Quantum chip packaging box

Abstract

The invention belongs to the technical field of quantum chip packaging, and discloses a quantum chip packaging box which comprises a shielding top cover with a cavity, a PCB supporting plate connected with the bottom of the shielding top cover and a base fixed to the bottom of the PCB supporting plate, and the shielding top cover, the PCB supporting plate and the base jointly form a packaging box body. Wherein the internal cavity of the shielding top cover comprises two cavities which are communicated with each other and have different sectional areas, and the two cavities are respectively a first cavity and a second cavity; the first cavity with the large sectional area is located below the second cavity with the small sectional area. An accommodating hole is formed in the center of the PCB supporting plate and is used for accommodating a quantum chip; the center of the base is provided with a groove corresponding to the position of the accommodating hole, the sectional area of the groove is smaller than that of the accommodating hole, and the quantum chip is located right above the groove in an installation state. The internal cavity of the shielding top cover is divided into two cavities, and the center of the base is provided with the groove, so that the cavity mode frequency of the packaging box can be effectively improved, and the interference of the cavity mode on the normal work of the quantum chip is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of quantum chip packaging, and more particularly, to a quantum chip packaging box. Background Art

[0002] The quantum chip package is a closed metal box. When microwaves propagate inside it, the package is equivalent to a microwave resonant cavity. When the 1 / 2 wavelength of the microwave and the size of the resonant cavity meet certain conditions, a resonant mode will appear and a resonant wave will be formed. The frequency of the microwave at this time is called the resonant frequency. Among them, the lowest resonant frequency is f 1 In order to avoid the interference of the package box resonant wave on the quantum chip, the minimum resonant frequency f 1 Higher than the operating frequency of quantum chips.

[0003] As the performance requirements for quantum chips continue to increase, the number of quantum bits contained in quantum chips is gradually increasing. At the same time, the number of corresponding resonators, filters, and control circuits is also increasing. These factors cause the chip area to gradually increase, and as a result, the size of the packaging box that matches the chip is also increasing. Generally speaking, the larger the size of the packaging box, the lower its resonant frequency will be. When the size of the packaging box increases to a certain extent, the resonant frequency of the resonant wave inside it may be close to or even coincide with the operating frequency of the quantum chip, which will affect the normal operation of the quantum chip.

[0004] Regarding the packaging of quantum chips, the packaging box of the prior art has the following defects and shortcomings: the shape of the cavity inside the packaging box is a simple cylinder, and no shape optimization design is performed, which makes the resonance frequency of the internal cavity low, which may be close to or overlap with the frequency of the quantum bits and superconducting resonators in the chip, thereby affecting the normal operation of the quantum chip. Summary of the invention

[0005] In order to solve the above technical problems, the object of the present invention is to provide a quantum chip packaging box, which can increase the resonance frequency of the packaging box, thereby preventing the resonance wave of the packaging box from affecting the normal operation of the quantum chip.

[0006] In order to achieve the purpose of solving the above problems, the technical solution adopted by the present invention is to provide a quantum chip packaging box, the quantum chip packaging box includes a shielding top cover with a cavity, a PCB support plate connected to the bottom of the shielding top cover, and a base fixed to the bottom of the PCB support plate, together forming a packaging box body; wherein the internal cavity of the shielding top cover includes two cavities that are interconnected and have different cross-sectional areas, namely a first cavity and a second cavity;

[0007] The first cavity with a larger cross-sectional area is located below the second cavity with a smaller cross-sectional area;

[0008] A receiving hole is provided at the center of the PCB support plate for receiving the quantum chip;

[0009] The center of the base is provided with a groove corresponding to the position of the accommodation hole and having a smaller cross-sectional area than the accommodation hole, and the quantum chip is located directly above the groove when installed. By dividing the internal cavity of the shielding top cover into two cavities and providing a groove in the center of the base, the cavity mode frequency of the packaging box can be effectively increased, thereby avoiding the interference of the cavity mode on the normal operation of the quantum chip.

[0010] According to the present invention, further, the first cavity is in the shape of a polygonal column.

[0011] According to the present invention, further, the first cavity is in the shape of a cylinder.

[0012] According to the present invention, further, the first cavity is in the shape of an elliptical cylinder.

[0013] According to the present invention, further, the second cavity is in the shape of a polygonal column.

[0014] According to the present invention, further, the second cavity is in the shape of a cylinder.

[0015] According to the present invention, further, the second cavity is in the shape of an elliptical cylinder.

[0016] According to the present invention, further, the shape of the accommodating hole is a polygonal column, a circular cylinder or an elliptical cylinder.

[0017] According to the present invention, further, the groove is in the shape of a polygonal column, a circular cylinder or an elliptical column.

[0018] According to the present invention, further, the edges of the column are chamfered.

[0019] Compared with the prior art, the present invention has the following beneficial effects: the present invention effectively improves the resonant frequency of the cavity inside the packaging box, so that the lowest resonant frequency of the packaging box is higher than the operating frequency of the quantum chip, thereby avoiding the influence of the resonant wave inside the packaging box on the normal operation of the quantum chip and ensuring the working performance of the quantum chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the structure of an embodiment of a quantum chip packaging box of the present invention;

[0021] Figure 2 It is a schematic structural diagram of a shielding top cover of the present invention in one direction;

[0022] Figure 3 is a schematic structural diagram of the shielding top cover of the present invention in another direction;

[0023] Figure 4 It is a structural schematic diagram of the PCB support plate and the base of the present invention;

[0024] Figure 5 It is a structural schematic diagram of a PCB support plate of the present invention;

[0025] Figure 6 It is a structural schematic diagram of a base of the present invention.

[0026] Description of reference numerals:

[0027] 1-shielding top cover, 11-first cavity, 12-second cavity;

[0028] 2-PCB support plate, 21-accommodation hole;

[0029] 3-base, 31-groove. DETAILED DESCRIPTION

[0030] In order to make the present invention more clearly understood, a preferred embodiment is described in detail with reference to the accompanying drawings as follows:

[0031] The embodiment of the present application provides a quantum chip packaging box, wherein the lowest resonant frequency f of the quantum chip is 1 It is related to the size and shape of the package box. For a quantum chip of a given size, the size of the package box is also determined. Therefore, in order to increase the minimum resonant frequency f 1 , it is necessary to design and optimize the shape of the cavity inside the package box. Based on this, this embodiment designs a quantum chip package box to increase its minimum resonant frequency f 1 , to avoid the impact of the package box resonant wave on the normal operation of the quantum chip, the specific implementation method is as follows:

[0032] The embodiment of the present invention provides a quantum chip packaging box, please refer to Figure 1 The quantum chip packaging box comprises a shielding top cover 1 with a cavity, a PCB support plate 2 fixed on the lower surface of the shielding top cover 1 and a base 3 fixed on the bottom surface of the PCB support plate 2.

[0033] For details, please refer to Figure 2 , is a schematic diagram of the structure of the shielding cover 1; the internal cavity of the shielding cover 1 is composed of two interconnected cavities, namely a first cavity 11 and a second cavity 12. Figure 2 The first cavity 11 is located below the second cavity 12. The first cavity 11 and the second cavity 12 are spatially connected. The cross-sectional area of ​​the first cavity 11 is greater than the cross-sectional area of ​​the second cavity 12.

[0034] The center of the PCB support plate 2 is provided with an accommodating hole 21 for accommodating the quantum chip; the center of the base 3 is provided with a groove 31 corresponding to the position of the accommodating hole 21, and the quantum chip is located directly above the groove 31; the shielding top cover 1, the PCB support plate 2 and the base 3 are sequentially fitted and fixed to form a packaging box body.

[0035] In the specific implementation, firstly fit and fix the PCB support plate 2 and the base 3 together, please refer to Figure 4 As shown. Next, place the quantum chip just above the groove 31 and fit it to the surface of the base 3. At this time, the quantum chip is also located in the receiving hole 21. Then, fit the shielding top cover 1 to the PCB support plate 2 and the base 3 with the quantum chip, and the packaging is completed. It should be noted that the cross-sectional area of ​​the quantum chip is larger than the cross-sectional area of ​​the groove 31 and smaller than the cross-sectional area of ​​the receiving hole 21.

[0036] refer to Figure 2 and Figure 3 As shown, the shape of the first cavity 11 includes a polygonal column (such as a cuboid, a cube, etc.), a cylinder and an elliptical column. In addition, since chamfering is often performed on the corners in actual processing, the shape of the first cavity 11 should also include variants of the above-mentioned column after chamfering.

[0037] refer to Figure 2 and Figure 3 As shown, the shape of the second cavity 12 includes a polygonal column (such as a cuboid, a cube, etc.), a cylinder and an elliptical column. In addition, since chamfering is often performed on the corners in actual processing, the shape of the second cavity 12 should also include a variant of the above-mentioned column after chamfering.

[0038] refer to Figure 5 As shown, the shape of the receiving hole 21 includes a polygonal column (such as a cuboid, a cube, etc.), a cylinder and an elliptical column. In addition, since chamfering is often performed on the corners in actual processing, the shape of the receiving hole 21 should also include a variant of the above-mentioned column after chamfering.

[0039] refer to Figure 6 As shown, the shapes of the grooves 31 include polygonal columns (such as cuboids, cubes, etc.), cylinders, and elliptical columns. In addition, since chamfering is often performed at the corners in actual processing, the shapes of the grooves 31 should also include variants of the above-mentioned columns that have been chamfered.

[0040] refer to Figure 1 , Figure 2 , Figure 4 , Figure 5 and Figure 6As shown, round holes are arranged on the shielding top cover 1, the PCB support plate 2 and the base 3. In specific implementation, these round holes will cooperate with corresponding screws to play a fixing role.

[0041] In a specific implementation, the specific dimensions of the first cavity 11, the second cavity 12, the receiving hole 21, and the groove 31 need to be optimized and determined by electromagnetic simulation software.

[0042] In specific implementation, the material of the shielding top cover 1 can be Permalloy, which is used to shield the interference of electromagnetic waves and static magnetic fields on the quantum chip. The manufacturing process of the shielding top cover 1 can be sheet metal process.

[0043] In a specific implementation, the PCB support plate 2 is composed of a combination of metal and dielectric materials. The metal material can be copper, and the dielectric can be Rogers high-frequency plate, such as RO4003, RO4350, RO4450F, etc.

[0044] In a specific implementation, the base 3 may be made of copper or aluminum.

[0045] The above is only a preferred embodiment of the present invention, and is not any formal or substantial limitation of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and supplements without departing from the present invention, and these improvements and supplements should also be regarded as the protection scope of the present invention. Any technician familiar with this profession, without departing from the spirit and scope of the present invention, can make some changes, modifications and equivalent changes made by using the technical content disclosed above, which are equivalent embodiments of the present invention; at the same time, any changes, modifications and evolutions of any equivalent changes made to the above embodiments based on the essential technology of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A quantum chip packaging box, characterized in that: The quantum chip packaging box comprises a shielding top cover (1) having a cavity, a PCB support plate (2) connected to the bottom of the shielding top cover (1), and a base (3) fixed to the bottom of the PCB support plate (2), which together form a packaging box body; The internal cavity of the shielding top cover (1) comprises two cavities which are interconnected and have different cross-sectional areas, namely a first cavity (11) and a second cavity (12); The first cavity (11) having a larger cross-sectional area is located below the second cavity (12) having a smaller cross-sectional area; The center of the PCB support plate (2) is provided with a receiving hole (21) for receiving the quantum chip; A groove (31) is provided at the center of the base (3) and corresponds to the position of the accommodating hole (21) and has a smaller cross-sectional area than the accommodating hole (21); the quantum chip is located directly above the groove (31) when in an installed state.

2. The quantum chip packaging box according to claim 1, characterized in that: The first cavity (11) is in the shape of a polygonal column.

3. The quantum chip packaging box according to claim 1, characterized in that: The first cavity (11) is in the shape of a cylinder.

4. The quantum chip packaging box according to claim 1, characterized in that: The first cavity (11) is in the shape of an elliptical cylinder.

5. The quantum chip packaging box according to claim 1, characterized in that: The second cavity (12) is in the shape of a polygonal column.

6. The quantum chip packaging box according to claim 1, characterized in that: The second cavity (12) is in the shape of a cylinder.

7. The quantum chip packaging box according to claim 1, characterized in that: The second cavity (12) is in the shape of an elliptical cylinder.

8. The quantum chip packaging box according to claim 1, characterized in that: The shape of the accommodating hole (21) is a polygonal column, a circular cylinder or an elliptical column.

9. The quantum chip packaging box according to claim 1, characterized in that: The shape of the groove (31) is a polygonal column, a circular cylinder or an elliptical column.

10. The quantum chip packaging box according to any one of claims 2 to 9, characterized in that: The edges of the column are chamfered.

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