Power supply housing, power conversion device, and electronic device

Abstract

The application provides a power supply shell, a power supply conversion device and an electronic device. The power supply shell comprises a shell and a fixing plate. The shell has a receiving cavity, and a first flow channel is arranged in the shell. The fixing plate is located in the receiving cavity. At least part of the surface of the fixing plate facing the shell is fixedly connected with at least part of the inner surface of the shell. The fixing plate is used for fixing a power supply conversion functional assembly. The heat generating devices in the power supply conversion functional assembly are cooled by the cooling flow in the first flow channel. The surface of the fixing plate and the surface of the shell in the power supply shell are connected in a face-to-face mode. The connection area is large, the connection stability is higher, and the fixing stability of the power supply conversion functional assembly and the shell is improved.

Description

[0001] This application is a divisional application of the original application with the application number 202111204608.2 and the original filing date of October 15, 2021, and the entire contents of the original application are incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of power supply, in particular to a power supply shell, a power conversion device and an electronic device. BACKGROUND

[0003] Switching power supply, also known as switching power supply or switching converter, is a kind of high-frequency power conversion device, which is a kind of power supply. Its function is to convert one voltage into the voltage or current required by the user end through different forms of architecture. With the increasing density of power modules of switching power supply, conventional air cooling and natural cooling cannot meet the cooling demand, and more and more high-power modules use liquid cooling for heat dissipation. For example, when the power module is a vehicle charger, the MOS tube and magnetic device of the vehicle charger are the main heat generating devices. In order to quickly take away the heat of the heat generating device, there are many solutions for the heat dissipation of the vehicle charger. Generally, a water channel is provided in the power supply shell, and the MOS tube is attached to the wall of the water channel for heat dissipation, and the cooling water in the water channel directly takes away the heat. The power supply shell can be formed by drawing process or pressure casting process, and a flow channel is formed. However, when the shell is formed by drawing process, it is not possible to stretch the integrated fixing column, and each fixing column needs to be fixed in the shell separately, and then the fixing column fixing device is fixed, which takes a long time and has poor connection stability between the fixing column and the stretched shell. When the shell is formed by pressure casting process, although the fixing column can be formed during pressure casting, it will increase the cost and complexity of the pressure casting mold. SUMMARY

[0004] The present application provides a power supply shell capable of stably fixing a device.

[0005] In a first aspect, the present application provides a power supply shell, comprising a shell and a fixing plate, the shell has a receiving cavity, and a first flow channel is arranged in the shell; the fixing plate is located in the receiving cavity, and at least part of the surface of the fixing plate is fixedly connected with at least part of the inner surface of the shell, the fixing plate is used for fixing a power conversion functional component, and a heat generating device in the power conversion functional component is cooled by a cooling fluid in the first flow channel.

[0006] In an embodiment, the shell is formed by drawing process, and the material of the shell is aluminum. After the aluminum plate is drawn by drawing process, a shell with a receiving cavity is formed. The first flow channel in the shell is used to cool the heat generating device in the power conversion functional component, and the cooling fluid in the first flow channel can be water, cooling medium or phase change medium.

[0007] In some embodiments, the housing is formed by a die casting process, and forms the first flow channel.

[0008] In the present application, the power supply housing is applied to a power supply conversion device, the power supply conversion device comprises a power supply housing and a power supply conversion functional assembly located in the power supply housing, and the power supply housing further comprises a cover plate, one side of the housing has an opening, and the cover plate covers the opening of the housing.

[0009] The power supply conversion functional assembly comprises a circuit board, a magnetic device, and the like, wherein the heat generating devices of the power supply conversion functional assembly comprise insulated gate bipolar transistors, triodes, MOS tubes, and the like located on the circuit board, and the heat generating devices further comprise inductor devices or voltage devices in the magnetic device. One function of the circuit board is to connect the insulated gate bipolar transistors, triodes, MOS tubes, and magnetic devices, and the like. Since the power supply conversion functional assembly has multiple devices, these devices need to be fixed in the receiving cavity of the housing. The housing formed by the die casting process can directly form fixing columns on the inner wall of the housing, and the fixing columns are used to fix the devices, but the fixing columns are generally more, which increases the cost of the die casting mold and the process complexity; when the housing is formed by the drawing process, the fixing columns for fixing the devices cannot be integrally formed on the inner surface of the housing, and the fixing columns need to be welded on the inner surface of the housing. Generally, the fixing columns are first fixed on the inner surface of the housing by welding or adhesive, and then the power supply conversion functional assembly is fixed with the fixing columns to fix the power supply conversion functional assembly in the housing. This way needs to fix the fixing columns one by one on the inner surface of the housing, and the end surface of the fixing column is generally small, which is not stable with the inner surface of the housing. On the other hand, if the fixing columns are welded one by one on the housing or are bonded one by one on the housing by adhesive, the welding process is long and complex. On the other hand, when the housing formed by the drawing process or the die casting process is made of aluminum material, the stability of direct welding on the aluminum housing is poor, and the welding yield is low. The stability of direct bonding on the aluminum housing by adhesive is also poor.

[0010] In the present application, the fixing plate is fixedly connected to at least part of the surface of the housing and at least part of the inner surface of the housing, and the fixed connection includes welding or adhesive bonding. The fixed connection of the surface of the fixing plate and the surface of the housing can improve the stability of the connection. Compared with the connection method of the small size end surface of the screw column and the inner surface of the housing, the surface of the fixing plate and the surface of the housing are connected by a face-to-face connection method, the connection area is large, and the connection stability is higher. The fixing plate is fixedly connected with the power supply conversion functional assembly to fix the power supply conversion functional assembly in the receiving cavity inside the housing. Compared with the method of forming fixing columns by die casting process, the process of using fixing plate is simpler and has low process cost.

[0011] In an embodiment, the fixing plate is fixedly connected to the inner surface of the shell towards all surfaces of the shell, so as to improve the connection stability of the fixing plate and the shell. In an embodiment, the fixing plate can be fixedly connected to the inner surface of the shell towards part of the surfaces of the shell.

[0012] In a possible implementation, the fixing plate is provided with a fixing hole penetrating through opposite surfaces of the fixing plate, and a fixing element is arranged in the fixing hole. The fixing hole and the fixing element are matched to fix the power conversion functional assembly.

[0013] In an embodiment, the area of the surface of the fixing plate towards the shell is greater than 1 / 4 of the area of the inner surface of the shell, so that the fixing plate has sufficient area to install a sufficient number of fixing elements.

[0014] In a possible implementation, the shell comprises a bottom plate and a circumferential side plate located on one side of the bottom plate and surrounding the bottom plate, and the bottom plate and the circumferential side plate surround to form the accommodation cavity. The fixing plate comprises a first fixing sub-plate which is arranged in a stack with the bottom plate. The first fixing sub-plate is fixedly connected to at least part of the inner surface of the bottom plate towards at least part of the surface of the bottom plate. The area of the surface of the first fixing sub-plate towards the bottom plate is greater than or equal to 0.5 times the area of the surface of the bottom plate towards the first fixing sub-plate, and is less than or equal to the area of the surface of the bottom plate towards the first fixing sub-plate.

[0015] In an embodiment, the circumferential side plate is perpendicular to the bottom plate. When the shell is formed by a drawing process, the circumferential side plate can be arranged perpendicular to the bottom plate. In this embodiment, when the shell is formed by a drawing process, the connection between the circumferential side plate and the bottom plate is a rounded corner. In an embodiment, the circumferential side plate deviates from the direction perpendicular to the bottom plate by a certain angle. When the shell is formed by a die casting process, the circumferential side plate has a draft angle, so that the circumferential side plate deviates from the direction perpendicular to the bottom plate by a certain angle.

[0016] The area of the first fixing sub-plate is greater than half the area of the bottom plate, which is beneficial to fixing the power conversion functional assembly. Since the functional devices of the power conversion functional assembly are relatively more and more scattered, including but not limited to circuit boards, inductor devices, voltage devices, etc., when these functional devices are distributed in the left and right, front and back, or middle of the accommodation cavity, the area of the first fixing sub-plate cannot be too small. The area of the surface of the first fixing sub-plate towards the bottom plate is greater than or equal to 0.5 times the area of the surface of the bottom plate towards the first fixing sub-plate, so that the first fixing sub-plate has sufficient area to install a sufficient number of fixing elements, so as to fix each functional device in the power conversion functional assembly.

[0017] In some embodiments, when the area of the first fixing sub-plate is small, the first fixing sub-plate can be designed in a pattern, so that the first fixing sub-plate can fix the functional devices in the power conversion functional assembly which are arranged towards the bottom plate. The specific pattern can be designed according to the arrangement positions and quantities of the devices in the power conversion functional assembly.

[0018] In a possible implementation, the fixing plate further comprises a second fixing sub-plate, the second fixing sub-plate is located on the inner side of the circumferential side plate and intersects with the first fixing sub-plate, and the second fixing sub-plate is fixedly connected to at least part of the surface of the circumferential side plate. The second fixing sub-plate can fix the power conversion functional assembly from the side, for example, can fix the magnetic devices towards the surface of the circumferential side plate, to improve the stability of the fixed connection. The second fixing sub-plate intersects with the first fixing sub-plate, including that the second fixing sub-plate is perpendicular to the first fixing sub-plate, or the second fixing sub-plate deviates from the direction of the first fixing sub-plate by a certain angle, for example, in an embodiment, the included angle between the second fixing sub-plate and the first fixing sub-plate is greater than or equal to 80° and less than 90°, and the second fixing sub-plate can be used to fix part of the power conversion functional assembly which has a certain distance from the circumferential side plate.

[0019] In an embodiment, the second fixing sub-plate and the first fixing sub-plate are integrated structures. That is, the fixing plate is an integrated structure. The material of the fixing plate is aluminum. In an embodiment, the shape of the fixing plate is adapted to the shell, and the fixing plate is attached to the inner wall of the shell. The fixing plate can be formed by a drawing process, and the fixing plate can also be formed by a bending process.

[0020] In an embodiment, the second fixing sub-plate comprises a first part and a second part which are oppositely arranged along a first direction, the circumferential side plate comprises a first side plate and a second side plate which are oppositely arranged along the first direction, the first part is located on the surface of the first side plate towards the accommodation cavity, and the second part is located on the surface of the second side plate towards the accommodation cavity. The first part, the first fixing sub-plate and the second part are integrated structures. The second fixing sub-plate is fixed on the circumferential side plate by fixing the first part and the second part to the first side plate and the second side plate respectively. The second fixing sub-plate only comprises the first part and the second part, which can save costs while ensuring reliable connection.

[0021] In some embodiments, the second fixed sub-plate further comprises a third portion disposed on one side of the first fixed sub-plate along a second direction, the third portion being used for fixing a surface of the power conversion functional assembly on one side of the power conversion functional assembly along the second direction, wherein the second direction intersects the first direction, and in a specific embodiment, the first direction is the width direction of the power supply shell, and the second direction is the length direction of the power supply shell, and the second direction intersects the first direction perpendicularly. In some embodiments, the first direction is the length direction of the power supply shell, and the second direction is the width direction of the power supply shell.

[0022] In an embodiment, the fixed plate is connected to the bottom plate and the peripheral side plate of the shell. The connection area is increased, and the stability of the connection is improved.

[0023] In an embodiment, the second fixed sub-plate has a fixing sheet at an end away from the first fixed sub-plate, the fixing sheet extending from the second fixed sub-plate to the middle of the accommodation cavity. The fixing sheet is used for fixing functional devices in the power conversion functional assembly that are disposed away from the bottom plate.

[0024] In an embodiment, the power conversion functional assembly comprises two circuit boards disposed opposite to each other along a third direction, the third direction intersecting the first direction and the second direction perpendicularly, and the third direction being the height direction of the power supply shell, one of the circuit boards being fixedly connected to the first fixed sub-plate, and the other circuit board being disposed on the side of the fixing sheet away from the bottom plate and being fixedly connected to the fixing sheet. Specifically, a hole can be formed on the fixing sheet, and the circuit board can be fixed to the fixing sheet by a stud or a rivet.

[0025] In a possible implementation, the part of the shell other than the first flow channel is of an integrated structure. The bottom plate and the peripheral side plate of the shell of the integrated structure are continuous, and no welding piece or fixing piece is needed, which can save cost and improve the sealing performance of the first flow channel. In some embodiments, a channel is formed by a die casting process, and a sealing plate is used to cover the channel to form a flow channel. The sealing position of the sealing plate and the channel needs to be welded by friction stir welding or bonded by adhesive, which results in poor sealing performance of the flow channel and poor stability of the welding or adhesive bonding after long-term use. In addition, the cooling water is more sensitive to defects such as pores, shrinkage, and cracks on the channel formed by die casting, and the risk of water leakage is high. In the present application, the part of the shell other than the part forming the first flow channel is of an integrated structure, that is, the edge of the first flow channel is integrated, which improves the sealing performance and avoids the risk of water leakage.

[0026] In a possible implementation, the outer shell comprises a first sub-shell and a second sub-shell, the first sub-shell is nested in the second sub-shell, and the cavity of the first sub-shell is a receiving cavity, the first sub-shell is fixedly connected with the fixing plate, the first flow channel is located between the first sub-shell and the second sub-shell, and the first sub-shell and the second sub-shell are integrally formed except for the part constituting the first flow channel.

[0027] In an embodiment, the first sub-shell comprises a first bottom wall and a first side wall located on one side of the first bottom wall and arranged around the first bottom wall, the second sub-shell comprises a second bottom wall and a second side wall located on one side of the second bottom wall and arranged around the second bottom wall, the first bottom wall and the second bottom wall are laminated to jointly constitute a bottom plate, and the first side wall and the second side wall are laminated to jointly constitute a peripheral side plate, part of the first flow channel is located between the first bottom wall and the second bottom wall, and part of the first flow channel is located between the first side wall and the second side wall. In some embodiments, the first flow channel can be located only between the first side wall and the second side wall and arranged around the entire first side wall. In some embodiments, the first flow channel can be located only between the first bottom wall and the second bottom wall, and the pattern of the first flow channel can be arranged according to actual needs.

[0028] In the above embodiment, the material of the first sub-shell and the second sub-shell is aluminum, which is cheap and has a good thermal conductivity, while copper is relatively expensive and stainless steel has a poor thermal conductivity.

[0029] In a possible implementation, the first sub-shell comprises a first protruding portion protruding away from the second sub-shell, and the second sub-shell and the first protruding portion constitute the first flow channel. In an embodiment, the thickness of the first protruding portion is smaller than the thickness of other parts of the second sub-shell, and the thickness refers to the dimension perpendicular to the first protruding portion or the second sub-shell. In an embodiment, the thickness of the second sub-shell is 1.5 mm, and the thickness of the first protruding portion is 1 mm. In an embodiment, when the first protruding portion is formed by a drawing process, the connection between the first protruding portion and the part of the first sub-shell other than the first protruding portion is a rounded corner.

[0030] In a possible implementation, the second sub-shell comprises a second protruding portion protruding away from the first sub-shell, and the first sub-shell and the second protruding portion constitute the first flow channel. In an embodiment, when the second protruding portion is formed by a drawing process, the connection between the second protruding portion and the part of the second sub-shell other than the second protruding portion is a rounded corner.

[0031] In a possible implementation, the first sub-shell comprises a first protruding portion protruding away from the second sub-shell, the second sub-shell comprises a second protruding portion protruding away from the first sub-shell, the first protruding portion and the second protruding portion are oppositely arranged and communicate with each other, and jointly constitute the first flow channel.

[0032] In a possible implementation, the shell comprises a first sub-shell and a second sub-shell, the first sub-shell is nested in the second sub-shell, the cavity of the first sub-shell is the receiving cavity, the first sub-shell is fixedly connected with the fixing plate, the first flow channel is located between the first sub-shell and the second sub-shell, and the edge of the opening of the first sub-shell is sealed with the edge of the opening of the second sub-shell. The first sub-shell is a groove-shaped structure composed of a first bottom wall and a first side wall, and the opening of the groove-shaped structure is the opening of the first sub-shell. The second sub-shell is a groove-shaped structure composed of a second bottom wall and a second side wall, and the opening of the groove-shaped structure is the opening of the second sub-shell.

[0033] In a possible implementation, the fixing plate is provided with a clearance hole penetrating through opposite surfaces thereof, a projection of the clearance hole on the first sub-shell in a thickness direction of the first sub-shell at least partially overlaps with a projection of the first flow channel on the first sub-shell in the thickness direction of the first sub-shell, and the clearance hole is used to accommodate at least part of the heat generating device. The thickness direction of the first sub-shell refers to a direction perpendicular to the part of the first sub-shell where the first flow channel is located. When the clearance hole is located on the first fixing sub-plate, the thickness direction of the first sub-shell refers to a direction perpendicular to the first bottom wall. When the clearance hole is located on the second fixing sub-plate, the thickness direction of the first sub-shell refers to a direction perpendicular to the first side wall.

[0034] In a possible implementation, the first flow channel comprises a first sub-channel located inside the bottom plate, the fixing plate comprises a first fixing sub-plate located opposite to the bottom plate in a third direction, at least part of the clearance hole is located in the first fixing sub-plate, and at least part of the first sub-channel is located opposite to the clearance hole in the first fixing sub-plate in the third direction. In an embodiment, the third direction is a height direction of the power supply shell, and the first sub-channel is used to cool the heat generating device above the bottom plate. In the power supply conversion device, the circuit board is generally arranged above the bottom plate of the shell, the circuit board is fixedly attached to the fixing plate face to face, and the first sub-channel cools the heat generating device such as an insulated gate bipolar transistor, a triode, and a MOS tube on the circuit board through the clearance hole.

[0035] In a possible implementation, the first flow channel further comprises a second sub-channel inside the peripheral side plate, the first sub-channel and the second sub-channel are in communication with each other, the fixed plate comprises a second fixed sub-plate, the second fixed sub-plate is fixedly connected with the surface of the peripheral side plate and connected with the first fixed sub-plate, and part of the relief holes are located in the second fixed sub-plate, and at least part of the second sub-channel and the relief holes located in the second fixed sub-plate are oppositely arranged in the third direction. The second sub-channel is used to cool the heat generating devices on the side of the peripheral side plate, such as inductors, capacitors and the like in the magnetic device, and the magnetic device can be arranged adjacent to the peripheral side plate, so that the second sub-channel in the peripheral side plate can cool and dissipate heat for the magnetic device.

[0036] In the implementation, the fixed plate can be provided with a plurality of relief holes, part of the relief holes are located in the first fixed sub-plate, and the remaining relief holes are located in the second fixed sub-plate.

[0037] In a possible implementation, the first sub-housing comprises a first protrusion protruding away from the second sub-housing, the second sub-housing and the first protrusion constitute the first flow channel, the first protrusion is located in the relief hole, and the first protrusion abuts at least part of the inner surface of the first sub-housing facing the power conversion functional assembly. In the implementation, the first protrusion is arranged in the relief hole to fill the relief hole, so that the power conversion functional assembly can be placed flat on the fixed plate, the flatness is improved, and the circuit board part located at the relief hole is prevented from being crushed when impacted.

[0038] In a possible implementation, the power supply housing further comprises an inlet nozzle and an outlet nozzle, the inlet nozzle and the outlet nozzle are located on two sides of the outer shell and in communication with the first flow channel. The inlet nozzle and the outlet nozzle can be welded on the outer side wall of the outer shell by a brazing process for communication with the first flow channel. In an embodiment, part of the first flow channel is located in the bottom plate, and part of the first flow channel is located in the peripheral side plate, the inlet nozzle and the outlet nozzle are located on the outer side of the peripheral side plate and in communication with the first flow channel in the peripheral side plate. In some embodiments, the inlet nozzle and the outlet nozzle are located on the same side of the peripheral side plate.

[0039] In a possible implementation, the power supply shell further comprises a third sub-shell, the first sub-shell and the second sub-shell are nested in the third sub-shell, and a second flow channel is arranged between the third sub-shell and the second sub-shell. The first sub-shell is nested in the second sub-shell, and the second sub-shell is nested in the third sub-shell. The first flow channel and the second flow channel can make the heat dissipation effect better. The first flow channel is arranged closer to the heat generating device in the power conversion functional assembly than the second flow channel. The first flow channel cools and absorbs heat from the heat generating device. The first flow channel absorbs heat after heat absorption and is cooled by the second flow channel to transfer heat. In some embodiments, the cooling liquid in the first flow channel and the second flow channel can be set to have different temperatures. The cooling liquid with a temperature difference can improve the heat exchange efficiency between the first flow channel and the second flow channel, and further improve the heat dissipation efficiency of the heat generating device.

[0040] In a possible implementation, the second sub-shell comprises a third protrusion protruding away from the third sub-shell, and the third sub-shell and the third protrusion constitute the second flow channel. In an embodiment, the thickness of the third protrusion is less than the thickness of the third sub-shell. The thickness refers to the dimension perpendicular to the third protrusion or the third sub-shell. In an embodiment, the thickness of the third sub-shell is 1.5 mm, and the thickness of the third protrusion is 1 mm.

[0041] In a possible implementation, the third sub-shell comprises a fourth protrusion protruding away from the second sub-shell, and the second sub-shell and the fourth protrusion constitute the second flow channel.

[0042] In a possible implementation, the second sub-shell comprises a third protrusion protruding away from the third sub-shell, and the third sub-shell comprises a fourth protrusion protruding away from the second sub-shell. The third protrusion and the fourth protrusion are oppositely arranged and communicate with each other, and jointly constitute the second flow channel.

[0043] In an embodiment, the area size of the inner surface of the third sub-shell is comparable to the area size of the outer surface of the second sub-shell. The third sub-shell is an integrated structure formed by a drawing process. The third sub-shell comprises a third bottom wall and a third side wall. The third bottom wall is located on the side of the second bottom wall away from the first bottom wall. The third side wall is located on the side of the second side wall away from the first side wall. The second flow channel is located between the third bottom wall and the second bottom wall. The third bottom wall, the second bottom wall, and the first bottom wall are stacked along a third direction to jointly constitute a bottom plate. The second flow channel is located in the bottom plate.

[0044] In an embodiment, the second flow channel is located between the third side wall and the second side wall. The third side wall, the second side wall, and the first side wall jointly constitute a circumferential side plate. The second flow channel is located in the circumferential side plate.

[0045] In an embodiment, part of the second flow channel is located between the third bottom wall and the second bottom wall, and part of the second flow channel can be located between the third side wall and the second side wall. The second flow channel is distributed in the bottom plate and the peripheral side plate.

[0046] In a possible implementation, a projection of the second flow channel on the second sub-shell along a thickness direction of the second sub-shell at least partially overlaps with a projection of the first flow channel on the second sub-shell along the thickness direction of the second sub-shell. The thickness direction of the second sub-shell refers to a direction perpendicular to the part of the second sub-shell where the second flow channel or the first flow channel is located. For example, when the second flow channel and the first flow channel are located in the bottom plate of the shell, the thickness direction is a direction perpendicular to the bottom plate. When the second flow channel and the first flow channel are located in the second side plate of the peripheral side plate, the thickness direction is a direction perpendicular to the second side plate.

[0047] Through the above design, heat transfer between the second flow channel and the first flow channel is continuous. The first flow channel can extend to the position of the heat generating device that needs to be cooled, so that the design of the second flow channel and the first flow channel is more flexible to adapt to power conversion functional components with various structural settings.

[0048] In a possible implementation, the second flow channel is not in communication with the first flow channel, the first flow channel is provided with a first medium, and the second flow channel is provided with a second medium. The thermal conductivity of the second medium is greater than the thermal conductivity of the first medium. The thermal conductivity of the second medium is greater than the thermal conductivity of the first medium, which means that the second medium has a better heat dissipation efficiency and can quickly absorb heat of the heat generating device. In an embodiment, the second medium is a phase change material, and the first medium is water.

[0049] In some embodiments, the second flow channel and the first flow channel are in communication, and two layers of flow channels can increase the flow path of the cooling liquid in the shell and improve the heat dissipation effect.

[0050] In some embodiments, the shell can further include more sub-shells stacked to form multiple flow channels, which can be set as needed to improve the heat dissipation effect.

[0051] In a second aspect, the application also provides a power conversion device, which comprises a power conversion functional assembly and the power supply housing as described in any of the preceding aspects, the power conversion functional assembly is located in the receiving cavity in the housing and is fixedly connected with the fixed plate. The power conversion device realizes the power conversion function through the power conversion functional assembly, wherein the power conversion includes AC conversion into high-voltage DC, such as converting 220V household AC or 380V industrial AC into high-voltage DC for charging the target device, when the target device is a car, the high-voltage DC can be 450V; the target device can also be other devices that need to be powered; the power conversion also includes high-voltage DC conversion into low-voltage DC, such as converting high-voltage DC in a car into low-voltage DC for powering low-voltage devices such as car lights, audio, radio, etc.

[0052] The power conversion functional assembly comprises a circuit board, magnetic devices, etc., wherein the heat generating devices of the power conversion functional assembly include insulated gate bipolar transistors, triodes, MOS tubes, etc. on the circuit board, and the heat generating devices also include inductive devices or voltage devices in the magnetic devices, etc.

[0053] In a possible implementation, the power supply housing further comprises a cover plate, one side of the housing has an opening, and the cover plate covers the opening of the housing.

[0054] In a third aspect, the application also provides an electronic device, which comprises a load and the power conversion device as described above, the power conversion device is electrically connected with the load for powering the load. The power conversion device provides the converted power to the load for powering the load.

[0055] In a possible implementation, the electronic device is a vehicle, a charging pile, a charging station, a communication device or a data center. The data center comprises a cabinet or a data room. The electronic device can also be other devices that need power conversion.

[0056] In some embodiments, when the electronic device is a data center, the load is a server in the data center, and the power conversion device converts 380V industrial power into DC power for powering the server. The voltage size of the power converted by the power conversion device can be set according to the load. BRIEF DESCRIPTION OF DRAWINGS

[0057] In order to more clearly illustrate the technical solutions in the embodiments of the application, the drawings needed to be used in the embodiments of the application will be described below.

[0058] Figure 1 is a perspective structural schematic diagram of the power supply housing provided by an embodiment of the application;

[0059] Figure 2a is a perspective view of a power conversion device according to an embodiment of the present application;

[0060] Figure 2b is a cutaway view of a power conversion device according to an embodiment of the present application;

[0061] Figure 3 is a perspective view of a power housing according to an embodiment of the present application;

[0062] Figure 4 is a cutaway view of a power housing according to an embodiment of the present application;

[0063] Figure 5a is a partial enlarged view of section A in FIG. 10 according to an embodiment of the present application; Figure 4

[0064] Figure 5b is a partial enlarged view of section B in FIG. 10 according to an embodiment of the present application; Figure 4

[0065] Figure 6 is a perspective view of a power housing according to an embodiment of the present application;

[0066] Figure 7 is a view of a structure of a bottom plate, a fixing plate, and a power conversion functional assembly part in a power housing according to an embodiment of the present application;

[0067] Figure 8 is a view of a structure of a fixing plate in a power housing according to an embodiment of the present application;

[0068] Figure 9 is a view of a structure of a bottom plate, a support frame, and a power conversion functional assembly part according to an embodiment of the present application;

[0069] Figure 10 is a view of a structure of a fixing plate in a power housing according to an embodiment of the present application;

[0070] Figure 11 is a view of a structure of a runner formed by a die casting process;

[0071] Figure 12 is a view of a step of printing a graphite blocking agent in a method of manufacturing a power housing according to an embodiment of the present application;

[0072] Figure 13 is a view of a step of hot rolling in a method of manufacturing a power housing according to an embodiment of the present application;

[0073] Figure 14 ​​is a schematic diagram of a drawing step in a method for manufacturing a power supply housing according to an embodiment of the present application;

[0074] Figure 15 is a schematic diagram of a blow molding step in a method for manufacturing a power supply housing according to an embodiment of the present application;

[0075] Figure 16 is a schematic diagram of a structure of a housing in a power supply housing according to an embodiment of the present application;

[0076] Figure 17 is a schematic diagram of a structure of a housing in a power supply housing according to an embodiment of the present application;

[0077] Figure 18 is a schematic diagram of a structure of a housing in a power supply housing according to an embodiment of the present application;

[0078] Figure 19 is a schematic diagram of a structure of a housing in a power supply housing according to an embodiment of the present application;

[0079] Figure 20 is a perspective exploded view of a power supply housing according to an embodiment of the present application;

[0080] Figure 21 is a schematic diagram of a position of a power supply housing and a circuit board according to an embodiment of the present application;

[0081] Figure 22 is a schematic diagram of a position of a power supply housing and a power conversion functional component according to an embodiment of the present application;

[0082] Figure 23 is a schematic diagram of a position of a power supply housing and a circuit board according to an embodiment of the present application;

[0083] Figure 24 is a schematic diagram of a structure of a housing in a power supply housing according to an embodiment of the present application;

[0084] Figure 25 is a schematic diagram of a structure of a housing in a power supply housing according to an embodiment of the present application;

[0085] Figure 26 is a schematic diagram of a structure of a housing in a power supply housing according to an embodiment of the present application;

[0086] Figure 27 is a schematic diagram of a position of a first flow path, a second flow path, and a heat generating device in a power supply housing according to an embodiment of the present application;

[0087] Figure 28 is a schematic diagram of a structure of a housing formed by a die casting process;

[0088] Figure 29Fig. 1 is a structural schematic diagram of an electronic device provided by an embodiment of the present application. DETAILED DESCRIPTION

[0089] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all of the embodiments of the present application.

[0090] In this document, the terms "first", "second", etc. are used only for descriptive purposes, and cannot be construed as indicating or implying relative importance or implying the number of the technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0091] In addition, in this document, the orientation terms such as "upper", "lower", etc. are defined with respect to the orientation of the structural schematic in the drawings, and it should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and can be changed accordingly according to the change of the orientation of the structure.

[0092] For the convenience of understanding, the English abbreviations and related technical terms involved in the embodiments of the present application will be explained and described below.

[0093] Drawing process: also known as drawing, stretching, calendering process, etc., refers to the use of a mold to stamp various open hollow parts from a certain shape flat blank after blanking or to reduce the diameter and increase the height of the open hollow blank. The drawing process can be used to manufacture cylindrical, stepped, conical, spherical, box-shaped and other irregular-shaped thin-walled parts.

[0094] MOS tube: MOSFET is an abbreviation of Metal-Oxide-Semiconductor Field-Effect Transistor, Metal-Oxide-Semiconductor Field-Effect Transistor.

[0095] Die casting: die casting is a kind of precision casting method which uses high pressure to force molten metal into a metal mold with complex shape. Its characteristic is to apply high pressure to the molten metal in the mold cavity. The mold is usually made of higher strength alloy.

[0096] Draft angle: the draft angle is also called the demolding angle, which is designed on both sides of the mold bore to facilitate demolding.

[0097] Welded flange: is a part for connecting pipes to each other, connected to the pipe end.

[0098] Friction stir welding: This refers to the use of heat generated by the friction between a high-speed rotating welding tool and the workpiece to locally melt the materials being welded. As the welding tool moves forward along the welding interface, the plasticized material flows from the front to the rear of the welding tool under the action of the rotational friction force of the welding tool, and forms a dense solid phase weld under the pressure of the welding tool.

[0099] Please see Figure 1 One embodiment of this application provides a power supply housing 10, including an outer shell 100 and a fixing plate 200. The outer shell 100 has a receiving cavity 101, and a first flow channel 300 is provided inside the outer shell 100. The fixing plate 200 is located inside the receiving cavity 101, and at least a portion of the surface of the fixing plate 200 facing the outer shell 100 is fixedly connected to at least a portion of the inner surface of the outer shell 100. The fixing plate 200 is used to fix a power conversion functional component 400 (such as...). Figure 2a As shown, the heat-generating device 401 in the power conversion function component 400 is cooled by the cooling fluid in the first flow channel 300.

[0100] The outer casing 100 is formed by a deep drawing process. The material of the outer casing 100 is aluminum. The aluminum sheet is drawn to form the outer casing 100 with a receiving cavity 101. The first flow channel 300 inside the outer casing 100 is used to cool the heat-generating device 401 in the power conversion functional component 400. The cooling fluid in the first flow channel 300 can be water, a cooling medium, or a phase change medium. In some embodiments, the outer casing 100 is formed by a die casting process, and the first flow channel 300 is formed therein.

[0101] In this application, the power supply housing 10 is applied to the power conversion device 20 (e.g., Figure 2a As shown, the power conversion device 20 includes a power housing 10 and a power conversion functional component 400 located within the power housing 10. The power housing 10 also includes a cover plate 600, and one side of the housing 100 has an opening 106. The cover plate 600 covers the opening 106 of the housing 100. The power conversion functional component 400 is a combination of components used to realize the power conversion function. The power conversion includes AC to high-voltage DC, for example, converting 220V household AC or 380V industrial AC to high-voltage DC to charge the target device. When the target device is a car, the high-voltage DC can be 450V. The target device can also be other devices that require power. The power conversion also includes high-voltage DC to low-voltage DC, for example, converting the high-voltage DC in a car to low-voltage DC to power low-voltage devices such as car lights, audio equipment, and radios. The housing 100 may be provided with a connection hole 107 (e.g., Figure 3 As shown), the power conversion device 20 also includes a connector 21 (such as...). Figure 2a As shown), connector 21 connects the power conversion function component 400 and the external load or external power source through connector hole 107.

[0102] Please refer to Figure 2b The power conversion functional assembly 400 includes a circuit board 410, a magnetic device 420, etc., wherein the heat generating device 401 of the power conversion functional assembly 400 includes an insulated gate bipolar transistor 411, a triode 412, a MOS tube, etc. on the circuit board 410, and the heat generating device 401 also includes an inductor device or a voltage device in the magnetic device 420. One function of the circuit board 410 is to connect the insulated gate bipolar transistor 411, the triode 412, the MOS tube, and the magnetic device 420, etc. Since the power conversion functional assembly 400 has multiple devices, these devices need to be fixed in the receiving cavity 101 of the shell 100. The shell formed by the die casting process can directly form fixing columns on the inner wall of the shell for fixing the devices, but the fixing columns are generally more, which increases the cost and process complexity of the die casting mold; when the shell 100 is formed by the drawing process, it is not possible to integrally form fixing columns for fixing the devices on the inner surface of the shell 100, and it is necessary to weld the fixing columns on the inner surface of the shell 100. Generally, the fixing columns are first fixed on the inner surface of the shell 100 by welding or adhesive, and then the power conversion functional assembly 400 is fixed with the fixing columns to fix the power conversion functional assembly 400 in the shell 100. This way, the fixing columns need to be fixed one by one on the inner surface of the shell 100, and the end surface of the fixing column is generally small and unstable in fixing with the inner surface of the shell 100. On the other hand, if the fixing columns are welded one by one on the shell 100 or are bonded one by one on the shell by adhesive, the welding process is long and complex. On the other hand, when the shell 100 formed by the drawing process or the die casting process is made of aluminum material, the stability of direct welding on the aluminum shell 100 is poor, and the welding yield is low. The stability of direct bonding on the aluminum shell 100 by adhesive is also poor.

[0103] In the present application, the fixing plate 200 is fixedly connected to at least part of the surface of the shell 100 and at least part of the inner surface of the shell 100, and the fixed connection includes welding or adhesive bonding. The surface of the fixing plate 200 and the surface of the shell 100 are fixedly connected, which can improve the stability of the connection. Compared with the connection method of the small size end surface of the stud and the inner surface of the shell 100, the surface of the fixing plate 200 and the surface of the shell 100 are connected by a face-to-face connection method, the connection area is large, and the connection stability is higher. The fixing plate 200 is fixedly connected with the power conversion functional assembly 400 to fix the power conversion functional assembly 400 in the receiving cavity 101 inside the shell 100. Compared with the method of forming fixing columns by die casting process, the process of using the fixing plate 200 is simpler and has low process cost.

[0104] In an embodiment, the fixing plate 200 is fixedly connected to all surfaces of the housing 100, so as to improve the stability of the connection between the fixing plate 200 and the housing 100. In an embodiment, the fixing plate 200 can be fixedly connected to part of the surfaces of the housing 100.

[0105] Referring to Figure 4 and Figure 5b In a possible implementation, the fixing plate 200 is provided with fixing holes 210 (as shown in Figure 5b ) penetrating through the two surfaces of the fixing plate 200, and the fixing holes 210 are provided with fixing members 220. The fixing holes 210 and the fixing members 220 are matched to fix the power conversion functional assembly 400.

[0106] The size and number of the fixing holes 210 and the fixing members 220 can be set according to the size and number of the functional devices in the power conversion functional assembly 400, so as to stably fix the devices in the power conversion functional assembly 400 in the housing 100. As shown in Figure 4 , the fixing plate 200 is provided with a plurality of fixing members 220, and the fixing members 220 can be studs or rivets. The fixing members 220 and the fixing holes 210 can be fixed by thread connection or riveting. When the fixing members 220 are fixed by thread connection, the fixing members 220 are studs, and the inner wall of the fixing hole 210 is provided with internal threads matched with the studs. When the fixing members 220 are fixed by riveting, the fixing members 220 are rivets (as shown in Figure 5b ), and the fixing hole 210 is provided with a groove 211 recessed from the hole wall of the fixing hole 210 toward the housing 100. The fixing member 220 is provided with a protrusion 222 protruding from the fixing member 220 toward the housing 100, and the protrusion 222 is located in the groove 211 to fix the fixing member 220 in the fixing hole 210. When the fixing members 220 are multiple, the height of each fixing member 220 can be set according to requirements. For example, the height of part of the fixing members 220 can be set to be higher, such as the fixing members 220 in Figure 10 , and the height of part of the fixing members 220 can be set to be lower, such as the fixing members 230 in Figure 10 .

[0107] In an embodiment, the area of the surface of the fixing plate 200 facing the housing 100 is greater than 1 / 4 of the area of the inner surface of the housing 100, so as to provide the fixing plate 200 with sufficient area to install a sufficient number of fixing members 220.

[0108] Referring to Figure 1 and Figure 6In a possible implementation, the shell 100 includes a bottom plate 110 and a circumferential side plate 120 located on one side of the bottom plate 110 and surrounding the bottom plate 110, the bottom plate 110 and the circumferential side plate 120 form a receiving cavity 101, and the fixing plate 200 includes a first fixing sub-plate 260 (as shown in Figure 1 FIG. 1) arranged in a stack with the bottom plate 110, at least part of a surface of the first fixing sub-plate 260 facing the bottom plate 110 is fixedly connected with at least part of an inner surface of the bottom plate 110, an area of the surface of the first fixing sub-plate 260 facing the bottom plate 110 is greater than or equal to 0.5 times an area of a surface of the bottom plate 110 facing the first fixing sub-plate 260, and less than or equal to the area of the surface of the bottom plate 110 facing the first fixing sub-plate 260.

[0109] In the embodiment, the circumferential side plate 120 is perpendicular to the bottom plate 110, and when the shell 100 is formed by a drawing process, the circumferential side plate 120 can be arranged perpendicular to the bottom plate 110. In the embodiment, when the shell 100 is formed by a drawing process, a connection between the circumferential side plate 120 and the bottom plate 110 is a rounded corner 103 (as shown in Figure 4 FIG. 1). In an embodiment, the circumferential side plate 120 deviates from a direction perpendicular to the bottom plate 110 by a certain angle, and when the shell 100 is formed by a die casting process, the circumferential side plate 120 has a draft angle, so that the circumferential side plate 120 deviates from the direction perpendicular to the bottom plate 110 by the certain angle.

[0110] In the embodiment, the area of the first fixing sub-plate 260 is greater than half the area of the bottom plate 110, which is beneficial for fixing the power conversion functional assembly 400. Since the power conversion functional assembly 400 has relatively many and scattered functional devices, including but not limited to a circuit board 410, inductor devices, voltage devices, etc., when the functional devices are distributed on the left and right, front and back, or middle in the receiving cavity 101, the area of the first fixing sub-plate 260 cannot be too small, and the area of the surface of the first fixing sub-plate 260 facing the bottom plate 110 is greater than or equal to 0.5 times the area of the surface of the bottom plate 110 facing the first fixing sub-plate 260, so that the first fixing sub-plate 260 has sufficient area to install a sufficient number of fixing sub-components 220 for fixing the various functional devices in the power conversion functional assembly 400. Please refer to Figure 7 , Figure 7is a structural diagram of the bottom plate 110 and the power conversion functional assembly 400, in an embodiment, the area of the surface of the first fixed sub-plate 260 facing the bottom plate 110 is equal to 0.8 times the area of the surface of the bottom plate 110 facing the first fixed sub-plate 260, the power conversion functional assembly 400 includes two magnetic devices 420 and one circuit board 410, the two magnetic devices 420 are respectively denoted as 420a and 420b, and the circuit board 410 is located between the two magnetic devices 420, since the first fixed sub-plate 260 occupies most of the area of the bottom plate 110, the two magnetic devices 420 and the circuit board 410 can be fixed on the fixed plate 200 through the fixed sub-piece 220. In some embodiments, when the area of the first fixed sub-plate 260 is small, the first fixed sub-plate 260 can be designed in a pattern (as shown in Figure 8 ), so that the first fixed sub-plate 260 can fix the functional devices in the power conversion functional assembly 400 which are arranged towards the bottom plate 110, and the specific pattern can be designed according to the arrangement position and quantity of each device in the power conversion functional assembly 400.

[0111] In some embodiments, please refer to Figure 9 , Figure 9 is a structural diagram of the bottom plate 110 and the power conversion functional assembly 400, two long strip-shaped support frames 201 are used to support and fix the power conversion functional assembly 400, the two support frames 201 are distributed on both sides of the bottom plate 110, the support frame 201 can only fix and support the magnetic devices 420a and 420b on both sides of the accommodation cavity 101, and cannot fix the circuit board 410 in the middle of the accommodation cavity 101, but can fix the circuit board 410 on one side and the magnetic device 420a through welding or a fixed piece 202, and fix the other side of the circuit board 410 and the magnetic device 420b through welding or a fixed piece 202, which will increase the cost, and the stability of the side fixation between the circuit board 410 and the magnetic device 420 is not as good as the stability of the bottom fixation between the circuit board 410 and the fixed plate 200, so for the power conversion functional assembly 400, the devices are more and scattered, and a fixed plate 200 with a larger area is used to fix and support, which can improve the stability of the fixed connection.

[0112] Please continue to refer to Figure 1In a possible implementation, the fixing plate 200 further comprises a second fixing sub-plate 270, which is located on the inner side of the circumferential side plate 120 and intersects the first fixing sub-plate 260, and is fixedly connected to at least part of the surface of the circumferential side plate 120. The second fixing sub-plate 270 can fix the power conversion functional component 400 from the side, for example, can fix the magnetic device 420 towards the surface of the circumferential side plate 120, to improve the stability of the fixed connection. The second fixing sub-plate 270 intersects the first fixing sub-plate 260, including that the second fixing sub-plate 270 is perpendicular to the first fixing sub-plate 260, or the second fixing sub-plate 270 deviates from the direction perpendicular to the first fixing sub-plate 260 by a certain angle, for example, in an embodiment, the included angle between the second fixing sub-plate 270 and the first fixing sub-plate 260 is greater than or equal to 80° and less than 90°, and the second fixing sub-plate 270 can be used to fix the part of the power conversion functional component 400 that has a certain distance from the circumferential side plate 120.

[0113] In an embodiment, the second fixing sub-plate 270 and the first fixing sub-plate 260 are integrated structures. That is, the fixing plate 200 is an integrated structure. The material of the fixing plate 200 is aluminum. In an embodiment, the shape of the fixing plate 200 is matched with the shell 100, and the fixing plate 200 is attached to the inner wall of the shell 100. The fixing plate 200 can be formed by a drawing process, and the fixing plate 200 can also be formed by a bending process.

[0114] In an embodiment, the second fixing sub-plate 270 comprises a first part 271 and a second part 272 arranged opposite along the first direction X (as shown in Figure 10 , the circumferential side plate 120 comprises a first side plate 121 and a second side plate 122 arranged opposite along the first direction X (as shown in Figure 1 , the first part 271 is located on the surface of the first side plate 121 facing the accommodation cavity 101, and the second part 272 is located on the surface of the second side plate 122 facing the accommodation cavity 101. The first part 271, the first fixing sub-plate 260 and the second part 272 are integrated structures. In this embodiment, the second fixing sub-plate 270 is fixed on the circumferential side plate 120 by the fixed connection of the first part 271 and the second part 272 with the first side plate 121 and the second side plate 122 respectively, and the second fixing sub-plate 270 only comprises the first part 271 and the second part 272, which can save costs while ensuring reliable connection. In some embodiments, the second fixing sub-plate 270 further comprises a third part 273 arranged on one side of the first fixing sub-plate 260 along the second direction Y (as shown in Figure 10As shown in FIG. 3, the third part 273 is used to fix the surface of the power conversion functional assembly 400 on one side of the second direction Y, wherein the second direction Y intersects the first direction X, in a specific embodiment, the first direction X is the width direction of the power supply shell 10, the second direction Y is the length direction of the power supply shell 10, and the second direction Y intersects the first direction X perpendicularly. In some embodiments, the first direction X is the length direction of the power supply shell 10, and the second direction Y is the width direction of the power supply shell 10.

[0115] In Figure 1 In the embodiment shown in FIG. 3, the fixing plate 200 is connected with the bottom plate 110 and the peripheral side plate 120 of the shell 100, thereby increasing the fixing connection area and improving the stability of the fixing connection.

[0116] Please continue to refer to Figure 1 In an embodiment, the second fixing sub-plate 270 has a fixing sheet 240 at the end away from the first fixing sub-plate 260, and the fixing sheet 240 extends from the second fixing sub-plate 270 to the middle of the accommodation cavity 101. The fixing sheet 240 is used to fix the functional devices in the power conversion functional assembly 400 arranged away from the bottom plate 110. In an embodiment, the power conversion functional assembly 400 includes two circuit boards 410 arranged oppositely along the third direction Z (as shown in FIG. 3), wherein the third direction Z intersects the first direction X and the second direction Y perpendicularly, and the third direction Z is the height direction of the power supply shell 10. The two circuit boards are respectively denoted as 410a and 410b. The circuit board 410a is fixedly connected with the first fixing sub-plate 260, and the circuit board 410b is located on the side of the fixing sheet 240 away from the bottom plate 110 and is fixedly connected with the fixing sheet 240. Specifically, a hole can be opened on the fixing sheet 240, and the circuit board 410b can be fixed on the fixing sheet 240 through a stud or a rivet. Figure 2b

[0117] Please continue to refer to Figure 4 In a possible implementation, the part of the shell 100 other than the first flow channel 300 is an integrated structure. The bottom plate 110 and the peripheral side plate 120 in the integrated structure of the shell 100 are continuous, and no welding or fixing member is needed, thereby saving cost and improving the sealing performance of the first flow channel 300. Please refer to Figure 11 ​In some embodiments, the channel 303 is formed by die casting, and then the channel 303 is sealed with a sealing plate 304 to form a flow channel. The sealing position 305 between the sealing plate 304 and the channel 303 needs to be welded by friction stir welding or bonded with adhesive, resulting in poor sealing of the flow channel. Moreover, the stability of the welding or adhesive bonding is poor after long-term use. In addition, cooling water is more sensitive to defects such as porosity, shrinkage porosity, and cracks on the die-cast channel 303, resulting in a high risk of water leakage. In this embodiment, the part of the outer shell 100 that constitutes the first flow channel 300 is an integrated structure, that is, the edge of the first flow channel 300 is integrated, resulting in better sealing and avoiding the risk of water leakage.

[0118] Please continue reading. Figure 4 In one possible implementation, the outer shell 100 includes a first sub-shell 140 and a second sub-shell 150. The first sub-shell 140 is nested inside the second sub-shell 150, and the cavity of the first sub-shell 140 is a receiving cavity 101. The first sub-shell 140 is fixedly connected to the fixing plate 200. The first flow channel 300 is located between the first sub-shell 140 and the second sub-shell 150. The parts of the first sub-shell 140 and the second sub-shell 150, except for those constituting the first flow channel 300, are hot-rolled and fused into an integrated structure.

[0119] The first flow channel 300 can be formed through a blow-blowing process; specifically, a graphite rolling resistance agent (such as...) is first printed on it. Figure 12 As shown): Graphite rolling resist 306 is printed at the location where the first flow channel 300 needs to be formed between the first plate 301 and the second plate 302. Different patterns are created and printed in the interlayer between the first plate 301 and the second plate 302 according to heat dissipation requirements; hot rolling (e.g.) Figure 13 As shown): The parts without printed graphite resistance 306 will fuse together after hot rolling to form the outer shell preform 105, while the parts with graphite resistance 306, the first plate 301 and the second plate 302, will remain separated after hot rolling; deep drawing (as shown) Figure 14 As shown): The hot-rolled precast outer shell plate 105 is formed into an outer shell 100 by a deep drawing process. The first plate 301 and the second plate 302 are respectively formed into a first sub-shell 140 and a second sub-shell 150 by a deep drawing process. The portions of the first sub-shell 140 and the second sub-shell 150, except for those forming the first flow channel 300, are hot-rolled and fused into an integrated structure; (e.g., blow-blown) Figure 15 As shown): Through the blowing process, local deformation will occur when the graphite rolling resist 306 is printed. The second sub-shell 150 will bulge outward to form a second protrusion 153 that protrudes away from the first sub-shell 140. The second protrusion 153 and the first sub-shell 140 together form a closed first flow channel 300.

[0120] Please continue reading. Figure 4 and Figure 5a, the first sub-shell 140 includes a first bottom wall 141 and a first side wall 142 located on one side of the first bottom wall 141 and surrounding the first bottom wall 141, and the second sub-shell 150 includes a second bottom wall 151 and a second side wall 152 located on one side of the second bottom wall 151 and surrounding the second bottom wall 151, the first bottom wall 141 and the second bottom wall 151 are laminated to form the bottom plate 110, and the first side wall 142 and the second side wall 152 are laminated to form the peripheral side plate 120, part of the first flow channel 300 is located between the first bottom wall 141 and the second bottom wall 151, and part of the first flow channel 300 is located between the first side wall 142 and the second side wall 152. In some embodiments, the first flow channel 300 can be located only between the first side wall 142 and the second side wall 152 (as shown in Figure 16 ), and is arranged around the entire first side wall 142. In some embodiments, the first flow channel 300 can be located only between the first bottom wall 141 and the second bottom wall 151 (as shown in Figure 17 ), and the pattern of the first flow channel 300 can be arranged according to actual needs.

[0121] In some embodiments, the first sub-shell 140 and the second sub-shell 150 are made of aluminum material, which is cheap and has a good thermal conductivity, while copper is relatively expensive and stainless steel has poor thermal conductivity.

[0122] Please refer to Figure 18 , in a possible implementation, the first sub-shell 140 includes a first protruding part 143 protruding away from the second sub-shell 150, and the second sub-shell 150 and the first protruding part 143 form the first flow channel 300. In this embodiment, the thickness of the first protruding part 143 is less than the thickness of other parts of the second sub-shell 150, and the thickness refers to the dimension perpendicular to the first protruding part 143 or the second sub-shell 150. In an embodiment, the thickness of the second sub-shell 150 is 1.5 mm, and the thickness of the first protruding part 143 is 1 mm. In an embodiment, when the first protruding part 143 is formed by a deep drawing process, the connection between the first protruding part 143 and the part of the first sub-shell 140 other than the first protruding part 143 is a round corner 108 (as shown in Figure 18 ).

[0123] Please refer to Figure 15 , in a possible implementation, the second sub-shell 150 includes a second protruding part 153 protruding away from the first sub-shell 140, and the first sub-shell 140 and the second protruding part 153 form the first flow channel 300. In an embodiment, when the second protruding part 153 is formed by a deep drawing process, the connection between the second protruding part 153 and the part of the second sub-shell 150 other than the second protruding part 153 is a round corner 104 (as shown in Figure 15 ).

[0124] Please refer to Figure 19In a possible implementation, the first sub-shell 140 comprises a first protrusion 143 protruding away from the second sub-shell 150, the second sub-shell 150 comprises a second protrusion 153 protruding away from the first sub-shell 140, the first protrusion 143 and the second protrusion 153 are oppositely arranged and in communication with each other, and together form the first flow channel 300.

[0125] Referring to Figure 20 In a possible implementation, the outer shell 100 comprises a first sub-shell 140 and a second sub-shell 150, the first sub-shell 140 is nested in the second sub-shell 150, the cavity of the first sub-shell 140 is the accommodation cavity 101, the first sub-shell 140 is fixedly connected with the fixed plate 200, the first flow channel 300 is located between the first sub-shell 140 and the second sub-shell 150, and the edge of the opening 144 of the first sub-shell 140 is sealed with the edge of the opening 154 of the second sub-shell 150. The first sub-shell 140 is a groove-shaped structure formed by a first bottom wall 141 and a first side wall 142, and the opening of the groove-shaped structure is the opening 144 of the first sub-shell 140. The second sub-shell is a groove-shaped structure formed by a second bottom wall 151 and a second side wall 152, and the opening of the groove-shaped structure is the opening 154 of the second sub-shell 150.

[0126] The first sub-shell 140 and the second sub-shell 150 are integrated structures formed by a drawing process, and the first flow channel 300 is formed by a drawing process. Specifically, the first plate 301 is formed into the first sub-shell 140 by a drawing process, the second plate 302 is formed into the second sub-shell 150 by a drawing process, and the second protrusion 153 is formed by a drawing process. The size and shape of the first sub-shell 140 and the second sub-shell 150 are matched, the first sub-shell 140 is nested in the second sub-shell 150, the second protrusion 153 and the first sub-shell 140 form the first flow channel 300, and finally the edge of the opening 144 of the first sub-shell 140 and the edge of the opening 154 of the second sub-shell 150 are welded by a flange welding or sealed by a sealant. The edge of the opening 144 of the first sub-shell 140 is the edge of the first side wall 142 away from the first bottom wall 141, and the edge of the opening 154 of the second sub-shell 150 is the edge of the second side wall 152 away from the second bottom wall 151. In this embodiment, only the edges of the first sub-shell 140 and the second sub-shell 150 need to be sealed and connected, and the other parts can be partially welded for structural reinforcement. The partial welding position can not damage the integrated structure of the first sub-shell 140 and the second sub-shell 150, has good sealing performance, and has high production efficiency of drawing forming.

[0127] It should be noted that the first flow channel 300 formed by the drawing process can be formed by the second sub-shell 150 and the first protrusion 143, or by the first sub-shell 140 and the second protrusion 153, or by the first protrusion 143 and the second protrusion 153.

[0128] Please continue reading. Figure 10 In one possible implementation, the fixing plate 200 is provided with a clearance hole 250 penetrating its two opposing surfaces. The projection of the clearance hole 250 on the first sub-shell 140 along the thickness direction of the first sub-shell 140 at least partially coincides with the projection of the first flow channel 300 on the first sub-shell 140 along the thickness direction of the first sub-shell 140. The clearance hole 250 is used to accommodate at least a portion of the heating device 401. The thickness direction of the first sub-shell 140 refers to the direction perpendicular to the portion of the first sub-shell 140 where the first flow channel 300 is located. When the clearance hole 250 is located on the first fixing plate 260, the thickness direction of the first sub-shell 140 is perpendicular to the first bottom wall 141 (e.g., ...). Figure 20 As shown), that is Figure 20 The third direction Z. When the clearance hole 250 is located on the second fixing sub-plate 270, the thickness direction of the first sub-shell 140 is perpendicular to the first sidewall 142.

[0129] Among them, the heat-generating devices 401 on the circuit board 410, such as insulated-gate bipolar transistors 411, transistors 412, and MOSFETs, are protruding from the surface of the circuit board 410. When the circuit board 410 is placed on the fixing plate 200, the heat-generating devices 401 will cause the surface of the circuit board 410 to not fit tightly against the surface of the fixing plate 200. When the heat-generating devices 401 are housed in the clearance holes 250 (such as...), Figure 21 As shown, this design allows the surface of the circuit board 410 to fit tightly against the surface of the fixing plate 200. Furthermore, the first flow channel 300 below the recessed hole 250 can directly cool the heat-generating device 401 located within the recessed hole 250, improving the cooling effect. In some embodiments, the heat-generating device 401 can also be an inductor or voltage regulator within the magnetic device 420, and the magnetic device 420 can also be placed within the recessed hole 250. The circuit board 410 and the fixing plate 200 are fixedly connected face-to-face. At least one of an insulated-gate bipolar transistor, a transistor, or a MOSFET can be placed within the recessed hole 250, wherein the number and size of the recessed holes 250 can be determined according to the number and size of the heat-generating device 401.

[0130] Please see Figure 22In a possible implementation, the first flow channel 300 includes a first sub-channel 310 inside the bottom plate 110, the fixing plate 200 includes a first fixing sub-plate 260 opposite to the bottom plate 110 along the third direction Z, and at least part of the avoiding holes 250 are located in the first fixing sub-plate 260. At least part of the first sub-channel 310 is opposite to the avoiding holes 250 in the first fixing sub-plate 260 along the third direction Z. In the embodiment, the third direction Z is the height direction of the power supply shell 10, and the first sub-channel 310 is used to cool the heat generating devices 401 above the bottom plate 110. In the power conversion device 20, the circuit board 410 is generally arranged above the bottom plate 110 of the shell 100, and the circuit board 410 is fixed by being attached to the fixing plate 200 face to face. The first sub-channel 310 cools the heat generating devices 401 such as the insulated gate bipolar transistor 411, the triode 412, and the MOS tube on the circuit board 410 through the avoiding holes 250.

[0131] For more details, please refer to Figure 22 In a possible implementation, the first flow channel 300 further includes a second sub-channel 320 inside the circumferential side plate 120, the first sub-channel 310 and the second sub-channel 320 are in communication with each other, the fixing plate 200 includes a second fixing sub-plate 270, the second fixing sub-plate 270 is fixedly connected to the surface of the circumferential side plate 120 and connected to the first fixing sub-plate 260, and part of the avoiding holes 250 are located in the second fixing sub-plate 270. At least part of the second sub-channel 320 is opposite to the avoiding holes 250 in the second fixing sub-plate 270 along the third direction Z. In the embodiment, the second sub-channel 320 is used to cool the heat generating devices 401 on the side of the circumferential side plate 120, such as the inductance and the capacitor in the magnetic device 420. The magnetic device 420 can be arranged adjacent to the circumferential side plate 120, so that the second sub-channel 320 in the circumferential side plate 120 can cool and dissipate heat for the magnetic device 420.

[0132] In the embodiment, the fixing plate 200 can be provided with multiple avoiding holes 250, part of the avoiding holes 250 are located in the first fixing sub-plate 260, and the remaining avoiding holes 250 are located in the second fixing sub-plate 270. For example, the fixing plate 200 has 10 avoiding holes 250, 6 of which are located in the first fixing sub-plate 260, and 4 of which are located in the second fixing sub-plate 270.

[0133] For more details, please refer to Figure 23In a possible implementation, the first sub-shell 140 includes a first protrusion 143 protruding away from the second sub-shell 150, the second sub-shell 150 and the first protrusion 143 form the first flow channel 300, the first protrusion 143 is located in the clearance hole 250, and the first protrusion 143 abuts at least part of the inner surface of the power conversion functional assembly 400 facing the first sub-shell 140. In this way, the first protrusion 143 is arranged in the clearance hole 250, and the clearance hole 250 is filled, so that the power conversion functional assembly 400 can be placed flat on the fixing plate 200, the flatness is improved, and the circuit board 410 part located at the clearance hole 250 is prevented from being crushed when impacted.

[0134] For example, when the power conversion functional assembly 400 is a circuit board 410, when the circuit board 410 is placed on the first fixed sub-plate 260, the circuit board 410 includes a part of the circuit board 410a without an insulated gate bipolar transistor 411, a triode 412, an MOS tube, and a part of the circuit board 410b with a heat generating device 401, the first fixed sub-plate 260 includes a clearance hole 250a and a clearance hole 250b, part of the first flow channel 300 protrudes into the clearance hole 250a, part of the first flow channel 300 at the clearance hole 250b is located below the first fixed sub-plate 260, the part of the circuit board 410b with the heat generating device 401 is located above the clearance hole 250b, so that the heat generating device 401 is located in the clearance hole 250b, and the part of the circuit board 410a without the heat generating device 401 is located above the clearance hole 250a. Although the part of the circuit board 410a does not directly arrange the heat generating device 401, the heat generated by the part of the circuit board 410b will be transferred to the part of the circuit board 410a, the part of the first flow channel 300 protruding into the clearance hole 250a can cool the part of the circuit board 410a, and the part of the first flow channel 300 can also support the part of the circuit board 410a.

[0135] Please continue to refer to Figure 6 In a possible implementation, the power shell 10 further includes a liquid inlet nozzle 700 and a liquid outlet nozzle 800, the liquid inlet nozzle 700 and the liquid outlet nozzle 800 are located on two sides of the shell 100 and communicate with the first flow channel 300. A hole can be opened on the outer side wall of the shell 100, and the hole is welded by a brazing process to weld the liquid inlet nozzle 700 and the liquid outlet nozzle 800, which are used to communicate with the first flow channel 300. In this embodiment, part of the first flow channel 300 is located in the bottom plate 110, and part of the first flow channel 300 is located in the peripheral side plate 120. The liquid inlet nozzle 700 and the liquid outlet nozzle 800 are located on the outer side of the peripheral side plate 120 and communicate with the first flow channel 300 in the peripheral side plate 120. In some embodiments, the liquid inlet nozzle 700 and the liquid outlet nozzle 800 are located on the same side of the peripheral side plate 120.

[0136] Please refer toFigure 24 In a possible implementation, the power supply shell 10 further comprises a third sub-shell 160, the first sub-shell 140 and the second sub-shell 150 are nested in the third sub-shell 160, and the second flow channel 500 is arranged between the third sub-shell 160 and the second sub-shell 150. In the embodiment, the first sub-shell 140 is nested in the second sub-shell 150, and the second sub-shell 150 is nested in the third sub-shell 160. The first flow channel 300 and the second flow channel 500 can improve the heat dissipation effect, the first flow channel 300 is arranged closer to the heat generating device 401 in the power conversion functional assembly 400 than the second flow channel 500, the first flow channel 300 absorbs heat to cool the heat generating device 401, and the first flow channel 300 after absorbing heat is cooled by the second flow channel 500 to transfer heat. In some embodiments, the cooling liquid in the first flow channel 300 and the second flow channel 500 can be set to different temperatures, for example, the temperature of the cooling liquid in the first flow channel 300 is between 10°C and 15°C, and the temperature of the cooling liquid in the second flow channel 500 is between 5°C and 10°C. The cooling liquid with a temperature difference can improve the heat exchange efficiency between the first flow channel 300 and the second flow channel 500, thereby improving the heat dissipation efficiency of the heat generating device 401.

[0137] Please continue to refer to Figure 24 In a possible implementation, the second sub-shell 150 comprises a third protrusion 154 protruding away from the third sub-shell 160, and the third sub-shell 160 and the third protrusion 154 constitute the second flow channel 500. In the embodiment, the thickness of the third protrusion 154 is less than the thickness of the third sub-shell 160, and the thickness refers to the dimension perpendicular to the third protrusion 154 or the third sub-shell 160. In an embodiment, the thickness of the third sub-shell 160 is 1.5 mm, and the thickness of the third protrusion 154 is 1 mm.

[0138] Please refer to Figure 25 In a possible implementation, the third sub-shell 160 comprises a fourth protrusion 163 protruding away from the second sub-shell 150, and the second sub-shell 150 and the fourth protrusion 163 constitute the second flow channel 500.

[0139] Please refer to Figure 26 In a possible implementation, the second sub-shell 150 comprises a third protrusion 154 protruding away from the third sub-shell 160, and the third sub-shell 160 comprises a fourth protrusion 163 protruding away from the second sub-shell 150, the third protrusion 154 and the fourth protrusion 163 are arranged opposite to each other and communicate with each other, and jointly constitute the second flow channel 500.

[0140] Please continue to refer to Figure 26In an embodiment, the third sub-shell 160 has an inner surface with an area size comparable to that of the outer surface of the second sub-shell 150. The third sub-shell 160 is formed by a deep drawing process and has an integrated structure. The third sub-shell 160 includes a third bottom wall 161 and a third side wall 162. The third bottom wall 161 is located on the side of the second bottom wall 151 away from the first bottom wall 141. The third side wall 162 is located on the side of the second side wall 152 away from the first side wall 142. The second flow channel 500 is located between the third bottom wall 161 and the second bottom wall 151. In this embodiment, the third bottom wall 161, the second bottom wall 151, and the first bottom wall 141 are stacked along the third direction Z to form the bottom plate 110. The second flow channel 500 is located in the bottom plate 110.

[0141] In an embodiment, the second flow channel 500 is located between the third side wall 162 and the second side wall 152. The third side wall 162, the second side wall 152, and the first side wall 142 together form the peripheral side plate 120. The second flow channel 500 is located in the peripheral side plate 120.

[0142] In an embodiment, part of the second flow channel 500 is located between the third bottom wall 161 and the second bottom wall 151. Part of the second flow channel 500 can be located between the third side wall 162 and the second side wall 152. The second flow channel 500 is distributed in the bottom plate 110 and the peripheral side plate 120.

[0143] Please continue to read Figure 25 In a possible implementation, the projection of the second flow channel 500 on the second sub-shell 150 along the thickness direction of the second sub-shell 150 at least partially overlaps with the projection of the first flow channel 300 on the second sub-shell 150 along the thickness direction of the second sub-shell 150. The thickness direction of the second sub-shell 150 refers to the direction perpendicular to the part of the second sub-shell 150 where the second flow channel 500 or the first flow channel 300 is located. For example, when the second flow channel 500 and the first flow channel 300 are located in the bottom plate 110 of the outer shell 100, the thickness direction is the direction perpendicular to the bottom plate 110, i.e., the third direction Z. Figure 25 When the second flow channel 500 and the first flow channel 300 are located in the second side plate 122 of the peripheral side plate 120 (as shown in Figure 1 ), the thickness direction is the direction perpendicular to the second side plate 122.

[0144] The above design allows continuous heat transfer between the second flow channel 500 and the first flow channel 300. The first flow channel 300 can extend to the location of the heat-generating device 401 that needs to be cooled, making the design of the second flow channel 500 and the first flow channel 300 more flexible to adapt to power conversion functional components 400 with various structural arrangements. Figure 27As shown, the power conversion functional component 400 includes a heat-generating device 401a with a large amount of heat, the first end 307 of the first flow channel 300 can be stacked with the heat-generating device 401a, the other end 308 of the first flow channel 300 can be stacked with the second flow channel 500, a cooling medium with a lower temperature or a phase change medium with a larger heat absorption rate can be arranged in the first flow channel 300, the first end 307 of the first flow channel 300 absorbs the heat of the heat-generating device 401a, the heat is transmitted to the second flow channel 500 through the other end 308 of the first flow channel 300 for heat dissipation, and the first flow channel 300 can be designed according to the position of the heat-generating device 401.

[0145] Please continue to refer to Figure 25 In a possible implementation, the second flow channel 500 is not communicated with the first flow channel 300, the first medium 301 is arranged in the first flow channel 300, and the second medium 501 is arranged in the second flow channel 500, and the thermal conductivity of the second medium 501 is greater than that of the first medium 301. The thermal conductivity of the second medium 501 is greater than that of the first medium 301, which means that the second medium 501 has a better heat dissipation efficiency and can quickly absorb the heat of the heat-generating device 401. In an embodiment, the second medium 501 is a phase change material, and the first medium 301 is water.

[0146] In some embodiments, the second flow channel 500 and the first flow channel 300 are communicated, and the two layers of flow channels can increase the flow path of the cooling liquid in the shell 100 and improve the heat dissipation effect.

[0147] In some embodiments, the shell 100 can further include more sub-shells stacked to form multiple flow channels, which can be arranged as needed to improve the heat dissipation effect.

[0148] It should be noted that the shell 100 of the present application is an integrated shell 100 formed by a drawing process. Please refer to Figure 28 The shell 100a with an integrated structure formed by a die casting process is fixedly connected with the power conversion functional component 400 by integrally forming a fixing column 102 in the shell 100a by die casting, and then fixing the power conversion functional component 400 through the fixing column 102. The shell 100 with an integrated structure formed by a drawing process cannot form a fixing column 102 inside the shell 100 by a drawing process, and the process of welding the fixing column 102 one by one on the shell 100 is complex and has a low welding yield. The present application realizes the fixed connection between the shell 100 and the power conversion functional component 400 through the fixing plate 200, as described above.

[0149] The shell 100 with an integrated structure formed by a drawing process and the shell 100a with an integrated structure formed by a die casting process in the present application have at least one difference as follows:

[0150] (1) The thickness of the shell 100 formed by the drawing process is uniform, the material surface color is uniform, and there are no pores in the internal material of the shell 100. The wall thickness of the shell 100a formed by the die casting process can be uneven, the surface color is uneven, there are flow marks, and there are pores, shrinkage and other defects in the internal material of the shell 100a;

[0151] (2) The wall thickness of the inner layer (first sub-shell 140) of the shell 100 formed by the drawing process is generally 1.5mm, and the wall thickness of the outer layer (second sub-shell 150) is generally 1.0mm. The wall thickness of the shell 100a formed by the die casting process can be uneven. Due to the limitation of the die casting process, the single layer wall thickness is greater than 2mm, and as the size increases, the wall thickness also increases;

[0152] (3) The part connecting the side wall (peripheral side plate 120) and the bottom wall (bottom plate 110) of the shell 100 formed by the drawing process is a round corner 103 (as shown in Figure 4 ), and the outer round corner radius is greater than 5mm. The part connecting the side wall 120a and the bottom wall 110a of the shell 100a formed by the die casting process has no round corner (as shown in Figure 28 );

[0153] (4) The side wall (peripheral side plate 120) of the shell 100 formed by the drawing process is perpendicular to the bottom wall (bottom plate 110), while the side wall 120a of the shell 100a formed by the die casting process is usually provided with a draft angle, that is, the side wall 120a is deviated from the direction perpendicular to the bottom wall 110a, and the draft angle θ is at least 1°;

[0154] (5) The outer part of the shell 100 formed by the drawing process has a protruding feature, and the inner side must have a recessed feature, such as the second protruding part 153 in Figure 15 , the protruding part on the outside of the second sub-shell 150 and the recessed part on the inside of the second sub-shell 150 appear at the same time, while the protruding feature 153a (as shown in Figure 28 ) on the outside of the shell 100a formed by the die casting process can exist alone, and the inside of the shell 100a can have no recess;

[0155] (6) The protruding feature (for example, the first flow channel 300) in the shell 100 formed by the drawing process is provided with a round corner, such as the second protruding part 153 and the round corner 104 between the second sub-shell 150 and other parts of the second sub-shell 150 in Figure 15 , and the round corner 104 is greater than or equal to 1 times the thickness of the second sub-shell 150. The protruding feature 153a of the shell 100a formed by the die casting process has no round corner limitation (as shown in Figure 28 ), but has a draft angle;

[0156] (7) The outer wall of the shell 100a formed by the die-casting process must have the parting line of the mold, the slag pocket, and the feeding port, and these positions must have polishing marks. The shell 100 formed by the deep drawing process does not have these.

[0157] Please continue to refer to Figure 2a and Figure 2b The power conversion device 20 includes the power conversion functional assembly 400 and the power supply shell 10 as any one of the preceding embodiments. The power conversion functional assembly 400 is located in the receiving cavity 101 in the shell 100 and is fixedly connected with the fixed plate 200. The power conversion device 20 realizes the power conversion function through the power conversion functional assembly 400. The power conversion includes AC to high-voltage DC conversion, such as converting 220V AC power or 380V AC power into high-voltage DC power for charging a target device. When the target device is a vehicle, the high-voltage DC power can be 450V. The target device can also be other devices that need to be powered. The power conversion also includes high-voltage DC to low-voltage DC conversion, such as converting high-voltage DC power in a vehicle into low-voltage DC power for powering low-voltage devices such as vehicle lights, audio, radio, etc.

[0158] The power conversion functional assembly 400 includes a circuit board 410, a magnetic device 420, etc. The heat generating device 401 of the power conversion functional assembly 400 includes an insulated gate bipolar transistor, a triode, a MOS tube, etc. on the circuit board 410, and also includes an inductor device or a voltage device in the magnetic device 420. One function of the circuit board 410 is to connect the insulated gate bipolar transistor, the triode, the MOS tube, and the magnetic device 420, etc.

[0159] In one possible implementation, the power supply shell 10 further includes a cover plate 600. One side of the shell 100 has an opening 106, and the cover plate 600 covers the opening 106 of the shell 100.

[0160] Please refer to Figure 29 The electronic device 30 includes a load 31 and the power conversion device 20 as described above. The power conversion device 20 is electrically connected with the load 31 and is used to power the load 31. The power conversion device 20 provides the converted power to the load 31 to power the load 31.

[0161] In one possible implementation, the electronic device 30 is a vehicle, a charging pile, a charging station, a communication device, or a data center. The data center includes a cabinet or a data room. The electronic device 30 can also be other devices that need power conversion.

[0162] When the electronic device 30 is a vehicle, the power conversion device 20 is a vehicle charger, and the power conversion device 20 is fixed in the vehicle 30 by the fixing support 26 (as shown in Figure 2a The outer side of the shell 100 is further provided with a first connecting port 21, a second connecting port 22, and a third connecting port 23. The shell 100 is provided with three connecting holes 107, 107a, and 107b (as shown in Figure 3 The first connecting port 21, the second connecting port 22, and the third connecting port 23 pass through the connecting holes 107, 107a, and 107b respectively and are electrically connected with the power conversion functional assembly 400. The first connecting port 21, the second connecting port 22, and the third connecting port 23 can be fixed on the outer side of the shell 100 by screwing or riveting. The first connecting port 21 is used to connect an external power source 32, for example, a 220V domestic alternating voltage. The second connecting port 22 is used to connect an external controller 34, which is used to control the operation of the power conversion device 20. The third connecting port 23 is used to connect a load 31. In a vehicle, the third connecting port 23 is used to connect a battery pack 33, which is a lithium ion battery pack and is used to supply power to the vehicle. When the vehicle needs to be charged, the first connecting port 21 is connected with the external power source, and the 220V domestic alternating voltage is converted into 450V high-voltage direct current by the power conversion device 20, and the battery pack 33 is charged through the third connecting port 23, realizing the power conversion from alternating current to high-voltage direct current.

[0163] The outer side of the shell 100 is further provided with a fourth connecting port 24, which is used to connect with a low-voltage device 35 in the vehicle. The low-voltage device 35 includes vehicle lamps, audio, radio, etc. When the low-voltage device 35 in the vehicle needs to be powered, at this time, the battery pack 33 is a power supply device, and the high-voltage direct current of the battery pack 33 is input to the power conversion device 20 through the third connecting port 23. The power conversion device 20 converts the 450V high-voltage direct current into 12V low-voltage direct current, and charges the low-voltage device through the fourth connecting port 24, realizing the power conversion from high-voltage direct current to low-voltage direct current.

[0164] In the embodiment, the electronic device 30 further includes an external cooling circulation system 36, which is in communication with the liquid inlet nozzle 700 and the liquid outlet nozzle 800 in the power supply shell 10. The cooling fluid after absorbing heat in the first flow channel 300 in the shell 100 flows back to the external cooling circulation system 36 from the liquid outlet nozzle 800, is cooled by the external cooling circulation system 36, and then the cooled cooling fluid is input into the first flow channel 300 from the liquid inlet nozzle 700 to cool the power conversion functional assembly 400. The external cooling circulation system 36 is not limited to the structure as shown in Figure 29 The external cooling circulation system 36 can also be other structures.

[0165] In some embodiments, when the electronic device 30 is a data center, the load 31 is a server in the data center, and the power conversion device 20 converts 380V industrial power into direct current power for powering the server. The voltage of the power converted by the power conversion device 20 can be set according to the load 31.

[0166] The power supply shell, the power conversion device and the electronic device provided by the embodiments of the present application are described in detail. The principles and embodiments of the present application are described by applying specific examples. The above description of the embodiments is only used to help understand the method of the present application and its core idea. Meanwhile, for those skilled in the art, according to the idea of the present application, the specific embodiments and application range can be changed. In summary, the content of the specification should not be understood as a limitation of the present application.

Claims

1. A power conversion device, characterized in that, The power conversion device includes a cover plate, a base plate, peripheral side plates, and a first fixing sub-plate, wherein: The base plate and the peripheral side plate form a receiving cavity. The receiving cavity has an opening on one side. The cover plate seals the opening of the receiving cavity. The receiving cavity is used to accommodate the power conversion functional component of the power conversion device and the first fixed sub-plate. The base plate is provided with a first sub-channel. The peripheral side plate is provided with a liquid inlet and a liquid outlet. The first sub-channel is connected to the liquid inlet and the liquid outlet. The first sub-channel is used to cool the power conversion functional component. The first fixing sub-board is stacked with the base plate and fixedly connected to the base plate. The power conversion function component includes a circuit board, which is stacked with the first fixing sub-board. The first fixing sub-board has a fixing hole, and a fixing component is provided in the fixing hole. The fixing hole and the fixing component cooperate to fix the circuit board. The area of ​​the surface of the first fixing sub-plate facing the base plate is greater than or equal to 0.5 times the area of ​​the surface of the base plate facing the first fixing sub-plate, and less than or equal to the area of ​​the surface of the base plate facing the first fixing sub-plate.

2. The power conversion device according to claim 1, characterized in that, At least a portion of the surface of the first fixing subplate facing the base plate is fixedly connected to at least a portion of the inner surface of the base plate.

3. The power conversion device according to claim 1, characterized in that, The height of one of the multiple fixing components is greater than the height of another of the multiple fixing components.

4. The power conversion device according to claim 1, characterized in that, The power conversion device further includes a second fixing sub-board, which is used to fix part of the power conversion functional components. The second fixing sub-board is located inside the peripheral side plate, and the plane where the second fixing sub-board is located intersects with the plane where the first fixing sub-board is located. The peripheral side plate is perpendicular to the bottom plate.

5. The power conversion device according to claim 4, characterized in that, The power conversion device also includes another circuit board, which is fixedly connected to the second fixing sub-board and stacked on top of the first circuit board.

6. The power conversion device according to claim 4 or 5, characterized in that, The second fixing sub-board includes a first part and a second part, which are arranged opposite to each other along the length direction of the base plate. The first part and / or the second part are used to fix at least one circuit board.

7. The power conversion device according to claim 5, characterized in that, The first fixing sub-board has a patterned design, the patterned design having at least one recessed portion, the thickness of the at least one recessed portion being less than the thickness of the area of ​​the first fixing sub-board without the patterned design, the at least one recessed portion being used to fix the functional device of the power conversion functional component facing the base plate onto the first fixing sub-board.

8. The power conversion device according to claim 7, characterized in that, The first fixing sub-plate is provided with a clearance hole, and at least a portion of the power conversion function component is disposed in the clearance hole.

9. The power conversion device according to claim 8, characterized in that, The opening area of ​​the clearance hole is larger than the opening area of ​​the fixing hole.

10. The power conversion device according to claim 8 or 9, characterized in that, At least a portion of the first sub-channel is disposed opposite to the clearance hole located in the first fixed sub-plate along the thickness direction of the base plate.

11. The power conversion device according to claim 8 or 9, characterized in that, The power conversion function component includes at least one magnetic device, and the circuit board is located on one side of the at least one magnetic device. The at least one magnetic device is fixed to the first fixing sub-plate by the fixing sub-component.

12. A vehicle, characterized in that, The vehicle includes a battery pack and a power conversion device as described in any one of claims 1-11, the power conversion device being electrically connected to the battery pack for charging the battery pack.

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