Novel heat dissipation system using CMUT technology

Abstract

The invention relates to the field of heat dissipation systems, and discloses a novel heat dissipation system using a CMUT technology, the novel heat dissipation system comprises a protection shell and a mainboard, the protection shell is internally provided with a vibration heat dissipation mechanism, the vibration heat dissipation mechanism comprises a CMUT module board, a substrate and a fixing plate, the upper end of the CMUT module board is fixedly connected to the center position of the inner side of the top of the protection shell, and the lower end of the CMUT module board is fixedly connected to the center position of the inner side of the top of the protection shell. And polarization plates are fixedly connected to four corners of the lower end of the CMUT module board. A direct-current bias voltage and an alternating-current voltage signal are applied to an on-film electrode and a substrate electrode of a CMUT module board, the applied alternating-current voltage can change the motion state of a film, and an electric signal is converted into vibration of the film; the up-and-down vibration of the film can directly influence the cavity volume of the CMUT unit, change the pressure distribution of the inside gas and push the air to flow towards one direction, and the structure is small in volume, light in weight, large in air volume, low in noise and capable of effectively reducing the surface temperature of a chip and reducing the total volume of the packaged chip at the same time.

Description

Technical Field

[0001] The invention belongs to the technical field of heat dissipation systems, and in particular relates to a novel heat dissipation system utilizing CMUT technology. Background Art

[0002] CMUT (Capacitive Micromachined Ultrasonic Transducer) is an ultrasonic transducer manufactured using micro-nano electromechanical system (MEMS, NMES) technology. It integrates the capacitive structure on the chip through micromachining technology to achieve the transmission and reception of ultrasonic signals. When a DC bias current and AC voltage signal are applied to the electrodes of the CMUT, the vibrating film will vibrate due to electrostatic effects. For example, in medical ultrasound imaging applications, by applying an electrical signal of a specific frequency and amplitude to the CMUT, it generates high-frequency vibrations.

[0003] Vibrating film is a dielectric film with the ability to store electric charge for a long time. It can make the internal electric charge move in a directional manner and be "frozen" in a certain position under electric field, corona discharge or other polarization conditions, forming a relatively stable polarization state; for example, electrostatic capacitor speakers use the electrostatic effect of the film to convert electrical signals into vibrations of the film, thereby generating sound. Electrostatic capacitor speakers have been used in some small portable audio devices.

[0004] Personal computers (PCs) have long pursued the idea of ​​"no moving parts" as a Platonic ideal of efficiency and reliability. However, active heat dissipation (cooling) has always been an obstacle to achieving this ideal: for high-power electronics, it is difficult to abandon the cooling function of fans.

[0005] The mainstream application of existing electronic chip heat dissipation is to conduct heat through silicone, and then use fans and water cooling to dissipate heat. The disadvantage is that the fan and water cooling pipes are huge, generally more than 10 times the size of the chip, which seriously restricts the miniaturization of electronic chip packaging equipment.

[0006] Therefore, the inventor proposes a novel heat dissipation system using CMUT technology based on the above technologies to solve the above-mentioned technical problems. Summary of the invention

[0007] In order to solve the technical problem that the volume of the above-mentioned fan and water cooling pipe is huge, which is generally more than 10 times the volume of the chip, and seriously restricts the miniaturization of electronic chip packaging equipment, the basic concept of the technical solution adopted by the present invention is:

[0008] A novel heat dissipation system using CMUT technology comprises a protective shell and a mainboard, wherein a vibration heat dissipation mechanism is arranged inside the protective shell, wherein the vibration heat dissipation mechanism comprises a substrate and a fixed plate frame, wherein a substrate fixing plate is fixedly connected to the periphery of the substrate, wherein bolt holes are provided at the four corners of the substrate fixing plate, wherein fixing bolts are movably sleeved in the bolt holes, wherein the threads of the fixing bolts correspond to the four corners of the fixed plate frame and are threadedly connected thereto, wherein a through hole is provided on the surface of the substrate, and an electret film is fixedly installed on the upper surface of the substrate, wherein pores are provided on the surface of the electret film, and a closed film is fixedly connected to the pores, and an electrode is fixedly connected to the center position of the upper surface of the electret film.

[0009] As a preferred embodiment of the present invention, a plurality of one-way airflow valves are fixedly connected to the membrane surface of the fixed plate, the one-way airflow valves penetrate the fixed plate and are fixedly sleeved therewith, and a receiving groove is provided inside the one-way airflow valve, a pneumatic sheet is movably sleeved in the receiving groove, and an air outlet and an air inlet are respectively provided at the upper and lower ends of the one-way airflow valve.

[0010] As a preferred embodiment of the present invention, the periphery of the fixed plate is fixedly connected to a fixed plate frame, the periphery of the fixed plate frame is fixedly connected to the inner side of the protective shell, and the upper ends of two side edges of the protective shell are provided with heat dissipation grilles, and the opening position of the heat dissipation grilles corresponds to the upper surface of the fixed plate.

[0011] As a preferred embodiment of the present invention, air intake grilles are provided at the lower ends of the other two sides of the protective shell, and the opening position of the air intake grilles corresponds to the lower surface of the fixed plate, and the lower end of the protective shell is fixedly connected to a fixed frame, and bolt holes are provided at the four corners of the fixed frame, and fastening bolts are movably sleeved in the bolt holes, and a buffer spring is sleeved and installed on the threaded rod of the fastening bolt.

[0012] As a preferred embodiment of the present invention, a heat-conducting copper plate is fixedly sleeved inside the fixed frame, and a plurality of heat-dissipating fins are fixedly connected to the upper surface of the heat-conducting copper plate. The upper ends of the heat-dissipating fins correspond to the fixed plate, and the direction of the slotted gaps of the heat-dissipating fins corresponds to the air intake grille, and a groove is provided on the lower surface of the heat-conducting copper plate.

[0013] As a preferred embodiment of the present invention, a through hole is provided on the plate body of the main board, and the opening position of the through hole corresponds to the bolt holes opened at the four corners of the fixed frame, and is movably connected with the fastening bolt. After the fastening bolt passes through the main board, an insulating gasket and a fixing nut are sequentially installed on the end of the threaded rod thereof, and the fixing nut is threadedly connected to the threaded rod of the fastening bolt.

[0014] As a preferred embodiment of the present invention, a CPU chip is fixedly mounted on the upper surface of the mainboard, a thermally conductive graphene-based composite material sheet is fixedly bonded to the upper surface of the CPU chip, and the CPU chip and the thermally conductive silicon sheet correspond to the groove opened at the lower end of the thermally conductive copper plate and are installed in a socketed manner therewith.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] The present invention applies a DC bias voltage and an AC voltage signal to the electrodes of the CMUT module board substrate and the film. Due to the electrostatic effect, the accumulated charge is used to generate an electric field effect between the electrodes, and the electrical signal is converted into the vibration of the film, which will change the gas pressure in the CMUT unit cavity, generate forced air convection, and thus push the air to flow in one direction, realizing the function of a micro fan. This structure has a small volume, light weight, large air volume, low noise, can effectively reduce the chip surface temperature, and reduce the total volume of the packaged chip.

[0017] The specific implementation modes of the present invention are further described in detail below in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In the attached picture:

[0019] Figure 1 A schematic diagram of the overall installation 3D effect of a new type of cooling system using CMUT technology;

[0020] Figure 2 A schematic diagram of the internal structure cross section of a new type of heat dissipation system using CMUT technology;

[0021] Figure 3 It is an exploded 3D top view of the overall internal parts of a new type of heat dissipation system using CMUT technology;

[0022] Figure 4 A schematic cross-sectional view of a heat conduction mechanism of a novel heat dissipation system using CMUT technology;

[0023] Figure 5 It is a schematic diagram of an enlarged cross-sectional view of a one-way valve of a novel heat dissipation system using CMUT technology;

[0024] Figure 6 A schematic diagram of the air intake of a heat dissipation mechanism of a new type of heat dissipation system using CMUT technology;

[0025] Figure 7 Schematic diagram of the exhaust of the heat dissipation mechanism of a new heat dissipation system using CMUT technology.

[0026] In the figure: 1. Protective housing; 2. Heat dissipation grid; 3. Air intake grid; 4. Fixed frame; 5. Main board;

[0027] 6. Fastening bolts; 7. Buffer spring; 8. Electret film; 9. Substrate; 10. Electrode; 11. Through hole; 12. Substrate fixing plate; 13. Fixing plate frame; 14. Fixing plate; 15. One-way airflow valve; 16. Thermal copper plate; 17. Heat sink fins; 18. CPU chip; 19. Thermal graphene-based composite material sheet; 20. Closing film; 21. Insulating gasket; 22. Fixing nut; 23. Air inlet; 24. Pneumatic sheet; 25. Air outlet; 26. Air hole. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. The following embodiments are used to illustrate the present invention.

[0029] like Figures 1 to 6 As shown, a novel heat dissipation system using CMUT technology includes a protective shell 1 and a main board 5. A vibration heat dissipation mechanism is arranged inside the protective shell 1. The vibration heat dissipation mechanism includes a substrate 9 and a fixed plate frame 13. A substrate fixing plate 12 is fixedly connected to the periphery of the substrate 9. Bolt holes are provided at the four corners of the substrate fixing plate 12. Fixing bolts are movably sleeved in the bolt holes. The threads of the fixing bolts correspond to the four corners of the fixing plate frame 13 and are threadedly connected thereto. A through hole 11 is provided on the surface of the substrate 9, and an electret film 8 is fixedly installed on the upper surface of the substrate 9. An air hole 26 is provided on the surface of the electret film 8, and a closed film 20 is fixedly connected to the air hole 26, and an electrode 10 is fixedly connected to the center position of the upper surface of the electret film 8.

[0030] In this setting, the present invention applies a DC bias voltage and an AC voltage signal to the electrode of the substrate 9. Due to the electrostatic effect, the electrostatic field effect of the electret film 8 is utilized to convert the electrical signal into the vibration of the film, which causes the film structure to deform and drives the pneumatic sheet 24 to vibrate at the same frequency. This structure has a small size, light weight, large air volume, and low noise, and can effectively reduce the surface temperature of the chip while reducing the total volume of the packaged chip.

[0031] like Figures 1 to 6 As shown, in a specific embodiment, a plurality of one-way airflow valves 15 are fixedly connected to the membrane surface of the fixed plate 14, the one-way airflow valves 15 penetrate the fixed plate 14 and are fixedly sleeved therewith, and a receiving groove is provided inside the one-way airflow valve 15, a pneumatic sheet 24 is movably sleeved in the receiving groove, and an air outlet 25 and an air inlet 23 are respectively provided at the upper and lower ends of the one-way airflow valve 15.

[0032] In this arrangement, when the one-way airflow valve 15 fixed on the fixed plate 14 vibrates downward, the pneumatic sheet 24 will lift it due to air pressure, causing the one-way airflow valve 15 to be in an open state and transferring the air at the lower end of the fixed plate 14 to the upper end.

[0033] like Figures 1 to 6 As shown, in a specific embodiment, the periphery of the fixed plate 14 is fixedly connected to the fixed plate frame 13, the periphery of the fixed plate frame 13 is fixedly connected to the inner side of the protective shell 1, and the upper ends of two side edges of the protective shell 1 are provided with heat dissipation grilles 2, and the opening position of the heat dissipation grilles 2 corresponds to the upper surface of the fixed plate 14.

[0034] In this setting, when the fixed plate 14 vibrates upward, the pneumatic sheet 24 will press it downward due to air pressure, causing the one-way airflow valve 15 to be in a closed state, and pushing the air at the upper end of the fixed plate 14 outward through the heat dissipation grille 2, thereby pushing the air to flow in one direction, realizing the function of a fan and discharging heat through airflow.

[0035] like Figures 1 to 6 As shown, in a specific embodiment, an air intake grille 3 is provided at the lower end of the other two sides of the protective shell 1, and the opening position of the air intake grille 3 corresponds to the lower surface of the fixing plate 14, and the lower end of the protective shell 1 is fixedly connected to a fixing frame 4, and bolt holes are provided at the four corners of the fixing frame 4, and a fastening bolt 6 is movably sleeved in the bolt hole, and a buffer spring 7 is sleeved and installed on the threaded rod of the fastening bolt 6; a through hole is provided on the plate body of the main board 5, and the opening position of the through hole corresponds to the bolt holes provided at the four corners of the fixing frame 4, and is movably sleeved with the fastening bolt 6, and after the fastening bolt 6 penetrates the main board 5, an insulating gasket 21 and a fixing nut 22 are sleeved and installed at the end of its threaded rod in sequence, and the fixing nut 22 is threadedly sleeved with the threaded rod of the fastening bolt 6.

[0036] In this configuration, the buffer spring 7 is sleeved on the fastening bolt 6, and then the fastening bolt 6 is passed through the bolt holes opened on the fixed frame 4 and the main board 5, and then the insulating gasket 21 is sleeved on the fastening bolt 6 from the back of the main board 5, and finally the fixing nut 22 is threadedly sleeved on the tail of the fastening bolt 6.

[0037] like Figures 1 to 6As shown, in a specific embodiment, a heat-conducting copper plate 16 is fixedly sleeved inside the fixed frame 4, and a plurality of heat-conducting fins 17 are fixedly connected to the upper surface of the heat-conducting copper plate 16, the upper end of the heat-conducting fins 17 corresponds to the fixed plate 14, and the direction of the slotted gaps of the heat-conducting fins 17 corresponds to the air intake grid 3, and a groove is provided on the lower surface of the heat-conducting copper plate 16; a CPU chip 18 is fixedly installed on the upper surface of the mainboard 5, and a heat-conducting silicon chip 19 is fixedly bonded to the upper surface of the CPU chip 18, and the CPU chip 18 and the heat-conducting silicon chip 19 correspond to the groove provided at the lower end of the heat-conducting copper plate 16, and are sleeved and installed therewith.

[0038] In this setting, when using this device, first paste the heat-conducting silicon chip 19 on the CPU chip 18, then align the heat-conducting copper plate 16 at the lower end of the device with the CPU chip 18, and then install it on the CPU chip 18. The implementation principle of a new type of heat dissipation system using CMUT technology in this embodiment is as follows:

[0039] The present invention applies a DC bias voltage and an AC voltage signal to the electrode of the substrate 9. Due to the electrostatic effect, the electrostatic field effect of the electret film 8 is used to convert the electrical signal into the vibration of the film, which will cause the film structure to deform, generate forced air convection, and drive the pneumatic sheet 24 to vibrate at the same frequency. When the electret film 8 vibrates upward, the one-way airflow valve 15 fixed on the fixed plate 14 will be lifted by the air pressure, causing the one-way airflow valve 15 to be in an open state, and the air at the lower end of the fixed plate 14 will be transferred to the upper end. When the electret film 8 vibrates downward, the pneumatic sheet 24 will be pressed down by the air pressure, causing the one-way airflow valve 15 to be in a closed state, and the air at the upper end of the fixed plate 14 will be pushed outward through the heat dissipation grid 2, thereby pushing the air to flow in one direction, realizing the function of a fan, and discharging heat through airflow. This structure is small in size, light in weight, large in air volume, low in noise, and can effectively reduce the surface temperature of the chip, while reducing the total volume of the packaged chip;

[0040] When using the device, first stick the thermally conductive graphene-based composite material sheet 19 on the CPU chip 18, then align the thermally conductive copper plate 16 at the lower end of the device with the CPU chip 18, and sleeve it on the CPU chip 18, then sleeve the buffer spring 7 on the fastening bolt 6, and then pass the fastening bolt 6 through the bolt holes opened on the fixed frame 4 and the main board 5, and then sleeve the insulating gasket 21 on the fastening bolt 6 from the back of the main board 5, and finally thread the fixing nut 22 on the tail of the fastening bolt 6.

Claims

1. A novel heat dissipation system using CMUT technology, comprising a protective housing (1) and a mainboard (5), characterized in that: A vibration heat dissipation mechanism is arranged inside the protective shell (1), and the vibration heat dissipation mechanism comprises a substrate (9) and a fixed plate frame (13); a substrate fixed plate (12) is fixedly connected to the periphery of the substrate (9); bolt holes are provided at the four corners of the substrate fixed plate (12); fixing bolts are movably sleeved in the bolt holes; the threads of the fixing bolts correspond to the four corners of the fixed plate frame (13) and are threadedly connected thereto; a through hole (11) is provided on the surface of the substrate (9), and an electret film (8) is fixedly installed on the upper surface of the substrate (9); an air hole (26) is provided on the surface of the electret film (8), and a closed film (20) is fixedly connected to the air hole (26); and an electrode (10) is fixedly connected to the center position of the upper surface of the electret film (8).

2. A novel heat dissipation system using CMUT technology according to claim 1, characterized in that: The periphery of the fixed plate frame (13) is fixedly connected to the inner side of the protective shell (1), and the interior of the fixed plate frame (13) is fixedly connected to a fixed plate (14), and the upper ends of two side edges of the protective shell (1) are provided with heat dissipation grilles (2), and the opening position of the heat dissipation grilles (2) corresponds to the upper surface of the fixed plate (14).

3. A novel heat dissipation system using CMUT technology according to claim 2, characterized in that: A plurality of one-way airflow valves (15) are fixedly connected to the membrane surface of the fixed plate (14). The one-way airflow valves (15) penetrate the fixed plate (14) and are fixedly sleeved therewith. A receiving groove is provided inside the one-way airflow valve (15). A pneumatic plate (24) is movably sleeved in the receiving groove. An air outlet (25) and an air inlet (23) are respectively provided at the upper end and the lower end of the one-way airflow valve (15).

4. A novel heat dissipation system using CMUT technology according to claim 2, characterized in that: The lower ends of the other two sides of the protective shell (1) are provided with air intake grilles (3), the opening position of the air intake grilles (3) corresponds to the lower surface of the fixing plate (14), and the lower end of the protective shell (1) is fixedly connected to a fixing frame (4), and the four corners of the fixing frame (4) are provided with bolt holes, and the bolt holes are movably sleeved with fastening bolts (6), and the threaded rod of the fastening bolts (6) is sleeved with a buffer spring (7).

5. A novel heat dissipation system using CMUT technology according to claim 4, characterized in that: A heat-conducting copper plate (16) is fixedly sleeved inside the fixed frame (4), and a plurality of heat-dissipating fins (17) are fixedly connected to the upper surface of the heat-conducting copper plate (16), the upper ends of the heat-dissipating fins (17) correspond to the fixed plate (14), and the direction of the slotted gaps of the heat-dissipating fins (17) corresponds to the air intake grid (3), and a groove is provided on the lower surface of the heat-conducting copper plate (16).

6. A novel heat dissipation system using CMUT technology according to claim 1, characterized in that: The main board (5) is provided with a through hole, the opening position of the through hole corresponds to the bolt holes opened at the four corners of the fixed frame (4), and is movably connected with the fastening bolt (6). After the fastening bolt (6) passes through the main board (5), an insulating gasket (21) and a fixing nut (22) are sequentially installed on the end of the threaded rod of the fastening bolt (6), and the fixing nut (22) is threadedly connected with the threaded rod of the fastening bolt (6).

7. A novel heat dissipation system using CMUT technology according to claim 6, characterized in that: A CPU chip (18) is fixedly mounted on the upper surface of the mainboard (5), a heat-conducting graphene-based composite material sheet (19) is fixedly bonded to the upper surface of the CPU chip (18), and the CPU chip (18) and the heat-conducting graphene sheet (19) correspond to the grooves provided at the lower end of the heat-conducting copper plate (16), and are sleeved and mounted therewith.

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