Silicon wafer sorting method and sorting system

Abstract

The invention discloses a silicon wafer sorting method and sorting system. According to the silicon wafer sorting method, after the identification information of the to-be-sorted silicon wafers on the conveying device is obtained, the target incoming material frequency corresponding to the identification information can be determined according to the identification information and the number of the silicon wafers in the historical time period, and then the target areas corresponding to the to-be-sorted silicon wafers are obtained according to the target incoming material frequency; and finally, a target gear box is determined from the target area, the moving device is controlled to move the silicon wafers to be sorted into the target gear box, the gear boxes are subjected to area division according to the incoming material frequency of the silicon wafers, the silicon wafers corresponding to the same incoming material frequency can be placed in the gear boxes in the same area, the wafer collecting efficiency can be greatly improved, and the yield of the silicon wafers is improved. Meanwhile, the gear boxes can be dynamically distributed, manual intervention is reduced, and cost is reduced.

Description

Technical Field

[0001] The embodiments of the present application relate to production management technology, and relate to but are not limited to a silicon wafer sorting method and a sorting system. Background Art

[0002] With the continuous development of the solar photovoltaic industry, the efficiency of silicon wafer production has become more and more urgent. At present, the silicon wafer sorter is the last link in the production of silicon wafers. Whether the capacity of the sorter can be used to the maximum efficiency is the biggest factor affecting the efficiency of silicon wafer production. Conventional technical means still use manual distribution of the corresponding gear boxes for silicon wafers, which undoubtedly increases the investment cost of the silicon wafer sorting link and cannot use the capacity of the sorter to the maximum efficiency. Summary of the invention

[0003] In view of this, the silicon wafer sorting method and sorting system provided in the embodiments of the present application can solve the problems of high investment cost in the silicon wafer sorting process and inability to maximize the efficiency of utilizing the sorting machine's production capacity.

[0004] In a first aspect, a silicon wafer sorting method provided in an embodiment of the present application is applied to a silicon wafer sorting system, wherein the silicon wafer sorting system comprises a conveying device, at least two gear boxes and a moving device, wherein the at least two gear boxes are divided into at least two areas, and the moving device is used to move silicon wafers from the conveying device to the at least two gear boxes, and the method comprises:

[0005] Obtaining identification information of the silicon wafers to be sorted on the conveying device;

[0006] Determine a target material incoming frequency corresponding to the identification information, wherein the target material incoming frequency is obtained based on the number of silicon wafers in a historical time period and the identification information;

[0007] According to the preset correspondence between the incoming material frequency and the region and the target incoming material frequency, the target region corresponding to the silicon wafer to be sorted is obtained;

[0008] A target box is determined from the target area, and the moving device is controlled to move the silicon wafer to be sorted into the target box.

[0009] In the above-mentioned silicon wafer sorting method, after obtaining the identification information of the silicon wafers to be sorted on the conveying device, the target incoming frequency corresponding to the identification information can be determined based on the identification information and the number of silicon wafers in the historical time period, and then the target area corresponding to the silicon wafers to be sorted can be obtained based on the target incoming frequency. Finally, the target gear box is determined from the target area, and the mobile device is controlled to move the silicon wafers to be sorted to the target gear box. Since the gear box is divided into areas according to the incoming frequency of the silicon wafers, the silicon wafers corresponding to the same incoming frequency can be placed in the gear box in the same area, which can greatly improve the efficiency of collecting wafers. At the same time, the gear box can be dynamically allocated to reduce manual intervention and reduce costs.

[0010] In some embodiments, before obtaining the target area corresponding to the silicon wafer to be sorted according to the preset correspondence between the incoming material frequency and the area and the target incoming material frequency, the method further includes:

[0011] In the case that there is an unfilled box among the at least two boxes, the unfilled box is used as the target box, the unfilled box being a box in which the number of target silicon wafers stored is greater than zero and less than a preset number threshold, and the target silicon wafers and the silicon wafers to be sorted have the same identification information;

[0012] In the case that the incomplete gear box does not exist in the at least two gear boxes, the step of obtaining the target area corresponding to the silicon wafers to be sorted according to the preset correspondence between the incoming material frequency and the area and the target incoming material frequency is performed.

[0013] In some embodiments, before determining the target material incoming frequency corresponding to the identification information, the method further includes:

[0014] Get the number of silicon wafers in the historical time period;

[0015] When the number of silicon wafers in the historical time period is less than a first preset threshold, randomly selecting one of the at least two storage boxes as the target storage box;

[0016] When the number of silicon wafers in the historical time period is greater than or equal to the first preset threshold, the step of determining the target incoming material frequency corresponding to the identification information is performed.

[0017] In some embodiments, the silicon wafer sorting system includes at least one statistical data set, and the statistical data set is used to store information of sorted silicon wafers. The obtaining the number of silicon wafers in a historical time period includes:

[0018] Obtaining the number of silicon wafers of the silicon wafer sorting system in a target statistical data set, wherein the target statistical data set is one of the at least one statistical data set;

[0019] When the number of silicon wafers in the target statistical data set reaches the upper limit of the data set, the number of silicon wafers in the target statistical data set is used as the number of silicon wafers in the historical time period, and the second preset threshold is greater than or equal to the first preset threshold.

[0020] In some embodiments, determining a target box from the target area includes:

[0021] Obtaining at least one candidate storage box in the target area, the candidate storage box being a storage box in which the number of stored target silicon wafers is less than a preset number threshold, and the target silicon wafers and the silicon wafers to be sorted have the same identification information;

[0022] The target box is determined from the at least one candidate box.

[0023] In some embodiments, each of the at least two boxes includes a box code, and obtaining at least one candidate box in the target area includes:

[0024] According to the preset query sequence for the file box code, the number of target silicon wafers stored in the file box is queried in sequence from the target area until the candidate file box is found.

[0025] In some embodiments, determining the target file box from the at least one candidate file box includes:

[0026] Sorting the at least one candidate storage box according to the number of stored target silicon wafers, and taking the candidate storage box in the first order after sorting as the target storage box;

[0027] And / or, the at least one candidate file box is sorted according to the preset query order, and the candidate file box in the first order after sorting is used as the target file box.

[0028] In some embodiments, when the number of target silicon wafers stored in the target area's storage boxes is zero, the target storage box is a storage box in the target area that is located in the first order of the preset query order.

[0029] In some embodiments, different incoming material frequencies correspond to different preset query sequences.

[0030] In some embodiments, after determining the target gear box from the target area, the method further includes:

[0031] The number of target silicon wafers stored in the target storage box is updated.

[0032] In some embodiments, the number of target silicon wafers stored in the transfer box is determined based on the number of target silicon wafers in the target transfer box, the number of target silicon wafers being moved by the moving device, and the number of target silicon wafers being transported by the conveying device, and the target silicon wafers have the same identification information as the silicon wafers to be sorted.

[0033] In some embodiments, the at least two areas are divided according to the distance between the baffle box and the conveying device.

[0034] In some embodiments, the correspondence between the incoming material frequency and the area is determined according to the distance between the baffle box and the conveying device.

[0035] In some embodiments, the correspondence between the incoming material frequency and the area is determined according to the distance between the baffle box and the conveying device.

[0036] In a second aspect, a silicon wafer sorting system provided by an embodiment of the present application includes a controller, a conveying device, at least two gear boxes and a moving device, wherein the at least two gear boxes are divided into at least two areas, and the moving device is used to move silicon wafers from the conveying device to the at least two gear boxes, and the controller is connected to the moving device, wherein the controller is used to:

[0037] Obtaining identification information of the silicon wafers to be sorted on the conveying device;

[0038] Determine the target incoming frequency of the silicon wafers to be sorted according to the identification information of the silicon wafers to be sorted and the incoming data of silicon wafers in a historical time period;

[0039] According to the preset correspondence between the incoming material frequency and the region and the target incoming material frequency, the target region corresponding to the silicon wafer to be sorted is obtained;

[0040] A target box is determined from the target area, and the moving device is controlled to move the silicon wafer to be sorted into the target box.

[0041] It should be understood that the second aspect of the embodiment of the present application is consistent with the technical solution of the first aspect of the embodiment of the present application, and the beneficial effects achieved by each aspect and the corresponding feasible implementation methods are similar and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The drawings herein are incorporated into the specification and constitute a part of the specification. These drawings illustrate embodiments consistent with the present application and are used together with the specification to illustrate the technical solution of the present application.

[0043] Figure 1 A schematic diagram of the structure of a silicon wafer sorting system provided in an embodiment of the present application;

[0044] Figure 2 One of the schematic diagrams of the arrangement of at least two gear boxes provided in the embodiment of the present application;

[0045] Figure 3 A second schematic diagram of an arrangement of at least two gear boxes provided in an embodiment of the present application;

[0046] Figure 4 A schematic diagram of the structure of a mobile device provided in an embodiment of the present application;

[0047] Figure 5 One of the flow diagrams of the silicon wafer sorting method provided in the embodiment of the present application;

[0048] Figure 6 A schematic diagram of the location of the target area provided in the embodiment of the present application;

[0049] Figure 7 The second flow chart of the silicon wafer sorting method provided in the embodiment of the present application;

[0050] Figure 8 A schematic diagram of the positions of workstations on a conveying device provided in an embodiment of the present application;

[0051] Fig. 9 A schematic diagram of the implementation process of the silicon wafer sorting method provided in the embodiment of the present application;

[0052] Fig.10 A schematic diagram of the structure of a computer device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0053] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the specific technical solution of the present application will be further described in detail below in conjunction with the drawings in the embodiments of the present application. The following embodiments are used to illustrate the present application, but are not used to limit the scope of the present application.

[0054] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application.

[0055] In the following description, reference is made to “some embodiments”, which describe a subset of all possible embodiments, but it will be understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.

[0056] It should be pointed out that the terms "first\second\third" involved in the embodiments of the present application are used to distinguish similar or different objects, and do not represent a specific ordering of the objects. It can be understood that "first\second\third" can be interchanged in a specific order or sequence where permitted, so that the embodiments of the present application described here can be implemented in an order other than that illustrated or described here.

[0057] Figure 1 This is a schematic diagram of the structure of a silicon wafer sorting system provided in an embodiment of the present application. Figure 1 As shown, the silicon wafer sorting system includes a conveying device 1, at least two baffle boxes 3 and a moving device 2, wherein the at least two baffle boxes 3 are divided into at least two areas, and the moving device 2 is located between the conveying device 1 and the at least two baffle boxes 3.

[0058] The conveying device 1 is used to convey the silicon wafers to be sorted along a preset conveying direction. The conveying device 1 can be a conveyor belt, which can be made of a rubber and fiber, metal composite product, or a plastic and fabric composite product. The specific configuration can be made by those skilled in the art according to actual conditions, and the embodiments of the present application are not limited thereto.

[0059] The moving device 2 is used to move the silicon wafers to be sorted into the target box.

[0060] In some embodiments, the moving device 2 may include a conveyor belt and / or a robotic arm.

[0061] If the mobile device 2 includes a conveyor belt, the conveyor belt needs to be connected to the conveying device 1 to transfer the moving direction of the silicon wafer to be sorted from the preset transmission direction of the conveying device 1 to the transmission direction corresponding to the mobile device 2, and a target gear box is set in the transmission direction corresponding to the mobile device 2.

[0062] If the moving device 2 includes a robot arm, the robot arm can be disposed between the block box 3 and the conveying device 1 , and the silicon wafers to be sorted can be directly clamped from the conveying device 1 to the target block box by changing the posture parameters of the robot arm.

[0063] During the implementation process, after the silicon wafers to be sorted enter the silicon wafer sorting system, the silicon wafer sorting system needs to perform data detection on the silicon wafers to be sorted, and obtain a target box that can store the silicon wafers to be sorted, so that silicon wafers of different specifications can be stored in different boxes; after obtaining the target box, the conveying device 1 starts to transport the silicon wafers to be sorted along a preset transmission direction. After transporting the silicon wafers to be sorted to the target position, the moving device 2 moves the silicon wafers to be sorted from the target position to the target box, thereby completing the sorting of the silicon wafers.

[0064] In some embodiments, the number of mobile devices 2 may be one or more than one, which is specifically determined by the number of gear boxes and the setting positions of the gear boxes. When at least two gear boxes 3 are set in the same transmission direction and the setting positions of at least two gear boxes 3 are relatively concentrated, and the moving range of the mobile device 2 can cover the setting positions of at least two gear boxes 3, the number of mobile devices 2 may be only one, thereby reducing costs. When at least two gear boxes 3 are set in different transmission directions and the setting positions of at least two gear boxes 3 are relatively dispersed, and the moving range of the mobile device 2 cannot cover the setting positions of at least two gear boxes 3, the number of mobile devices 2 needs to be more than one, so that the moving range of the mobile device 2 can cover all gear boxes.

[0065] Among them, at least two gear boxes 3 are used to store silicon wafers to be sorted. Each of the at least two gear boxes 3 can be any container box that can store silicon wafers, such as a wafer boat box, etc.; at least two gear boxes 3 can be containers of the same specifications or containers of different specifications, which can be specifically set by those skilled in the art according to actual conditions, and the embodiments of the present application do not limit it.

[0066] In some embodiments, since the number of the mobile devices 2 is affected by the relative position between the gear box and the conveying device 1, that is, the more dispersed the arrangement between the at least two gear boxes 3 is, the more mobile devices 2 are needed, the arrangement of the at least two gear boxes 3 can be set to an array, such as Figure 2 As shown, that is, M rows*N columns, M is greater than zero, and N is greater than zero, thereby setting some of the gear boxes in the same transmission direction, reducing the number of moving devices 2.

[0067] In some embodiments, the setting position of each of at least two gear boxes 3 can be fixed, that is, when the moving device 2 moves the silicon wafer to be sorted to the target gear box, it can directly obtain the setting position of the target gear box, thereby moving the silicon wafer to be sorted to the setting position of the target gear box until the silicon wafer to be sorted is moved to the setting position of the target gear box. After the silicon wafer to be sorted is moved to the setting position of the target gear box, the sorting of the silicon wafer to be sorted can be regarded as completed.

[0068] In some embodiments, when at least two gear boxes 3 are arranged in an array, affected by the structural shape of the device in the silicon wafer sorting system, at least two gear boxes 3 cannot be arranged in a strict M*N array. At this time, according to the structural shape of the device, only the setting positions where the gear boxes are set can be preset, and the setting positions where the gear boxes cannot be set can be left empty. Therefore, when determining the target gear boxes for the silicon wafers to be sorted, only the setting positions where the gear boxes are set are considered, and the empty positions are ignored, thereby ensuring that the storage of the silicon wafers is not affected by the structural shape of the device.

[0069] In some embodiments, at least two stop boxes 3 may be distributed on one side of the conveying device 1, such as Figure 2 As shown, they can also be distributed on both sides of the conveying device 1, such as Figure 3 As shown, the specific configuration is performed by those skilled in the art according to actual conditions, and the embodiments of the present application are not limited thereto.

[0070] Accordingly, when at least two baffle boxes 3 are distributed on one side of the conveying device 1, the moving device 2 may be distributed only between the at least two baffle boxes 3 and the conveying device 1, such as Figure 2 When at least two gear boxes 3 are distributed on both sides of the conveying device 1, the mobile device 2 also needs to be set accordingly, that is, the first mobile device 2 needs to be distributed between the first side gear box and the conveying device 1, and the second mobile device 2 needs to be distributed between the second side gear box and the conveying device 1, such as Figure 3 shown.

[0071] In some embodiments, the moving device may include a track and a mechanical arm, and the track is arranged above the conveying device and at least two baffle boxes, such as Figure 4 As shown, the track can completely cover the conveying device and at least two baffle boxes, the robot arm can be movably arranged on the track, and the robot arm can move on the track. After the robot arm completes the clamping operation of the silicon wafer on the conveying device, it can move on the track to move the silicon wafer from the conveying device to the baffle box, and then place the silicon wafer in the baffle box to complete the sorting of the silicon wafer.

[0072] In some embodiments, the silicon wafer sorting system may include a controller, which is connected to the mobile device 2 and the conveying device 1, respectively, and is used to determine the target box corresponding to the silicon wafer to be sorted, control the conveying device 1 to start transmitting the silicon wafer to be sorted, and control the mobile device 2 to move the silicon wafer to be sorted to the target box. The controller may be located in the conveying device 1 or the mobile device 2, or in other equipment different from the conveying device 1 and the mobile device 2. The controller may be specifically set by those skilled in the art according to actual conditions, and the embodiments of the present application are not limited thereto.

[0073] Figure 5 The following is a schematic diagram of a silicon wafer sorting method provided in an embodiment of the present application. Figure 5 As shown, the method can be applied to the controller in the above-mentioned silicon wafer sorting system, and the specific control process may include the following steps:

[0074] Step S101 , obtaining identification information of silicon wafers to be sorted on the conveying device 1 .

[0075] In some embodiments, the above-mentioned identification information can be obtained based on the appearance parameters and / or electrical characteristic parameters of the silicon wafer, the appearance parameters include size, flatness, surface quality and edge condition, and the electrical characteristic parameters include conductivity, resistivity and electron mobility.

[0076] Exemplarily, after the silicon wafers to be sorted enter the feed port of the conveying device 1, the appearance parameters such as size, flatness, surface quality and edge condition of the silicon wafers to be sorted can be obtained by a visual camera or an automatic optical inspection (AOI) device, so that silicon wafers with the same appearance parameters can be identified as the same identification information.

[0077] Exemplarily, after the silicon wafers to be sorted enter the feed port of the conveying device 1, the electrical characteristic parameters such as conductivity, resistivity and electron mobility of the silicon wafers to be sorted can be obtained through current and voltage detection equipment, so that silicon wafers with electrical characteristic parameters having the same numerical level can be identified as the same identification information.

[0078] The identification information is, for example, an identity document (ID).

[0079] Step S102, determining a target incoming material frequency corresponding to the identification information, wherein the target incoming material frequency is obtained based on the number of silicon wafers and the identification information within a historical time period.

[0080] It should be understood that the silicon wafers within the historical time period include all silicon wafers sorted by the silicon wafer sorting system. Therefore, based on the number of silicon wafers within the historical time period and the identification information of the silicon wafers to be sorted, it can be determined from all the silicon wafers within the historical time period whether the silicon wafers to be sorted are the type of silicon wafers with more incoming materials within the historical time period based on the identification information of the silicon wafers to be sorted.

[0081] Among them, the number of silicon wafers in the historical time period can be obtained from the silicon wafer data in the historical time period. The silicon wafer data in the historical time period can include the identification information of all silicon wafers and the corresponding arrival time. Therefore, based on the silicon wafer data in the historical time period, the number of silicon wafers with each identification information can be obtained.

[0082] In some embodiments, because different batches require silicon wafers of different specifications, the identification information of the silicon wafer may also include batch information, that is, different batch information is identified by different identification information, and the number of silicon wafers in a historical time period may come from the same batch information or from different batch information.

[0083] For example, when the silicon wafer sorting system identifies the silicon wafers, it will identify the corresponding batch information, and identify the silicon wafers from the same batch as the same identification information, while different batches correspond to different identification information, for example, batch A corresponds to identification information A, and batch B corresponds to identification information B. If the silicon wafers to be sorted correspond to batch A, then when the controller determines the target incoming material frequency based on the number of silicon wafers in the historical time period, it can be determined based on the number of silicon wafers in the historical time period of batch A, or it can be determined based on the number of silicon wafers in batch B, or it can be determined based on the number of silicon wafers in batch A and batch B. The specific setting is made by those skilled in the art according to the actual situation, and the embodiments of the present application do not limit it.

[0084] In some embodiments, the silicon wafer sorting system may include the number of silicon wafers in multiple historical time periods, and those skilled in the art may select one of the multiple historical time periods, and use the number of silicon wafers in the selected historical time period as the basis for determining the target incoming material frequency. For example, the silicon wafer sorting system may include the number of silicon wafers in historical time period A, the number of silicon wafers in historical time period B, and the number of silicon wafers in historical time period C. After those skilled in the art select historical time period A from historical time period A, historical time period B, and historical time period C as the basis for determining the target incoming material frequency, the controller determines the target incoming material frequency of the silicon wafers to be sorted according to the number of silicon wafers in historical time period A.

[0085] In some embodiments, the frequency of incoming materials can be obtained based on the number of silicon wafers with identification information and the number of all silicon wafers. The specific form of the frequency of incoming materials can be divided into relative levels, such as high frequency and low frequency, etc.; it can also be divided according to the ratio of the number of silicon wafers with identification information to the number of all silicon wafers. For example, the number of silicon wafers with identification information in the historical time period is 20, and the number of all silicon wafers in the historical time period is 100, then the corresponding target frequency of incoming materials is 0.2. The specific setting is made by those skilled in the art according to actual conditions, and the embodiments of the present application are not limited.

[0086] Step S103, obtaining the target area corresponding to the silicon wafer to be sorted according to the preset correspondence between the incoming material frequency and the area and the target incoming material frequency.

[0087] It should be understood that if a large number of silicon wafers with a certain type or several types of identification information are sorted in a historical period of time, it means that the silicon wafers with this type of identification information are the production focus, and the number of silicon wafers with this type of identification information will definitely be large in the subsequent period of time. If the silicon wafers with this type of identification information are placed in a scattered manner, it will be detrimental to the efficiency of technicians in collecting silicon wafers with this type of identification information. Therefore, setting a corresponding relationship between the frequency of incoming materials and the area, and placing silicon wafers with the same frequency of incoming materials in the same area can facilitate the recycling work of technicians.

[0088] It should be noted that the correspondence between the incoming material frequency and the area can be set by technical personnel in this field according to actual conditions. For example, the correspondence between the incoming material frequency and the area is associated with the distance between the baffle box 3 and the conveying device 1, that is, the silicon wafers with a high incoming material frequency are placed in the area close to the conveying device 1, and the silicon wafers with a low incoming material frequency are placed in the area far away from the conveying device 1. The embodiments of the present application are not limited to this.

[0089] Step S104 , determining a target box from the target area, and controlling the moving device 2 to move the silicon wafers to be sorted into the target box.

[0090] Among them, the above-mentioned process of determining the target box from the target area can adopt conventional technical means in the field. For example, based on the number of silicon wafers in the box and the identification information of the silicon wafers in the box, the target box corresponding to the silicon wafers with the same identification information as the silicon wafers to be sorted is determined, and the number of silicon wafers in the target box has not reached the storage upper limit.

[0091] Exemplarily, a box A and a box B are provided in the target area, wherein box A contains silicon wafers A, and box B contains silicon wafers B, and the number of silicon wafers B in box B does not reach the upper limit of the capacity of box B, and the silicon wafers to be sorted have the same identification information as that of silicon wafer B, so box B will be used as the target box when determining the target box.

[0092] In some embodiments, the at least two areas are divided according to the distance between the stop box 3 and the conveying device 1 .

[0093] For example, when it is determined that the silicon wafer to be sorted is a high-frequency silicon wafer, the area adjacent to the mobile device 2 can be used as the target area, such as Figure 6 The framed area in the figure is used to reduce the movement range of the mobile device 2; when it is determined that the silicon wafer to be sorted is a low-frequency silicon wafer, the area far away from the mobile device 2 can be used as the target area, such as Figure 6 The unselected area in the image is used to separate high-frequency silicon wafers from low-frequency silicon wafers, making it easier for technicians to collect them.

[0094] In the above-mentioned silicon wafer sorting method, after obtaining the identification information of the silicon wafers to be sorted on the conveying device 1, the target incoming frequency corresponding to the identification information can be determined based on the identification information and the number of silicon wafers in the historical time period, and then the target area corresponding to the silicon wafers to be sorted can be obtained based on the target incoming frequency. Finally, the target gear box is determined from the target area, and the mobile device 2 is controlled to move the silicon wafers to be sorted to the target gear box. Since the gear box is divided into areas according to the incoming frequency of the silicon wafers, the silicon wafers corresponding to the same incoming frequency can be placed in the gear box in the same area, which greatly improves the efficiency of collecting wafers. At the same time, the gear boxes are dynamically allocated to reduce manual intervention and reduce allocation costs.

[0095] In some embodiments, before the controller executes step S103, the method may further include:

[0096] Detecting the number of target silicon wafers stored in each of at least two storage boxes, where the target silicon wafers and the silicon wafers to be sorted have the same identification information;

[0097] In the case that there is an unfilled box among the at least two boxes, the unfilled box is used as a target box, where the number of stored target silicon wafers in the unfilled box is greater than zero and less than a preset number threshold;

[0098] In the case that there is no underfilled gear box among the at least two gear boxes, step S103 is executed.

[0099] Exemplarily, after the silicon wafers to be sorted enter the silicon wafer sorting system, after obtaining the identification information of the silicon wafers to be sorted, the number of target silicon wafers stored in at least two boxes can be detected. If there is a non-full box among at least two boxes, the non-full box can be directly used as the target box; if at least two boxes are empty boxes or full boxes, step S103 is executed, and the target box is determined from the target area, wherein an empty box is a box in which the number of target silicon wafers stored is zero, and a full box is a box in which the number of target silicon wafers stored is a preset number threshold.

[0100] It should be noted that the above-mentioned preset quantity threshold is the upper limit of the number of silicon wafers stored in the storage box. This value can be set by those skilled in the art according to actual conditions and is not limited in the embodiments of the present application.

[0101] It is understandable that before executing the step of determining the target area, first detecting whether there is an underfilled box in at least two boxes can ensure that the boxes to be sorted are preferentially allocated to the underfilled boxes, thereby improving the utilization rate of the boxes.

[0102] In some embodiments, Figure 7 As shown, before determining the target incoming material frequency corresponding to the identification information in the above step S101, the method further includes:

[0103] Step S105, obtaining the number of silicon wafers in a historical time period;

[0104] Step S106, when the number of silicon wafers in the historical time period is less than a first preset threshold, randomly select one of the at least two boxes as a target box;

[0105] When the number of silicon wafers in the historical time period is greater than or equal to the first preset threshold, the step of determining the target incoming material frequency corresponding to the identification information in step S101 is executed.

[0106] It should be understood that if the number of silicon wafers in the historical time period is less than the first preset threshold, it means that the number of silicon wafers in the historical time period is small and cannot provide effective support for calculating the frequency of incoming materials. Therefore, before determining the frequency of incoming materials, we first determine whether the number of silicon wafers in the historical time period is less than the first preset threshold, and randomly select one of at least two gear boxes as the target gear box when the number of silicon wafers in the historical time period is less than the first preset threshold, which can further improve the sorting reliability.

[0107] Among them, the first preset threshold can be set by those skilled in the art according to actual conditions, such as zero, and the embodiment of the present application does not limit it.

[0108] It can be understood that by first determining whether the number of silicon wafers in the historical time period is less than the first preset threshold, it can be determined whether the number of silicon wafers in the historical time period can provide support for determining the frequency of incoming silicon wafers to be sorted, thereby improving sorting reliability.

[0109] In some embodiments, the silicon wafer sorting system includes at least one statistical data set for the number of silicon wafers, and the number of silicon wafers in a historical time period is obtained in the above step S105, including:

[0110] Obtaining the number of silicon wafers in a target statistical data set of a silicon wafer sorting system, wherein the target statistical data set is one of at least one statistical data set;

[0111] When the number of silicon wafers in the target statistical data set reaches the upper limit of the data set, the number of silicon wafers in the target statistical data set is used as the number of silicon wafers in the historical time period.

[0112] It should be understood that the silicon wafer sorting system will periodically divide the historical time period during the process of sorting silicon wafers. If the number of silicon wafers in the target statistical data set does not reach the upper limit of the data set, it means that the number of silicon wafers in the target statistical data set is not at a valid data level, and the number of silicon wafers in the target statistical data set cannot be temporarily used as the number of silicon wafers in the historical time period. Only when the number of silicon wafers in the target statistical data set is greater than or equal to the second preset threshold, can it be said that the number of silicon wafers in the target statistical data set is at a valid data level, which can provide data support for determining the target incoming material frequency.

[0113] In some embodiments, when the number of silicon wafers in a single statistical data set reaches an upper limit, the controller will automatically divide the silicon wafers in the next order into the next statistical data set. For example, the historical time period includes identification information of 50 silicon wafers. If each statistical data set needs to cover 30 silicon wafers, then the 50 silicon wafers can be divided into one statistical data set, and the remaining 20 silicon wafers need to be used as silicon wafers in the next statistical data set, waiting for the number of silicon wafers in the next statistical data set to reach 30.

[0114] In some embodiments, the target statistical data set may be a statistical data set closest to the current moment, so that the recent historical silicon wafer quantity is used as the basis for sorting.

[0115] In other embodiments, due to the batch and diversity of orders, it often happens that a certain type of silicon wafer in the current time period is the silicon wafer with a higher frequency of incoming materials, but in the next time period, the silicon wafer with a higher frequency of incoming materials becomes another type of silicon wafer, and the subsequent sorting is cyclically performed between the two types of silicon wafers. Therefore, the target statistical data set can be a statistical data set selected by the user, and the user can select from at least one statistical data set during the implementation process, thereby providing the user with a variety of choices. When providing the user with selection information of the statistical data set, a corresponding selection interface can be output, and the number of silicon wafers and identification information in each statistical data set can be output in the selection interface.

[0116] In some embodiments, determining a target box from a target area includes:

[0117] Obtain at least one candidate storage box in the target area, the candidate storage box being a storage box in which the number of stored target silicon wafers is less than a preset number threshold, and the target silicon wafers and the silicon wafers to be sorted correspond to the same identification information;

[0118] A target box is determined from at least one candidate box.

[0119] It should be understood that since each file box has an upper limit on the number of silicon wafers that can be stored, and each file box can only store files with one type of identification information, when determining the target file box corresponding to the silicon wafers to be sorted, it is necessary to first determine whether the number of target silicon wafers stored in the target file box has reached a preset number threshold. If the preset number threshold is reached, it means that the storage upper limit has been reached in the target file box, and the silicon wafers to be sorted cannot be placed in the target file box for storage; if the preset number threshold is not reached, it means that the storage upper limit has not been reached in the target file box, and the target file box can be used as a file box for storing the silicon wafers to be sorted.

[0120] The candidate file box may be determined in one or a combination of the following ways:

[0121] Method 1: The above-mentioned candidate boxes can be obtained after querying the number of target silicon wafers in all boxes in the target area. For example, if the boxes used to store the target silicon wafers in the target area include box A, box B and box C, after querying the number of target silicon wafers stored in box A, box B and box C, it is found that the number of target silicon wafers stored in box A is equal to the preset number threshold, and the number of target silicon wafers stored in box B and box C is less than the preset number threshold, so the candidate boxes for the silicon wafers to be sorted at this time are box B and box C.

[0122] Method 2: the candidate boxes may be queried in a certain query order, one by one, until a candidate box is found in which the number of stored silicon wafers is less than a preset number threshold. That is, when it is found that the number of stored silicon wafers in a certain box does not reach the preset number threshold, the box is directly used as the only candidate box, and the boxes in subsequent orders are no longer queried, thereby improving the efficiency of determining the target box.

[0123] Exemplarily, each of the at least two boxes 3 includes a box code, and the step of obtaining at least one candidate box in the target area includes:

[0124] According to the preset query sequence for the bin codes, the number of silicon wafers in the first bin is obtained;

[0125] When the number of silicon wafers stored in the first storage box is less than a preset number threshold, determining the first storage box as a candidate storage box;

[0126] When the number of silicon wafers stored in the first gear box is greater than or equal to a preset number threshold, the number of silicon wafers in the second gear box is obtained, and the second gear box is a gear box whose gear box code query order in the preset query order is lower than that of the first gear box.

[0127] It can be understood that, compared with method 1, method 2 can reduce the query time for the number of target silicon wafers and improve the efficiency of determining the target gear box.

[0128] In some embodiments, different incoming material frequencies correspond to different preset query sequences.

[0129] Exemplarily, high frequencies correspond to a query order of gear box codes from small to large, and low frequencies correspond to a query order of gear box codes from large to small, thereby reducing the probability that high frequencies and low frequencies correspond to the same target gear box.

[0130] In some embodiments, since there may be multiple candidate boxes obtained through the above-mentioned target silicon wafer quantity query process, a corresponding selection strategy may be formulated when selecting a target box from multiple candidate boxes. For example, one or a combination of the following methods may be included:

[0131] Method 1: sort at least one candidate file box according to the number of stored target silicon wafers, and use the candidate file box in the first order after sorting as the target file box.

[0132] Among them, after sorting at least one candidate file box according to the number of target silicon wafers stored, the first order can be the file box with the largest number of target silicon wafers stored, or it can be the file box with the least number of target silicon wafers stored. The specific setting is made by technical personnel in this field according to actual conditions, and the embodiments of this application do not limit it.

[0133] Exemplarily, the candidate boxes include box 1, box 2 and box 3, the number of target silicon wafers stored in box 1 is 9, the number of target silicon wafers stored in box 2 is 11, the number of target silicon wafers stored in box 3 is 19, and the number of silicon wafers in box 1, box 2 and box 3 has not reached the storage upper limit, so at this time, box 1, box 2 and box 3 can be sorted according to the number of target silicon wafers stored to obtain the sorted candidate boxes. For example, after sorting in order from large to small, box 3, box 2 and box 1 can be obtained, among which box 3 is the first order box, so at this time the controller will use box 3 as the target box.

[0134] Method 2: sort at least one candidate file box according to a preset query order, and use the candidate file box in the first order after sorting as the target file box.

[0135] Among them, the preset query order can be the query order when querying the candidate file boxes, or it can be other orders. It is specifically set by technical personnel in this field according to actual conditions, and the embodiments of the present application do not limit it.

[0136] Exemplarily, the candidate boxes include box 1, box 2 and box 3, and the preset query order is box 1, box 2 and box 3, so the controller will directly use box 1 as the target box.

[0137] It should be noted that the above two methods are only two implementation methods provided in the embodiments of the present application. Other selection strategies may also be used to execute the selection of the target gear box. The above two methods should not be regarded as limitations on the embodiments of the present application.

[0138] In some embodiments, when the number of target silicon wafers stored in the file boxes in the target area is zero, it means that no target silicon wafers are placed in the target area. At this time, the controller can select one of the file boxes in the target area as the target file box according to a certain selection strategy. For example, when the number of target silicon wafers stored in the file boxes in the target area is zero, the target file box is the file box in the first order of the preset query order in the target area.

[0139] Among them, the preset query order can be the query order when querying the candidate file boxes, or it can be other orders. It is specifically set by technical personnel in this field according to actual conditions, and the embodiments of the present application do not limit it.

[0140] Exemplarily, the target area includes box 1, box 2 and box 3, and the number of target silicon wafers in box 1, box 2 and box 3 is zero. The preset query order is box 1, box 2 and box 3, so the controller will directly use box 1 as the target box.

[0141] From the above process, it can be known that the number of target silicon wafers stored in the target box is an important factor affecting the accuracy of the final sorting result during the sorting process, so how to accurately obtain the number of target silicon wafers stored in the target box is particularly critical.

[0142] The method for determining the number of target silicon wafers stored in the target storage box may include one or a combination of the following:

[0143] Mode 1: After determining the target storage box in the target area, the method further includes:

[0144] Update the number of target silicon wafers stored in the target storage box.

[0145] It should be understood that since the controller controls the mobile device 2 to move the silicon wafers to be sorted to the target box, it is a subsequent processing flow after determining the target box. Under normal circumstances, the subsequent processing flow will not affect the selection of the target box. Therefore, before the silicon wafers to be sorted are moved to the target box by the conveying device 1 and the mobile device 2, the number of target silicon wafers stored in the target box is updated. The step of updating the number of target silicon wafers stored in the target box can be advanced without affecting the execution of the step of selecting the target box for other silicon wafers to be sorted.

[0146] In some embodiments, if an operation error occurs in the process of the conveying device 1 and the mobile device 2 when moving the silicon wafers to be sorted to the target box, the operation can be stopped and an error instruction can be sent to the controller so that the controller outputs an error message, prompting the user to check the conveying device 1 and the mobile device 2, and after the user restarts the conveying device 1 and the mobile device 2, continue to move the silicon wafers to be sorted to the target box.

[0147] It should be understood that although the above method 1 is relatively simple in updating the number of silicon wafers in the target box, the update of the number of silicon wafers in the target box is placed before the movement process of the silicon wafers to be sorted, which is easily affected by whether the movement process of the conveying device 1 and the moving device 2 is running normally.

[0148] Method 2: The number of target silicon wafers stored in the gear box is determined based on the number of target silicon wafers in the target gear box, the number of target silicon wafers being moved by the mobile device 2, and the number of target silicon wafers being transported on the conveying device 1. The target workstation is the position on the conveying device 1 corresponding to the target gear box, and the target silicon wafers and the silicon wafers to be sorted have the same identification information.

[0149] It should be understood that when the controller obtains the number of silicon wafers stored in the baffle box, it can be determined based on the number of target silicon wafers being moved by the mobile device 2 and the number of target silicon wafers being transported on the conveying device 1, that is, the number of silicon wafers in transit on the conveying device 1 and the mobile device 2 is counted, and then the number of silicon wafers in transit and the number of silicon wafers in the target baffle box are superimposed to obtain the accurate number of silicon wafers.

[0150] Among them, the number of target silicon wafers being transported on the conveying device 1 can be superimposed and counted according to the number of target silicon wafers on each workstation. The workstation refers to the position on the conveying device 1 corresponding to each column of gear boxes. When the mobile device 2 moves the silicon wafers from the conveying device 1 to the target gear box, it is necessary to wait for the conveying device 1 to transfer the silicon wafers to be sorted to the target workstation, and then the mobile device 2 can directly move the silicon wafers to be sorted from the target workstation to the target gear box.

[0151] When conveying silicon wafers, the conveying device 1 sequentially transfers the silicon wafers to each station of the conveying device until the silicon wafer is transferred to the target station corresponding to the target gear box. For example, at least two gear boxes are arranged in 6 rows and 4 columns, and the target gear box is located in the 4th column. The conveying device 1 includes station 1, station 2, station 3 and station 4. Station 1 corresponds to the position of the gear box in the 1st column, station 2 corresponds to the position of the gear box in the 2nd column, station 3 corresponds to the position of the gear box in the 3rd column, and station 4 corresponds to the position of the gear box in the 4th column. Figure 8 As shown, the conveying device 1 needs to transfer the silicon wafers to be sorted through station 1, station 2 and station 3 in sequence, and finally transfer them to station 4, and then the moving device 2 moves the silicon wafers to be sorted on station 4 to the target gear box.

[0152] Exemplarily, after the silicon wafers to be sorted enter the feed port of the conveying device 1, the material box of the target silicon wafers with the same identification information is first judged as a material box in the fifth column of the target area based on the identification information of the silicon wafers to be sorted, and then the number of target silicon wafers stored in the material box is obtained, wherein the number of target silicon wafers stored in the material box is the sum of the number of silicon wafers already in the material box, the number of target silicon wafers on the conveying device 1, and the number of target silicon wafers carried on the first column, the second column, the third column, the fourth column and the fifth column. If the superimposed number of silicon wafers does not reach the storage upper limit of the material box, the material box is used as the target box for the silicon wafers to be sorted.

[0153] It can be understood that, compared with the first method, the second method can effectively reduce the erroneous operation of the conveying device 1 and the moving device 2 to the target gear box, but it also increases the calculation cost of the number of target silicon wafers.

[0154] In some embodiments, if there is no candidate box in the target area, the method further includes: outputting an alarm message to prompt the user that there is no free box, so that the user can replace the free box in time, thereby improving the sorting efficiency of silicon wafers.

[0155] Fig. 9 The following is a schematic diagram of the implementation process of a silicon wafer sorting method provided in an embodiment of the present application. Fig. 9 As shown, the method may include the following steps:

[0156] Step 1: After the silicon wafers to be sorted enter the feeding port of the conveying device, the appearance and electrical characteristics of the battery cells are first inspected by visual cameras, AOI equipment, voltage and current detection equipment, etc., and the data is automatically summarized to generate corresponding identification information, and the actual silicon wafer number is bound and stored in the database.

[0157] Step 2, based on the identification information and the number of silicon wafers in the historical time period, determine the frequency of incoming silicon wafers to be sorted, where the number of silicon wafers in the historical time period indicates the higher frequency silicon wafer identifications obtained after data collection and data analysis of the incoming silicon wafers in recent times. The number of silicon wafers in the historical time period is stored in the database and updated and iterated in real time.

[0158] Step 3, according to the frequency of incoming materials, the target area is obtained, wherein if the silicon wafers to be sorted are of high frequency, the gear box close to the mobile device is preferentially allocated (such as Figure 5 If the silicon wafers to be sorted are of low frequency, the boxes far away from the mobile device are preferentially allocated (such as Figure 5 Unselected area).

[0159] Step 4, query the existing available box data from the target area, query the idle box codes from small to large for high-frequency silicon wafers to be sorted to reduce the movement stroke of the robot arm; query the idle codes from large to small for low-frequency silicon wafers to be sorted to reduce the probability of cross-sorting; if there are no available idle boxes in the above two processes, output a warning prompt.

[0160] Step 5, determine the candidate storage box that stores silicon wafers with the same identification information and whose current storage quantity of silicon wafers has not reached the storage upper limit. After counting the number of materials in transit, if the storage box can still continue to put materials, then bind the coding information of the target storage box to the silicon wafer database.

[0161] For example, a new silicon wafer has arrived on the conveying device. According to its identification information, it should be stored in a material box in the fifth column. At this time, the "quantity of materials in transit" is determined by considering whether there are silicon wafers with the same identification information on the conveying device, and whether the mobile device in the fifth column is carrying silicon wafers with the same identification information. After accumulating their quantities, if the corresponding material box is not full, it can be determined as the target box.

[0162] Step 6: Control the moving device to move the silicon wafers to be sorted to the target box.

[0163] It should be understood that although Figure 5-Figure 9 The steps in the flowchart are shown in sequence as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. Moreover, Figure 5-Figure 9 At least part of the steps may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least part of the sub-steps or stages of other steps.

[0164] It should be noted that in the embodiment of the present application, if the above method is implemented in the form of a software function module and sold or used as an independent product, it can also be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the embodiment of the present application can be essentially or partly embodied in the form of a software product that contributes to the relevant technology. The computer software product is stored in a storage medium, including several instructions to enable an electronic device to execute all or part of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a U disk, a mobile hard disk, a read-only memory (ROM), a magnetic disk or an optical disk. In this way, the embodiment of the present application is not limited to any specific combination of hardware and software.

[0165] The embodiment of the present application provides a computer device, which may be a server, and its internal structure diagram may be as follows: Fig.10 As shown. The computer device includes a processor, a memory and a network interface connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store data. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a silicon wafer sorting method is implemented.

[0166] An embodiment of the present application provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps in the method provided in the above embodiment are implemented.

[0167] An embodiment of the present application provides a computer program product including instructions, which, when executed on a computer, enables the computer to execute the steps of the method provided in the above method embodiment.

[0168] Those skilled in the art will understand that Fig.10 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0169] In one embodiment, the silicon wafer sorting method provided in the present application can be implemented in the form of a computer program. The computer program can be Fig.10 The computer device shown in the figure can be run on the computer device. The memory of the computer device can store various program modules constituting the electronic device. The computer program composed of various program modules enables the processor to execute the steps of the silicon wafer sorting method in various embodiments of the present application described in this specification.

[0170] In one embodiment, a computer device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the above-mentioned silicon wafer sorting method when executing the computer program.

[0171] It should be noted here that the description of the above storage medium and device embodiments is similar to the description of the above method embodiments, and has similar beneficial effects as the method embodiments. For technical details not disclosed in the storage medium, storage medium and device embodiments of this application, please refer to the description of the method embodiments of this application for understanding.

[0172] It should be understood that "one embodiment" or "an embodiment" or "some embodiments" mentioned throughout the specification means that specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in one embodiment" or "in some embodiments" appearing throughout the specification may not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in various embodiments of the present application, the size of the sequence number of the above-mentioned processes does not mean the order of execution, and the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present application. The above-mentioned sequence numbers of the embodiments of the present application are only for description and do not represent the advantages and disadvantages of the embodiments. The above description of each embodiment tends to emphasize the differences between the various embodiments, and the same or similar aspects can be referenced to each other. For the sake of brevity, this article will not repeat them.

[0173] The term "and / or" in this article is only a description of the association relationship of associated objects, indicating that there may be three relationships. For example, object A and / or object B can represent three situations: object A exists alone, object A and object B exist at the same time, and object B exists alone.

[0174] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0175] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. The embodiments described above are only schematic. For example, the division of the modules is only a logical function division. There may be other division methods in actual implementation, such as: multiple modules or components can be combined, or can be integrated into another system, or some features can be ignored, or not executed. In addition, the coupling, direct coupling, or communication connection between the components shown or discussed can be through some interfaces, and the indirect coupling or communication connection of devices or modules can be electrical, mechanical or other forms.

[0176] The modules described above as separate components may or may not be physically separated, and the components displayed as modules may or may not be physical modules; they may be located in one place or distributed on multiple network units; some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment.

[0177] In addition, all functional modules in the embodiments of the present application may be integrated into one processing unit, or each module may be a separate unit, or two or more modules may be integrated into one unit; the above-mentioned integrated modules may be implemented in the form of hardware or in the form of hardware plus software functional units.

[0178] A person skilled in the art can understand that all or part of the steps of implementing the above method embodiment can be completed by hardware related to program instructions, and the aforementioned program can be stored in a computer-readable storage medium. When the program is executed, it executes the steps of the above method embodiment; and the aforementioned storage medium includes: mobile storage devices, read-only memories (ROM), magnetic disks or optical disks, etc., various media that can store program codes.

[0179] Alternatively, if the above-mentioned integrated unit of the present application is implemented in the form of a software function module and sold or used as an independent product, it can also be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the embodiment of the present application can essentially or in other words, the part that contributes to the relevant technology can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for enabling an electronic device to execute all or part of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as mobile storage devices, ROMs, magnetic disks, or optical disks.

[0180] The methods disclosed in several method embodiments provided in this application can be arbitrarily combined without conflict to obtain new method embodiments.

[0181] The features disclosed in several product embodiments provided in this application can be arbitrarily combined without conflict to obtain new product embodiments.

[0182] The features disclosed in several method or device embodiments provided in this application can be arbitrarily combined without conflict to obtain new method embodiments or device embodiments.

[0183] The above is only an implementation method of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A silicon wafer sorting method, characterized in that: Applied to a silicon wafer sorting system, the silicon wafer sorting system comprises a conveying device, at least two gear boxes and a moving device, the at least two gear boxes are divided into at least two areas, the moving device is used to move the silicon wafers from the conveying device to the at least two gear boxes, the method comprises: Obtaining identification information of the silicon wafers to be sorted on the conveying device; Determine a target material incoming frequency corresponding to the identification information, wherein the target material incoming frequency is obtained based on the number of silicon wafers in a historical time period and the identification information; According to the preset correspondence between the incoming material frequency and the region and the target incoming material frequency, the target region corresponding to the silicon wafer to be sorted is obtained; A target box is determined from the target area, and the moving device is controlled to move the silicon wafer to be sorted into the target box.

2. The method according to claim 1, characterized in that Before obtaining the target area corresponding to the silicon wafer to be sorted according to the preset correspondence between the incoming material frequency and the area and the target incoming material frequency, the method further includes: In the case that there is an unfilled box among the at least two boxes, the unfilled box is used as the target box, the unfilled box being a box in which the number of target silicon wafers stored is greater than zero and less than a preset number threshold, and the target silicon wafers and the silicon wafers to be sorted have the same identification information; In the case that the incomplete gear box does not exist in the at least two gear boxes, the step of obtaining the target area corresponding to the silicon wafers to be sorted according to the preset correspondence between the incoming material frequency and the area and the target incoming material frequency is performed.

3. The method according to claim 1, characterized in that Before determining the target material incoming frequency corresponding to the identification information, the method further includes: Get the number of silicon wafers in the historical time period; When the number of silicon wafers in the historical time period is less than a first preset threshold, randomly selecting one of the at least two storage boxes as the target storage box; When the number of silicon wafers in the historical time period is greater than or equal to the first preset threshold, the step of determining the target incoming material frequency corresponding to the identification information is performed.

4. The method according to claim 3, characterized in that The silicon wafer sorting system includes at least one statistical data set, and the statistical data set is used to store information of sorted silicon wafers. The obtaining the number of silicon wafers in a historical time period includes: Obtaining the number of silicon wafers of the silicon wafer sorting system in a target statistical data set, wherein the target statistical data set is one of the at least one statistical data set; When the number of silicon wafers in the target statistical data set reaches the upper limit of the data set, the number of silicon wafers in the target statistical data set is used as the number of silicon wafers in the historical time period.

5. The method according to claim 1, characterized in that The step of determining a target gear box from the target area comprises: Obtaining at least one candidate storage box in the target area, the candidate storage box being a storage box in which the number of stored target silicon wafers is less than a preset number threshold, and the target silicon wafers and the silicon wafers to be sorted have the same identification information; The target box is determined from the at least one candidate box.

6. The method according to claim 5, characterized in that Each of the at least two boxes includes a box code, and obtaining at least one candidate box in the target area includes: According to the preset query sequence for the file box code, the number of target silicon wafers stored in the file box is queried in sequence from the target area until the candidate file box is found.

7. The method according to claim 6, characterized in that The determining the target file box from the at least one candidate file box comprises: Sorting the at least one candidate storage box according to the number of stored target silicon wafers, and taking the candidate storage box in the first order after sorting as the target storage box; And / or, the at least one candidate file box is sorted according to the preset query order, and the candidate file box in the first order after sorting is used as the target file box.

8. The method according to claim 6, characterized in that When the number of target silicon wafers stored in the storage boxes in the target area is zero, the target storage box is a storage box in the target area that is located in the first order of the preset query order.

9. The method according to any one of claims 6 to 8, characterized in that: Different incoming material frequencies correspond to different preset query sequences.

10. The method according to claim 5, characterized in that After determining the target gear box from the target area, the method further includes: The number of target silicon wafers stored in the target storage box is updated.

11. The method according to claim 2 or 5, characterized in that: The number of target silicon wafers stored in the storage box is determined according to the number of target silicon wafers in the target storage box, the number of target silicon wafers being moved by the moving device, and the number of target silicon wafers being transported by the conveying device, and the target silicon wafers have the same identification information as the silicon wafers to be sorted.

12. The method according to claim 1, characterized in that The at least two areas are divided according to the distance between the stop box and the conveying device.

13. The method according to claim 1, characterized in that The corresponding relationship between the incoming material frequency and the area is determined according to the distance between the baffle box and the conveying device.

14. A silicon wafer sorting system, characterized in that: The silicon wafer sorting system comprises a controller, a conveying device, at least two gear boxes and a moving device, wherein the at least two gear boxes are divided into at least two areas, and the moving device is used to move the silicon wafers from the conveying device to the at least two gear boxes. The controller is connected to the moving device, wherein the controller is used to: Obtaining identification information of the silicon wafers to be sorted on the conveying device; Determine the target incoming frequency of the silicon wafers to be sorted according to the identification information of the silicon wafers to be sorted and the incoming data of silicon wafers in a historical time period; According to the preset correspondence between the incoming material frequency and the region and the target incoming material frequency, the target region corresponding to the silicon wafer to be sorted is obtained; A target box is determined from the target area, and the moving device is controlled to move the silicon wafer to be sorted into the target box.

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