Deposition mask for OLED pixel deposition

Abstract

A deposition mask according to an embodiment includes a metal plate including a deposition region and a non-deposition region, in which the deposition region includes at least one effective portion. The active portion includes a plurality of unit through holes, and each of the unit through holes includes: a small region hole formed in a first surface of the metal plate; a large region hole formed in the second surface of the metal plate; and a connecting portion connecting the small region hole and the large region hole. The cell via has a first width defined as a width in the first direction and a second width defined as a width in the second direction, the first width and the second width being different from each other. Further, ribs are provided between the unit through-holes adjacent to each other in the first direction, and island portions are provided between the unit through-holes adjacent to each other in the second direction. Further, in the unit through holes, a height of the large-region holes in the second direction is greater than a height of the large-region holes in the first direction, and a height of the small-region holes in the unit through holes in the second direction is smaller than a height of the small-region holes in the unit through holes in the first direction.

Description

Technical Field

[0001] Embodiments relate to deposition masks for OLED pixel deposition. Background Art

[0002] Display devices are applied to various devices. For example, display devices are applied to small devices such as smart phones or tablet PCs. Alternatively, display devices are applied to large-size devices such as TVs, monitors, or public display screens. Recently, the demand for ultra-high definition (UHD) with 500 pixels per inch (PPI) or higher has been increasing. Therefore, display devices with high resolution are being applied to both small and large devices.

[0003] Display devices are classified into liquid crystal display (LCD) and organic light emitting diode (OLED) according to driving modes.

[0004] LCD is a display device driven by using liquid crystals, while OLED is a display device driven by using organic materials.

[0005] OLED can show infinite contrast, has a response speed 1000 times faster than LCD, and has an excellent viewing angle. Therefore, OLED has attracted much attention as a display device that can replace LCD.

[0006] The OLED includes a light-emitting layer. The light-emitting layer includes an organic material. The organic material is deposited on a substrate using a deposition mask. The deposition mask may include an open mask (OM) or a fine metal mask (FMM). A deposition pattern corresponding to the pattern formed on the deposition mask is formed on the substrate. Therefore, the deposition pattern can be used as a pixel.

[0007] An open mask is a thin plate that forms a deposition pattern only at specific locations when manufacturing OLEDs. An open mask is used in the deposition process of forming a light-emitting layer on the backplane after it is completed in the display manufacturing process. That is, an open mask is a mask that does not cover the portion within the working range of the display so that the entire surface of the display is deposited. Therefore, an open mask is used when depositing a light-emitting layer with a light-emitting material of one color.

[0008] On the other hand, the fine metal mask is used to change the color of the sub-pixel of the light-emitting layer. Therefore, the fine metal mask includes ultra-fine holes. The process using the fine metal mask requires a multi-step deposition process. Therefore, the process requires accurate alignment. Therefore, the process using the fine metal mask is more difficult than the process using the open mask.

[0009] When an open mask is used to deposit the light-emitting layer of an OLED, only a single-color light-emitting layer can be formed. Therefore, a separate color filter is required to achieve various colors. On the other hand, when a fine metal mask is used, an RGB light-emitting layer can be formed. Therefore, a separate color filter is not required. In other words, the technology using a fine metal mask has a high degree of difficulty. However, compared with the method using an open mask, since a filter for blocking light is not required, the light efficiency is better.

[0010] The fine metal mask is usually made of an Invar alloy metal plate including iron (Fe) and nickel (Ni). Through holes are formed through one surface and the other surface of the metal plate. The through holes are formed at positions corresponding to the pixel pattern. Therefore, red, green and blue organic materials can pass through the through holes of the metal plate and be deposited on a deposition substrate. Therefore, a pixel pattern can be formed on a deposition substrate.

[0011] At the same time, the fine metal mask includes small surface holes formed on one surface of the metal plate and large surface holes formed on the other surface of the metal plate. The small surface holes and the large surface holes are connected by a connecting portion. Therefore, a through hole is formed.

[0012] The organic material is ejected in the direction of the fine metal mask and deposited on the deposition substrate using the large surface holes as inlets and the small surface holes as outlets.

[0013] The through holes may form different angles with the inner surface of the large surface hole depending on the direction. Therefore, when the height of the small surface hole is the same in all directions, the deposition efficiency of the organic material may be reduced.

[0014] In addition, when the heights of the small surface holes are different in various directions, the strength of the fine metal mask is different in various directions. Therefore, the fine metal mask may bend in one direction.

[0015] Therefore, a deposition mask having a new structure capable of solving the above-mentioned problems is required. Summary of the invention

[0016] Technical issues

[0017] Embodiments provide a deposition mask for OLED pixel deposition with improved deposition efficiency and rigidity.

[0018] Technical Solution

[0019] A deposition mask comprises: a metal plate, the metal plate comprises a deposition area and a non-deposition area, wherein the deposition area comprises at least one effective portion; wherein the effective portion comprises a plurality of unit through holes, wherein the unit through holes comprise: a small surface hole formed on a first surface of the metal plate; a large surface hole formed on a second surface of the metal plate; and a connecting portion connecting the small surface hole and the large surface hole, wherein the unit through hole comprises a first width defined as a width in a first direction and a second width defined as a width in a second direction, wherein the first width is different from the second width, wherein a rib is arranged between unit through holes adjacent in the first direction, wherein an island portion is arranged between unit through holes adjacent in the second direction, wherein a height of the small surface hole of the unit through hole in the second direction is less than a height of the small surface hole of the unit through hole in the first direction.

[0020] Beneficial Effects

[0021] The deposition mask according to the first embodiment includes a unit through hole. The unit through hole has different widths in a first direction and a second direction.

[0022] Therefore, the large surface holes of the unit through hole may have different heights and tilt angles in the first direction and the second direction. Therefore, the deposition efficiency of the deposition mask may be reduced. In addition, since the strength of the deposition mask varies according to the direction, the deposition mask may be bent in one direction.

[0023] Therefore, in the deposition mask according to the first embodiment, the height of the small surface hole is different depending on the direction. Specifically, in the direction where the height of the large surface hole is small, the height of the small surface hole is large. In addition, in the direction where the height of the large surface hole is large, the height of the small surface hole is small. Therefore, the strength of the deposition mask is prevented from varying depending on the direction.

[0024] In addition, in the direction where the inclination angle of the large surface hole is small, the height of the small surface hole is large. In addition, in the direction where the inclination angle of the large surface hole is large, the height of the small surface hole is small. Therefore, the deposition uniformity of the deposition mask is improved.

[0025] Therefore, the deposition mask according to the first embodiment has improved deposition efficiency and reliability.

[0026] The deposition mask according to the second embodiment includes unit through holes. The unit through holes have different widths in a first direction and a second direction. In addition, ribs having different widths in the first direction and the second direction are provided between adjacent unit through holes.

[0027] Therefore, deposition uniformity of the deposition mask may be reduced. In addition, the strength of the deposition mask may vary depending on the direction.

[0028] Therefore, the heights of the small surface holes and the large surface holes are different depending on the direction. Specifically, in the direction in which the width of the rib is small, the height of the large surface holes is small. In addition, in the direction in which the width of the rib is small, the height of the small surface holes is large. In addition, in the direction in which the width of the rib is large, the height of the large surface holes is large. In addition, in the direction in which the width of the rib is large, the height of the small surface holes is small.

[0029] Therefore, the strength of the deposition mask can be prevented from varying depending on the direction. In addition, a sufficient amount of organic material can be accommodated in the large surface holes where the width of the rib is large.

[0030] Therefore, the deposition mask according to the second embodiment has improved deposition efficiency and reliability.

[0031] The deposition mask according to the third embodiment includes a unit through hole. The unit through hole has different widths in the third direction and the fourth direction. In addition, island portions having different widths and / or areas in the third direction and the fourth direction are provided between adjacent unit through holes.

[0032] Therefore, deposition uniformity of the deposition mask may be reduced. In addition, the strength of the deposition mask may differ depending on the direction.

[0033] Therefore, the heights of the small surface holes and the large surface holes are different depending on the direction. Specifically, in the direction where the width and / or area of ​​the island portion is small, the height of the large surface holes is small. In addition, in the direction where the width and / or area of ​​the island portion is small, the height of the small surface holes is large. In addition, in the direction where the width and / or area of ​​the island portion is large, the height of the large surface holes is large. In addition, in the direction where the width and / or area of ​​the island portion is large, the height of the small surface holes is small.

[0034] Therefore, the strength of the deposition mask can be prevented from varying depending on the direction. In addition, a sufficient amount of organic material can be accommodated in the large surface holes having a large width and / or area of ​​the island portion.

[0035] Therefore, the deposition mask according to the third embodiment has improved deposition efficiency and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 is a view illustrating a combination of a deposition mask and a frame according to an embodiment.

[0037] Figure 2 is a cross-sectional view of an organic material deposition apparatus including a deposition mask according to an embodiment.

[0038] Figure 3 is a view illustrating forming a deposition pattern on a deposition substrate through a through hole of a deposition mask according to an embodiment.

[0039] Figure 4 is a plan view of a deposition mask according to an embodiment.

[0040] Figure 5 is a plan view of an effective portion of a deposition mask according to the first embodiment.

[0041] Figure 6 is along Figure 5 A cross-sectional view taken at area AA'.

[0042] Figure 7 is along Figure 5 A cross-sectional view taken at area BB'.

[0043] Figure 8 Is used for comparison Figure 6 and Figure 7 of the view.

[0044] Fig. 9 is a plan view of an effective portion of a deposition mask according to a second embodiment.

[0045] Fig.10 is along Fig. 9 A cross-sectional view taken at area CC'.

[0046] Fig.11 is along Fig. 9 A cross-sectional view taken at area D-D'.

[0047] Fig.12 Is used for comparison Fig.10 and Fig.11 of the view.

[0048] Fig.13 is a plan view of an effective portion of a deposition mask according to a third embodiment.

[0049] Fig.14 is along Fig.13 A cross-sectional view taken at area EE'.

[0050] Fig.15 is along Fig.13 A cross-sectional view taken at the region F-F';

[0051] Fig.16 Is used for comparison Fig.14 and Fig.15 of the view.

[0052] Fig.17 is a plan view of an effective portion of a deposition mask according to a fourth embodiment.

[0053] Fig.18 is along Fig.17 A cross-sectional view taken at region G-G'.

[0054] Fig.19 is along Fig.17 A cross-sectional view taken at region H-H'.

[0055] Fig. 20 is along Fig.17 A cross-sectional view taken at region II'. DETAILED DESCRIPTION

[0056] Hereinafter, the embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. However, the spirit and scope of the present disclosure are not limited to the parts of the described embodiments, and can be implemented in various other forms, and in the spirit and scope of the present disclosure, one or more of the elements of the embodiments can be selectively combined and replaced. In addition, unless explicitly defined and described otherwise, the terms (including technical terms and scientific terms) used in the embodiments of the present disclosure can be interpreted as the same meanings commonly understood by ordinary technicians in the field to which the present disclosure belongs, and the terms such as those defined in the commonly used dictionaries can be interpreted as having the meanings consistent with their meanings in the context of the relevant technology.

[0057] In addition, the terms used in the embodiments of the present disclosure are used to describe the embodiments and are not intended to limit the present disclosure. In this specification, unless otherwise specified in a phrase, a singular form may also include a plural form, and when described as "at least one (or more) of A (and), B, and C", the singular form may include at least one of all combinations that can be combined with A, B, and C.

[0058] In addition, when describing the elements of the embodiments of the present disclosure, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish an element from other elements, and the terms are not limited to the nature, order, or sequence of the elements.

[0059] In addition, when an element is described as being “connected”, “coupled” or “coupled” to another element, it may include not only the case where the element is directly “connected”, “coupled” or “coupled” to other elements, but also the case where the element is “connected”, “coupled” or “coupled” to the other elements through another element.

[0060] In addition, when described as being formed or arranged “on (above)” or “under (below)” each element, “on (above)” or “under (below)” may include not only the case where two elements are directly connected to each other, but also the case where one or more other elements are formed or arranged between the two elements.

[0061] In addition, when expressed as "upper (above)" or "lower (below)", not only an upper direction but also a lower direction can be included based on one element.

[0062] Hereinafter, a deposition mask according to an embodiment will be described with reference to the accompanying drawings.

[0063] The deposition mask described below is a fine metal mask capable of forming an RGB pixel pattern on a deposition substrate by depositing red, green and blue organic materials on the deposition substrate. In addition, the following description does not apply to an open mask.

[0064] Figures 1 to 3 1 is a view for explaining a process of depositing an organic material on a deposition substrate 300 using a deposition mask 100 according to an embodiment.

[0065] Figure 1 is a view illustrating a combination of a deposition mask and a frame according to an embodiment. Figure 2 is a cross-sectional view of an organic material deposition apparatus including a deposition mask according to an embodiment. Figure 3 is a view illustrating forming a deposition pattern on a deposition substrate through a through hole of a deposition mask according to an embodiment.

[0066] Reference Figure 1 and Figure 2 , the organic material deposition apparatus includes a deposition mask 100 , a mask frame 200 , a deposition substrate 300 , an organic material deposition container 400 , and a vacuum chamber 500 .

[0067] The deposition mask 100 includes a metal. For example, the deposition mask includes iron (Fe) and nickel (Ni). Specifically, the deposition mask includes an Invar alloy including iron (Fe) and nickel (Ni).

[0068] The deposition mask 100 includes a plurality of through holes TH. The through holes are disposed in an effective portion. The through holes are disposed to correspond to a pixel pattern to be formed on a deposition substrate. The deposition mask 100 includes a non-effective portion other than an effective portion, the effective portion including a deposition region.

[0069] The mask frame 200 includes an opening 205. A plurality of through holes are provided on a region corresponding to the opening 205. Thus, the organic material supplied to the organic material deposition container 400 is deposited on the deposition substrate 300. The deposition mask 100 is provided and fixed on the mask frame 200. For example, the deposition mask 100 is tightened with a set tension. In addition, the deposition mask 100 is welded and fixed on the mask frame 200.

[0070] For example, the ineffective portion of the deposition mask 100 is welded. Thus, the deposition mask 100 is fixed on the mask frame 200. Then, the portion protruding from the mask frame 200 is cut and removed.

[0071] The mask frame 200 includes metal having high rigidity. Therefore, deformation of the mask frame during the welding process is reduced.

[0072] The deposition substrate 300 is a substrate used when manufacturing a display device. For example, an OLED pixel pattern is formed on the deposition substrate 300. Red, green, and blue organic patterns are formed on the deposition substrate 300 to form pixels of three primary colors of light. That is, an RGB pattern is formed on the deposition substrate 300.

[0073] The organic material deposition container 400 is a crucible. The organic material is disposed in the crucible. The organic material deposition container 400 moves in the vacuum chamber 500. That is, the organic material deposition container 400 moves in one direction in the vacuum chamber 500. For example, the organic material deposition container 400 moves in the vacuum chamber 500 along the width direction of the deposition mask 100.

[0074] A heat source and / or an electric current is supplied to the organic material deposition container 400. As a result, the organic material is deposited on the deposition substrate 300.

[0075] Reference Figure 3 , the deposition mask 100 includes a metal plate 10. The metal plate includes a first surface 1S and a second surface 2S. The first surface 1S and the second surface 2S are opposite to each other.

[0076] The first surface 1S includes small surface holes V1. The second surface 2S includes large surface holes V2. For example, a plurality of small surface holes V1 and a plurality of large surface holes V2 are formed on the first surface 1S and the second surface 2S, respectively.

[0077] In addition, the deposition mask 100 includes a through hole TH. The through hole TH is formed by a connection portion CA connecting a boundary between the small surface hole V1 and the large surface hole V2.

[0078] The width of the large surface hole V2 is greater than the width of the small surface hole V1. The width of the small surface hole V1 is measured on the first surface 1S of the deposition mask 100. The width of the large surface hole V2 is measured on the second surface 2S of the deposition mask 100.

[0079] In addition, the width of the connection portion CA has a set size. Specifically, the width of the connection portion CA may be 15 μm to 33 μm. More specifically, the width of the connection portion CA may be 19 μm to 33 μm. More specifically, the width of the connection portion CA may be 20 μm to 27 μm. When the width of the connection portion CA exceeds 33 μm, it is difficult to achieve a resolution of 500 PPI or higher. In addition, when the width of the connection portion CA is less than 15 μm, defects may occur during the deposition process.

[0080] The small surface hole V1 faces the deposition substrate 300. The small surface hole V1 is disposed close to the deposition substrate 300. Therefore, the small surface hole V1 has a shape corresponding to the deposition pattern DP.

[0081] The large surface hole V2 faces the organic material deposition container 400. Therefore, the organic material supplied from the organic material deposition container 400 can be accommodated with a wider width through the large surface hole V2. In addition, a fine pattern can be quickly formed on the deposition substrate 300 through the small surface hole V1.

[0082] Therefore, the organic material contained by the large surface hole V2 is deposited on the deposition substrate 300 through the small surface hole V1. Accordingly, any one of the red, green and blue pixel patterns is formed on the deposition substrate 300. Then, the above process is repeated. Therefore, the red, green and blue pixel patterns are all formed on the deposition substrate 300.

[0083] Figure 4 is a plan view of a deposition mask 100 according to an embodiment.

[0084] Reference Figure 4 , the deposition mask 100 includes a deposition area DA and a non-deposition area NDA.

[0085] The deposition area DA is an area for forming a deposition pattern. The deposition area DA includes a pattern area and a non-pattern area. The pattern area is an area including small surface holes V1, large surface holes V2, through holes TH, and islands IS. The non-pattern area is an area not including small surface holes V1, large surface holes V2, through holes TH, and islands IS.

[0086] In addition, the deposition area DA includes a plurality of effective portions AA1, AA2, and AA3. The effective portions may form a plurality of deposition patterns. Specifically, the pattern area includes a plurality of effective portions AA1, AA2, and AA3.

[0087] The deposition area DA includes a plurality of separation areas IA1 and IA2. The separation areas IA1 and IA2 are disposed between adjacent effective parts. The separation areas IA1 and IA2 are spacing areas between the plurality of effective parts. Adjacent effective parts can be distinguished from each other by the separation areas IA1 and IA2. In addition, one deposition mask 100 can support a plurality of effective parts.

[0088] The non-deposition area NDA is an area that does not participate in deposition. The non-deposition area NDA includes frame fixing areas FA1 and FA2. The frame fixing areas FA1 and FA2 are areas for fixing the deposition mask 100 to the mask frame 200. In addition, the non-deposition area NDA may include half-etched portions HF1 and HF2 and an open portion.

[0089] The half-etched portions HF1 and HF2 may disperse stress generated when the deposition mask 100 is subjected to tension.

[0090] In addition, the open portion may disperse stress generated when the deposition mask 100 is subjected to tension. Therefore, deformation of the deposition mask may be reduced.

[0091] As described above, the deposition mask 100 includes a through hole. The through hole is a passage through which an organic material moves.

[0092] The through hole is formed by a small surface hole, a large surface hole and a connecting portion. When the shape of the large surface hole is an asymmetric shape with multiple widths, the inclination angle of the inner surface of the large surface hole in each area may be different. That is, the inner surface of the large surface hole in the long width direction and the inner surface of the large surface hole in the short width direction have different inclination angles. Therefore, when the height of the small surface hole is the same, the deposition rate in the short width direction is different from that in the long width direction. Therefore, the deposition efficiency of the deposition mask may be reduced.

[0093] In addition, when the shape of the large surface hole is an asymmetric shape having multiple widths, the height of the large surface hole in the long width direction may be different from the height of the large surface hole in the short width direction. Therefore, the strength of the deposition mask in the long width direction and the short width direction may be different. Therefore, the deposition mask may be bent in one direction.

[0094] In addition, when the shape of the large surface hole is an asymmetric shape with multiple widths, the remaining area of ​​the metal plate in the long width direction may be different from the remaining area of ​​the metal plate in the short width direction. Therefore, the strength of the deposition mask in the long width direction and the short width direction may be different. Therefore, the deposition mask may be bent in one direction.

[0095] A deposition mask capable of solving the above-mentioned problems will be described below.

[0096] Will refer to Figures 5 to 8 A deposition mask according to a first embodiment is described.

[0097] Reference Figures 5 to 8 , the deposition mask 100 includes a plurality of through holes. Specifically, the deposition mask 100 includes a plurality of unit through holes UTH. The unit through holes UTH are formed of a small surface hole V1, a large surface hole V2, and a connection portion CA.

[0098] The unit through hole UTH includes a first width W1 along the first direction 1D and a second width W2 along the second direction 2D. The first direction 1D and the second direction 2D may be a longitudinal direction or a width direction of the deposition mask 100. For example, the first direction 1D may be a longitudinal direction of the deposition mask 100. Likewise, the second direction 2D may be a width direction of the deposition mask 100. In addition, the size of the width is defined as the size of the width of the large surface hole V2.

[0099] The first width W1 and the second width W2 are different. For example, the first width W1 is greater than the second width W2. Therefore, the unit through hole UTH has a long width in the first direction and a short width in the second direction.

[0100] A rib RB and an island IS are provided between the plurality of unit through holes UTH. The rib RB is a partially etched region of the metal plate 10. In addition, the island IS is a non-etched region of the metal plate 10. In addition, the thickness of the island IS is equal to the thickness of the non-deposition area NDA of the metal plate 10.

[0101] The rib RB is disposed between the unit through holes UTH adjacent to each other in the first direction 1D. In addition, the island portion IS is disposed between the unit through holes UTH adjacent to each other in the second direction 2D.

[0102] Therefore, the unit through hole UTH has a height H1-1 of the first large surface hole and a height H1-2 of the second large surface hole. The height H1-1 of the first large surface hole is the height in the first direction 1D. The height H1-2 of the second large surface hole is the height in the second direction 2D. The height H1-1 of the first large surface hole is different from the height H1-2 of the second large surface hole. The height H1-1 of the first large surface hole is the height from the connecting portion CA to the rib RB. The height H1-2 of the second large surface hole is the height from the connecting portion CA to the island portion IS.

[0103] The rib RB is a partially etched region of the metal plate 10. Therefore, the height H1-2 of the second large surface hole is greater than the height H1-1 of the first large surface hole.

[0104] The large surface hole V2 has an inner surface. Figure 6 and Figure 7 It is shown that the inner surface of the large surface hole V2 is a curved surface. However, the embodiment is not limited thereto. For example, the inner surface of the large surface hole V2 may be formed as a flat surface.

[0105] The large surface hole V2 includes a plurality of inner surfaces defined according to directions. Figure 6 , the large surface hole V2 includes a first inner surface ES1 facing the first direction. Figure 7 , the large-surface hole V2 includes a second inner surface ES2 facing the second direction.

[0106] The first inner surface ES1 and the second inner surface ES2 each have an inclination angle. An imaginary line extending between one end of the connection portion CA and one end of the large surface hole V2 may be defined. The inclination angle is defined as an acute angle between the imaginary line and an extension line of the connection portion CA.

[0107] The first inner surface ES1 has a first inclination angle θ1. Similarly, the second inner surface ES2 has a second inclination angle θ2. The first inclination angle θ1 is different from the second inclination angle θ2. For example, the second inclination angle θ2 may be greater than the first inclination angle θ1. That is, since the height H1-2 of the second large surface hole is greater than the height H1-1 of the first large surface hole, the second inclination angle θ2 may be greater than the first inclination angle θ1.

[0108] The height H1-2 of the second large surface hole is greater than the height H1-1 of the first large surface hole. Likewise, the second inclination angle θ2 is greater than the first inclination angle θ1.

[0109] Therefore, the angle at which the organic material enters the large surface hole in the first direction may be different from the angle at which the organic material enters the large surface in the second direction. In addition, the amount of organic material entering the large surface in the first direction may be different from the amount of organic material entering the large surface in the second direction. Therefore, when the height of the small surface hole in the first direction and the height of the small surface hole in the second direction are the same, the thickness of the organic layer deposited on the deposition substrate in each direction may be different. Therefore, the deposition efficiency of the deposition mask may be reduced.

[0110] In addition, since the heights of the large surface holes in the first direction and the second direction are different, the remaining areas of the metal plate in the first direction and the second direction are also different. Therefore, the strength of the deposition mask in the first direction and the second direction is different. Therefore, since the strength of the deposition mask varies depending on the direction, the deposition mask may be bent in one direction.

[0111] In the deposition mask according to the first embodiment, in order to solve the above-mentioned problem, the small-surface holes are formed at different heights in the first direction and the second direction.

[0112] Reference Figures 6 to 8, the unit through hole UTH has a height H2-1 of a first small surface hole and a height H2-2 of a second small surface hole. The height H2-1 of the first small surface hole is the height in the first direction 1D. The height H2-2 of the second small surface hole is the height in the second direction 2D. The height H2-1 of the first small surface hole is different from the height H2-2 of the second small surface hole. The height H2-1 of the first small surface hole and the height H2-2 of the second small surface hole are respectively defined as the height from the connecting portion CA to the first surface 1S of the metal plate.

[0113] Specifically, the height H2-2 of the second small surface hole is smaller than the height H2-1 of the first small surface hole.

[0114] Specifically, the height H2-1 of the first small surface hole and the height H2-2 of the second small surface hole may be 1 μm to 5 μm. More specifically, the height H2-1 of the first small surface hole and the height H2-2 of the second small surface hole may be 1 μm to 4 μm. More specifically, the height H2-1 of the first small surface hole and the height H2-2 of the second small surface hole may be 1 μm to 3 μm.

[0115] Therefore, the distance between one surface of the deposition mask 100 and the deposition substrate is reduced. Therefore, deposition defects caused by the shadow effect can be reduced. For example, when an RGB pattern is formed using the deposition mask 100, other deposition materials can be prevented from being deposited in a region between two adjacent patterns.

[0116] Within the above range, the height H2-2 of the second small-surface hole is smaller than the height H2-1 of the first small-surface hole.

[0117] Therefore, the height H1-1 of the first large surface hole is smaller than the height H1-2 of the second large surface hole, and the height H2-1 of the first small surface hole is larger than the height H2-2 of the second small surface hole.

[0118] Therefore, the strength of the deposition mask can be uniform in the first direction and the second direction. Therefore, the deposition mask can be prevented from bending in one direction. That is, the area of ​​the metal plate remaining above and below the metal plate in the first direction and the second direction becomes similar. Therefore, the strength of the metal plate can be uniform regardless of the direction.

[0119] Furthermore, although the first inclination angle is smaller than the second inclination angle, the height of the first small surface hole is greater than the height of the second small surface hole.

[0120] Therefore, it is possible to prevent the deposition of the deposition mask in the first direction and the second direction from being different. Therefore, it is possible to improve the deposition efficiency of the deposition mask.

[0121] The deposition mask according to the first embodiment includes a unit through hole. The unit through hole has different widths in a first direction and a second direction.

[0122] Therefore, the large surface holes of the unit through hole may have different heights and tilt angles in the first direction and the second direction. Therefore, the deposition efficiency of the deposition mask may be reduced. In addition, since the strength of the deposition mask varies depending on the direction, the deposition mask may be bent in one direction.

[0123] Therefore, in the deposition mask according to the first embodiment, the height of the small surface hole is different depending on the direction. Specifically, in the direction where the height of the large surface hole is small, the height of the small surface hole is large. In addition, in the direction where the height of the large surface hole is large, the height of the small surface hole is small. Therefore, the strength of the deposition mask is prevented from varying depending on the direction.

[0124] In addition, in the direction where the inclination angle of the large surface hole is small, the height of the small surface hole is large. In addition, in the direction where the inclination angle of the large surface hole is large, the height of the small surface hole is small. Therefore, the deposition uniformity of the deposition mask is improved.

[0125] Therefore, the deposition mask according to the first embodiment has improved deposition efficiency and reliability.

[0126] Meanwhile, in the foregoing description, the ribs are disposed between the unit through holes adjacent in the long width direction of the unit through holes, and the islands are disposed between the unit through holes adjacent in the short width direction of the unit through holes. However, the embodiment is not limited thereto.

[0127] That is, the island portion may be provided between the unit through holes adjacent to each other in the long width direction of the unit through holes. In addition, the rib may be provided between the unit through holes adjacent to each other in the short width direction of the unit through holes.

[0128] In this case, the height H2-1 of the first small surface hole is smaller than the height H2-2 of the second small surface hole. In addition, by making the first inclination angle θ1 larger than the second inclination angle θ2, the same effect as described above can be obtained.

[0129] The following will refer to Figures 9 to 12 Describing a deposition mask according to a second embodiment. When describing the deposition mask according to the second embodiment, the same or similar description as that of the deposition mask according to the above-described first embodiment will be omitted. In addition, the same reference numerals are assigned to the same components as those of the deposition mask according to the above-described first embodiment.

[0130] Reference Figures 9 to 12 , the deposition mask 100 includes a plurality of through holes. Specifically, the deposition mask 100 includes a plurality of unit through holes UTH. The unit through holes UTH are formed of a small surface hole V1, a large surface hole V2, and a connection portion CA.

[0131] The unit through hole UTH includes a first width W1 along the first direction 1D and a second width W2 along the second direction 2D. The first direction 1D and the second direction 2D may be a longitudinal direction or a width direction of the deposition mask 100. For example, the first direction 1D may be a longitudinal direction of the deposition mask 100. Likewise, the second direction 2D may be a width direction of the deposition mask 100. In addition, the size of the width is defined as the size of the width of the large surface hole V2.

[0132] The first width W1 is different from the second width W2. For example, the first width W1 is greater than the second width W2. Therefore, the unit through hole UTH has a long width in the first direction and a short width in the second direction.

[0133] A rib RB and an island IS are provided between the plurality of unit through holes UTH. The rib RB is a region where the metal plate 10 is partially etched. In addition, the island IS is a region where the metal plate 10 is not etched.

[0134] The first rib RB1 is disposed between the unit through holes UTH adjacent to each other in the first direction 1D. In addition, the second rib RB2 is disposed between the unit through holes UTH adjacent to each other in the second direction 2D. In addition, the island IS is disposed between the unit through holes UTH adjacent to each other in the third direction 3D, which is a direction between the first direction 1D and the second direction 2D.

[0135] The first rib RB1 and the second rib RB2 connect adjacent island portions IS.

[0136] The first rib RB1 and the second rib RB2 extend in different directions. Specifically, the first rib RB1 extends in the second direction 2D. Meanwhile, the second rib RB2 extends in the first direction 1D.

[0137] The width W3 of the large surface hole V2 between the first ribs RB1 is different from the width W4 of the large surface hole V2 between the second ribs RB2. Specifically, the width W3 of the large surface hole V2 between the first ribs RB1 is greater than the width W4 of the large surface hole V2 between the second ribs RB2.

[0138] Therefore, the amount of organic matter entering the large surface pores in the first direction is different from the amount of organic matter entering the large surface pores in the second direction. Therefore, when the heights of the small surface pores in the first direction and the second direction are the same, the thickness of the organic layer deposited on the deposition substrate may be different in each direction. Therefore, the deposition efficiency of the deposition mask may be reduced.

[0139] In addition, since the width of the large surface hole in the second direction between the first ribs is different from the width of the large surface hole in the first direction between the second ribs, the remaining area of ​​the metal plate in the first direction and the second direction is different. Therefore, the strength of the deposition mask in the first direction and the second direction is different. Therefore, since the strength of the deposition mask varies according to the direction, the deposition mask may be bent in one direction.

[0140] In the deposition mask according to the second embodiment, in order to solve the above-mentioned problem, the height of the large-surface holes and the height of the small-surface holes are different in the first direction and the second direction.

[0141] Reference Figures 10 to 12 , the unit through hole UTH has a first large surface hole height H1-1 and a second large surface hole height H1-2. The first large surface hole height H1-1 is the height in the first direction. The second large surface hole height H1-2 is the height in the second direction. The first large surface hole height H1-1 is the height from the connection portion CA to the first rib RB1. In addition, the second large surface hole height H1-2 is the height from the connection portion CA to the second rib RB2.

[0142] The height H1-1 of the first large surface hole is different from the height H1-2 of the second large surface hole. Specifically, the height H1-2 of the second large surface hole is greater than the height H1-1 of the first large surface hole.

[0143] Therefore, the unit through hole can accommodate a sufficient amount of organic material in the large surface hole in the second direction. That is, the width W4 of the large surface hole between the second ribs RB2 is greater than the width W3 of the large surface hole between the first ribs RB1. Therefore, the area for accommodating the organic material in the large surface hole in the second direction 2D is reduced by the width of the large surface hole between the second ribs RB2. Therefore, the height H1-2 of the second large surface hole is greater than the height H1-1 of the first large surface hole. Therefore, the large surface hole can ensure an area for accommodating the organic material in the second direction 2D.

[0144] In addition, refer to Figures 10 to 12 , the unit through hole UTH has a height H2-1 of a first small surface hole and a height H2-2 of a second small surface hole. The height H2-1 of the first small surface hole is a height in the first direction 1D. The height H2-2 of the second small surface hole is a height in the second direction 2D. The height H2-1 of the first small surface hole and the height H2-2 of the second small surface hole are different. The height H2-1 of the first small surface hole and the height H2-2 of the second small surface hole are respectively the heights from the connection portion CA to the first surface 1S of the metal plate.

[0145] Specifically, the height H2-2 of the second small surface hole is smaller than the height H2-1 of the first small surface hole.

[0146] Specifically, the height H2-1 of the first small surface hole and the height H2-2 of the second small surface hole may be 1 μm to 5 μm. More specifically, the height H2-1 of the first small surface hole and the height H2-2 of the second small surface hole may be 1 μm to 4 μm. More specifically, the height H2-1 of the first small surface hole and the height H2-2 of the second small surface hole may be 1 μm to 3 μm.

[0147] Within the above range, the height H2-2 of the second small-surface hole is smaller than the height H2-1 of the first small-surface hole.

[0148] Therefore, the width W3 of the large surface hole between the first ribs RB1 in the first direction 1D is greater than the width W4 of the large surface hole between the second ribs RB2 in the second direction 2D. In addition, the height H2-1 of the first small surface hole is greater than the height H2-2 of the second small surface hole.

[0149] Therefore, the strength of the deposition mask in the first direction and the second direction can be uniform. Therefore, the deposition mask can be prevented from bending in one direction. That is, the remaining area of ​​the metal plate above and below the metal plate in the first direction and the second direction becomes similar. Therefore, the strength of the metal plate can be uniform regardless of the direction.

[0150] The deposition mask according to the second embodiment includes a unit through hole. The unit through hole has different widths in a first direction and a second direction. In addition, a rib having different widths in the first direction and the second direction is disposed between adjacent unit through holes.

[0151] Therefore, deposition uniformity of the deposition mask may be reduced. In addition, the strength of the deposition mask may vary depending on the direction.

[0152] Therefore, the heights of the small surface holes and the large surface holes are different depending on the direction. Specifically, in the direction in which the width of the rib is small, the height of the large surface holes is small. In addition, in the direction in which the width of the rib is small, the height of the small surface holes is large. In addition, in the direction in which the width of the rib is large, the height of the large surface holes is large. In addition, in the direction in which the width of the rib is large, the height of the small surface holes is small.

[0153] Therefore, the strength of the deposition mask can be prevented from varying depending on the direction. In addition, a sufficient amount of organic material can be accommodated in the large surface holes having a large width of the ribs.

[0154] Therefore, the deposition mask according to the second embodiment has improved deposition efficiency and reliability.

[0155] In the following, reference will be made to Figures 13 to 16Describing a deposition mask according to a third embodiment. In the description of the deposition mask according to the third embodiment, the same or similar description as that of the deposition mask according to the above embodiment will be omitted. In addition, the same reference numerals are assigned to the same components as those of the deposition mask according to the above embodiment.

[0156] Reference Figures 13 to 16 , the deposition mask 100 includes a plurality of through holes. Specifically, the deposition mask 100 includes a plurality of unit through holes UTH. The unit through holes UTH are formed of a small surface hole V1, a large surface hole V2, and a connection portion CA.

[0157] The unit through hole UTH has a first width W1 in the third direction 3D and a second width W2 in the fourth direction 4D. The third direction 3D is a diagonal direction of the deposition mask 100. The fourth direction 4D is another diagonal direction of the deposition mask 100. In addition, the size of the width is defined as the size of the width of the large surface hole V2.

[0158] The first width W1 and the second width W2 are different. For example, the first width W1 is greater than the second width W2. Therefore, the unit through hole UTH has a long width in the first direction and a short width in the second direction.

[0159] The rib RB and the islands IS1 and IS2 are provided between the plurality of unit through holes UTH. The rib RB is a region where the metal plate 10 is partially etched. In addition, the islands IS1 and IS2 are regions where the metal plate 10 is not etched.

[0160] The first island portion IS1 is disposed between the unit through holes UTH adjacent in the third direction 3D. The second island portion IS2 is disposed between the unit through holes UTH adjacent in the fourth direction 4D. The rib RB is disposed between the unit through holes UTH adjacent in the first direction 1D and the second direction 2D.

[0161] The rib RB connects the adjacent island portions IS1 and IS2.

[0162] The width W5 of the first island portion IS1 is different from the width W6 of the second island portion IS2. Specifically, the width W5 of the first island portion IS1 is greater than the width W6 of the second island portion IS2. Alternatively, the area of ​​the first island portion IS1 and the area of ​​the second island portion IS2 are different from each other. Specifically, the area of ​​the first island portion IS1 is greater than the area of ​​the second island portion IS2.

[0163] Therefore, the amount of organic matter entering the large surface pores along the third direction is different from the amount of organic matter entering the large surface pores along the fourth direction. Therefore, when the heights of the small surface pores in the third direction and the fourth direction are the same, the thickness of the organic layer deposited on the deposition substrate may be different in each direction. Therefore, the deposition efficiency of the deposition mask may be reduced.

[0164] In addition, since the first island portion and the second island portion have different widths and / or areas, the remaining areas of the metal plate in the third direction and the fourth direction are also different. Therefore, the strength of the deposition mask in the third direction and the fourth direction is different. Therefore, since the strength of the deposition mask varies according to the direction, the deposition mask may be bent in one direction.

[0165] In the deposition mask according to the third embodiment, in order to solve the above-mentioned problem, the height of the large-surface holes and the height of the small-surface holes are different in the first direction and the second direction.

[0166] Reference Figures 14 to 16 , the unit through hole UTH has a first large surface hole height H1-1 and a second large surface hole height H1-2. The first large surface hole height H1-1 is the height in the third direction. The second large surface hole height H1-2 is the height in the fourth direction. The first large surface hole height H1-1 is the height from the connection portion CA to the first island portion IS1. In addition, the second large surface hole height H1-2 is the height from the connection portion CA to the second island portion IS2.

[0167] The height H1-1 of the first large surface hole is different from the height H1-2 of the second large surface hole. Specifically, the height H1-1 of the first large surface hole is greater than the height H1-2 of the second large surface hole.

[0168] Therefore, the unit through hole can accommodate a sufficient amount of organic material in the large surface hole in the third direction 3D. That is, the width W5 and / or area of ​​the first island portion IS1 is greater than the width W6 and / or area of ​​the second island portion IS2. Therefore, the area for accommodating the organic material in the large surface hole in the third direction 3D is reduced due to the width W5 and / or area of ​​the first island portion IS1. Therefore, the height H1-1 of the first large surface hole is greater than the height H1-2 of the second large surface hole. Therefore, the large surface hole can ensure an area for accommodating the organic material in the third direction 3D.

[0169] In addition, refer to Figures 14 to 16 , the unit through hole UTH has a height H2-1 of the first small surface hole and a height H2-2 of the second small surface hole. The height H2-1 of the first small surface hole is the height in the third direction 3D. The height H2-2 of the second small surface hole is the height in the fourth direction 4D. The height H2-1 of the first small surface hole and the height H2-2 of the second small surface hole are different. The height H2-1 of the first small surface hole and the height H2-2 of the second small surface hole are respectively the heights from the connection portion CA to the first surface 1S of the metal plate.

[0170] Specifically, the height H2-1 of the first small surface hole is smaller than the height H2-2 of the second small surface hole.

[0171] Specifically, the height H2-1 of the first small surface hole and the height H2-2 of the second small surface hole may be 1 μm to 5 μm. More specifically, the height H2-1 of the first small surface hole and the height H2-2 of the second small surface hole may be 1 μm to 4 μm. More specifically, the height H2-1 of the first small surface hole and the height H2-2 of the second small surface hole may be 1 μm to 3 μm.

[0172] Within the above range, the height H2-1 of the first small-surface hole is smaller than the height H2-2 of the second small-surface hole.

[0173] Therefore, the width W6 of the second island portion IS2 in the fourth direction 4D is smaller than the width W5 of the first island portion IS1 in the third direction 3D. In addition, the height H2-2 of the second small surface is greater than the height H2-1 of the first small surface.

[0174] Therefore, the strength of the deposition mask in the third direction 3D and the fourth direction 4D can be uniform. Therefore, the deposition mask 100 can be prevented from bending in one direction. That is, the remaining areas of the metal plate above and below the metal plate in the third direction and the fourth direction become similar. Therefore, the strength of the metal plate can be uniform regardless of the direction.

[0175] The deposition mask according to the third embodiment includes a unit through hole. The unit through hole has different widths in the third direction and the fourth direction. In addition, island portions having different widths and / or areas in the third direction and the fourth direction are provided between adjacent unit through holes.

[0176] Therefore, deposition uniformity of the deposition mask may be reduced. In addition, the strength of the deposition mask may vary depending on the direction.

[0177] Therefore, the heights of the small surface holes and the large surface holes are different depending on the direction. Specifically, in the direction where the width and / or area of ​​the island portion is small, the height of the large surface holes is small. In addition, in the direction where the width and / or area of ​​the island portion is small, the height of the small surface holes is large. In addition, in the direction where the width and / or area of ​​the island portion is large, the height of the large surface holes is large. In addition, in the direction where the width and / or area of ​​the island portion is large, the height of the small surface holes is small.

[0178] Therefore, the strength of the deposition mask can be prevented from varying depending on the direction. In addition, a sufficient amount of organic material can be accommodated in the large surface hole having a large width and / or area of ​​the island portion.

[0179] Therefore, the deposition mask according to the third embodiment has improved deposition efficiency and reliability.

[0180] Meanwhile, in the foregoing description, it is described that the width and / or area of ​​the first island portion between the adjacent unit through holes along the long width direction of the unit through hole is greater than the width and / or area of ​​the second island portion between the adjacent unit through holes along the short width direction of the unit through hole. However, the embodiment is not limited thereto.

[0181] That is, the width and / or area of ​​the first island between adjacent unit through holes along the long width direction of the unit through holes is smaller than the width and / or area of ​​the second island between adjacent unit through holes along the short width direction of the unit through holes.

[0182] In this case, the height H1-2 of the second large surface hole is greater than the height H1-1 of the first large surface hole. In addition, by making the height H1-2 of the second large surface hole smaller than the height H1-1 of the first large surface hole, the same effect as above can be obtained.

[0183] In the following, reference will be made to Figures 17 to 20 Describing a deposition mask according to a fourth embodiment. In the description of the deposition mask according to the fourth embodiment, the same or similar description as that of the deposition mask according to the above-described embodiments will be omitted. In addition, the same reference numerals are assigned to the same components as those of the deposition mask according to the above-described embodiments.

[0184] Reference Figures 17 to 20 , the deposition mask 100 according to the fourth embodiment includes a plurality of through holes. Specifically, the deposition mask 100 includes a plurality of unit through holes UTH. The unit through holes UTH are formed of a small surface hole V1, a large surface hole V2, and a connection portion CA.

[0185] The unit through hole UTH includes a first width W1 along a first direction 1D and a second width W2 along a second direction 2D. The first direction 1D may be a longitudinal direction of the deposition mask 100. Likewise, the second direction 2D may be a width direction of the deposition mask 100. In addition, the size of the width is defined as the size of the width of the large surface hole V2.

[0186] The first width W1 and the second width W2 are different. For example, the first width W1 is greater than the second width W2. Therefore, the unit through hole UTH has a long width in the first direction and a short width in the second direction.

[0187] The rib RB and the island IS are provided between the plurality of unit through holes UTH. The rib RB is a region where the metal plate 10 is partially etched. In addition, the island IS is a region where the metal plate 10 is not etched.

[0188] The rib RB is disposed between the unit through holes UTH adjacent in the first direction 1D. The rib RB and the island IS are disposed between the unit through holes UTH adjacent in the second direction 2D. Specifically, both the rib RB and the island IS are disposed in one region of the region between the unit through holes UTH adjacent in the second direction 2D. In addition, only the rib RB is disposed in the other region of the region between the unit through holes UTH adjacent in the second direction 2D.

[0189] In addition, one rib RB is disposed between the unit through holes UTH adjacent in the first direction 1D. In addition, at least one rib RB is disposed in another region of the region between the unit through holes UTH adjacent in the second direction 2D. Specifically, a plurality of ribs RB are disposed in another region of the region between the unit through holes UTH adjacent in the second direction 2D.

[0190] Therefore, the remaining area of ​​the metal plate in the first direction and the second direction is different. That is, only one rib is provided between the unit through holes UTH adjacent in the first direction 1D. On the other hand, a plurality of islands and a plurality of ribs are provided between the unit through holes UTH adjacent in the second direction 2D.

[0191] Therefore, the remaining area of ​​the metal plate in the first direction and the second direction is different. Therefore, the strength of the deposition mask in the first direction and the second direction is different. Therefore, since the strength of the deposition mask varies according to the direction, the deposition mask may be bent in one direction.

[0192] In the deposition mask according to the fourth embodiment, in order to solve the above-mentioned problem, the heights of the small-surface holes in the first direction and the second direction are formed to be different.

[0193] Reference Figures 18 to 20 , the unit through hole UTH has a height H2-1 of the first small surface hole and a height H2-2 of the second small surface hole. The height H2-1 of the first small surface hole is the height in the first direction 1D. The height H2-2 of the second small surface hole is the height in the second direction 2D. The height H2-1 of the first small surface hole and the height H2-2 of the second small surface hole are different. The height H2-1 of the first small surface hole and the height H2-2 of the second small surface hole are respectively the heights from the connection portion CA to the first surface 1S of the metal plate.

[0194] Specifically, the height H2-2 of the second small surface hole is smaller than the height H2-1 of the first small surface hole.

[0195] Specifically, the height H2-1 of the first small surface hole and the height H2-2 of the second small surface hole may be 1 μm to 5 μm. More specifically, the height H2-1 of the first small surface hole and the height H2-2 of the second small surface hole may be 1 μm to 4 μm. More specifically, the height H2-1 of the first small surface hole and the height H2-2 of the second small surface hole may be 1 μm to 3 μm.

[0196] Within the above range, the height H2-2 of the second small surface is smaller than the height H2-1 of the first small surface.

[0197] Therefore, the strength of the deposition mask in the first direction and the second direction can be uniform. Therefore, the deposition mask can be prevented from bending in one direction. That is, the difference between the areas remaining above and below the metal plate in the first direction and the second direction is reduced. Therefore, the strength of the metal plate can be uniform regardless of the direction.

[0198] Meanwhile, in the foregoing description, it is described that one rib is disposed between unit through holes adjacent in the long width direction of the unit through holes, and a plurality of islands and a plurality of ribs are disposed between unit through holes adjacent in the short width direction of the unit through holes. However, the embodiment is not limited thereto.

[0199] That is, one rib may be provided between the unit through holes adjacent to each other in the short width direction of the unit through holes. In addition, a plurality of island portions and a plurality of ribs may be provided between the unit through holes adjacent to each other in the long width direction of the unit through holes.

[0200] In this case, by making the height H2-2 of the second small-surface hole greater than the height H2-1 of the first small-surface hole, the same effect as above can be obtained.

[0201] Furthermore, in the foregoing description, it is described that one rib is disposed between unit through holes adjacent in the long width direction of the unit through holes, and a plurality of islands and a plurality of ribs are disposed between unit through holes adjacent in the short width direction of the unit through holes. However, the embodiment is not limited thereto.

[0202] That is, one rib and one island portion may be provided between unit through holes adjacent to each other in the short width direction of the unit through holes. In addition, a plurality of island portions and a plurality of ribs may be provided between unit through holes adjacent to each other in the long width direction of the unit through holes.

[0203] In this case, by making the height H2-1 of the first small-surface hole greater than the height H2-2 of the second small-surface hole, the same effect as above can be obtained.

[0204] The characteristics, structures, effects, etc. described in the above embodiments are included in at least one embodiment of the present invention, but are not limited to only one embodiment. In addition, the characteristics, structures, and effects shown in each embodiment can be combined or modified by those skilled in the art for other embodiments. Therefore, it should be understood that such combinations and modifications are included within the scope of the present invention.

[0205] In addition, the above mainly describes the embodiment, but the embodiment is only an example and does not limit the present invention, and those skilled in the art can understand that without departing from the basic characteristics of the embodiment, several changes and applications not presented above can be made. For example, each component specifically shown in the embodiment can be changed. In addition, it should be understood that the differences related to such changes and such applications are included in the scope of the present invention defined in the appended claims.

Claims

1. A deposition mask, comprising: A metal plate comprising a deposition area and a non-deposition area, wherein the deposition area includes at least one effective portion; Wherein, the effective portion includes a plurality of unit through holes, The unit through hole comprises: a small surface hole formed on the first surface of the metal plate; a large surface hole formed on the second surface of the metal plate; and a connecting portion connecting the small surface hole and the large surface hole. The unit through hole includes a first width and a second width, the first width is defined as a width in a first direction, and the second width is defined as a width in a second direction. wherein the first width is different from the second width, Wherein, ribs are arranged between the unit through holes adjacent to each other along the first direction, Wherein, an island portion is provided between the unit through holes adjacent to each other along the second direction, The height of the small surface hole of the unit through hole in the second direction is smaller than the height of the small surface hole of the unit through hole in the first direction. 2 . The deposition mask according to claim 1 , wherein in the unit through hole, a first inclination angle of a first inner surface of the large-surface hole in the first direction is smaller than a second inclination angle of a second inner surface of the large-surface hole in the second direction.

3. The deposition mask according to claim 1 or 2, wherein: The first direction is defined as a longitudinal direction of the deposition mask, wherein the second direction is defined as the width direction of the deposition mask, Wherein, the first width is greater than the second width.

4. The deposition mask according to claim 1 or 2, in, The first direction is defined as a longitudinal direction of the deposition mask, wherein the second direction is defined as the width direction of the deposition mask, Wherein, the second width is greater than the first width.

5. A deposition mask comprising: A metal plate comprising a deposition area and a non-deposition area, wherein the deposition area includes at least one effective portion; Wherein, the effective portion includes a plurality of unit through holes, The unit through hole comprises: a small surface hole formed on the first surface of the metal plate; a large surface hole formed on the second surface of the metal plate; and a connecting portion connecting the small surface hole and the large surface hole. The unit through hole includes a first width and a second width, the first width is defined as a width in a first direction, and the second width is defined as a width in a second direction. wherein the first width is different from the second width, Wherein, a first rib is arranged between the unit through holes adjacent to each other along the first direction, Wherein, a second rib is arranged between the unit through holes adjacent to each other along the second direction, wherein the width of the large surface hole between the first ribs is greater than the width of the large surface hole between the second ribs, The height of the small surface hole of the unit through hole in the second direction is smaller than the height of the small surface hole of the unit through hole in the first direction.

6. The deposition mask according to claim 5, wherein: The first rib and the second rib extend in different directions.

7. A deposition mask comprising: A metal plate comprising a deposition area and a non-deposition area, wherein the deposition area includes at least one effective portion; Wherein, the effective portion includes a plurality of unit through holes, The unit through hole comprises: a small surface hole formed on the first surface of the metal plate; a large surface hole formed on the second surface of the metal plate; and a connecting portion connecting the small surface hole and the large surface hole. The unit through hole includes a first width and a second width, the first width is defined as a width in a third direction, and the second width is defined as a width in a fourth direction. wherein the first width is different from the second width, Wherein, a first island portion is provided between adjacent unit through holes along the third direction, Wherein, a second island portion is provided between the unit through holes adjacent to each other along the fourth direction, Wherein, the width of the first island portion is greater than the width of the second island portion, Wherein, a height of the small surface hole in the third direction is smaller than a height of the small surface hole in the fourth direction.

8. The deposition mask according to claim 7, wherein: An area of ​​the first island portion is greater than an area of ​​the second island portion.

9. A deposition mask comprising: A metal plate comprising a deposition area and a non-deposition area, wherein the deposition area includes at least one effective portion; Wherein, the effective portion includes a plurality of unit through holes, The unit through hole comprises: a small surface hole formed on the first surface of the metal plate; a large surface hole formed on the second surface of the metal plate; and a connecting portion connecting the small surface hole and the large surface hole. The unit through hole includes a first width and a second width, the first width is defined as a width in a first direction, and the second width is defined as a width in a second direction. wherein the first width is different from the second width, Wherein, ribs are arranged between the unit through holes adjacent to each other along the first direction, Wherein, ribs and islands are provided between the unit through holes adjacent to each other along the second direction, The height of the small surface hole of the unit through hole in the second direction is smaller than the height of the small surface hole of the unit through hole in the first direction.

10. The deposition mask according to claim 9, wherein: The rib and the island portion are provided in one region among regions between unit through holes adjacent to each other in the second direction, At least one rib is disposed in another region between the unit through holes adjacent to each other along the second direction.

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