A highly versatile wafer testing method

Abstract

The invention discloses a highly versatile wafer testing method, which relates to the field of wafer testing technology. The universal fixture assembly includes an oil cylinder, an air cylinder, an oil branch pipe, a piston rod, a bearing plate, a guide rail, a sliding rod, a clamping block, a spring rod, a rack, a micro electric push rod and a locking tooth plate. The bottom of the oil cylinder is provided with an air cylinder, the surface of the bearing plate is fixed with a guide rail, and the top of the bearing plate is fixed with a micro electric push rod. The highly versatile wafer testing method, for wafer bodies of different diameters and thicknesses, when clamping them, the clamping block is synchronously extended to clamp the side of the wafer body through the flow of oil, thereby adapting to wafer bodies of different diameters, and before clamping, the bottom surface of the height-fixing plate is flush with the surface of the wafer body by pressing down the annular pressure plate, ensuring that the clamping block stably clamps the wafer body while avoiding the top of the clamping block protruding to affect the direct contact between the probe on the probe card and the test point of the wafer body.

Description

Technical Field

[0001] The invention relates to the technical field of wafer testing, and in particular to a highly versatile wafer testing method. Background Art

[0002] Wafer testing usually uses a probe card to perform electrical testing on it. Generally, the wafer is clamped and positioned. After positioning, the clamp is released to avoid interference between the probe card and the clamp. The electrical test is performed by directly contacting the probes on the surface of the probe card with the test points of the wafer.

[0003] In the existing wafer electrical testing process, after the clamping part clamps the wafer, the top height of the clamping part is likely to be higher than the wafer surface, which causes the probes on the probe card to interfere with the test points of the wafer when they contact. Therefore, the clamping part can only be released after the wafer positioning is completed, and then the electrical test can be carried out. However, when the clamping part is released, it is easy to deviate the wafer and cause alignment errors, thereby affecting the test accuracy.

[0004] Therefore, in view of this, the existing structure and defects are studied and improved, and a highly versatile wafer testing method is proposed. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides a highly versatile wafer testing method, which solves the problems raised in the above-mentioned background technology.

[0006] To achieve the above objectives, the present invention is implemented by the following technical scheme: a highly versatile wafer testing method, the highly versatile wafer testing method comprising the following steps:

[0007] Step 1: First, the electric pulley slides to the end of the test bench surface away from the test box, and the wafer body is placed on the placement platform surface in the universal fixture assembly by a robot or manually. Based on the thickness of the wafer body, the electric lifting rod is extended to drive the annular pressure plate to descend, so that the annular pressure plate presses down the clamping block to make it slide down along the inside of the guide rail through the sliding rod. At this time, the spring rod is forced to sink and the spring is compressed until the bottom surface of the height-fixing plate contacts the side of the wafer body. At this time, the electric lifting rod stops extending, and the micro electric push rod extends to make the locking gear plate engage with the rack, thereby fixing the height of the clamping block;

[0008] Step 2: For wafer bodies of different diameters, the pump body injects air into the annular pipe through the medium pipe to stretch the bellows to push the height setting plate to extend along the guide groove toward the center of the annular pressing plate, so that the radius between the center of the circle and the height setting plate can be adjusted, and the air can be extracted by the pump body to retract the height setting plate, so as to adapt to wafer bodies of different diameters and always overlap with the edge of their surface;

[0009] Step 3: After the height of the clamping block is fixed, the annular pressure plate rises, and the cylinder extends to press the piston at its end into the oil cylinder, so that the oil inside the oil cylinder enters the oil branch pipe to push the piston rod to extend, thereby making the carrier plate carry the clamping block close to the wafer body until the clamping block clamps the wafer body from the side, and at this time the top surface of the clamping block is flush with the side of the surface of the wafer body;

[0010] Step 4: After the wafer body is clamped stably, it is sent into the test box for testing by an electric pulley. At this time, since the top surface of the clamping block is flush with the side surface of the wafer body, the probe card and the clamping block used for testing do not affect each other. That is, the clamping block can stably clamp the wafer body without affecting the direct contact between the probes on the probe card and the test points of the wafer body due to the protrusion of its top surface.

[0011] Furthermore, the universal fixture assembly includes an oil cylinder, an air cylinder, an oil branch pipe, a piston rod, a bearing plate, a guide rail, a sliding rod, a clamping block, a spring rod, a rack, a micro electric push rod and a locking tooth plate. The air cylinder is arranged at the bottom of the oil cylinder, and the outer wall of the oil cylinder is connected to the oil branch pipe, a piston rod is passed through the end of the oil branch pipe, and a bearing plate is fixed to the end of the piston rod, a guide rail is fixed to the surface of the bearing plate, and a sliding rod is slidably connected to the inside of the guide rail, a clamping block is fixed to the outer wall of the sliding rod, and the bottom of the clamping block is connected to the spring rod, a rack is fixed to the side of the clamping block, a micro electric push rod is fixed to the top of the bearing plate, and a locking tooth plate is fixed to the end of the micro electric push rod.

[0012] Furthermore, an electric pulley is fixed to the bottom of the cylinder, and a test bench is fixed to the bottom of the electric pulley, and a test box is provided on one side of the test bench.

[0013] Furthermore, support rods are fixed on the surface of the electric pulley around the cylinder, and the top of the support rods is fixedly connected to the outer wall of the oil cylinder.

[0014] Furthermore, three clamping blocks are provided, and the clamping blocks are elastically connected to the bearing plate via spring rods.

[0015] Furthermore, a placing platform is fixed on the top of the oil cylinder, and a wafer body is placed on the surface of the placing platform.

[0016] Furthermore, a clamping block height adjustment assembly is arranged above the wafer body, and the clamping block height adjustment assembly includes an electric lifting rod and an annular pressure plate. An annular pressure plate is fixed to the bottom of the electric lifting rod, and the annular pressure plate is located directly above the clamping block.

[0017] Furthermore, the clamp height adjustment assembly also includes a guide groove and a height-fixing plate. The guide groove is opened inside the annular pressure plate, and the interior of the guide groove is slidably connected to the height-fixing plate, and the bottom surface of the height-fixing plate and the bottom surface of the annular pressure plate are located in the same horizontal plane.

[0018] Furthermore, the clamping block height adjustment assembly also includes an annular pipe and a medium pipe. The annular pipe is fixed to the upper surface of the annular pressure plate, and the surface of the annular pipe is connected to the medium pipe.

[0019] Furthermore, the clamping block height adjustment assembly also includes a bellows, the inner side surface of the annular pipe is provided with the bellows, and the end of the bellows is connected to the height-fixing plate.

[0020] The present invention provides a highly versatile wafer testing method, which has the following beneficial effects:

[0021] This highly versatile wafer testing method can adapt to wafer bodies of different diameters and thicknesses by allowing the flow of oil to cause the clamping block to synchronously extend and clamp the side of the wafer body when clamping the wafer bodies. Before clamping, the bottom surface of the height-fixing plate is flush with the surface of the wafer body by pressing down the annular pressure plate, thereby making the top of the clamping block flush with the surface of the wafer body, ensuring that the clamping block stably clamps the wafer body while preventing the top of the clamping block from protruding to affect the direct contact between the probe on the probe card and the test point of the wafer body, that is, the electrical test of the probe card can be performed while the wafer body is clamped. Therefore, the testing method of the present invention is highly versatile for wafer bodies of different diameters and thicknesses.

[0022] This highly versatile wafer testing method, for wafer bodies of different diameters, the pump body injects air into the annular pipe through the medium pipe to stretch the bellows to push the height-fixing plate to extend along the guide groove toward the center of the annular pressure plate, so that the radius size between the center of the circle and the height-fixing plate can be adjusted, and the air extracted by the pump body can cause the height-fixing plate to retract, thereby adapting to wafer bodies of different diameters so that they can always overlap with their surface edges, thereby ensuring that the top surface of the clamping block is always flush with the surface of the wafer bodies of different diameters. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 It is a schematic diagram of the structure of the placement platform of the present invention;

[0025] Figure 3 It is a schematic diagram of the structure of the locking tooth plate of the present invention;

[0026] Figure 4 It is a schematic diagram of the top surface structure of the annular pressing plate of the present invention;

[0027] Figure 5 It is a schematic diagram of the bottom surface structure of the annular pressure plate of the present invention.

[0028] In the figure: 1. Universal fixture assembly; 101. Oil cylinder; 102. Cylinder; 103. Oil branch pipe; 104. Piston rod; 105. Loading plate; 106. Guide rail; 107. Slide rod; 108. Clamping block; 109. Spring rod; 110. Rack; 111. Micro electric push rod; 112. Locking gear plate; 2. Electric pulley; 3. Test bench; 4. Test box; 5. Support rod; 6. Placement platform; 7. Wafer body; 8. Clamp height adjustment assembly; 801. Electric lifting rod; 802. Annular pressure plate; 803. Guide groove; 804. Fixed height plate; 805. Annular pipeline; 806. Medium pipe; 807. Bellows. DETAILED DESCRIPTION

[0029] The following is a further detailed description of the embodiments of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0030] like Figure 1-Figure 5 As shown, the present invention provides a technical solution: a highly versatile wafer testing method, the highly versatile wafer testing method comprises the following steps:

[0031] Step 1: First, the electric pulley 2 slides to the end of the test table 3 surface away from the test box 4, and the wafer body 7 is placed on the surface of the placement platform 6 in the universal fixture assembly 1 by a robot or manually. Based on the thickness of the wafer body 7, the electric lifting rod 801 is extended to drive the annular pressure plate 802 to descend, so that the annular pressure plate 802 presses down the clamping block 108 to make it slide down along the inside of the guide rail 106 through the slide rod 107. At this time, the spring rod 109 is forced to sink and the spring is compressed until the bottom surface of the height-fixing plate 804 contacts the side of the wafer body 7. At this time, the electric lifting rod 801 stops extending, and the micro electric push rod 111 extends to make the locking tooth plate 112 engage with the rack 110, thereby fixing the height of the clamping block 108;

[0032] Step 2: For wafer bodies 7 of different diameters, the pump body injects air into the annular pipe 805 through the medium pipe 806 to stretch the bellows 807 to push the height-setting plate 804 to extend along the guide groove 803 toward the center of the annular pressing plate 802, so that the radius between the center of the circle and the height-setting plate 804 can be adjusted, and the air can be extracted by the pump body to retract the height-setting plate 804, so as to adapt to wafer bodies 7 of different diameters so that they can always overlap with the edge of their surface;

[0033] Step 3: After the height of the clamping block 108 is fixed, the annular pressure plate 802 rises, and the cylinder 102 extends to press the piston at its end into the oil cylinder 101, so that the oil in the oil cylinder 101 enters the oil branch pipe 103 to push the piston rod 104 to extend, thereby making the carrier plate 105 carry the clamping block 108 close to the wafer body 7 until the clamping block 108 clamps the wafer body 7 from the side, and at this time, the top surface of the clamping block 108 is flush with the side of the surface of the wafer body 7;

[0034] Step 4: After the wafer body 7 is clamped stably, the electric pulley 2 slides it into the test box 4 for testing. At this time, since the top surface of the clamping block 108 is flush with the side surface of the wafer body 7, the probe card used for testing and the clamping block 108 do not affect each other. That is, the clamping block 108 can stably clamp the wafer body 7 without affecting the direct contact between the probe on the probe card and the test point of the wafer body 7 due to the protrusion of its top surface.

[0035] like Figure 1-Figure 5As shown, the universal clamp assembly 1 includes an oil cylinder 101, a cylinder 102, an oil branch pipe 103, a piston rod 104, a bearing plate 105, a guide rail 106, a slide bar 107, a clamping block 108, a spring rod 109, a rack 110, a micro electric push rod 111 and a locking tooth plate 112. The cylinder 102 is arranged at the bottom of the oil cylinder 101, and the outer wall of the oil cylinder 101 is connected to the oil branch pipe 103, the end of the oil branch pipe 103 is penetrated by the piston rod 104, and the end of the piston rod 104 is fixed A carrier plate 105 is fixed, a guide rail 106 is fixed on the surface of the carrier plate 105, and a slide bar 107 is slidably connected inside the guide rail 106, a clamping block 108 is fixed on the outer wall of the slide bar 107, and a spring rod 109 is connected to the bottom of the clamping block 108, a rack 110 is fixed to the side of the clamping block 108, a micro electric push rod 111 is fixed on the top of the carrier plate 105, and a locking toothed plate 112 is fixed on the end of the micro electric push rod 111, an electric pulley 2 is fixed to the bottom of the cylinder 102, and the electric A test bench 3 is fixed to the bottom of the pulley 2, and a test box 4 is arranged on one side of the test bench 3. A support rod 5 is fixed to the surface of the electric pulley 2 around the cylinder 102, and the top of the support rod 5 is fixedly connected to the outer wall of the oil cylinder 101. Three clamping blocks 108 are arranged, and the clamping blocks 108 are elastically connected to the carrier plate 105 through spring rods 109. A placement platform 6 is fixed to the top of the oil cylinder 101, and a wafer body 7 is placed on the surface of the placement platform 6. A clamping block height adjustment component 8 is arranged above the wafer body 7. The clamping block height adjustment assembly 8 includes an electric lifting rod 801 and an annular pressure plate 802. The annular pressure plate 802 is fixed to the bottom of the electric lifting rod 801, and the annular pressure plate 802 is located directly above the clamping block 108. The clamping block height adjustment assembly 8 also includes a guide groove 803 and a height-fixing plate 804. The annular pressure plate 802 is provided with a guide groove 803, and the guide groove 803 is slidably connected to the height-fixing plate 804, and the bottom surface of the height-fixing plate 804 is located at the same level as the bottom surface of the annular pressure plate 802.

[0036] The specific operation is as follows: the wafer body 7 is placed on the surface of the placement platform 6. Based on the thickness of the wafer body 7, the electric lifting rod 801 is extended to drive the annular pressure plate 802 to descend, so that the annular pressure plate 802 presses down the clamping block 108 so that it slides down along the inside of the guide rail 106 through the sliding rod 107. At this time, the spring rod 109 is forced to sink and the spring is compressed until the bottom surface of the height-fixing plate 804 contacts the side of the wafer body 7. At this time, the electric lifting rod 801 stops extending, and the micro-electric push rod 111 extends to make the locking tooth plate 112 engage with the rack 110, thereby fixing the height of the clamping block 108. Since the bottom surface of the height-fixing plate 804 and the bottom surface of the annular pressure plate 802 are The height-fixing plate 804 is located in the same horizontal plane, and the bottom surface of the height-fixing plate 804 contacts the side of the wafer body 7 after it is lowered, so that no matter how the thickness of the wafer body 7 changes, the height-fixing plate 804 will make the top surface of the clamping block 108 flush with the surface of the wafer body 7 after it is lowered, and then the annular pressure plate 802 rises after the height of the clamping block 108 is fixed, and the cylinder 102 is extended at this time to press the piston at its end into the oil cylinder 101, so that the oil in the oil cylinder 101 enters the oil branch pipe 103 to push the piston rod 104 to extend, so that the carrier plate 105 carries the clamping block 108 close to the wafer body 7 until the clamping block 108 clamps the wafer body 7 from the side thereof;

[0037] Among them, the oil cylinder 101 is fixedly connected to the electric pulley 2 through the support rod 5, thereby preventing the piston at the end of the cylinder 102 from driving the oil cylinder 101 to rise synchronously when it is extended, and the clamping block 108 is elastically connected to the carrier plate 105 through the spring rod 109, and the bottom end of the spring rod 109 passes through the bottom of the carrier plate 105. After the clamping block 108 is pressed down, the spring rod 109 sinks and the spring enters a compressed state. After the wafer body 7 is tested, the locking tooth plate 112 retracts and separates from the rack 110. At this time, the clamping block 108 is automatically reset and raised by the elastic action of the spring rod 109 for next use;

[0038] Based on the above description, the present invention is for wafer bodies 7 of different diameters and thicknesses. When clamping the wafer bodies 7, the oil flow causes the clamping block 108 to synchronously extend to clamp the side of the wafer body 7, thereby adapting to wafer bodies 7 of different diameters. Before clamping, the annular pressure plate 802 is pressed down to make the bottom surface of the height-setting plate 804 flush with the surface of the wafer body 7, thereby making the top of the clamping block 108 flush with the surface of the wafer body 7, ensuring that the clamping block 108 stably clamps the wafer body 7 while avoiding the top of the clamping block 108 protruding to affect the direct contact between the probe on the probe card and the test point of the wafer body 7. Therefore, the testing method of the present invention is highly versatile for wafer bodies 7 of different diameters and thicknesses.

[0039] like Figure 1-Figure 5As shown, the clamping block height adjustment assembly 8 further includes an annular pipe 805 and a medium pipe 806. The annular pipe 805 is fixed to the upper surface of the annular pressure plate 802, and the surface of the annular pipe 805 is connected to the medium pipe 806. The clamping block height adjustment assembly 8 further includes a bellows 807. The inner side of the annular pipe 805 is distributed with the bellows 807, and the end of the bellows 807 is connected to the height setting plate 804.

[0040] The specific operation is as follows: the clamping block 108 can be extended to clamp the wafer bodies 7 of different diameters. To adapt to this operation, for wafer bodies 7 of different diameters, the pump body injects air into the annular pipe 805 through the medium pipe 806 to extend the bellows 807 to push the height-fixing plate 804 along the guide groove 803 to extend toward the center of the annular pressure plate 802, so that the radius size between the center of the circle and the height-fixing plate 804 can be adjusted, and the air extracted by the pump body can make the height-fixing plate 804 retract, so as to adapt to wafer bodies 7 of different diameters so that they can always coincide with the edge of their surface, so as to ensure that the top surface of the clamping block 108 is always flush with the surface of the wafer bodies 7 of different diameters.

[0041] The embodiments of the present invention are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. A highly versatile wafer testing method, characterized in that: The highly versatile wafer testing method comprises the following steps: Step 1: First, the electric pulley (2) slides to the end of the test table (3) away from the test box (4), and the wafer body (7) is placed on the surface of the placement platform (6) in the universal fixture assembly (1) by a robot or manually. Based on the thickness of the wafer body (7), the electric lifting rod (801) is extended to drive the annular pressure plate (802) to descend, so that the annular pressure plate (802) presses down the clamping block (108) so that it slides down along the inside of the guide rail (106) through the slide rod (107). At this time, the spring rod (109) is forced to sink and the spring is compressed until the bottom surface of the height-fixing plate (804) contacts the side of the wafer body (7). At this time, the electric lifting rod (801) stops extending, and the micro electric push rod (111) extends to make the locking tooth plate (112) engage with the rack (110), thereby fixing the height of the clamping block (108); Step 2: For wafer bodies (7) of different diameters, the pump body injects air into the annular pipe (805) through the medium pipe (806) to stretch the bellows (807) to push the height-fixing plate (804) to extend along the inside of the guide groove (803) toward the center of the annular pressure plate (802), so that the radius size between the center of the circle and the height-fixing plate (804) can be adjusted, and the air can be extracted by the pump body to make the height-fixing plate (804) retract, so as to adapt to wafer bodies (7) of different diameters so that they can always overlap with the edge of their surface; Step 3: After the height of the clamping block (108) is fixed, the annular pressure plate (802) rises, and the cylinder (102) extends to press the piston at its end into the oil cylinder (101), so that the oil inside the oil cylinder (101) enters the oil branch pipe (103) to push the piston rod (104) to extend, thereby allowing the carrier plate (105) to carry the clamping block (108) close to the wafer body (7) until the clamping block (108) clamps the wafer body (7) from the side, and at this time the top surface of the clamping block (108) is flush with the side of the surface of the wafer body (7); Step 4: After the wafer body (7) is clamped and stabilized, the electric pulley (2) slides it into the test box (4) for testing. At this time, since the top surface of the clamping block (108) is flush with the side surface of the wafer body (7), the probe card used for testing and the clamping block (108) do not affect each other. That is, the clamping block (108) can stably clamp the wafer body (7) without affecting the direct contact between the probe on the probe card and the test point of the wafer body (7) due to the protrusion of its top surface.

2. A highly versatile wafer testing method according to claim 1, characterized in that: The universal clamp assembly (1) comprises an oil cylinder (101), a cylinder (102), an oil branch pipe (103), a piston rod (104), a bearing plate (105), a guide rail (106), a sliding rod (107), a clamping block (108), a spring rod (109), a rack (110), a micro electric push rod (111) and a locking toothed plate (112); the bottom of the oil cylinder (101) is provided with the cylinder (102), the outer wall of the oil cylinder (101) is connected with the oil branch pipe (103), the end of the oil branch pipe (103) is penetrated with a piston rod (104), and A bearing plate (105) is fixed to the end of the piston rod (104), a guide rail (106) is fixed to the surface of the bearing plate (105), and a slide rod (107) is slidably connected to the inside of the guide rail (106), a clamping block (108) is fixed to the outer wall of the slide rod (107), and a spring rod (109) is connected to the bottom of the clamping block (108), a rack (110) is fixed to the side of the clamping block (108), a micro electric push rod (111) is fixed to the top of the bearing plate (105), and a locking tooth plate (112) is fixed to the end of the micro electric push rod (111).

3. A highly versatile wafer testing method according to claim 2, characterized in that: An electric pulley (2) is fixed to the bottom of the cylinder (102), and a test bench (3) is fixed to the bottom of the electric pulley (2), and a test box (4) is provided on one side of the test bench (3).

4. A highly versatile wafer testing method according to claim 3, characterized in that: The surface of the electric pulley (2) is fixed with a support rod (5) around the cylinder (102), and the top of the support rod (5) is fixedly connected to the outer wall of the oil cylinder (101).

5. The highly versatile wafer testing method according to claim 2, characterized in that: Three clamping blocks (108) are provided, and the clamping blocks (108) are elastically connected to the bearing plate (105) via spring rods (109).

6. The highly versatile wafer testing method according to claim 2, characterized in that: A placement platform (6) is fixed on the top of the oil cylinder (101), and a wafer body (7) is placed on the surface of the placement platform (6).

7. A highly versatile wafer testing method according to claim 6, characterized in that: A clamping block height adjustment assembly (8) is arranged above the wafer body (7), and the clamping block height adjustment assembly (8) comprises an electric lifting rod (801) and an annular pressure plate (802). An annular pressure plate (802) is fixed to the bottom of the electric lifting rod (801), and the annular pressure plate (802) is located directly above the clamping block (108).

8. A highly versatile wafer testing method according to claim 7, characterized in that: The clamping block height adjustment assembly (8) further comprises a guide groove (803) and a height-fixing plate (804); the guide groove (803) is provided inside the annular pressure plate (802); the guide groove (803) is slidably connected inside the guide groove (803); and the bottom surface of the height-fixing plate (804) and the bottom surface of the annular pressure plate (802) are located on the same horizontal plane.

9. A highly versatile wafer testing method according to claim 8, characterized in that: The clamping block height adjustment assembly (8) further comprises an annular pipe (805) and a medium pipe (806); the annular pipe (805) is fixed to the upper surface of the annular pressure plate (802), and the surface of the annular pipe (805) is connected to the medium pipe (806).

10. A highly versatile wafer testing method according to claim 9, characterized in that: The clamping block height adjustment assembly (8) further comprises a bellows (807), the inner side surface of the annular pipe (805) is provided with the bellows (807), and the end of the bellows (807) is connected to the height-fixing plate (804).

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