Pressure-sensitive adhesive tape for processing electronic parts and process for producing electronic parts

Abstract

To provide an adhesive tape for processing an electronic component capable of stably holding a substrate to be processed.SOLUTION: An adhesive tape 10 for processing electronic components includes a base material 11, a mesh layer 12 having a plurality of openings O1, and an adhesive layer 2 disposed on a first surface S1 of the base material 11. The base material has a sea-island structure having a region X that can be cut by water-jet laser processing from the surface on the adhesive layer side of the adhesive tape for processing electronic components and a region Y that cannot be cut by the water-jet laser processing in a plan view as viewed from the S1 of the second surface side opposite to the S2 of the first surface of the base material, in which the region X is an island and the region Y is a sea.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to an adhesive tape for processing electronic components and a method for manufacturing electronic components. [Background technology]

[0002] In a so-called dicing process in which a substrate to be processed is divided into chips, an adhesive tape called a dicing tape is used to protect and fix the substrate to be processed and the chips.

[0003] Recently, a dicing method using a laser guided by a water jet has been proposed, which will be referred to as water jet laser processing hereinafter.

[0004] An adhesive tape usually has a substrate and an adhesive layer. In the case of water jet laser processing, if the substrate is not permeable to water, chipping or chipping due to splashing of water is likely to occur. For example, as described in Patent Documents 1 to 4, in the case of water jet laser processing, a mesh sheet or the like that is permeable to water is used as the substrate constituting the adhesive tape. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 3824874 [Patent Document 2] Patent No. 4087144 [Patent Document 3] Patent No. 5000370 [Patent Document 4] Japanese Patent Application Laid-Open No. 2005-167042 Summary of the Invention [Problem to be solved by the invention]

[0006] The inventors of the present disclosure have found that, although an adhesive tape having a mesh sheet can suppress chipping and chip flying due to water splashing because the mesh sheet has multiple openings, the surface smoothness of the adhesive layer disposed on the mesh sheet may be reduced, and the workpiece substrate may not be held accurately and stably. If the workpiece substrate cannot be held accurately and stably, chip flying and chip chipping may occur during processing.

[0007] The present disclosure has been made in view of the above circumstances, and has as its main object to provide an adhesive tape for processing electronic components that can stably hold a substrate to be processed. [Means for solving the problem]

[0008] One embodiment of the present disclosure provides an adhesive tape for electronic component processing, comprising a substrate and an adhesive layer disposed on a first surface of the substrate, wherein the substrate, in a plan view from a second surface side opposite the first surface of the substrate, has a region X that can be cut by water jet laser processing from the adhesive layer side of the adhesive tape for electronic component processing and a region Y that cannot be cut by water jet laser processing, and the adhesive tape for electronic component processing has a sea-island structure in which the region X is an island and the region Y is a sea.

[0009] Another embodiment of the present disclosure provides a method for manufacturing electronic components, comprising: an attachment step of attaching the above-mentioned adhesive tape for electronic component processing to a first surface of a workpiece substrate; a dicing step of dividing the workpiece substrate into a plurality of chips; and a peeling step of peeling the adhesive tape for electronic component processing from the chips. [Effects of the Invention]

[0010] The present disclosure can provide an adhesive tape for processing electronic components that can stably hold a substrate to be processed. [Brief explanation of the drawings]

[0011] [Figure 1]1A and 1B are a schematic cross-sectional view and a schematic plan view of a substrate illustrating an adhesive tape for processing electronic components according to the present disclosure. [Figure 2] 1A and 1B are a schematic cross-sectional view and a schematic plan view of a substrate illustrating another pressure-sensitive adhesive tape for processing electronic components according to the present disclosure. [Figure 3] 1A and 1B are a schematic cross-sectional view and a schematic plan view of a substrate illustrating another pressure-sensitive adhesive tape for processing electronic components according to the present disclosure. [Figure 4] FIG. 2 is a schematic cross-sectional view illustrating another pressure-sensitive adhesive tape for processing electronic components according to the present disclosure. [Figure 5] FIG. 2 is a schematic cross-sectional view illustrating another pressure-sensitive adhesive tape for processing electronic components according to the present disclosure. [Figure 6] 1A to 1C are process diagrams illustrating a method for manufacturing an electronic component according to the present disclosure. [Figure 7] 1A to 1C are process diagrams illustrating a method for manufacturing an electronic component according to the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0012] Embodiments of the present disclosure will be described below with reference to the drawings and the like. However, the present disclosure can be implemented in many different forms and should not be limited to the description of the embodiments exemplified below. Furthermore, in order to clarify the description, the drawings may schematically show the width, thickness, shape, etc. of each part compared to the actual form, but these are merely examples and should not be interpreted as being limiting. Furthermore, in this specification and each drawing, elements similar to those described above with reference to the previous drawings will be designated by the same reference numerals, and detailed descriptions may be omitted as appropriate.

[0013] In this specification, when describing a mode in which another component is placed on a certain component, the term "above" or "below" includes, unless otherwise specified, both a case in which another component is placed directly above or below a certain component so as to be in contact with the component, and a case in which another component is placed above or below a certain component with another component interposed therebetween. Also, in this specification, when describing a mode in which another component is placed on the surface of a certain component, the term "on the surface" includes, unless otherwise specified, both a case in which another component is placed directly above or below a certain component so as to be in contact with the component, and a case in which another component is placed above or below a certain component with another component interposed therebetween.

[0014] In this specification, the term "sheet" also includes a member called a "film."

[0015] The adhesive tape for processing electronic components and the method for manufacturing electronic components according to the present disclosure will be described below.

[0016] A. Adhesive tape for electronic component processing The adhesive tape for electronic component processing according to the present disclosure comprises a substrate and an adhesive layer disposed on a first surface of the substrate, wherein the substrate, in a plan view from a second surface side opposite to the first surface of the substrate, has a region X that can be cut by water jet laser processing from the adhesive layer side of the adhesive tape for electronic component processing and a region Y that cannot be cut by water jet laser processing, and has a sea-island structure in which the region X is an island and the region Y is a sea.

[0017] Fig. 1(a) is a schematic cross-sectional view showing an example of an adhesive tape for electronic component processing according to the present disclosure. Fig. 1(b) is a schematic plan view of a substrate 1 (substrate 1A of a first specification of a first embodiment) of the adhesive tape for electronic component processing 10 shown in Fig. 1(a), viewed from the second surface S2 side of the substrate 1.

[0018] Fig. 2(a) is a schematic cross-sectional view showing another example of the adhesive tape for processing electronic components according to the present disclosure. Fig. 2(b) is a schematic plan view of the substrate 1 (substrate 1B of the second specification of the first embodiment) of the adhesive tape for processing electronic components 10 shown in Fig. 2(a), as viewed from the second surface S2 of the substrate 1.

[0019] Fig. 3(a) is a schematic cross-sectional view showing another example of the adhesive tape for electronic component processing according to the present disclosure. Fig. 3(b) is a schematic plan view of the substrate 1 (substrate 1C of the second embodiment) of the adhesive tape for electronic component processing 10 shown in Fig. 3(a), as viewed from the second surface S2 side of the substrate 1.

[0020] As illustrated in Figures 1(a), 2(a), and 3(a), the adhesive tape 10 for electronic component processing includes a substrate 1 and an adhesive layer 2 disposed on a first surface S1 of the substrate 1. The substrate 1 has the first surface S1 and a second surface S2 opposing the first surface S1. As illustrated in Figures 1(b), 2(b), and 3(b), the substrate 1, in a plan view from the second surface S2 side of the substrate 1, includes an area X that can be cut by water jet laser processing from the surface of the adhesive layer 2 side of the adhesive tape 10 for electronic component processing, and an area Y that cannot be cut by water jet laser processing from the surface of the adhesive layer 2 side of the adhesive tape 10 for electronic component processing, and has a sea-island structure in which the area X is an island and the area Y is a sea.

[0021] As described above, in conventional water jet laser processing, a mesh sheet is used as the substrate constituting the adhesive tape. The mesh sheet has a plurality of openings, resulting in unevenness on the surface of the mesh sheet. Therefore, the adhesive layer disposed on the mesh sheet may follow the unevenness, resulting in a decrease in the smoothness of the surface of the adhesive layer. As a result, the adhesive tape may not be able to hold the substrate to be processed stably and accurately, which may result in chipping or chip breakage during processing.

[0022] In a mesh sheet used in an adhesive tape, the openings preferably have a certain size from the viewpoint of water permeability. On the other hand, if the openings of the mesh sheet are large, the surface smoothness of the adhesive layer is likely to decrease. Furthermore, in the adhesive layer of an adhesive tape, the thickness of the adhesive layer is limited from the viewpoint of cuttability by water jet laser processing. On the other hand, if the thickness of the adhesive layer is thin, the surface smoothness of the adhesive layer is likely to decrease.

[0023] In contrast, in the adhesive tape for electronic component processing according to the present disclosure, the substrate has an area X that can be cut by water jet laser processing and an area Y that cannot be cut by water jet laser processing, with the area X being an island and the area Y being a sea. Therefore, unlike conventional mesh sheets, the substrate according to the present disclosure does not have openings penetrating the substrate in the thickness direction. This prevents a decrease in smoothness due to the openings, improves the smoothness of the first surface of the substrate, and improves the surface smoothness of the adhesive layer disposed on the first surface of the substrate. Therefore, the adhesive tape for electronic component processing can hold the substrate to be processed stably and accurately. This prevents chipping and chip breakage during processing.

[0024] Furthermore, in the substrate of the present disclosure, region X can be cut by water jet laser processing. Therefore, when water jet laser processing is performed from the adhesive layer side of the adhesive tape for electronic component processing, the adhesive layer is cut, and then region X of the substrate is cut, allowing water to penetrate through the cut portion. This can suppress chipping and chip flying due to water splashing. On the other hand, region Y of the substrate of the present disclosure cannot be cut by water jet laser processing. Furthermore, the substrate has a sea-island structure in which region X is an island and region Y is a sea, and region X is a discontinuous region and region Y is a continuous region. Therefore, region Y of the substrate is not cut during water jet laser processing, and region Y is a continuous region, so the workpiece substrate and chip can be held by the adhesive tape for electronic component processing.

[0025] Therefore, the pressure-sensitive adhesive tape for electronic component processing according to the present disclosure can be suitably used when dicing a substrate to be processed by water jet laser processing.

[0026] Hereinafter, each component of the adhesive tape for processing electronic components according to the present disclosure will be described.

[0027] 1. Base material (1) Area X and Area Y The substrate in the present disclosure has, in a plan view from the second surface side of the substrate, an area X that can be cut by water jet laser processing from the adhesive layer side of the adhesive tape for electronic component processing, and an area Y that cannot be cut by the water jet laser processing.

[0028] In this specification, "region X cuttable by water jet laser processing from the adhesive layer side of the adhesive tape for electronic component processing" refers to a region that can penetrate the substrate in the thickness direction when water jet laser processing is performed on the adhesive tape for electronic component processing from the adhesive layer side of the adhesive tape for electronic component processing. When water jet laser processing is performed on the adhesive tape for electronic component processing from the adhesive layer side of the adhesive tape for electronic component processing, the substrate may be cut continuously or intermittently in region X. In other words, the substrate does not need to be cut in all areas where water jet laser processing is performed. Even if the substrate is cut intermittently, water can pass through the cut portions.

[0029] In addition, in this specification, "area Y that cannot be cut by water jet laser processing from the adhesive layer side of the adhesive tape for electronic component processing" refers to an area that cannot penetrate the substrate in the thickness direction when water jet laser processing is performed on the adhesive tape for electronic component processing from the adhesive layer side of the adhesive tape for electronic component processing.

[0030] Whether a certain region of a substrate can be cut by water jet laser processing from the adhesive layer side of the adhesive tape for electronic component processing, or whether it cannot be cut by water jet laser processing from the adhesive layer side of the adhesive tape for electronic component processing, can be confirmed by the following method. First, water jet laser processing is performed on the adhesive tape for electronic component processing from the adhesive layer side of the adhesive tape for electronic component processing under the following conditions. Next, the adhesive tape for electronic component processing is observed from the substrate side using a digital microscope. If through holes can be confirmed by transmitted light observation at 200x magnification, it is determined that the tape can be cut by water jet laser processing. On the other hand, if through holes cannot be confirmed by transmitted light observation at 200x magnification, it is determined that the tape cannot be cut by water jet laser processing.

[0031] <Condition> Cutting speed: 100mm / s Laser wavelength 532nm Water jet diameter: 40 μm Water pressure: 250 Bar

[0032] The substrate has a sea-island structure in which region X is an island and region Y is a sea in a plan view from the second surface side of the substrate. The sea-island structure is a structure composed of a continuous sea region and discontinuous island regions. In other words, region X is a discontinuous region, while region Y is a continuous region.

[0033] (i) Area X The region X is a region that can be cut by water jet laser processing from the adhesive layer side of the adhesive tape for processing electronic components.

[0034] Examples of means for making region X cuttable by water jet laser processing include a method of reducing the thickness of region X and a method of making region X a region that is absorbent to the laser light used in water jet laser processing.

[0035] When the thickness of region X is reduced, the thickness of region X varies depending on the material constituting region X. Specifically, in a first embodiment of the substrate described below, it is preferable that the thickness of the substrate layer is thin. The thickness of the substrate layer will be described later.

[0036] In the case of a method of making region X a region that is absorptive of the laser light used in water jet laser processing, for example, a method of including a material that is absorptive of the laser light in region X. The material that is absorptive of the laser light will be described later.

[0037] In the above case, specifically, the transmittance of the laser light in the region X of the substrate is 90% or less, or may be 70% or less, or may be 50% or less. If the transmittance is within the above range, the region X can be cut by water jet laser processing. On the other hand, the lower limit of the transmittance of the laser light in the region X of the substrate is not particularly limited.

[0038] The laser light transmittance in region X is measured using a microspectrophotometer. When measuring the laser light transmittance in region X of the substrate, the adhesive layer is removed from the adhesive tape for electronic component processing, and the substrate is taken out. A method for removing the adhesive layer includes dissolving the adhesive layer in a solvent. The solvent that can be used is the same as that contained in the adhesive composition used to form the adhesive layer.

[0039] In this specification, examples of wavelengths of laser light used in water jet laser processing include the 1064 nm wavelength of the fundamental wave of a YAG laser, the 532 nm wavelength of the second harmonic of a YAG laser, and the 355 nm wavelength of the third harmonic of a YAG laser. In recent years, in water jet laser processing, the use of laser light with a shorter wavelength has been considered to reduce the absorption rate in water and increase processing efficiency. Therefore, in this disclosure, it is preferable to use laser light with a wavelength of 532 nm or 355 nm regarding the absorbability or non-absorption of laser light.

[0040] Specifically, in a first embodiment of the substrate described below, the substrate layer preferably has laser light absorption properties, and in a second embodiment of the substrate described below, the filling portion preferably has laser light absorption properties.

[0041] As described below, when the adhesive layer is an energy ray-curable adhesive layer, the energy ray transmittance in region X of the substrate is preferably 50% or more, more preferably 60% or more. If the energy ray transmittance in region X is high within the above range, when the adhesive tape for electronic component processing is irradiated with energy rays from the substrate side to cure the adhesive layer, the energy ray can be irradiated onto the adhesive layer through region X of the substrate. This can prevent poor curing of the adhesive layer. Meanwhile, the energy ray transmittance in region X is, for example, 80% or less, and may be 70% or less. Ultraviolet rays are often used as the energy ray, and the wavelength of the energy ray may be close to the wavelength of the laser light used in water jet laser processing. In such cases, if the energy ray transmittance is within the above range, region X can be cut by water jet laser processing.

[0042] In this specification, the energy ray transmittance refers to the transmittance of the energy ray used to cure the energy ray-curable adhesive layer. For example, when ultraviolet light is used, the energy ray transmittance is preferably an average transmittance at a wavelength of 300 nm or more and 400 nm or less. When ultraviolet light is used and a high-pressure mercury lamp or a light source that reproduces the spectrum of a high-pressure mercury lamp is used, the dominant wavelength of the high-pressure mercury lamp is 365 nm. Therefore, in this case, the energy ray transmittance is preferably the transmittance at a wavelength of 365 nm.

[0043] The energy ray transmittance in region X is measured using a microspectrophotometer. When measuring the energy ray transmittance in region X of the substrate, the adhesive layer is removed from the adhesive tape for processing electronic components, and the substrate is taken out. The method for removing the adhesive layer is as described above.

[0044] The planar shape, size, and arrangement of region X are the same as the planar shape, size, and arrangement of the openings in the mesh layer in the substrate according to a first embodiment described below, or the planar shape, size, and arrangement of the openings in the resin film in the substrate according to a second embodiment described below. The ratio of the area of ​​region X to the total area of ​​region X and region Y is the same as the opening ratio of the mesh layer in the substrate according to the first embodiment, or the opening ratio of the resin film in the substrate according to the second embodiment.

[0045] (ii) Area Y Region Y is a continuous region that is continuously arranged around region X, which is a discontinuous region, in a plan view seen from the second surface side of the substrate. Region Y is preferably arranged in a mesh pattern.

[0046] Region Y is a region that cannot be cut by water jet laser processing from the adhesive layer side of the adhesive tape for processing electronic components.

[0047] Examples of means for making region Y uncuttable by water jet laser processing include increasing the thickness of region Y and making region Y non-absorbent to the laser light used in water jet laser processing.

[0048] When the thickness of region Y is increased, the thickness of region Y varies depending on the material constituting region Y. Specifically, in a first embodiment of the substrate described below, it is preferable that the mesh layer is thick. Also, in a second embodiment of the substrate described below, it is preferable that the resin film having openings is thick. The thickness of the mesh layer and the thickness of the resin film having openings will be described later.

[0049] An example of a method for making region Y non-absorbent to the laser light used in water jet laser processing is to include a method of incorporating a material non-absorbent to laser light into region Y. By making region Y of the substrate non-absorbent to the laser light used in water jet laser processing, region Y of the substrate can be prevented from absorbing the laser light and generating heat. This can prevent the adhesive tape for electronic component processing from breaking during water jet laser processing, or prevent the substrate from becoming brittle during water jet laser processing.

[0050] In this specification, "non-absorbent to the laser light used in water jet laser processing" means either being transparent to the wavelength of the laser light used in water jet laser processing, or being reflective to the wavelength of the laser light used in water jet laser processing.

[0051] Region Y is preferably non-absorbent to the laser light used in water jet laser processing, and more preferably transparent to the wavelength of the laser light used in water jet laser processing.

[0052] Specifically, the transmittance of the laser light in the region Y of the substrate is, for example, 50% or more, or may be 70% or more, or may be 90% or more. On the other hand, the upper limit of the transmittance of the laser light in the region Y of the substrate is not particularly limited.

[0053] The method for measuring the transmittance of the laser light in the region Y varies depending on the material that constitutes the region Y.

[0054] In the case of a substrate of the first specification of the first embodiment described below, in which the mesh layer constituting the substrate is a resin film having a plurality of openings, in the case of a substrate of the second specification of the first embodiment described below, and in the case of a substrate of the second embodiment described below, the transmittance of laser light in region Y is measured using a microspectrophotometer.

[0055] On the other hand, in the case of a substrate of the first specification of the first embodiment described below, in which the mesh layer constituting the substrate is a woven fabric, the transmittance T1 of the laser light in the region Y is calculated by the following formula (1). T1=(T2-A×T3 / 100) / (100-A)×100 (1) In the above formula, T2 represents the transmittance of the laser light through the entire substrate, T3 represents the transmittance of the laser light in the region X, and A represents the opening ratio of the fabric.

[0056] Furthermore, in the above case, when the transmittance of the laser light in region Y is T1 (%), it is preferable that the transmittance in region Y within the range of the wavelength λ of the laser light ±20 nm is within T1 ±2.0%. When the transmission spectrum of region Y of the substrate is obtained based on the transmission spectrum of the entire substrate, if the transmittance in a predetermined wavelength range in the transmission spectrum of region Y of the substrate satisfies the above relationship, it can be said that region Y is non-absorbent to the laser light, that is, does not have an absorption band at the wavelength of the laser light.

[0057] When measuring the laser light transmittance in region Y of the substrate, the adhesive layer is removed from the adhesive tape for processing electronic components, and the substrate is taken out. The method for removing the adhesive layer is as described above.

[0058] Specifically, in a first embodiment of the substrate described below, the mesh layer preferably has non-absorption properties for laser light, and in a second embodiment of the substrate described below, the resin film having openings preferably has non-absorption properties for laser light.

[0059] (2) Pages 1 and 2 As shown in FIGS. 1(a), 2(a), and 3(a), the substrate 1 has a first surface S1 on which the adhesive layer 2 is disposed, and a second surface S2 opposite the first surface S1. In the present disclosure, improving the smoothness of the first surface of the substrate improves the smoothness of the surface of the adhesive layer disposed on the first surface of the substrate. This allows the workpiece substrate to be held stably and accurately. Therefore, the first surface of the substrate is flat. Meanwhile, the second surface S2 of the substrate 1 may have irregularities as shown in FIGS. 1(a) and 2(a), or may be flat as shown in FIG. 3(a).

[0060] As described above, the first surface of the substrate is flat. For example, it is preferable that the maximum height roughness Rz of the first surface of the substrate is equal to or less than the thickness of the adhesive layer. Specifically, the maximum height roughness Rz of the first surface of the substrate is more preferably equal to or less than 20 μm, and particularly preferably equal to or less than 10 μm. The Rz of the first surface of the substrate is measured using a laser microscope in accordance with JIS B0601:2013, and the average value of the measured values ​​at any 10 locations is used.

[0061] (3) Form of substrate The form of the substrate in the present disclosure is not particularly limited as long as the substrate has an area X that can be cut by water jet laser processing from the adhesive layer side of the adhesive tape for processing electronic components and an area Y that cannot be cut by the water jet laser processing, and the first surface of the substrate is flat. For example, the substrate may have, from the adhesive layer side, a base layer and a mesh layer having a plurality of openings (hereinafter referred to as the first embodiment), or the substrate may have a resin film having a plurality of openings and a filling portion disposed in the openings of the resin film (hereinafter referred to as the second embodiment). The first and second embodiments will be described below.

[0062] (3-1) First embodiment 1(a) and 2(a), the substrate 1 in this embodiment has, from the adhesive layer 2 side, a substrate layer 11 and a mesh layer 12 having a plurality of openings O1. In the substrate 1, region X is a region where the openings O1 of the mesh layer 12 are present, and region Y is a region where the openings O1 of the mesh layer 12 are not present.

[0063] In this embodiment, the substrate has a base layer on the adhesive layer side, which improves the smoothness of the first surface of the substrate, thereby improving the surface smoothness of the adhesive layer disposed on the first surface of the substrate. Therefore, the adhesive tape for electronic component processing can hold the substrate to be processed stably and accurately. Furthermore, in this embodiment, region X is the region where openings in the mesh layer are present, and region Y is the region where openings in the mesh layer are not present. Region X is composed of the base layer, and region Y is composed of the base layer and mesh layer. Therefore, during water jet laser processing, the adhesive layer is cut, and then region X composed of the base layer is selectively cut, allowing water to pass through the cut portion. This prevents chipping and chip flying due to water splashing. Meanwhile, region Y composed of the base layer and mesh layer is not cut during water jet laser processing, and the mesh layer remains continuously connected, allowing the adhesive tape for electronic component processing to hold the substrate to be processed and the chip.

[0064] The base material layer and the mesh layer may be separate or integrated. Below, we will explain the first specification in which the base material layer and the mesh layer are separate, and the second specification in which the base material layer and the mesh layer are integrated.

[0065] (3-1-1) First specification 1(a), the base material 1A has, from the adhesive layer 2 side, a base material layer 11 and a mesh layer 12 having a plurality of openings O1, which are separate bodies. In the base material 1A, region X is a region where the openings O1 of the mesh layer 12 are present, and region Y is a region where the openings O1 of the mesh layer 12 are not present.

[0066] The phrase "the base layer and the mesh layer are separate bodies" means that the base layer and the mesh layer are formed as separate layers.

[0067] In this specification, the thickness of region X and region Y in substrate 1A differ depending on whether or not openings O1 are present in mesh layer 12. That is, the thickness of region X, where openings O1 are present in mesh layer 12, is thinner than the thickness of region Y, where openings O1 are not present in mesh layer 12. Therefore, by adjusting the thickness of substrate layer 11 and the thickness of mesh layer 12, it is possible to differentiate the cuttability of regions X and Y by water jet laser processing.

[0068] In addition, in this specification, the cutting properties of area X and area Y by water jet laser processing can be made different by using a material for base layer 11 that is absorbent to the laser used in water jet laser processing and using a material for mesh layer 12 that is not absorbent to the laser used in water jet laser processing.

[0069] (a) Mesh layer (i) Non-absorption of laser light The mesh layer is preferably non-absorbent to the laser light used in water jet laser processing. By making the mesh layer non-absorbent to the laser light, the region where no openings exist in the mesh layer can be made into a region Y that cannot be cut by water jet laser processing.

[0070] Some laser beams are easily absorbed by water, while others are not. Therefore, in water jet laser processing, the use of short-wavelength laser beams is being considered to reduce the absorption rate in water and increase processing efficiency.

[0071] However, in general, the shorter the wavelength of the laser beam, the higher the energy and the higher the absorption rate of the laser beam in a material. Therefore, when a short-wavelength laser beam is used in water jet laser processing, the adhesive tape substrate may break during the water jet laser processing, or the substrate may become brittle during the water jet laser processing, making the substrate more susceptible to breakage in subsequent processes.

[0072] The mesh layer is non-absorbent to the laser light used in water jet laser processing, which prevents the mesh layer from absorbing the laser light and generating heat, thereby preventing the adhesive tape for electronic component processing from breaking during water jet laser processing and preventing the mesh layer from becoming brittle during water jet laser processing.

[0073] The phrase "non-absorbent to the laser light used in water jet laser processing" is as described above. The mesh layer is preferably non-absorbent to the laser light used in water jet laser processing, and more preferably transparent to the wavelength of the laser light used in water jet laser processing.

[0074] The laser light absorption or non-absorption of the mesh layer can be controlled, for example, by adjusting the material of the mesh layer.

[0075] Furthermore, when the material of the mesh layer is non-absorbent to laser light, the mesh layer may be colorless or colored.

[0076] (ii) Shape of the mesh layer Examples of the mesh layer include a resin film having a plurality of openings, a woven fabric, and the like. Among these, a resin film having openings is preferred. In a resin film having openings, the openings tend to be larger than in a woven fabric. If the openings in the resin film are large, the smoothness of the surface of the adhesive layer is likely to decrease if an adhesive layer is disposed on the resin film. Therefore, the present disclosure is useful when a resin film having openings is used. Furthermore, in a resin film having openings, expandability can be imparted by appropriately selecting the material.

[0077] (ii-1) Resin film with openings Examples of materials for the resin film include olefin-based resins, vinyl chloride resins, polyester resins, urethane resins, polystyrene resins, polycarbonate resins, fluororesins, thermoplastic elastomers, and rubber-based materials. Examples of olefin-based resins include low-density polyethylene, high-density polyethylene, polypropylene, polybutene, polymethylpentene, polybutadiene, ethylene-vinyl acetate copolymers, ionomer resins, ethylene (meth)acrylic acid copolymers, and ethylene (meth)acrylic acid ester copolymers. Examples of vinyl chloride resins include polyvinyl chloride and vinyl chloride copolymers. Examples of polyester resins include polyethylene terephthalate and polybutylene terephthalate. Examples of thermoplastic elastomers include olefin-based elastomers, vinyl chloride-based elastomers, polyester-based elastomers, styrene-based elastomers, urethane-based elastomers, acrylic elastomers, and amide-based elastomers. Examples of rubber-based materials include isoprene rubber, butadiene rubber, styrene butadiene rubber, chloroprene rubber, acrylonitrile butadiene rubber, butyl rubber, halogenated butyl rubber, acrylic rubber, urethane rubber, polysulfide rubber, etc. These may be used alone or in combination of two or more.

[0078] The resin film may contain additives as needed, such as plasticizers, antioxidants, light stabilizers, antistatic agents, lubricants, dispersants, and flame retardants.

[0079] The resin film has a plurality of openings penetrating through it in the thickness direction.

[0080] In the resin film, the planar shape of the opening is not particularly limited, and examples thereof include a circle, an ellipse, a triangle, a square, a rectangle, and a hexagon. Among these, the planar shape of the opening is preferably a rounded shape. If the shape has corners, the resin film is more likely to break from the corners. Therefore, a rounded shape can prevent the resin film from breaking. Specifically, the planar shape of the opening is preferably a circle, an ellipse, or a polygon with rounded corners, and more preferably a circle or an ellipse.

[0081] The size of the opening is preferably smaller than the chip size, for example, on the order of millimeters or less. The size of the opening is, for example, 3 mm or less, or may be 2 mm or less, or may be 1 mm or less. If the size of the opening is larger than the above range, the chip may fall into the opening. On the other hand, the size of the opening is preferably, for example, 100 μm or more, preferably 300 μm or more, and more preferably 500 μm or more. The present disclosure is useful when the size of the opening is equal to or greater than a predetermined value. That is, the size of the opening is, for example, 100 μm or more to 3 mm or less, or may be 300 μm or more to 2 mm or less, or 500 μm or more to 1 mm or less.

[0082] The size of the opening is the maximum value of 10 randomly selected openings. The size of the opening is defined according to the shape of the opening in plan view. For example, the size of the opening is the diameter for a circle, the major axis for an ellipse, the diagonal length for a square or rectangle, the maximum height for a triangle, and the maximum diagonal length for a hexagon.

[0083] The openings may be arranged regularly or irregularly. When the openings are arranged regularly, the arrangement of the openings is not particularly limited, and examples thereof include a lattice arrangement and a staggered arrangement.

[0084] The aperture ratio of the resin film is, for example, 30% or more, 40% or more, or 50% or more. On the other hand, the aperture ratio of the resin film is, for example, 80% or less, 70% or less, or 60% or less. That is, the aperture ratio of the resin film is, for example, 30% or more and 80% or less, 40% or more and 70% or less, or 50% or more and 60% or less. In this embodiment, the openings of the mesh layer, i.e., the region X where the openings of the resin film are present, are cut by water jet laser processing, thereby allowing water to pass through. Therefore, if the aperture ratio is equal to or greater than a predetermined value, sufficient water permeability can be obtained. Furthermore, if the aperture ratio is equal to or less than a predetermined value, the adhesive tape for electronic component processing can stably hold the substrate and chips to be processed, even if the openings of the mesh layer, i.e., the region X where the openings of the resin film are present, are cut by water jet laser processing.

[0085] The aperture ratio of a resin film is the ratio of the area of ​​the openings in the resin film in a planar view. The aperture ratio of a resin film is determined by observing the surface of the resin film side of a substrate (a laminate consisting of a substrate layer and a resin film with openings) using a digital microscope and binarizing the image through image processing. Specifically, first, the surface of the resin film is observed using a digital microscope at a predetermined magnification, and a predetermined region is extracted. The magnification is appropriately set depending on the size of the openings in the resin film, for example, 1x to 200x. The size of the predetermined region is large enough to accommodate 5 to 100 openings vertically and horizontally. Next, the image of the predetermined region is subjected to image processing to binarize the image into openings and non-openings. The predetermined region is taken as the area of ​​the entire resin film, and the ratio of openings, i.e., the aperture ratio, is determined. This operation is performed in the same way for 10 randomly selected locations on the surface of the resin film, and the average value is taken as the aperture ratio of the resin film. Commercially available image analysis software or free software, such as Adobe Photoshop, can be used as the image processing software. When the boundary between the openings and non-openings is not clear, image analysis can be facilitated by obtaining a roughness image using a laser microscope.

[0086] The method for forming openings in a resin film is not particularly limited, and examples thereof include punching and laser processing. Another method for forming a resin film having openings is mold printing using gravure printing. In this case, a resin film having openings is formed on a separator by mold printing using gravure printing, and the separator is peeled off to obtain a resin film having openings. In this case, the separator may be used as a substrate layer without being peeled off. Alternatively, a substrate having a substrate layer and a resin film having openings can be obtained by forming a substrate layer on a separator, forming a resin film having openings on the substrate layer by mold printing using gravure printing, and peeling off the separator. Among these, a resin film having openings is preferably formed by mold printing using gravure printing. In this case, the openings tend to be large, and the present disclosure is useful.

[0087] The resin film may be, for example, a single layer or a multilayer.

[0088] The surface of the resin film facing the adhesive layer may be subjected to a surface treatment to improve adhesion to the adhesive layer. The surface treatment is not particularly limited, and examples thereof include corona treatment, plasma treatment, ozone treatment, flame treatment, primer treatment, vapor deposition treatment, and alkali treatment.

[0089] (ii-2) Textiles Examples of textile materials include chemical fibers, natural fibers, and inorganic fibers. Examples of chemical fiber materials include polyolefin, polyester, polyamide, polycarbonate, acrylic resin, polyvinyl chloride, polyurethane, polystyrene, styrene-ethylene-butene copolymer, styrene-ethylene-pentene copolymer, rayon, and cellulose acetate. Examples of polyolefins include polyethylene, polypropylene, polybutene, ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA), ethylene-methyl methacrylate copolymer (EMMA), and ionomer. Examples of polyesters include polyethylene terephthalate. Examples of polyamides include nylon 6, nylon 6,6, nylon 12, and aramid. Examples of natural fiber materials include cotton, silk, and wool. Examples of inorganic fibers include glass fiber and carbon fiber. These may be used alone or in combination.

[0090] The weaving method of the woven fabric is not particularly limited, and examples thereof include plain weave, twill weave, and satin weave.

[0091] The thread may be a monofilament or a multifilament, with a monofilament being preferred because it is less likely to break during water jet laser processing.

[0092] The average diameter of the yarn is, for example, 50 μm to 1000 μm, or may be 75 μm to 500 μm, 100 μm to 300 μm, or 150 μm to 200 μm. If the average diameter of the yarn is equal to or greater than a predetermined value, the fabric can be prevented from being cut or weakened by the pressure of the water jet and the heat of the laser during water jet laser processing. When using yarns with a thin diameter, opening can be prevented by welding the warp and weft yarns. When the yarn is a multifilament yarn, the average diameter of the yarn refers to the average diameter of the multifilament.

[0093] The average diameter of the yarns is the arithmetic mean value of the diameters of 10 randomly selected warp yarns and 10 randomly selected weft yarns. The diameters of the warp yarns and the weft yarns are measured using a digital microscope.

[0094] The opening rate of the woven fabric is, for example, 10% or more, or may be 20% or more, or 30% or more. The opening rate of the woven fabric is, for example, 80% or less, or may be 70% or less, or may be 60% or less. That is, the opening rate of the woven fabric is, for example, 10% or more and 80% or less, or may be 20% or more and 70% or less, or may be 30% or more and 60% or less. When the opening rate is a predetermined value or more, sufficient water permeability can be obtained. When the opening rate is a predetermined value or less, sufficient adhesion to the adhesive layer can be obtained. The method for measuring the opening rate of the woven fabric is the same as the method for measuring the opening rate of the resin film described above.

[0095] The opening between the yarns is preferably smaller than the chip size, for example, on the order of millimeters or less. The opening between the yarns is, for example, 1 μm to 500 μm, or alternatively, 5 μm to 200 μm, or alternatively, 10 μm to 100 μm.

[0096] The opening between threads is the maximum value of the opening between warp threads and the opening between weft threads at 10 randomly selected locations. The opening between warp threads and the opening between weft threads are measured using a digital microscope.

[0097] The surface of the fabric facing the base material layer may be subjected to a surface treatment to improve adhesion to the base material layer. The surface treatment is not particularly limited, and examples thereof include corona treatment, plasma treatment, ozone treatment, flame treatment, primer treatment, and alkali treatment.

[0098] (iii) Thickness The thickness of the mesh layer is preferably such that it cannot be cut by water jet laser processing. The thickness of the mesh layer varies depending on the material and form of the mesh layer, but is, for example, 50 μm or more, or may be 100 μm or more, or 200 μm or more. If the thickness of the mesh layer is within the above range, the mesh layer can be made less susceptible to cutting by water jet laser processing. On the other hand, the thickness of the mesh layer is, for example, 1000 μm or less, or may be 500 μm or less, or may be 300 μm or less. That is, the thickness of the mesh layer is, for example, 50 μm or more to 1000 μm or less, or may be 100 μm or more to 500 μm or less, or may be 200 μm or more to 300 μm or less.

[0099] The thickness of the mesh layer is measured by observing the cut surface of the substrate cut with a razor blade using a digital microscope. When the mesh layer is a resin film with openings, the thickness of the resin film is the distance between the surface of the resin film facing the substrate layer and the surface of the resin film opposite the substrate layer. When the mesh layer is a woven fabric, the thickness of the woven fabric is measured by cutting the area near the intersection of the warp and weft threads parallel to the weft threads, so that the cross section of the warp and weft threads is visible. Then, parallel upper and lower lines (lines tangent to the uppermost wefts in the above range) are drawn for the wefts within the range of 10 warp threads. The upper side refers to the substrate layer side of the woven fabric, and the lower side refers to the side opposite the substrate layer of the woven fabric. The measurement magnification is set at a magnification of 1x to 2000x, depending on the thickness. The average value of the measurements taken at 10 different locations is then used.

[0100] (b) Base material layer The first type of substrate has a substrate layer, which is preferably a resin film.

[0101] (i) Absorption of laser light The substrate layer preferably has absorptivity for the laser light used in water jet laser processing.

[0102] The phrase "having the ability to absorb the laser light used in water jet laser processing" has been described above.

[0103] As a method for controlling the laser light absorption or non-absorption of the substrate layer, for example, a method for adjusting the material of the substrate layer can be mentioned.

[0104] (ii) Energy ray transmittance When the adhesive layer is an energy ray curable adhesive layer, the energy ray transmittance of the base layer is the same as the energy ray transmittance of the region X of the base material described above.

[0105] (iii) Materials When the thickness of region X is reduced to allow region X to be cut by water jet laser processing, the material of the substrate layer is the same as that used for the resin film having openings when the mesh layer is a resin film having openings. In particular, it is preferable that the substrate layer and the mesh layer contain the same type of resin. This can improve the adhesion between the substrate layer and the mesh layer. In this case, the substrate layer and the mesh layer can be directly bonded.

[0106] On the other hand, when region X is made absorbing the laser beam used in water jet laser processing, thereby enabling region X to be cut by water jet laser processing, the substrate layer preferably contains a material absorbing the laser beam. Examples of materials absorbing the laser beam include laser-absorbing resins and laser-absorbing agents. The laser-absorbing resin varies depending on the wavelength of the predetermined laser beam. For example, when the wavelength of the predetermined laser beam is in the ultraviolet region, examples of the laser-absorbing resin include resins having aromatic rings. Examples of the laser-absorbing agent include colorants, organic particles, and inorganic particles. When the substrate layer contains a laser-absorbing agent, the substrate layer further contains a resin. Examples of the resin include polyesters such as polyethylene terephthalate, polyolefins such as polyethylene and polypropylene, and urethane resins. The substrate layer may be colorless or colored. A colored substrate layer improves the absorption of laser beam. When the wavelength of the laser beam is 1064 nm, a substrate layer containing a material absorbing infrared rays at 1064 nm is preferably used. When the wavelength of the laser beam is 532 nm, a light pink substrate layer is preferably used. When the wavelength of the laser light is 355 nm, a light yellow substrate layer is preferably used. However, a black or white substrate layer can also be used as long as the energy ray transmittance is 50% or more.

[0107] (iv) Thickness When the thickness of region X is reduced to enable region X to be cut by water jet laser processing, the thickness of the base layer is, for example, 100 μm or less, or may be 80 μm or less, or may be 70 μm or less. When the thickness of the base layer is within the above range, the base layer is easily cut by water jet laser processing and water permeability can be increased. Therefore, the occurrence of chipping and flying chips due to water splashing during water jet laser processing can be suppressed. On the other hand, the thickness of the base layer is, for example, 20 μm or more, or may be 30 μm or more, or may be 40 μm or more. When the thickness of the base layer is within the above range, the flatness of the first surface of the base material is likely to be good. Specifically, the thickness of the base layer is 20 μm or more and 100 μm or less, or may be 30 μm or more and 80 μm or less, or may be 40 μm or more and 70 μm or less.

[0108] In the above case, the thickness of the mesh layer T is the total thickness T0 of the base layer and the mesh layer. 12 The ratio (T 12 / T0) is, for example, 0.3 or more, may be 0.5 or more, or may be 0.7 or more. 12 / T0) is, for example, 0.95 or less, and may be 0.9 or less. 12 / T0) is 0.3 or more and 0.95 or less, may be 0.5 or more and 0.95 or less, or may be 0.7 or more and 0.9 or less.

[0109] On the other hand, when region X is made cuttable by water jet laser processing by making region X a region that is absorbent to the laser light used in water jet laser processing, the thickness of the base layer is not particularly limited, but may be, for example, 200 μm or less, or may be 100 μm or less. If the thickness of the base layer is within the above range, the base layer is easily cut by water jet laser processing and water permeability can be increased. Therefore, the occurrence of chipping and flying chips due to water splashing during water jet laser processing can be suppressed. On the other hand, the thickness of the base layer is, for example, 20 μm or more, or may be 30 μm or more, or may be 40 μm or more. If the thickness of the base layer is within the above range, the flatness of the first surface of the base material is likely to be good. Specifically, the thickness of the base layer is 20 μm or more to 200 μm or less, or may be 30 μm or more to 200 μm or less, or may be 40 μm or more to 100 μm or less.

[0110] (c) Other layers An adhesive layer may be disposed between the base layer and the mesh layer. The adhesive layer is not particularly limited as long as it does not cause the base layer and the mesh layer to peel off, but if an adhesive layer is present in the X region, it must also be cuttable by water jet laser processing.

[0111] When an adhesive layer is present in region X, the adhesive layer may be made thin so that it can be cut by water jet laser processing, or may be made of a material that is absorbent to the laser light used in water jet laser processing so that it can be cut by water jet laser processing.

[0112] When the adhesive layer is thinned to enable cutting by water jet laser processing, the thickness of the adhesive layer is, for example, 100 μm or less, and may be 50 μm or less. On the other hand, the thickness of the adhesive layer is, for example, 5 μm or more, and may be 10 μm or more. Specifically, the thickness of the adhesive layer may be 5 μm or more and 100 μm or less, and may be 10 μm or more and 50 μm or less.

[0113] When the adhesive layer is made of a material that is absorbent to the laser light used in water jet laser processing, thereby making the adhesive layer cuttable by water jet laser processing, examples of the material that has adhesive properties and absorbs the laser light used in water jet laser processing include materials containing colorants, ultraviolet absorbers, infrared absorbers, etc. Examples of colorants that can be used include organic pigments, inorganic pigments, and dyes.

[0114] (d) Method for preparing the substrate The method for producing the substrate of the first specification of this embodiment is not particularly limited. For example, a method of bonding a substrate layer and a mesh layer via an adhesive layer or a method of thermally welding the substrate layer and the mesh layer can be used. In addition to the above methods, when the mesh layer is a resin film having openings and the resin film having openings is formed by mold printing using gravure printing, other methods include a method of using a separator as the substrate layer, and a method of forming a substrate layer on a separator and then forming a resin film having openings on the substrate layer.

[0115] (3-1-2) Second Specification 2(a), the base material 1B has, from the adhesive layer 2 side, a base material layer 11 and a mesh layer 12 having a plurality of openings O1, and the base material layer 11 and the mesh layer 12 are integrated. In the base material 1B, region X is a region where the openings O1 of the mesh layer 12 are present, and region Y is a region where the openings O1 of the mesh layer 12 are not present.

[0116] The phrase "the substrate layer and the mesh layer are integrated" means that the substrate layer and the mesh layer contain the same material and are formed continuously as one layer. The phrase "the substrate layer and the mesh layer contain the same material" means that when the substrate layer and the mesh layer are analyzed by an analytical instrument, the results are the same, taking into account the error of the analytical instrument.

[0117] In this specification, the thickness of region X and region Y in substrate 1B differ depending on whether or not openings O1 are present in mesh layer 12. That is, the thickness of region X, where openings O1 are present in mesh layer 12, is thinner than the thickness of region Y, where openings O1 are not present in mesh layer 12. Therefore, by adjusting the thickness of substrate layer 11 and the thickness of mesh layer 12, it is possible to differentiate the cuttability of region X and region Y by water jet laser processing.

[0118] The substrate is preferably non-absorbent to the laser beam used in water jet laser processing. Furthermore, the region X of the substrate preferably has the above-described energy ray transmittance. The material of the substrate is not particularly limited, and examples thereof include materials used for resin films having openings when the mesh layer in the substrate of the first specification is a resin film having openings.

[0119] The planar shape, size, and arrangement of the openings in the mesh layer of the base material are the same as those in the first specification base material, and the opening ratio of the mesh layer of the base material is the same as those in the first specification base material.

[0120] The thickness of the base material layer and the thickness of the mesh layer in the base material are the same as the thickness of the base material layer and the mesh layer in the base material of the first specification, respectively.

[0121] The thickness T of the mesh layer relative to the total thickness T0 of the substrate layer and the mesh layer 12 The ratio (T 12 / T0) is the same as the base material of the first specification above.

[0122] The substrate can be produced, for example, by forming irregularities on the surface of a resin film, specifically by embossing.

[0123] (3-2) Second embodiment The substrate 1C in this embodiment has a resin film 13 having a plurality of openings, and a filling portion 14 disposed in the openings of the resin film 13, as shown in FIG. 3(a).

[0124] In this embodiment, the filler is disposed within the opening of the resin film in the substrate, improving the smoothness of the first surface of the substrate and thus the surface smoothness of the adhesive layer disposed on the first surface of the substrate. Therefore, the adhesive tape for electronic component processing can hold the workpiece substrate stably and accurately. Furthermore, in this embodiment, region X is the region where the filler is present, and region Y is the region where no opening of the resin film is present, with region X being composed of the filler and region Y being composed of the resin film. Therefore, during water jet laser processing, the adhesive layer is cut, and then region X composed of the filler is selectively cut, allowing water to pass through the cut portion. This prevents chipping and chip flying due to water splashing. Meanwhile, region Y composed of the resin film is not cut during water jet laser processing, and the resin film remains continuously connected, allowing the adhesive tape for electronic component processing to hold the workpiece substrate and chips.

[0125] (a) Resin film with openings The resin film has a plurality of openings penetrating through it in the thickness direction, and is a member that supports the adhesive layer.

[0126] The resin film having openings is preferably non-absorbent to the laser light used in water jet laser processing. This can prevent the resin film from absorbing the laser light and generating heat. This can prevent the adhesive tape for electronic component processing from breaking during water jet laser processing. Furthermore, it can prevent the resin film from becoming brittle during water jet laser processing.

[0127] The phrase "non-absorbent to the laser light used in water jet laser processing" is as described above. The mesh layer is preferably non-absorbent to the laser light used in water jet laser processing, and more preferably transparent to the wavelength of the laser light used in water jet laser processing.

[0128] The laser light absorption and non-absorption properties of the resin film can be controlled, for example, by adjusting the material of the resin film.

[0129] When the material of the resin film is non-absorbent to laser light, the resin film may be colorless or colored.

[0130] The resin film having openings is the same as the resin film having openings used in the base material of the first specification of the first embodiment.

[0131] (b) Filling section The filling portion in this embodiment is disposed within the opening of the resin film.

[0132] (i) Absorption of laser light The filling portion in this embodiment preferably has an absorptivity for the laser light used in the water jet laser processing.

[0133] The phrase "having the ability to absorb the laser light used in water jet laser processing" has been described above.

[0134] In this embodiment, the laser light absorption and non-absorption properties of the filling portion can be controlled by, for example, adjusting the material of the filling portion.

[0135] (ii) Energy ray transmittance When the adhesive layer is an energy ray curable adhesive layer, the energy ray transmittance of the filling portion in this embodiment is the same as the energy ray transmittance of the region X of the base material described above.

[0136] (iii) Materials The material of the filling portion in this embodiment is the same as the material used for the base layer in the base material of the first specification of the first embodiment described above, when the base layer is absorbent to the laser light used in water jet laser processing. The filling portion may be colorless or colored. A colored filling portion improves the absorption of laser light. When the wavelength of the laser light is 1064 nm, a filling portion containing a material that absorbs 1064 nm infrared light is preferably used. When the wavelength of the laser light is 532 nm, a light pink filling portion is preferably used. When the wavelength of the laser light is 355 nm, a light yellow filling portion is preferably used. Note that, as long as the energy ray transmittance is 50% or more, a black or white filling portion can also be used.

[0137] (iv) Shape of the filling part In this embodiment, it is sufficient that the filling portion is disposed within the opening of the resin film, thereby improving the flatness of the first surface of the substrate. Therefore, as shown in Fig. 3(a), the entire opening of the resin film 13 may be filled with the filling portion 14, or as shown in Fig. 4(b), the filling portion 14 may be disposed in only a portion of the opening of the resin film 13. In Fig. 4(b), the thickness of the filling portion 14 is thinner than the thickness of the resin film 13, and the second surface S2 of the substrate 1 has irregularities.

[0138] (v) Thickness The thickness of the filling portion in this embodiment may be the same as or thinner than the thickness of the resin film. The thickness of the filling portion is not particularly limited, but may be, for example, 200 μm or less, or 100 μm or less. On the other hand, the thickness of the filling portion may be, for example, 20 μm or more, 30 μm or more, or 40 μm or more.

[0139] (c) Covering layer In the base material of this embodiment, as shown in Fig. 4(a), a first coating layer 15a may be disposed on the surface of the resin film 13 opposite to the adhesive layer 2. Alternatively, as shown in Fig. 4(c), a second coating layer 15b may be disposed on the surface of the resin film 13 facing the adhesive layer 2. Alternatively, as shown in Fig. 4(d), a first coating layer 15a may be disposed on the surface of the resin film 13 opposite to the adhesive layer 2, and a second coating layer 15b may be disposed on the surface of the resin film 13 facing the adhesive layer 2.

[0140] In this embodiment, the first coating layer and the second coating layer are formed thicker than the resin film when forming the filling portion in the opening of the resin film, and are made of the same material as the filling portion. The thickness of the first coating layer and the second coating layer is, for example, 200 μm or less, and may be 100 μm or less. If the thickness is within the above range, the region X can be cut by water jet laser processing. On the other hand, the lower limit of the thickness of the first coating layer and the lower limit of the thickness of the second coating layer are not particularly limited.

[0141] (d) Method for preparing the substrate In this embodiment, the substrate can be produced, for example, by placing a resin film having an opening on a support, placing a resin composition for the filling portion on the resin film, and scraping off excess resin composition for the filling portion with a squeegee or the like to form a filling portion in the opening of the resin film. After the filling portion is formed, the support is peeled off. When the resin film having an opening is formed by mold printing using gravure printing, a separator may be used as the support.

[0142] (3-3) Third embodiment As shown in Figure 5(a), the substrate 1D in this embodiment has a woven fabric 16, a filling portion 17 filled in the opening of the woven fabric 16, a first coating layer 18a arranged on the side of the woven fabric 16 opposite the adhesive layer 2, and a second coating layer 18b arranged on the side of the woven fabric 16 facing the adhesive layer 2, and the filling portion 17, the first coating layer 18a and the second coating layer 18b are made of the same material.

[0143] In the substrate of this embodiment, a filling portion is disposed within the openings of the woven fabric, and a second coating layer is disposed on the adhesive layer side of the woven fabric. This improves the smoothness of the first surface of the substrate, thereby improving the surface smoothness of the adhesive layer disposed on the first surface of the substrate. Therefore, the adhesive tape for electronic component processing can hold the workpiece substrate stably and accurately. Furthermore, in this embodiment, region X is the region where the filling portion is present, and region Y is the region where no openings of the woven fabric are present. Region X is composed of the filling portion and the coating layer, and region Y is composed of the woven fabric and the coating layer. Therefore, during water jet laser processing, the adhesive layer is cut, and then region X, which is composed of the filling portion and the coating layer, is selectively cut, allowing water to pass through the cut portion. This prevents chipping and chip flying due to water splashing. Meanwhile, region Y, which is composed of the woven fabric and the coating layer, is not cut during water jet laser processing, and the woven fabric remains continuous, allowing the adhesive tape for electronic component processing to hold the workpiece substrate and chips.

[0144] (a) Textiles 5(b), the woven fabric 16 has warp threads 16a and weft threads 16b, and in plan view has openings 16c surrounded by the warp threads 16a and the weft threads 16b and non-openings 16d other than the openings 16c. The woven fabric has a plurality of openings and is a member that supports the adhesive layer.

[0145] The woven fabric is preferably non-absorbent to the laser light used in water jet laser processing. This prevents the woven fabric from absorbing the laser light and generating heat. This prevents the adhesive tape for electronic component processing from breaking during water jet laser processing. Furthermore, it prevents the woven fabric from becoming brittle during water jet laser processing.

[0146] The phrase "non-absorbent to the laser light used in water jet laser processing" is as described above. The woven fabric is preferably non-absorbent to the laser light used in water jet laser processing, and more preferably transparent to the wavelength of the laser light used in water jet laser processing.

[0147] The laser light absorption and non-absorption properties of a fabric can be controlled, for example, by adjusting the fabric material.

[0148] In addition, when the material of the fabric is non-absorbent to the laser light, the fabric may be colorless or colored.

[0149] The woven fabric is the same as the woven fabric used for the base material of the first specification in the first embodiment.

[0150] (b) Filling section The filling portion in this embodiment is disposed within the openings of the fabric.

[0151] (i) Absorption of laser light The filling portion in this embodiment preferably has absorbency to the laser light used in water jet laser processing. "Having absorbency to the laser light used in water jet laser processing" is as described above.

[0152] In this embodiment, the laser light absorption and non-absorption properties of the filling portion can be controlled by, for example, adjusting the material of the filling portion.

[0153] (ii) Energy ray transmittance When the adhesive layer is an energy ray curable adhesive layer, the energy ray transmittance of the filling portion in this embodiment is the same as the energy ray transmittance of the region X of the base material described above.

[0154] (iii) Materials The material of the filling portion in this embodiment is the same as the material of the filling portion in the second embodiment.

[0155] (iv) Shape and thickness of the filling part In this embodiment, the filling portion is disposed in the opening of the woven fabric, and a coating layer made of the same material as the filling portion is formed, so that the flatness of the first surface of the substrate is improved. In this embodiment, as shown in Figure 5(a), the entire opening of the woven fabric 16 is filled with the filling portion 17. The thickness of the filling portion is the same as the thickness of the woven fabric.

[0156] (c) Covering layer 5(a), in the base material of this embodiment, a first coating layer 18a is disposed on the surface of the fabric 16 opposite to the adhesive layer 2, and a second coating layer 18b is disposed on the surface of the fabric 16 facing the adhesive layer 2. The first coating layer and the second coating layer are made of the same material as the filling portion.

[0157] In this embodiment, the thickness of the first coating layer and the thickness of the second coating layer are, for example, 200 μm or less, and may be 100 μm or less. If the thickness is within the above range, the region X can be cut by water jet laser processing. On the other hand, the lower limit of the thickness of the first coating layer and the lower limit of the thickness of the second coating layer are not particularly limited.

[0158] (d) Method for preparing the substrate The substrate of this embodiment can be produced, for example, by the following method. First, an uncured resin composition is applied to a first separator to form a first uncured resin layer, and a woven fabric is laminated onto the first uncured resin layer to obtain a laminate having the first separator, the first uncured resin layer, and the woven fabric in this order. At this time, the uncured resin composition penetrates into the openings of the woven fabric. Next, the same uncured resin composition as above is applied to a second separator to form a second uncured resin layer, and this is laminated onto the woven fabric side of the laminate to obtain a laminate having the first separator, the first uncured resin layer, the woven fabric, the second uncured resin layer, and the second separator in this order. At this time, the uncured resin composition also penetrates into the openings of the woven fabric. Next, the first uncured resin layer and the second uncured resin layer are cured, and then the first separator and the second separator are peeled off. This results in a substrate as shown in FIG. 5(a).

[0159] 2. Adhesive layer The adhesive layer in the present disclosure is disposed on the first surface of the substrate.

[0160] (1) Shape of adhesive layer The adhesive layer in the present disclosure is not particularly limited as long as it can sufficiently fix the substrate and chip to the adhesive tape for electronic component processing in the dicing step, and can easily peel the chip from the adhesive tape for electronic component processing in the peeling step. Examples of adhesive layers include an energy ray-curable adhesive layer having energy ray curability and a weak adhesive layer exhibiting weak adhesiveness. Of these, an energy ray-curable adhesive layer is preferred. An energy ray-curable adhesive layer can increase the initial adhesive strength. Each adhesive layer will be described below.

[0161] (a) Energy ray curable adhesive layer The energy ray-curable adhesive layer is an adhesive layer whose adhesive strength decreases when irradiated with energy rays. In the energy ray-curable adhesive layer, the initial adhesive strength allows the substrate and chip to be sufficiently fixed to the adhesive tape for electronic component processing during the dicing process. Furthermore, during the peeling process, the adhesive strength decreases and the peelability improves when irradiated with energy rays, allowing the chip to be easily peeled from the adhesive tape for electronic component processing.

[0162] Examples of energy rays include light rays such as far ultraviolet rays, ultraviolet rays, near ultraviolet rays, visible light rays, and infrared rays, electromagnetic waves such as X-rays and gamma rays, as well as electron beams, proton beams, and neutron beams. Among these, from the viewpoint of versatility, ultraviolet rays and electron beams are preferred, and ultraviolet rays are more preferred.

[0163] The energy ray-curable adhesive layer is not particularly limited as long as it satisfies the desired adhesive properties, and can contain, for example, at least a resin (main adhesive agent) and an energy ray-curable compound. When the adhesive layer contains the energy ray-curable compound, the adhesive strength can be reduced by curing the energy ray-curable compound by irradiation with energy rays, and at the same time, the cohesive force is increased, making it easier to peel.

[0164] (i) Resin (main adhesive) Examples of resins (adhesive bases) include resins generally used as bases for adhesives, such as acrylic resins, polyester resins, polyimide resins, and silicone resins. Among these, acrylic resins are preferred. By using acrylic resins, adhesive residue on the adherend can be reduced.

[0165] Therefore, the adhesive layer preferably contains at least an acrylic resin, an energy ray-curable compound, and a crosslinking agent. In the adhesive layer, the acrylic resin is usually present as a crosslinked body formed by crosslinking between acrylic resin molecules with the crosslinking agent, but the acrylic resin may also be present as a simple substance together with the crosslinked body.

[0166] (acrylic resin) The acrylic resin is not particularly limited, and examples thereof include (meth)acrylic acid ester polymers obtained by homopolymerizing (meth)acrylic acid esters, and (meth)acrylic acid ester copolymers obtained by copolymerizing (meth)acrylic acid esters with other monomers and (meth)acrylic acid esters as the main component. Among these, (meth)acrylic acid ester copolymers are preferred. Specific examples of (meth)acrylic acid esters and other monomers include those disclosed in JP 2012-31316 A. The other monomers can be used alone or in combination of two or more. Here, "main component" means that the copolymerization ratio is 51% by mass or more, preferably 65% ​​by mass or more.

[0167] Among these, as the acrylic resin, a (meth)acrylic acid ester copolymer having a (meth)acrylic acid ester as the main component and obtained by copolymerizing a hydroxyl group-containing monomer copolymerizable with the (meth)acrylic acid ester, or a (meth)acrylic acid ester copolymer having a (meth)acrylic acid ester as the main component and obtained by copolymerizing a hydroxyl group-containing monomer and a carboxyl group-containing monomer copolymerizable with the (meth)acrylic acid ester can be suitably used.

[0168] In this specification, (meth)acrylic acid refers to at least one of acrylic acid and methacrylic acid.

[0169] The copolymerizable hydroxyl group-containing monomer and carboxyl group-containing monomer are not particularly limited, and for example, the hydroxyl group-containing monomer and carboxyl group-containing monomer disclosed in JP-A-2012-31316 can be used.

[0170] The weight-average molecular weight of the acrylic resin is, for example, preferably from 200,000 to 1,000,000, and more preferably from 200,000 to 800,000. By setting the weight-average molecular weight of the acrylic resin within the above range, sufficient initial adhesive strength can be exhibited.

[0171] Here, in this specification, the weight-average molecular weight is a polystyrene-equivalent value measured by gel permeation chromatography (GPC). The weight-average molecular weight is measured, for example, using a measuring device HLC-8220GPC manufactured by Tosoh Corporation, a column TSKGEL-SUPERMULTIPORE-HZ-M manufactured by Tosoh Corporation, THF as a solvent, and standard polystyrenes with molecular weights of 1050, 5970, 18100, 37900, 96400, and 706000 as standards.

[0172] Furthermore, when the acrylic resin is a (meth)acrylic acid ester copolymer of a hydroxyl group-containing monomer copolymerizable with a (meth)acrylic acid ester and a carboxyl group-containing monomer, the mass ratio of the hydroxyl group-containing monomer to the carboxyl group-containing monomer is, for example, preferably 51:49 to 100:0, and more preferably 75:25 to 100:0. When the mass ratio of the monomers is within the above range, effective reduction in adhesive strength due to energy ray irradiation can be expected, and the occurrence of adhesive residue can be suppressed.

[0173] The acrylic resin may be energy ray-curable, for example, may have an energy ray-curable functional group in a side chain. The energy ray-curable functional group preferably has, for example, an ethylenically unsaturated bond, and specific examples thereof include a (meth)acryloyl group, a vinyl group, and an allyl group.

[0174] (ii) Energy ray curable compound The energy ray-curable compound is not particularly limited as long as it is polymerizable upon irradiation with energy rays, and examples thereof include compounds having an energy ray-curable functional group.

[0175] Examples of energy ray-curable compounds include energy ray-curable monomers, energy ray-curable oligomers, and energy ray-curable polymers. The energy ray-curable polymers are polymers different from the resins (adhesive bases) described above. Among them, energy ray-curable oligomers are preferred from the viewpoint of the balance of adhesive strength before and after energy ray irradiation. Furthermore, energy ray-curable monomers, energy ray-curable oligomers, and energy ray-curable polymers may be used in combination. For example, when an energy ray-curable monomer is used in addition to an energy ray-curable oligomer, the adhesive layer is cured by three-dimensional crosslinking upon irradiation with energy rays, thereby reducing adhesive strength and increasing cohesive strength to prevent transfer to the chip side.

[0176] Examples of the energy ray-curable compound include radically polymerizable compounds, cationically polymerizable compounds, and anionically polymerizable compounds. Among these, radically polymerizable compounds are preferred. They have a high curing rate, can be selected from a wide variety of compounds, and can easily control physical properties such as adhesive strength before and after energy ray irradiation.

[0177] In addition, the adhesive strength after the energy ray irradiation can be controlled by adjusting the number of energy ray-curable functional groups in the energy ray-curable compound. As described above, for example, as the number of energy ray-curable functional groups increases, the crosslink density of the adhesive layer after the energy ray irradiation increases, and the adhesive strength after the energy ray irradiation tends to decrease.

[0178] In the energy ray-curable compound, the number of energy ray-curable functional groups per molecule is preferably 2 or more, more preferably 3 or more, and even more preferably 4 or more. If the number of energy ray-curable functional groups is within the above range, the crosslinking density of the adhesive layer after energy ray irradiation is sufficient, thereby achieving the desired peelability. In addition, the occurrence of adhesive residue due to a decrease in cohesive force can be suppressed. In addition, the upper limit of the number of energy ray-curable functional groups is not particularly limited.

[0179] The energy ray-curable compound is preferably a radical polymerizable oligomer, more preferably a radical polymerizable polyfunctional oligomer, such as those disclosed in JP 2012-31316 A.

[0180] In addition, as the energy ray-curable compound, a radical polymerizable oligomer or a radical polymerizable monomer may be used, and in particular, a radical polymerizable polyfunctional oligomer or a radical polymerizable polyfunctional monomer may be used. Examples of the radical polymerizable monomer include those disclosed in JP 2010-173091 A.

[0181] Examples of the energy ray curable compound include (meth)acrylate monomers, (meth)acrylate oligomers, (meth)acrylate polymers, etc. Examples of the energy ray curable compound that can be used include urethane (meth)acrylate, polyester (meth)acrylate, and epoxy (meth)acrylate.

[0182] Commercially available energy ray-curable compounds may also be used. For example, Mitsubishi Chemical Corporation's urethane acrylate "Shikou UV7620EA (molecular weight: 4100)" and Negami Chemical Industrial Co., Ltd.'s urethane acrylates "Art Resin UN-905 (molecular weight: 50,000 to 210,000)," "Art Resin UN-905DU1 (molecular weight: 26,000)," "Art Resin UN-951SC (molecular weight: 12,500)," "Art Resin UN-952 (molecular weight: 6,500 to 9,500)," "Art Resin UN-953 (molecular weight: 14,000 to 40,000)," "Art Resin UN-954 (molecular weight: 4,200)," and "Art Resin H-219 (molecular weight: 14,000 to 40,000)" are available. Examples of suitable polymers include "Art Resin H-315M (molecular weight: 6600)" and "Art Resin H-417M (molecular weight: 4000)" manufactured by Taisei Fine Chemical Co., Ltd., "8BR-600 (molecular weight: 100000)" acrylic urethane polymer manufactured by Taisei Fine Chemical Co., Ltd., "Unidic V-6850" polymer acrylate manufactured by DIC Corporation, "SMP-250AP (molecular weight: 20000-30000)" and "SMP-360A (molecular weight: 20000-30000)" acrylic polymer manufactured by Kyoeisha Chemical Co., Ltd., and "HA7975" acrylic resin acrylate manufactured by Showa Denko Materials Co., Ltd.

[0183] The energy ray-curable compounds may be used alone or in combination of two or more.

[0184] The weight-average molecular weight of the energy ray-curable compound is not particularly limited, but is preferably 30,000 or less, more preferably 10,000 or less, and even more preferably 8,000 or less. If the weight-average molecular weight of the energy ray-curable compound is within the above range, it exhibits sufficient compatibility with the acrylic resin (main adhesive agent), and the adhesive layer exhibits the desired adhesive strength before energy ray irradiation, and after energy ray irradiation, the occurrence of adhesive residue is suppressed and it can be easily peeled off. On the other hand, the weight-average molecular weight of the energy ray-curable resin composition is, for example, 500 or more.

[0185] Furthermore, the adhesive strength after irradiation with energy rays can be controlled by adjusting the content of the energy ray-curable compound. If the content of the energy ray-curable compound is high, the adhesive strength after irradiation with energy rays tends to be low.

[0186] The content of the energy ray-curable compound is, for example, preferably 5 to 150 parts by mass, more preferably 20 to 100 parts by mass, and even more preferably 50 to 80 parts by mass, per 100 parts by mass of the resin (main adhesive agent). If the content of the energy ray-curable compound is within the above range, the crosslink density of the adhesive layer after energy ray irradiation is sufficient, thereby achieving the desired peelability. In addition, the occurrence of adhesive residue due to a decrease in cohesive force can be suppressed.

[0187] (iii) Polymerization initiator The adhesive layer may contain a polymerization initiator in addition to the resin (main adhesive agent) and the energy ray-curable compound.

[0188] As the polymerization initiator, a general photopolymerization initiator can be used. Specific examples include acetophenones, benzophenones, α-hydroxyketones, benzyl methyl ketals, α-aminoketones, and bisacylphosphine oxides. When a urethane acrylate is used as the energy ray-curable compound, the polymerization initiator is preferably a bisacylphosphine-based polymerization initiator. Because this polymerization initiator has heat resistance, it can reliably cure the energy ray-curable compound even when the adhesive layer is irradiated with energy rays through a resin film.

[0189] The polymerization initiator preferably has absorption at wavelengths of 230 nm or more, and preferably at wavelengths of 300 nm to 400 nm. Such polymerization initiators can absorb energy rays with a wide wavelength range of 300 nm or more and efficiently generate active species that induce polymerization reactions of energy ray-curable compounds. Therefore, even with a small amount of energy ray irradiation, the energy ray-curable compound can be efficiently cured and easily peeled off. Furthermore, many resin films absorb energy rays with wavelengths up to about 300 nm but transmit energy rays with wavelengths of about 300 nm or more. Furthermore, in recent years, LED lamps with wavelengths of 300 nm or more are often used in energy ray irradiation devices. Therefore, by using a polymerization initiator with absorption at wavelengths of 230 nm or more, the energy ray-curable compound can be cured using energy rays that have transmitted through the resin film.

[0190] The content of the polymerization initiator is, for example, preferably 0.01 to 10 parts by mass, more preferably 0.5 to 6 parts by mass, per 100 parts by mass of the total of the resin (main adhesive agent) and the energy ray-curable compound. If the content of the polymerization initiator is below the above range, the polymerization reaction of the energy ray-curable compound may not occur sufficiently, resulting in excessively high adhesive strength of the adhesive layer after energy ray irradiation and inability to achieve peelability. On the other hand, if the content of the polymerization initiator exceeds the above range, the energy ray may only reach the vicinity of the energy ray-irradiated surface, resulting in insufficient curing of the adhesive layer. Furthermore, the cohesive force may decrease, which may cause adhesive residue.

[0191] (iv) Crosslinking agent The adhesive layer may contain a crosslinking agent in addition to the resin (main adhesive agent) and the energy ray-curable compound.

[0192] The crosslinking agent is not particularly limited as long as it crosslinks at least between resins (main adhesive agents), and is appropriately selected depending on the type of resin (main adhesive agent), etc. Examples include isocyanate-based crosslinking agents, epoxy-based crosslinking agents, and metal chelate-based crosslinking agents. Specific examples of isocyanate-based crosslinking agents and epoxy-based crosslinking agents include those disclosed in JP 2012-31316 A. The crosslinking agents can be used alone or in combination of two or more.

[0193] The content of the crosslinking agent is appropriately set depending on the type of crosslinking agent, and is, for example, preferably 0.01 to 15 parts by mass, more preferably 0.01 to 10 parts by mass, per 100 parts by mass of the resin (main adhesive). If the content of the crosslinking agent is below the above range, the adhesion may be poor, or the adhesive layer may undergo cohesive failure when peeling the chip, resulting in adhesive residue. On the other hand, if the content of the crosslinking agent exceeds the above range, the crosslinking agent may remain in the adhesive layer as unreacted monomer after energy ray irradiation, which may reduce cohesive strength and cause adhesive residue.

[0194] (v) Additives The adhesive layer may contain various additives as needed, such as a tackifier, an antistatic agent, a plasticizer, a silane coupling agent, a metal chelating agent, a surfactant, an antioxidant, an ultraviolet absorber, a colorant, a preservative, an antifoaming agent, and a wettability adjuster.

[0195] (vi) Other The energy ray-curable adhesive layer can be formed, for example, by applying an adhesive composition onto a separator. After the adhesive layer is formed, a resin film is placed on the adhesive layer to obtain an adhesive tape for processing electronic components, which has the resin film, adhesive layer, and separator in this order.

[0196] (b) Slightly adhesive adhesive layer The weak adhesive layer is an adhesive layer that exhibits weak adhesion. Although the weak adhesive layer has low initial adhesive strength, it can sufficiently fix the substrate and chip to the adhesive tape for electronic component processing during the dicing process. Furthermore, because the initial adhesive strength is low, it has excellent removability, and during the peeling process, the chip can be easily peeled from the adhesive tape for electronic component processing.

[0197] Here, the term "weak adhesive layer exhibits weak adhesion" means that the adhesive layer exhibits sufficient adhesive strength to fix the substrate and chip to the adhesive tape for electronic component processing sufficiently during the dicing process, and to easily peel the chip from the adhesive tape for electronic component processing during the peeling process.

[0198] The weak adhesive layer is not particularly limited as long as it has the desired adhesive properties. In particular, the weak adhesive layer preferably contains at least an acrylic resin, and more preferably contains an acrylic resin and a crosslinking agent.

[0199] Here, when the low-tack adhesive layer contains an acrylic resin, it means that the acrylic resin may exist in the low-tack adhesive layer as a single entity without forming crosslinks, or as a crosslinked entity formed by crosslinking between acrylic resins or between acrylic resins and other resins, or both the single entity and the crosslinked entity may be present.

[0200] Here, the adhesive layer containing an acrylic resin means that the acrylic resin may exist in the adhesive layer as a single entity without forming crosslinks, or as a crosslinked entity formed by crosslinking between acrylic resins or between an acrylic resin and another resin, or both the single entity and the crosslinked entity may be present.

[0201] (i) Acrylic resin The acrylic resin is not particularly limited, and examples thereof include a (meth)acrylic acid ester polymer obtained by homopolymerizing a (meth)acrylic acid ester, and a (meth)acrylic acid ester copolymer obtained by copolymerizing a (meth)acrylic acid ester as a main component with a (meth)acrylic acid ester and other monomers. Among these, a (meth)acrylic acid ester copolymer is preferred.

[0202] Here, the (meth)acrylic acid ester copolymer containing a (meth)acrylic acid ester as the main component means that the proportion of the (meth)acrylic acid ester relative to other monomers in the copolymer is greater than 30% by mass, and specifically, the copolymerization proportion is 51% by mass or more.

[0203] In this specification, (meth)acrylic acid refers to at least one of acrylic acid and methacrylic acid.

[0204] Examples of (meth)acrylic acid esters that can be used include (meth)acrylic acid alkyl esters, such as linear or branched alkyl esters having from 1 to 30 carbon atoms, and (meth)acrylic acid cycloalkyl esters. Specific examples of (meth)acrylic acid alkyl esters include those disclosed in JP 2014-101457 A. One or more types of (meth)acrylic acid esters may be used. Of these, (meth)acrylic acid esters having from 1 to 18 carbon atoms, and particularly from 1 to 8 carbon atoms, are preferred. The glass transition temperature of the acrylic resin is likely to fall within the range described below, which can improve the adhesiveness of the adhesive layer.

[0205] The acrylic resin may be a copolymer of a (meth)acrylic acid ester and a monomer or oligomer. In addition to the (meth)acrylic acid ester, other monomers or oligomers may be included as copolymerization components, if necessary, to improve properties such as cohesive strength and heat resistance. Examples of the copolymerization component include functional group-containing (meth)acrylates copolymerizable with the (meth)acrylic acid ester. Specific examples include carboxyl group-containing monomers, acid anhydride group-containing monomers, hydroxyl group-containing monomers, sulfonic acid group-containing monomers, phosphate group-containing monomers, epoxy group-containing monomers, vinyl esters, vinyl ethers, and aromatic vinyl compounds. Nitrogen-containing monomers such as cyano group-containing monomers, amide group-containing monomers, amino group-containing monomers, and isocyanate group-containing monomers may also be used as copolymerization components. The copolymerization component may be included in an acrylic acid ester polymer as a copolymerization component.

[0206] The weight-average molecular weight of the acrylic resin is, for example, preferably 100,000 or more and 2,000,000 or less, more preferably 200,000 or more and 1,000,000 or less, and even more preferably 400,000 or more and 800,000 or less. If the weight-average molecular weight is smaller than the above range, adhesive residue may occur in the adhesive layer. On the other hand, if the weight-average molecular weight is larger than the above range, the adhesive strength may increase and the peelability may decrease.

[0207] The glass transition temperature of the acrylic resin is, for example, preferably −100° C. or higher and 0° C. or lower, and more preferably −80° C. or higher and −20° C. or lower. By using an acrylic resin having a glass transition temperature within the above range as the main component, desired adhesive properties can be easily obtained.

[0208] The glass transition temperature of an acrylic resin can be adjusted appropriately by changing the type of monomer unit used, the ratio of the monomer units to be combined, etc. Even in the case of an acrylic resin in the form of a polymer (homopolymer) obtained by homopolymerizing a monomer, the glass transition temperature may be within the above range. However, the use of a monomer unit whose homopolymer glass transition temperature is not within the above range is not restricted. It is sufficient that the glass transition temperature of a copolymer obtained by copolymerizing a combination of various monomer units is within the above range.

[0209] In this specification, the glass transition temperature refers to a value measured by a method (DMA method) based on the peak-top value of the loss tangent (tan δ). The loss tangent is determined by the value of loss modulus / storage modulus. These moduli are measured using a dynamic viscoelasticity measuring device to measure the stress when a force is applied to a polymer or copolymer at a certain frequency.

[0210] The acrylic resin can be obtained by polymerizing a monomer such as the above-mentioned (meth)acrylic acid ester, monomer, or oligomer by a conventional method such as solution polymerization, bulk polymerization, emulsion polymerization, or suspension polymerization.

[0211] (ii) Crosslinking Agent The crosslinking agent may be any common crosslinking agent capable of crosslinking the acrylic resin, such as an epoxy crosslinking agent, an isocyanate crosslinking agent, a metal chelate crosslinking agent, or a carbodiimide crosslinking agent.

[0212] The content of the crosslinking agent is, for example, 0.1 to 20 parts by mass, preferably 0.3 to 10 parts by mass, relative to 100 parts by mass of the acrylic resin. When the content of the crosslinking agent is within the above range, desired adhesive properties can be easily obtained.

[0213] (iii) Other ingredients The adhesive layer may contain any additives, such as a lubricant, a plasticizer, a bulking agent, an antistatic agent, an antiblocking agent, a light stabilizer, and a colorant, as required.

[0214] (iv) Other The method for forming the weakly adhesive layer is the same as the method for forming the energy ray curable adhesive layer.

[0215] (2) Surface roughness of the adhesive layer In the present disclosure, the surface smoothness of the adhesive layer disposed on the first surface of the substrate can be improved. Specifically, the maximum height roughness Rz of the surface of the adhesive layer opposite the substrate is preferably 8 μm or less, more preferably 5 μm or less, and even more preferably 3 μm or less. By ensuring that Rz is within the above range, the surface smoothness of the adhesive layer is improved, and the adhesive tape for electronic component processing can hold the substrate to be processed stably and accurately. The lower limit of Rz is not particularly limited.

[0216] Rz is measured using a laser microscope in accordance with JIS B0601:2013.

[0217] (3) Thickness of adhesive layer The thickness of the adhesive layer may be any thickness that provides the desired adhesive strength, for example, 10 μm or more, 25 μm or more, or even 50 μm or more. When the thickness of the adhesive layer is within the above range, the adhesion between the adhesive sheet for electronic components and the substrate or chip to be processed is improved, and chip flying during water jet laser processing can be suppressed. On the other hand, the thickness of the adhesive layer is, for example, 200 μm or less. If the adhesive layer is too thick, water permeability may be reduced.

[0218] 3. Other configurations The adhesive tape for processing electronic components according to the present disclosure may have other components as needed in addition to the resin film and adhesive layer described above. The adhesive tape for processing electronic components according to the present disclosure may have a separator on the surface of the adhesive layer opposite to the substrate.

[0219] 4. Characteristics of adhesive tape for electronic component processing (1) Elongation at break In the present disclosure, the elongation at break of the adhesive tape for electronic component processing is 100% or more, or may be 500% or more, or even 1000% or more. When the elongation at break is within the above range, breakage of the adhesive tape for electronic component processing during expansion can be suppressed. Furthermore, when the elongation at break is within the above range, it can be said that the adhesive tape for electronic component processing has good expandability. Meanwhile, there is no particular upper limit for the elongation at break of the adhesive tape for electronic component processing.

[0220] The elongation at break of adhesive tapes for electronic component processing is measured in accordance with JIS K7127: 1999. The specific measurement conditions are shown below.

[0221] <Measurement conditions> Test piece: rectangular test piece (width 10 mm, length 60 mm) ·Distance between gauge lines: 25mm Initial distance between chucks: 25mm Pulling speed: 200mm / min ·Temperature: 23±2℃ ·Humidity: 50±10%RH

[0222] As a method for controlling the elongation at break of the adhesive tape for processing electronic parts, for example, a method of adjusting the material of the substrate can be mentioned.

[0223] When adjusting the material of the substrate, for example, when an olefin resin, vinyl chloride resin, or thermoplastic elastomer is used, the elongation at break of the adhesive tape for processing electronic components tends to increase.

[0224] (2) Adhesive strength (a) Energy ray curable adhesive layer When the adhesive layer is an energy ray-curable adhesive layer, the peel strength between the substrate and the adhesive layer after irradiation with energy rays is preferably equal to or greater than the adhesive strength to the glass substrate after irradiation with energy rays, thereby preventing adhesive residue on the adherend.

[0225] When the adhesive layer is an energy ray-curable adhesive layer, the adhesive strength of the adhesive tape for electronic component processing to a glass plate before energy ray irradiation may be, for example, 0.5 N / 25 mm or more and 40 N / 25 mm or less. Furthermore, the adhesive strength to a glass plate after energy ray irradiation is preferably, for example, 2.0 N / 25 mm or less. The lower limit of the adhesive strength to a glass plate after energy ray irradiation is not particularly limited, and is, for example, 0.01 N / 25 mm or more.

[0226] The adhesive strength to the glass plate is measured according to Method 1 of JIS Z0237:2022 (Test Methods for Adhesive Tapes and Sheets) (a test method in which the tape or sheet is peeled off at an angle of 180° from the stainless steel test plate at a temperature of 23°C and humidity of 50%), by peeling the test piece lengthwise at a width of 25 mm, a peel angle of 180°, and a peel speed of 300 mm / min. The glass plate used is float glass (150 mm x 70 mm, 2 mm thick) manufactured by Osaka Glass Industry Co., Ltd.

[0227] When the adhesive layer is an energy ray-curable adhesive layer, the peel strength between the substrate and the adhesive layer in the adhesive tape for electronic component processing after irradiation with energy rays may be, for example, equal to or greater than the adhesive strength to a glass plate after irradiation with the energy rays, and may be at least twice the adhesive strength to a glass plate after irradiation with the energy rays. When the peel strength is within the above range, the adhesion between the substrate and the adhesive layer after irradiation with energy rays is increased, thereby suppressing adhesive residue on the adherend. On the other hand, the upper limit of the peel strength is not particularly limited. For example, when the peel strength between the substrate and the adhesive layer after irradiation with energy rays is very large, the peel strength between the substrate and the adhesive layer may be equal to or greater than the peel strength between the adhesive tape for electronic component processing and the adherend in the method for measuring the peel strength between the substrate and the adhesive layer after irradiation with energy rays described below, and peeling may not occur between the substrate and the adhesive layer.

[0228] Here, the peel strength between the substrate and the adhesive layer after energy ray irradiation is measured by a T-peel test. Specifically, first, an adhesive tape for electronic component processing having a substrate, an adhesive layer, and a separator in this order is prepared. At this time, if a separator is not arranged on the adhesive layer side opposite the substrate in the adhesive tape for electronic component processing, a separator is arranged on the adhesive layer side opposite the substrate. Next, the adhesive layer of the adhesive tape for electronic component processing is irradiated with energy rays to harden it. For example, energy rays are irradiated from the substrate side of the adhesive tape for electronic component processing. Next, the separator is peeled from the adhesive tape for electronic component processing to expose the adhesive layer. Next, an adherend (polyester adhesive tape No. 31B manufactured by Nitto Denko Corporation) is bonded to the adhesive layer side of the adhesive tape for electronic component processing (one reciprocating motion) using a 2 kg roller and cut to a width of 25 mm. After that, the adhesive tape is aged for 6 hours to prepare a test specimen. Next, the substrate and adhesive layer of the test specimen are forcibly peeled along the length of the specimen. The edges of the peeled portion between the substrate and adhesive layer are clamped with the gripping tools of a tensile tester, and a T-shaped peel is performed at a peel speed of 300 mm / min and a peel distance of 50 mm to measure the peel strength between the substrate and adhesive layer after energy beam irradiation. The measurement environment is a temperature of 23°C and a humidity of 50% RH. An example of a tensile tester used is a Tensilon RTF1150 manufactured by A&D Corporation.

[0229] Examples of means for controlling the peel force between the substrate and the adhesive layer after irradiation with energy rays include a method of subjecting the substrate to a surface treatment, a method of adjusting the thickness of the adhesive layer, a method of adjusting the components or composition contained in the adhesive layer, and a method of adjusting the aging temperature when forming the adhesive layer or when laminating the substrate and adhesive layer.

[0230] In addition, in the method of subjecting the substrate to a surface treatment, for example, the peel force can be increased by subjecting the substrate to a surface treatment.

[0231] In addition, in the method of adjusting the thickness of the adhesive layer, the thicker the adhesive layer, the better the adhesion between the substrate and the adhesive layer, and the larger the peel force tends to be.

[0232] Specific examples of methods for adjusting the components and composition of the adhesive layer include adjusting the content, number of functional groups, and molecular weight of the energy ray-curable compound, and adding a tackifier. For example, when the content of the energy ray-curable compound is low, the peel force tends to be high, while when the content of the energy ray-curable compound is high, the peel force tends to be low. For example, when the number of energy ray-curable functional groups in the energy ray-curable compound is low, the peel force tends to be high, while when the number of energy ray-curable functional groups in the energy ray-curable compound is high, the peel force tends to be low. For example, when the molecular weight of the energy ray-curable compound is low, the peel force tends to be high, while when the molecular weight of the energy ray-curable compound is high, the peel force tends to be low. For example, adding a tackifier tends to increase the peel force.

[0233] Furthermore, in a method of adjusting the aging temperature when forming the adhesive layer or when laminating the substrate and adhesive layer, for example, if the aging temperature is high, the peel force tends to be large, whereas if the aging temperature is low, the peel force tends to be small.

[0234] (b) Slightly adhesive adhesive layer When the adhesive layer is a weak adhesive layer, the peel strength between the substrate and the adhesive layer is preferably equal to or greater than the adhesive strength to the glass substrate, thereby preventing adhesive residue on the adherend.

[0235] When the adhesive layer is a weak adhesive layer, the adhesive strength of the adhesive tape for electronic component processing to a glass plate is 6.0 N / 25 mm or less, or may be 3.0 N / 25 mm or less, or may be 0.5 N / 25 mm or less, while the adhesive strength to a glass plate is, for example, 0.05 N / 25 mm or more.

[0236] Here, the method for measuring the adhesive strength to the glass plate is the same as the method for measuring the adhesive strength to the glass plate in the case of the energy ray curable adhesive layer.

[0237] When the adhesive layer is a weak adhesive layer, the peel strength between the substrate and the adhesive layer in the adhesive tape for electronic component processing is, for example, equal to or greater than the adhesive strength to a glass plate after the above-mentioned energy ray irradiation, and may be at least twice the adhesive strength to a glass plate after the above-mentioned energy ray irradiation. When the peel strength is within the above range, the adhesion between the substrate and the adhesive layer is high, thereby suppressing adhesive residue on the adherend. On the other hand, the upper limit of the peel strength is not particularly limited. For example, when the peel strength between the substrate and the adhesive layer after energy ray irradiation is very high, in the method for measuring the peel strength between the substrate and the adhesive layer after energy ray irradiation described below, the peel strength between the substrate and the adhesive layer may be equal to or greater than the peel strength between the adhesive tape for electronic component processing and the adherend, and the substrate and the adhesive layer may not peel.

[0238] The peel strength between the substrate and adhesive layer is measured using a T-peel test. Specifically, an adherend (Nitto Denko Corporation's polyester adhesive tape No. 31B) is first bonded to the adhesive layer of an adhesive tape for electronic component processing (one round trip) using a 2 kg roller, and then cut to a width of 25 mm. This is then aged for 6 hours to prepare a test specimen. Next, the substrate and adhesive layer of the test specimen are forcibly peeled along the length of the specimen. The edges of the peeled portion between the substrate and adhesive layer are clamped with the grips of a tensile tester, and a T-peel test is performed at a peel speed of 300 mm / min and a peel distance of 50 mm to measure the peel strength between the substrate and adhesive layer after energy beam irradiation. The measurement environment is a temperature of 23°C and humidity of 50% RH. For example, a Tensilon RTF1150 manufactured by A&D Corporation is used as the tensile tester.

[0239] Examples of means for controlling the peel force between the substrate and the adhesive layer include a method of subjecting the substrate to a surface treatment, a method of adjusting the thickness of the adhesive layer, a method of adjusting the components or composition contained in the adhesive layer, and a method of adjusting the aging temperature when forming the adhesive layer or when laminating the substrate and adhesive layer.

[0240] The method of surface treating the substrate, the method of adjusting the thickness of the adhesive layer, and the method of adjusting the aging temperature when forming the adhesive layer or when laminating the substrate and adhesive layer are the same as in the case of the above-mentioned energy ray-curable adhesive layer.

[0241] Furthermore, a specific example of a method for adjusting the components and composition contained in the adhesive layer is to add a tackifier. For example, adding a tackifier tends to increase the peel strength.

[0242] 5.Applications The adhesive tape for electronic component processing according to the present disclosure can be used as a dicing tape. In particular, the adhesive tape for electronic component processing according to the present disclosure can be suitably used as a dicing tape when dicing a workpiece substrate by laser processing. In particular, the adhesive tape for electronic component processing according to the present disclosure can be suitably used as a dicing tape when dicing a workpiece substrate by water jet laser processing.

[0243] B. Manufacturing methods for electronic components The method for manufacturing electronic components in the present disclosure includes an attachment step of attaching the above-mentioned adhesive tape for electronic component processing to a first surface of a workpiece substrate, a dicing step of dividing the workpiece substrate into a plurality of chips, and a peeling step of peeling the adhesive tape for electronic component processing from the chips.

[0244] 6(a) to 6(f) are process diagrams illustrating an example of a method for manufacturing an electronic component according to the present disclosure. First, as shown in FIG. 6(a), a bonding process is performed in which the adhesive layer surface of the adhesive tape 10 for electronic component processing is bonded to a ring frame 31, and then a workpiece substrate 21 is bonded to the adhesive layer surface of the adhesive tape 10 for electronic component processing. Next, as shown in FIG. 6(b), a dicing process is performed in which the workpiece substrate 21 is divided into chips 22. Next, as shown in FIG. 6(c), an expanding process is performed in which the adhesive tape 10 for electronic component processing is stretched to increase the spacing between the chips 22. Next, when the adhesive layer of the adhesive tape 10 for electronic component processing is an energy ray-curable adhesive layer, as shown in FIG. 6(d), an irradiation process is performed in which the adhesive layer of the adhesive tape 10 for electronic component processing is irradiated with energy rays 25 from the substrate side to harden the adhesive layer and thereby reduce its adhesive strength. Next, as shown in FIG. 6(e), a pick-up process is performed in which the chips 22 are peeled off from the adhesive tape 10 for electronic component processing and picked up. This pick-up step is the peeling step. Next, as shown in Fig. 6(f), a mounting (die bonding) step is carried out in which the picked-up chip 22 is attached to a substrate 26.

[0245] 7(a) to 7(e) are process diagrams illustrating another example of a method for manufacturing an electronic component according to the present disclosure. First, as shown in FIG. 7(a), a bonding step is performed in which the adhesive layer surface of the adhesive tape 10 for electronic component processing is bonded to a ring frame 31, and then a substrate 21 to be processed is bonded to the adhesive layer surface of the adhesive tape 10 for electronic component processing. Next, as shown in FIG. 7(b), a dicing step is performed in which the substrate 21 is divided into chips 22. Next, as shown in FIG. 7(c), a transfer tape 27 is bonded to the surface of the chip 22 opposite to the adhesive tape 10 for electronic component processing. Thereafter, if the adhesive layer of the adhesive tape 10 for electronic component processing is an energy ray-curable adhesive layer, an irradiation step is performed in which the adhesive layer of the adhesive tape 10 for electronic component processing is irradiated with energy rays 25 from the substrate side to harden it and thereby reduce its adhesive strength, as shown in FIG. 7(d). 7(e), a transfer step is performed in which the adhesive tape 10 for processing electronic components is peeled off from the chip 22 and the ring frame 31, and the chip 22 and the ring frame 31 are transferred to the transfer tape 27. This transfer step is the peeling step.

[0246] In the present disclosure, the above-described adhesive tape for processing electronic components is used, so that the substrate to be processed and the chip can be stably held.

[0247] A general method can be applied to each step in the method for manufacturing an electronic component according to the present disclosure.

[0248] In particular, in the dicing step, it is preferable to divide the substrate into a plurality of chips by a laser guided by a water jet. General conditions can be adopted for the water jet laser processing.

[0249] When the adhesive layer is an energy ray-curable adhesive layer, a curing step of irradiating the adhesive layer of the adhesive tape for processing electronic components with energy rays to cure the adhesive layer is carried out after the dicing step and before the peeling step. The curing step may be carried out between the dicing step and the expanding step, or between the expanding step and the peeling step.

[0250] The present disclosure is not limited to the above-described embodiments. The above-described embodiments are merely examples, and any configuration that is substantially identical to the technical idea described in the claims of the present disclosure and that provides similar effects is included within the technical scope of the present disclosure. [Example]

[0251] The present disclosure will be further described below with reference to examples and comparative examples.

[0252] [Example 1] (Preparation of substrate) A substrate of the first specification of the first embodiment was produced. First, a 40 μm thick polyurethane resin film was prepared as a substrate layer. A 200 μm thick mesh layer containing polyurethane resin was formed on the substrate layer by mold printing using gravure printing. The openings in the mesh layer were circular, had a diameter of 1 mm, an opening ratio of 20%, and were arranged in a 60° staggered pattern. This produced the substrate.

[0253] A pressure-sensitive adhesive composition was prepared by diluting 100 parts by mass of the adhesive base (acrylic acid copolymer), 50 parts by mass of urethane acrylate (ultraviolet-curable compound, 9 functional groups, molecular weight 4100, active content 65%), 1.5 parts by mass of an acylphosphine oxide polymerization initiator (IGM Resins' "Omnirad 819"), 1.5 parts by mass of an α-hydroxyalkylphenone polymerization initiator (IGM Resins' "Omnirad 184"), and 3 parts by mass of a crosslinking agent (isocyanate curing agent (tolylene diisocyanate (TDI) adduct type (trimethylolpropane adduct)), solid content 75%) with a mixed solvent of toluene and methyl ethyl ketone (mass ratio 1:1) and thoroughly dispersing the mixture.

[0254] The above adhesive composition was applied to a polyethylene terephthalate (PET) separator (Nippa Corporation's "PET50x1-M-J2", thickness 50 μm) so that the thickness after drying would be 50 μm, and the composition was dried in an oven at 110°C for 3 minutes to form an adhesive layer.

[0255] The substrate was laminated onto the adhesive layer with the polyurethane resin film facing the adhesive layer, and the laminate was aged at 40°C for 3 days to produce an adhesive tape for processing electronic components.

[0256] [Comparative Example 1] A 200 μm thick mesh layer containing polyurethane resin was formed on the separator by mold printing using gravure printing. The openings in the mesh layer were circular, had a diameter of 1 mm, an opening ratio of 20%, and were arranged in a 60° staggered pattern. The separator was then peeled off to obtain the mesh layer. An adhesive tape for processing electronic components was produced in the same manner as in Example 1, using only the mesh layer as the substrate.

[0257] Comparative Example 2 An adhesive tape for electronic component processing was produced in the same manner as in Example 1, except that a 150 μm thick resin film (polypropylene film ("PL815T" manufactured by Diaplus Film Co., Ltd.)) was used as the substrate and the thickness of the adhesive layer was 20 μm.

[0258] Comparative Example 3 Except for using a 190 μm thick woven fabric (thread diameter 105 μm, 100 mesh, opening rate 34%) as the substrate, an adhesive tape for processing electronic components was produced in the same manner as in Example 1. In the woven fabric, the openings between the threads were 145 μm.

[0259] [evaluation] (1) Rz of the adhesive layer surface Using a Keyence Corporation "Profile Measuring Laser Microscope VK-X110," Rz was measured on the surface of the adhesive layer side of the adhesive tape for electronic component processing in accordance with JIS B0601:2013.

[0260] (2) Chip chipping Adhesive tape for electronic component processing was attached to a ring frame for 6-inch wafers, and a 100μm-thick 6-inch silicon wafer was adhered and fixed to the adhesive tape for electronic component processing. Using a water jet laser dicing device (SYNOVA's "Laser Microjet"), 10 passes were made on the same location under conditions of a cutting speed of 100mm / s, a laser wavelength of 532nm, a water jet diameter of 50μm, and a water pressure of 250 bar. Chip chipping was observed using a Keyence "VHX-2000 Digital Microscope" at a magnification of 200x and with transmitted illumination. Evaluation criteria A: No chipping of 50 μm or more occurred. B: Chips of 50 μm or more and less than 100 μm occurred. C: Chips of 100 μm or more occurred.

[0261] (3) Expandability The tensile tester used was the "Tensilon RTF1150" manufactured by A&D Co., Ltd., and the elongation at break of the adhesive tape for electronic component processing was measured under the above-mentioned measurement conditions in accordance with JIS K7127:1999. A: 100% or more B: 30% or more but less than 100% C: Less than 30%

[0262] (4) Chip flying Adhesive tape for electronic component processing was attached to a ring frame for 6-inch wafers, and a 100 μm-thick 6-inch silicon wafer was adhered and fixed to the adhesive tape for electronic component processing. Using a water jet laser dicing device (SYNOVA's "Laser Microjet"), the wafer was diced into 1.0 mm x 1.0 mm chips at a cutting speed of 100 mm / s, a laser wavelength of 532 nm, a water jet diameter of 50 μm, and a water pressure of 250 Bar, and the presence or absence of chip breakage was confirmed. Similarly, the wafer was diced into 2.0 mm x 2.0 mm chips and the presence or absence of chip breakage was confirmed. A: No chip breakage with chip size 1.0mm x 1.0mm B: Chip size 2.0mm x 2.0mm, no chip breakage C: Chip size 2.0mm x 2.0mm with chip skipping

[0263] [Table 1]

[0264] In Comparative Example 1, the mesh layer used as the substrate had large openings, which resulted in poor smoothness of the adhesive layer surface, making it impossible to hold the wafer stably and accurately, resulting in chipping and chip chipping. In Comparative Example 2, the resin film used as the substrate was impermeable to water, resulting in chipping and chipping due to the rebound of the water jet. In Comparative Example 3, the woven fabric used as the substrate had small openings, resulting in good smoothness of the adhesive layer surface, but poor expandability due to the woven fabric substrate. In contrast, in Example 1, the substrate had a base layer and a mesh layer, resulting in low Rz and good smoothness of the adhesive layer surface. Furthermore, the thin base layer allowed the base layer to be cut by water jet laser processing, and exhibited good water permeability during water jet laser processing. Therefore, dicing was possible while suppressing chipping and chip chipping. Furthermore, the mesh layer was a resin film with openings, resulting in good expandability.

[0265] The present disclosure provides the following inventions. [1] An adhesive tape for processing electronic components, comprising a substrate and an adhesive layer disposed on a first surface of the substrate, The substrate has, in a plan view seen from a second surface side opposite to the first surface of the substrate, a region X that can be cut by water jet laser processing from the adhesive layer side of the adhesive tape for electronic component processing, and a region Y that cannot be cut by water jet laser processing, and the adhesive tape for electronic component processing has a sea-island structure in which the region X is an island and the region Y is a sea. [2] The adhesive tape for processing electronic components according to [1], wherein the surface of the adhesive layer opposite to the substrate has a maximum height roughness Rz of 8 μm or less. [3] The substrate has, from the adhesive layer side, a substrate layer and a mesh layer having a plurality of openings, The adhesive tape for electronic component processing according to [1] or [2], wherein the region X is a region where the openings of the mesh layer are present, and the region Y is a region where the openings of the mesh layer are not present. [4] The adhesive tape for processing electronic components according to [3], wherein the base layer and the mesh layer are separate bodies. [5] The adhesive tape for processing electronic components according to [3], wherein the base layer and the mesh layer are integral with each other. [6] The adhesive tape for processing electronic components according to any one of [3] to [5], wherein the base layer has a thickness that can be cut by the water jet laser processing, and the mesh layer has a thickness that cannot be cut by the water jet laser processing. [7] An adhesive tape for processing electronic components according to any one of [3] to [5], wherein the base layer is absorbent to the laser light used in the water jet laser processing, and the mesh layer is non-absorbent to the laser light used in the water jet laser processing. [8] the substrate has a resin film having a plurality of openings and a filling portion disposed in the openings of the resin film, The region X is a region where the filling portion exists, The adhesive tape for processing electronic parts according to [1] or [2], wherein the region Y is a region of the resin film where the openings are not present. [9] [8] The adhesive tape for processing electronic components according to [8], wherein the filling section is absorbent to the laser light used in the water jet laser processing, and the resin film is non-absorbent to the laser light used in the water jet laser processing.

[10] The substrate has a woven fabric, a filling portion filled in an opening of the woven fabric, a first coating layer disposed on a surface of the woven fabric opposite to the adhesive layer, and a second coating layer disposed on a surface of the woven fabric facing the adhesive layer, the filling portion, the first coating layer, and the second coating layer are made of the same material; The region X is a region where the filling portion exists, The adhesive tape for processing electronic components according to [1] or [2], wherein the region Y is a region of the fabric where the openings are not present.

[11]

[10] The adhesive tape for electronic component processing described in

[10] , wherein the filling portion, the first coating layer, and the second coating layer are absorbent to the laser light used in the water jet laser processing, and the woven fabric is non-absorbent to the laser light used in the water jet laser processing.

[12] the adhesive layer is an energy ray-curable adhesive layer, The adhesive tape for processing electronic components according to any one of [1] to

[11] , wherein the energy ray transmittance in the region X is 50% or more and 80% or less.

[13] The adhesive tape for processing electronic parts according to any one of [1] to

[12] , wherein the adhesive tape for processing electronic parts has an elongation at break of 100% or more.

[14] a step of attaching the adhesive tape for electronic component processing according to any one of [1] to

[13] to a first surface of a substrate to be processed; a dicing step of dividing the substrate into a plurality of chips; a peeling step of peeling the adhesive tape for processing electronic components from the chip; The method for manufacturing an electronic component includes the steps of:

[15] The method for manufacturing an electronic component according to

[14] , wherein the dicing step divides the substrate to be processed into a plurality of chips using a laser guided by a water jet. [Explanation of symbols]

[0266] 1 … Base material 2 … Adhesive layer 10...Adhesive tape for electronic component processing

Claims

1. An adhesive tape for processing electronic components, comprising a substrate and an adhesive layer disposed on a first surface of the substrate, The adhesive tape for electronic component processing has, in a plan view from a second surface side opposite to the first surface of the substrate, a region X that can be cut by water jet laser processing from the adhesive layer side of the adhesive tape for electronic component processing and a region Y that cannot be cut by water jet laser processing, and has a sea-island structure in which the region X is an island and the region Y is a sea.

2. 2. The adhesive tape for processing electronic components according to claim 1, wherein the surface roughness in maximum height Rz of the adhesive layer on the side opposite to the substrate is 8 μm or less.

3. The substrate has, from the adhesive layer side, a substrate layer and a mesh layer having a plurality of openings, 2. The adhesive tape for processing electronic components according to claim 1, wherein the region X is a region where the openings of the mesh layer are present, and the region Y is a region where the openings of the mesh layer are not present.

4. The adhesive tape for processing electronic components according to claim 3 , wherein the base layer and the mesh layer are separate bodies.

5. The adhesive tape for processing electronic parts according to claim 3 , wherein the base layer and the mesh layer are integral with each other.

6. 4. The adhesive tape for processing electronic components according to claim 3, wherein the base layer has a thickness that allows it to be cut by the water jet laser processing, and the mesh layer has a thickness that does not allow it to be cut by the water jet laser processing.

7. 4. The adhesive tape for processing electronic components according to claim 3, wherein the base layer is absorbent to the laser light used in the water jet laser processing, and the mesh layer is non-absorbent to the laser light used in the water jet laser processing.

8. the substrate has a resin film having a plurality of openings and a filling portion disposed in the openings of the resin film, The region X is a region where the filling portion exists, The adhesive tape for processing electronic components according to claim 1 , wherein the region Y is a region of the resin film where the openings are not present.

9. 9. The adhesive tape for electronic component processing according to claim 8, wherein the filling portion is absorbent to the laser light used in the water jet laser processing, and the resin film is non-absorbent to the laser light used in the water jet laser processing.

10. The substrate includes a woven fabric, a filling portion filled in an opening of the woven fabric, a first coating layer disposed on a surface of the woven fabric opposite to the adhesive layer, and a second coating layer disposed on a surface of the woven fabric facing the adhesive layer, the filling portion, the first coating layer, and the second coating layer are made of the same material; The region X is a region where the filling portion exists, The adhesive tape for processing electronic components according to claim 1 , wherein the region Y is a region of the woven fabric where the openings are not present.

11. 11. The adhesive tape for electronic component processing according to claim 10, wherein the filling portion, the first coating layer, and the second coating layer are absorbent to the laser light used in the water jet laser processing, and the woven fabric is non-absorbent to the laser light used in the water jet laser processing.

12. the adhesive layer is an energy ray-curable adhesive layer, 2. The adhesive tape for processing electronic parts according to claim 1, wherein the energy ray transmittance in the region X is 50% or more and 80% or less.

13. 2. The adhesive tape for processing electronic parts according to claim 1, wherein the adhesive tape for processing electronic parts has an elongation at break of 100% or more.

14. a bonding step of bonding the adhesive tape for electronic component processing according to any one of claims 1 to 13 to a first surface of a substrate to be processed; a dicing step of dividing the workpiece substrate into a plurality of chips; a peeling step of peeling the adhesive tape for electronic component processing from the chip; The method for manufacturing an electronic component includes the steps of:

15. The method for manufacturing an electronic component according to claim 14, wherein the dicing step divides the substrate into a plurality of chips by a laser guided by a water jet.

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