Temperature control device for ion source power amplifier module

Abstract

The invention relates to the technical field of ion source power amplifier modules, in particular to an ion source power amplifier module temperature control device which comprises a substrate, a heat dissipation mechanism is fixedly installed at the top of the substrate, and a temperature adjusting mechanism is fixedly installed at the bottom of the heat dissipation mechanism. When the power amplifier module body needs to be disassembled, the operation is also convenient, by pressing the top of the driving guide plate on the sliding block, when the top is pressed, the sliding block can slide downwards on the inner side of the vertical rail, at the moment, the inclined surface of the bottom of the arrow-shaped driving guide plate can extrude the inner end arc surface of the driven guide plate, and the power amplifier module body is disassembled. The driving guide plate and the driven guide plate extrude each other for limiting to drive the displacement block to pull the limiting spring to displace, so that the displacement block can drive the limiting block on the limiting rod to be separated from the limiting groove, and the power amplifier module body can be quickly disassembled, and therefore, the device is very convenient and quick to assemble and disassemble, and the working efficiency is greatly improved. And great convenience is provided for use and maintenance of a user.

Description

Technical Field

[0001] The present application relates to the technical field of ion source power amplifier modules, and in particular to a temperature control device for an ion source power amplifier module. Background Art

[0002] The ion source power amplifier module is an electronic component that plays a key role in the ion source system. It is mainly used to amplify the power of the electrical signal input to the ion source to meet the energy requirements for the normal operation of the ion source. The ion source is a device that generates ions, and is widely used in fields such as mass spectrometry, ion beam processing, and semiconductor manufacturing. The ion source requires a specific energy input to ionize atoms or molecules and form ions. The ion source power amplifier module is responsible for amplifying the power of the input low-power electrical signal through internal circuit design and electronic components, such as power transistors. The amplified electrical signal can provide sufficient energy for the filament, electrode and other components in the ion source, prompting them to generate a stable electric field or magnetic field, thereby achieving gas ionization and ion generation and extraction. For example, in an electron bombardment ion source, the power amplifier module provides the filament with a suitable voltage and current, causing the filament to emit electrons, which then bombard the gas molecules to ionize them into ions. In addition, the ion source power amplifier module also needs to have high stability and reliability to ensure that the ion source works stably for a long time and provides high-quality ion beams for subsequent analysis, processing and other operations. The Chinese patent with the announcement number "CN218277666U" discloses a power amplifier module with a heat dissipation structure, which includes a power amplifier module body and a mounting plate, a heat conducting plate is fixedly installed on one side of the power amplifier module body close to the mounting plate, the heat conducting plate is arranged on the mounting plate, and a clamping assembly is arranged on the mounting plate. The beneficial effects of the utility model are as follows: the clamping assembly drives the heat conducting plate by taking the power amplifier module body, so that the heat conducting plate is placed between two calibration blocks, and then presses the power amplifier module body, and at the same time, the heat conducting plate slides on the calibration block, and at the same time, the power amplifier module body drives the heat conducting plate to squeeze the calibration plate, and at the same time, the calibration plate drives the slider to slide in the movable groove, and at the same time, the slider stretches the telescopic rod and the spring, so as to facilitate the clamping and installation of the power amplifier module body, facilitate disassembly and maintenance, and help to improve the clamping capacity of the device, and help to improve the work efficiency of installation and disassembly of the staff; During actual use, although the above device has the advantage of being easy to disassemble and repair during use, there are many problems in its disassembly and adjustment process; when disassembling and assembling, it is necessary to adjust the linkage of multiple components such as sliders and screws, which means that the overall disassembly and assembly operation has to adjust multiple structures such as springs and telescopic rods on both sides of the device; such a complicated operation process makes the disassembly and assembly process extremely cumbersome and inconvenient, increasing the difficulty and time cost of the operation; Furthermore, the device also has obvious deficiencies in heat dissipation; it only uses fans to assist in heat dissipation, and this single heat dissipation method is not effective under certain circumstances; for example, when the temperature inside the device or the indoor environment is high, the wind blown out by the fan will also become hot air; in this case, the hot air combined with the heat dissipation mode greatly reduces the overall heat dissipation efficiency; obviously, under such conditions, the device cannot quickly and efficiently reduce the temperature of the power amplifier module during use; for example, in the hot summer, the indoor temperature is high. At this time, if the device needs to be repaired, during the disassembly and assembly process, not only will a lot of time be spent on adjusting the various components, but also due to poor heat dissipation, the power amplifier module will continue to work in a high temperature environment, and there may be a risk of performance degradation or even damage, which greatly affects the normal use and stability of the device; it can be seen that its overall use does have certain defects and shortcomings, and therefore it is urgently needed to be improved. Summary of the invention

[0003] In order to improve the convenience of disassembly, assembly and maintenance as well as the heat dissipation performance of the prior art during application, the present application provides an ion source power amplifier module temperature control device.

[0004] The present application provides an ion source power amplifier module temperature control device, which adopts the following technical solution: comprising a substrate, a heat dissipation mechanism is fixedly installed on the top of the substrate, a temperature adjustment mechanism is fixedly installed on the bottom of the heat dissipation mechanism, a power amplifier module body is slidably connected inside the heat dissipation mechanism, a limiting mechanism is fixedly installed on the top rear side of the substrate, and the power amplifier module body is installed on the inner side of the heat dissipation mechanism through the limiting mechanism; The heat dissipation mechanism includes a supporting leg, which is fixedly installed on the top of the substrate, a heat-conducting frame is fixedly installed on the top of the supporting leg, a heat dissipation rack is fixedly installed on the top of the heat-conducting frame, a heat dissipation fan is fixedly installed in the middle of the heat dissipation rack, a heat dissipation groove is opened on the top of the heat-conducting frame, and the inner wall of the heat-conducting frame is fitted and connected to the outer surface of the power amplifier module body.

[0005] Optionally, heat exchange coils are fixedly installed at equal intervals on the outer surface of the heat-conducting frame, and the heat exchange coils are connected to the temperature regulating mechanism.

[0006] Optionally, heat dissipation fins are fixedly connected to both sides of the heat-conducting frame at equal intervals, and the heat-conducting frame is configured as an aluminum frame.

[0007] Optionally, mounting holes are provided at four corners of the top of the substrate, the mounting holes are configured as countersunk holes, and the outer edges and corners of the substrate are configured as arcs.

[0008] Optionally, exhaust holes are evenly spaced on both sides of the power amplifier module body, heat dissipation holes are evenly spaced on the top of the power amplifier module body, and the heat dissipation holes arranged at even intervals are located directly below the heat dissipation fan.

[0009] Optionally, the temperature control mechanism includes a heat conduction box, which is fixedly connected to the bottom of the heat conduction frame, a micro pump is fixedly connected to the front of the heat conduction box, the output end of the micro pump is connected to the input end of the heat exchange coil, the output end of the heat exchange coil is connected to the interior of the heat conduction box, the input end of the micro pump is connected to the output end of the heat conduction box, a semiconductor refrigeration plate is fixedly connected to the back of the heat conduction box, the cooling end of the semiconductor refrigeration plate is arranged inside the heat conduction frame, and a heat exchange medium is arranged inside the heat conduction box.

[0010] Optionally, the temperature control mechanism also includes a temperature sensor and a single-chip microcomputer controller, the single-chip microcomputer controller is fixedly connected to the middle of the bottom of the power amplifier module, the temperature sensor is fixedly installed on the rear side of the semiconductor refrigeration plate, and the detection end of the temperature sensor is fit-connected to the bottom of the heat-conducting frame.

[0011] Optionally, the limiting mechanism includes a fixed rail frame and a clamping plate, the fixed rail frame is fixedly installed on the top rear end of the substrate, both ends of the interior of the fixed rail frame are fixedly connected to limiting springs, both ends of the limiting spring are fixedly connected to displacement blocks, the displacement block is slidably connected to the interior of the fixed rail frame, an adjustment component is provided on the top of the fixed rail frame, the top of the displacement block is fixedly connected to a limiting rod, the inner upper end of the limiting rod is fixedly connected to the limiting block, the clamping plate is fixedly connected to both sides of the back side of the power amplifier module body, a limiting slot is provided on the rear side of the clamping plate, and the outer end of the limiting block is inserted into the interior of the limiting slot.

[0012] Optionally, the adjustment component includes a vertical rail and a driven guide plate, the vertical rail is fixedly connected to the top of the fixed rail frame, the vertical rail is slidably connected to a sliding block inside, the back of the sliding block is fixedly connected to a driving guide plate, the driving guide plate is arranged in an arrow shape, the driven guide plate is L-shaped when viewed from above, the inner end of the driven guide plate is arranged in a circular arc shape, and the lower end inclined surface of the driving guide plate and the inner end arc surface of the driven guide plate are fit-connected.

[0013] Optionally, a first guiding inclined surface is provided on the rear side of the clamping plate, and a second guiding inclined surface is provided on a side of the limiting block close to the first guiding inclined surface.

[0014] In summary, this application includes the following beneficial technical effects: 1. This device is equipped with a heat dissipation mechanism and a temperature adjustment mechanism. When the temperature of the power amplifier module is too high, the temperature sensor will feed back information to the single-chip microcomputer controller, start the micro pump, semiconductor cooling sheet and cooling fan, the cooling fan blows air, and the air enters and exits the power amplifier module body through the heat dissipation holes to achieve heat dissipation. The semiconductor cooling sheet cools the heat exchange medium in the heat transfer box, the micro pump pumps the heat exchange medium for circulation, the heat transfer frame and the heat dissipation fins assist in heat dissipation, and the heat exchange coil introduces heat into the heat transfer box for cooling. The dual heat dissipation mode improves efficiency, ensures stable operation of the power amplifier module, extends life and improves performance; 2. A limit mechanism is provided so that during installation, it is only necessary to insert the power amplifier module body into the heat conduction frame. During the insertion process, the first guide slope of the clamping plate contacts the second guide slope of the limit block. Through the mutual guiding action, the limit block is stretched open, thereby pushing the sliding block to move outward. At this time, the limit spring is in a stretched state. When the limit block contacts the limit slot, the limit spring is reset, driving the limit block to be inserted into the limit slot, thereby assisting in the installation of the power amplifier module body. The entire installation process is extremely simple, and only requires a light insertion. 3. When the power amplifier module body needs to be disassembled, the operation is also convenient. By pressing the top of the driving guide plate on the sliding block, when the top is under pressure, the sliding block will slide downward on the inner side of the vertical rail. At this time, the arrow-shaped bottom inclined surface of the driving guide plate will squeeze the inner end arc surface of the driven guide plate. Since the driving guide plate and the driven guide plate squeeze each other to limit, the displacement block will pull the limit spring to move. In this way, the displacement block will drive the limit block on the limit rod to break away from the limit groove, thereby realizing the rapid disassembly of the power amplifier module body. It can be seen that this device is very convenient and fast whether it is installed or disassembled, which provides great convenience for the user's use and maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure in the embodiment of the present application; Figure 2 It is a schematic diagram of the rear view structure in the embodiment of the present application; Figure 3 This is a schematic diagram of the structure viewed from above in an embodiment of the present application; Figure 4 It is a schematic diagram of the structure of the temperature regulating mechanism and the heat dissipation mechanism in the embodiment of the present application; Figure 5 This is a schematic diagram of the front view of the heat dissipation mechanism in an embodiment of the present application; Figure 6 This is a schematic diagram of the top view of the power amplifier module body in the disassembled state in the embodiment of the present application; Figure 7 This is a schematic diagram of the structure of the power amplifier module in the embodiment of the present application in a disassembled state; Figure 8 This is a schematic diagram of the structure of the limit mechanism in the disassembled state in the embodiment of the present application; Fig. 9 It is a schematic diagram of the structure of the limit spring, the displacement block, the second guide slope and the limit block in the embodiment of the present application.

[0016] 1. Base plate; 2. Heat dissipation mechanism; 21. Support leg; 22. Heat conduction frame; 23. Heat dissipation frame; 24. Heat dissipation fan; 25. Heat dissipation slot; 26. Heat exchange coil; 27. Heat dissipation fin; 3. Temperature control mechanism; 31. Heat conduction box; 32. Micro pump; 33. Semiconductor refrigeration plate; 34. Single chip controller; 35. Temperature sensor; 4. Power amplifier module body; 5. Limiting mechanism; 51. Fixed rail frame; 52. Snap-in plate; 53. Limiting spring; 54. Displacement block; 55. Limiting rod; 56. Limiting block; 57. Limiting slot; 58. Adjustment assembly; 581. Vertical rail; 582. Driven guide plate; 583. Sliding block; 584. Driving guide plate; 585. First guide slope; 586. Second guide slope; 6. Mounting hole; 7. Exhaust hole; 8. Heat dissipation hole. DETAILED DESCRIPTION

[0017] The following is combined with Figure 1-9 This application is described in further detail.

[0018] The present application embodiment discloses a temperature control device for an ion source power amplifier module. Figure 1-9 As shown, it includes a substrate 1, a heat dissipation mechanism 2 is fixedly installed on the top of the substrate 1, a temperature adjustment mechanism 3 is fixedly installed on the bottom of the heat dissipation mechanism 2, a power amplifier module body 4 is slidably connected inside the heat dissipation mechanism 2, a limiting mechanism 5 is fixedly installed on the top rear side of the substrate 1, and the power amplifier module body 4 is installed on the inner side of the heat dissipation mechanism 2 through the limiting mechanism 5;

[0019] The heat dissipation mechanism 2 includes a support leg 21, which is fixedly mounted on the top of the substrate 1, a heat-conducting frame 22 is fixedly mounted on the top of the support leg 21, a heat-dissipating frame 23 is fixedly mounted on the top of the heat-conducting frame 22, a heat-dissipating fan 24 is fixedly mounted in the middle of the heat-dissipating frame 23, a heat-dissipating groove 25 is provided on the top of the heat-conducting frame 22, and the inner wall of the heat-conducting frame 22 is fitted and connected to the outer surface of the power amplifier module body 4. By arranging the support leg 21 on the top of the substrate 1 to support the heat-conducting frame 22, a stable installation foundation is provided for the power amplifier module body 4, and the heat-conducting frame 22 is fitted and connected to the outer surface of the power amplifier module body 4, so as to efficiently conduct the heat generated by the power amplifier module body 4. The cooling fan 24 installed in the middle of the heat sink 23 can blow air from top to bottom, accelerate the air flow, and promote the air to enter and be discharged through the heat sink 25 on the top of the heat conducting frame 22, so as to realize the rapid heat dissipation of the power amplifier module body 4. This design enables the heat dissipation mechanism 2 to dissipate the heat generated by the power amplifier module body 4 in a timely and effective manner, and avoids the heat accumulation causing the power amplifier module body 4 to be overheated, thereby extending the service life of the power amplifier module body 4 and improving its working stability and reliability. At the same time, the heat dissipation mechanism 2 cooperates with the temperature adjustment mechanism 3 and the limiting mechanism 5 to provide a strong guarantee for the normal operation and convenient installation and disassembly of the power amplifier module body 4.

[0020] Please refer to Figure 1-Figure 7 , the outer surface of the heat-conducting frame 22 is fixedly installed with heat exchange coils 26 at equal intervals, the heat exchange coils 26 are connected to the temperature regulating mechanism 3, and the two sides of the heat-conducting frame 22 are fixedly connected with heat dissipation fins 27 at equal intervals. The heat-conducting frame 22 is set as an aluminum frame. The heat exchange coils 26 fixedly installed at equal intervals on the outer surface of the heat-conducting frame 22 can be connected to the temperature regulating mechanism 3, and play an important role in the heat dissipation process. When the operating temperature of the power amplifier module body 4 increases, the heat exchange coils 26 can quickly conduct away the heat conducted by the heat-conducting frame 22, realize the heat transfer, and provide a basis for subsequent heat dissipation processing. Secondly, the two sides of the heat-conducting frame 22 The heat dissipation fins 27 fixedly connected at equal intervals further enhance the heat dissipation effect. The heat dissipation fins 27 increase the contact area between the heat conductive frame 22 and the air, so that the heat can be dissipated to the surrounding environment more quickly. Furthermore, the heat conductive frame 22 is configured as an aluminum frame. Aluminum has good thermal conductivity and can efficiently conduct the heat generated by the power amplifier module body 4 to ensure that the heat can be processed by the heat dissipation mechanism 2 in time. This design makes the entire heat dissipation system more efficient and stable, and can effectively ensure that the power amplifier module body 4 operates at an appropriate temperature, extend its service life, and improve its working performance and reliability.

[0021] Please refer to Figure 1-Figure 3, mounting holes 6 are provided at the four corners of the top of the substrate 1, and the mounting holes 6 are set as countersunk holes. The outer corners of the substrate 1 are set as arcs. Exhaust holes 7 are evenly spaced on both sides of the power amplifier module body 4. Heat dissipation holes 8 are evenly spaced on the top of the power amplifier module body 4. The heat dissipation holes 8 arranged at equal intervals are located directly below the cooling fan 24. The mounting holes 6 opened at the four corners of the top of the substrate 1 are countersunk holes. On the one hand, it is convenient to install and fix the device, making the installation process more simple and beautiful. At the same time, the design of the countersunk holes can avoid the protrusion of the bolt head, reduce interference with the surrounding environment and potential collision risks, and the outer corners of the substrate 1 are set as arcs. , enhancing safety and avoiding personal injury or damage to other items due to sharp edges during use and transportation. For the power amplifier module body 4, the exhaust holes 7 opened at equal intervals on both sides and the heat dissipation holes 8 opened at equal intervals on the top also play an important role. The heat dissipation holes 8 are located directly below the cooling fan 24, so that when the cooling fan 24 is running, air can enter the power amplifier module body 4 more efficiently through the heat dissipation holes 8, and then be discharged from the exhaust holes 7, forming a good air circulation path, accelerating the dissipation of heat, ensuring that the power amplifier module body 4 maintains a suitable temperature during operation, improving its working stability and reliability, and extending its service life.

[0022] Please refer to Figure 1-Figure 7The temperature regulating mechanism 3 includes a heat conducting box 31, which is fixedly connected to the bottom of the heat conducting frame 22, a micro pump 32 is fixedly connected to the front of the heat conducting box 31, the output end of the micro pump 32 is connected to the input end of the heat exchange coil 26, the output end of the heat exchange coil 26 is connected to the inside of the heat conducting box 31, the input end of the micro pump 32 is connected to the output end of the heat conducting box 31, a semiconductor refrigeration sheet 33 is fixedly connected to the back of the heat conducting box 31, the cooling end of the semiconductor refrigeration sheet 33 is arranged inside the heat conducting frame 22, and a heat exchange medium is arranged inside the heat conducting box 31. The temperature regulating mechanism 3 also includes a temperature sensor 35 and a single chip controller 34, the single chip controller 34 is fixedly connected to the middle of the bottom of the power amplifier module, the temperature sensor 35 is fixedly installed on the rear side of the semiconductor refrigeration sheet 33, the detection end of the temperature sensor 35 is fitted and connected to the bottom of the heat conducting frame 22, the heat conducting box 31 is fixed to the bottom of the heat conducting frame 22, and is tightly combined with the heat conducting frame 22 to form an efficient heat conduction system, the micro pump 32 The setting enables the heat exchange medium to circulate between the heat exchange coil 26 and the heat conducting box 31. When the temperature of the power amplifier module body 4 rises, the micro pump 32 starts to quickly pump the heat exchange medium to take away the heat conducted by the heat conducting frame 22, thereby realizing heat transfer and dissipation. The addition of the semiconductor refrigeration plate 33 further improves the temperature control effect. Its cooling end is arranged inside the heat conducting frame 22, which can cool the heat exchange medium inside the heat conducting box 31 and reduce the temperature of the heat exchange medium, thereby improving the heat dissipation efficiency. The temperature sensor 35 can accurately detect the temperature of the heat conducting frame 22 and promptly feed back the temperature information to the single-chip controller 34. The single-chip controller 34 automatically controls the operation of the micro pump 32 and the semiconductor refrigeration plate 33 according to the temperature data to realize intelligent temperature control. This temperature control mechanism 3 can quickly respond to the temperature changes of the power amplifier module body 4, ensure that the power amplifier module body 4 always operates within a suitable temperature range, extend its service life, and improve its working performance and stability.

[0023] Please refer to Figure 1-Figure 4 and 8- Fig. 9The limiting mechanism 5 includes a fixed rail frame 51 and a clamping plate 52. The fixed rail frame 51 is fixedly installed at the top rear end of the base plate 1. The two ends of the fixed rail frame 51 are fixedly connected to the limiting spring 53. The two ends of the limiting spring 53 are fixedly connected to the displacement block 54. The displacement block 54 is slidably connected to the inside of the fixed rail frame 51. The top of the fixed rail frame 51 is provided with an adjustment component 58. The top of the displacement block 54 is fixedly connected to the limiting rod 55. The inner upper end of the limiting rod 55 is fixedly connected The limit block 56, the clamping plate 52 is fixedly connected to both sides of the back of the power amplifier module body 4, the rear side of the clamping plate 52 is provided with a limit slot 57, the outer end of the limit block 56 is inserted into the inner part of the limit slot 57, the adjustment component 58 includes a vertical rail 581 and a driven guide plate 582, the vertical rail 581 is fixedly connected to the top of the fixed rail frame 51, the interior of the vertical rail 581 is slidably connected with a sliding block 583, the back of the sliding block 583 is fixedly connected with a driving guide plate 584, and the driving guide plate 584 The driven guide plate 582 is set in an arrow shape, and the top view shape of the driven guide plate 582 is set in an L shape. The inner end of the driven guide plate 582 is set in an arc shape. The lower end slope of the driving guide plate 584 and the inner end arc surface of the driven guide plate 582 are fitted and connected. The rear side of the clamping plate 52 is provided with a first guide slope 585, and the side of the limit block 56 close to the first guide slope 585 is provided with a second guide slope 586. The fixed rail frame 51 is installed at the top rear end of the base plate 1 to provide stable support for the entire limit mechanism 5 The internal limiting spring 53 is connected to the displacement block 54, so that the displacement block 54 can slide in the fixed rail frame 51, providing elastic buffer for the movement of the limiting block 56. When the power amplifier module body 4 is inserted, the limiting groove 57 on the rear side of the clamping plate 52 cooperates with the limiting block 56 to achieve stable limiting installation of the power amplifier module body 4. The vertical rail 581 in the adjustment component 58 provides a stable sliding track for the sliding block 583. The arrow-shaped driving guide plate 584 on the back of the sliding block 583 is L-shaped. The driven guide plate 582 with a circular arc shape at the inner end is cleverly matched. When the power amplifier module body 4 needs to be disassembled, by pressing the sliding block 583, the lower end inclined surface of the driving guide plate 584 squeezes the inner end arc surface of the driven guide plate 582, driving the displacement block 54 to move, so that the limit block 56 is disengaged from the limit groove 57, and quick disassembly is achieved. The first guiding inclined surface 585 of the clamping plate 52 and the second guiding inclined surface 586 of the limit block 56 guide each other during the installation process, so that when the power amplifier module body 4 is installed, it only needs to be inserted to automatically open the limit block 56 to complete the installation, and the operation is more convenient. The overall limiting mechanism 5 not only ensures the stability of the installation of the power amplifier module body 4, but also realizes quick and convenient disassembly and assembly, which brings great convenience to the user's use and maintenance.

[0024] The implementation principle of the temperature control device of an ion source power amplifier module in the embodiment of the present application is as follows: by setting a heat dissipation mechanism 2 and a temperature adjustment mechanism 3, during the actual use of the device, when the power amplifier module is in operation and the temperature is too high, the temperature sensor 35 can accurately detect the temperature of the power amplifier module and promptly feed back the temperature information to the single-chip controller 34. Once the temperature exceeds the standard, the single-chip controller 34 will quickly start the micro pump 32, the semiconductor cooling sheet 33 and the cooling fan 24. After the cooling fan 24 starts running, it blows air from top to bottom. At this time, the air will enter the interior of the power amplifier module body 4 through the heat dissipation holes 8, and then be discharged through the heat dissipation holes 8, thereby realizing rapid heat dissipation of the interior of the power amplifier module body 4. During the heat dissipation process, the micro pump 32 and the semiconductor cooling sheet 33 play a role. The semiconductor refrigeration sheet 33 can efficiently cool the heat exchange medium inside the heat conduction box 31. At the same time, the micro pump 32 is started to pump the heat exchange medium to circulate in the heat exchange coil 26 and the heat conduction box 31. The heat conduction frame 22 and the heat dissipation fins 27 play a role in assisting heat conduction and heat dissipation, and can quickly dissipate the heat. Moreover, the heat exchange coil 26 can conduct the heat to the inside of the heat conduction box 31, and the heat exchange medium inside the heat conduction box 31 is cooled by the semiconductor refrigeration sheet 33, which further promotes the heat dissipation of the heat conduction frame 22 and the heat conduction fins. In this way, the power amplifier module body 4 adopts a dual heat dissipation mode of air cooling and water pump, and the overall heat dissipation efficiency is significantly improved, which can ensure that the power amplifier module operates within a stable temperature range, extend its service life, and improve its working performance and reliability; By setting the limiting mechanism 5, during the process of disassembling and assembling the power amplifier module body 4, when installing the power amplifier module body 4, it is only necessary to insert the power amplifier module body 4 into the interior of the heat-conducting frame 22. During the insertion process, the first guiding slope 585 of the clamping plate 52 will contact the second guiding slope 586 at the limiting block 56. Through the mutual guiding action of the first guiding slope 585 and the second guiding slope 586, the limiting block 56 will be stretched open, thereby pushing the sliding block 583 to move outward. At this time, the limiting spring 53 is in a stretched state. When the limiting block 56 contacts the limiting groove 57, the limiting spring 53 will quickly reset, driving the limiting block 56 to be inserted into the inner side of the limiting groove 57. Through the mutual limiting of the limiting block 56 and the limiting groove 57, the power amplifier module body 4 can be assisted in the clamping and installation. It can be seen that the installation process of the power amplifier module body 4 is simpler and more convenient. When the top of the driving guide plate 584 is pressed, the sliding block 583 will slide downward on the inner side of the vertical rail 581. At this time, the arrow-shaped bottom inclined surface of the driving guide plate 584 will squeeze the inner end arc surface of the driven guide plate 582. Since the driving guide plate 584 and the driven guide plate 582 squeeze each other to limit, the displacement block 54 will pull the limit spring 53 to move. At this time, the displacement block 54 will drive the limit block 56 on the limit rod 55 to disengage from the limit groove 57. In this way, the power amplifier module body 4 can be quickly disassembled. It can be seen that the device only needs to simply insert the power amplifier module when installing, and only needs to press the driving guide plate 584 to squeeze and drive the limit block 56 to move outward when disassembling. The overall disassembly and assembly process is very convenient and fast, which brings great convenience to the user's use and maintenance.

[0025] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A temperature control device for an ion source power amplifier module, characterized in that; The invention comprises a substrate (1), a heat dissipation mechanism (2) being fixedly mounted on the top of the substrate (1), a temperature adjustment mechanism (3) being fixedly mounted on the bottom of the heat dissipation mechanism (2), a power amplifier module body (4) being slidably connected inside the heat dissipation mechanism (2), a limiting mechanism (5) being fixedly mounted on the rear side of the top of the substrate (1), and the power amplifier module body (4) being mounted on the inner side of the heat dissipation mechanism (2) via the limiting mechanism (5); The heat dissipation mechanism (2) comprises a support leg (21), the support leg (21) being fixedly mounted on the top of the base plate (1), a heat conduction frame (22) being fixedly mounted on the top of the support leg (21), a heat dissipation rack (23) being fixedly mounted on the top of the heat conduction frame (22), a heat dissipation fan (24) being fixedly mounted in the middle of the heat dissipation rack (23), a heat dissipation groove (25) being formed on the top of the heat conduction frame (22), and an inner wall of the heat conduction frame (22) being fitted and connected to an outer surface of a power amplifier module body (4).

2. The ion source power amplifier module temperature control device according to claim 1, characterized in that: Heat exchange coils (26) are fixedly mounted at equal intervals on the outer surface of the heat conduction frame (22), and the heat exchange coils (26) are connected to the temperature adjustment mechanism (3).

3. The ion source power amplifier module temperature control device according to claim 2, characterized in that: Heat dissipation fins (27) are fixedly connected at equal intervals on both sides of the heat-conducting frame (22), and the heat-conducting frame (22) is configured as an aluminum frame.

4. The ion source power amplifier module temperature control device according to claim 1, characterized in that: The four corners on the top of the base plate (1) are all provided with mounting holes (6), the mounting holes (6) are arranged as countersunk holes, and the outer corners of the base plate (1) are all arranged in an arc shape.

5. The ion source power amplifier module temperature control device according to claim 1, characterized in that: Exhaust holes (7) are evenly spaced on both sides of the power amplifier module body (4), and heat dissipation holes (8) are evenly spaced on the top of the power amplifier module body (4). The heat dissipation holes (8) arranged at even intervals are located directly below the heat dissipation fan (24).

6. The ion source power amplifier module temperature control device according to claim 2, characterized in that: The temperature adjustment mechanism (3) comprises a heat conduction box (31), the heat conduction box (31) is fixedly connected to the bottom of the heat conduction frame (22), a micro pump (32) is fixedly connected to the front of the heat conduction box (31), an output end of the micro pump (32) is connected to an input end of a heat exchange coil (26), the output end of the heat exchange coil (26) is connected to the inside of the heat conduction box (31), the input end of the micro pump (32) is connected to the output end of the heat conduction box (31), a semiconductor refrigeration sheet (33) is fixedly connected to the back of the heat conduction box (31), a cooling end of the semiconductor refrigeration sheet (33) is arranged inside the heat conduction frame (22), and a heat exchange medium is arranged inside the heat conduction box (31).

7. The ion source power amplifier module temperature control device according to claim 6, characterized in that: The temperature adjustment mechanism (3) further comprises a temperature sensor (35) and a single-chip microcomputer controller (34); the single-chip microcomputer controller (34) is fixedly connected to the middle of the bottom of the power amplifier module; the temperature sensor (35) is fixedly installed on the rear side of the semiconductor cooling plate (33); and the detection end of the temperature sensor (35) is fitted and connected to the bottom of the heat-conducting frame (22).

8. The ion source power amplifier module temperature control device according to claim 1, characterized in that: The limiting mechanism (5) comprises a fixed rail frame (51) and a clamping plate (52); the fixed rail frame (51) is fixedly mounted on the top rear end of the base plate (1); both ends of the fixed rail frame (51) are fixedly connected to limiting springs (53); both ends of the limiting spring (53) are fixedly connected to displacement blocks (54); the displacement blocks (54) are slidably connected to the inside of the fixed rail frame (51); an adjustment component (58) is provided on the top of the fixed rail frame (51); the top of the displacement block (54) is fixedly connected to a limiting rod (55); the inner upper end of the limiting rod (55) is fixedly connected to the limiting block (56); the clamping plate (52) is fixedly connected to both sides of the back side of the power amplifier module body (4); a limiting slot (57) is provided on the rear side of the clamping plate (52); the outer end of the limiting block (56) is inserted into the inside of the limiting slot (57).

9. The ion source power amplifier module temperature control device according to claim 8, characterized in that: The adjustment assembly (58) comprises a vertical rail (581) and a driven guide plate (582); the vertical rail (581) is fixedly connected to the top of the fixed rail frame (51); a sliding block (583) is slidably connected inside the vertical rail (581); a driving guide plate (584) is fixedly connected to the back of the sliding block (583); the driving guide plate (584) is arranged in an arrow shape; the driven guide plate (582) is arranged in an L shape when viewed from above; the inner end of the driven guide plate (582) is arranged in an arc shape; the lower end inclined surface of the driving guide plate (584) and the inner end arc surface of the driven guide plate (582) are fitted and connected.

10. The ion source power amplifier module temperature control device according to claim 9, characterized in that: A first guiding inclined surface (585) is provided on the rear side of the clamping plate (52), and a second guiding inclined surface (586) is provided on a side of the limiting block (56) close to the first guiding inclined surface (585).

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