Automatic Laser Solder Ball Welding Equipment for Wafer Based on Visual Positioning and Detection

Abstract

The present invention relates to the technical field of welding, and particularly relates to an automatic laser solder ball welding device for wafers based on vision positioning and detection, including a platform. An installation frame is fixedly connected to the platform. A vision positioning and detection device and a laser solder ball welding device are arranged on the installation frame. A mounting seat is slidably connected to the platform, and a positioning and fixing device for automatically calibrating and fixing the wafer product is mounted on the mounting seat. In this application, the positioning and fixing device can automatically adjust the position of the wafer product and fix it after the position is adjusted. It effectively solves the problems of manually placing and mechanically clamping the wafer product for fixing and positioning in the wafer-level packaging process of existing laser welding equipment.

Description

Technical Field

[0001] The present invention relates to the field of welding technology, and particularly to an automatic laser solder ball welding device for wafers based on visual positioning and detection. Background Art

[0002] Semiconductor packaging is divided into traditional packaging and wafer-level packaging. In traditional packaging, the wafer is first cut and then packaged, while in wafer-level packaging, partial or all packaging is completed at the wafer level first and then the wafer is cut. Wafer-level packaging has no substrate, and wiring and solder balls are directly made on the wafer, and are connected to the outside through these solders. However, in the existing wafer-level packaging process, since the flux is extremely prone to generating voids during reflow soldering, the voids will cause stress and heat concentration inside the solder balls, which will not only damage the mechanical and electrical properties of the solder balls, but also shorten the life of the solder balls. In order to detect the voids inside the solder balls, new detection equipment needs to be added, which will increase the packaging cost.

[0003] With the miniaturization of electronic products, the diameter of the solder balls becomes smaller, and it is difficult to control the proportion of the void volume inside the solder balls in the solder ball volume. The laser welding technology has been applied. In the field of electronic chip packaging, laser welding can accurately focus on tiny solder balls, and through the thermal effect generated by the absorption of laser energy by the material, the solder balls are quickly locally melted to achieve connection. Different from traditional welding methods, laser welding does not require flux to assist the melting of the solder.

[0004] At present, the laser welding equipment uses the method of manual placement for positioning and combines mechanical jigs for fixing to position and fix the product. Since the wafer is a thin and brittle silicon wafer, it is easily cracked and damaged due to mechanical stress during fixing. If the clamping force of the mechanical jig is slightly too large, it may cause cracks in it. At the same time, wafer-level packaging requires high precision at the micron or even sub-micron level. The chip solder joints and circuits are tiny, and there are large positioning errors when using the method of manual placement for positioning, which is likely to cause welding misalignment.

[0005] Therefore, in the wafer-level packaging process, although laser welding has advantages, the problems of fixing and positioning the wafer have become technical bottlenecks. Solving these problems is of great significance for promoting the development of semiconductor packaging technology, improving the performance and reliability of electronic products, and is also the key that those skilled in the art urgently need to overcome. Summary of the Invention

[0006] In order to solve the problems of fixing and positioning the wafer in the process of wafer-level packaging by the existing laser welding equipment, the present application provides an automatic laser solder ball welding device for wafers based on visual positioning and detection.

[0007] The automatic laser solder ball welding device for wafers based on visual positioning and detection provided by the present application adopts the following technical solutions:

[0008] The wafer automatic laser solder ball welding device based on vision positioning and detection includes a platform. An installation frame is fixedly connected to the platform. A vision positioning and detection device and a laser solder ball welding device are arranged on the installation frame. A mounting seat is slidably connected to the platform. A positioning and fixing device for automatically calibrating and fixing the wafer product is installed on the mounting seat. The positioning and fixing device includes a fixing mechanism, a lifting mechanism, an adjusting mechanism, a detection mechanism and a controller. The controller is electrically connected to the fixing mechanism, the lifting mechanism, the adjusting mechanism and the detection mechanism respectively. A notch for the detection mechanism to detect is opened on the wafer product. An interlocking mechanism is arranged between the fixing mechanism and the lifting mechanism.

[0009] Further, the fixing mechanism includes a bottom plate which is fixedly connected to the mounting seat. A plurality of vertically arranged and juxtaposed support rods are fixedly connected to the bottom plate. A suction cup is fixedly and hermetically connected to the top of the support rod. A vacuum tube joint which is fixedly and hermetically communicated with the suction cup is arranged at a position close to the top of the outer side of the support rod. The vacuum tube joint is connected to a vacuum pump through the interlocking mechanism. The vacuum pump is electrically connected to the controller.

[0010] Further, the lifting mechanism includes a lifting driving part fixedly installed on the bottom plate. The lifting driving part is electrically connected to the controller. A plurality of vertically arranged and juxtaposed lead screws are rotatably connected to the bottom plate. A synchronous transmission component is connected between the lifting driving part and the lead screw. A lead screw nut is fitted on the lead screw. The lead screw nuts are respectively fixedly installed on two symmetrically arranged lifting lock plates. A lifting support ring is fixedly installed on the lifting lock plate. A support ring is rotatably connected to the lifting support ring. A plurality of wafer support plates are fixedly installed on the support ring. A positioning step corresponding to the wafer product is opened on the wafer support plate.

[0011] Further, the synchronous transmission component includes a driving synchronous pulley fixedly installed on the lifting driving part. A driven synchronous pulley is fixedly connected to the lead screw. A synchronous belt is connected between the driven synchronous pulley and the driving synchronous pulley for transmission.

[0012] Further, the adjusting mechanism includes a rotating base fixedly installed on the bottom plate. A rotating driving part is fixedly installed on the rotating base. The rotating driving part is electrically connected to the controller. A driving gear is fixedly installed on the rotating driving part. A rotating ring sleeve is rotatably connected to the rotating base. A driven gear ring is fixedly connected to the rotating ring sleeve. The driven gear ring meshes with the driving gear. A plurality of driving guide sleeves are fixedly connected to the rotating ring sleeve. A rotating guide post is slidably connected inside the driving guide sleeve. The rotating guide post is fixedly installed on the support ring.

[0013] Furthermore, the detection mechanism includes a positioning inductor fixedly installed on the fixing mechanism. An induction light column can be emitted from the positioning inductor, and the position of the induction light column corresponds to the notch.

[0014] Furthermore, the interlocking mechanism includes a valve body. A valve cavity is formed inside the valve body along the lifting direction of the lifting mechanism. A first interface and a second interface communicating with the valve cavity are formed on the valve body along the lifting direction of the lifting mechanism. The first interface is connected to the vacuum pump, and the second interface is connected to the vacuum tube joint. A piston valve is hermetically and slidably connected inside the valve cavity. A piston rod is fixedly connected to the piston valve. The piston rod penetrates through the end of the valve body and is hermetically and slidably connected to the valve body. A spring is abutted and connected between one end of the piston valve away from the piston rod and the inner end of the valve body. The valve body is fixedly installed on the fixing mechanism, and the piston rod is elastically abutted on the lifting lock plate.

[0015] Furthermore, a plurality of annularly and evenly distributed rollers are rotatably connected to the lifting support ring. Ring grooves are formed on the support ring corresponding to the rollers, and the rollers are in rolling connection with the ring grooves.

[0016] Furthermore, the wafer support plate is made of a transparent material.

[0017] Furthermore, a first slide rail is arranged on the mounting frame along a first direction. A mounting plate is slidably connected to the first slide rail. Both the vision positioning detection device and the laser solder ball welding device are installed on the mounting plate. A second slide rail is arranged on the platform along a second direction. The mounting seat is slidably connected to the second slide rail, and the first direction is perpendicular to the second direction.

[0018] The beneficial effects achieved:

[0019] In this application, the position of the wafer product can be determined by using the detection mechanism to detect the notch on the wafer product. The positioning accuracy of this method is much higher than that during manual placement. At the same time, by precisely controlling the lifting mechanism to descend to a set height through the controller, the wafer product can be fixed to the fixing mechanism. The mechanical action of the fixing mechanism is precise, which can ensure that the wafer is uniformly stressed and stable in position, avoiding problems of displacement and uneven pressure caused by uneven force and inaccurate clamping position when using a fixture manually. It effectively solves the problems of fixing and positioning the wafer during the wafer-level packaging process of the existing laser welding equipment. Description of the Drawings

[0020] Figure 1 It is a schematic diagram of the overall structure of an embodiment of this application.

[0021] Figure 2 It is a schematic perspective view of the alignment and fixing device in an embodiment of the present application.

[0022] Figure 3 It is a schematic exploded view of the alignment and fixing device in an embodiment of the present application.

[0023] Figure 4 It is a schematic internal structure view of the interlocking mechanism in an embodiment of the present application.

[0024] Figure 5 It is a schematic installation structure view of the support ring in an embodiment of the present application.

[0025] Description of reference numerals: 3000, platform; 3001, mounting frame; 3002, mounting seat; 3003, first slide rail; 3004, mounting plate; 3005, second slide rail; 4000, vision positioning detection device; 5000, laser solder ball welding device; 6000, alignment and fixing device; 6001, wafer product; 6002, notch; 6100, fixing mechanism; 6101, bottom plate; 6102, support rod; 6103, suction cup; 6104, vacuum tube joint; 6200, lifting mechanism; 6201, lifting drive member; 6202, driving synchronous pulley; 6203, lead screw; 6204, driven synchronous pulley; 6205, synchronous belt; 6206, lead screw nut; 6207, lifting lock plate; 6208, lifting support ring; 6209, support ring; 6210, wafer support plate; 6211, positioning step; 6212, roller; 6213, annular groove; 6300, adjustment mechanism; 6301, rotating base; 6302, rotating drive member; 6303, driving gear; 6304, rotating ring sleeve; 6305, driven gear ring; 6306, driving guide sleeve; 6307, rotating guide post; 6400, detection mechanism; 6401, alignment inductor; 6402, induction light column; 6500, interlocking mechanism; 6501, valve body; 6502, valve cavity; 6503, first interface; 6504, second interface; 6505, piston valve; 6506, piston rod; 6507, spring. Detailed implementation manners

[0026] The following will further describe the present application in detail Figures 1-5 in conjunction with the attached drawings.

[0027] In the description of the present application, it should be noted that the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation to the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0028] In the description of the present application, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", "connected to" shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0029] The embodiment of the present application discloses an automatic laser solder ball welding device for wafers based on visual positioning and detection.

[0030] Please refer to Figures 1 to 5 , in an implementation manner of the present application, the automatic laser solder ball welding device for wafers based on visual positioning and detection includes a platform 3000, and the platform 3000 is made of marble. The marble has undergone natural aging treatment, and its internal stress is almost zero. Therefore, its material is stable, its organizational structure is precise, its texture is uniform, it will not be deformed by conventional factors, and its flatness tolerance can reach a very high standard. It can be used as a high-precision reference surface, which is conducive to ensuring the accuracy and consistency of the welding work.

[0031] During the working process, the platform 3000 made of marble has high compressive strength and can withstand large pressure and impact force during the operation of the device, which is conducive to ensuring the structural stability and providing a solid support for the welding operation. At the same time, it also has good wear resistance and corrosion resistance, with a smooth surface and small roughness, and it is not easy to wear after long-term use, thereby reducing the accuracy reduction and equipment failure caused by wear. In addition, the platform 3000 made of marble has no magnetic reaction. As a non-metallic material, it will not generate magnetic interference, which is very important for welding magnetic-sensitive objects such as microelectronic components and is conducive to ensuring the welding quality.

[0032] Please refer to Figures 1 to 5, in an embodiment of the present application, a mounting bracket 3001 is fixedly connected to the platform 3000. The mounting bracket 3001 is arranged in an arch shape. A first slide rail 3003 is arranged on the mounting bracket 3001 along a first direction. A mounting plate 3004 is slidably connected to the first slide rail 3003. A vision positioning detection device 4000 and a laser solder ball welding device 5000 are mounted on the mounting plate 3004. A second slide rail 3005 is arranged on the platform 3000 along a second direction. The first direction is perpendicular to the second direction. A mounting seat 3002 is slidably connected to the second slide rail 3005. A positioning and fixing device 6000 for automatically calibrating and fixing the wafer product 6001 is mounted on the mounting seat 3002.

[0033] During the working process, after the wafer product 6001 is placed on the positioning and fixing device 6000, the positioning and fixing device 6000 can automatically adjust the position of the wafer product 6001 and fix it after the position is adjusted. The vision positioning detection device 4000 will take pictures through camera vision, so as to obtain the accurate positioning coordinates of the wafer product 6001. By controlling the mounting plate 3004 and the mounting seat 3002 to move relatively in the first direction and the second direction respectively, the laser solder ball welding device 5000 can perform laser ball spraying processing on the wafer product 6001 according to the accurate positioning coordinates of the wafer product.

[0034] In a specific embodiment of the present application, the laser solder ball welding device 5000 can adopt the application number 202411535084.9 and the invention name is a laser heating type soldering equipment. This laser heating type soldering equipment uses laser to directly heat the spherical solder. The spherical solder directly completes the processes of heating, melting, and re-solidifying on the surface of the solder pad, and there is no need to pre-place a soldering agent (flux) on the surface of the solder pad. This not only reduces the equipment and processes for applying the flux, but also ensures the welding quality, and reduces the equipment and processes for cleaning the flux.

[0035] Please refer to Figures 1 to 5 , in a specific embodiment of the present application, the positioning and fixing device 6000 includes a fixing mechanism 6100, a lifting mechanism 6200, an adjustment mechanism 6300, a detection mechanism 6400, and a controller; the controller is electrically connected to the fixing mechanism 6100, the lifting mechanism 6200, the adjustment mechanism 6300, and the detection mechanism 6400 respectively; a notch 6002 for the detection mechanism 6400 to detect is opened on the wafer product 6001, and an interlocking mechanism 6500 is arranged between the fixing mechanism 6100 and the lifting mechanism 6200.

[0036] The implementation principle of the wafer automatic laser solder ball welding equipment based on visual positioning and detection in the embodiments of the present application is as follows: First, the controller controls the lifting mechanism 6200 to rise, and then the wafer product 6001 is placed on the lifting mechanism 6200. The controller then controls the adjustment mechanism 6300 to drive the wafer product 6001 to rotate through the lifting mechanism 6200, and at the same time controls the detection mechanism 6400 to detect the wafer product 6001. When the detection mechanism 6400 detects the notch 6002 on the wafer product 6001, the rotation stops. The controller then controls the lifting mechanism 6200 to descend, and at the same time controls the fixing mechanism 6100 to operate. When the lifting mechanism 6200 descends to the set height, the wafer product 6001 will be fixed on the fixing mechanism 6100.

[0037] This design coordinates the actions of each mechanism through the controller, and uses the detection mechanism 6400 to detect the notch 6002 on the wafer product 6001 to determine the position. The positioning accuracy of this method is much higher than that during manual placement. Manual placement mainly relies on the vision and experience of the operator to determine the position, with a large error range, and there may be deviations of several millimeters or even larger. The automated system can be accurate to the micron level. For the wafer product 6001 that requires high-precision positioning, this precise positioning can better meet the requirements of subsequent complex processes. During the fixing process, the controller precisely controls the lifting mechanism 6200 to descend to the set height, so that the wafer product 6001 is fixed to the fixing mechanism 6100. The mechanical action is precise, which can ensure that the wafer is uniformly stressed and the position is stable, avoiding problems such as displacement and uneven pressure caused by uneven force and inaccurate clamping position when using a fixture manually. At the same time, the automated process also reduces cumbersome and time-consuming steps such as finding a fixture and adjusting the position during manual fixing, significantly improving production efficiency, which is particularly prominent in large-scale production, and effectively solves the problems of fixing and positioning the wafer in the wafer-level packaging process of existing laser welding equipment.

[0038] Please also refer to Figures 1 to 5 , in a specific implementation manner of the present application, the fixing mechanism 6100 includes a bottom plate 6101, the bottom plate 6101 is fixedly connected to the mounting base 3002, four vertically arranged and juxtaposed support rods 6102 are fixedly connected to the bottom plate 6101, a suction cup 6103 is fixedly and hermetically connected to the top of the support rod 6102, a vacuum tube joint 6104 fixedly and hermetically connected to the suction cup 6103 is arranged at a position near the top of the outer side of the support rod 6102, the four vacuum tube joints 6104 are all interconnected, and are connected to a vacuum pump through an interlock mechanism 6500, and the vacuum pump is electrically connected to the controller.

[0039] During the working process, when the controller controls the lifting mechanism 6200 to descend to the set height, the wafer product 6001 contacts the suction cup 6103. At this time, the controller makes the vacuum pump communicate with the vacuum tube joint 6104 through the interlock mechanism 6500, and the vacuum pump starts to work, evacuating the inside of the suction cup 6103, so that the air pressure inside the suction cup 6103 decreases. Due to the existence of the external atmospheric pressure, under the action of the air pressure difference, the wafer product 6001 is tightly adsorbed on the suction cup 6103, thereby realizing the fixation of the wafer product 6001. The interlock mechanism 6500 is used to ensure the safe and reliable connection between the vacuum pump and the vacuum tube joint 6104. Only when the lifting mechanism 6200 descends in place, will it be allowed to establish a connection between the vacuum pump and the vacuum tube joint 6104, preventing air extraction at inappropriate times from causing equipment failures or abnormal adsorption.

[0040] This design uses the method of suction cup adsorption to fix the wafer product 6001, avoiding physical damage to the wafer that may be caused by traditional mechanical fixtures, such as scratches and indentations. Because the suction cup and the wafer product 6001 are adsorbed through the air pressure difference, the contact process is relatively gentle. As long as the surface of the suction cup is flat and clean, it will not cause mechanical damage to the wafer surface, which is very important for the high-precision and high-value wafer product 6001. At the same time, multiple vertically arranged suction cups 6103 in parallel can enable the wafer product 6001 to receive a relatively uniform adsorption force during the fixation process. Compared with single-point or local fixation methods, this uniform force can better maintain the flatness of the wafer. Moreover, the vacuum pump is electrically connected to the controller, enabling the entire adsorption and fixation process to be conveniently incorporated into the automated control system. The controller can accurately control operations such as the start, stop, and air extraction degree of the vacuum pump according to preset programs and parameters. For example, according to factors such as the size and weight of the wafer product 6001, adjust the air extraction time and air extraction intensity to achieve precise adsorption and fixation, further improving the automation level and working efficiency of the entire equipment.

[0041] Please refer to Figures 1 to 5 In a specific embodiment of the present application, the lifting mechanism 6200 includes a lifting drive member 6201 fixedly installed on the bottom plate 6101. The lifting drive member 6201 is electrically connected to the controller. Four vertically arranged lead screws 6203 are rotatably connected to the bottom plate 6101. A synchronous transmission component is connected between the lifting drive member 6201 and the lead screws 6203. A lead screw nut 6206 is fitted on the lead screw 6203. The lead screw nuts 6206 are respectively fixedly installed on two symmetrically arranged lifting lock plates 6207. A lifting support ring 6208 is fixedly installed on the lifting lock plate 6207. A support ring 6209 is rotatably connected to the lifting support ring 6208. A plurality of wafer support plates 6210 are fixedly installed on the support ring 6209. Positioning steps 6211 corresponding to the wafer product 6001 are provided on the wafer support plates 6210.

[0042] During the working process, when the controller issues an instruction to the lifting driving member 6201, since the lifting driving member 6201 is electrically connected to the controller, the lifting driving member 6201 starts to operate. The power of the lifting driving member 6201 is transmitted to the vertically arranged lead screws 6203 in parallel through the synchronous transmission assembly, causing the lead screws 6203 to rotate. The function of the synchronous transmission assembly is to ensure that each lead screw 6203 can rotate synchronously, ensuring the consistency of subsequent actions. When the lead screw 6203 rotates, the lead screw nut 6206 installed in cooperation with it will perform a linear motion along the axial direction of the lead screw 6203. Since the lead screw nuts 6206 are respectively fixedly installed on two symmetrically arranged lifting lock plates 6207, the linear motion of the lead screw nuts 6206 will drive the lifting lock plates 6207 to perform lifting and lowering motions synchronously. As the lifting lock plates 6207 move up and down, the lifting support rings 6208 fixedly installed on the lifting lock plates 6207 will also move up and down accordingly. The support rings 6209 rotatably connected to the lifting support rings 6208 and several wafer support plates 6210 fixedly installed on the support rings 6209 will also perform lifting and lowering actions together. When it is necessary to place the wafer product 6001, the lifting mechanism 6200 rises, lifts the wafer support plate 6210 to a suitable position, and then places the wafer product 6001 on the wafer support plate 6210. The positioning steps 6211 provided on the wafer support plate 6210 can position the wafer product 6001, restricting the displacement of the wafer product 6001 in the plane and enabling it to be accurately placed at a predetermined position, facilitating subsequent operations such as rotation and detection.

[0043] This design adopts a lead screw drive method to achieve high-precision linear motion, with relatively high transmission accuracy, and can accurately control the lifting height. This is very crucial for objects such as the wafer product 6001 that have extremely high requirements for position accuracy, and can accurately send the wafer product 6001 to the required height position, ensuring that the wafer product 6001 does not have motion interference with the fixed mechanism 6100 during the detection and adjustment processes, which helps to improve the accuracy and stability of the entire process. At the same time, the positioning steps 6211 on the wafer support plate 6210 provide a precise positioning function for the wafer product 6001. When placing the wafer product 6001, operators or automated equipment can quickly and accurately place the wafer in place based on the positioning steps 6211, reducing the position deviation during the placement process and improving the efficiency and accuracy of wafer positioning.

[0044] Please also refer to Figures 1 to 5 , in a specific embodiment of the present application, the synchronous transmission assembly includes a driving synchronous pulley 6202, the driving synchronous pulley 6202 is fixedly installed on the lifting driving member 6201, a driven synchronous pulley 6204 is fixedly connected to the lead screw 6203, and a synchronous belt 6205 is drivingly connected between the driven synchronous pulley 6204 and the driving synchronous pulley 6202.

[0045] During operation, when the lifting drive 6201 receives the operation command from the controller and starts to work, the driving synchronous pulley 6202 will rotate along with the lifting drive 6201 because the driving synchronous pulley 6202 is fixedly mounted on the output shaft of the lifting drive 6201. When the driving synchronous pulley 6202 rotates, the driven synchronous pulleys 6204 are driven to rotate through the synchronous belt 6205 connected thereto. The driven synchronous pulley 6204 is fixedly connected to the screw rod 6203, so that the rotation of the driven synchronous pulley 6204 will drive the screw rod 6203 to rotate synchronously, and then the screw nut 6206 matched with the screw rod 6203 will move linearly along the axial direction of the screw rod 6203, and finally realize the lifting action of the entire lifting mechanism. In addition, due to the presence of the synchronous belt 6205, each driven synchronous pulley 6204 can receive power transmitted from the active synchronous pulley 6202 at the same time, ensuring the synchronization of the rotation of multiple screw rods 6203, thereby ensuring that the lifting and lowering actions of all parts of the entire lifting mechanism are coordinated and consistent.

[0046] The design adopts synchronous belt drive with accurate transmission ratio. Under normal working conditions, the speed ratio between the active synchronous pulley 6202 and the driven synchronous pulley 6204 can be kept constant, which enables the rotation speed of the screw rod 6203 to be precisely controlled, thereby ensuring the displacement accuracy of the lifting lock plate driven by the screw nut 6206 during the lifting process.

[0047] Please refer to Figures 1 to 5 In a specific embodiment of the present application, the lifting drive 6201 is configured as a stepper motor, and the operation of the stepper motor is based on a fixed step angle, and each time a pulse signal is received, it will rotate a fixed angle. This enables it to achieve highly consistent positioning in multiple lifting operations.

[0048] During the working process, when the wafer needs to be lifted to a specific height for inspection, each time the operation is performed, as long as the number of control pulses is the same, the stepper motor can accurately send the wafer to the same position, ensuring the repeatability of positioning, which is crucial for quality stability in mass production. Moreover, stepper motors can usually adopt open-loop control, without the need for complex feedback devices such as encoders. This makes the motor control system relatively simple, reducing hardware costs and system complexity. In wafer processing equipment, a simple control system is not only easy to install and debug, but also reduces the probability of failure and improves the reliability and stability of the equipment.

[0049] Please refer to Figures 1 to 5, in a specific embodiment of the present application, the adjustment mechanism 6300 includes a rotating base 6301, the rotating base 6301 is fixedly installed on the bottom plate 6101, a rotating driving member 6302 is fixedly installed on the rotating base 6301, the rotating driving member 6302 is electrically connected to the controller, a driving gear 6303 is fixedly installed on the rotating driving member 6302, a rotating ring sleeve 6304 is rotatably connected to the rotating base 6301, a driven gear ring 6305 is fixedly connected to the rotating ring sleeve 6304, the driven gear ring 6305 meshes with the driving gear 6303, four driving guide sleeves 6306 evenly distributed in a ring shape are fixedly connected to the rotating ring sleeve 6304, a rotating guide post 6307 is slidably connected inside the driving guide sleeve 6306, and the rotating guide post 6307 is fixedly installed on the support ring 6209.

[0050] During the working process, when the controller issues an operation instruction to the rotating driving member 6302, since the rotating driving member 6302 is electrically connected to the controller, the rotating driving member 6302 starts to work. When the rotating driving member 6302 rotates, the driving gear 6303 fixedly installed on it also rotates synchronously. The rotation of the driving gear 6303 drives the driven gear ring 6305 to rotate. And the driven gear ring 6305 is fixedly connected to the rotating ring sleeve 6304, so the rotation of the driven gear ring 6305 drives the rotating ring sleeve 6304 to rotate around the central axis of the rotating base 6301 together. A plurality of driving guide sleeves 6306 are fixedly connected to the rotating ring sleeve 6304, a rotating guide post 6307 is slidably connected inside the driving guide sleeve 6306, and the rotating guide post 6307 is fixedly installed on the support ring 6209. When the rotating ring sleeve 6304 rotates, due to the connection relationship between the driving guide sleeve 6306 and the rotating guide post 6307, it drives the support ring 6209 and the wafer tray 6210 fixedly installed on the support ring 6209 and carrying the wafer product 6001 to rotate together.

[0051] Please refer to Figures 1 to 5 , in a specific embodiment of the present application, the rotating driving member 6302 is configured as a servo motor, and an encoder is installed inside the servo motor. The encoder inside the servo motor can accurately detect the position information of the motor rotor and feedback it to the controller. This enables the controller to accurately control the rotation angle of the servo motor according to the preset program.

[0052] During the working process, when the controller issues a start rotation instruction, the servo motor can quickly reach the preset rotation speed, reducing the waiting time and improving the working efficiency. Similarly, when it is necessary to stop rotating, it can quickly brake and accurately stop at the target position. Ensuring the positioning accuracy when positioning the wafer product 6001.

[0053] Please refer to Figures 1 to 5, in a specific embodiment of the present application, the detection mechanism 6400 includes an alignment sensor 6401. The alignment sensor 6401 is fixedly installed on the fixing mechanism 6100. An induction light column 6402 can be emitted from the alignment sensor 6401, and the position of the induction light column 6402 corresponds to the notch 6002.

[0054] During the working process, when the wafer product 6001 starts to rotate under the combined action of the lifting mechanism 6200 and the adjustment mechanism 6300, the alignment sensor 6401 continuously emits the induction light column 6402. The induction light column 6402 will irradiate on the edge part of the wafer product 6001. Since the position of the induction light column 6402 is pre-set to correspond to the notch 6002, when the wafer rotates to the notch 6002 just located in the optical path of the induction light column 6402, it will cause a change in the signal of the induction light column 6402. This signal change will be detected by the alignment sensor 6401, thereby determining the position of the notch 6002 of the wafer product 6001, and then realizing the precise alignment of the wafer.

[0055] This design can achieve high-precision notch positioning through the corresponding detection method of the induction light column 6402 and the notch 6002. In semiconductor manufacturing, the notch position of the wafer is an important reference point for determining the direction and position of the wafer. This precise positioning method can ensure that the wafer can be operated in the correct direction and position during subsequent processing, which helps to improve the processing accuracy and ensure the performance and quality of the chip. At the same time, using the induction light column 6402 for detection belongs to a non-contact detection method. This avoids direct contact between the detection mechanism and the wafer product 6001, and will not cause physical damage such as scratches or contamination to the wafer surface. For high-precision wafer processing, maintaining the integrity and cleanliness of the wafer surface is crucial, and non-contact detection effectively reduces the risk of product damage.

[0056] Please refer to Figures 1 to 5 , in a specific embodiment of the present application, the wafer carrier 6210 is made of a transparent material. For example: aluminum nitride ceramic, transparent acrylic material, quartz glass, etc. The wafer carrier 6210, as a component for carrying the wafer product 6001, is made of a transparent material mainly to facilitate relevant detection and operations.

[0057] During the working process, when the induction light column 6402 emitted by the detection mechanism 6400 irradiates on the wafer product 6001, the transparent wafer carrier 6210 will not block the induction light column 6402, and can ensure that the induction light column 6402 passes through the wafer carrier 6210 smoothly to detect the notch 6002 on the wafer, ensuring the normal development of detection and positioning work.

[0058] In a specific embodiment of the present application, the wafer carrier 6210 is preferably made of aluminum nitride ceramic. The single crystal state of aluminum nitride ceramic is colorless and transparent, with high thermal conductivity, between 170 - 210 W / (m·K), and the single crystal is even higher than 275 W / (m·K). Its thermal expansion coefficient matches that of semiconductor materials such as Si and GaAs. It has excellent electrical properties, good mechanical properties, can be sintered under normal pressure, and the sublimation decomposition temperature under normal pressure reaches 2450 °C, with strong high-temperature resistance.

[0059] During the working process, the high thermal conductivity of the aluminum nitride ceramic helps to better control the temperature of the wafer product 6001 during processing, ensuring the stability of its process; the thermal expansion coefficient matching that of semiconductor materials can reduce the stress problem between the wafer product 6001 and the wafer carrier 6210 caused by thermal expansion and contraction, reducing the risk of wafer deformation or damage; the excellent electrical properties enable it not to interfere with detection signals or processing electric fields, etc. in the links involving electrical detection or processing; the good mechanical properties can ensure that the carrier is not easily damaged during long-term use, which is beneficial to ensuring the service life of the wafer carrier 6210.

[0060] Please also refer to Figures 1 to 5 , in a specific embodiment of the present application, the interlocking mechanism 6500 includes a valve body 6501. A valve cavity 6502 is formed inside the valve body 6501 along the lifting direction of the lifting mechanism 6200. A first interface 6503 and a second interface 6504 communicating with the valve cavity 6502 are formed on the valve body 6501 along the lifting direction of the lifting mechanism 6200. The first interface 6503 is connected to a vacuum pump, and the second interface 6504 is connected to a vacuum tube joint 6104. A piston valve 6505 is hermetically and slidably connected inside the valve cavity 6502. A piston rod 6506 is fixedly connected to the piston valve 6505. The piston rod 6506 penetrates the end of the valve body 6501 and is hermetically and slidably connected to the valve body 6501. A spring 6507 is abutted and connected between the end of the piston valve 6505 away from the piston rod 6506 and the inner end of the valve body 6501. The valve body 6501 is fixedly installed on the fixing mechanism 6100, and the piston rod 6506 elastically abuts against the lifting lock plate 6207.

[0061] During the working process, when the lifting mechanism 6200 ascends, the lifting lock plate 6207 also ascends accordingly. Due to the action of the spring 6507, the spring 6507 will push the piston valve 6505 and the piston rod 6506 upward. After the piston valve 6505 ascends, it will first block the first interface 6503, making the first interface 6503 and the second interface 6504 in a disconnected state, that is, the vacuum pump and the vacuum tube joint 6104 are not connected. Then, as the piston valve 6505 continues to ascend, the space of the valve cavity 6502 above the piston valve 6505 will be compressed, and the compressed air will pass through the second interface 6504 and the vacuum tube joint 6104 to convert the suction cup 6103 from a negative pressure state to a positive pressure state, so that the suction cup 6103 can be more easily separated from the wafer product 6001. In this way, it can be avoided that during the ascending process of the lifting mechanism 6200, the wafer product 6001 is deformed or damaged due to the failure to separate from the suction cup 6103.

[0062] This design can easily separate the wafer product 6001 from the suction cup 6103 by converting the suction cup 6103 from a negative pressure state to a positive pressure state, avoiding damage caused by forcibly pulling the wafer due to the failure to release the adsorption force in time, and greatly improving the integrity and yield rate of the wafer in the entire processing flow.

[0063] Please also refer to Figures 1 to 5 , in a specific embodiment of the present application, a plurality of annularly and evenly distributed rollers 6212 are rotatably connected to the lifting support ring 6208, and a ring groove 6213 is correspondingly formed on the support ring 6209 for the rollers 6212, and the rollers 6212 are in rolling connection with the ring groove 6213.

[0064] During the working process, when the adjustment mechanism 6300 drives the support ring 6209 to rotate, since the rollers 6212 are in rolling connection with the ring groove 6213 on the support ring 6209, the rotational movement of the support ring 6209 will drive the rollers 6212 to roll in the ring groove 6213. At the same time, the rollers 6212 are rotatably connected to the lifting support ring 6208, which enables the support ring 6209 to rotate smoothly relative to the lifting support ring 6208. And the mutual cooperation between the rollers 6212 and the ring groove 6213 can also axially limit the support ring 6209, further ensuring the stability of the support ring 6209 during rotation.

[0065] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereby. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A wafer automatic laser solder ball welding device based on visual positioning and detection, characterized in that: The invention comprises a platform (3000), a mounting frame (3001) is fixedly connected to the platform (3000), a visual positioning detection device (4000) and a laser solder ball welding device (5000) are arranged on the mounting frame (3001), a mounting seat (3002) is slidably connected to the platform (3000), and a positioning fixing device (6000) for automatically calibrating and fixing a wafer product (6001) is installed on the mounting seat (3002); the positioning fixing device (6000) comprises a fixing mechanism (6100), a lifting mechanism (6200), an adjustment mechanism (6300), a detection mechanism (6400) and a controller; the controller is respectively connected to The fixing mechanism (6100), the lifting mechanism (6200), the adjustment mechanism (6300), and the detection mechanism (6400) are electrically connected; a notch (6002) for detection by the detection mechanism (6400) is provided on the wafer product (6001); an interlocking mechanism (6500) is provided between the fixing mechanism (6100) and the lifting mechanism (6200); the fixing mechanism (6100) comprises a bottom plate (6101), the bottom plate (6101) is fixedly connected to the mounting seat (3002), a plurality of support rods (6102) arranged vertically in parallel are fixedly connected to the bottom plate (6101), the support rods (6102) are arranged vertically in parallel, and the support rods (6101) are provided in a plurality of ways to prevent the wafer product (6001) from being damaged. 2) is fixedly and sealedly connected to the top of the support rod (6102), a vacuum pipe joint (6104) fixedly and sealedly connected to the suction cup (6103) is arranged on the outer side of the support rod (6102) near the top thereof, the vacuum pipe joint (6104) is connected to a vacuum pump through the interlocking mechanism (6500), and the vacuum pump is electrically connected to the controller; the lifting mechanism (6200) comprises a lifting drive member (6201) fixedly mounted on the bottom plate (6101), the lifting drive member (6201) is electrically connected to the controller, and a plurality of vertically arranged screw rods (6203) are rotatably connected to the bottom plate (6101), and the lifting drive member (6201) is electrically connected to the controller. A synchronous transmission assembly is connected between the moving part (6201) and the screw rod (6203); a screw nut (6206) is mounted on the screw rod (6203); the screw nuts (6206) are respectively and correspondingly fixedly mounted on two symmetrically arranged lifting lock plates (6207); a lifting support ring (6208) is fixedly mounted on the lifting lock plate (6207); a support ring (6209) is rotatably connected to the lifting support ring (6208); a plurality of wafer support plates (6210) are fixedly mounted on the support ring (6209); and a positioning step (6211) is provided on the wafer support plate (6210) corresponding to the wafer product (6001);The interlocking mechanism (6500) comprises a valve body (6501), a valve cavity (6502) is provided inside the valve body (6501) along the lifting direction of the lifting mechanism (6200), a first interface (6503) and a second interface (6504) which are in communication with the valve cavity (6502) are provided on the valve body (6501) along the lifting direction of the lifting mechanism (6200), the first interface (6503) is connected to the vacuum pump, the second interface (6504) is connected to the vacuum pipe joint (6104), and the valve cavity (6502) is sealed and slidably connected inside. A piston valve (6505) is connected, a piston rod (6506) is fixedly connected to the piston valve (6505), the piston rod (6506) passes through the end of the valve body (6501) and is sealed and slidably connected to the valve body (6501), a spring (6507) is abutted and connected between the end of the piston valve (6505) away from the piston rod (6506) and the inner end of the valve body (6501), the valve body (6501) is fixedly mounted on the fixing mechanism (6100), and the piston rod (6506) elastically abuts against the lifting lock plate (6207). ; 2. The wafer automatic laser solder ball welding equipment based on visual positioning and detection according to claim 1 is characterized in that: The synchronous transmission component comprises a driving synchronous pulley (6202), wherein the driving synchronous pulley (6202) is fixedly mounted on the lifting drive member (6201), a driven synchronous pulley (6204) is fixedly connected to the screw rod (6203), and a synchronous belt (6205) is connected between the driven synchronous pulley (6204) and the driving synchronous pulley (6202) for transmission.

3. The wafer automatic laser solder ball welding equipment based on visual positioning and detection according to claim 1 is characterized in that: The adjustment mechanism (6300) comprises a rotating base (6301), wherein the rotating base (6301) is fixedly mounted on the base plate (6101), a rotating driving member (6302) is fixedly mounted on the rotating base (6301), the rotating driving member (6302) is electrically connected to the controller, a driving gear (6303) is fixedly mounted on the rotating driving member (6302), a rotating ring sleeve (6304) is rotatably connected to the rotating base (6301), a driven gear ring (6305) is fixedly connected to the rotating ring sleeve (6304), the driven gear ring (6305) is meshed with the driving gear (6303), a plurality of driving guide sleeves (6306) are fixedly connected to the rotating ring sleeve (6304), a rotating guide column (6307) is slidably connected inside the driving guide sleeve (6306), and the rotating guide column (6307) is fixedly mounted on the support ring (6209).

4. The wafer automatic laser solder ball welding equipment based on visual positioning and detection according to claim 1 is characterized in that: The detection mechanism (6400) comprises an alignment sensor (6401), wherein the alignment sensor (6401) is fixedly mounted on the fixing mechanism (6100), and the alignment sensor (6401) is capable of emitting a sensing light column (6402), wherein the position of the sensing light column (6402) corresponds to the notch (6002).

5. The wafer automatic laser solder ball welding equipment based on visual positioning and detection according to claim 1 is characterized in that: The lifting support ring (6208) is rotatably connected to a plurality of rollers (6212) evenly distributed in an annular shape, and an annular groove (6213) is formed on the support ring (6209) corresponding to the rollers (6212), and the rollers (6212) are rollingly connected to the annular groove (6213).

6. The wafer automatic laser solder ball welding equipment based on visual positioning and detection according to claim 1 is characterized in that: The wafer support plate (6210) is made of transparent material.

7. The wafer automatic laser solder ball welding equipment based on visual positioning and detection according to any one of claims 1 to 6, characterized in that: A first slide rail (3003) is arranged on the mounting frame (3001) along a first direction, a mounting plate (3004) is slidably connected to the first slide rail (3003), and the visual positioning detection device (4000) and the laser solder ball welding device (5000) are both installed on the mounting plate (3004); a second slide rail (3005) is arranged on the platform (3000) along a second direction, and the mounting seat (3002) is slidably connected to the second slide rail (3005), and the first direction is perpendicular to the second direction.

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