Near space thermal management device and control method

Abstract

The invention discloses a near space thermal management device and a control method, and belongs to the field of near space thermal management, and the near space thermal management device comprises electronic equipment, a heat conduction diffusion structure, a radiation structure, a radiation film material, a thermal switch, a phase change module, a resistance wire, a fan, a controller and a temperature sensor. The high-efficiency controllable heat management device for the near space floating platform integrates radiation cooling / heating, phase change heat absorption / heat release, air cooling heat dissipation and electric heating, the double requirements of heat dissipation and heat preservation are met, and the heat management problem of electronic equipment in the near space changeable environment can be solved.

Description

Technical Field

[0001] The present invention relates to the technical field of near-space thermal management, and more specifically, to a near-space thermal management device and a control method. Background Art

[0002] Near-space is suitable for large floating platforms to stay in the air for a long time and fly at a fixed point due to its altitude of 20km, low relative wind speed and stable wind direction. The observation radius of floating platforms for ground targets is 500km, which is an important supplement and improvement of satellites and aircraft in terms of time and space. In view of the particularity of the stratospheric environment, there are "three lows and one high" (low temperature -56℃, low pressure 5500Pa, low density 0.089kg / m 3 , high radiation 1260W / m 2 ) characteristics, and the resulting overheating and overcooling problems directly affect the safety and reliability of electronic equipment. As the power consumption of equipment increases, the thermal management problem of the platform becomes increasingly prominent.

[0003] Currently, among the publicly available prior art, there are few studies on thermal management technologies for near-space, and they are mainly based on air cooling and traditional radiation heat dissipation, which show the characteristics of only focusing on heat dissipation and failing to achieve heat preservation, and passive heat dissipation and poor heat dissipation effect, which are far from the actual needs. For example, invention patent CN101730436A proposes a convection radiation heat dissipation system for temperature control of electronic equipment of near-space aircraft, which dissipates heat for electronic equipment in near-space by means of radiation heat dissipation, but has the disadvantages of weak heat dissipation performance regulation ability and no heat preservation means. Similarly, invention patent CN101730437A proposes a heat dissipation system for temperature control of electronic equipment of near-space aircraft, which ultimately takes away the heat loss of electronic equipment through a combination of fans and heat dissipation, and has defects similar to those of the previous patent application. Based on this, it is necessary to carry out research on controllable thermal management solutions with dual functions of heat dissipation and heat preservation suitable for near-space. Summary of the invention

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide a near-space thermal management device and a control method, which can solve the thermal management problem of electronic equipment in the variable environment of near-space.

[0005] The object of the present invention is achieved through the following solutions:

[0006] A near-space thermal management device, characterized by comprising:

[0007] Electronic equipment, thermal diffusion structures, radiation structures, radiation film materials, thermal switches, phase change modules, resistance wires, fans, controllers and temperature sensors;

[0008] Electronic equipment is the main functional equipment, and a complete set of thermal management devices is required to provide heat dissipation or heat preservation functions according to needs;

[0009] The heat-conducting diffusion structure is used to transfer heat between the electronic device and the radiating structure;

[0010] The radiation structure and the radiation film material constitute a radiation heat exchange unit. The radiation structure is used to expand the radiation heat exchange area, and the radiation film material is used to adjust the radiation characteristics of the radiation heat exchange surface.

[0011] The thermal switch is used to control whether the phase change module, fan and resistance wire are involved in the thermal management process;

[0012] The phase change module is used to absorb or release heat, and adaptively switches the working state of absorbing and releasing heat according to the needs of electronic equipment;

[0013] The resistance wire is used to enhance the thermal insulation capacity and make up for the lack of thermal insulation capacity when the radiation heating and phase change heat release cannot meet the thermal insulation requirements;

[0014] The fan is used to enhance the heat dissipation capacity and make up for the lack of heat dissipation capacity when radiation cooling and phase change heat absorption cannot meet the heat dissipation requirements; when the heat dissipation capacity meets the requirements, the fan does not intervene in the system operation;

[0015] The controller has input and output functions. The input function is used to collect equipment status information in the device; the output function is used to control the adjustable parameters of the thermal management system and adjust the working mode and performance of the device.

[0016] Furthermore, the heat conduction and diffusion structure includes an aluminum plate, a copper plate, a heat pipe, a heat spreader, and a combination thereof.

[0017] Furthermore, the radiation film material includes a dynamic radiation film material.

[0018] Furthermore, the dynamic radiation film material, in a default state with no electrical excitation signal input, has an absorptivity of ≤0.1 in the infrared band of 0.3-2.5μm and an emissivity of ≥0.9 in the atmospheric transmission band of 8-13μm; when an electrical excitation signal is input, the absorptivity of the material in the infrared band of 0.3-2.5μm is ≥0.9, and the emissivity in the atmospheric transmission band of 8-13μm is ≤0.1.

[0019] Furthermore, the thermal switch specifically comprises a material with controllable thermal conductivity, and the thermal switch has high thermal conductivity and low thermal conductivity characteristics in an on state and a off state respectively, and the on / off ratio is ≥50.

[0020] Furthermore, the phase change latent heat of the phase change module is ≥200 kJ / kg, and the phase change temperature is required to be close to the optimal operating temperature of the electronic device 1 within the range of engineering experience.

[0021] Furthermore, the air cooling and heat dissipation capacity of the fan is dynamically adjusted by adjusting the fan speed.

[0022] Furthermore, the device status information includes the heating power and temperature of the electronic device at the next moment.

[0023] Furthermore, the adjustable parameters of the thermal management system include an electrical excitation signal of the radiation film material, an on / off signal of a thermal switch, a fan speed signal, and a resistance wire heating power signal.

[0024] A near-space thermal management method, based on the near-space thermal management device as described in any one of the above items, comprises the following steps:

[0025] S1. Preset parameters: According to the actual situation of the electronic equipment, set the maximum heating power Q0 of the electronic equipment, the optimal working temperature T0 of the electronic equipment, and the maximum working temperature T max , Minimum operating temperature of electronic equipment T min ;

[0026] S2. Obtain system status parameters: obtain the real-time heating power Q1 of the electronic device, and read the real-time temperature T1 of the electronic device through the temperature sensor;

[0027] S3, determination of heat dissipation and heat preservation working mode:

[0028] a) If T1 ≥ T0, the thermal management device enters the heat dissipation working mode;

[0029] b) If T1<T0, the thermal management device enters the insulation working mode;

[0030] S4. Determination of specific working mode:

[0031] a) In heat dissipation working mode:

[0032] 1) If T0≤T1≤a1T max -Q1 / A, the thermal management device enters the pure radiation cooling mode;

[0033] 2) If a1T max -Q1 / A<T1≤a2T max -Q1 / A, the thermal management device enters the radiation cooling + phase change heat absorption and heat dissipation working mode;

[0034] 3) If a2T max -Q1 / A<T1≤T max , the thermal management device enters the radiation cooling, phase change heat absorption and air cooling working mode; in this working mode, the fan speed is controlled according to the change of T1, the fan speed is increased when the control temperature rises, and the fan speed is reduced when the control temperature drops, so as to maintain the temperature stable within the range;

[0035] b) In the insulation working mode:

[0036] 1) If b1T min +Q1 / A≤T1<T0, the thermal management device enters the pure radiation heating and heat preservation working mode;

[0037] 2) If b2T min +Q1 / A≤T1<b1T min +Q1 / A, the thermal management device enters the radiation heating + phase change heat release and heat preservation working mode;

[0038] 3) If T min ≤T1<b1T min +Q1 / A, the thermal management device enters the radiation heating, phase change heat release and electric heating insulation working mode; in this working mode, the electric heating power is controlled according to the change of T1. When the control temperature rises, the heating power is reduced. When the control temperature drops, the heating power is increased to maintain the temperature stable within the range.

[0039] S5. End the control process of the near-space thermal management device.

[0040] Further, in step S4, a2>a1, b2>b1, and a2, a1, b2, b1∈(0, 1].

[0041] Further, in step S4, A is a heat capacity parameter related to the device, which increases with the increase of the heat capacity of the device itself and is determined according to actual conditions.

[0042] The beneficial effects of the present invention include:

[0043] In response to the overheating and overcooling problems faced by electronic equipment on near-space floating platforms, the present invention proposes a highly efficient and controllable thermal management device that is mainly passive and supplemented by active, integrating radiation cooling / heating, phase change heat absorption / exothermicity, air cooling and heat dissipation, and electric heating. The device collects the temperatures of key nodes in the device through a controller, controls parameters such as the properties of radiation refrigeration materials, the state of thermal switches, the speed of the fan, and the electric heating power, so that the heat dissipation or thermal insulation performance matches the real-time demand, and the electronic equipment operates in an appropriate temperature range, thereby supporting the long-term and stable operation of the electronic equipment on near-space floating platforms.

[0044] The present invention proposes a highly efficient and controllable thermal management device for a near-space floating platform that integrates radiation cooling / heating, phase change heat absorption / release, air cooling and electric heating, taking into account the dual needs of heat dissipation and thermal insulation, and can solve the thermal management problems of electronic equipment in the changeable environment of near-space.

[0045] The present invention introduces a dynamic radiation film material, and the emissivity and absorptivity of the dynamic radiation film material can be adjusted according to actual heat dissipation or heat preservation requirements, thereby dynamically adjusting the cooling or heating effect.

[0046] The present invention introduces a thermal switch to control whether the phase change module, the fan and the resistance wire are involved in the thermal management process, and can dynamically match the heat dissipation and heat preservation requirements of the electronic equipment in real time according to the requirements.

[0047] The present invention proposes a control strategy for a thermal management device, which can adjust the device working mode according to the device status to achieve real-time matching of the heat dissipation and insulation requirements of the electronic equipment, thereby maintaining the equipment working within an appropriate temperature range and having strong adjustment and control capabilities. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0049] Figure 1 This is a schematic diagram of a near-space thermal management device according to an embodiment of the present invention;

[0050] Figure 2 A control strategy flow chart of a near-space thermal management device according to an embodiment of the present invention;

[0051] In the figure, 1-electronic device, 2-heat conduction diffusion structure, 3-radiation structure, 4-radiation film material, 5-thermal switch, 6-phase change module, 7-resistance wire, 8-fan, 9-controller, 10-temperature sensor. DETAILED DESCRIPTION

[0052] All features disclosed in all embodiments in this specification, or steps in all methods or processes implicitly disclosed, except for mutually exclusive features and / or steps, can be combined and / or expanded or replaced in any manner.

[0053] The specific implementation process of the present invention is as follows:

[0054] The present invention provides a near-space thermal management device, such as Figure 1 As shown, the device includes an electronic device 1, a heat-conducting diffusion structure 2, a radiation structure 3, a radiation film material 4, a thermal switch 5, a phase change module 6, a resistance wire 7, a fan 8, a controller 9 and a temperature sensor 10.

[0055] Among them, the electronic device 1 is a main functional device, which requires a complete set of thermal management devices to provide heat dissipation or heat preservation functions according to needs.

[0056] The heat-conducting diffusion structure 2 transfers heat between the electronic device and the radiation structure, and can be one of a variety of efficient heat-conducting structures such as an aluminum plate, a copper plate, a heat pipe, a heat spreader, or a combination of the above.

[0057] The radiation structure 3 and the radiation film material 4 form a radiation heat exchange unit. The radiation structure 3 plays a role in expanding the radiation heat exchange area, and the radiation film material 4 plays a role in regulating the radiation characteristics of the radiation heat exchange surface.

[0058] Among them, the radiation film material 4 is a dynamic radiation film material (electrochromic), that is, when the electric excitation signal input is changed, the absorptivity and emissivity of the material will change. In particular, in the default state without the input of the electric excitation signal, the absorptivity of the material in the infrared band (0.3-2.5μm) is ≤0.1, and the emissivity in the atmospheric transmission band (8-13μm) is ≥0.9; when the electric excitation signal is input, the absorptivity of the material in the infrared band (0.3-2.5μm) is ≥0.9, and the emissivity in the atmospheric transmission band (8-13μm) is ≤0.1.

[0059] Among them, the function of the thermal switch 5 is to control whether the phase change module 6, the fan 8 and the resistance wire 7 intervene in the thermal management process. It is a special material with controllable thermal conductivity. The thermal switch has high thermal conductivity and low thermal conductivity characteristics in the on and off states respectively, and the switch ratio is ≥50.

[0060] The phase change module 6 has the functions of absorbing and releasing heat, and can adaptively switch between the absorbing and releasing heat working states according to the needs of the electronic device. Its phase change latent heat is ≥ 200 kJ / kg, and the phase change temperature requirement is close to the optimal operating temperature of the electronic device 1.

[0061] The function of the resistance wire 7 is to enhance the thermal insulation capacity, mainly to make up for the lack of thermal insulation capacity when the radiation heating and phase change heat release cannot meet the thermal insulation requirements.

[0062] The function of the fan 8 is to enhance the heat dissipation capacity, mainly to make up for the lack of heat dissipation capacity when radiation cooling and phase change heat absorption cannot meet the heat dissipation requirements. The air cooling heat dissipation capacity can be dynamically adjusted by adjusting the fan speed. In addition, when the heat dissipation capacity meets the requirements, the fan does not intervene in the system operation.

[0063] The controller 9 has input and output functions. The input function is used to collect the device status information in the device, including the heating power and temperature of the electronic equipment at the next moment. The output function is used to control the adjustable parameters of the thermal management system and adjust the working mode and performance of the device, including the electrical excitation signal of the radiation film material, the on / off signal of the thermal switch, the fan speed signal and the resistance wire heating power signal.

[0064] The device has two working modes: heat dissipation and heat preservation.

[0065] The heat dissipation working mode adjusts the combination of heat dissipation components according to the differences in external environment and internal needs. It can be divided into three heat dissipation modes: pure radiation cooling, radiation cooling + phase change heat absorption, radiation cooling + phase change heat absorption + air cooling, which correspond to low-power heat dissipation requirements, medium-power heat dissipation requirements, and high-power heat dissipation requirements. Among them, the pure radiation cooling heat dissipation mode is switched to the radiation cooling + phase change heat absorption heat dissipation mode, which is achieved by controlling the thermal switch from off to on by the controller. The radiation cooling + phase change heat absorption heat dissipation mode is switched to the radiation cooling + phase change heat absorption + air cooling heat dissipation mode, which is achieved by controlling the fan to turn on by the controller.

[0066] The insulation working mode adjusts the combination of heat dissipation components according to the differences in external environment and internal needs. It can be divided into three insulation modes: pure radiation heating, radiation heating + phase change heat release, radiation heating + phase change heat release + electric heating. They correspond to low-power insulation requirements, medium-power insulation requirements, and high-power insulation requirements, respectively. Among them, the pure radiation heating insulation mode is switched to the radiation heating + phase change heat release insulation mode, which is achieved by controlling the thermal switch from off to on by the controller. The radiation heating + phase change heat release insulation mode is switched to the radiation heating + phase change heat release + electric heating insulation mode, which is achieved by controlling the resistance wire heating to turn on by the controller.

[0067] On the other hand, Figure 2 As shown, the present invention provides a control strategy for a critical space thermal management device, which is particularly used for real-time matching of heat dissipation and heat preservation requirements of electronic equipment on a critical space floating platform to achieve equipment temperature control requirements. The specific steps of the control strategy are as follows:

[0068] S1. Preset parameters: According to the actual situation of the electronic equipment, set the maximum heating power Q0 of the electronic equipment, the optimal working temperature T0 of the electronic equipment, and the maximum working temperature T max , Minimum operating temperature of electronic equipment T min ;

[0069] S2. Obtain system status parameters: obtain the real-time heating power Q1 of the electronic device, and read the real-time temperature T1 of the electronic device through the temperature sensor;

[0070] S3, determination of heat dissipation and heat preservation working mode:

[0071] a) If T1 ≥ T0, the thermal management device enters the heat dissipation working mode;

[0072] b) If T1<T0, the thermal management device enters the insulation working mode.

[0073] S4. Determination of specific working mode:

[0074] a) In heat dissipation working mode:

[0075] 1) If T0≤T1≤a1T max -Q1 / A, the thermal management device enters the pure radiation cooling mode;

[0076] 2) If a1T max -Q1 / A<T1≤a2T max -Q1 / A, the thermal management device enters the radiation cooling + phase change heat absorption and heat dissipation working mode;

[0077] 3) If a2T max -Q1 / A<T1≤T max , the thermal management device enters the radiation cooling + phase change heat absorption + air cooling working mode; in this working mode, the fan speed is controlled according to the change of T1, that is, when the temperature rises, the fan speed is increased, and when the temperature drops, the fan speed is reduced to maintain the temperature stable within this range.

[0078] b) In the insulation working mode:

[0079] 1) If b1T min +Q1 / A≤T1<T0, the thermal management device enters the pure radiation heating and heat preservation working mode;

[0080] 2) If b2T min +Q1 / A≤T1<b1T min +Q1 / A, the thermal management device enters the radiation heating + phase change heat release and heat preservation working mode;

[0081] 3) If T min ≤T1<b1T min +Q1 / A, the thermal management device enters the radiation heating + phase change heat release + electric heating insulation working mode; in this working mode, the electric heating power is controlled according to the change of T1, that is, when the temperature rises, the heating power is reduced, and when the temperature drops, the heating power is increased to maintain the temperature stable within the range.

[0082] S5. End the control process of the near-space thermal management device.

[0083] In a specific implementation, in step S4, a2>a1, b2>b1, and a2, a1, b2, b1∈(0,1].

[0084] In a specific implementation manner, in step S4, A is a heat capacity parameter related to the device, which increases with the increase of the heat capacity of the device itself and needs to be determined according to actual conditions.

[0085] In another embodiment of the present invention, a near-space thermal management device using the present invention is provided, the structure of which is as follows: Figure 1As shown, its working principle is: electronic equipment generates heat during operation. In order to make it work near the optimal operating temperature, a thermal management device is required to adjust the heat dissipation and thermal insulation performance in real time according to the heat transfer effect of the external environment.

[0086] In cooling working mode:

[0087] a) Pure radiation cooling mode: When the temperature of the electronic equipment is higher than the optimal operating temperature and T0≤T1≤a1T max -Q1 / A, the thermal management device enters the pure radiation cooling and heat dissipation working mode. At this time, the controller does not apply electrical excitation to the radiation film material. The radiation film material has a low absorptivity in the infrared band and a high emissivity in the atmospheric transmission band, which reduces the absorption of external radiation heat while increasing the emission to the cosmic background, exerting a cooling effect, reducing the radiation surface temperature, and then dissipating the heat of the electronic equipment by heat conduction through the thermal diffusion structure.

[0088] b) Radiative cooling + phase change heat dissipation working mode: When a1T max -Q1 / A<T1≤a2T max At -Q1 / A, the thermal management device enters the radiation cooling + phase change heat absorption and heat dissipation working mode. At this time, the controller does not apply electrical excitation to the radiation film material and adjusts the thermal switch to open, and then introduces phase change heat absorption to absorb the heat generated by the electronic equipment under the premise of radiation cooling.

[0089] c) Radiative cooling + phase change heat release + air cooling working mode: When a2T max -Q1 / A<T1≤T max When the heat management device enters the radiation cooling + phase change heat absorption + air cooling working mode, the controller does not apply electrical excitation to the radiation film material, adjusts the thermal switch to open, controls the fan to start, and cools the phase change module through air cooling to maintain its ability to absorb heat from the electronic equipment.

[0090] In cooling working mode:

[0091] a) Pure radiation heating insulation working mode: When the temperature of the electronic equipment is lower than the optimal working temperature and b1T min When +Q1 / A≤T1<T0, the thermal management device enters the pure radiation heating insulation working mode. At this time, the controller applies electrical excitation to the radiation film material. The radiation film material has a high absorptivity in the infrared band and a low emissivity in the atmospheric transmission band, which increases the absorption of external radiation heat while reducing the emission to the cosmic background, exerting a heating effect, increasing the radiation surface temperature, and then insulating the electronic equipment by heat conduction through the thermal diffusion structure.

[0092] b) Radiation heating + phase change heat release and heat preservation working mode: When b2T min +Q1 / A≤T1<b1Tmin +Q1 / A, the thermal management device enters the radiation cooling + phase change heat release and thermal insulation working mode. At this time, the controller applies electrical excitation to the radiation film material and adjusts the thermal switch to open, and then introduces phase change heat release to keep the electronic equipment warm under the premise of radiation heating.

[0093] c) Radiation heating + phase change heat release + electric heating insulation working mode: When T min ≤T1<b1T min +Q1 / A, the thermal management device enters the radiation heating + phase change heat release + electric heating insulation working mode. At this time, the controller applies electrical excitation to the radiation film material, adjusts the thermal switch to open, and adjusts the electric heating power. The phase change module is heated by electric heating to maintain its ability to keep the electronic equipment warm.

[0094] It should be noted that within the scope of protection defined in the claims of the present invention, the following embodiments can be combined and / or expanded or replaced in any logical way from the above specific implementation methods, such as disclosed technical principles, disclosed technical features or implicitly disclosed technical features.

[0095] Example 1

[0096] A near-space thermal management device, comprising:

[0097] Electronic device 1, heat conduction diffusion structure 2, radiation structure 3, radiation film material 4, thermal switch 5, phase change module 6, resistance wire 7, fan 8, controller 9 and temperature sensor 10;

[0098] Electronic device 1 is a main function device, which requires a complete set of thermal management devices to provide heat dissipation or heat preservation functions according to requirements;

[0099] The heat-conducting diffusion structure 2 is used to transfer heat between the electronic device and the radiation structure;

[0100] The radiation structure 3 and the radiation film material 4 form a radiation heat exchange unit. The radiation structure 3 is used to expand the radiation heat exchange area, and the radiation film material 4 is used to adjust the radiation characteristics of the radiation heat exchange surface.

[0101] The thermal switch 5 is used to control whether the phase change module 6, the fan 8 and the resistance wire 7 are involved in the thermal management process;

[0102] The phase change module 6 is used to absorb or release heat, and adaptively switches the working state of absorbing and releasing heat according to the needs of the electronic equipment;

[0103] The resistance wire 7 is used to enhance the heat preservation capacity and make up for the lack of heat preservation capacity when the radiation heat and phase change heat release cannot meet the heat preservation requirements;

[0104] The fan is used to enhance the heat dissipation capacity and make up for the lack of heat dissipation capacity when radiation cooling and phase change heat absorption cannot meet the heat dissipation requirements; when the heat dissipation capacity meets the requirements, the fan does not intervene in the system operation;

[0105] The controller 9 has input and output functions. The input function is used to collect the status information of the equipment in the device; the output function is used to control the adjustable parameters of the thermal management system and adjust the working mode and performance of the device.

[0106] Example 2

[0107] On the basis of Example 1, the heat-conducting diffusion structure 2 includes an aluminum plate, a copper plate, a heat pipe, a heat spreader, and a combination thereof.

[0108] Example 3

[0109] Based on the embodiment 1, the radiation film material 4 comprises a dynamic radiation film material.

[0110] Example 4

[0111] On the basis of Example 3, the dynamic radiation film material, in the default state without electrical excitation signal input, has an absorptivity of ≤0.1 in the infrared band of 0.3-2.5μm and an emissivity of ≥0.9 in the atmospheric transmission band of 8-13μm; when an electrical excitation signal is input, the absorptivity of the material in the infrared band of 0.3-2.5μm is ≥0.9, and the emissivity in the atmospheric transmission band of 8-13μm is ≤0.1.

[0112] Example 5

[0113] On the basis of Example 1, the thermal switch 5 specifically comprises a material with controllable thermal conductivity. The thermal switch has high thermal conductivity and low thermal conductivity characteristics in the on and off states respectively, and the on / off ratio is ≥50.

[0114] Example 6

[0115] On the basis of Example 1, the phase change latent heat of the phase change module 6 is ≥200 kJ / kg, and the phase change temperature is required to be close to the optimal operating temperature of the electronic device 1 within the scope of engineering experience.

[0116] Example 7

[0117] Based on Example 1, the air cooling and heat dissipation capacity of the fan is dynamically adjusted by adjusting the fan speed.

[0118] Example 8

[0119] Based on the first embodiment, the device status information includes the heating power of the electronic device and the temperature of the electronic device at the next moment.

[0120] Example 9

[0121] Based on Example 1, the adjustable parameters of the thermal management system include the electrical excitation signal of the radiation film material, the thermal switch on / off signal, the fan speed signal and the resistance wire heating power signal.

[0122] Example 10

[0123] A near-space thermal management method, based on the near-space thermal management device described in any one of Embodiments 1 to 9, comprises the following steps:

[0124] S1. Preset parameters: According to the actual situation of the electronic equipment, set the maximum heating power Q0 of the electronic equipment, the optimal working temperature T0 of the electronic equipment, and the maximum working temperature T max , Minimum operating temperature of electronic equipment T min ;

[0125] S2. Obtain system status parameters: obtain the real-time heating power Q1 of the electronic device, and read the real-time temperature T1 of the electronic device through the temperature sensor;

[0126] S3, determination of heat dissipation and heat preservation working mode:

[0127] a) If T1 ≥ T0, the thermal management device enters the heat dissipation working mode;

[0128] b) If T1<T0, the thermal management device enters the insulation working mode;

[0129] S4. Determination of specific working mode:

[0130] a) In heat dissipation working mode:

[0131] 1) If T0≤T1≤a1T max -Q1 / A, the thermal management device enters the pure radiation cooling mode;

[0132] 2) If a1T max -Q1 / A<T1≤a2T max -Q1 / A, the thermal management device enters the radiation cooling + phase change heat absorption and heat dissipation working mode;

[0133] 3) If a2T max -Q1 / A<T1≤T max , the thermal management device enters the radiation cooling, phase change heat absorption and air cooling working mode; in this working mode, the fan speed is controlled according to the change of T1, the fan speed is increased when the control temperature rises, and the fan speed is reduced when the control temperature drops, so as to maintain the temperature stable within the range;

[0134] b) In the insulation working mode:

[0135] 1) If b1T min+Q1 / A≤T1<T0, the thermal management device enters the pure radiation heating and heat preservation working mode;

[0136] 2) If b2T min +Q1 / A≤T1<b1T min +Q1 / A, the thermal management device enters the radiation heating + phase change heat release and heat preservation working mode;

[0137] 3) If T min ≤T1<b1T min +Q1 / A, the thermal management device enters the radiation heating, phase change heat release and electric heating insulation working mode; in this working mode, the electric heating power is controlled according to the change of T1. When the control temperature rises, the heating power is reduced. When the control temperature drops, the heating power is increased to maintain the temperature stable within the range.

[0138] S5. End the control process of the near-space thermal management device.

[0139] On the basis of Example 10, in step S4, a2>a1, b2>b1, and a2, a1, b2, b1∈(0, 1].

[0140] On the basis of Example 10, in step S4, A is a heat capacity parameter related to the device, which increases with the increase of the heat capacity of the device itself and is determined according to actual conditions.

[0141] The units involved in the embodiments of the present invention may be implemented by software or hardware, and the units described may also be arranged in a processor. The names of these units do not, in some cases, limit the units themselves.

[0142] According to one aspect of an embodiment of the present invention, a computer program product or a computer program is provided, the computer program product or the computer program includes a computer instruction, and the computer instruction is stored in a computer-readable storage medium. A processor of a computer device reads the computer instruction from the computer-readable storage medium, and the processor executes the computer instruction, so that the computer device executes the method provided in the above various optional implementations.

[0143] As another aspect, an embodiment of the present invention further provides a computer-readable medium, which may be included in the electronic device described in the above embodiment; or may exist independently without being assembled into the electronic device. The above computer-readable medium carries one or more programs, and when the above one or more programs are executed by an electronic device, the electronic device implements the method described in the above embodiment.

Claims

1. A near-space thermal management device, characterized in that: include: Electronic equipment, thermal diffusion structures, radiation structures, radiation film materials, thermal switches, phase change modules, resistance wires, fans, controllers and temperature sensors; Electronic equipment is the main functional equipment, and a complete set of thermal management devices is required to provide heat dissipation or heat preservation functions according to needs; The heat-conducting diffusion structure is used to transfer heat between the electronic device and the radiating structure; The radiation structure and the radiation film material constitute a radiation heat exchange unit. The radiation structure is used to expand the radiation heat exchange area, and the radiation film material is used to adjust the radiation characteristics of the radiation heat exchange surface. The thermal switch is used to control whether the phase change module, fan and resistance wire are involved in the thermal management process; The phase change module is used to absorb or release heat, and adaptively switches the working state of absorbing and releasing heat according to the needs of electronic equipment; The resistance wire is used to enhance the thermal insulation capacity and make up for the lack of thermal insulation capacity when the radiation heating and phase change heat release cannot meet the thermal insulation requirements; The fan is used to enhance the heat dissipation capacity and make up for the lack of heat dissipation capacity when radiation cooling and phase change heat absorption cannot meet the heat dissipation requirements; when the heat dissipation capacity meets the requirements, the fan does not intervene in the system operation; The controller has input and output functions. The input function is used to collect equipment status information in the device; the output function is used to control the adjustable parameters of the thermal management system and adjust the working mode and performance of the device.

2. The near-space thermal management device according to claim 1, characterized in that: The heat conduction and diffusion structure includes an aluminum plate, a copper plate, a heat pipe, a heat spreader, and a combination thereof.

3. The near-space thermal management device according to claim 1, characterized in that: The radiation film material includes a dynamic radiation film material.

4. The near-space thermal management device according to claim 3, characterized in that: The dynamic radiation film material, in the default state without electrical excitation signal input, has an absorptivity of ≤0.1 in the infrared band of 0.3-2.5 μm and an emissivity of ≥0.9 in the atmospheric transmission band of 8-13 μm; when an electrical excitation signal is input, has an absorptivity of ≥0.9 in the infrared band of 0.3-2.5 μm and an emissivity of ≤0.1 in the atmospheric transmission band of 8-13 μm.

5. The near-space thermal management device according to claim 1, characterized in that: The thermal switch specifically includes a material with controllable thermal conductivity. The thermal switch has high thermal conductivity and low thermal conductivity characteristics in an on state and a off state respectively, and the on / off ratio is ≥50.

6. The near-space thermal management device according to claim 1, characterized in that: The phase change latent heat of the phase change module is ≥200 kJ / kg, and the phase change temperature is required to be close to the optimal operating temperature of the electronic equipment within the scope of engineering experience.

7. The near-space thermal management device according to claim 1, characterized in that: The air cooling and heat dissipation capacity of the fan is dynamically adjusted by adjusting the fan speed.

8. The near-space thermal management device according to claim 1, characterized in that: The device status information includes the heating power and temperature of the electronic device at the next moment.

9. The near-space thermal management device according to claim 1, characterized in that: The adjustable parameters of the thermal management system include an electrical excitation signal of the radiation film material, an on / off signal of a thermal switch, a fan speed signal, and a resistance wire heating power signal.

10. A near-space thermal management method, characterized in that: The near-space thermal management device according to any one of claims 1 to 9 comprises the following steps: S1. Preset parameters: According to the actual situation of the electronic equipment, set the maximum heating power Q0 of the electronic equipment, the optimal working temperature T0 of the electronic equipment, and the maximum working temperature T max , Minimum operating temperature of electronic equipment T min ; S2. Obtain system status parameters: obtain the real-time heating power Q1 of the electronic device, and read the real-time temperature T1 of the electronic device through the temperature sensor; S3, determination of heat dissipation and heat preservation working mode: a) If T1 ≥ T0, the thermal management device enters the heat dissipation working mode; b) If T1<T0, the thermal management device enters the insulation working mode; S4. Determination of specific working mode: a) In heat dissipation working mode: 1) If T0≤T1≤a1T max -Q1 / A, the thermal management device enters the pure radiation cooling mode; 2) If a1T max -Q1 / A<T1≤a2T max -Q1 / A, the thermal management device enters the radiation cooling + phase change heat absorption and heat dissipation working mode; 3) If a2T max -Q1 / A<T1≤T max , the thermal management device enters the radiation cooling, phase change heat absorption and air cooling working mode; in this working mode, the fan speed is controlled according to the change of T1, the fan speed is increased when the control temperature rises, and the fan speed is reduced when the control temperature drops, so as to maintain the temperature stable within the range; b) In the insulation working mode: 1) If b1T min +Q1 / A≤T1<T0, the thermal management device enters the pure radiation heating and heat preservation working mode; 2) If b2T min +Q1 / A≤T1<b1T min +Q1 / A, the thermal management device enters the radiation heating + phase change heat release and heat preservation working mode; 3) If T min ≤T1<b1T min +Q1 / A, the thermal management device enters the radiation heating, phase change heat release and electric heating insulation working mode; in this working mode, the electric heating power is controlled according to the change of T1. When the control temperature rises, the heating power is reduced. When the control temperature drops, the heating power is increased to maintain the temperature stable within the range. S5. End the control process of the near-space thermal management device.

11. The near-space thermal management method according to claim 10, characterized in that: In step S4, a2>a1, b2>b1, and a2, a1, b2, b1∈(0, 1].

12. The near-space thermal management method according to claim 10, characterized in that: In step S4, A is a heat capacity parameter related to the device, which increases with the increase of the heat capacity of the device itself and is determined according to actual conditions.

Images