Cabinet and liquid cooling system

Abstract

The invention discloses a cabinet and a liquid cooling system, and the cabinet comprises a top wall and a bottom wall which are oppositely disposed, and also comprises a plurality of side walls disposed between the top wall and the bottom wall. A closed space is defined by the side walls, the top wall and the bottom wall, and the closed space is used for containing electronic equipment; a first flow channel is formed in at least one of the side walls, the first flow channel comprises at least two first sub-flow channels and at least one second sub-flow channel, the at least two first sub-flow channels are distributed in the side wall, and the second sub-flow channel is used for connecting the adjacent first sub-flow channels; wherein the first flow channel is used for circulating a cooling medium to change the temperature of the side wall, so that the temperature of the side wall of the cabinet is reduced through the cooling medium circulating in the first flow channel, the temperature difference between the side wall of the cabinet and the environment temperature in the machine room is reduced, heat leakage in the cabinet is reduced, and temperature rise of the machine room where the cabinet is located is avoided.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a cabinet and a liquid cooling system. Background Art

[0002] With the development of science and technology, the power of electronic equipment such as servers installed in cabinets is getting higher and higher, and higher requirements are also put forward for the heat dissipation of electronic equipment. Some heat dissipation solutions are proposed to immerse electronic equipment in a cabinet with a cooling medium, such as single-phase immersion cooling and two-phase immersion cooling. The cooling medium absorbs the heat generated by the electronic equipment when it is working, and then cools and dissipates the electronic equipment.

[0003] However, the cabinet is generally installed in a computer room, which is generally equipped with other electronic equipment besides the cabinet. When the cooling medium in the cabinet absorbs the heat generated by the electronic equipment when it is working, the temperature in the cabinet rises, and there is a situation where the heat in the cabinet leaks into the computer room, causing the temperature in the computer room to rise, thereby affecting the use and maintenance of other electronic equipment in the computer room.

[0004] Therefore, how to reduce heat leakage in the cabinet and avoid the temperature rise of the computer room where the cabinet is located is a technical problem that needs to be solved at present. Summary of the invention

[0005] The present application provides a cabinet and a liquid cooling system to reduce the temperature difference between the outer surface of the cabinet and the ambient temperature in a computer room, thereby reducing heat leakage in the cabinet and avoiding a temperature rise in the computer room where the cabinet is located.

[0006] In the first aspect, the present application provides a cabinet, which includes a top wall, a bottom wall and multiple side walls; the top wall and the bottom wall are arranged opposite to each other, the multiple side walls are arranged between the top wall and the bottom wall, and the multiple side walls, the top wall and the bottom wall are enclosed to form an enclosed space, and the enclosed space is used to place electronic equipment; at least one of the multiple side walls has a first flow channel, and the first flow channel is used to circulate a cooling medium to change the temperature of the side wall; the first flow channel includes at least two first sub-flow channels and at least one second sub-flow channel, the at least two first sub-flow channels are distributed in the side walls, and the second sub-flow channels are used to connect adjacent first sub-flow channels.

[0007] It can be seen that the side wall of the cabinet has a first flow channel for circulating cooling medium. The cooling medium circulating in the first flow channel reduces the temperature of the side wall of the cabinet, reduces the temperature difference between the side wall of the cabinet and the ambient temperature in the computer room, thereby reducing heat leakage in the cabinet and avoiding temperature rise in the computer room where the cabinet is located.

[0008] In some embodiments, the first flow channel is used to connect to a cold source device to change the temperature of the side wall.

[0009] It can be seen that the cold source device continuously provides low-temperature cooling medium to the first flow channel, thereby realizing a cyclic and sustainable change in the side wall temperature of the cabinet.

[0010] In some embodiments, the first flow channel has a first liquid inlet and a first liquid outlet, and the first liquid inlet and the first liquid outlet are respectively arranged in the two first sub-flow channels; the first liquid inlet and the first liquid outlet are used to be connected to a cold source device respectively to establish a cooling medium circuit between the cold source device and the first flow channel.

[0011] It can be seen that the first liquid inlet is used to allow the cooling medium of the cold source device to flow into the first flow channel, and the first liquid outlet is used to flow the cooling medium in the first cavity back to the cold source device. The cooling medium in the first cavity absorbs the heat generated when the electronic device is working and the temperature rises. By flowing the cooling medium in the first cavity back to the cold source device, the cold source device cools down the heated cooling medium, thereby realizing a cyclic and sustainable supply of low-temperature cooling medium.

[0012] In some embodiments, the side wall has a first end and a second end opposite to each other, the first end of the side wall is connected to the bottom wall, and the second end of the side wall is connected to the top wall; the first liquid inlet and the first liquid outlet are respectively arranged at the first end of the side wall.

[0013] In one possible embodiment, the first liquid inlet and the first liquid outlet may be respectively arranged at the second end of the side wall; in another possible embodiment, the first liquid inlet is arranged at the first end of the side wall, and the first liquid outlet is arranged at the second end of the side wall; in another possible embodiment, the first liquid inlet is arranged at the second end of the side wall, and the first liquid outlet is arranged at the first end of the side wall; in yet another possible embodiment, the first liquid inlet and the first liquid outlet are arranged at the third end of the side wall, and the third end is adjacent to the first end and the second end, respectively.

[0014] In some embodiments, the first liquid inlet is provided with a flow rate controller, and the flow rate controller is used to control the flow rate of the cooling medium flowing through the first liquid inlet.

[0015] It can be seen that the flow rate controller controls the flow rate of the cooling medium flowing through the first liquid inlet, thereby adjusting the flow rate of the cooling medium in the first flow channel, thereby changing the temperature of the side wall and reducing the temperature difference between the side wall and the ambient temperature in the machine room.

[0016] In some embodiments, the first flow channel has a first liquid inlet and a first liquid outlet, and the first liquid inlet and the first liquid outlet are respectively arranged on two first sub-channels; the first flow channel also includes a third sub-channel, and the third sub-channel is used for thermal contact with the cold source device; the two ends of the third sub-channel are respectively connected to the first liquid inlet and the first liquid outlet, so that at least two first sub-channels, at least one second sub-channel and the third sub-channel are connected to form a closed-loop flow channel.

[0017] It can be understood that the third sub-flow channel may be in indirect contact with the cold source device or in direct contact with the cold source device, so that the cold source device can cool the cooling medium flowing through the third sub-flow channel.

[0018] In some embodiments, the multiple side walls include a first side wall, a second side wall, a third side wall and a fourth side wall; the first side wall and the third side wall are arranged opposite to each other, the second side wall and the fourth side wall are arranged opposite to each other, the first side wall is connected to the second side wall and the fourth side wall respectively, and the third side wall is connected to the second side wall and the fourth side wall respectively.

[0019] In some embodiments, a heat insulating layer is provided on the surface of the side wall, and the heat leakage in the cabinet is further reduced by the heat insulating layer.

[0020] In some embodiments, the side wall has a first surface and a second surface relative to each other, the first surface of the side wall faces away from the electronic device, and the first surface of the side wall having the first flow channel is provided with a temperature detector for detecting the first surface temperature of the side wall.

[0021] It can be seen that the temperature of the first surface of the side wall is detected by the temperature sensor to determine the temperature difference between the first surface temperature of the side wall and the ambient temperature in the machine room. The temperature difference is used to determine the flow rate of the cooling medium in the first flow channel, thereby reducing the temperature difference between the side wall and the ambient temperature in the machine room.

[0022] In some embodiments, the top wall has a second flow channel, and the second flow channel is used to circulate a cooling medium to change the temperature of the top wall; the bottom wall has a third flow channel, and the third flow channel is used to circulate a cooling medium to change the temperature of the bottom wall; the second flow channel is connected to the first flow channel, or the third flow channel is connected to the first flow channel, or the first flow channel, the second flow channel and the third flow channel are connected.

[0023] Based on the above description, the top wall and bottom wall of the cabinet are respectively provided with a second flow channel and a third flow channel for circulating cooling medium. The cooling medium circulating in the second flow channel and the third flow channel lowers the temperature of the top wall and the bottom wall of the cabinet, and reduces the temperature difference between the top wall and the bottom wall of the cabinet and the ambient temperature in the computer room, thereby reducing heat leakage in the cabinet and avoiding the temperature rise of the computer room where the cabinet is located.

[0024] In a second aspect, the present application further provides a liquid cooling system, comprising a cold source device and the cabinet described in the first aspect; the cold source device is connected to a first flow channel in the cabinet described in the first aspect.

[0025] Since the liquid cooling system here includes the cabinet described in the first aspect above, it also has the technical effects that can be brought about by any possible implementation method in the first aspect above, and the repeated parts will not be discussed. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of a cabinet in the related art;

[0027] Figure 2 is a schematic diagram of another cabinet in the related art;

[0028] Figure 3 A schematic diagram of a cabinet provided exemplarily in an embodiment of the present application;

[0029] Figure 4 A schematic diagram of a cabinet provided exemplarily in an embodiment of the present application;

[0030] Figure 5 A schematic diagram of a front view of a fourth side wall 306 exemplarily provided in an embodiment of the present application;

[0031] Figure 6 A schematic diagram of a front view of a fourth side wall 306 exemplarily provided in an embodiment of the present application;

[0032] Figure 7 A schematic diagram of a front view of a fourth side wall 306 exemplarily provided in an embodiment of the present application;

[0033] Figure 8 A schematic diagram of a front view of a fourth side wall 306 exemplarily provided in an embodiment of the present application;

[0034] Fig. 9 A schematic diagram of a front view of a fourth side wall 306 exemplarily provided in an embodiment of the present application;

[0035] Fig.10 A schematic diagram of a cabinet provided exemplarily in an embodiment of the present application;

[0036] Fig.11A schematic diagram of a liquid cooling system provided as an example for an application embodiment. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to be used as limitations on the present application. As used in the specification and the appended claims of the present application, the singular expressions "one", "a kind", "said", "above", "the" and "this" are intended to also include expressions such as "one or more", unless there is a clear contrary indication in the context. It should also be understood that in the embodiments of the present application, "one or more" refers to one, two or more; "and / or" describes the association relationship of the associated objects, indicating that three relationships may exist; for example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural. The character " / " generally indicates that the associated objects before and after are in an "or" relationship.

[0038] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0039] The multiple involved in the embodiments of the present application means greater than or equal to two. It should be noted that in the description of the embodiments of the present application, the words "first", "second", etc. are only used for the purpose of distinguishing the description, and cannot be understood as indicating or implying relative importance, nor can they be understood as indicating or implying an order.

[0040] With the development of science and technology, the power of electronic equipment such as servers installed in cabinets is getting higher and higher, and higher requirements are put forward for the heat dissipation of electronic equipment, so liquid cooling technology is born. Liquid cooling technology has various applications in the information technology (IT) industry, such as single-phase immersion cooling, two-phase immersion cooling, spray liquid cooling, full cold plate liquid cooling, cold plate + air cooling and other liquid cooling methods.

[0041] See also Figure 1 , Figure 1The figure is a schematic diagram of an air-cooled cabinet in the related art. The cabinet 100 includes a cabinet wall 101, a fixed frame 102 and a cabinet door 103. The internal space formed by the cabinet wall 101 and the cabinet door 103 contains electronic equipment. The cabinet door 103 may be a tube-fin type. The heat generated by the electronic equipment in the internal space flows out of the cabinet door 103 through a fan device, thereby achieving heat dissipation and cooling of the electronic equipment. Figure 1 The cabinet shown has a low heat dissipation effect, and additional air duct design is required in the computer room to meet the airflow requirements, which is too costly.

[0042] A cooling solution has been proposed to ensure the chip's heat dissipation capacity and energy efficiency (power usage effectiveness, PUE) through full liquid cooling, so as to maximize the chip's computing power in high performance computing (HPC) scenarios. Among them, PUE represents the ratio of all energy consumed by the data center to the energy consumed by the IT load. Full liquid cooling methods include the above-mentioned single-phase immersion cooling, two-phase immersion cooling, etc. For example, single-phase immersion cooling refers to directly immersing electronic equipment in an insulating cooling medium (such as fluorinated liquid), and the cooling medium and electronic equipment are placed in a sealed cabinet. Heat is transferred from the electronic equipment to the cooling medium, and the fluorinated liquid with increased temperature is flowed to the heat exchanger through a circulating pump, cooled in the heat exchanger and circulated back to the cabinet. Two-phase immersion cooling refers to immersing electronic equipment directly in an insulating cooling medium (such as fluorinated liquid). The cooling medium and electronic equipment are placed in a sealed cabinet. Heat is transferred from the electronic equipment to the cooling medium, causing the cooling medium to boil and produce steam (i.e., from liquid to gas). The steam is then condensed on a heat exchanger (such as a condenser) to transfer the heat.

[0043] However, in the above-mentioned liquid cooling method, after the cooling medium in the cabinet absorbs the heat generated by the electronic equipment when it is working, the temperature in the cabinet rises, which will cause heat leakage in the cabinet. Since the cabinet is generally set in the computer room, and the computer room is generally equipped with other electronic equipment besides the cabinet, when the heat in the cabinet leaks into the computer room, it will cause the temperature in the computer room to rise, thereby affecting the use and maintenance of other electronic equipment in the computer room. Therefore, how to reduce the heat leakage of the cabinet is a technical problem that needs to be solved urgently.

[0044] See also Figure 2 , Figure 2It is a schematic diagram of another cabinet in the related art. The cabinet 200 includes an upper cabinet wall 201, a lower cabinet wall 202, a front cabinet wall 203, a left cabinet wall 204, a right cabinet wall 205 and a rear cabinet wall 206. The upper cabinet wall 201, the lower cabinet wall 202, the front cabinet wall 203, the left cabinet wall 204, the right cabinet wall 205 and the rear cabinet wall 206 form a closed space, and the closed space is used to place electronic equipment 207. In addition, the upper cabinet wall 201, the lower cabinet wall 202, the front cabinet wall 203, the left cabinet wall 204, the right cabinet wall 205 and the rear cabinet wall 206 are all made of non-metallic materials with low heat transfer coefficient, strong thermal insulation and strong heat resistance, so as to reduce the heat leakage of the cabinet. Exemplarily, Figure 2 The cabinet wall is also provided with a heat insulation cotton interlayer to reduce the heat leakage of the cabinet. However, in the above method, the heat transfer coefficient of the non-metallic material has a lower limit. When the cabinet has a large heat leakage prevention demand, the thickness of the cabinet wall or the thickness of the heat insulation cotton must be increased, which will increase the size of the cabinet, make the deployment and transportation of the cabinet more difficult, and increase the cost.

[0045] Therefore, the present application proposes a cabinet that improves the efficiency of preventing heat leakage of the cabinet in a lightweight manner without increasing the size of the cabinet wall, thereby avoiding the temperature rise of the computer room where the cabinet is located, affecting the use and maintenance of other electronic equipment in the computer room.

[0046] See also Figure 3 , Figure 3 This is a schematic diagram of a cabinet provided as an example in an embodiment of the present application. It can be understood that Figure 3 The cabinet 300 is a half-section view of the three-view diagram of the cabinet. The cabinet 300 includes a top wall 301 and a bottom wall 302, and also includes a plurality of side walls (303-306); wherein the top wall 301 and the bottom wall 302 are arranged relative to each other, such as the top wall 301 and the bottom wall 302 are parallel to the ground, and the top wall 301 is higher than the bottom wall 302. The plurality of side walls are arranged between the top wall 301 and the bottom wall 302, and the plurality of side walls, the top wall 301 and the bottom wall 302 are enclosed to form a closed space, and the closed space is used to place the electronic device 310, and the electronic device 310 can be a server, etc., which is not specifically limited here.

[0047] Exemplarily, the plurality of side walls include Figure 3 The first side wall 303 corresponding to the front view of the middle cabinet 300, Figure 3 The second side wall 304 corresponding to the left view of the middle cabinet 300, Figure 3 The third side wall 305 corresponding to the rear view of the middle cabinet 300, Figure 3The fourth side wall 306 corresponding to the right view of the middle cabinet 300. The first side wall 303 and the third side wall 305 are arranged opposite to each other, the second side wall 304 and the fourth side wall 306 are arranged opposite to each other, the first side wall 303 is connected to the second side wall 304 and the fourth side wall 306 respectively, and the third side wall 305 is connected to the second side wall 304 and the fourth side wall 306. For any side wall, the side wall has a first end and a second end opposite to each other; wherein the first end of the side wall is connected to the bottom wall 302, and the second end of the side wall is connected to the top wall 301. See Figure 5 Taking the fourth side wall 306 as an example, the fourth side wall 306 includes a first end 306a and a second end 306b which are arranged opposite to each other; wherein the first end 306a is an end close to the bottom wall 302, and the second end 306b is an end close to the top wall 301. The first end 306a of the fourth side wall 306 is connected to the bottom wall 302, and the second end 306b of the fourth side wall 306 is connected to the top wall 301. Thus, a plurality of side walls, the top wall 301 and the bottom wall 302 are enclosed to form a closed space for placing the electronic device 310.

[0048] Further, at least one of the plurality of side walls has a first flow channel; taking the fourth side wall 306 as an example, see Figure 5 , Figure 5 A schematic diagram of a fourth side wall 306 is provided as an example in an embodiment of the present application, wherein the first flow channel 501 includes at least two first sub-flow channels 501a and at least one second sub-flow channel 501b. Exemplarily, the first sub-flow channel 501a is a straight flow channel in the first flow channel 501, and the number is 6; the second sub-flow channel 501b is a curved flow channel in the first flow channel 501, and the number is 5; the first sub-flow channel 501a is distributed in the side wall, and the second sub-flow channel 501b is used to connect adjacent first sub-flow channels 501a. The first flow channel 501 is used to circulate cooling medium to change the temperature of the side wall, thereby reducing the temperature difference between the side wall and the ambient temperature in the machine room.

[0049] See also Figure 6 , Figure 6 The front view of the fourth side wall 306 is provided as an example in the embodiment of the present application, wherein the first flow channel has a first liquid inlet 601 and a first liquid outlet 602, and the first liquid inlet and the first liquid outlet are respectively arranged at one end of the two first sub-flow channels (such as Figure 6 As shown, the first sub-channel 501a1 on the leftmost side and the first sub-channel 501a2 on the rightmost side are respectively arranged). The first liquid inlet 601 and the first liquid outlet 602 are used to be connected to the cold source device respectively, thereby realizing the connection between the first channel 501 and the cold source device, so as to establish a cooling medium loop between the cold source device and the first channel, and change the temperature of the side wall.

[0050] In some embodiments, multiple first flow channels may be formed by multiple partitions in the side wall, and correspondingly, the number of first liquid inlet 601 and first liquid outlet 602 may also be multiple. Figure 7 , Figure 7 A schematic diagram of a fourth side wall 306 is provided as an example for an embodiment of the present application, wherein the fourth side wall 306 includes three partitions, namely partition 701, partition 702 and partition 703. As shown in the figure, a first sub-channel 501a3 is formed between the left end of the fourth side wall 306 and the partition 701, and a first sub-channel 501a4 is formed between the partition 701 and the partition 702. A through hole 704 is provided at a position of the partition 701 near the second end 306b to achieve communication between the first sub-channel 501a3 and the first sub-channel 501a4, a first liquid inlet 601a is provided at one end of the first sub-channel 501a3 near the first end 306a, and a first liquid outlet 602a is provided at one end of the first sub-channel 501a4 near the first end 306a, thereby forming the first channel 501.

[0051] Similarly, a first sub-channel 502a1 is formed between the partition 702 and the partition 703, and a first sub-channel 502a2 is formed between the partition 703 and the right end of the fourth side wall 306 shown in the figure. A through hole 705 is provided at a position of the partition 703 near the second end 306b to achieve communication between the first sub-channel 502a1 and the first sub-channel 502a2. A first liquid inlet 601b is provided at one end of the first sub-channel 502a1 near the first end 306a, and a first liquid outlet 602b is provided at one end of the first sub-channel 502a2 near the first end 306a, thereby forming the first channel 502.

[0052] That is, the fourth side wall 306 has two first flow channels, namely the first flow channel 501 and the second flow channel 502. Correspondingly, the first flow channel 501 has a first liquid inlet 601a and a first liquid outlet 602a, and the first flow channel 502 has a first liquid inlet 601b and a first liquid outlet 602b, which is equivalent to the fourth side wall 306 having two pairs of first liquid inlets and first liquid outlets.

[0053] In some embodiments, the first liquid inlet and the first liquid outlet are respectively disposed at the same end of the side wall. For example, taking the fourth side wall 306 as an example, see Figure 4 and Figure 6 The first liquid inlet 601 and the first liquid outlet 602 of the fourth side wall 306 are respectively arranged Figure 4 In one possible embodiment, the first liquid inlet 601 and the first liquid outlet 602 of the fourth side wall 306 are respectively arranged at Figure 4In another possible embodiment, the first liquid inlet 601 of the fourth side wall 306 is at the first end 306a, and the first liquid outlet 602 is arranged at the second end 306b; In another possible embodiment, the first liquid inlet 601 of the fourth side wall 306 is at the second end 306b, and the first liquid outlet 602 is arranged at the first end 306a; In another possible embodiment, the first liquid inlet 601 and the first liquid outlet 602 of the fourth side wall 306 are arranged at the third end, see Figure 8 , the third end 306c is adjacent to the first end 306a and the second end 306b respectively. Based on the above description, the first flow channel can be a multi-channel aluminum profile or an aluminum plate embedded tube structure; the cooling medium can be a non-insulating liquid, such as a mixture of water and ethylene glycol, or an insulating liquid, such as a fluorinated liquid, which is not specifically limited here.

[0054] In some embodiments, the first flow channel 501 further includes a third sub-flow channel, see Fig. 9 The two ends of the third sub-channel 501c are connected to the first liquid inlet 601 and the first liquid outlet 602 respectively, so that at least two first sub-channels 501a, at least one second sub-channel 501b and the third sub-channel 501c are connected to form a closed-loop channel. Fig. 9 The fourth side wall 306 shown includes 6 first sub-channels 501a and 5 second sub-channels 501b. The 5 second sub-channels 501b connect the 6 first sub-channels 501a end to end. The leftmost first sub-channel 501a is provided with a first liquid inlet 601, and the rightmost first sub-channel 501a is provided with a first liquid outlet 602. Both ends of the third sub-channel 501c are respectively connected to the first liquid inlet 501 and the first liquid outlet 502, thereby forming a closed-loop channel.

[0055] Depend on Fig. 9It can be seen that the closed-loop flow channel formed by the first sub-flow channel 501a, the second sub-flow channel 501b and the third sub-flow channel 501c is equivalent to a closed-loop hollow tube, so the closed-loop hollow tube can adopt an oscillating heat pipe (OHP), also known as a pulsating heat pipe. Based on this, the cooling medium arranged in the closed-loop hollow tube can be a phase change working medium, such as water, methanol, acetone, fluorinated liquid or refrigerant. In practical applications, the third sub-flow channel 501c can be arranged in the bottom wall 302, and the bottom wall 302 is in thermal contact with the cold source device, so as to achieve indirect thermal contact between the third sub-flow channel 501c and the cold source device (such as contact through a thermal conductive adhesive). Because the third sub-channel 501c is in thermal contact with the cold source device, the third sub-channel 501c is the low-temperature section (also called the condensation end) in the closed-loop channel, and the second sub-channel 501b is the high-temperature section (also called the evaporation end) in the closed-loop channel. Therefore, the phase-change medium in the closed-loop channel can oscillate between the high-temperature end and the low-temperature end to achieve heat transfer, thereby changing the temperature of the side wall and reducing the temperature difference between the temperature of the side wall of the cabinet and the ambient temperature in the machine room. It can be understood that the third sub-channel 501c can also be in direct contact with the cold source device (such as contact by immersion liquid cooling), which is not specifically limited here.

[0056] Based on the above description, only one of the multiple side walls may have the first flow channel, or only some of the multiple side walls may have the first flow channel, or all of the multiple side walls may have the first flow channel. Fig.10 The four side walls of the cabinet each have two first flow channels to improve the cooling efficiency of the side walls, thereby improving the heat leakage effect of the cabinet.

[0057] In some embodiments, a heat-insulating layer is provided on the surface of the side wall to further prevent heat leakage from the cabinet. The surface of the side wall includes a first surface and a second surface, wherein the first surface faces away from the electronic device, i.e., the first surface is the side wall surface outside the enclosed space (also referred to as the outer surface); the first surface faces the electronic device, i.e., the second surface represents the side wall surface inside the enclosed space (also referred to as the inner surface). The heat-insulating layer may be provided only on the outer surface of the side wall, or only on the inner surface of the side wall, or on both the inner and outer surfaces of the side wall.

[0058] In some embodiments, the first liquid inlet of the first flow channel is provided with a flow rate controller, and the flow rate controller is used to control the flow rate of the cooling medium flowing through the first liquid inlet, thereby adjusting the temperature of the side wall and reducing the temperature difference between the side wall and the ambient temperature in the machine room. Based on this, in order to determine the temperature difference between the side wall and the ambient temperature in the machine room, a temperature detector can also be provided on the first surface of the side wall having the first flow channel, and the temperature detector is used to detect the first surface temperature of the side wall.

[0059] Based on the above description of the first flow channel in the side wall, similarly, the top wall has a second flow channel, and the bottom wall has a third flow channel. It can be understood that the second flow channel and the third flow channel are the same as the first flow channel, and the cooling medium flows through the second flow channel to change the temperature of the top wall 301; the cooling medium flows through the third flow channel to change the temperature of the bottom wall 302. The first flow channel has been described above, and the second and third flow channels will not be described in detail here.

[0060] Exemplarily, in order to simplify the connection relationship between the first flow channel, the second flow channel, the third flow channel and the cold source device, only the first flow channel can be connected to the cold source device, the second flow channel is connected to the first flow channel, or the third flow channel is connected to the first flow channel, or the first flow channel, the second flow channel, and the third flow channel are all connected to each other.

[0061] See also Fig.11 , Fig.11 A schematic diagram of a liquid cooling system is provided as an example of an embodiment of the present application, and the liquid cooling system includes the above-mentioned cabinet 300 and a cold source device 1100, wherein the cold source device 1100 includes a shell 1110 and a liquid cooling box 1120, a circulating pump 1130 and a radiator 1140 located in the shell 1110, and the liquid cooling box 1120 includes a liquid supply port 1121 and a liquid return port 1122. Based on the above description, the first liquid inlet of the first flow channel having a side wall is connected to one end of the circulating pump 1130, and the liquid supply port 1121 is connected to the other end of the circulating pump 1130, thereby realizing that the liquid supply port 1121 is connected to the first liquid inlet of the first flow channel through the circulating pump 1130, so that the circulating pump flows the cooling medium of the liquid cooling box 1120 to the first flow channel, thereby reducing the side wall temperature. It can be understood that the liquid supply port 1121 and the other end of the circulation pump 1130 can be connected through a hollow pipe; the first liquid inlet of the first flow channel and one end of the circulation pump 1130 can be connected through a multi-way joint and a hollow pipe, for example, one end of the circulation pump 1130 is connected to the two side walls respectively through a two-way joint. The hollow pipe can be made of non-metallic materials with low heat transfer coefficient, strong heat insulation and strong heat resistance to reduce heat leakage, and the material and shape of the hollow pipe are not specifically limited here.

[0062] Based on the above description, the first liquid outlet of the first flow channel is connected to one end of the radiator 1140, and the liquid return port 1122 is connected to the other end of the radiator 1140, so that the first liquid outlet of the first flow channel is connected to the liquid return port 1122 through the radiator 1140, so that the cooling medium flowing out of the first flow channel flows into the radiator 1140, and then the radiator 1140 cools the cooling medium flowing out, and the cooled cooling medium flows back to the liquid cooling box 1120. It can be understood that the liquid return port 1122 and the other end of the radiator 1140 can be connected through a hollow pipe; the first liquid outlet and one end of the radiator 1140 can be connected through a multi-way joint and a hollow pipe, for example, one end of the radiator 1140 is connected to the first liquid outlet of the first flow channel of the two side walls through a two-way joint, so as to realize the recycling of the cooling medium.

[0063] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A cabinet, characterized in that: The cabinet comprises a top wall, a bottom wall and a plurality of side walls; the top wall and the bottom wall are arranged opposite to each other, the plurality of side walls are arranged between the top wall and the bottom wall, and the plurality of side walls, the top wall and the bottom wall are enclosed to form a closed space, and the closed space is used to place electronic equipment; At least one of the multiple side walls has a first flow channel, and the first flow channel is used to circulate a cooling medium to change the temperature of the side wall; the first flow channel includes at least two first sub-flow channels and at least one second sub-flow channel, the at least two first sub-flow channels are distributed in the side wall, and the second sub-flow channel is used to connect adjacent first sub-flow channels.

2. The cabinet according to claim 1, characterized in that: The first flow channel is used to connect to a cold source device to change the temperature of the side wall.

3. The cabinet according to claim 2, characterized in that: The first flow channel has a first liquid inlet and a first liquid outlet, and the first liquid inlet and the first liquid outlet are respectively arranged in the two first sub-flow channels; The first liquid inlet and the first liquid outlet are used to be connected to a cold source device respectively, so as to establish a cooling medium loop between the cold source device and the first flow channel.

4. The cabinet according to claim 3, characterized in that: The side wall has a first end and a second end opposite to each other, the first end of the side wall is connected to the bottom wall, and the second end of the side wall is connected to the top wall; The first liquid inlet and the first liquid outlet are respectively disposed at the first end of the side wall.

5. The cabinet according to claim 3 or 4, characterized in that: The first liquid inlet is provided with a flow rate controller, and the flow rate controller is used to control the flow rate of the cooling medium flowing through the first liquid inlet.

6. The cabinet according to claim 2, characterized in that: The first flow channel has a first liquid inlet and a first liquid outlet, and the first liquid inlet and the first liquid outlet are respectively arranged in the two first sub-flow channels; The first flow channel also includes a third sub-flow channel, which is used for thermal contact with the cold source device; the two ends of the third sub-flow channel are respectively connected to the first liquid inlet and the first liquid outlet, so that at least two of the first sub-flow channels, at least one of the second sub-flow channels and the third sub-flow channel are connected to form a closed-loop flow channel.

7. The cabinet according to any one of claims 1 to 6, characterized in that: The multiple side walls include a first side wall, a second side wall, a third side wall and a fourth side wall; the first side wall and the third side wall are arranged opposite to each other, the second side wall and the fourth side wall are arranged opposite to each other, the first side wall is connected to the second side wall and the fourth side wall respectively, and the third side wall is connected to the second side wall and the fourth side wall respectively.

8. The cabinet according to any one of claims 1 to 7, characterized in that: A heat insulation layer is provided on the surface of the side wall.

9. The cabinet according to any one of claims 1 to 8, characterized in that: The side wall has a first surface and a second surface opposite to each other. The first surface of the side wall faces away from the electronic device. The first surface of the side wall having the first flow channel is provided with a temperature detector for detecting the temperature of the first surface of the side wall.

10. The cabinet according to any one of claims 1 to 9, characterized in that: The top wall has a second flow channel therein, and the second flow channel is used to circulate a cooling medium to change the temperature of the top wall; The bottom wall has a third flow channel therein, and the third flow channel is used to circulate a cooling medium to change the temperature of the bottom wall; The second flow channel is in communication with the first flow channel, or the third flow channel is in communication with the first flow channel, or the first flow channel, the second flow channel and the third flow channel are in communication with each other.

11. A liquid cooling system, characterized in that: Comprising a cold source device and a cabinet as claimed in any one of claims 1 to 10; The cold source device is connected to the first flow channel in the cabinet according to any one of claims 1-10.

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