A heat dissipation structure

Abstract

The application discloses a heat dissipation structure, which comprises at least two heat dissipation fins, the heat dissipation fin comprises a first edge part and a second edge part intersecting or opposite to the first edge part, the first edge part of one of the at least two heat dissipation fins is detachably connected to the second edge part of the other heat dissipation fin, and a bonding layer with a first bonding surface and a second bonding surface opposite to the first bonding surface is arranged, the first bonding surface is bonded to at least one heat dissipation fin, and the second bonding surface is used for fixing the heat dissipation fin to a heating element. The heat dissipation structure is detachably connected to at least two heat dissipation fins, so that the heat dissipation structure can be assembled and disassembled according to different operation scenes and operation requirements, the bonding layer is connected to the heating element to fix the whole heat dissipation structure, the assembly and disassembly of the heat dissipation structure are flexible and reliable, and the applicability of the heat dissipation structure is improved.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and more specifically, to a heat dissipation structure. Background Technology

[0002] In the current detection circuit of server boards, alloy resistors are widely used due to their specific electrical properties. When a large current passes through an alloy resistor, a large amount of heat is generated. Excessive temperature can alter the characteristics of the alloy resistor, affecting the accuracy of current detection on the server board, and consequently impacting the server's performance and reliability.

[0003] In related technologies, heat dissipation of alloy resistor elements is achieved through press-fit heat sinks. Specifically, after machining holes on the circuit board, the heat sink is fixed to the board using rubber posts and springs to dissipate heat from the alloy resistor elements. This method requires machining the circuit board, and the installation and removal of the heat sink is complex and lacks flexibility.

[0004] In summary, how to facilitate the installation and disassembly of heat dissipation structures for alloy resistor components is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] In view of this, the purpose of the present invention is to provide a heat dissipation structure that can be flexibly assembled and disassembled according to the heat dissipation requirements of the heat-generating components. The heat dissipation structure is fixed by adhesive bonding to avoid damage to other electronic components and has good applicability.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A heat dissipation structure, the heat dissipation structure comprising:

[0008] At least two heat sinks, each heat sink including a first edge portion and a second edge portion intersecting or opposite to the first edge portion, wherein the first edge portion of one of the two heat sinks is at least detachably connected to the second edge portion of the other;

[0009] An adhesive layer has a first adhesive surface and a second adhesive surface disposed opposite to the first adhesive surface. The first adhesive surface is adhered to at least one of the heat sinks, and the second adhesive surface is used to fix the heat sink to the heating element.

[0010] On the other hand, the first edge portion and the second edge portion are disposed opposite to each other, and both ends of the first edge portion and the second edge portion are connected by a third edge portion;

[0011] Either the first edge portion or the second edge portion is provided with a slot, and the other edge portion is provided with a snap-fit ​​portion that can snap into the slot.

[0012] On the other hand, of the two third edge portions connecting the first edge portion and the second edge portion, one is provided with the slot and the other is provided with the snap-fit ​​portion.

[0013] On the other hand, the first edge portion and the second edge portion are disposed opposite to each other, and both ends of the first edge portion and the second edge portion are connected by a third edge portion;

[0014] Both the first edge portion and the second edge portion are provided with snap-fit ​​portions, and the third edge portion is provided with a snap-fit ​​groove that can snap-fit ​​with the snap-fit ​​portions.

[0015] On the other hand, the first end of the first edge portion and the first end of the second edge portion intersect, and the second end of the first edge portion and the second end of the second edge portion are connected by a third edge portion;

[0016] One or both of the first edge portion, the second edge portion, and the third edge portion are provided with a slot, and the others are provided with a snap-fit ​​portion that can snap into the slot.

[0017] On the other hand, the adhesive layer has a hollow area and the edges do not extend beyond the first edge portion and the second edge portion. A heat conductor for contacting the heating element is provided in the hollow area, and the heat conductor is thermally conductive silicone grease.

[0018] On the other hand, the heat sink includes a conductive part near the first adhesive surface and a heat dissipation part away from the first adhesive surface. Heat dissipation fins are protruding from the heat dissipation part, and several sets of heat dissipation fins are arranged to form multiple sets of heat dissipation channels.

[0019] The heat dissipation channel of one of two adjacent heat sinks can be connected to the heat dissipation channel of the other.

[0020] On the other hand, the heat dissipation fins have a tree-like structure, which includes a main branch and a branch connected to the main branch. The branch is distributed between two main branches on the same heat dissipation fin, and the main branch is distributed between two branch on the same heat dissipation fin.

[0021] On the other hand, the branch portion includes a plurality of heat dissipation branches extending away from the main branch, the heat dissipation branches close to the main branch being located in the central region of the heat dissipation portion, and the width of the heat dissipation channel formed by the heat dissipation branches gradually decreasing away from the main branch.

[0022] On the other hand, an insulating layer is provided between the conductive part and the adhesive layer, and the insulating layer is provided to cover the plane of the conductive part.

[0023] The heat dissipation structure provided by this invention includes: at least two heat sinks and an adhesive layer. Each heat sink includes a first edge portion and a second edge portion intersecting or opposite to the first edge portion. The first edge portion of one of the two heat sinks is detachably connected to at least the second edge portion of the other, meaning the heat dissipation structure can be flexibly assembled and disassembled according to actual heat dissipation needs and operating conditions. The adhesive layer has a first adhesive surface and a second adhesive surface opposite to the first adhesive surface. The first adhesive surface is adhered to at least one heat sink to fix it to the heat sink, and the second adhesive surface is used to adhere to a heat-generating element to fix the entire heat sink to the heat-generating element, thereby reliably and effectively dissipating heat from the heat-generating element. This bonding method eliminates the need for further processing of electronic components, and the heat dissipation structure is simple and convenient to install and disassemble, highly flexible, and has good applicability.

[0024] The beneficial effects of this invention are as follows: by setting at least two detachably connected heat sinks, the heat dissipation structure can be assembled and disassembled according to different working scenarios and needs. By setting an adhesive layer and connecting the heating element, the overall heat dissipation structure can be fixed, assembled, disassembled, and reassembled flexibly and reliably, thereby improving the applicability of the heat dissipation structure. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the heat dissipation structure provided by the present invention;

[0027] Figure 2 This is a schematic diagram illustrating the application of the heat dissipation structure provided by the present invention;

[0028] Figure 3 This is a schematic diagram of the first structure of the heat sink provided by the present invention;

[0029] Figure 4 This is a schematic diagram of a second structure of the heat sink provided by the present invention;

[0030] Figure 5 This is a schematic diagram of a third structure of the heat sink provided by the present invention;

[0031] Figure 6 for Figure 5 A schematic diagram of the assembly and disassembly of the corresponding heat sink;

[0032] Figure 7 for Figure 5Another diagram showing the assembly and disassembly of the corresponding heatsink;

[0033] Figure 8 This is a schematic diagram of the fourth structure of the heat sink provided by the present invention;

[0034] Figure 9 This is a schematic diagram of the fifth structure of the heat sink provided by the present invention;

[0035] Figure 10 This is a schematic diagram of the installation of the heat sink and heat fins provided by the present invention.

[0036] Figures 1-10 In the accompanying drawings, the reference numerals include:

[0037] 1-Heat sink; 2-Adhesive layer; 3-Heat conductor; 4-Board; 5-Alloy resistor element; 11-First edge; 12-Second edge; 13-Third edge; 14-Snap-fit ​​part; 15-Slot; 16-Heat sink fin; 161-Main branch; 162-Heat sink branch; 163-Heat sink channel; 111-Conducting part; 112-Heat sink part. Detailed Implementation

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] The core of this invention is to provide a heat dissipation structure. By setting at least two detachably connected heat sinks, the heat dissipation structure can be assembled and disassembled according to different working scenarios and requirements. By setting an adhesive layer and connecting the heat-generating element, the overall heat dissipation structure is fixed, making assembly and disassembly flexible and reliable, thereby improving the applicability of the heat dissipation structure.

[0040] The heat dissipation structure provided by this invention can be applied in multiple fields, providing reliable and flexible heat dissipation for heat-generating components in various sectors. In communication equipment such as base stations, it dissipates heat from electronic components, improving equipment stability. In consumer electronics products, such as laptops and tablets, customized heat sink designs can meet the demands for thinness and high performance. In the server field, it can also be applied to heat dissipation of resistors in other package sizes and non-alloy resistors. In industrial control, it improves system stability in automated control systems and power electronic equipment. In the new energy field, the heat sink of this invention can provide efficient heat dissipation for components such as battery management systems and motor controllers in electric vehicles, as well as inverters and controllers in solar power generation systems.

[0041] Taking the heat dissipation structure used for heat dissipation of alloy resistor element 5 on board 4 as an example, the specific distribution relationship of board 4, alloy resistor element 5, and heat sink 1 is as follows: Figure 2 As shown. It should be noted that the heat sink 1 covers all edges of the alloy resistor element 5 to ensure reliable heat dissipation.

[0042] Taking one specific implementation as an example, if the heat sink 1 is quadrilateral, the length and width of the heat sink 1 are slightly larger than the package size of the alloy resistor element 5 to ensure complete coverage of the surface of the alloy resistor element 5, thereby achieving the maximum heat dissipation contact area and ensuring reliable and effective heat dissipation of the alloy resistor element 5. "Slightly larger" is explained as follows: if the package size of the alloy resistor element 5 is 6.35mm x 3.18mm, then the length of the heat sink 1 is designed to be 7.98mm ± 0.1mm, and the width is 4.86mm ± 0.1mm.

[0043] As for the thickness of heat sink 1, it can be optimized according to heat dissipation requirements and the thermal conductivity of the material. Under the premise of meeting the usage requirements, a thin design is preferred to reduce space occupation while ensuring sufficient heat dissipation capacity.

[0044] The heat dissipation structure includes at least two heat sinks 1. "At least two" can include two, three, four, five, etc. The specific number of heat sinks 1 can be flexibly selected based on actual heat dissipation needs and available space, and is not limited. Through the flexible combination of heat sinks 1, heat conduction and sharing are achieved, forming an overall heat dissipation network to ensure reliable and effective heat dissipation for the alloy resistor element 5.

[0045] The heat sink 1 includes a first edge portion 11 and a second edge portion 12 that intersects with or is opposite to the first edge portion 11. Here, "intersecting" means that the first edge portion 11 and the second edge portion 12 have intersecting connections, while "opposite" means that the first edge portion 11 and the second edge portion 12 are arranged in parallel.

[0046] The case where the first edge portion 11 and the second edge portion 12 intersect is as follows: Figure 9 and Figure 10 As shown, the situation where the first edge portion 11 and the second edge portion 12 are opposite is as follows: Figure 3 , Figure 4 , Figure 5 As shown. The heat sink 1 can be triangular, quadrilateral, pentagonal, hexagonal, etc., or it can be a shape with six sides, such as an L-shape, without specific restrictions.

[0047] In practical applications, at least two heat sinks 1 can be flexibly assembled and disassembled according to operational requirements. For example, if one heat sink 1 fails, it can be directly removed from the heat dissipation structure and replaced with a new heat sink 1, facilitating maintenance and replacement. If multiple alloy resistor elements 5 are used or the individual area is relatively large, it is necessary to increase the number of heat sinks 1 to increase the heat dissipation area of ​​the heat dissipation structure. In this case, the heat sinks 1 are assembled according to the actual situation. When multiple alloy resistor elements 5 are connected in parallel, the detachable connection between the heat sinks 1 allows the heat dissipation structure to be flexibly combined according to the parallel resistor layout, realizing heat conduction sharing, forming an overall heat dissipation network, improving flexibility, and better adapting to the layout of board components.

[0048] The first edge 11 of any two heat sinks 1 is detachably connected to the second edge 12 of the other.

[0049] If the heat dissipation structure includes two heat sinks 1, the first embodiment is as follows: the first edge 11 of one of the two heat sinks 1 is connected to the second edge 12 of the other. Please refer to the corresponding structural form of the heat sink 1. Figure 5 , Figure 8 , Figure 9 In this manner, the first edge portion 11 of the two heat sinks 1 have the same structure, and the corresponding second edge portion 12 also has the same structure. However, the different structures of the first edge portion 11 and the second edge portion 12 can form an engaging relationship to reliably assemble the two heat sinks 1.

[0050] If the heat dissipation structure includes two heat sinks 1, another embodiment is as follows: the first edge portion 11 of one of the two heat sinks 1 is detachably connected to the first edge portion 11 and the second edge portion 12 of the other. In this case, the structure of the corresponding heat sink 1 is as follows: Figure 3 As shown, the engaging structure provided on the first edge portion 11 of one of the two heat sinks 1 can engage with the first edge portion 11 and the second edge portion 12 of the other heat sink 1. In this case, the engaging structure is provided at the corner of the heat sink 1.

[0051] The above three implementation methods merely illustrate the assembly of two heat sinks 1. If the number of heat sinks 1 is increased, they can be connected according to the snap-fit ​​structure on the heat sinks 1, which will not be described in detail here. Regardless of the number of heat sinks 1, they can be detachably connected to form a more integrated heat dissipation structure, allowing for easy disassembly and improving the flexibility of the heat dissipation structure.

[0052] The adhesive layer 2 has a first adhesive surface and a second adhesive surface disposed opposite to the first adhesive surface. The first adhesive surface is adhered to at least one heat sink 1, and the second adhesive surface is used to adhere to a heat-generating element. When applied to heat dissipation of the alloy resistor element 5 on the board 4, the heat-generating element is specifically the alloy resistor element 5.

[0053] When the heating element is specifically an alloy resistor element 5, the alloy resistor element 5 is positioned between the board 4 and the heat dissipation structure. The heat dissipation structure is fixed to the board 4 via the adhesive layer 2, thus limiting the position of the heat dissipation structure and fixing it relatively above the alloy resistor element 5. Here, "above" refers to... Figure 2 In terms of the upper and lower positions.

[0054] The heat dissipation structure is fixed by adhesive bonding, eliminating the need for soldering or hole alignment. Installation is simple and convenient. If the server board layout is adjusted, the entire heat dissipation structure can be manually removed. Its position can be flexibly adjusted to avoid interference caused by layout changes. Reassembly is unnecessary; simply attach the adhesive layer 2 to the board 4. This offers high flexibility. Furthermore, if heatsink 1 malfunctions, no special soldering equipment is required. Simply peel off the old heatsink 1 and replace it with a new one. This simple operation avoids damage to surrounding components, improving the convenience of maintenance and replacement. Upgrading heatsink 1 during the server board's lifespan can be easily achieved, reducing maintenance costs and time.

[0055] For example, when heat dissipating a single alloy resistor element 5, the heat sink 1 can be easily adjusted and its mounting position can be adjusted according to the server board layout and the position of the alloy resistor element 5, allowing for flexible combination. When multiple alloy resistor elements 5 are connected in parallel, the combination method of the heat sink 1 can be flexibly selected according to the heat generation of each alloy resistor element 5, and the heat dissipation structure can be easily recombined or disassembled when the layout of the parallel resistors changes.

[0056] In one specific implementation, the adhesive layer 2 is specifically polyurethane adhesive. When not in use, the second adhesive surface is sealed to the heat sink 1 by plastic to prevent the adhesive layer from being contaminated or deteriorated. When in use, the plastic is simply peeled off for adhesion.

[0057] By bonding the heatsink 1 to the board 4, it is ensured that the heatsink 1 will not loosen under vibration and temperature changes during server operation. The bonding strength of the polyurethane adhesive used as the adhesive layer 2 has been tested and can withstand a tensile force of at least 10N in the vertical direction without falling off, ensuring the reliability of the heat dissipation structure installation.

[0058] In this embodiment, the first adhesive surface of the adhesive layer 2 is adhered to at least one heat sink 1. That is, the entire heat dissipation structure may have only one adhesive layer 2, or each heat sink 1 may have an adhesive layer 2. More specifically, if two heat sinks 1 are assembled, they can be reliably connected to the circuit board 4 by having an adhesive layer 2 on the bottom of each heat sink 1, or they can be connected to the circuit board 4 by having an adhesive layer 2 on one of the heat sinks 1. It should be noted that if the first adhesive surface of the adhesive layer 2 is only adhered to one heat sink 1, the engagement structure corresponding to the first edge portion 11 and the second edge portion 12 of at least two heat sinks 1 has good reliability and will not easily separate due to server vibration.

[0059] In this embodiment, the first edge portion 11 of any two heat sinks 1 is detachably connected to at least the second edge portion 12 of the other. The detachable connection can be achieved by means of snap-fit, fastening, or other methods.

[0060] The heat dissipation structure provided by the present invention allows for the detachable connection of at least one of the first edge portions 11 of any two heat sinks 1 with the second edge portion 12 of the other. This means that the heat dissipation structure can be flexibly assembled and disassembled according to the actual heat dissipation requirements of the heat-generating element and the actual operating conditions. The adhesive layer 2 has a first adhesive surface and a second adhesive surface disposed opposite to the first adhesive surface. The first adhesive surface is adhered to at least one heat sink 1 to fix it to the heat sink 1, and the second adhesive surface is used to adhere to the heat-generating element to fix the heat sink 1 as a whole to the heat-generating element, so as to reliably and effectively dissipate heat from the heat-generating element. This bonding method does not require further processing of electronic components. The heat dissipation structure is simple and convenient to install and disassemble, highly flexible, and has good applicability.

[0061] The above-mentioned heat dissipation structure can be assembled without soldering, and the bonding position can be adjusted according to the structural layout and resistor position. Replacing heat sink 1 is simple. The heat dissipation structure can be flexibly selected and combined according to the heating condition of the heat-generating element and the layout changes.

[0062] Based on the above embodiment, the first edge portion 11 and the second edge portion 12 are disposed opposite to each other, and both ends of the first edge portion 11 and the second edge portion 12 are connected by a third edge portion 13. Please refer to Figure 5 , Figure 6 , Figure 7 The heat sink 1 is quadrilateral in shape, and the first edge 11 and the second edge 12 are two edges that are arranged opposite each other. The third edge 13 is formed by connecting the first edge 11 and the second edge 12 to form an overall quadrilateral structure.

[0063] A slot 15 is provided on either the first edge portion 11 or the second edge portion 12, and a snap-fit ​​portion 14 is provided on the other edge portion 12 that can snap into the slot 15.

[0064] If the heat dissipation structure includes two heat sinks 1, the assembly of the two heat sinks 1 is completed directly by the engagement of the first edge portion 11 of one heat sink 1 and the second edge portion 12 of the other heat sink 1.

[0065] If the heat dissipation structure includes four heat sinks 1, such as Figure 6 and Figure 7 As shown by the arrows, the assembly method involves the four heat sinks 1 being reliably assembled through the interlocking relationship between the slots 15 and the latching parts 14 on the four heat sinks 1. Specifically, in this method, the four heat sinks 1 are connected sequentially to form a heat dissipation structure.

[0066] Regardless of the specific assembly method described above, the interlocking relationship allows for detachable connection between two or more heat sinks 1, simplifying the assembly and disassembly process and improving the overall flexibility and applicability of the heat dissipation structure.

[0067] In this embodiment, the shapes of the slot 15 and the latching part 14 are not limited; they can be circular, square, or irregular in shape, without much restriction. Similarly, the number of slots 15 and latching parts 14 is not limited; two or three can be provided. If one latching part 14 or slot 15 fails, the other latching parts 14 and slots 15 can still ensure normal operation, guaranteeing a reliable latching relationship and ensuring the overall reliability and stability of the heat dissipation structure.

[0068] In this embodiment, the third edge portion 13 may be provided with a slot 15 or a snap-fit ​​portion 14, or it may not be provided. The specific arrangement depends on the actual assembly form of the heat sink. If the slot 15 and snap-fit ​​portion 14 of the first edge portion 11 and the second edge portion 12 can meet the assembly requirements of the heat dissipation structure, then there is no need to process the third edge portion 13.

[0069] Based on any of the above embodiments, one of the two third edge portions 13 connecting the two ends of the first edge portion 11 and the second edge portion 12 is provided with a slot 15 and the other is provided with a snap-fit ​​portion 14.

[0070] Please refer to Figure 5 , Figure 6 , Figure 7 A slot 15 and a snap-fit ​​part 14 are also provided on the third edge part 13, so that the four heat sinks 1 can form a more flexible assembly relationship. Each heat sink 1 can connect to two adjacent heat sinks 1, making the heat dissipation structure assembled by multiple heat sinks 1 more flexible and improving the applicability of the heat dissipation structure.

[0071] like Figure 6 and Figure 7As shown, the heat dissipation structure includes four heat sinks 1. The heat sinks 1 can be spliced ​​together in the direction indicated by the arrow to form a square heat dissipation structure, which meets the requirement of forming a square heat dissipation part.

[0072] Given that the heat dissipation structure includes three heat sinks 1, they can be connected in pairs and then connected to the remaining heat sink 1. They can be assembled flexibly by oneself, and will not be described in detail.

[0073] Based on any of the above embodiments, the first edge portion 11 and the second edge portion 12 are disposed opposite to each other, and both ends of the first edge portion 11 and the second edge portion 12 are connected by the third edge portion 13; both the first edge portion 11 and the second edge portion 12 are provided with a snap-fit ​​portion 14, and the third edge portion 13 is provided with a snap-fit ​​groove 15 that can snap-fit ​​with the snap-fit ​​portion 14.

[0074] Please refer to Figure 4 When assembling the heat sink 1, taking two heat sinks 1 as an example, the snap-fit ​​portion 14 on the first edge portion 11 of one heat sink 1 connects to the snap-fit ​​groove 15 on the third edge portion 13 of the other heat sink 1 to form a snap-fit ​​engagement; or, the snap-fit ​​portion 14 on the second edge portion 12 of one heat sink 1 connects to the snap-fit ​​groove 15 on the third edge portion 13 of the other heat sink 1 to form a snap-fit ​​engagement.

[0075] In this way, the heat sink 1 can be formed into a square structure to meet the heat dissipation requirements of the square alloy resistor element 5.

[0076] In this embodiment, the shapes of the slot 15 and the latching part 14 are not limited; they can be circular, square, or irregular in shape, without much restriction. Similarly, the number of slots 15 and latching parts 14 is not limited; two or three can be provided. If one latching part 14 or slot 15 fails, the other latching parts 14 and slots 15 can still ensure normal operation, guaranteeing a reliable latching relationship and ensuring the overall reliability and stability of the heat dissipation structure.

[0077] Based on any of the above embodiments, the first end of the first edge portion 11 and the first end of the second edge portion 12 intersect, and the second end of the first edge portion 11 and the second end of the second edge portion 12 are connected by a third edge portion 13. Please refer to... Figure 8 and Figure 9 If the heat sink 1 is triangular in shape, two heat sinks 1 can be assembled to form a quadrilateral structure. This type of heat sink 1 is suitable for the needs of smaller or more irregular heat dissipation areas, and can ensure reliable heat dissipation without taking up too much space.

[0078] Please refer to Figure 8 and Figure 9One or both of the first edge portion 11, the second edge portion 12, and the third edge portion 13 are provided with a slot 15, and the others are provided with a latching portion 14 that can engage with the slot 15. Based on the above conditions, the distribution of the slots 15 and latching portions 14 on the three edge portions is restricted to satisfy the engagement relationship of two or more heat sinks 1, so as to achieve the effect of flexible assembly and disassembly according to actual heat dissipation requirements.

[0079] In one specific embodiment, given that the heat sink 1 includes a first edge portion 11, a second edge portion 12, and a third edge portion 13, each edge portion may be provided with a snap-fit ​​portion 14 or a snap-fit ​​groove 15. The snap-fit ​​portion 14 and the snap-fit ​​groove 15 on one edge portion are snapped into the snap-fit ​​grooves 15 and snap-fit ​​portions 14 on other edge portions respectively, so as to ensure the reliable and firm connection between the heat sinks 1 and the reliability of the heat dissipation operation.

[0080] Based on any of the above embodiments, the heat sink 1 is connected to the board 4 using a non-drilling method with polyurethane adhesive. When not in use, the polyurethane adhesive is sealed with plastic to prevent contamination and deterioration. The bonding method avoids the impact on the alloy resistor element 5 and surrounding components, and no operating space is required, saving space inside the board.

[0081] Assuming polyurethane adhesive is used as adhesive layer 2, please refer to... Figure 1 The adhesive layer 2 has a hollow area and its edges do not extend beyond the first edge portion 11 and the second edge portion 12. A heat-conducting body 3 for contacting the alloy resistor element 5 is provided in the hollow area. By filling the hollow area of ​​the adhesive layer 2 on the heat sink 1 with the heat-conducting body 3, the heat of the alloy resistor element 5 can be reliably transferred out, ensuring heat conduction efficiency and ensuring reliable and effective heat dissipation of the alloy resistor element 5 by the heat sink 1.

[0082] Furthermore, the heat sink 1 is made of aluminum alloy with a high thermal conductivity to improve heat conduction. The heat conductor 3 is thermal grease, which has high thermal conductivity and can fill the tiny gaps between the heat sink and the resistor, further enhancing the heat conduction efficiency. Together with the polyurethane adhesive used to bond the board 4 on the heat sink 1 and the aluminum alloy heat sink 1, it ensures effective heat conduction and guarantees reliable and effective heat dissipation of the alloy resistor element 5.

[0083] Based on any of the above embodiments, the heat sink 1 includes a conductive portion 111 near the first adhesive surface and a heat dissipation portion 112 away from the first adhesive surface. Heat dissipation fins 16 are protruding from the heat dissipation portion 112, and a plurality of heat dissipation fins 16 are arranged to form a plurality of heat dissipation channels 163.

[0084] The height and spacing of the heat dissipation fins 16 are not limited; the design should be based on the requirement of increasing the heat dissipation area within a limited space and ensuring the heat dissipation effect.

[0085] The heat dissipation fins 16 are set perpendicular to the board 4 to meet the actual situation of air flowing from bottom to top. The heat of the alloy resistor element 5 is discharged through multiple heat dissipation channels 163 formed by the arrangement of several sets of heat dissipation fins 16, so as to ensure the reliable operation of the alloy resistor element 5.

[0086] In this embodiment, the heat dissipation fins 16 can be arranged in the shape of fins, waves, or other shapes, as long as the heat dissipation area is maximized to ensure reliable and effective heat dissipation for the alloy resistor element 5.

[0087] In this embodiment, the form of the multiple heat dissipation channels 163 can be the same or different, and there is no specific restriction. As long as it can facilitate the dissipation of hot air on the alloy resistor element 5 through the heat dissipation channels 163.

[0088] One of two adjacent heat sinks 1 has a corresponding heat dissipation channel 163 that can be connected to the corresponding heat dissipation channel 163 of the other. If the heat dissipation fins 16 have a tree-like structure, after two or more heat sinks 1 are assembled, multiple interconnected heat dissipation channels 163 can be formed. The combined multiple heat dissipation channels 163 form a tree-like structure, and heat is conducted and collected from the multiple interconnected heat dissipation channels 163 of the alloy resistor element 5. After collection, the heat is dissipated to the surrounding environment, effectively utilizing the overall heat dissipation capacity of the tree-like structure, avoiding local overheating of the alloy resistor element 5, and ensuring the reliable operation of the alloy resistor element 5.

[0089] Based on any of the above embodiments, please refer to Figure 10 The heat dissipation fin 16 has a tree-like structure, which includes a main branch 161 and a branch connected to the main branch 161. The branch is distributed between the two main branches 161 on the same heat dissipation fin 1.

[0090] like Figure 10 Taking a heat dissipation section 112 with three sets of heat dissipation fins 16 as an example, namely the first heat dissipation fin, the second heat dissipation fin, and the third heat dissipation fin, the vertical branches of the second heat dissipation fin are distributed between the main branches 161 of the first heat dissipation fin and the main branches of the second heat dissipation fin are distributed between the vertical branches of the first heat dissipation fin and the vertical branches of the third heat dissipation fin. This arrangement disperses the heat dissipation area of ​​the heat dissipation fin 1, ensuring that heat can be dissipated in each area, thus guaranteeing reliable and effective heat dissipation for the alloy resistor element 5.

[0091] In this embodiment, the form of the branch is not limited; it can have one, two, or more branches, and the design can be tailored to the specific heat dissipation requirements.

[0092] Based on any of the above embodiments, the branch portion includes a plurality of heat dissipation branches 162 extending in a direction away from the main branch 161, the number of heat dissipation branches 162 gradually decreasing in the direction away from the main branch 161, and the width of the corresponding heat dissipation channel 163 becoming smaller and smaller.

[0093] The heat dissipation branches 162 of the main branch 161, which are close to the main branch 161, are located in the central region of the heat dissipation section 112. The width of the heat dissipation channel 163 formed by the heat dissipation branches 162 in the central region is the largest, while the width of the heat dissipation channel 163 formed by the heat dissipation branches 162 in other regions gradually decreases. This is because the heat-generating area of ​​the alloy resistor element 5 is mostly concentrated in the central region, and this arrangement ensures efficient and rapid heat dissipation of the alloy resistor element 5.

[0094] By limiting the specific form of the branch section in this embodiment, the heat dissipation area of ​​the heat sink 1 in the middle position is relatively large, while the heat dissipation area on both sides is relatively small. This is based on the fact that the heat generated in the middle of the alloy resistor element 5 during actual operation is much greater than the heat generated on both sides or edges. By specifically setting the structure of the heat dissipation fins 16, the rapid and efficient heat dissipation of the alloy resistor element 5 is ensured, and the reliability and effectiveness of the heat dissipation structure operation are guaranteed.

[0095] Based on any of the above embodiments, please refer to Figure 1 An insulating layer is provided between the conductive part 111 and the adhesive layer 2, and the insulating layer covers the plane of the conductive part 111.

[0096] After the heat sink 1 is processed, an insulating layer is attached or coated on the plane of the conductive part 111, and then the adhesive layer 2 is connected to the insulating layer. By covering the plane of the conductive part with the insulating layer, the heat sink 1 is ensured not to contact the board 4, thus avoiding short circuits in the board 4 and ensuring safety and reliability.

[0097] In one specific embodiment, the insulating layer includes, but is not limited to, an epoxy resin coating. Epoxy resin has excellent insulating properties, with an insulation resistance exceeding 1 MΩ, effectively preventing short circuits between the heat sink 1 and surrounding circuit components. Simultaneously, different fillers can be added to the epoxy resin insulating coating to improve thermal conductivity, ensuring good thermal conductivity without negatively impacting the heat dissipation performance of the heat sink 1. Under the premise of ensuring insulation, the heat dissipation efficiency of the heat sink 1 can still meet the heat dissipation requirements of the alloy resistor element 5.

[0098] Different fillers can be added to the epoxy resin insulating coating. Specific fillers include alumina particles, silver nanoparticles, or silicon nitrides. Silver nanoparticles can be added directly by adding Al₂O₃ containing silver nanoparticles. Adding these fillers forms a composite structure layer in the insulating layer, improving its thermal conductivity. This ensures insulation performance without compromising heat dissipation, thus promoting the heat dissipation process of the alloy resistor element 5.

[0099] In the specific manufacturing process of the heat sink 1, the high thermal conductivity aluminum alloy material is cut into a basic shape of heat sink 1 that is slightly larger than the alloy resistance element 5 using high-precision cutting equipment, with the error controlled within ±0.05mm; heat dissipation fins 16 are stamped out using precision molds to ensure that their height and spacing meet the design requirements, with the stamping mold accuracy reaching ±0.02mm; after filling the heat conductor 3 in the middle of the heat sink 1, the bottom perimeter is coated with an adhesive layer 2 and sealed with plastic.

[0100] When using the heat sink 1, for heat dissipation of a single alloy resistor element 5, determine its position on the board 4, and use a positioning tool to ensure the accuracy is within ±0.1mm. Peel off the plastic seal of the adhesive layer 2, place the heat sink 1 above the alloy resistor element 5, so that the heat conductor 3 contacts the alloy resistor element 5, press the center part to apply specific pressure and hold for a certain period of time, so that the adhesive layer 2 is reliably bonded to the board 4, thereby fixing the heat sink 1.

[0101] When multiple alloy resistor elements 5 are connected in parallel, the corresponding heat dissipation structure is selected according to the heat generation situation. After the installation is carried out in the same way as a single alloy resistor element 5, the corresponding snap-fit ​​parts and grooves of the first edge 11, second edge 12, and third edge 13 of the heat sink 1 are used to form a heat dissipation channel for the entire set of multiple alloy resistor elements 5, ensuring the heat dissipation effect of the multiple alloy resistor elements 5. In practical applications, a thermal imager can be used to detect whether the heat conduction is normal, in order to determine whether the heat sink 1 corresponding to the multiple alloy resistor elements 5 is reliably installed and whether a reliable heat dissipation effect is achieved.

[0102] Regarding the heat dissipation structure determined in the above embodiments, in terms of heat dissipation efficiency, the heat sink 1 is optimized to be made of aluminum alloy and filled with a heat conductor 3. The heat conductor 3 contacts the heat-generating element for reliable heat transfer, effectively improving heat dissipation efficiency. In terms of installation flexibility, the placement of the heat sink 1 for a single heat-generating element can be flexibly adjusted and easily replaced. When multiple heat-generating elements are connected in parallel, the heat dissipation structure can be flexibly combined according to changes in heat generation and layout, solving the problem of poor flexibility in traditional methods. In terms of space occupancy, the heat sink assembly method eliminates the need for soldering; it is glued with polyurethane adhesive, eliminating the need for pre-reserved space for soldering operations. The heat sink structure is compact and assemblable, better adapting to electronic component layouts and saving space. In terms of maintenance and replacement, the heat sink 1 can be replaced without special equipment when it fails, without damaging surrounding components, and is easy to upgrade, reducing maintenance costs and time.

[0103] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0104] The above provides a detailed description of a heat dissipation structure provided by the present invention. Specific examples have been used to illustrate the principles and implementation methods of the invention. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A heat dissipation structure, characterized in that, The heat dissipation structure includes: At least two heat sinks (1), each heat sink (1) includes a first edge portion (11) and a second edge portion (12) intersecting or opposite to the first edge portion (11), wherein the first edge portion (11) of any two heat sinks (1) is at least detachably connected to the second edge portion (12) of the other. The adhesive layer (2) has a first adhesive surface and a second adhesive surface disposed opposite to the first adhesive surface. The first adhesive surface is adhered to at least one of the heat sinks (1), and the second adhesive surface is used to fix the heat sink (1) to the heat-generating element. The heat sink (1) includes a conductive part (111) near the first adhesive surface and a heat dissipation part (112) away from the first adhesive surface. Heat dissipation fins (16) are protruding on the heat dissipation part (112), and several sets of heat dissipation fins (16) are arranged to form multiple sets of heat dissipation channels (163). The heat dissipation channel (163) of one of the two adjacent heat sinks (1) can be connected to the heat dissipation channel (163) of the other. The heat dissipation fins (16) have a tree-like structure, which includes a main branch (161) and a branch connected to the main branch (161). The branch portion includes a plurality of heat dissipation branches (162) extending away from the main branch (161). The heat dissipation branches (162) close to the main branch (161) are located in the middle region of the heat dissipation portion (112). The width of the heat dissipation channel (163) formed by the heat dissipation branches (162) gradually decreases away from the main branch (161).

2. The heat dissipation structure according to claim 1, characterized in that, The first edge portion (11) and the second edge portion (12) are disposed opposite to each other, and both ends of the first edge portion (11) and the second edge portion (12) are connected by a third edge portion (13); The first edge portion (11) and the second edge portion (12) are provided with a slot (15), and the other is provided with a snap-fit ​​portion (14) that can snap into the slot (15).

3. The heat dissipation structure according to claim 2, characterized in that, Of the two third edge portions (13) connecting the first edge portion (11) and the second edge portion (12), one is provided with the slot (15) and the other is provided with the snap-fit ​​portion (14).

4. The heat dissipation structure according to claim 1, characterized in that, The first edge portion (11) and the second edge portion (12) are disposed opposite to each other, and both ends of the first edge portion (11) and the second edge portion (12) are connected by a third edge portion (13); Both the first edge portion (11) and the second edge portion (12) are provided with a snap-fit ​​portion (14), and the third edge portion (13) is provided with a slot (15) that can snap-fit ​​with the snap-fit ​​portion (14).

5. The heat dissipation structure according to claim 1, characterized in that, The first end of the first edge portion (11) intersects with the first end of the second edge portion (12), and the second end of the first edge portion (11) and the second end of the second edge portion (12) are connected by a third edge portion (13); One or both of the first edge portion (11), the second edge portion (12), and the third edge portion (13) are provided with a slot (15), and the others are provided with a snap-fit ​​portion (14) that can snap into the slot (15).

6. The heat dissipation structure according to any one of claims 1 to 5, characterized in that, The adhesive layer (2) has a hollow area and the edges do not extend beyond the first edge portion (11) and the second edge portion (12). A heat conductor (3) for contacting the heating element is provided in the hollow area. The heat conductor (3) is thermally conductive silicone grease.

7. The heat dissipation structure according to claim 1, characterized in that, The branch portion is distributed between the two main branches (161) on the same heat sink (1), and the main branches (161) are distributed between the two branch portions on the same heat sink (1).

8. The heat dissipation structure according to claim 7, characterized in that, An insulating layer is provided between the conductive part (111) and the adhesive layer (2), and the insulating layer covers the plane of the conductive part (111).

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