Liquid-cooled heat dissipation device
By introducing puncture elements into the liquid-cooled heat dissipation device, the problem of air bubbles hindering flow is solved, and a more efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202311719690.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-09-27
- Filing Date
- 2023-12-14
- Publication Date
- 2025-03-28
AI Technical Summary
In existing two-phase liquid-cooled heat dissipation devices, bubbles generated by the heat of the liquid cooling fluid will hinder the flow and reduce the heat dissipation efficiency.
A liquid-cooled heat dissipation device is designed, including a thermal base, a thermal cover plate, a heat dissipation structure and a puncture element. The cooling fluid generates bubbles after transferring heat on the heat contact surface. The puncture element punctures the bubbles through its convex structure and disperses into small volume bubbles for easy discharge.
By dispersing the bubbles, the obstacles to the flow of cooling fluid are reduced, the pressure drop is reduced, and the heat dissipation efficiency is improved.
Smart Images
Figure CN119730137A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a liquid-cooled heat dissipation device, in particular to a liquid-cooled heat dissipation device with a piercing element. Background Art
[0002] With the rapid development of technology, the computing performance of various electronic components has also increased significantly, and a large amount of heat is also generated. In order to ensure that electronic components are not damaged by high heat, heat dissipation devices need to be installed on the electronic components to dissipate excess heat.
[0003] Electronic components are often cooled by a two-phase liquid cooling system to maintain their performance and service life. The so-called two-phase liquid cooling system refers to a liquid cooling system in which the liquid cooling fluid absorbs the heat generated by the electronic components and undergoes a phase change, causing the liquid cooling fluid to evaporate into a gaseous cooling fluid to generate bubbles and take away the heat generated by the electronic components. However, in current two-phase liquid cooling systems, bubbles generated by the heated liquid cooling fluid will hinder the flow of the liquid cooling fluid, affecting the transfer of heat and thereby reducing the heat dissipation efficiency. Therefore, how to further improve the heat dissipation efficiency of the two-phase liquid-cooled heat dissipation device is one of the problems that researchers should solve. Summary of the invention
[0004] The present invention provides a liquid cooling type heat dissipation device, so as to further improve the heat dissipation efficiency of the two-phase liquid cooling type heat dissipation device.
[0005] An embodiment of the present invention discloses a liquid cooling device, which includes:
[0006] A heat-conducting base, having a liquid storage space and a heat contact surface, the heat contact surface facing away from the liquid storage space, the liquid storage space containing a cooling fluid, the heat generated by a heat source is transferred to the cooling fluid in the liquid storage space through the heat contact surface, and the cooling fluid generates bubbles after absorbing the heat;
[0007] At least one puncture element is located in the liquid storage space, and the floating bubbles are punctured by the puncture element to discharge the liquid storage space.
[0008] The above-mentioned liquid-cooled heat dissipation device further includes: a heat-conducting cover plate, which is arranged on the heat-conducting base and covers the liquid storage space.
[0009] In the above-mentioned liquid-cooled heat dissipation device, each of the puncturing elements has a plurality of protruding structures, and the protruding structures face the thermal contact surface, and the bubbles are punctured by the protruding structures.
[0010] The above-mentioned liquid-cooled heat dissipation device further comprises a plurality of heat dissipation structures. The heat-conducting base has a bottom surface, which is located in the liquid storage space and faces away from the thermal contact surface. The heat dissipation structures protrude from the bottom surface.
[0011] The above-mentioned liquid-cooled heat dissipation device, wherein the bottom surface includes a first surface and two second surfaces, the two second surfaces are respectively connected to opposite sides of the first surface, and the first surface is closer to the thermal contact surface than the two second surfaces, and the heat dissipation structures protrude from the first surface.
[0012] In the above-mentioned liquid-cooled heat dissipation device, each of the heat dissipation structures is in the shape of a square column.
[0013] The above-mentioned liquid-cooled heat dissipation device, wherein the heat dissipation structures are divided into multiple groups, each group of heat dissipation structures includes multiple rows of the heat dissipation structures, the distance between any two adjacent heat dissipation structures in the groups is greater than the distance between any two adjacent heat dissipation structures in the same group, the number of the at least one piercing element is multiple and divided into multiple rows, and each row of the piercing elements corresponds to each group of the heat dissipation structures respectively.
[0014] In the above-mentioned liquid-cooled heat dissipation device, the distance between any two adjacent ones of the piercing elements in each row is greater than the distance between any two adjacent ones of the heat dissipation structures in each group.
[0015] The above-mentioned liquid-cooled heat dissipation device further comprises a plurality of columns, which protrude from the bottom surface and are respectively located in any two adjacent gaps of the heat dissipation structure groups.
[0016] In the above-mentioned liquid-cooled heat dissipation device, the height of each of the columns is higher than the height of each of the heat dissipation structures.
[0017] In the above-mentioned liquid-cooled heat dissipation device, the protruding structure portions of the at least one piercing element are overlapped on the heat dissipation structure portions.
[0018] In the above-mentioned liquid-cooled heat sink, the protruding structure is in the shape of a frustum or a cone.
[0019] In the above-mentioned liquid-cooled heat sink, the protruding structure is in the shape of a truncated pyramid or a pyramid.
[0020] In the above-mentioned liquid-cooled heat dissipation device, the at least one piercing element is copper foam.
[0021] In the above-mentioned liquid-cooled heat dissipation device, the at least one piercing element is sintered on the heat-conducting cover plate.
[0022] The above-mentioned liquid-cooled heat dissipation device further comprises a capillary structure, and the capillary structure is sintered on the bottom surface of the thermal conductive base.
[0023] In the above-mentioned liquid-cooled heat dissipation device, the heat-conducting cover plate has two inlets and outlets, and the two inlets and outlets are connected to the liquid storage space.
[0024] According to the liquid-cooled heat sink of the above embodiment, the cooling fluid will boil and generate bubbles after absorbing the heat transferred by the heat source, and as the operation time of the liquid-cooled heat sink increases, the bubbles will gradually accumulate and increase the volume of the bubbles, thereby hindering the flow of the cooling fluid and increasing the pressure drop, thereby reducing the heat dissipation efficiency. Therefore, by providing these puncturing elements in the liquid-cooled heat sink, after the large-volume bubbles float up, these puncturing elements can puncture the large-volume bubbles to disperse into multiple small-volume bubbles, so that the small-volume bubbles can be more easily discharged from the liquid storage space. In this way, the obstruction to the flow of the cooling fluid can be reduced without affecting the transfer of heat, so the heat dissipation efficiency can be improved.
[0025] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide a further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 Schematic diagram of a three-dimensional liquid cooling device according to a first embodiment of the present invention.
[0027] Figure 2 for Figure 1 Exploded diagram of the liquid cooling device.
[0028] Figure 3 for Figure 1 A partially enlarged exploded schematic diagram of a liquid-cooled heat dissipation device.
[0029] Figure 4 for Figure 1 A schematic cross-sectional view along the cutting line 4-4 of the liquid-cooled heat dissipation device.
[0030] Figure 5 for Figure 1 A schematic cross-sectional view along the cutting line 5-5 of the liquid-cooled heat dissipation device.
[0031] Figure 6 for Figure 1 A partially enlarged cross-sectional schematic diagram along the cutting line 5-5 of the liquid-cooled heat dissipation device.
[0032] Figure 7 for Figure 1 A cross-sectional schematic diagram of bubbles generated in the liquid storage space of a liquid-cooled heat sink.
[0033] Figure 8 for Figure 1 A cross-sectional schematic diagram of a puncturing element puncturing an air bubble in a liquid storage space of a liquid-cooled heat sink.
[0034] Fig. 9 FIG. 4 is a perspective schematic diagram of a liquid-cooled heat dissipation device according to a second embodiment of the present invention.
[0035] Fig.10 for Fig. 9 Exploded diagram of the liquid cooling device.
[0036] Fig.11 for Fig. 9 A partially enlarged exploded schematic diagram of a liquid-cooled heat dissipation device.
[0037] Fig.12 for Fig. 9 A schematic cross-sectional view along the cutting line 12-12 of the liquid-cooled heat dissipation device.
[0038] Fig.13 for Fig. 9 A partially enlarged cross-sectional schematic diagram of a liquid-cooled heat dissipation device.
[0039] Fig.14 It is a partially enlarged exploded schematic diagram of a liquid-cooled heat dissipation device according to a third embodiment of the present invention.
[0040] Fig.15 for Fig.14 A cross-sectional schematic diagram of a liquid-cooled heat dissipation device.
[0041] Fig.16 for Fig.14 A partially enlarged cross-sectional schematic diagram of a liquid-cooled heat dissipation device.
[0042] Wherein, the reference numerals are:
[0043] 10,10B,10C: Liquid cooling device
[0044] 11: Thermal base
[0045] 111: Liquid storage space
[0046] 112: Thermal contact surface
[0047] 113: Bottom surface
[0048] 1131: First face
[0049] 1132: Second face
[0050] 12,12B,12C: Thermal cover
[0051] 121,121C: Plate
[0052] 122: Inlet and outlet pipes
[0053] 1221: Entrance and Exit
[0054] 13,13B,13C: Heat dissipation structure
[0055] 13A, 13B1, 13C1: heat dissipation structure
[0056] 13A1: Heat dissipation structure
[0057] 14,14B,14C:Puncture element
[0058] 141,141B,141C: protruding structure
[0059] 15,15B,15C: Column
[0060] 16,16C: Capillary structure
[0061] 20: Bubbles
[0062] 30: Assemble components
[0063] A: Direction
[0064] D1~D4: Spacing
[0065] H: Heat source
[0066] H1,H2: Height
[0067] L: Cooling fluid DETAILED DESCRIPTION
[0068] See also Figures 1 to 3 . Figure 1 It is a three-dimensional schematic diagram of a liquid-cooled heat dissipation device according to an embodiment of the present invention. Figure 2 for Figure 1 Exploded diagram of the liquid cooling device. Figure 3 for Figure 1 A partially enlarged exploded schematic diagram of a liquid-cooled heat dissipation device.
[0069] The liquid cooling heat dissipation device 10 of this embodiment is, for example, a water cooling plate, and can be fixed to an electronic device (not shown) by, for example, an assembly element 30. The liquid cooling heat dissipation device 10 includes a heat conductive base 11, a heat conductive cover plate 12, a plurality of heat dissipation structures 13, and a plurality of piercing elements 14. Figure 4 . Figure 4 for Figure 1 Schematic cross-sectional view of the liquid cooling heat dissipation device along the cutting line 4-4. The heat conductive base 11 has a liquid storage space 111, a thermal contact surface 112 and a bottom surface 113. The liquid storage space 111 is used to store a cooling fluid (not shown). The cooling fluid is, for example, a refrigerant or water.
[0070] The thermal contact surface 112 faces away from the liquid storage space 111. The thermal contact surface 112 is used to thermally contact with a heat source (not shown) or connect via other heat-conducting media, and transfer the heat generated by the heat source to the cooling fluid in the liquid storage space 111. The bottom surface 113 is located in the liquid storage space 111 and faces away from the thermal contact surface 112.
[0071] The heat-conducting cover plate 12 is disposed on the heat-conducting base 11 by, for example, brazing, and covers the liquid storage space 111. The heat-conducting cover plate 12 includes a plate body 121 and two inlet and outlet pipes 122. The two inlet and outlet pipes 122 are connected to the plate body 121 by, for example, brazing. The two inlet and outlet pipes 122 have two inlets and outlets 1221. The two inlets and outlets 1221 are connected to the liquid storage space 111, and are used for the cooling fluid to flow into and out of the liquid storage space 111.
[0072] These heat dissipation structures 13 are, for example, heat-conducting protrusions, and are, for example, formed by milling and, for example, in the shape of square columns. These heat dissipation structures 13 protrude from the bottom surface 113. In detail, the bottom surface 113 includes a first surface 1131 and two second surfaces 1132. The two second surfaces 1132 are respectively connected to opposite sides of the first surface 1131, and the first surface 1131 is closer to the thermal contact surface 112 than the two second surfaces 1132. These heat dissipation structures 13 protrude from the first surface 1131. The two second surfaces 1132 correspond to the two inlets and outlets 1221, respectively.
[0073] Please also read Figure 5 and Figure 6 . Figure 5 for Figure 1 A schematic cross-sectional view along the cutting line 5-5 of the liquid-cooled heat dissipation device. Figure 6 for Figure 1 A partially enlarged cross-sectional schematic diagram along the cutting line 5-5 of the liquid-cooled heat dissipation device.
[0074] The distance between the center of each heat dissipation structure 13 and the center of another heat dissipation structure 13 adjacent thereto is, for example, 0.75 mm, and these heat dissipation structures 13 are divided into multiple groups. Each group of heat dissipation structures 13A includes multiple rows of heat dissipation structures 13A1. The spacing D1 between any two adjacent heat dissipation structures 13A1 in these groups is greater than the spacing D2 between any two adjacent heat dissipation structures 13A1 in the same group. In other words, the arrangement of the heat dissipation structures 13A1 in the same group is closer than that of the heat dissipation structures 13A in these groups.
[0075] The piercing elements 14 are, for example, copper blocks, and are, for example, integrally formed with the heat-conducting cover plate 12. The piercing elements 14 are used to pierce bubbles (not shown) generated by the cooling fluid after being heated. The piercing elements 14 are located in the liquid storage space 111, and are, for example, sintered to the heat-conducting cover plate 12. The piercing elements 14 are divided into multiple rows, and the piercing elements 14 in each row correspond to each group of the heat dissipation structures 13.
[0076] The distance D3 between any two adjacent piercing elements 14 in each row is greater than the distance D4 between any two adjacent piercing elements 14 in each group. In other words, the arrangement of the piercing elements 14 is more dispersed than the arrangement of the piercing elements 13. The distance D2 between any two adjacent piercing elements 14 in the row of piercing elements 13A1 and the distance D4 between any two adjacent piercing elements 14 in each group are, for example, the same.
[0077] The piercing elements 14 have a plurality of protruding structures 141. The protruding structures 141 are, for example, quadrangular pyramidal in shape and face the thermal contact surface 112. In other words, a surface of the protruding structures 141 away from the heat-conducting cover plate 12 faces the thermal contact surface 112. Parts of the protruding structures 141 are overlapped with parts of the heat dissipation structures 13.
[0078] In this embodiment, the cooling fluid will boil and generate bubbles after absorbing the heat transferred by the heat source, and the bubbles will hinder the flow of the cooling fluid and increase the pressure drop, thereby reducing the heat dissipation efficiency. Therefore, the advantage of the liquid-cooled heat sink 10 being provided with these piercing elements 14 is that after the bubbles are generated, these piercing elements 14 can pierce the bubbles to disperse the vapor in the bubbles, so that the vapor can be more easily discharged from the liquid storage space 111. In this way, the obstruction to the flow of the cooling fluid can be reduced without affecting the transfer of heat, thereby improving the heat dissipation efficiency.
[0079] In this embodiment, the liquid-cooled heat sink 10 may further include a plurality of columns 15. These columns 15 are, for example, in the shape of square columns. These columns 15 protrude from the bottom surface 113 and are respectively located in any two adjacent gaps of these heat dissipation structures 13A. The height H1 of each column 15 is, for example, higher than the height H2 of each heat dissipation structure 13. These columns 15 are used to further expand the liquid storage space 111 so that there is enough space for the cooling fluid and the steam to flow.
[0080] In this embodiment, the liquid cooling heat sink 10 may further include a capillary structure 16. The capillary structure 16 is, for example, a copper mesh, and is sintered on the bottom surface 113 of the thermal conductive base 11. Since the holes of the capillary structure 16 are easy to become boiling nucleation points, only a lower superheat temperature is required to make the cooling fluid boil, so the thermal resistance can be further reduced.
[0081] In this embodiment, the heat dissipation structures 13 are formed by milling, but the present invention is not limited thereto. In other embodiments, the heat dissipation structures can also be formed by laser cutting, for example.
[0082] In this embodiment, there are multiple piercing elements 14, and the piercing elements 14 are dispersedly arranged on the heat conductive cover plate 12, but the present invention is not limited thereto. In other embodiments, there may be only one piercing element, and the heat dissipation structures are located within the first surface of the bottom surface projected by the piercing elements.
[0083] In this embodiment, the protruding structures 141 of the piercing elements 14 are in the shape of quadrangular pyramids, but the present invention is not limited thereto. In other embodiments, the protruding structures of the piercing elements may also be in the shape of polygonal pyramids, polygonal truncated pyramids, cones or truncated pyramids.
[0084] In this embodiment, the spacing D2 between any two adjacent heat dissipation structures 13A1 in these rows is the same as the spacing D4 between any two adjacent heat dissipation structures 13 in each group, but the present invention is not limited thereto. In other embodiments, the spacing between any two adjacent heat dissipation structures in these rows is different from the spacing between any two adjacent heat dissipation structures in each group.
[0085] In this embodiment, the capillary structure 16 is a copper mesh, but the invention is not limited thereto. In other embodiments, the capillary structure may also be, for example, a fiber or a powder sintered body.
[0086] See also Figure 7 and Figure 8 . Figure 7 for Figure 1 A cross-sectional schematic diagram of bubbles generated in the liquid storage space of a liquid-cooled heat sink. Figure 8 for Figure 1 A cross-sectional schematic diagram of a puncturing element puncturing an air bubble in a liquid storage space 111 of a liquid-cooled heat sink.
[0087] like Figure 7 As shown, the liquid-cooled heat sink 10 is thermally coupled to a heat source H, and the heat generated by the heat source H is transferred to the cooling fluid L through the thermal contact surface 112. When the cooling fluid L is heated, a plurality of bubbles 20 are generated. As the operation time of the liquid-cooled heat sink 10 increases, the bubbles 20 are accumulated, and the volume of the bubbles 20 gradually increases, and the bubbles 20 float upward along the direction A due to buoyancy. Figure 8As shown, when these large-volume bubbles 20 float upward along direction A and touch the protruding structures 141 of the piercing elements 14, the protruding structures 141 will pierce these large-volume bubbles 20, so that these large-volume bubbles 20 are dispersed into a plurality of small-volume bubbles 20. In this way, the vapor in these small-volume bubbles 20 can be easily discharged from the liquid storage space 111, so as to reduce the obstruction caused by these bubbles 20 to the flow of the cooling fluid L, thereby reducing the pressure drop and improving the heat dissipation efficiency.
[0088] See also Figures 9 to 11 . Fig. 9 FIG. 4 is a perspective schematic diagram of a liquid-cooled heat dissipation device according to a second embodiment of the present invention. Fig.10 for Fig. 9 Exploded diagram of the liquid cooling device. Fig.11 for Fig. 9 A partially enlarged exploded schematic diagram of a liquid-cooled heat dissipation device.
[0089] The liquid-cooled heat sink 10B of this embodiment is similar to the liquid-cooled heat sink 10 of the first embodiment, so the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. The liquid-cooled heat sink 10B of this embodiment can be fixed to an electronic device through an assembly element 30, for example, and includes a heat-conducting base 11, a heat-conducting cover plate 12B, a plurality of heat dissipation structures 13B, and a plurality of piercing elements 14B.
[0090] Please also read Fig.12 and Fig.13 . Fig.12 for Fig. 9 A schematic cross-sectional view along the cutting line 12-12 of the liquid-cooled heat dissipation device. Fig.13 for Fig. 9 A partially enlarged cross-sectional schematic diagram of a liquid-cooled heat dissipation device.
[0091] The heat-conducting base 11 has a liquid storage space 111, a heat contact surface 112 and a bottom surface 113. The heat contact surface 112 faces away from the liquid storage space 111. The bottom surface 113 is located in the liquid storage space 111 and faces away from the heat contact surface 112. The heat-conducting cover plate 12B is disposed on the heat-conducting base 11 and covers the liquid storage space 111.
[0092] The distance between the center of each heat dissipation structure 13B and the center of another heat dissipation structure 13B adjacent thereto is, for example, 0.75 mm. These heat dissipation structures 13B protrude from the bottom surface 113 and are, for example, cylindrical. These heat dissipation structures 13B are divided into a plurality of heat dissipation structure groups 13B1. These piercing elements 14B are, for example, copper blocks and are, for example, integrally formed with the heat conductive cover plate 12B. These piercing elements 14B have a plurality of protruding structures 141B, and these protruding structures 141B of these piercing elements 14B are, for example, in the shape of quadrangular pyramids. These protruding structures 141B are separated from these heat dissipation structures 13B.
[0093] In this embodiment, the liquid-cooled heat sink 10B may further include a plurality of columns 15B. The columns 15B are, for example, cylindrical. The columns 15B protrude from the bottom surface 113 and are respectively located in any two adjacent gaps of the heat sink structures 13B1. In addition, the liquid-cooled heat sink 10B does not include a capillary structure.
[0094] See also Figures 14 to 16 . Fig.14 It is a partially enlarged exploded schematic diagram of a liquid-cooled heat dissipation device according to a third embodiment of the present invention. Fig.15 for Fig.14 A cross-sectional schematic diagram of a liquid-cooled heat dissipation device. Fig.16 for Fig.14 A partially enlarged cross-sectional schematic diagram of a liquid-cooled heat dissipation device.
[0095] The liquid-cooled heat sink 10C of this embodiment is similar to the liquid-cooled heat sink 10B of the second embodiment, so the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the liquid-cooled heat sink 10C is provided with a capillary structure 16C. The capillary structure 16C is, for example, a copper mesh, and is sintered on the bottom surface 113 of the heat-conducting base 11 of the liquid-cooled heat sink 10C. In addition, the distance between the center of each heat sink 13C and the center of another heat sink 13C adjacent thereto is, for example, 1 mm.
[0096] According to the liquid-cooled heat sink of the above embodiment, the cooling fluid will boil and generate bubbles after absorbing the heat transferred by the heat source, and as the operation time of the liquid-cooled heat sink increases, the bubbles will gradually accumulate and increase the volume of the bubbles, thereby hindering the flow of the cooling fluid and increasing the pressure drop, thereby reducing the heat dissipation efficiency. Therefore, by providing these puncturing elements in the liquid-cooled heat sink, after the large-volume bubbles float up, these puncturing elements can puncture the large-volume bubbles to disperse into multiple small-volume bubbles, so that the small-volume bubbles can be more easily discharged from the liquid storage space. In this way, the obstruction to the flow of the cooling fluid can be reduced without affecting the transfer of heat, so the heat dissipation efficiency can be improved.
[0097] Although the present invention is disclosed as above by the aforementioned embodiments, it is not intended to limit the present invention. Any relevant technician familiar with the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the protection scope of the claims attached to the present invention.
Claims
1. A liquid cooling heat dissipation device, characterized in that: Include: A heat-conducting base, having a liquid storage space and a heat contact surface, the heat contact surface facing away from the liquid storage space, the liquid storage space containing a cooling fluid, the heat generated by a heat source is transferred to the cooling fluid in the liquid storage space through the heat contact surface, and the cooling fluid generates bubbles after absorbing the heat; At least one puncture element is located in the liquid storage space, and the floating bubbles are punctured by the puncture element to discharge the liquid storage space.
2. The liquid cooling heat dissipation device according to claim 1, characterized in that: Also includes: A heat-conducting cover plate is arranged on the heat-conducting base and covers the liquid storage space.
3. The liquid cooling heat dissipation device according to claim 2, characterized in that: Each of the puncturing elements has a plurality of protruding structures, which face the thermal contact surface and puncture the bubble through the protruding structures.
4. The liquid cooling heat dissipation device according to claim 3, characterized in that: It further comprises a plurality of heat dissipation structures. The heat conductive base has a bottom surface, which is located in the liquid storage space and faces away from the thermal contact surface. The heat dissipation structures protrude from the bottom surface.
5. The liquid cooling heat dissipation device according to claim 4, characterized in that: The bottom surface includes a first surface and two second surfaces. The two second surfaces are respectively connected to opposite sides of the first surface. The first surface is closer to the thermal contact surface than the two second surfaces. The heat dissipation structures protrude from the first surface.
6. The liquid cooling heat dissipation device according to claim 4, characterized in that: Each of the heat dissipation structures is in a square column shape.
7. The liquid cooling heat dissipation device according to claim 4, characterized in that: The heat dissipation structures are divided into multiple groups, each group of heat dissipation structures includes multiple rows of the heat dissipation structures, and the distance between any two adjacent heat dissipation structures in the groups is greater than the distance between any two adjacent heat dissipation structures in the same group. The number of the at least one piercing element is multiple and divided into multiple rows, and the piercing elements in each row correspond to each group of the heat dissipation structures.
8. The liquid cooling heat dissipation device according to claim 7, characterized in that: The distance between any two adjacent piercing elements in each row is greater than the distance between any two adjacent heat dissipation structures in each group.
9. The liquid cooling heat dissipation device according to claim 7, characterized in that: It further comprises a plurality of columns, which protrude from the bottom surface and are respectively located in any two adjacent gaps of the heat dissipation structure groups.
10. The liquid cooling heat dissipation device according to claim 9, characterized in that: The height of each of the columns is higher than the height of each of the heat dissipation structures.
11. The liquid cooling heat dissipation device according to claim 4, characterized in that: The protruding structures of the at least one piercing element are overlapped on the heat dissipation structures.
12. The liquid cooling heat dissipation device according to claim 3, characterized in that: The protruding structure is in a frustum shape or a cone shape.
13. The liquid cooling heat dissipation device according to claim 12, characterized in that: The protruding structure is in a truncated pyramid shape or a pyramid shape.
14. The liquid cooling heat dissipation device according to claim 2, characterized in that: The at least one piercing element is copper foam.
15. The liquid cooling heat dissipation device according to claim 14, characterized in that: The at least one piercing element is sintered on the heat-conducting cover plate.
16. The liquid cooling heat dissipation device according to claim 4, characterized in that: The invention further comprises a capillary structure which is sintered on the bottom surface of the thermal conductive base.
17. The liquid cooling heat dissipation device according to claim 2, characterized in that: The heat-conducting cover plate has two inlets and outlets, and the two inlets and outlets are communicated with the liquid storage space.