Laser grooving apparatus for round crystal processing

Abstract

The application discloses a circular crystal processing laser slotting equipment in the technical field of circular crystal laser processing, which comprises a case, a feeding assembly, a driving assembly, a material guiding assembly and a material collecting box. The feeding assembly is arranged on the case. The feeding assembly comprises a bottom plate, a support frame, a conveying shaft, a conveying belt and partitions. The bottom plate is arranged on the case. The support frame is arranged on the bottom plate. The conveying shaft is rotatably arranged on the support frame. The conveying belt is sleeved on the conveying shaft. The partitions are arranged in multiple groups. The multiple groups of partitions are linearly arranged on the conveying belt. The driving assembly is arranged on the case. The driving assembly is used for pushing the circular crystals with completed slotting to drop. The material guiding assembly is arranged on the case. The material collecting box is movably arranged on the case. In the process of slotting the circular crystals, the circular crystals are quickly and efficiently dropped. The generated chippings in the process of pushing and dropping the circular crystals are pushed and dropped synchronously. The efficiency is improved, and the product quality during the processing of the circular crystals is ensured.

Description

Technical Field

[0001] This invention relates to the technical field of wafer laser processing, and more particularly to a wafer laser grooving device. Background Technology

[0002] Wafers, as circular, thin-film solid-state electronic materials, are meticulously crafted primarily from high-purity silicon or other semiconductor materials, playing an indispensable and fundamental role in the semiconductor manufacturing industry for the production of integrated circuits. Grooving technology, especially laser grooving technology, precisely engraves grooves on the surface of wafers using lasers, significantly improving the efficiency and accuracy of subsequent cutting and processing, becoming a major highlight in advanced manufacturing processes.

[0003] However, the loading and unloading process in current wafer laser grooving technology still faces challenges. While high-tech robotic arms can achieve precise positioning and stable operation, their high cost and cumbersome debugging process limit their widespread application. In contrast, manual operation is less expensive but less efficient, making it difficult to meet the urgent needs of large-scale production.

[0004] Even more challenging is the large amount of debris generated during laser grooving. This debris not only stubbornly adheres to various parts of the equipment but is also extremely difficult to clean. The residue of debris not only threatens the normal operation of the equipment but may also cause a chain reaction in subsequent wafer grooving processes, such as reduced processing accuracy and accelerated equipment wear, seriously affecting production efficiency and product quality. Summary of the Invention

[0005] The present invention aims to at least partially solve one of the technical problems in the related art.

[0006] Therefore, the purpose of this invention is to provide a laser grooving device for wafer processing, which can quickly and efficiently unload the wafer during the grooving process, and simultaneously push away the debris generated during the wafer unloading process, thereby improving efficiency and ensuring product quality during wafer processing.

[0007] To achieve the above objectives, this invention proposes a laser grooving device for wafer processing, comprising a chassis, a feeding assembly, a driving assembly, a guiding assembly, and a collection box. The feeding assembly is mounted on the chassis and includes a base plate, a support frame, a conveyor shaft, a conveyor belt, and partitions. The base plate is mounted on the chassis; the support frame is mounted on the base plate; the conveyor shaft is rotatably mounted on the support frame; the conveyor belt is sleeved on the conveyor shaft; multiple partitions are arranged in a linear array on the conveyor belt; the driving assembly is mounted on the chassis and is used to push the grooved wafers off the chassis; the guiding assembly is mounted on the chassis and is used to limit the movement of the wafers to be grooved; and the collection box is movably mounted on the chassis.

[0008] The laser grooving equipment for wafer processing of the present invention completes the rapid and efficient unloading of wafers during the grooving process, and simultaneously pushes away the debris generated during the wafer unloading process, thereby improving efficiency and ensuring product quality during wafer processing.

[0009] In addition, the laser grooving equipment for wafer processing proposed in the above application may also have the following additional technical features:

[0010] Specifically, the drive assembly includes a drive box, a rotating shaft, a pushing mechanism, a guiding mechanism, a chassis, a material hole, a lifting mechanism, a debris collection mechanism, and a discharge mechanism. The drive box is mounted on the chassis and contains a laser cutter and a drive component. The rotating shaft is located at the output end of the drive component. The pushing mechanism is mounted on the rotating shaft and positioned above the guiding assembly. The guiding mechanism is mounted on the rotating shaft. The chassis is located inside the chassis. Multiple sets of material holes are located on the chassis. The lifting mechanism is movably mounted within the material holes. The debris collection mechanism is mounted on the chassis. The discharge mechanism is located inside the chassis and positioned below the material holes.

[0011] Specifically, the pushing mechanism includes a positioning shaft, an outer pushing plate, and a guide groove, wherein the positioning shaft is disposed on the rotating shaft; the outer pushing plate is disposed on the positioning shaft; and the guide groove is formed on the outer pushing plate.

[0012] Specifically, the guiding mechanism includes an outer frame, a movable pressure plate, a reset component, a fixed shaft, a movable collar, a scraper, and a connecting frame. The outer frame is mounted on the rotating shaft; the movable pressure plate is movably mounted within the outer frame; the reset component is connected at both ends to the outer frame and the movable pressure plate, respectively; the fixed shaft is mounted on the outer frame; the movable collar is rotatably mounted on the fixed shaft; the scraper is mounted on the movable collar; and the connecting frame is connected at both ends to the movable pressure plate and the scraper, respectively.

[0013] Specifically, the lifting mechanism includes a movable top rod, an arc-shaped concave plate, a protrusion, and a buffer component. The movable top rod is movably disposed within the chassis. The arc-shaped concave plate is formed on the movable top rod. The protrusion is disposed within the arc-shaped concave plate. One end of the buffer component is disposed on the bottom wall of the movable top rod, and the other end of the buffer component is connected to the inner wall of the chassis.

[0014] Specifically, the debris collection mechanism includes a debris collection trough and a debris collection cylinder, wherein the debris collection trough is respectively opened on the material guiding assembly and the chassis; the debris collection cylinder is movably disposed on the chassis and is disposed below the debris collection trough.

[0015] Specifically, the unloading mechanism includes a through pipe, a baffle plate, and a collection trough, wherein the through pipe is disposed on the bottom wall corresponding to the material hole; the collection trough is disposed inside the machine housing; the baffle plate is disposed on the collection trough, and the collection box is movably disposed inside the collection trough.

[0016] Specifically, the material guiding assembly includes a processing platform, a support rod frame, and a limiting mechanism, wherein the processing platform is mounted on the chassis; the support rod frame is mounted on the processing platform; and the limiting mechanism is mounted on the support rod frame.

[0017] Specifically, the limiting mechanism includes a hollow sleeve, a guide plate, and a guide tube. The hollow sleeve is disposed on the support frame. There are multiple sets of guide plates, which are arranged in a circular array inside the hollow sleeve. The guide tube is disposed inside the hollow sleeve and is located on the bottom wall of the guide plate.

[0018] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0019] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, wherein:

[0020] Figure 1 This is a schematic diagram of the structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the drive component structure of the present invention;

[0022] Figure 3 This is a schematic diagram of the feeding mechanism of the present invention;

[0023] Figure 4 This is a schematic diagram of the guiding mechanism structure of the present invention;

[0024] Figure 5 This is a schematic diagram of the lifting mechanism structure of the present invention;

[0025] Figure 6 This is a schematic diagram of the material guiding component structure of the present invention;

[0026] Figure 7 This is a schematic diagram of the limiting mechanism structure of the present invention.

[0027] As shown in the figure: 10. Chassis; 20. Feeding assembly; 201. Base plate; 202. Support frame; 203. Conveyor shaft; 204. Conveyor belt; 205. Partition plate; 30. Drive assembly; 301. Drive box; 302. Rotating shaft; 303. Pushing mechanism; 3031. Positioning shaft; 3032. Outer push plate; 3033. Guide groove; 304. Guide mechanism; 3041. Outer frame; 3042. Movable pressure plate; 3043. Reset component; 3044. Fixed shaft; 3045. Movable collar; 3046. Scraper; 3047. Connecting frame; 305. Chassis; 306, Material hole; 307, Lifting mechanism; 3071, Movable top rod; 3072, Arc-shaped concave plate; 3073, Protrusion; 3074, Buffer component; 308, Crushed material collection mechanism; 3081, Crushed material collection trough; 3082, Crushed material collection cylinder; 309, Unloading mechanism; 3091, Through pipe; 3092, Baffle plate; 3093, Collection trough; 40, Material guiding assembly; 401, Processing platform; 402, Support rod frame; 403, Limiting mechanism; 4031, Hollow sleeve; 4032, Guide plate; 4033, Guide tube; 50, Collection box. Detailed Implementation

[0028] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the invention, and should not be construed as limiting the invention. Rather, embodiments of the invention include all variations, modifications, and equivalents falling within the spirit and scope of the appended claims.

[0029] The laser grooving equipment for wafer processing according to an embodiment of the present invention will be described below with reference to the accompanying drawings.

[0030] like Figures 1-7 As shown, the wafer processing laser grooving equipment of this embodiment includes a chassis 10, a feeding assembly 20, a driving assembly 30, a guiding assembly 40, and a collection box 50.

[0031] The feeding assembly 20 is mounted on the chassis 10 and includes a base plate 201, a support frame 202, a conveyor shaft 203, a conveyor belt 204, and a partition plate 205.

[0032] The base plate 201 is mounted on the chassis 10, the support frame 202 is mounted on the base plate 201, and the conveyor shaft 203 is rotatably mounted on the support frame 202. The conveyor belt 204 is sleeved on the conveyor shaft 203, and multiple sets of partitions 205 are arranged in a linear array on the conveyor belt 204.

[0033] It should be noted that a support frame 202 is provided on the base plate 201, and a drive motor is provided on the support frame 202. The conveyor shaft 203 is located on the output end of the drive motor. The drive motor is operated by connecting to a power source via a control switch. The drive motor drives the conveyor shaft 203 to rotate through a reducer, which in turn drives the conveyor belt 204 to rotate. The wafer to be laser-grooved is placed on the conveyor belt 204, and the wafer is separated by a partition 205, so that the wafer is processed one by one during the conveying and processing process.

[0034] Furthermore, in order to ensure that the wafer to be slotted is conveyed on the conveyor belt 204 and falls into the limiting mechanism 403 on the processing platform 40, the conveyor belt 204 is positioned close to the limiting mechanism 403, and the top walls of the conveyor belt 204 and the limiting mechanism 403 are on the same horizontal plane.

[0035] The drive assembly 30 is mounted on the chassis 10 and is used to push the slotted wafer blank. The guide assembly 40 is mounted on the chassis 10 and is used to limit the wafer blank to be slotted. The collection box 50 is movably mounted on the chassis 10.

[0036] It should be noted that during operation, the drive assembly 30 pushes the wafers that fall onto the guide assembly 40. During the pushing process, the slotted wafers are pushed off, while the un-slotted wafers are continuously processed. The slotted wafers fall into the collection box 50 for easy collection and handling.

[0037] Specifically, the laser grooving process for wafers is as follows: the wafer to be grooved is placed on conveyor belt 204, and the wafers are separated on conveyor belt 204 by partitions 205. The wafers are then conveyed and fall onto the guide assembly 40. The drive assembly 30 grooves the wafers, and after grooving, the processed wafers are pushed off into the collection box 50 for easy collection and removal.

[0038] In one embodiment of the present invention, such as Figure 2 As shown, the drive assembly 30 includes a drive box 301, a rotating shaft 302, a pushing mechanism 303, a guiding mechanism 304, a chassis 305, a material hole 306, a lifting mechanism 307, a crushed material collection mechanism 308, and a unloading mechanism 309.

[0039] The drive box 301 is mounted on the chassis 10, and contains a laser cutter and a drive component. A rotating shaft 302 is located at the output end of the drive component. A pushing mechanism 303 is mounted on the rotating shaft 302 and positioned above the guiding assembly 40. A guiding mechanism 304 is also mounted on the rotating shaft 302. A chassis 305 is located inside the chassis 10. Multiple sets of material holes 306 are located on the chassis 305, and a lifting mechanism 307 is movably mounted within each of the material holes 306. A scrap collection mechanism 308 is mounted on the chassis 305, and a discharge mechanism 309 is located inside the chassis 10 and below the material holes 306.

[0040] It should be noted that the laser cutter in the drive box 301 described in this embodiment is existing technology, and the drive component is a stepper motor. The drive component is connected to the power supply through a control switch to operate. The operation of the drive component drives the rotating shaft 302 to rotate. During the rotation of the rotating shaft 302, the guide mechanism 304 rotates synchronously. When the guide mechanism 304 rotates, it cooperates with the lifting mechanism 307 to make the slotted wafer fall downwards. Then the wafer falls from the material guide assembly 40 and the material hole 306 into the unloading mechanism 309 and slides into the collection box 50.

[0041] Furthermore, the pusher mechanism 303 is movably mounted on the surface of the processing platform 401, while the guide mechanism 304 is movably mounted on the surface of the chassis 305. The angle between the pusher mechanism 303 and the guide mechanism 304 is set according to the position of the wafer laser grooving. This ensures that the entire process of wafer grooving, pushing off the processed part, and cleaning debris operates smoothly and with accurate positioning.

[0042] In one embodiment of the present invention, such as Figure 3 As shown, the feeding mechanism 303 includes a positioning shaft 3031, an outer push plate 3032, and a guide groove 3033.

[0043] The positioning shaft 3031 is mounted on the rotating shaft 302, the outer push plate 3032 is mounted on the positioning shaft 3031, and the guide groove 3033 is formed on the outer push plate 3032.

[0044] It should be noted that the positioning shaft 3031 and the rotating shaft 302 are overlapped and fixed together, while the outer push plate 3032 is an incompletely circular plate. The outer diameter of the outer push plate 3032 is the same as the outer diameter of the material guiding assembly 40, and the guide groove 3033 is an arc-shaped groove opened on the outer push plate 3032. The inner diameter of the arc-shaped groove is the same as the outer diameter of the wafer to be processed.

[0045] In one embodiment of the present invention, such as Figure 4 As shown, the guide mechanism 304 includes an outer frame 3041, a movable pressure plate 3042, a reset component 3043, a fixed shaft 3044, a movable collar 3045, a scraper 3046, and a connecting frame 3047.

[0046] The outer frame 3041 is mounted on the rotating shaft 302, and the movable pressure plate 3042 is movably mounted inside the outer frame 3041. The two ends of the reset component 3043 are connected to the outer frame 3041 and the movable pressure plate 3042, respectively. The fixed shaft 3044 is mounted on the outer frame 3041, and the movable collar 3045 is rotatably mounted on the fixed shaft 3044. The scraper 3046 is mounted on the movable collar 3045, and the two ends of the connecting frame 3047 are connected to the movable pressure plate 3042 and the scraper 3046, respectively.

[0047] It should be noted that the rotating shaft 302 synchronously drives the outer frame 3041 to rotate during rotation, and the reset component 3043 is a reset spring. The bottom wall of the movable pressure plate 3042 has rounded corners. During the rotation, the movable pressure plate 3042 first cooperates with the lifting mechanism 307. During the lifting and lowering movement of the lifting mechanism 307, the slotted wafer is pushed onto the guide assembly 40. During the lifting and lowering process of the movable pressure plate 3042, the scraper 3046 moves synchronously through the connecting frame 3047. After passing the lifting mechanism 307, the scraper 3046 slides down and adheres to the chassis 305. During the rotation of the rotating shaft 302, the scraper 3046 scrapes off the debris that falls during the slotting of the wafer and collects it in the debris collection mechanism 308.

[0048] In one embodiment of the present invention, such as Figure 5 As shown, the lifting mechanism 307 includes a movable top rod 3071, an arc-shaped concave plate 3072, a protrusion 3073, and a buffer component 3074.

[0049] The movable top rod 3071 is movably disposed within the chassis 305, the arc-shaped concave plate 3072 is formed on the movable top rod 3071, the protrusion 3073 is disposed within the arc-shaped concave plate 3072, one end of the buffer component 3074 is disposed on the bottom wall of the movable top rod 3071, and the other end of the buffer component 3074 is connected to the inner wall of the chassis 305.

[0050] It should be noted that the movable top rod 3071 is provided with an arc-shaped concave plate 3072, and the protrusion 3073 in the arc-shaped concave plate 3072 is located above the top wall of the chassis 305. The top wall of the protrusion 3073 is provided with a rounded corner that is tangent to the bottom wall of the movable pressure plate 3042.

[0051] In one embodiment of the present invention, such as Figure 2 As shown, the debris collection mechanism 308 includes a debris collection trough 3081 and a debris collection cylinder 3082.

[0052] The material collection trough 3081 is respectively opened on the material guiding assembly 40 and the chassis 305, and the material collection cylinder 3082 is movably arranged on the chassis 305 and is located below the material collection trough 3081.

[0053] It should be noted that the scrap generated after wafer processing falls from the scrap collection tank 3081 and is collected by the scrap collection cylinder 3082, so that the scrap can be easily collected and centrally cleaned.

[0054] In one embodiment of the present invention, such as Figure 2 As shown, the unloading mechanism 309 includes a through pipe 3091, a baffle plate 3092, and a collection trough 3093.

[0055] The passage pipe 3091 is installed on the bottom wall of the corresponding material hole 306, the material collection trough 3093 is installed inside the machine box 10, the baffle plate 3092 is installed on the material collection trough 3093, and the material collection box 50 is movably installed inside the material collection trough 3093.

[0056] It should be noted that after the slotting is completed, the wafer falls downward through the through pipe 3091. The baffle plate 3092 is provided with an inclined plate, so the wafer slides onto the baffle plate 3092 and continues to slide into the collection trough 3093.

[0057] In one embodiment of the present invention, such as Figure 6 As shown, the material guiding assembly 40 includes a processing platform 401, a support rod frame 402, and a limiting mechanism 403.

[0058] The processing platform 401 is mounted on the chassis 10, the support rod frame 402 is mounted on the processing platform 401, and the limiting mechanism 403 is mounted on the support rod frame 402.

[0059] It should be noted that the limiting mechanism 403 is set in multiple groups, and the number of limiting mechanisms 403 is set according to the size of the wafer to be processed.

[0060] In one embodiment of the present invention, such as Figure 7 As shown, the limiting mechanism 403 includes a hollow sleeve 4031, a guide plate 4032, and a guide tube 4033.

[0061] The hollow sleeve 4031 is mounted on the support rod frame 402. There are multiple sets of guide plates 4032, and the multiple sets of guide plates 4032 are arranged in a ring array inside the hollow sleeve 4031. The guide tube 4033 is arranged inside the hollow sleeve 4031 and is located on the bottom wall of the guide plate 4032.

[0062] It should be noted that there are multiple sets of guide plates 4032, and the guide plates 4032 are inclined. The inclination angle of the guide plates 4032 is set according to the outer diameter of the wafer to be slotted. The inner diameter of the guide tube 4033 is smaller than the outer diameter of the wafer.

[0063] Specifically, the steps for slotting the wafer to be processed are as follows:

[0064] The wafer to be slotted is placed on conveyor belt 204, separated by partition 205. The wafer is then conveyed and falls onto limiting mechanism 403. At this time, movable push rod 3071 is pushed up by reset component 3043, pushing the bottom wall of the wafer to the same level as the top wall of processing platform 401. Then, the drive component in drive box 301 is activated. The drive component rotates shaft 302, which in turn rotates guide mechanism 304. Movable pressure plate 3042 in guide mechanism 304 moves and engages with protrusion 3073, causing movable push rod 3071 to fall into hollow sleeve 4031, where it is slotted by laser cutting machine.

[0065] After the wafer grooving is completed, the drive unit is activated again. The rotating shaft 302 operates again, and the movable push rod 3071 moves upward and resets via the buffer component 3074. The movable push rod 3071 then pushes the processed wafer onto the surface of the processing platform 401. During the rotation of the rotating shaft 302, the outer push plate 3032 rotates synchronously. As the guide groove 3033 moves, it carries the grooved wafer through the material hole 306 and onto the baffle plate 3092 via the interconnected pipe 3091. The wafer then falls into the collection trough 3093. The wafer is stored in the collection box 50, and the above steps are repeated for subsequent wafer grooving.

[0066] During the wafer grooving process, debris falls onto the processing platform 401 and is pushed onto the chassis 305 by the outer push plate 3032. Subsequently, the rotating shaft 302 simultaneously rotates the outer frame 3041. The bottom wall of the movable pressure plate 3042 has rounded corners. During its rotation, the movable pressure plate 3042 first cooperates with the lifting mechanism 307. During the lifting and lowering movement of the lifting mechanism 307, the grooved wafer is pushed onto the guide assembly 40. During the lifting and lowering process of the movable pressure plate 3042, the scraper plate 3046 moves synchronously via the connecting frame 3047. After passing the lifting mechanism 307, the scraper 3046 slides down and adheres to the chassis 305. As it rotates with the rotating shaft 302, the scraper 3046 scrapes off the debris that falls during wafer grooving and collects it in the debris collection cylinder 3082. After collecting the debris, the debris collection cylinder 3082 is disassembled and reassembled to clean the mobile phone debris.

[0067] In summary, the laser grooving equipment for wafer processing according to the embodiments of the present invention can quickly and efficiently unload the wafer during the grooving process, and simultaneously push away the debris generated during the wafer unloading process, thereby improving efficiency and ensuring product quality during wafer processing.

[0068] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A laser grooving device for wafer processing, characterized in that, It includes a chassis (10), a feeding assembly (20), a drive assembly (30), a guiding assembly (40), and a collection bin (50), wherein, The feeding assembly (20) is mounted on the chassis (10). The feeding assembly (20) includes a base plate (201), a support frame (202), a conveyor shaft (203), a conveyor belt (204), and a partition plate (205). The base plate (201) is mounted on the chassis (10); The support frame (202) is mounted on the base plate (201); The conveying shaft (203) is rotatably mounted on the support frame (202); The conveyor belt (204) is fitted onto the conveyor shaft (203); The partition (205) is in multiple sets, and the multiple sets of partition (205) are arranged in a linear array on the conveyor belt (204); The drive assembly (30) is mounted on the chassis (10) and is used to push the slotted wafer blank; The drive assembly (30) includes a drive box (301), a rotating shaft (302), a pushing mechanism (303), a guiding mechanism (304), a chassis (305), a material hole (306), a lifting mechanism (307), a scrap collection mechanism (308), and a unloading mechanism (309), wherein, The drive box (301) is mounted on the chassis (10), and the drive box (301) contains a laser cutter and drive components; The rotating shaft (302) is disposed at the output end of the driving component; The pushing mechanism (303) is disposed on the rotating shaft (302) and above the guiding assembly (40); The guide mechanism (304) is disposed on the rotating shaft (302); The chassis (305) is disposed inside the enclosure (10); The material holes (306) are in multiple sets, and the multiple sets of material holes (306) are respectively opened on the chassis (305); The lifting mechanism (307) is movably disposed within the material hole (306); The debris collection mechanism (308) is mounted on the chassis (305); The unloading mechanism (309) is disposed inside the housing (10), and the unloading mechanism (309) is located below the material hole (306); The material guiding assembly (40) is disposed on the chassis (10), and the material guiding assembly (40) is used to limit the wafer to be slotted; The material guiding assembly (40) includes a processing platform (401), a support rod frame (402), and a limiting mechanism (403), wherein, The processing platform (401) is mounted on the chassis (10); The support rod frame (402) is mounted on the processing platform (401); The limiting mechanism (403) is mounted on the support rod frame (402); The collection box (50) is movably mounted on the chassis (10).

2. The laser grooving equipment for wafer processing according to claim 1, characterized in that, The pushing mechanism (303) includes a positioning shaft (3031), an outer pushing plate (3032), and a guide groove (3033), wherein, The positioning shaft (3031) is disposed on the rotating shaft (302); The push plate (3032) is mounted on the positioning shaft (3031); The guide groove (3033) is formed on the push plate (3032).

3. The laser grooving equipment for wafer processing according to claim 1, characterized in that, The guiding mechanism (304) includes an outer frame (3041), a movable pressure plate (3042), a reset component (3043), a fixed shaft (3044), a movable collar (3045), a scraper (3046), and a connecting frame (3047), wherein, The outer frame (3041) is mounted on the pivot (302); The movable pressure plate (3042) is movably disposed within the outer frame (3041); The two ends of the reset component (3043) are respectively connected to the outer frame (3041) and the movable pressure plate (3042). The fixed shaft (3044) is mounted on the outer frame (3041); The movable collar (3045) is rotatably mounted on the fixed shaft (3044); The scraper (3046) is disposed on the movable collar (3045); The two ends of the connecting frame (3047) are respectively connected to the movable pressure plate (3042) and the scraper plate (3046).

4. The laser grooving equipment for wafer processing according to claim 1, characterized in that, The lifting mechanism (307) includes a movable top rod (3071), an arc-shaped concave plate (3072), a protrusion (3073), and a buffer component (3074), wherein, The movable top rod (3071) is movably disposed within the chassis (305); The arc-shaped concave plate (3072) is formed on the movable top rod (3071); The protrusion (3073) is disposed within the arc-shaped concave plate (3072); One end of the buffer component (3074) is disposed on the bottom wall of the movable top rod (3071), and the other end of the buffer component (3074) is connected to the inner wall of the chassis (305).

5. The laser grooving equipment for wafer processing according to claim 1, characterized in that, The debris collection mechanism (308) includes a debris collection trough (3081) and a debris collection cylinder (3082), wherein, The scrap collection trough (3081) is respectively opened on the material guiding assembly (40) and the chassis (305); The debris collection cylinder (3082) is movably mounted on the chassis (305), and the debris collection cylinder (3082) is located below the debris collection trough (3081).

6. The laser grooving equipment for wafer processing according to claim 1, characterized in that, The unloading mechanism (309) includes a through pipe (3091), a baffle plate (3092), and a collection trough (3093), wherein, The through pipe (3091) is disposed on the bottom wall corresponding to the material hole (306); The material collection trough (3093) is located inside the chassis (10); The baffle plate (3092) is disposed on the collection trough (3093), and the collection box (50) is movably disposed within the collection trough (3093).

7. The laser grooving equipment for wafer processing according to claim 1, characterized in that, The limiting mechanism (403) includes a hollow sleeve (4031), a guide plate (4032), and a guide tube (4033), wherein, The hollow sleeve (4031) is mounted on the support rod frame (402); The guide plate (4032) is in multiple sets, and the multiple sets of guide plates (4032) are arranged in a ring array inside the hollow sleeve (4031); The guide tube (4033) is disposed inside the hollow sleeve (4031), and the guide tube (4033) is located on the bottom wall of the guide plate (4032).

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