Functional module and electronic equipment

Abstract

The invention discloses a functional module and electronic equipment, the functional module comprises a first circuit board, a second circuit board, an audio component and a first optical component, the first circuit board and the second circuit board are arranged at an interval and are electrically connected, and at least part of acoustic space is formed between the first circuit board and the second circuit board; the audio component and the first optical component are electrically connected to the first circuit board, the first circuit board is located between the audio component and the first optical component, and the first optical component is located in the acoustic space. According to the functional module and the electronic equipment, the space utilization rate is high, optimized arrangement and composite integration of a plurality of components are achieved, and the cost is low.

Description

Functional modules and electronic devices Technical Field

[0001] The present disclosure relates to the field of device arrangement technology, and in particular, to a functional module and an electronic device using the functional module. Background Art

[0002] With the continuous improvement of living standards, consumers have an increasing demand for electronic devices such as mobile phones, tablets, and laptops. However, in related technologies, the components of electronic devices are arranged irrationally, resulting in low space utilization, which is not conducive to the miniaturization design of electronic devices.

[0003] Summary of the Invention

[0004] The present disclosure aims to solve one of the technical problems in the related art at least to a certain extent.

[0005] To this end, the embodiments of the present disclosure propose a functional module that has high space utilization, achieves optimized arrangement and composite integration of multiple components, and has low cost.

[0006] The embodiment of the present disclosure also provides an electronic device using the above functional module.

[0007] The functional modules of the embodiment of the present disclosure include:

[0008] a first circuit board and a second circuit board, wherein the first circuit board and the second circuit board are spaced apart and electrically connected, and at least a portion of an acoustic space is formed between the first circuit board and the second circuit board;

[0009] An audio component and a first optical component, the audio component is electrically connected to the first circuit board, the first optical component is electrically connected to the first circuit board or the second circuit board, the first circuit board is located between the audio component and the first optical component, and the first optical component is located in the acoustic space.

[0010] The functional modules of the disclosed embodiments have high space utilization, achieve optimized arrangement and composite integration of multiple components, and have low cost.

[0011] In some embodiments, the functional module includes a second optical component, and the second optical component is electrically connected to a side of the second circuit board facing away from the acoustic space.

[0012] In some embodiments, the functional module includes a light guide having a sound outlet hole connected to the acoustic space. The light guide is opposite to the first optical component and can allow light waves received and transmitted by the first optical component to pass through the light guide.

[0013] In some embodiments, the functional module includes a frame, the frame is provided with a first hole, the second circuit board is provided in the frame, and at least a portion of the light guide member is fitted in the first hole.

[0014] In some embodiments, the light guide includes a first section and a second section, the radial dimension of the second section is larger than that of the first section, the first section fits in the first hole, and at least a portion of the second section overlaps the second circuit board.

[0015] In some embodiments, an annular groove is provided on the outer circumference of the first section, and a sealing ring is embedded in the annular groove.

[0016] In some embodiments, the second section is provided with an inclined surface, which is provided on a side of the second section facing away from the second circuit board, and the inclined surface is suitable for abutting against the frame to seal the second section and the second circuit board.

[0017] In some embodiments, the functional module includes a casing, the casing is provided with a second hole, the casing is sleeved on the outside of the second optical component, and the casing is fitted into the second hole.

[0018] In some embodiments, the frame is provided with an assembly groove, the second hole is communicated with the assembly groove, and the second circuit board is fitted in the assembly groove.

[0019] In some embodiments, the functional module includes a seal, at least a portion of which is sealed between the first circuit board and the second circuit board, and the seal is in sealing contact with the light guide, and the acoustic space is formed within the seal.

[0020] In some embodiments, the functional module includes at least one elastic member, at least one of the elastic members is located on the outer peripheral side of the seal, at least one of the elastic members is connected between the first circuit board and the second circuit board, and the first circuit board and the second circuit board are electrically connected through at least one of the elastic members.

[0021] In some embodiments, the sealing member is provided with a step portion, one side of the step portion is in sealing contact with the light guide member, and the other side of the step portion is in contact with the first circuit board.

[0022] In some embodiments, the seal includes a groove portion and a shielding portion, the groove portion includes a first side wall, a second side wall and a third side wall, the first side wall and the second side wall are arranged at intervals, the third side wall is connected between the first side wall and the second side wall, the shielding portion is connected to the first side wall and the second side wall, and the shielding portion is arranged at intervals from the third side wall, the first side wall and the second side wall are located on one side of the shielding portion, the step portion is provided on the other side of the shielding portion, and the first circuit board overlaps the shielding portion and abuts against the step portion.

[0023] In some embodiments, the first side wall includes a first wall segment and a second wall segment, the first wall segment is connected between the second wall segment and the third side wall, the second side wall includes a third wall segment and a fourth wall segment, the third wall segment is connected between the fourth wall segment and the third side wall, the distance between the first wall segment and the third wall segment is greater than the distance between the second wall segment and the fourth wall segment, and the shielding portion is connected between the second wall segment and the fourth wall segment.

[0024] In some embodiments, a groove is provided in the step portion, and the space in the groove forms part of the acoustic space.

[0025] In some embodiments, the functional module includes a cover assembly, which is disposed on the frame. The second optical assembly is located between the cover assembly and the second circuit board. The second optical assembly can receive and receive light waves through the frame and / or the cover assembly.

[0026] In some embodiments, the first optical component is an infrared component, and / or the second optical component is an ambient light component.

[0027] The electronic device of the embodiment of the present disclosure includes a functional module, and the functional module is the functional module described in any of the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] FIG1 is an exploded schematic diagram of a functional module according to an embodiment of the present disclosure.

[0029] FIG2 is a schematic cross-sectional view of the functional module in the front-to-back direction according to an embodiment of the present disclosure.

[0030] FIG3 is a schematic diagram of the light guide member in FIG2 .

[0031] FIG4 is a first schematic cross-sectional view of the functional module in the left-right direction according to an embodiment of the present disclosure.

[0032] FIG5 is a second schematic cross-sectional view of the functional module in the left-right direction according to an embodiment of the present disclosure.

[0033] FIG6 is a first schematic diagram of the sealing member in FIG2 .

[0034] FIG7 is a second schematic diagram of the sealing member in FIG2 .

[0035] Reference numerals:

[0036] a first circuit board 1;

[0037] A second circuit board 2;

[0038] Audio component 3;

[0039] A first optical component 4;

[0040] Second optical component 5;

[0041] Frame 6; second hole 61; first hole 62; assembly groove 63;

[0042] Housing 7;

[0043] Sealing member 8; step portion 81; groove 811; groove portion 82; first side wall 821; first wall section 8211; second wall section 8212; second side wall 822; third wall section 8221; fourth wall section 8222; third side wall 823; shielding portion 83;

[0044] Elastic member 9;

[0045] Cover plate assembly 10;

[0046] Light guide 11; sound outlet 111; first section 112; second section 113; annular groove 114; inclined surface 115;

[0047] Acoustic Space 12. DETAILED DESCRIPTION

[0048] The embodiments of the present disclosure are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present disclosure, but should not be understood as limiting the present disclosure.

[0049] The present disclosure is based on the inventors' findings and understanding of the following facts and problems:

[0050] In related technologies, in order to realize the transmission and reception of optical signals, mobile phones and other electronic devices are equipped with ambient light components, infrared light components and other components. Among them, the ambient light components need to receive external light signals through light guide columns, and the infrared light components also need to receive infrared light signals through light guide columns. The planar design of the ambient light components and the infrared light components has high requirements for layout space, which reduces the space utilization of electronic equipment.

[0051] The functional modules of the embodiments of the present disclosure are described below.

[0052] As shown in Figures 1 to 7, the functional module of the embodiment of the present disclosure includes a first circuit board 1, a second circuit board 2, an audio component 3 and a first optical component 4.

[0053] The first circuit board 1 and the second circuit board 2 are spaced apart and electrically connected, with at least a portion of an acoustic space 12 formed between the first circuit board 1 and the second circuit board 2. As shown in Figures 1 and 2, the first circuit board 1 and the second circuit board 2 are both generally flat. The first circuit board 1 and the second circuit board 2 can be arranged in parallel and spaced apart in a vertical direction, with the first circuit board 1 being located above the second circuit board 2.

[0054] A portion of the interval between the first circuit board 1 and the second circuit board 2 may form an acoustic space 12 . The acoustic space 12 may be a relatively sealed space, and the acoustic space 12 is used to transmit sound waves.

[0055] The audio component 3 and the first optical component 4 are electrically connected to the first circuit board 1. The first circuit board 1 is located between the audio component 3 and the first optical component 4. The first optical component 4 is located in the acoustic space 12. The audio component 3 can transmit sound waves into the acoustic space 12.

[0056] As shown in Figure 2, the audio component 3 may be a microphone (MIC) or a speaker, etc., and may be fixed to the TOP surface (top surface) of the first circuit board 1 through an SMT soldering process. The first optical component 4 may be an infrared light sensor module, which can transmit and receive infrared light, and may be fixed to the BOT surface (bottom surface) of the first circuit board 1 through an SMT soldering process.

[0057] It should be noted that the sound waves generated by the audio component 3 can be transmitted into the acoustic space 12 and then transmitted to the outside of the functional module through the acoustic space 12. The first optical component 4 can be arranged in the acoustic space 12, thereby avoiding the need for a separate installation space for the first optical component 4 and improving space utilization.

[0058] It should be noted that, in some other embodiments, the first optical component may also be other optical components such as a light sensor, a lens component, etc.

[0059] The functional module of the disclosed embodiment realizes the overall stacking of the audio component 3, the first circuit board 1, the first optical component 4, and the second circuit board 2 in the upper and lower directions. By limiting the acoustic space 12 between the first circuit board 1 and the second circuit board 2, the acoustic space 12 can simultaneously meet the use requirements of the audio component 3 and the first optical component 4. The overall structure is simple, the cost is low, and the space utilization rate is improved.

[0060] In some embodiments, the second optical component 5 is electrically connected to the side of the second circuit board 2 facing away from the acoustic space 12. The second optical component 5 may include a light sensor, etc., and the second optical component 5 may monitor ambient light. As shown in Figure 2, the second optical component 5 may be fixed to the BOT surface (bottom surface) of the second circuit board 2 using an SMT soldering process. In other embodiments, the second optical component 5 may also be other optical components such as an infrared light sensor module, a lens assembly, etc.

[0061] This allows for the vertical stacking of the audio component 3, first circuit board 1, first optical component 4, second circuit board 2, and second optical component 5, further enhancing the stacking integration of functional modules. The second circuit board 2 can be configured separately for the second optical component 5, enabling the integration of multiple light sensors for infrared and ambient light, as well as the integration of the audio component 3 and light sensor, meeting multi-purpose usage requirements.

[0062] In some embodiments, an opening (not shown) is provided on the first circuit board 1, which is connected to the acoustic space 12, and the opening can be opposite to the audio component 3 in the up and down directions. The sound waves generated by the audio component 3 are suitable for being transmitted into the acoustic space 12 through the opening, thereby meeting the transmission requirements of the sound waves.

[0063] In some embodiments, the functional module includes a light guide 11, which is provided with a sound outlet 111, which is connected to the acoustic space 12, and the light guide 11 is opposite to the first optical component 4, and the light guide 11 allows the light waves received and transmitted by the first optical component 4 to pass through.

[0064] As shown in Figures 2 and 3, the light guide 11 can be made of a translucent material. The light guide 11 can be arranged on the front side of the acoustic space 12. The sound outlet 111 on the light guide 11 can extend along the front-to-back direction and be connected with the acoustic space 12. When in use, the acoustic space 12 can be a sound outlet space. For example, the sound waves generated by the audio component 3 can be transmitted into the acoustic space 12, and then can be transmitted to the outside world through the sound outlet 111 on the light guide 11.

[0065] In some other embodiments, the acoustic space 12 may also be a sound input space, that is, the sound waves of the external environment of the functional module may be transmitted to the collection end of the audio component 3 via the acoustic space 12 .

[0066] In the front-to-back direction, the light guide 11 is also opposite to the first optical component 4 . The first optical component 4 may be an infrared component. The infrared light generated by the first optical component 4 may pass through the light guide 11 , thereby realizing the infrared signal receiving and sending function.

[0067] On the one hand, the light guide 11 realizes the functional integration of infrared light transmission and sound wave transmission, and can meet the use requirements of multiple functions at the same time through one component, further simplifying the structure and reducing space occupancy. On the other hand, the light guide 11 can also play a certain sealing effect, which can enhance the sealing of the functional module.

[0068] In some embodiments, the functional module includes a frame 6 , the frame 6 defines a first hole 62 , the second circuit board 2 is disposed in the frame 6 , and at least a portion of the light guide 11 fits within the first hole 62 .

[0069] As shown in Figures 1 and 2, the frame 6 can be a middle frame of an electronic device, and the first hole 62 can be a through hole. The first hole 62 can be provided at the front end of the frame 6 and can penetrate the frame 6 in the front-to-back direction. A portion of the light guide 11 can fit into the first hole 62.

[0070] The middle frame is provided to connect and fix the whole unit, thus realizing the integration of functional modules. Secondly, the middle frame can limit the freedom of the light guide 11 and the second optical component 5, thus facilitating the installation and fixation of the light guide 11 and the second optical component 5.

[0071] In some embodiments, the light guide 11 includes a first section 112 and a second section 113 . The radial dimension of the second section 113 is larger than that of the first section 112 . The first section 112 fits in the first hole 62 , and at least a portion of the second section 113 overlaps the second circuit board 2 .

[0072] As shown in Figures 2 and 3, along the front-to-back direction, the light guide 11 can be divided into a first section 112 and a second section 113 according to different radial dimensions, wherein the first section 112 is a cylindrical structure, for example, the first section 112 can be generally elliptical or cylindrical, etc. The shape of the first section 112 can be adapted to the hole shape of the first hole 62, and the second section 113 can be prismatic. When installing the light guide 11, the first section 112 of the light guide 11 can be inserted into the first hole 62, and the second section 113 can be partially fitted with the frame 6 around the first hole 62 to stop it. The bottom side of the second section 113 can overlap the second circuit board 2, thereby playing a limiting role, and also ensuring the assembly accuracy of the light guide 11 and the sealing effect.

[0073] In some embodiments, an annular groove 114 is provided on the outer circumference of the first section 112. A sealing ring is adapted to be embedded within the annular groove 114 to enhance sealing. As shown in Figures 2 and 3, the annular groove 114 can extend along the circumference of the first section 112 to form a closed circle. When the light guide 11 is assembled, the sealing ring can be embedded within the annular groove 114. The sealing ring can seal the gap between the first section 112 and the wall of the first hole 62, preventing external light and impurities from easily passing through the gap, and also providing liquid protection.

[0074] In some embodiments, the second section 113 is provided with an inclined surface 115, which is provided on a side of the second section 113 facing away from the second circuit board 2. The inclined surface 115 is adapted to abut against the frame 6 to seal the second section 113 against the second circuit board 2. As shown in FIG2 and FIG3 , the second section 113 may be generally prismatic in shape, and the inclined surface 115 may be provided on the top side of the second section 113. When the light guide 11 is assembled, the inclined surface 115 may be in contact with the frame 6. This, on the one hand, enhances the position limiting effect and ensures the stability of the assembly of the light guide 11. On the other hand, under the action of the inclined surface 115, the light guide 11 may be subjected to a downward force component, thereby allowing the light guide 11 to be in contact with the second circuit board 2, thereby ensuring the sealing between the light guide 11 and the second circuit board 2.

[0075] In some embodiments, the functional module includes a sleeve 7, a frame 6 having a second hole 61, the sleeve 7 is sleeved on the outside of the second optical component 5, and the sleeve 7 is interference-fitted in the second hole 61. The second hole 61 can be a through hole, and the second hole 61 can pass through the frame 6 in the vertical direction, and a portion of the second optical component 5 can be fitted in the second hole 61.

[0076] As shown in Figures 1 and 2, the shape of the sleeve 7 can be adapted to the shape of the second optical component 5. The material of the sleeve 7 can be silicone. When in use, the sleeve 7 can be put on the outer peripheral side of the second optical component 5, and then the overall structure of the sleeve 7 and the second optical component 5 can be interference fit in the second hole 61.

[0077] The provision of the sleeve 7 enhances the sealing effect, ensuring a relatively large gap between the second optical assembly 5 and the wall of the second hole 61. It also serves to block light from the screen, ensuring accurate ambient light collection. Furthermore, the relatively soft material of the sleeve 7 provides a certain degree of protection, preventing the second optical assembly 5 from rigidly contacting the frame 6 during assembly.

[0078] In some embodiments, the frame 6 is provided with a mounting groove 63, the second hole 61 being in communication with the mounting groove 63, and the second circuit board 2 being fitted into the mounting groove 63. As shown in FIG2 , the mounting groove 63 can be provided on the upper side of the frame 6, and the second hole 61 can be located below and in communication with the mounting groove 63. During installation, the second circuit board 2 can be inserted into the mounting groove 63, and the second optical assembly 5 can be inserted into the second hole 61.

[0079] Therefore, on the one hand, the problem of the second circuit board 2 being directly stacked on the frame 6, which may easily cause the overall size of the frame 6 and the second circuit board 2 to be higher, can be avoided, and the airdrop utilization rate can be further improved. On the other hand, it can play a positioning effect on the second circuit board 2, ensuring the compactness of the assembly.

[0080] In some embodiments, the functional module includes a seal 8 , at least part of which is sealed between the first circuit board 1 and the second circuit board 2 , and the seal 8 is sealed against the light guide 11 , and an acoustic space 12 is formed within the seal 8 .

[0081] As shown in Figures 1 and 2, the seal 8 can be made of silicone and can be generally U-shaped. When in use, the seal 8 can be sandwiched between the first circuit board 1 and the second circuit board 2, wherein the upper surface of the seal 8 can be in contact with the first circuit board 1 and the lower surface of the seal 8 can be in contact with the second circuit board 2. The opening of the seal 8 can face the front side, and the acoustic space 12 is enclosed in the area enclosed by the seal 8, the first circuit board 1, and the second circuit board 2. The acoustic space 12 is connected to the sound outlet 111 of the light guide 11 through the opening on the front side of the seal 8.

[0082] The setting of the seal 8 can limit a relatively closed acoustic space 12 between the first circuit board 1 and the second circuit board 2, thereby limiting the transmitted sound waves to a limited space and avoiding the spread of sound waves. It can also seal and isolate the first optical component 4 to prevent the first optical component 4 from being easily disturbed by light.

[0083] In some embodiments, the functional module includes at least one elastic member 9, at least one elastic member 9 is located on the outer peripheral side of the seal 8, at least one elastic member 9 is connected between the first circuit board 1 and the second circuit board 2, and the first circuit board 1 and the second circuit board 2 are electrically connected through at least one elastic member 9.

[0084] As shown in Figures 1, 2, 4 and 5, the elastic member 9 can be a spring sheet, and four elastic members 9 can be provided. The four elastic members 9 are all provided on the outer peripheral side of the seal 8, and the four elastic members 9 are arranged at intervals along the circumference of the seal 8. Each elastic member 9 is connected between the first circuit board 1 and the second circuit board 2.

[0085] On the one hand, the elastic member 9 has good elastic properties, thereby realizing elastic buffering and energy absorption between the first circuit board 1 and the second circuit board 2. On the other hand, the first circuit board 1 and the second circuit board 2 can be electrically connected through the elastic member 9, avoiding the need to set up an additional electrical connection structure, further simplifying the structure, and reducing space occupancy.

[0086] In addition, the elastic members 9, the first optical component 4, and the sealing member 8 are generally located in the same horizontal space, thereby realizing multi-purpose functions within a limited space, avoiding the situation where each component repeatedly occupies stacking space, and further improving space utilization.

[0087] In some embodiments, the seal 8 is provided with a step portion 81, one side of which is in sealing contact with the light guide 11, and the other side of which is in contact with the first circuit board 1. As shown in Figures 2 and 6, the step portion 81 can be integrally provided with the seal 8, and the step portion 81 can be provided at the top position of the front side of the seal 8. When the seal 8 is installed, the front surface of the step portion 81 can be in sealing contact with the rear surface of the light guide 11, the first circuit board 1 can be fixed to the upper side of the seal 8, and the front side surface of the first circuit board 1 can be in contact with the rear side surface of the step portion 81, thereby enhancing the compactness of the assembly of the seal 8 and the first circuit board 1.

[0088] As shown in FIG6 , the step portion 81 can also seal the front top of the seal 8 , thereby preventing the seal 8 between the light guide 11 and the first circuit board 1 from being connected to the outside world, further ensuring the sealing of the acoustic space 12 .

[0089] In some embodiments, as shown in Figure 6, the seal 8 includes a groove portion 82 and a shielding portion 83. The groove portion 82 can be generally U-shaped, and a portion of the groove portion 82 can be clamped between the first circuit board 1 and the second circuit board 2. The acoustic space 12 can be formed within the space enclosed by the groove portion 82.

[0090] The groove portion 82 may include a first side wall 821, a second side wall 822, and a third side wall 823. The first side wall 821 and the second side wall 822 may be arranged parallel to each other in the left-right direction, and the third side wall 823 may be connected between the rear ends of the first side wall 821 and the rear ends of the second side wall 822. The shielding portion 83 is connected to the first side wall 821 and the second side wall 822, and is spaced apart from the third side wall 823. The shielding portion 83 may be located in front of the third side wall 823, and an opening may be formed between the shielding portion 83 and the third side wall 823, through which sound waves generated by the audio component can be transmitted into the acoustic space 12.

[0091] The first side wall 821 and the second side wall 822 are located below the shielding portion 83, and the step portion is provided above the shielding portion 83. The first circuit board 1 overlaps the shielding portion 83 and abuts the step portion. As shown in Figure 2, after assembly is complete, the front side of the first circuit board 1 can overlap the shielding portion 83, and the front side surface of the first circuit board 1 can press against the step portion, enhancing the compactness and stability of the assembly of the first circuit board 1.

[0092] In some embodiments, as shown in FIG7 , the first sidewall 821 includes a first wall segment 8211 and a second wall segment 8212, wherein the first wall segment 8211 is connected between the second wall segment 8212 and the third sidewall 823. The second sidewall 822 includes a third wall segment 8221 and a fourth wall segment 8222, wherein the third wall segment 8221 is connected between the fourth wall segment 8222 and the third sidewall 823. The distance between the first wall segment 8211 and the third wall segment 8221 is greater than the distance between the second wall segment 8212 and the fourth wall segment 8222. The shielding portion 83 is connected between the second wall segment 8212 and the fourth wall segment 8222. Thus, the size of the acoustic space 12 corresponding to the audio component can be made larger, thereby meeting the need for collecting and converging sound waves.

[0093] In some embodiments, as shown in FIG6 , a groove 811 is provided within the stepped portion, and the space within the groove 811 forms part of the acoustic space 12. This allows the front exit of the acoustic space 12 to be larger, satisfying the spatial dimension requirements for the simultaneous entry and exit of sound waves and infrared rays. The rear side of the sealant 8 is lower, further increasing space utilization and preventing the first circuit board 1, sealant 8, and second circuit board 2 from being stacked higher, thereby reducing the overall height in the vertical direction.

[0094] In some embodiments, the functional module includes a cover assembly 10, which is disposed on the frame 6. The second optical assembly 5 is located between the cover assembly 10 and the second circuit board 2. The second optical assembly 5 can transmit and receive light waves through the frame 6 and / or the cover assembly 10. As shown in Figures 1 and 2, the cover assembly 10 can be a screen cover of an electronic device. The cover assembly 10 can be fixed to the bottom side of the frame 6, the second optical assembly 5 can be opposite the screen cover, and the sleeve 7 can abut the screen cover.

[0095] It should be noted that the cover assembly 10 may be provided with a light-transmitting hole or a light-transmitting area, and the second optical assembly 5 can transmit and receive light waves through the light-transmitting hole or the light-transmitting area. In some other embodiments, the frame 6 may also be provided with a light-transmitting hole or a light-transmitting area to transmit and receive light waves.

[0096] The electronic device according to the embodiment of the present disclosure is described below.

[0097] The electronic device of the disclosed embodiment includes a functional module, which may be the functional module described in the above embodiment. The electronic device may be a mobile phone, tablet, notebook, or other electronic device, or may be any other electronic device that requires a functional module. The functional module of the electronic device of the disclosed embodiment has high space utilization, achieves optimized layout and composite integration of multiple components, and is low-cost.

[0098] In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present disclosure.

[0099] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. Throughout the present disclosure, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0100] In this disclosure, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections, electrical connections, or communication between them; direct connections or indirect connections through an intermediate medium; and internal communication between two elements or interaction between two elements, unless otherwise expressly limited. Those skilled in the art will understand the specific meanings of the above terms in this disclosure based on specific circumstances.

[0101] In the present disclosure, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0102] In the present disclosure, the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" and the like mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are mutually inconsistent. Although the above embodiments have been shown and described, it will be understood that the above embodiments are exemplary and cannot be understood as limitations on the present disclosure, and that changes, modifications, substitutions and variations of the above embodiments by those of ordinary skill in the art are within the scope of protection of the present disclosure.

Claims

1. A functional module, characterized in that: include: a first circuit board and a second circuit board, wherein the first circuit board and the second circuit board are spaced apart and electrically connected, and at least a portion of an acoustic space is formed between the first circuit board and the second circuit board; An audio component and a first optical component, the audio component is electrically connected to the first circuit board, the first optical component is electrically connected to the first circuit board or the second circuit board, the first circuit board is located between the audio component and the first optical component, and the first optical component is located in the acoustic space.

2. The functional module according to claim 1, characterized in that: A second optical component is included, wherein the second optical component is electrically connected to a side of the second circuit board facing away from the acoustic space.

3. The functional module according to claim 2, characterized in that: The light guide comprises a light guide having a sound outlet hole connected to the acoustic space, the light guide is opposite to the first optical component, and the light guide allows light waves received and sent by the first optical component to pass through.

4. The functional module according to claim 3, characterized in that: The light guide device comprises a frame body, wherein the frame body is provided with a first hole, the second circuit board is arranged in the frame body, and at least a part of the light guide member is fitted in the first hole.

5. The functional module according to claim 4, characterized in that: The light guide comprises a first section and a second section, the radial dimension of the second section is larger than that of the first section, the first section fits in the first hole, and at least a portion of the second section overlaps the second circuit board.

6. The functional module according to claim 5, characterized in that: An annular groove is provided on the outer circumference of the first section, and a sealing ring is embedded in the annular groove.

7. The functional module according to claim 5 or 6, characterized in that: The second section is provided with an inclined surface, which is provided on a side of the second section away from the second circuit board. The inclined surface is suitable for abutting against the frame to ensure a sealing fit between the second section and the second circuit board.

8. The functional module according to any one of claims 4 to 7, characterized in that: The optical system comprises a sleeve body, the frame body is provided with a second hole, the sleeve body is sleeved on the outside of the second optical component, and the sleeve body is matched in the second hole.

9. The functional module according to claim 8, characterized in that: The frame body is provided with an assembly groove, the second hole is communicated with the assembly groove, and the second circuit board is fitted in the assembly groove.

10. The functional module according to any one of claims 3 to 9, characterized in that: A sealing member is included, at least a portion of which is sealingly fitted between the first circuit board and the second circuit board, and the sealing member is in sealing contact with the light guide, and the acoustic space is formed in the sealing member.

11. The functional module according to claim 10, characterized in that: It includes at least one elastic member, at least one of the elastic members is located on the outer peripheral side of the sealing member, at least one of the elastic members is connected between the first circuit board and the second circuit board, and the first circuit board and the second circuit board are electrically connected through the at least one elastic member.

12. The functional module according to claim 10 or 11, characterized in that: The sealing member is provided with a step portion, one side of the step portion is in sealing contact with the light guide member, and the other side of the step portion is in contact with the first circuit board.

13. The functional module according to claim 12, characterized in that: The sealing member includes a groove portion and a shielding portion, the groove portion includes a first side wall, a second side wall and a third side wall, the first side wall and the second side wall are spaced apart, the third side wall is connected between the first side wall and the second side wall, the shielding portion is connected to the first side wall and the second side wall, and the shielding portion is spaced apart from the third side wall, the first side wall and the second side wall are located on one side of the shielding portion, the step portion is provided on the other side of the shielding portion, and the first circuit board is overlapped on the shielding portion and abuts against the step portion.

14. The functional module according to claim 13, characterized in that: The first side wall includes a first wall segment and a second wall segment, the first wall segment is connected between the second wall segment and the third side wall, the second side wall includes a third wall segment and a fourth wall segment, the third wall segment is connected between the fourth wall segment and the third side wall, the distance between the first wall segment and the third wall segment is greater than the distance between the second wall segment and the fourth wall segment, and the shielding portion is connected between the second wall segment and the fourth wall segment.

15. The functional module according to any one of claims 12 to 14, characterized in that: A groove is provided in the step portion, and the space in the groove forms part of the acoustic space.

16. The functional module according to any one of claims 4 to 15, characterized in that: It includes a cover assembly, which is arranged on the frame. The second optical assembly is located between the cover assembly and the second circuit board. The second optical assembly can receive and receive light waves through the frame and / or the cover assembly.

17. The functional module according to any one of claims 2 to 16, characterized in that: The first optical component is an infrared component, and / or the second optical component is an ambient light component.

18. An electronic device, characterized in that: It comprises a functional module, wherein the functional module is the functional module according to any one of claims 1-17.

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