Switch heat dissipation mounting rack for network communication

Abstract

The invention relates to the technical field of network communication, in particular to a switch heat dissipation mounting rack for network communication, which comprises a cabinet body, a heat dissipation bin is fixedly connected to the back surface of the cabinet body, mounting plates are uniformly and fixedly connected in the cabinet body, the other half parts of heat dissipation fins are located in the cabinet body, and a ventilation opening is formed in the top end of the heat dissipation bin. The second liquid tank is located below the conveying pipe, a liquid opening is formed in the communicating position of the first liquid tank and the second liquid tank, a second flow dividing plate is arranged below the conveying pipe, a rotating rod is arranged in the first liquid tank, a reset shaft is installed on the side face of the conveying pipe, and a fluted disc is fixedly connected to a driving shaft of the motor. Through cooperation of evaporation heat absorption and wind power heat dissipation, the heat dissipation efficiency of the device is greatly improved, compared with a traditional heat dissipation mode of heat conduction and heat absorption, the heat dissipation mode has few holding factors, the heat dissipation effect cannot be affected by the temperature of the external space, and heat taken away by evaporation heat dissipation is always stable.

Description

Technical Field

[0001] The invention relates to the technical field of network communication, in particular to a heat dissipation mounting frame for a switch used for network communication. Background Art

[0002] A switch is a tool used for network communication. When a switch is in use, if the network information transmission volume is transmitted for a long time and in large quantities, the switch will always be in a high-power state, which will cause the switch to generate a lot of heat, which will cause damage to the switch or reduce its lifespan over time. At present, switches generally use traditional heat absorption to dissipate heat. However, traditional heat absorption can meet the heat dissipation requirements when the switch is used normally. However, when the switch is overclocked for a long time, it cannot absorb and dissipate the heat in time. In addition, the traditional heat absorption and heat conduction methods are related to the temperature difference of the external space. When the temperature of the external space is higher, the efficiency of the traditional heat absorption and heat conduction heat dissipation methods is lower. Summary of the invention

[0003] The purpose of the present invention is to provide a heat dissipation mounting frame for a switch for network communication, so as to solve the problem raised in the above background technology that at present, the switch generally uses the traditional heat absorption method to dissipate heat. However, the traditional heat absorption can meet the heat dissipation when the switch is used normally, but when the switch is overclocked for a long time, it cannot absorb and dissipate the heat in time, and the traditional heat absorption and heat conduction methods are related to the temperature difference of the external space. When the temperature of the external space is higher, the efficiency of the traditional heat absorption and heat conduction heat dissipation methods is lower.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a heat dissipation mounting frame for a switch for network communication, comprising a cabinet, a heat dissipation bin fixedly connected to the back of the cabinet, a mounting plate evenly fixedly connected to the interior of the cabinet, heat dissipation fins evenly installed inside the heat dissipation bin, half of the heat dissipation fins are located inside the heat dissipation bin, and the other half of the heat dissipation fins are located inside the cabinet, a vent is opened at the top of the heat dissipation bin, the vent passes through the heat dissipation bin to connect the heat dissipation bin with the outside, a mounting bin fixedly connected to the back of the heat dissipation bin, a motor is installed inside the mounting bin, and the output of the motor A fan is fixedly connected to the shaft, a coolant tank is installed at the top of the back side of the heat dissipation tank, the coolant tank is located above the installation tank, a delivery pipe is fixedly connected to the bottom of the coolant tank, a liquid tank 1 and a liquid tank 2 are provided inside the delivery pipe, the liquid tank 1 is located above the delivery pipe, the liquid tank 2 is located below the delivery pipe, a liquid port is provided at the connection between the liquid tank 1 and the liquid tank 2, a diverter plate 1 is fixedly connected to the bottom end of the liquid tank 2, a diverter plate 2 is provided below the delivery pipe, a rotating rod is provided inside the liquid tank 1, a reset shaft is installed on the side of the delivery pipe, and a gear disk is fixedly connected to the driving shaft of the motor.

[0005] Preferably, sliders are fixedly connected to both sides of the two inner walls of the diverter plate, an annular groove is opened on the surface of the conveying pipe, the slider is located inside the groove, the slider can rotate and move along the track of the annular groove, and the slider and the groove cannot be separated.

[0006] Preferably, the rotating rod is connected to the conveying pipe through a rotating seal, and the rotating rod can rotate left and right through the rotating seal. One end of the rotating rod extends to the outside of the conveying pipe, and the other end of the rotating rod is fixedly connected to a sealing ball, which blocks and seals the liquid port.

[0007] Preferably, the reset shaft includes a shaft ring, the interior of the shaft ring is fixedly connected to a shaft rod, the surface of the shaft rod is sleeved with a shaft plate, the surface of the shaft rod is sleeved with a spring, one end of the spring is fixedly connected to the inner wall of the shaft ring, and the other end of the spring is fixedly connected to the inner wall of the shaft plate.

[0008] Preferably, a resistance rod is fixedly connected to the surface of the shaft plate, the top of the resistance rod and the bottom end of the rotating rod are in mutual resistance, a magnet is fixedly connected to the surface of the resistance rod, and a magnet is fixedly connected to the side of the conveying pipe. The positions of the two groups of magnets correspond to each other, and the two groups of magnets attract each other.

[0009] Preferably, a through hole is opened through the surface of the diverter plate 1, and a through hole is opened through the surface of the diverter plate 2. The delivery pipe connects the inside and outside of the coolant tank, and the positions of the through holes between the diverter plate 1 and the diverter plate 2 correspond to each other.

[0010] Preferably, a tooth plate is evenly fixedly connected to the side of the toothed disc, a tooth block is evenly fixedly connected to the surface of the diverter plate 2, the tooth plate and the tooth block are meshed with each other, and the through holes on the surfaces of the diverter plate 1 and the diverter plate 2 are located directly above the fan.

[0011] Compared with the prior art, the present invention has the following beneficial effects: When the switch is overclocked for a long time, a large amount of heat is generated. The heat sink fins are attached to the surface of the switch, and the heat generated by the switch is absorbed by the heat sink fins. The high-speed rotating fan collides with the coolant, and the coolant is knocked into tiny water droplets. A large amount of coolant is knocked into water mist, and then the wind force of the fan blows the water mist formed by the coolant into the inside of the heat dissipation bin. The coolant adheres to the surface of the heat sink fins, and cooperates with the fast-flowing air to drive the coolant to evaporate quickly and absorb the heat on the heat sink fins. The device increases the heat dissipation speed on the heat sink fins by accelerating the air flow rate, and knocks the coolant into water mist attached to the heat sink fins through the fan. The principle of liquid evaporation and heat absorption is used to quickly take away the heat on the heat sink fins. The heat dissipation efficiency of the device is greatly improved by combining evaporation heat absorption with wind heat dissipation. Compared with traditional heat conduction and heat absorption heat dissipation methods, this heat dissipation method has fewer constraints and will not affect the heat dissipation effect due to the temperature of the external space. The heat taken away by evaporation heat dissipation is always stable. When the switch is in normal working state, the heat generated at this time is relatively small, and the heat dissipation task can be completed by driving the air to flow quickly through the fan. At this time, the user can pull the resistance rod, and the resistance rod and the rotating rod interfere with each other, so that the rotating rod cannot rotate, so that the coolant inside the liquid tank 1 cannot drive the sealing ball and the rotating rod to float up, so that the liquid port is blocked for a long time by the sealing ball, so that the coolant cannot enter the interior of the liquid tank 2 and remain. This structure allows the user to freely and flexibly adjust the heat dissipation effect of the device according to the workload of the switch in a certain period of time, so as to avoid the coolant being always consumed when the heat generated by the switch is not large, resulting in excessive heat dissipation efficiency, and also avoid the coolant being always consumed, which increases costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic front view of the structure of the present invention; Figure 2 It is a schematic side cross-sectional view of the structure of the present invention; Figure 3 It is a schematic diagram of the three-dimensional connection of the delivery pipe and the toothed disc in the present invention; Figure 4 It is a schematic front cross-sectional view of the structure of the delivery pipe in the present invention; Figure 5 It is a schematic diagram of a top view cross section of the structure of the delivery pipe in the present invention; Figure 6It is a schematic side view of the structure of the delivery pipe in the present invention; Figure 7 It is a schematic diagram of the structural three-dimensional cross-sectional connection of the reset shaft in the present invention.

[0013] In the figure: 1. cabinet; 2. heat dissipation chamber; 3. mounting plate; 4. heat dissipation fins; 5. vent; 6. mounting chamber; 7. motor; 8. fan; 9. coolant chamber; 10. delivery pipe; 11. liquid tank 1; 12. liquid tank 2; 13. liquid port; 14. manifold plate 1; 15. manifold plate 2; 16. rotating rod; 17. gear disc; 18. reset shaft; 181. shaft ring; 182. shaft rod; 183. shaft plate; 184. spring; 19. resistance rod. DETAILED DESCRIPTION

[0014] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0015] The present invention will be further described below in conjunction with the embodiments. Example

[0016] A heat dissipation mounting frame for a network communication switch of this embodiment, such as Figure 1-4 As shown, it includes a cabinet 1, a heat dissipation bin 2 is fixedly connected to the back of the cabinet 1, a mounting plate 3 is evenly fixedly connected to the inside of the cabinet 1, heat dissipation fins 4 are evenly installed inside the heat dissipation bin 2, half of the heat dissipation fins 4 are located inside the heat dissipation bin 2, and the other half of the heat dissipation fins 4 are located inside the cabinet 1, a vent 5 is opened at the top of the heat dissipation bin 2, and the vent 5 penetrates the heat dissipation bin 2 to connect the heat dissipation bin 2 with the outside, a mounting bin 6 is fixedly connected to the back of the heat dissipation bin 2, a motor 7 is installed inside the mounting bin 6, a fan 8 is fixedly connected to the output shaft of the motor 7, a coolant bin 9 is installed at the top of the back of the heat dissipation bin 2, the coolant bin 9 is located above the mounting bin 6, and a delivery pipe 10 is fixedly connected to the bottom of the coolant bin 9.

[0017] Furthermore, sliders are fixedly connected to both sides of the inner wall of the second diverter plate 15, and an annular groove is opened on the surface of the delivery pipe 10. The slider is located inside the groove. The slider can rotate and move along the track of the annular groove. The slider and the groove cannot be separated. The rotating rod 16 is connected to the delivery pipe 10 through a rotating seal. The rotating rod 16 can rotate left and right through the rotating seal. One end of the rotating rod 16 extends to the outside of the delivery pipe 10, and the other end of the rotating rod 16 is fixedly connected to a sealing ball, which blocks and seals the liquid port 13.

[0018] In the specific implementation of this embodiment, when the switch is overclocked for a long time, a large amount of heat is generated. The heat dissipation fins 4 are attached to the surface of the switch, and the heat generated by the switch is absorbed by the heat dissipation fins 4, and then dissipated. At the same time, by starting the motor 7, the motor 7 drives the fan 8 and the toothed disc 17 to rotate. When the fan 8 rotates, it drives the air inside the installation chamber 6 and the heat dissipation chamber 2 to flow quickly, thereby improving the rapid dissipation of the heat absorbed by the heat dissipation fins 4. When the toothed disc 17 rotates, it drives the toothed plate on the surface of the toothed disc 17 to rotate, and the toothed plate and the diverter plate 2 rotate. The tooth blocks on the surface of 15 mesh, and the tooth blocks drive the second diverter plate 15 to rotate, and the second diverter plate 15 drives the through holes on the surface to rotate, and constantly overlaps and intersects with the through holes on the surface of the diverter plate 14, and repeats continuously. At this time, the coolant inside the coolant tank 9 enters the inside of the liquid tank 11 and accumulates inside the liquid tank 11. When the coolant accumulates to a certain extent, it drives the rotating rod 16 and the sealing ball on the rotating rod 16 to float, exposing the liquid port 13, and then the coolant enters the inside of the liquid tank 2 12 through the liquid port 13, and the rotating rod 16 and the sealing ball fall again. The liquid inlet 13 is blocked, and then when the through holes on the diverter plate 14 and the diverter plate 2 15 coincide with each other, the coolant flows out, and the through hole is located directly above the fan 8, and the coolant falls on the fan 8, and the high-speed rotating fan 8 collides with the coolant, and the coolant is knocked into small water droplets. A large amount of coolant is knocked into water mist, and then the water mist formed by the coolant is blown into the heat dissipation bin 2 by the wind force of the rotation of the fan 8, and the coolant adheres to the surface of the heat dissipation fins 4, and cooperates with the fast-flowing air to drive the coolant to evaporate quickly and absorb the heat on the heat dissipation fins 4. The device increases the heat dissipation rate on the heat dissipation fins 4 by accelerating the air flow rate, and knocks the coolant into water mist attached to the heat dissipation fins 4 through the fan 8, and uses the principle of liquid evaporation and heat absorption to quickly take away the heat on the heat dissipation fins 4, and cooperates with the wind force of the rotation of the fan 8 to greatly improve the heat dissipation efficiency of the device. Compared with the traditional heat conduction and heat absorption heat dissipation methods, this heat dissipation method has fewer constraints, will not affect the heat dissipation effect due to the temperature of the external space, and the heat taken away by evaporative heat dissipation is always stable. Example

[0019] In other aspects, this embodiment also provides a heat dissipation mounting frame for a network communication switch, such as Figure 4-7 As shown, a liquid tank 11 and a liquid tank 2 12 are provided inside the delivery pipe 10, the liquid tank 11 is located above the delivery pipe 10, the liquid tank 2 12 is located below the delivery pipe 10, a liquid port 13 is provided at the connection between the liquid tank 11 and the liquid tank 2 12, a diverter plate 14 is fixedly connected to the bottom end of the liquid tank 2 12, a diverter plate 2 15 is provided below the delivery pipe 10, a rotating rod 16 is provided inside the liquid tank 11, a reset shaft 18 is installed on the side of the delivery pipe 10, and a gear disc 17 is fixedly connected to the driving shaft of the motor 7.

[0020] Further, the reset shaft 18 includes a shaft ring 181, the interior of the shaft ring 181 is fixedly connected to a shaft rod 182, the surface of the shaft rod 182 is sleeved with a shaft plate 183, the surface of the shaft rod 182 is sleeved with a spring 184, one end of the spring 184 is fixedly connected to the inner wall of the shaft ring 181, the other end of the spring 184 is fixedly connected to the inner wall of the shaft plate 183, the surface of the shaft plate 183 is fixedly connected to a resisting rod 19, the top end of the resisting rod 19 and the bottom end of the rotating rod 16 are mutually resisted, the surface of the resisting rod 19 is fixedly connected to a magnet, and the side of the conveying pipe 10 is fixedly connected to Magnets, the positions of the two groups of magnets correspond to each other, the two groups of magnets attract each other, the surface of the diverter plate 14 is penetrated with a through hole, the surface of the diverter plate 2 15 is penetrated with a through hole, the delivery pipe 10 connects the inside of the coolant tank 9 with the outside, the positions of the through holes between the diverter plate 14 and the diverter plate 2 15 correspond to each other, the side of the toothed disc 17 is evenly fixedly connected with a tooth plate, the surface of the diverter plate 2 15 is evenly fixedly connected with a tooth block, the tooth plate and the tooth block are meshed with each other, and the through holes on the surface of the diverter plate 14 and the diverter plate 2 15 are located directly above the fan 8.

[0021] During the specific implementation of this embodiment, when the switch is in a normal working state, the heat generated at this time is relatively small, and the heat dissipation task can be completed by driving the air to flow quickly by the fan 8. At this time, the user can pull the resistance rod 19 to drive the magnet on the surface of the resistance rod 19 to separate from the magnet on the surface of the conveying pipe 10. At this time, the spring 184 drives the shaft plate 183 to rotate and reset, and drives the resistance rod 19 to rotate to the bottom of the rotating rod 16. The resistance rod 19 and the rotating rod 16 interfere with each other, so that the rotating rod 16 cannot rotate, so that the coolant inside the liquid tank 11 cannot drive the sealing ball and the rotating rod 16 to float, so that the liquid port 13 is blocked for a long time by the sealing ball, so that the coolant cannot enter the interior of the liquid tank 2 12 and is retained. This structure allows the user to freely and flexibly adjust the heat dissipation effect of the device according to the workload used by the switch in a certain period of time, so as to avoid the coolant being always consumed when the heat generated by the switch is not large, resulting in excessive heat dissipation efficiency, and also avoid the coolant being always consumed, which increases costs.

[0022] Working principle: In summary, when the switch is overclocked for a long time, a large amount of heat is generated. The heat sink fins 4 are attached to the surface of the switch, and the heat generated by the switch is absorbed by the heat sink fins 4 and then dissipated. At the same time, by starting the motor 7, the motor 7 drives the fan 8 and the toothed disc 17 to rotate. When the fan 8 rotates, it drives the air inside the installation chamber 6 and the heat sink 2 to flow quickly, thereby increasing the rapid dissipation of the heat absorbed by the heat sink fins 4. When the toothed disc 17 rotates, it drives the toothed plate on the surface of the toothed disc 17 to rotate, and the toothed plate and the diverter plate 15 rotate. The tooth blocks on the surface are meshed, and the tooth blocks drive the diverter plate 2 15 to rotate, and the diverter plate 2 15 drives the through holes on the surface to rotate, and constantly overlaps and interlaces with the through holes on the surface of the diverter plate 14, and repeats continuously. At this time, the coolant inside the coolant tank 9 enters the inside of the liquid tank 11 and accumulates inside the liquid tank 11. When the coolant accumulates to a certain extent, it drives the rotating rod 16 and the sealing ball on the rotating rod 16 to float, exposing the liquid port 13, and then the coolant enters the inside of the liquid tank 2 12 through the liquid port 13, and the rotating rod 16 and the sealing ball fall again to collect the liquid. The opening 13 is blocked, and then when the through holes on the diverter plate 14 and the diverter plate 2 15 coincide with each other, the coolant flows out, and the through hole is located just above the fan 8, and the coolant falls on the fan 8, and the high-speed rotating fan 8 collides with the coolant, and the coolant is knocked into tiny water droplets, and a large amount of coolant is knocked into water mist, and then the wind force of the rotation of the fan 8 blows the water mist formed by the coolant into the interior of the heat dissipation bin 2, and the coolant adheres to the surface of the heat dissipation fins 4, and cooperates with the fast-flowing air to drive the coolant to evaporate quickly and absorb the heat on the heat dissipation fins 4. The device increases the heat dissipation speed on the heat dissipation fins 4 by accelerating the air flow rate, and knocks the coolant into water mist attached to the heat dissipation fins 4 through the fan 8, and uses the principle of liquid evaporation to absorb heat to quickly take away the heat on the heat dissipation fins 4. The heat absorption by evaporation and the heat dissipation by wind are combined to greatly improve the heat dissipation efficiency of the device. Compared with the traditional heat conduction and heat absorption heat dissipation methods, this heat dissipation method has fewer constraints, and will not affect the heat dissipation effect due to the temperature of the external space, and the heat taken away by evaporative heat dissipation is always stable; When the switch is in normal working state, the heat generated at this time is relatively small, and the heat dissipation task can be completed by driving the air to flow quickly through the fan 8. At this time, the user can pull the resistance rod 19 to drive the magnet on the surface of the resistance rod 19 to separate from the magnet on the surface of the conveying pipe 10. At this time, the elastic force of the spring 184 drives the shaft plate 183 to rotate and reset, and drives the resistance rod 19 to rotate to the bottom of the rotating rod 16. The resistance rod 19 and the rotating rod 16 conflict with each other, so that the rotating rod 16 cannot rotate, so that the coolant inside the liquid tank 11 cannot drive the sealing ball and the rotating rod 16 to float, so that the liquid port 13 is blocked for a long time by the sealing ball, so that the coolant cannot enter the interior of the liquid tank 2 12 and is retained. This structure allows the user to freely and flexibly adjust the heat dissipation effect of the device according to the workload used by the switch in a certain period of time, so as to avoid the coolant being always consumed when the heat generated by the switch is not large, resulting in excessive heat dissipation efficiency, and also avoid the coolant being always consumed, which increases costs.

[0023] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A heat dissipation mounting frame for a network communication switch, comprising a cabinet (1), characterized in that: The back of the cabinet (1) is fixedly connected to a heat sink (2); the interior of the cabinet (1) is evenly fixedly connected to a mounting plate (3); the interior of the heat sink (2) is evenly installed with heat sink fins (4); half of the heat sink fins (4) are located inside the heat sink (2); the other half of the heat sink fins (4) are located inside the cabinet (1); a vent (5) is provided at the top of the heat sink (2); the vent (5) penetrates the heat sink (2) to connect the heat sink (2) with the outside; the back of the heat sink (2) is fixedly connected to a mounting chamber (6); a motor (7) is installed inside the mounting chamber (6); a fan (8) is fixedly connected to the output shaft of the motor (7); a coolant chamber (9) is installed at the top of the back of the heat sink (2); the coolant The bin (9) is located above the installation bin (6); a delivery pipe (10) is fixedly connected to the bottom of the coolant bin (9); a liquid tank 1 (11) and a liquid tank 2 (12) are provided inside the delivery pipe (10); the liquid tank 1 (11) is located above the delivery pipe (10); the liquid tank 2 (12) is located below the delivery pipe (10); a liquid port (13) is provided at the connection between the liquid tank 1 (11) and the liquid tank 2 (12); a diverter plate 1 (14) is fixedly connected to the bottom end of the liquid tank 2 (12); a diverter plate 2 (15) is provided below the delivery pipe (10); a rotating rod (16) is provided inside the liquid tank 1 (11); a reset shaft (18) is installed on the side of the delivery pipe (10); and a gear disk (17) is fixedly connected to the drive shaft of the motor (7).

2. A heat dissipation mounting frame for a network communication switch according to claim 1, characterized in that: Both sides of the inner wall of the second diverter plate (15) are fixedly connected with sliders, and the surface of the delivery pipe (10) is provided with an annular slide groove, and the slider is located inside the slide groove. The slider can rotate and move along the track of the annular slide groove, and the slider and the slide groove cannot be separated.

3. A heat dissipation mounting frame for a network communication switch according to claim 1, characterized in that: The rotating rod (16) is connected to the delivery pipe (10) via a rotating seal, and the rotating rod (16) can rotate left and right via the rotating seal. One end of the rotating rod (16) extends to the outside of the delivery pipe (10), and the other end of the rotating rod (16) is fixedly connected to a sealing ball, which blocks and seals the liquid port (13).

4. A heat dissipation mounting frame for a network communication switch according to claim 1, characterized in that: The reset shaft (18) comprises a shaft ring (181), the interior of the shaft ring (181) is fixedly connected to a shaft rod (182), the surface of the shaft rod (182) is sleeved with a shaft plate (183), the surface of the shaft rod (182) is sleeved with a spring (184), one end of the spring (184) is fixedly connected to the inner wall of the shaft ring (181), and the other end of the spring (184) is fixedly connected to the inner wall of the shaft plate (183).

5. A heat dissipation mounting frame for a network communication switch according to claim 4, characterized in that: The surface of the shaft plate (183) is fixedly connected to a resistance rod (19), the top end of the resistance rod (19) and the bottom end of the rotating rod (16) are in mutual contact, the surface of the resistance rod (19) is fixedly connected to a magnet, and the side of the conveying pipe (10) is fixedly connected to a magnet, the positions of the two groups of magnets correspond to each other, and the two groups of magnets attract each other.

6. A heat dissipation mounting frame for a network communication switch according to claim 1, characterized in that: A through hole is formed through the surface of the first diverter plate (14), and a through hole is formed through the surface of the second diverter plate (15). The delivery pipe (10) connects the inside and the outside of the coolant tank (9), and the positions of the through holes between the first diverter plate (14) and the second diverter plate (15) correspond to each other.

7. A heat dissipation mounting frame for a network communication switch according to claim 1, characterized in that: The side surface of the toothed disc (17) is evenly fixedly connected with a tooth plate, the surface of the second diverter plate (15) is evenly fixedly connected with a tooth block, the tooth plate and the tooth block are meshed with each other, and the through holes on the surfaces of the first diverter plate (14) and the second diverter plate (15) are located directly above the fan (8).

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