Slag adhering machine for single crystal furnace

Abstract

The invention belongs to the technical field of monocrystalline silicon manufacturing, and particularly relates to a single crystal furnace slag adhering machine which comprises a slag lifting structure. The slag extraction structure comprises two fixing rods, and the two fixing rods are arranged at one end, close to the quartz crucible, in the containing cylinder; and the sliding rod is fixedly connected to the interior of the fixed rod. By arranging the electrode column and the sliding rod, when the quartz crucible melts a silicon raw material, the electrode column is in the quartz crucible and is clamped at the upper end of the fixed rod by the connecting plate at the moment, the electrode column and the quartz crucible are synchronously heated, and then when the silicon raw material melts into a silicon liquid and impurities float on the surface, the electrode column is clamped at the upper end of the fixed rod by the connecting plate. When the electrode column extends into the silicon liquid, the conductive ball below the conductive strip is in contact with the conductive ball above the extrusion spring, and the extrusion spring is extruded, so that the copper sheet is in contact with the contact sheet, and the electrode column automatically discharges; therefore, impurities in the silicon liquid are adsorbed through the adsorption column below the electrode column.

Description

Technical Field

[0001] The invention belongs to the technical field of single crystal silicon manufacturing, in particular to a single crystal furnace slag sticking machine. Background Art

[0002] The single crystal furnace slag sticking machine is a key equipment used in the single crystal silicon manufacturing process. It is mainly used to deal with impurities floating in the silicon liquid in the single crystal furnace. Because in the manufacturing process of single crystal silicon, the impurities floating on the surface of the silicon liquid after the melt will directly affect the survival rate of the crystal. Therefore, the slag sticking process of sticking the impurities floating in the silicon liquid in the single crystal furnace out of the furnace is an indispensable key process, and the slag sticking machine is generally installed inside the single crystal furnace and used in conjunction with the single crystal furnace.

[0003] A patent application with publication number CN115369476B discloses a slag sticking device for a single crystal furnace, including a slag sticking carrier, a pulling joint and a connecting rod, wherein the pulling joint is docked with the pulling mechanism of the single crystal furnace, and the connecting rod is arranged between the pulling joint and the slag sticking carrier. Through this solution, the slag sticking operation can be more convenient, the slag sticking time can be shortened and the slag sticking risk can be lowered, which not only helps to achieve the purpose of reducing costs and increasing efficiency, but also helps to increase the crystal pulling output.

[0004] There are still some problems in the actual application of the above scheme. When the device is used to stick the impurities floating in the silicon liquid in the single crystal furnace out of the furnace, after the silicon raw material is melted into the silicon liquid, the bottom of the sticky slag carrier is moved to the melted silicon liquid. Through the temperature difference between the silicon liquid and the sticky slag carrier, the impurities are quickly gathered in the sticky slag carrier, and the impurities are transferred out. However, since the silicon raw material is placed in a crucible and melted into silicon liquid, after melting, in order to reduce the influence of heat and reduce volatilization loss, it is necessary to ensure the sealing of the crucible. When the above device is extended into the silicon liquid, it is necessary to open the sealing cover above the crucible to extend to the inside of the crucible, thereby affecting the sealing inside the crucible. In addition, the slag is stuck through the temperature difference, and there are certain requirements for the working environment, which makes the slag sticking work more complicated.

[0005] To this end, the present invention provides a single crystal furnace slag sticking machine. Summary of the invention

[0006] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0007] The technical solution adopted by the present invention to solve its technical problems is: a single crystal furnace slag sticking machine described in the present invention is used in conjunction with a containing tube inside the single crystal furnace, a quartz crucible is placed inside the containing tube, a crystal pulling structure is provided at the upper end of the containing tube, the crystal pulling structure includes a furnace cover, and a slag lifting structure; the slag lifting structure includes: a fixed rod, two of the fixed rods are arranged at one end of the containing tube close to the quartz crucible; a sliding rod, the sliding rod is fixedly connected to the inside of the fixed rod; a thread, the thread is opened on the arc surface of the sliding rod; a rotating ring, the rotating ring is slidably connected to the surface of the sliding rod, and the rotating ring is threadedly connected to the thread after moving; an electrode column, the electrode column is arranged at an eccentric position at the lower end of the rotating ring; an adsorption column, the adsorption column is arranged at the lower end of the electrode column.

[0008] Preferably, the slag lifting structure also includes: a lifting frame, which is slidably connected to the inside of the sliding rod and is rotatably connected to the rotating ring; a connecting plate, which is arranged at the upper end of the lifting frame; and a conductive bar, which is arranged at one end of the rotating ring and the other end of the rotating ring is connected to the electrode column.

[0009] Preferably, a contact piece is provided inside the fixing rod, a copper piece is provided at one end of the fixing rod close to the contact piece, and the copper piece is placed obliquely, and the copper piece contacts the contact piece during operation, a compression spring is provided at the upper end of the copper piece, a conductive ball is provided at the upper end of the compression spring, and the conductive ball is slidably connected inside the fixing rod, and a conductive ball is also provided at the lower end of the conductive strip.

[0010] Preferably, a telescopic cylinder is provided inside the furnace cover, and a snap-in ball is provided at one end of the telescopic cylinder close to the connecting plate, a buckle is provided at the upper end of the connecting plate, and the snap-in ball is snap-connected to the inner wall of the buckle.

[0011] Preferably, a coil spring is provided inside the connecting plate, a placement plate is provided at one end of the coil spring, and a limiting strip is provided inside the fixing rod at one end close to the placement plate.

[0012] Preferably, a temporary storage frame is provided at one end of the containing tube close to the quartz crucible, a scraping frame is provided inside the temporary storage frame, and an inner wall of the scraping frame is in contact with the adsorption column.

[0013] Preferably, the end of the scraping frame is rotatably connected to an abutment plate, the interior of the scraping frame is rotatably connected to a rotating column, one end of the rotating column is provided with a cleaning column, and the cleaning column is in contact with the adsorption column when working.

[0014] Preferably, a sliding arm is provided at one end of the rotating column close to the cleaning column, and the cleaning column slides on the surface of the sliding arm. An adjusting spring is provided on the surface of the sliding arm, and one end of the adjusting spring is connected to the rotating column.

[0015] Preferably, an abutment groove is formed on the surface of the abutment plate, and the abutment groove is in contact with the adsorption column.

[0016] Preferably, a return spring is provided at one end of the abutment plate, and the other end of the return spring is connected to the scraping frame.

[0017] The beneficial effects of the present invention are as follows: 1. The single crystal furnace slag sticking machine described in the present invention is provided with an electrode column and a sliding rod. When the quartz crucible melts the silicon raw material, the furnace cover will move to the upper end of the quartz crucible, so that the interior of the quartz crucible remains sealed. At this time, the electrode column will also be inside the quartz crucible and be clamped on the upper end of the fixed rod by the connecting plate, and will be heated synchronously with the quartz crucible. Then, when the silicon raw material is dissolved into silicon liquid and impurities float on the surface, the telescopic cylinder is started at this time, and the telescopic cylinder will be clamped with the connecting plate and drive the connecting plate to move downward. At this time, the electrode column will also move downward. When the electrode column is extended into the silicon liquid, since it has been heated synchronously with the quartz crucible, the electrode column will not be damaged due to excessive temperature difference when it is extended into the silicon liquid. At this time, the conductive ball located below the conductive strip will contact the conductive ball above the extrusion spring, and the extrusion spring will be squeezed, so that the copper sheet will contact the contact sheet, so that the electrode column automatically discharges, thereby adsorbing impurities in the silicon liquid through the adsorption column below the electrode column.

[0018] 2. The single crystal furnace slag machine described in the present invention is configured with a scraping frame. After the adsorption column under the electrode column adsorbs impurities, the electrode column is rotated to contact the scraping frame through the connection between the rotating ring and the thread. At this time, the rotating column is started, and the impurities on the surface of the adsorption column can be cleaned by the cleaning column. The spring is adjusted to make the cleaning column have a certain elasticity, so that the surface of the adsorption column will not be damaged during the cleaning process. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described below in conjunction with the accompanying drawings.

[0020] Figure 1 is a three-dimensional diagram of the first embodiment of the present invention; Figure 2 is a front view of the first embodiment of the present invention; Figure 3 is an internal view of the container of the present invention; Figure 4 yes Figure 3 A partial enlarged view of the middle part; Figure 5 is a position diagram of the adsorption column and the quartz crucible of the present invention; Figure 6 yes Figure 5 A partial enlarged view of point B in the middle; Figure 7 yes Figure 5 A partial enlarged view of point C in the middle; Figure 8 It is a position diagram of the conductive balls and conductive strips of the present invention; Fig. 9 It is a position diagram of the temporary storage frame and the scraping frame of the present invention; Fig.10 is an internal view of the scraping frame of the present invention; Fig.11 is a position diagram of the scraping frame and the abutment plate of the present invention; In the figure: 1, base frame; 2, holding tube; 21, quartz crucible; 3, crystal pulling structure; 31, furnace cover; 32, stretching tube; 33, driving motor; 34, rotating frame; 35, crystal seed; 4, slag lifting structure; 401, telescopic cylinder; 402, temporary storage frame; 403, fixed rod; 404, electrode column; 405, sliding rod; 406, lifting frame; 407, connecting plate; 408, thread; 409, conductive strip; 410, Snap-on ball; 411, snap buckle; 412, rotating ring; 413, conductive ball; 414, extrusion spring; 415, copper sheet; 416, contact sheet; 417, scraping frame; 418, adsorption column; 419, abutment plate; 420, abutment groove; 421, cleaning column; 422, rotating column; 423, sliding arm; 424, adjusting spring; 425, reset spring; 426, limit strip; 427, placement plate; 428, coil spring. DETAILED DESCRIPTION

[0021] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods. Embodiment 1

[0022] like Figures 1 to 11As shown, a single crystal furnace slag sticking machine according to an embodiment of the present invention is used in conjunction with a containing tube 2 inside the single crystal furnace, a quartz crucible 21 is placed inside the containing tube 2, a crystal pulling structure 3 is provided at the upper end of the containing tube 2, the crystal pulling structure 3 includes a furnace cover 31, and a slag lifting structure 4; the slag lifting structure 4 includes: fixed rods 403, two fixed rods 403 are arranged at one end of the containing tube 2 close to the quartz crucible 21; sliding rods 405, the sliding rods 405 are fixedly connected to the inside of the fixed rods 403; threads 408, the threads 408 are opened on the arc surface of the sliding rods 405; rotating ring 412, the rotating ring 412 is slidably connected to the surface of the sliding rod 405, and the rotating ring 412 is threadedly connected to the thread 408 after moving; an electrode column 404, the electrode column 404 is arranged at an eccentric position of the lower end of the rotating ring 412; an adsorption column 418, the adsorption column 418 is arranged at the lower end of the electrode column 404.

[0023] Specifically, a single crystal furnace slag sticking machine of the scheme can remove impurities in silicon liquid when the single crystal furnace is performing crystal pulling. When in use, the silicon raw material is first placed into the interior of the quartz crucible 21, and then the furnace cover 31 is rotated to the upper end of the containing tube 2, thereby achieving the sealing of the interior of the containing tube 2. At this time, the heating system located at the lower end of the quartz crucible 21 is started. During the heating process, the silicon raw material is gradually converted into silicon liquid. Since the silicon liquid reacts with oxygen, nitrogen, carbon dioxide, etc. in the air during exposure to the air to generate impurities such as oxides and nitrides, these impurities will adhere to the surface of the silicon liquid and become impurities in the silicon liquid. At this time, the rotation is started. The rotating ring 412 moves downward, and the rotating ring 412 will move downward along the surface of the sliding rod 405. The electrode column 404 connected to the rotating ring 412 is not located at the upper end of the quartz crucible 21 in the initial state. During the movement, the rotating ring 412 will be threadedly connected with the thread 408, thereby driving the electrode column 404 to rotate to the top of the quartz crucible 21. Since the electrode column 404 is connected to the rotating ring 412, the adsorption column 418 under the electrode column 404 will eventually be driven into the silicon liquid. At this time, the controllers inside the two electrode columns 404 are started. One of the two electrode columns is the positive electrode column 404, and the other is the negative electrode column 408. 4. Since the quartz crucible 21 contains silicon liquid, when the two electrode columns 404 are in contact with the silicon liquid, the two electrode columns 404 will form a series circuit and form an electric field with the silicon liquid. This electric field will act on the ions in the silicon liquid, so that they are affected by the electric field force and move toward the electrode columns 404, so that the positive electrode column 404 of the two electrode columns 404 absorbs the impurity negative ions in the silicon liquid, and the negative electrode column 404 absorbs the impurity positive ions in the silicon liquid. In this way, the impurities in the silicon liquid can be effectively adsorbed on the surface of the adsorption column 418, and then the seed crystal 35 is started, and the seed crystal 35 will move downward to the inside of the quartz crucible 21 and contact with the impurities that have been removed. When the seed crystal 35 extends into the silicon liquid, the seed crystal 35 is lifted to carry out the seeding operation. At this time, the pulled silicon rod will not be affected by the impurities in the silicon liquid. Finally, after the single crystal production is completed, the rotating ring 412 is started again. The rotating ring 412 will drive the electrode column 404 to move upward, and in the process of moving, the rotating ring 412 will contact the thread 408 again, so that the rotating ring 412 drives the electrode column 404 to rotate to reset, so that the electrode column 404 moves to the upper outside of the quartz crucible 21, so that when the adsorption column 418 is subsequently cleaned, impurities will not fall into the inside of the quartz crucible 21.

[0024] like Figures 1 to 8As shown, the slag lifting structure 4 also includes: a lifting frame 406, which is slidably connected to the inside of the sliding rod 405, and the lifting frame 406 is rotatably connected to the rotating ring 412; a connecting plate 407, which is arranged at the upper end of the lifting frame 406; a conductive strip 409, which is arranged at one end of the rotating ring 412, and the other end of the rotating ring 412 is connected to the electrode column 404.

[0025] Specifically, after the silicon raw material is placed into the quartz crucible 21, the rotating frame 34 is started, and the rotating frame 34 will drive the furnace cover 31 to move to the upper end of the containing tube 2. Then, when impurities are generated on the surface of the silicon liquid, the connecting plate 407 is started to move downward, and the connecting plate 407 will drive the rotating ring 412 to move together through the lifting frame 406. In the process of movement, when the rotating ring 412 contacts the thread 408, the rotating ring 412 will rotate at the lower end of the lifting frame 406, but will not affect the downward movement. When the adsorption column 418 moves to the inside of the silicon liquid, the conductive strip 409 is started, and the conductive strip 409 will transmit current to the electrode column 404, so that the electrode column 404 is charged.

[0026] like Figure 8 As shown, a contact piece 416 is provided inside the fixing rod 403, and a copper piece 415 is provided at one end of the fixing rod 403 close to the contact piece 416, and the copper piece 415 is placed obliquely. The copper piece 415 contacts the contact piece 416 during operation, and a compression spring 414 is provided at the upper end of the copper piece 415. A conductive ball 413 is provided at the upper end of the compression spring 414, and the conductive ball 413 is slidably connected inside the fixing rod 403. A conductive ball 413 is also provided at the lower end of the conductive strip 409.

[0027] Specifically, when the rotating ring 412 drives the adsorption column 418 to move into the silicon liquid, the conductive ball 413 located below the conductive strip 409 will abut against the conductive ball 413 at the upper end of the extrusion spring 414, and then the rotating ring 412 will continue to move downward, and the conductive ball 413 at the upper end of the extrusion spring 414 will cause the extrusion spring 414 to contract. When the extrusion spring 414 contracts, it will drive the copper sheet 415 to contact the contact sheet 416. Since one end of the contact sheet 416 is directly connected to the power supply, and the contact sheet 416 is connected to the copper sheet 415, the contact sheet 416 is connected to the copper sheet 415. The contact between the sheets 415 is not completely smooth, but is composed of many tiny contact points. The contact sheet 416 contacts the copper sheet 415 to form a conductive path, so that the current can be directly transmitted to the electrode column 404 through the conductive ball 413, and finally the adsorption column 418 adsorbs the impurities. This form of conduction can automatically and quickly charge the adsorption column 418 when the adsorption column 418 moves into the silicon liquid, thereby avoiding the phenomenon that the adsorption column 418 is not charged when it moves into the silicon liquid.

[0028] like Figures 1 to 6As shown, a telescopic cylinder 401 is provided inside the furnace cover 31 , and a snap-in ball 410 is provided at one end of the telescopic cylinder 401 close to the connecting plate 407 . A snap 411 is provided at the upper end of the connecting plate 407 , and the snap-in ball 410 is snap-connected to the inner wall of the snap 411 .

[0029] Specifically, by setting the telescopic cylinder 401, when it is necessary to move the rotating ring 412 downward, the telescopic cylinder 401 is started, one end of the telescopic cylinder 401 will extend downward and abut against the connecting plate 407, so that the connecting plate 407 also moves downward, and when the adsorption column 418 moves to the inside of the silicon liquid, the rotating ring 412 at this time has also moved to the bottom of the sliding rod 405, and when the telescopic cylinder 401 extends downward again, the snap-in ball 410 will move to the inside of the snap buckle 411 to achieve snap connection, and when the adsorption column 418 completes the adsorption of impurities in the silicon liquid, the telescopic cylinder 401 is started again, the telescopic cylinder 401 will be reset, and because the snap-in ball 410 is snapped in the snap buckle 411, the telescopic cylinder 401 at this time will also drive the adsorption column 418 to reset together.

[0030] like Figures 1 to 7 As shown, a coil spring 428 is provided inside the connecting plate 407 , a placement plate 427 is provided at one end of the coil spring 428 , and a limiting strip 426 is provided at one end of the fixing rod 403 close to the placement plate 427 .

[0031] Specifically, by setting the placement plate 427, in the initial state, the placement plate 427 will be located on the surface of the limit strip 426, so that the connecting plate 407 can be fixed, and then when the telescopic cylinder 401 drives the connecting plate 407 to move downward, the placement plate 427 at this time will rotate upward with the coil spring 428 as the axis, thereby retracting into the interior of the connecting plate 407, so that the connecting plate 407 can slide inside the fixed rod 403, and when the telescopic cylinder 401 drives the connecting plate 407 to reset, when the placement plate 427 passes the limit strip 426, the coil spring 428 at this time will release the elastic force, and finally the placement plate 427 moves to the original position, and when the telescopic cylinder 401 pulls the connecting plate 407 to move upward at this time, due to the limitation of the connecting plate 407, the placement plate 427 will not be able to rotate downward, and the receiving ball 410 at this time will automatically separate from the buckle 411 to facilitate subsequent slag sticking work. Embodiment 2

[0032] like Figures 1 to 9 As shown, compared with Example 1, another embodiment of the present invention is: a temporary storage frame 402 is provided at one end of the containing tube 2 close to the quartz crucible 21, and a scraping frame 417 is provided inside the temporary storage frame 402, and the inner wall of the scraping frame 417 is in contact with the adsorption column 418.

[0033] Specifically, by setting up a scraping frame 417, when the slag sticking is completed and the rotating ring 412 moves upward to reset, the electrode column 404 and the adsorption column 418 will rotate to a position away from the upper end of the quartz crucible 21, and during the rotation, the adsorption column 418 will contact the inner wall of the scraping frame 417, thereby scraping off the impurities on the surface of the adsorption column 418 and collecting them in the temporary storage frame 402.

[0034] like Figures 1 to 10 As shown, the end of the scraping frame 417 is rotatably connected to the abutment plate 419, and the interior of the scraping frame 417 is rotatably connected to the rotating column 422. A cleaning column 421 is provided at one end of the rotating column 422, and the cleaning column 421 contacts the adsorption column 418 when working.

[0035] Specifically, before the adsorption column 418 enters the interior of the scraping frame 417, it will first contact the abutment plate 419 and then enter the interior of the scraping frame 417. At this time, the rotating column 422 is started, and the rotating column 422 will drive the cleaning column 421 to rotate, and during the rotation process, the impurities on the surface of the adsorption column 418 will be removed so that the adsorption column 418 can be used directly afterwards.

[0036] like Figures 1 to 10 As shown, a sliding arm 423 is provided at one end of the rotating column 422 close to the cleaning column 421, and the cleaning column 421 slides on the surface of the sliding arm 423. An adjusting spring 424 is provided on the surface of the sliding arm 423, and one end of the adjusting spring 424 is connected to the rotating column 422.

[0037] Specifically, by setting an adjustment spring 424, when the cleaning column 421 abuts against the surface of the adsorption column 418, the cleaning column 421 can slide on the surface of the sliding arm 423, so that the force applied by the cleaning column 421 to the adsorption column 418 can be adjusted, and the adjustment spring 424 can also keep the cleaning column 421 always in contact with the adsorption column 418.

[0038] like Figures 1 to 10 As shown, abutment grooves 420 are formed on the surface of the abutment plate 419 , and the abutment grooves 420 are in contact with the adsorption columns 418 .

[0039] Specifically, by opening the abutment groove 420, when the adsorption column 418 contacts the abutment plate 419, the adsorption column 418 will first contact the abutment groove 420. Since the size of the abutment groove 420 matches the adsorption column 418, the adsorption column 418 can be kept to accurately open the abutment plate 419.

[0040] like Fig.11 As shown, a return spring 425 is provided at one end of the abutting plate 419 , and the other end of the return spring 425 is connected to the scraping frame 417 .

[0041] Specifically, by providing a reset spring 425, after the adsorption column 418 pushes the abutment plate 419 away, the reset spring 425 will release its elastic force at this time, thereby driving the abutment plate 419 to reset for subsequent cleaning work.

[0042] Working principle: A single crystal furnace slag sticking machine in this scheme can remove impurities in silicon liquid when the single crystal furnace is performing crystal pulling. Before use, first put the silicon raw material into the interior of the quartz crucible 21, start the rotating frame 34, and the rotating frame 34 will drive the furnace cover 31 to move to the upper end of the containing tube 2, thereby realizing the closure of the interior of the containing tube 2. At this time, the heating system located at the lower end of the quartz crucible 21 is started. During the heating process, the silicon raw material is gradually converted into silicon liquid. Since the silicon liquid reacts with oxygen, nitrogen, carbon dioxide, etc. in the air during exposure to the air to generate impurities such as oxides and nitrides, such impurities will adhere to the surface of the silicon liquid and become impurities in the silicon liquid. At this time, the telescopic cylinder 401 is started, and one end of the telescopic cylinder 401 will move toward The conductive ball 413 located below the conductive strip 409 will contact the conductive ball 413 at the upper end of the extrusion spring 414, and then the conductive ball 413 at the upper end of the extrusion spring 414 will continue to move downward through the rotating ring 412, and the conductive ball 413 at the upper end of the extrusion spring 414 will cause the extrusion spring 414 to contract, and the extrusion spring 414 will drive the copper sheet 415 to contact the contact sheet 416 when contracting. Since one end of the contact sheet 416 is directly connected to the power supply, and the contact between the contact sheet 416 and the copper sheet 415 is not completely smooth, but is composed of many tiny contact points, the contact sheet 416 and the copper sheet 415 are not completely smooth. The contact of the two electrodes 404 forms a conductive path, so that the current can be directly conducted to the electrode column 404 through the conductive ball 413. Since the quartz crucible 21 contains silicon liquid, the two electrode columns 404 are in contact with the silicon liquid to form a series circuit. This series circuit makes one of the two electrode columns 404 become a positive electrode column 404 that can absorb the impurity negative ions in the silicon liquid, and at the same time, the other electrode column 404 becomes a negative electrode column 404 that can absorb the impurity positive ions in the silicon liquid. In this way, the impurities in the silicon liquid can be effectively adsorbed on the surface of the adsorption column 418, and then the seed crystal 35 is started. The seed crystal 35 will move downward to the inside of the quartz crucible 21 and contact with the silicon liquid from which impurities have been removed. When the seed crystal 35 extends into the silicon liquid, the seed crystal 35 is lifted to proceed. The operation of seeding is performed, and the pulled silicon rod will not be affected by impurities in the silicon liquid. Finally, after the single crystal production is completed, the telescopic cylinder 401 is started again, and the telescopic cylinder 401 will drive the connecting plate 407 to reset. At this time, when the placement plate 427 passes through the limit bar 426, the coil spring 428 will release the elastic force, and finally the placement plate 427 moves to the original position. When the telescopic cylinder 401 pulls the connecting plate 407 to move upward, due to the limit of the connecting plate 407, the placement plate 427 will not be able to rotate downward. At this time, the clamping ball 410 will automatically separate from the buckle 411, and when the slag sticking is completed and the rotating ring 412 moves upward to reset, the electrode column 404 and the adsorption column 418 will rotate to the upper end away from the quartz crucible 21.During the rotation, the adsorption column 418 will contact the inner wall of the scraping frame 417, thereby scraping off the impurities on the surface of the adsorption column 418 and collecting them in the temporary storage frame 402.

[0043] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A single crystal furnace slag sticking machine, used in conjunction with a holding tube (2) inside the single crystal furnace, a quartz crucible (21) is placed inside the holding tube (2), a crystal pulling structure (3) is provided at the upper end of the holding tube (2), the crystal pulling structure (3) includes a furnace cover (31), and is characterized in that: including a slag extraction structure (4); The slag extraction structure (4) comprises: Fixed rods (403), two of the fixed rods (403) being arranged inside the containing tube (2) at one end close to the quartz crucible (21); A sliding rod (405), the sliding rod (405) being fixedly connected inside the fixed rod (403); A thread (408), wherein the thread (408) is provided on the sliding rod (405); a rotating ring (412), the rotating ring (412) being slidably connected to the surface of the sliding rod (405), and the rotating ring (412) being threadedly connected to the thread (408) after moving; An electrode column (404), the electrode column (404) being arranged at an eccentric position at the lower end of the rotating ring (412); An adsorption column (418), wherein the adsorption column (418) is arranged at the lower end of the electrode column (404).

2. A single crystal furnace slag sticking machine according to claim 1, characterized in that: The slag extraction structure (4) further comprises: A lifting frame (406), the lifting frame (406) is slidably connected inside the sliding rod (405), and the lifting frame (406) is rotatably connected to the rotating ring (412); A connecting plate (407), the connecting plate (407) being arranged at the upper end of the lifting frame (406); A conductive strip (409), wherein the conductive strip (409) is arranged at one end of the rotating ring (412), and the other end of the rotating ring (412) is connected to the electrode column (404).

3. A single crystal furnace slag sticking machine according to claim 2, characterized in that: A contact sheet (416) is provided inside the fixing rod (403), a copper sheet (415) is provided at one end of the fixing rod (403) close to the contact sheet (416), and the copper sheet (415) is placed obliquely. The copper sheet (415) contacts the contact sheet (416) during operation, a compression spring (414) is provided at the upper end of the copper sheet (415), a conductive ball (413) is provided at the upper end of the compression spring (414), and the conductive ball (413) is slidably connected inside the fixing rod (403), and a conductive ball (413) is also provided at the lower end of the conductive strip (409).

4. The single crystal furnace slag sticking machine according to claim 2, characterized in that: A telescopic cylinder (401) is provided inside the furnace cover (31), and a clamping ball (410) is provided at one end of the telescopic cylinder (401) close to the connecting plate (407). A clamping buckle (411) is provided at the upper end of the connecting plate (407), and the clamping ball (410) is clamped to the inner wall of the clamping buckle (411).

5. The single crystal furnace slag sticking machine according to claim 4, characterized in that: A coil spring (428) is provided inside the connecting plate (407), a placement plate (427) is provided at one end of the coil spring (428), and a limit strip (426) is provided inside the fixing rod (403) at one end close to the placement plate (427).

6. The single crystal furnace slag sticking machine according to claim 1, characterized in that: A temporary storage frame (402) is provided at one end of the containing tube (2) close to the quartz crucible (21), a scraping frame (417) is provided inside the temporary storage frame (402), and an inner wall of the scraping frame (417) is in contact with the adsorption column (418).

7. The single crystal furnace slag sticking machine according to claim 6, characterized in that: The end of the scraping frame (417) is rotatably connected to an abutment plate (419), the interior of the scraping frame (417) is rotatably connected to a rotating column (422), one end of the rotating column (422) is provided with a cleaning column (421), and the cleaning column (421) is in contact with the adsorption column (418) when in operation.

8. The single crystal furnace slag sticking machine according to claim 7, characterized in that: A sliding arm (423) is provided at one end of the rotating column (422) close to the cleaning column (421), and the cleaning column (421) slides on the surface of the sliding arm (423). An adjusting spring (424) is provided on the surface of the sliding arm (423), and one end of the adjusting spring (424) is connected to the rotating column (422).

9. The single crystal furnace slag sticking machine according to claim 7, characterized in that: An abutment groove (420) is provided on the surface of the abutment plate (419), and the abutment groove (420) is in contact with the adsorption column (418).

10. The single crystal furnace slag sticking machine according to claim 9, characterized in that: A return spring (425) is provided at one end of the abutment plate (419), and the other end of the return spring (425) is connected to the scraping frame (417).

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