing of the device to be cooled comprises: The relay power supply device controlling the window opening control device supplies power to the relay of the window opening control device, so that the window baffle is pulled to move in the first direction by the relay being attracted to open the window; The second control of the window opening control device to control the window baffle to close the window includes: The relay power supply device is controlled to cut off power to the relay, so that the spring of the window opening control device pulls the window baffle to move in the second direction through the release of the relay to close the window.

14. A device to be cooled, characterized in that: include: A heat source and a heat dissipation system as described in any one of claims 1 to 8; the heat dissipation system is used to dissipate heat from the heat source.

15. An electronic device, comprising: one or more processors; A memory having one or more programs stored thereon, wherein when the one or more programs are executed by the one or more processors, the one or more processors implement the heat dissipation method according to any one of claims 9 to 13; One or more input / output I / O interfaces are connected between the processor and the memory and are configured to implement information interaction between the processor and the memory.

16. A computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the heat dissipation method according to any one of claims 9 to 13.

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