A semiconductor plastic encapsulation thickness detection device

Abstract

The present invention relates to the field of semiconductor packaging technology, and provides a semiconductor plastic package thickness detection device, including a frame and a laser detector mounted thereon, wherein a detection head is provided on the laser detector, and a thickness control mechanism is provided on a side of the laser detector close to the detection head, wherein the thickness control mechanism includes a shell connected to the laser detector, a lower sensing column is provided at the bottom of the shell, the bottom of the lower sensing column extends out of the shell, and a ball is rotatably connected to the bottom, and an upper sensing column is provided at the top of the shell, and the upper sensing column is correspondingly arranged below the detection head. The present invention overcomes the shortcomings of the prior art, has a reasonable design, and a compact structure, and amplifies the slight thickness changes on the surface of the plastic package body through a lever unit, thereby enhancing the sensitivity of the laser detector and improving the detection accuracy. The wiping mechanism is linked to the thickness changes on the surface of the plastic package body, thereby avoiding misjudgment caused by contamination of the lens of the dirty detection head, and ensuring the accuracy of the detection result.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a semiconductor plastic packaging thickness detection device. Background Art

[0002] In the field of semiconductor packaging, the thickness of the plastic package is a key quality indicator in the packaging. In the current plastic packaging process, the mold is designed as a variable floating mold, and the cavity thickness of the mold is not fixed. During the molding process, the thickness of the plastic package may exceed the standard value due to various reasons such as mold deformation, foreign matter, and resin weight. Therefore, the detection of the thickness of the plastic package is indispensable in the plastic packaging process.

[0003] After molding, the plastic package body may have extremely slight thickness exceeding the standard in certain positions, and the existing detection devices often find it difficult to accurately capture these tiny thickness differences, and there is a risk of missed detection. Therefore, we propose a semiconductor plastic package thickness detection device. Summary of the invention

[0004] 1. Technical issues to be solved

[0005] In view of the shortcomings of the prior art, the present invention provides a semiconductor plastic package thickness detection device, which overcomes the shortcomings of the prior art, has a reasonable design and a compact structure, and solves the problem that the existing detection devices are often difficult to accurately capture these tiny thickness differences and there is a risk of missed detection.

[0006] (II) Technical solution

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions: a semiconductor plastic package thickness detection device, including a frame and a laser detector installed thereon, the laser detector is provided with a detection head, and a thickness adjustment mechanism is provided on the side of the laser detector close to the detection head, the thickness adjustment mechanism includes a shell connected to the laser detector, a lower sensing column is provided at the bottom of the shell, the bottom of the lower sensing column extends out of the shell, and a ball is rotatably connected to the bottom, an upper sensing column is provided at the top of the shell, and the upper sensing column is correspondingly arranged below the detection head, and a lever unit is hinged in the shell, and the lever unit is respectively connected to the lower sensing column and the upper sensing column to increase the relative displacement of the upper sensing column.

[0008] Preferably, the lever unit includes a first lever and a second lever hinged inside the housing. One ends of both are connected by a connecting rod so that the first lever can drive the second lever to move. The bottom of the first lever is connected to the inner wall of the housing by a spring so that the first lever and the second lever maintain a balanced state. One end of the first lever away from the connecting rod is hinged to a lower sensing post. On both sides of the first lever near one end of the lower sensing post, there are first rotating shafts connected to the housing to control the displacement of both ends of the first lever. One end of the second lever away from the connecting rod is hinged to an upper sensing post. On both sides of the second lever near one end of the connecting rod, there are second rotating shafts connected to the housing to control the displacement distance of both ends of the second lever.

[0009] Preferably, a wiping mechanism is provided on the housing. The wiping mechanism includes a rotating column rotatably connected to the top of the housing. On one side of the rotating column, there is a bearing box. The bearing box is provided with a wiping opening. A wiping cloth is installed in the wiping opening and is located below the detection head so that the wiping cloth fits the lens of the detection head.

[0010] Preferably, the internal structure of the bearing box is symmetric up and down. In the bearing box, mounting rollers, a first guiding roller and a second guiding roller are installed in pairs. The mounting roller is detachably connected to the bearing box. A wiping cloth roller is installed on one of the mounting rollers. The wiping cloth on the wiping cloth roller passes through the first guiding roller and the second guiding roller in sequence and then is connected to the other mounting roller so that the top of the wiping cloth fits the lens of the detection head. One end of the mounting roller connected to the tail end of the wiping cloth is connected to a motor.

[0011] Preferably, a box cover covers the top of the bearing box.

[0012] Preferably, both ends of the mounting roller penetrate the bearing box, and both ends thereof are screw rods. The outer wall of the screw rod is threadedly connected with nuts so that the mounting roller is installed on the bearing box. There are gaps between the nuts on both sides and the side wall of the bearing box to facilitate the rotation of the mounting roller relative to the bearing box.

[0013] Preferably, the rotating column is a hollow column. An arc-shaped groove is circumferentially provided inside it and is inclinedly opened along its inner wall. A pull rod is provided inside the rotating column. A plug rod inserted into the arc-shaped groove is provided on the outer wall of the top of the pull rod. The bottom of the pull rod is hinged to the top of the second lever to control the rotation of the rotating column through the deflection of the second lever.

[0014] Preferably, the frame is provided with a bracket adjustment mechanism, and the bracket adjustment mechanism includes a first chain, a first guide rail is installed at one end of the first chain, a second guide rail is provided at the bottom of the first guide rail and is perpendicular to the direction of the first guide rail for the first guide rail to slide thereon, a sensor bracket is slidably connected to the first guide rail, and a second chain connected to the sensor bracket is provided on one side of the first guide rail to drive the sensor bracket to move in the direction of the first guide rail, and the sensor bracket is symmetrically provided with laser detectors above and below to simultaneously detect the upper and lower surfaces of the plastic package body.

[0015] Preferably, a track for carrying the plastic package body is provided on the top of the frame, a pushing mechanism is provided in the track, the pushing mechanism includes a third chain, a cylinder is provided on the third chain, and a push plate for pushing the plastic package body is provided at the output end of the cylinder.

[0016] (III) Beneficial effects

[0017] The embodiment of the present invention provides a semiconductor plastic package thickness detection device, which has the following beneficial effects:

[0018] 1. The lever unit amplifies the tiny thickness changes on the surface of the plastic package, which enhances the sensitivity of the laser detector and improves the detection accuracy.

[0019] 2. The wiping mechanism is linked to the thickness change of the plastic package surface, avoiding misjudgment caused by contamination of the lens of the detection head and ensuring the accuracy of the detection results. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a main perspective schematic diagram of the overall structure of the present invention;

[0021] Figure 2 For the present invention Figure 1 A right-side stereoscopic diagram of the structure;

[0022] Figure 3 For the present invention Figure 1 Schematic diagram of the back of the structure;

[0023] Figure 4 It is a three-dimensional schematic diagram of the structure of the laser detector of the present invention;

[0024] Figure 5 It is a three-dimensional schematic diagram of the shell structure of the present invention;

[0025] Figure 6 It is a top-down stereoscopic schematic diagram of the carrier box structure of the present invention after it is opened;

[0026] Figure 7 It is a schematic cross-sectional perspective view of the housing structure of the present invention;

[0027] Figure 8This is a schematic perspective sectional view of the rotating column structure of the present invention.

[0028] In the figure: 1, frame; 2, laser detector; 3, detection head; 41, housing; 42, first lever; 421, lower induction column; 422, ball; 423, first rotating shaft; 43, second lever; 431, upper induction column; 432, second rotating shaft; 44, connecting rod; 45, spring; 51, rotating column; 511, arc-shaped groove; 512, pull rod; 513, inserting rod; 52, carrying box; 53, mounting roller; 54, first guiding roller; 55, second guiding roller; 56, motor; 57, box cover; 58, wiping port; 6, first chain; 7, first guide rail; 8, second guide rail; 9, sensor bracket; 10, second chain; 11, track; 12, third chain; 13, cylinder; 14, push plate. Detailed implementation manners

[0029] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0030] Referring to the appendix Figure 1-8 , a semiconductor plastic encapsulation thickness detection device includes a frame 1 and a laser detector 2 installed thereon to measure the thickness of the plastic encapsulation. A detection head 3 is provided on the laser detector 2 for emitting and receiving laser signals. A thickness adjustment mechanism is provided on one side of the laser detector 2 close to the detection head 3. The thickness adjustment mechanism includes a housing 41 connected to the laser detector 2. A lower induction column 421 is provided at the bottom of the housing 41. The lower induction column 421 can only move in the vertical direction under the restriction of the housing 41. The bottom of the lower induction column 421 extends out of the housing 41, and a ball 422 is rotatably connected to its bottom. The ball 422 is a spherical structure, and its bottom extends beyond the lower induction column 421. An upper induction column 431 is provided at the top of the housing 41. The upper induction column 431 can only move in the vertical direction under the restriction of the housing 41. The upper induction column 431 is correspondingly arranged below the detection head 3. A lever unit is hinged in the housing 41. The lever unit is respectively connected to the lower induction column 421 and the upper induction column 431 to increase the relative displacement amount of the upper induction column 431.

[0031] During use, the ball 422 moves along the surface of the plastic-sealed body. When the thickness of the surface of the plastic-sealed body exceeds the standard, the ball 422 will contact the top of the plastic-sealed body and be pushed upward. At this time, the lower induction post 421 will also be pushed upward. At this time, under the drive of the lever unit, the upper induction post 431 will also be pushed upward. At this time, under the action of the lever unit, the upward movement distance of the upper induction post 431 is significantly greater than the upward movement distances of the ball 422 and the lower induction post 421, thereby relatively amplifying the minute change in the surface thickness of the plastic-sealed body, enhancing the sensitivity of the laser detector 2 to the thickness change, and thus improving the detection accuracy.

[0032] In order to amplify the displacement of the upper induction post 431, the lever unit includes a first lever 42 and a second lever 43 hinged in the housing 41. The two are horizontally arranged up and down, and one end of the two is connected by a connecting rod 44 so that the first lever 42 can drive the second lever 43 to move. The bottom of the first lever 42 is connected to the inner wall of the housing 41 through a spring 45 so that the first lever 42 and the second lever 43 maintain a balanced state. One end of the first lever 42 away from the connecting rod 44 is hinged to the lower induction post 421. On both sides of the first lever 42 near the lower induction post 421, there are first rotating shafts 423 connected to the housing 41 to control the displacement of both ends of the first lever 42. One end of the second lever 43 away from the connecting rod 44 is hinged to the upper induction post 431. On both sides of the second lever 43 near the connecting rod 44, there are second rotating shafts 432 connected to the housing 41 to control the displacement distance of both ends of the second lever 43. When the ball 422 at the bottom of the lower induction post 421 is squeezed by the plastic-sealed body, the first lever 42 rotates around the first rotating shaft 423 and drives the second lever 43 to rotate around the second rotating shaft 432 through the connecting rod 44, amplifying the relative displacement of the upper induction post 431 and making it easier for the laser detector 2 to sense the change in the surface thickness of the plastic-sealed body.

[0033] In order to keep the lens of the detection head 3 clean, a wiping mechanism is provided on the housing 41. The wiping mechanism includes a rotating column 51 rotatably connected to the top of the housing 41. On one side of the rotating column 51, there is a carrier box 52. The carrier box 52 is provided with a wiping port 58. A wiping cloth is installed in the wiping port 58. The wiping cloth is made of microfiber cloth and is located below the detection head 3 so that the wiping cloth fits the lens of the detection head 3. By controlling the rotation of the rotating column 51, the carrier box 52 can drive the wiping cloth to rotate. During this process, the wiping cloth can wipe the lens of the detection head 3 without the need for regular manual wiping.

[0034] The internal structure of the carrier box 52 is symmetric up and down. Inside the carrier box 52, mounting rollers 53, a first guide roller 54, and a second guide roller 55 are installed in pairs. The mounting roller 53 is detachably connected to the carrier box 52. A wiping cloth roller is installed on one of the mounting rollers 53. The wiping cloth on the wiping cloth roller passes through the first guide roller 54 and the second guide roller 55 in sequence and then is connected to the other mounting roller 53. The wiping cloth can be kept in a taut state so that the top of the wiping cloth fits the lens of the detection head 3. And one end of the mounting roller 53 connected to the tail end of the wiping cloth is connected with a motor 56. By starting the motor 56, the mounting roller 53 connected to it will rotate, thereby winding up the wiping cloth and avoiding the wiping cloth in contact with the lens of the detection head 3 being contaminated with more impurities and affecting the wiping effect.

[0035] A box cover 57 is covered on the top of the carrier box 52 to protect the wiping cloth from external pollution.

[0036] Both ends of the mounting roller 53 penetrate through the carrier box 52, and both ends thereof are screws. The outer wall of the screw is threadedly connected with nuts so that the mounting roller 53 is installed on the carrier box 52. There is a gap between the nuts on both sides and the side wall of the carrier box 52 to facilitate the rotation of the mounting roller 53 relative to the carrier box 52 and facilitate the disassembly of the mounting roller 53 and the replacement of a new wiping cloth roller.

[0037] The rotating column 51 is a hollow column. An arc-shaped groove 511 is circumferentially provided inside it and is inclinedly opened along its inner wall. A pull rod 512 is provided inside the rotating column 51. An insertion rod 513 inserted into the arc-shaped groove 511 is provided on the outer wall of the top of the pull rod 512. The bottom of the pull rod 512 is hinged to the top of the second lever 43 to control the rotation of the rotating column 51 through the deflection of the second lever 43. When the ball 422 is lifted by the top of the plastic package, at this time the second lever 43 will deflect, further causing the pull rod 512 to be pulled downward. At this time, the insertion rod 513 moves downward in the arc-shaped groove 511, causing the rotating column 51 to deflect, further causing the carrier box 52 to drive the wiping piece to deflect and wipe the lens of the detection head 3, thereby realizing the linkage control of the wiping of the lens of the detection head 3 and the change in the surface thickness of the plastic package, effectively preventing the problem of misjudgment of the surface thickness of the plastic package caused by the contamination of the surface of the detection head 3 lens, and ensuring the accuracy of the detection result.

[0038] In order to detect different positions of the plastic-sealed body, a bracket adjustment mechanism is provided on the frame 1. The bracket adjustment mechanism includes a first chain 6. One end of the first chain 6 is installed with a first guide rail 7. A second guide rail 8 perpendicular to the direction of the bottom of the first guide rail 7 is provided for the first guide rail 7 to slide thereon. The first chain 6 moves and drives the first guide rail 7 to move along the second guide rail 8. A sensor bracket 9 is slidably connected to the first guide rail 7. A second chain 10 connected to the sensor bracket 9 is provided on one side to drive the sensor bracket 9 to move along the direction of the first guide rail 7. The second chain 10 moves and drives the sensor bracket 9 to move along the first guide rail 7, thereby realizing the detection of different positions of the plastic-sealed body. The movement of the first chain 6 driving the first guide rail 7 and the movement of the second chain 10 driving the sensor bracket 9 belong to the prior art and will not be described in detail in this application. Laser detectors 2 are symmetrically arranged above and below the sensor bracket 9 to detect the upper and lower surfaces of the plastic-sealed body simultaneously, improving the detection efficiency.

[0039] A track 11 for carrying the plastic-sealed body is provided at the top of the frame 1. The plastic-sealed body moves along the track 11. A material pushing mechanism is provided inside the track 11. The material pushing mechanism includes a third chain 12. A cylinder 13 is provided on the third chain 12. The third chain 12 can drive the cylinder 13 to move and belongs to the prior art and will not be described in detail in this application. A push plate 14 for pushing the plastic-sealed body is provided at the output end of the cylinder 13. When it is necessary to push the plastic-sealed body, the third chain 12 drives the cylinder 13 and the push plate 14 to move. At this time, the push plate 14 pushes the plastic-sealed body to move along the track 11. When the push plate 14 pushes the plastic-sealed body to a suitable position, the output end of the cylinder 13 is controlled to retract, so that the push plate 14 can move downward. Then, after controlling the third chain 12 to return to the initial position, the output end of the cylinder 13 is controlled to extend upward, so that the push plate 14 can continue to push the plastic-sealed body at that place.

[0040] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0041] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor plastic package thickness detection device, comprising a frame (1) and a laser detector (2) mounted thereon, wherein a detection head (3) is provided on the laser detector (2), and is characterized in that: On one side of the laser detector (2) close to the detection head (3), there is a thickness adjustment mechanism. The thickness adjustment mechanism includes a housing (41) connected to the laser detector (2). At the bottom of the housing (41), there is a lower induction post (421). The bottom of the lower induction post (421) extends out of the housing (41), and a ball (422) is rotatably connected to its bottom. At the top of the housing (41), there is an upper induction post (431). The upper induction post (431) is correspondingly arranged below the detection head (3). A lever unit is hinged inside the housing (41). The lever unit is respectively connected to the lower induction post (421) and the upper induction post (431) to increase the relative displacement of the upper induction post (431). The lever unit includes a first lever (42) and a second lever (43) hinged inside the housing (41). One ends of the two are connected by a connecting rod (44) so that the first lever (42) can drive the second lever (43) to move. The bottom of the first lever (42) is connected to the inner wall of the housing (41) by a spring (45) so that the first lever (42) and the second lever (43) maintain a balanced state. The end of the first lever (42) away from the connecting rod (44) is hinged to the lower induction post (421). On both sides of the end of the first lever (42) close to the lower induction post (421), there are first rotating shafts (423) connected to the housing (41) to control the displacement of both ends of the first lever (42). The end of the second lever (43) away from the connecting rod (44) is hinged to the upper induction post (431). On both sides of the end of the second lever (43) close to the connecting rod (44), there are second rotating shafts (432) connected to the housing (41) to control the displacement distance of both ends of the second lever (43). A wiping mechanism is provided on the housing (41). The wiping mechanism includes a rotating column (51) rotatably connected to the top of the housing (41). On one side of the rotating column (51), there is a carrying box (52). The carrying box (52) is provided with a wiping opening (58). A wiping cloth is installed in the wiping opening (58), and it is located below the detection head (3) so that the wiping cloth fits the lens of the detection head (3). The rotating column (51) is a hollow column. An arc-shaped groove (511) is circumferentially provided inside it and is inclinedly opened along its inner wall. A pull rod (512) is provided inside the rotating column (51). A plug rod (513) inserted into the arc-shaped groove (511) is provided on the outer wall of the top of the pull rod (512). The bottom of the pull rod (512) is hinged to the top of the second lever (43) to control the rotation of the rotating column (51) through the deflection of the second lever (43).

2. The semiconductor plastic encapsulation thickness detection device according to claim 1, characterized in that: The internal structure of the carrier box (52) is symmetric up and down. In the carrier box (52), mounting rollers (53), a first guide roller (54), and a second guide roller (55) are installed in pairs. The mounting roller (53) is detachably connected to the carrier box (52). A wiping cloth roller is installed on one of the mounting rollers (53). The wiping cloth on the wiping cloth roller passes through the first guide roller (54) and the second guide roller (55) in sequence and then is connected to the other mounting roller (53), so that the top of the wiping cloth fits the lens of the detection head (3), and one end of the mounting roller (53) connected to the tail end of the wiping cloth is connected with a motor (56).

3. The semiconductor plastic package thickness detection device according to claim 1 or 2, characterized in that: A box cover (57) is covered on the top of the carrier box (52).

4. A semiconductor plastic package thickness detection device according to claim 2, characterized in that: Both ends of the mounting roller (53) penetrate the carrier box (52), and both ends thereof are screw rods. The outer wall of the screw rod is threadedly connected with nuts, so that the mounting roller (53) is installed on the carrier box (52). There are gaps between the nuts on both sides and the side wall of the carrier box (52) to facilitate the rotation of the mounting roller (53) relative to the carrier box (52).

5. The semiconductor plastic package thickness detection device according to claim 1, characterized in that: A bracket adjusting mechanism is provided on the frame (1). The bracket adjusting mechanism includes a first chain (6). One end of the first chain (6) is installed with a first guide rail (7). A second guide rail (8) perpendicular to the direction of the first guide rail (7) is provided at the bottom of the first guide rail (7) for the first guide rail (7) to slide thereon. A sensor bracket (9) is slidably connected to the first guide rail (7). A second chain (10) connected to the sensor bracket (9) is provided on one side thereof to drive the sensor bracket (9) to move along the direction of the first guide rail (7). Laser detectors (2) are symmetrically arranged on the upper and lower sides of the sensor bracket (9) to simultaneously detect the upper and lower surfaces of the plastic-sealed body.

6. The semiconductor plastic package thickness detection device according to claim 5, characterized in that: A track (11) for carrying the plastic-sealed body is provided on the top of the frame (1). A pushing mechanism is arranged in the track (11). The pushing mechanism includes a third chain (12). A cylinder (13) is arranged on the third chain (12). A push plate (14) for pushing the plastic-sealed body is arranged at the output end of the cylinder (13).

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