Server heat dissipation device and server

Abstract

The invention relates to a server heat dissipation device and a server, and belongs to the field of servers, the server heat dissipation device comprises a case and a heat dissipation assembly arranged on the case, the case is square and comprises a bottom plate, a top plate and four side plates, and the heat dissipation assembly comprises two radiators arranged on the outer side surfaces of the side plates on the two opposite sides of the case; the radiator comprises a mounting frame detachably arranged in the case, a mounting space is formed in the mounting frame, a cooling fan with a reverse rotation function is mounted in the mounting space, one side, deviating from the case, of the mounting frame is opened, and the case is provided with an open window communicated with the mounting space corresponding to the mounting frame; a dustproof assembly is further included, a containing groove used for detachably installing the dustproof assembly is formed in the opening of the installation frame, the dustproof assembly is installed in the containing groove and then matched with the opening of the installation frame in a sealed mode, a heat dissipation bin is formed, and the heat dissipation fan is wrapped in the heat dissipation bin. The cleaning convenience of the server cooling fan can be effectively improved.

Description

Technical Field

[0001] The present invention relates to the field of servers, and in particular to a server heat dissipation device and a server. Background Art

[0002] A server is a computer system used to provide services, process data or store information. It generally includes a central processing unit, graphics card, memory, hard disk, power supply, motherboard and other components, all of which are housed in the server chassis.

[0003] The server generally needs to work continuously for a long time. During the operation, these components in the chassis will generate a lot of heat. Therefore, the server chassis is generally equipped with a heat dissipation device, usually a cooling fan, to dissipate the heat of these components so that the server can maintain a low operating temperature, thereby ensuring the normal operation of the server.

[0004] Although current server chassis are equipped with dustproof nets, the dustproof nets cannot completely prevent dust, and fine dust will still enter the chassis through the dustproof nets. The dust entering the chassis will cover the fan blades. The dust on the fan blades will increase the weight and resistance of the fan blades, causing the fan speed to decrease or the rotation to be unbalanced, which will affect the air flow ability of the fan and reduce the air circulation volume. In addition, the dust on the fan blades will change the shape of the fan blades, causing unstable airflow and generating vortexes, which will reduce the heat dissipation efficiency of the cooling fan. Therefore, during the operation of the server, it is necessary to clean the dust on the fan blades regularly. The dust cleaning process requires disassembling the chassis and powering off the cooling fan at the same time. Powering off the cooling fan requires shutting down the server and disconnecting the power supply of the server, which is bound to affect the continuous operation of the server and cause certain troubles to the use of the server.

[0005] Based on this, the present invention provides a server heat dissipation device and a server. By improving the server heat dissipation device, the technical effect of cleaning the heat dissipation fan without shutting down the server is achieved. Summary of the invention

[0006] Based on this, it is necessary to provide a server heat dissipation device, including a chassis, and a heat dissipation component arranged on the chassis, the chassis is square, including a bottom plate, a top plate and four side plates, and is characterized in that the heat dissipation component includes two radiators arranged on the outer surfaces of the side plates on opposite sides of the chassis, the radiator includes a mounting frame detachably arranged on the chassis, an mounting space is formed in the mounting frame, a heat dissipation fan with a reversing function is installed in the mounting space, the mounting frame is arranged with an opening on one side away from the chassis, and the chassis is provided with a window connected to the mounting space corresponding to the mounting frame; the two radiators on the chassis have the same air outlet direction, and their air outlet directions are perpendicular to the side plates of the chassis where they are located; it also includes a dustproof component, the opening of the mounting frame is provided with a receiving groove for detachably installing the dustproof component, and after the dustproof component is installed in the receiving groove, it is sealed and matched with the opening of the mounting frame to form a heat dissipation bin, and the heat dissipation bin covers the heat dissipation fan.

[0007] In the present invention, the chassis of the server heat dissipation device is used to accommodate components such as a central processing unit, a graphics card, a memory, a hard disk, a power supply, and a motherboard, and the heat dissipation component of the heat dissipation device is used to cool the inside of the chassis, specifically: the airflows generated by the two radiators arranged on both sides of the chassis have the same direction, which will cause the airflow outside the chassis to flow into the chassis from the radiator on one side, and then flow out of the chassis from the radiator on the other side after passing through the chassis, thereby achieving the purpose of cooling the components such as the central processing unit, the graphics card, the memory, the hard disk, the power supply, and the motherboard inside the chassis. In the present invention, the heat dissipation device also includes a dustproof component, which needs to be installed on the radiator blowing air toward the inside of the chassis, which can reduce the dust in the environment from entering the chassis through the radiator, and at the same time, it can also reduce the accumulation of dust on the blades of the heat dissipation fan of the radiator. At the same time, because the dustproof component reduces the amount of dust entering the chassis, the dust accumulated on the blades of the heat dissipation fan of the radiator arranged at the air outlet position of the chassis will also be reduced. Among them, since the airflow of the radiator located at the air outlet position of the chassis is outward, dust in the environment will not enter the chassis from the air outlet position of the chassis.

[0008] In the present invention, the radiator is arranged on the outside of the chassis. Therefore, when the blades of the cooling fan need to be cleaned, a cleaning tool such as a brush can be used directly at the opening of the mounting frame for cleaning without opening the chassis and without shutting down the server, which can effectively improve the cleaning convenience of the cooling fan blades. In the present invention, when cleaning, only the cooling fan blades blowing toward the outside of the chassis can be cleaned, because the outward airflow can prevent dust from falling into the chassis during the cleaning process, wherein the presence of the dustproof component can also prevent the operator from mistakenly cleaning the cooling fan blowing toward the inside of the chassis. When it is necessary to clean another cooling fan, it is necessary to replace the position of the dustproof component and change the direction of the two cooling fans.

[0009] In addition, the radiator is detachably mounted on the chassis through a detachable connection structure between the mounting frame and the chassis. Therefore, when the blades of the cooling fan need to be further cleaned, the radiator can be removed from the chassis for cleaning. In order to ensure that the server still has a cooling effect during the cleaning process, the two radiators in the cooling assembly can be cleaned one by one to ensure that there is always a radiator to cool the server. Similarly, for the radiator left on the chassis for cooling, its wind direction needs to be changed to blow toward the inside of the chassis, and a dustproof assembly needs to be installed on the radiator so that its cooling process still has a protective effect against dust. It is worth noting that in order to facilitate the disassembly and cleaning of the cooling fan when the server is running, the cooling fan preferably uses a power supply that is independent of the server motherboard power supply to prevent the cleaning process from affecting the server power supply.

[0010] In addition, in the present invention, during the heat dissipation process of the heat dissipation device, the wind direction is from one side of the chassis to the outside, and leaves the chassis from the other side of the chassis. Therefore, the cooling fan located at the air inlet position of the chassis will accumulate more dust than another cooling fan, and most of the dust is located on the windward side of the cooling fan. Therefore, the present invention adopts a reversible cooling fan, so that the cooling fan is reversed, and the positions of the air inlet position and the air outlet position of the switching chassis can effectively blow the dust on the cooling fan blades originally located at the air inlet position away from the blades, which can greatly reduce the accumulation speed and amount of dust on the cooling fan, can effectively reduce the cleaning frequency of the cooling fan, and improve its convenience of use.

[0011] Furthermore, the dustproof component includes a square-shaped outer frame, and a dustproof net is fixedly installed on the inner side of the outer frame; the installation frame is square-shaped, and the upper side wall, the lower side wall and the inner side of the two side walls of the installation frame are all provided with grooves at one end away from the chassis, and the grooves on the upper side wall, the lower side wall and the two side walls are combined to form the accommodating groove, and the accommodating groove extends upward from the top end of the installation frame, and a through groove is formed on the upper side wall of the installation frame; the dustproof component is inserted into the accommodating groove through the through groove, and the outer frame of the dustproof component is embedded in the groove.

[0012] In the present invention, the dustproof component can be inserted into the receiving groove through the through groove, and the dustproof component inserted in the receiving groove can block the opening of the installation frame, wherein the outer frame of the dustproof component is embedded in the groove of the installation frame and sealed with the installation frame, which can effectively block dust and make the dust enter the installation frame only through the dustproof net.

[0013] Furthermore, a first mounting groove is opened on a side wall of the through groove, and a baffle is retractably arranged in the first mounting groove through a spring, and the distance between the baffle and the bottom of the accommodating groove is the same as the height of the outer frame of the dustproof component.

[0014] In the present invention, the distance between the baffle and the bottom of the receiving groove is the same as the height of the dustproof component outer frame. Therefore, after the dustproof component is embedded in the receiving groove, the baffle can press the dustproof component in the receiving groove to fix the dustproof component and ensure the stability of the sealing structure between the dustproof component and the installation frame. In order to further increase the sealing between the dustproof component and the installation frame, a sealing ring can be arranged in the groove and the through groove of the installation frame, and the sealing is increased by the abutment between the sealing ring and the outer frame of the dustproof component.

[0015] Furthermore, an adjustment groove connected to the first mounting groove is provided on the upper surface of the upper side wall of the mounting frame corresponding to the first mounting groove, and the length direction of the adjustment groove is arranged along the moving direction of the baffle plate. A lever is fixedly arranged on the baffle plate corresponding to the adjustment groove, and the lever extends outward from the adjustment groove.

[0016] In the present invention, the lever is fixedly connected to the baffle plate to control the extension and retraction of the baffle plate, thereby improving the convenience of the dustproof component disassembly process.

[0017] Furthermore, a cleaning head is provided on the side of the bottom end of the outer frame facing the chassis, and the cleaning head includes a mounting rod fixedly provided on the bottom end of the outer frame, and a plurality of bristles fixedly provided on the end of the mounting rod away from the outer frame; a through groove is provided on the upper side wall of the mounting frame corresponding to the cleaning head, and the through groove is connected to the through groove for the passage of the cleaning head; a closing block is provided on the side of the top end of the outer frame facing the chassis corresponding to the cleaning head, and the closing block matches the through groove, and is used to be embedded in the through groove and seal with the through groove.

[0018] In the present invention, the length of the mounting rod needs to be determined according to the position of the cooling fan in the radiator to ensure that the bristles on the mounting rod can abut against the blades of the cooling fan. At this time, during the process of installing and disassembling the dustproof component, since the dustproof component can only move up and down along the accommodating groove, the bristles on the mounting rod can play a certain cleaning role on the blades of the cooling fan. Therefore, in the process of regularly switching the direction of the cooling fan, the accumulation speed and amount of dust on the cooling fan blades can be further reduced. In the process of loading and unloading the dustproof component, there is no need to stop the rotation of the cooling fan, and the short-term contact between the soft bristles and the cooling fan will not damage the cooling fan.

[0019] In the present invention, the closing block arranged on the outer frame of the dustproof component is used to block the through groove to ensure the sealing between the dustproof component and the installation frame. At the same time, the existence of the closing block also has an anti-fool effect, which can prevent the dustproof component from being installed upside down.

[0020] Furthermore, the heat dissipation component also includes a trigger switch for changing the direction of the two cooling fans. The number of the trigger switches is two, which are respectively arranged in the receiving slots of the two radiators, and the trigger switch is triggered when the dustproof component is inserted into the receiving slot.

[0021] In the present invention, when the heat dissipation device is working, the dustproof component is inserted into the radiator at the air inlet position of the chassis. At this time, the dustproof component plays a role in preventing dust from entering the chassis. When the dustproof component is replaced on another radiator, the trigger switch on the radiator will be triggered. At this time, the radiator with the newly installed dustproof component will be converted to blow air into the chassis, and the other radiator will be converted to blow air outside the chassis. In this way, the direction of the heat dissipation device will change, and the dustproof component can still play the role of a dustproof component, which can facilitate the regular conversion of the direction of the heat dissipation fan, that is, it is convenient to convert the wind direction of the heat dissipation device. Among them, the heat dissipation fans of the two radiators need to use a common control circuit for synchronous control, and the two trigger switches are connected to this control circuit to realize the control of the two trigger switches on the forward and reverse rotation of the heat dissipation fans.

[0022] Furthermore, a second mounting groove is provided at the bottom of one of the grooves on the two side walls of the mounting frame, and the trigger switch is installed in the second mounting groove. The trigger switch includes a trigger rod, and the upper end of the trigger rod is fixedly connected to a rotating shaft, and the rotating shaft is rotatably arranged in the second mounting groove, and the lower end of the trigger rod is inclined toward the inner side of the accommodating groove and extends out of the first mounting groove, and the lower end of the trigger rod is connected to the bottom of the groove through a spring; the trigger switch also includes a button switch fixedly arranged in the groove through a support arm, and the button switch is located above the rotating shaft; the trigger switch also includes a pressure rod arranged on the rotating shaft, the lower end of the pressure rod is fixedly connected to the rotating shaft, and the upper end of the pressure rod is located on the outside of the button switch for pressing the button switch.

[0023] In the present invention, the upper end of the pressure rod is located outside the push button switch, that is, the upper end of the pressure rod is located on the side of the push button switch away from the center of the accommodating groove.

[0024] In the present invention, during the installation of the dust screen, the dust screen outer frame will push the trigger rod to swing downward, thereby driving the rotating shaft to rotate, and then driving the pressure rod to swing toward the button switch, and finally causing the pressure rod to press the button switch, thereby triggering the button switch. When the dust screen is removed, after the dust screen outer frame no longer abuts against the trigger rod, the trigger rod will reset under the action of the spring, causing the pressure rod to leave the button switch.

[0025] Furthermore, a mounting ring is fixedly provided at the bottom end of the outer wall of the mounting frame, and a plurality of through holes are formed on the mounting ring, and threaded mounting holes are formed on the side panels of the chassis corresponding to the through holes, and the mounting frame is detachably provided on the side wall of the chassis by a bolt connection structure passing through the through holes and the threaded mounting holes.

[0026] In the present invention, the mounting frame is detachably mounted on the side panel of the chassis via a bolt connection structure between the mounting ring thereon and the side panel of the chassis, which can facilitate the disassembly and assembly of the radiator on the chassis. In order to improve the sealing between the mounting frame and the side panel of the chassis, an annular receiving groove can be provided on the side surface of the mounting ring facing the chassis, and a sealing ring can be placed in the annular receiving groove to improve its sealing.

[0027] On the other hand, the present invention further provides a server having the heat dissipation device described above.

[0028] Furthermore, the server also includes a mainboard, which is horizontally arranged and fixed in the middle of the chassis by a bracket, dividing the internal space of the chassis into a first heat dissipation cavity and a second heat dissipation cavity arranged up and down; the number of heat dissipation components on the chassis is two groups, and the two radiators of the two heat dissipation components are respectively arranged on opposite sides of the first heat dissipation cavity and the second heat dissipation cavity.

[0029] In the present invention, the chassis is divided into a first heat dissipation chamber and a second heat dissipation chamber arranged in an upper and lower position, which can reduce the cross-sectional area of ​​the airflow channel of the heat dissipation component, so that the airflow is more concentrated, and the heat in the chassis can be taken away more efficiently, thereby improving the heat dissipation efficiency. Preferably, the first heat dissipation chamber and the second heat dissipation chamber are in the shape of a regular quadrangular prism arranged along the airflow direction of the heat dissipation component; further preferably, the central processing unit, graphics card, and power supply on the mainboard with a larger heat generation are arranged on the upper surface of the mainboard, and the memory and hard disk on the mainboard with a smaller heat generation are arranged on the lower surface of the mainboard. In this way, most of the heat in the chassis will be concentrated in the first heat dissipation chamber. At this time, the heat dissipation fan located on the first heat dissipation chamber can use a heat dissipation fan with a larger power, so that the chassis can be dissipated in a targeted manner, so that it has a better heat dissipation efficiency, and the heat dissipation fan on the second heat dissipation box can use a heat dissipation fan with a smaller power, which has a certain energy-saving effect.

[0030] The principle and effect of the present invention are further described below in combination with the above technical solutions and the accompanying drawings: In the present invention, the radiator is arranged on the outside of the chassis. Therefore, when the blades of the cooling fan need to be cleaned, a cleaning tool such as a brush can be used directly at the opening of the mounting frame for cleaning without opening the chassis or shutting down the server, which can effectively improve the cleaning convenience of the cooling fan blades.

[0031] In addition, in the present invention, during the heat dissipation process of the heat dissipation device, the wind direction is from one side of the chassis to the outside, and leaves the chassis from the other side of the chassis. Therefore, the cooling fan located at the air inlet position of the chassis will accumulate more dust than another cooling fan, and most of the dust is located on the windward side of the cooling fan. Therefore, the present invention adopts a reversible cooling fan, so that the cooling fan is reversed, and the positions of the air inlet position and the air outlet position of the switching chassis can effectively blow the dust on the cooling fan blades originally located at the air inlet position away from the blades, which can greatly reduce the accumulation speed and amount of dust on the cooling fan, can effectively reduce the cleaning frequency of the cooling fan, and improve its convenience of use. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic cross-sectional structure diagram of a server heat dissipation device according to an embodiment of the present invention; Figure 2 is a schematic cross-sectional structure diagram of a heat sink according to an embodiment of the present invention; Figure 3 for Figure 2 A partial enlarged view of Figure 4 This is a schematic diagram of the structure of the dustproof component according to an embodiment of the present invention; Figure 5 It is a schematic cross-sectional structure diagram of the heat sink according to the embodiment of the present invention when a dustproof component is installed; Figure 6 It is a schematic cross-sectional structure diagram of the server according to an embodiment of the present invention; Figure 7 for Figure 6 A partial enlarged view of . Attached photos

[0033] 11-chassis, 111-top plate, 112-side plate, 121-mounting frame, 1211-mounting ring, 1212-through hole, 1213-baffle, 1214-adjusting slot, 1215-lever, 1216-through slot, 1217-second mounting slot, 122-mounting space, 123-groove, 124-through slot, 1251-trigger rod, 1252-rotating shaft, 1253-pressure rod, 1254-spring, 1255-support arm, 1256-button switch, 13-cooling fan, 141-outer frame, 142-dust net, 143-mounting rod, 1431-brush, 144-closing block. DETAILED DESCRIPTION

[0034] In order to facilitate understanding by those skilled in the art, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments: like Figure 1-6A server heat dissipation device comprises a chassis 11 and a heat dissipation assembly arranged on the chassis 11, wherein the chassis 11 is square and comprises a bottom plate, a top plate 111 and four side plates 112, wherein the heat dissipation assembly comprises two heat sinks arranged on the outer surfaces of the side plates 112 on opposite sides of the chassis 11, wherein the heat sink comprises a mounting frame 121 detachably arranged on the chassis 11, wherein an mounting space 122 is formed in the mounting frame 121, wherein a heat dissipation fan 13 with a reversing function is installed in the mounting space 122, wherein the mounting frame 121 An opening is set on one side away from the chassis 11, and the chassis 11 is provided with a window connected to the installation space 122 corresponding to the installation frame 121; the air outlet directions of the two radiators on the chassis 11 are the same, and their air outlet directions are perpendicular to the side panel 112 of the chassis 11 where they are located; it also includes a dustproof component, and the opening of the installation frame 121 is provided with a receiving groove for detachably installing the dustproof component. After the dustproof component is installed in the receiving groove, it is sealed with the opening of the installation frame 121 to form a heat dissipation bin, and the heat dissipation bin covers the cooling fan 13.

[0035] In the present invention, the chassis 11 of the server heat dissipation device is used to accommodate components such as a central processing unit, a graphics card, a memory, a hard disk, a power supply, and a motherboard. The heat dissipation component of the heat dissipation device is used to cool the inside of the chassis 11. Specifically, the airflows generated by the two heat sinks arranged on both sides of the chassis 11 have the same direction, which will cause the airflow outside the chassis 11 to flow into the chassis 11 from the heat sink on one side, and then flow out of the chassis 11 from the heat sink on the other side after passing through the chassis 11, thereby achieving the purpose of cooling the components such as the central processing unit, the graphics card, the memory, the hard disk, the power supply, and the motherboard inside the chassis 11. In the present invention, the heat dissipation device also includes a dustproof component, which needs to be installed on the heat sink blowing toward the inside of the chassis 11, which can reduce the dust in the environment from entering the chassis 11 through the heat sink, and at the same time, it can also reduce the accumulation of dust on the blades of the heat dissipation fan 13 of the heat sink. At the same time, since the dustproof component reduces the amount of dust entering the chassis 11, the dust accumulated on the blades of the heat dissipation fan 13 of the heat sink arranged at the air outlet position of the chassis 11 will also be reduced. Among them, since the airflow of the radiator located at the air outlet position of the chassis 11 is outward, dust in the environment will not enter the chassis 11 from the air outlet position of the chassis 11.

[0036] In the present invention, the radiator is arranged on the outside of the chassis 11. Therefore, when the blades of the cooling fan 13 need to be cleaned, a cleaning tool such as a brush can be used directly at the opening of the mounting frame 121 for cleaning, without opening the chassis 11 and without shutting down the server, which can effectively improve the cleaning convenience of the cooling fan 13 blades. In the present invention, when cleaning, only the cooling fan 13 blades blowing toward the outside of the chassis 11 can be cleaned, because the outward airflow can prevent dust from falling into the chassis 11 during the cleaning process, wherein the presence of the dustproof component can also prevent the operator from mistakenly cleaning the cooling fan 13 blowing toward the inside of the chassis 11. When it is necessary to clean another cooling fan 13, it is necessary to replace the position of the dustproof component and change the direction of the two cooling fans 13.

[0037] In addition, the radiator is detachably mounted on the chassis 11 through a detachable connection structure between the mounting frame 121 and the chassis 11. Therefore, when the blades of the cooling fan 13 need to be further cleaned, the radiator can be removed from the chassis 11 for cleaning. In order for the server to still have a heat dissipation effect during the cleaning process, the two radiators in the heat dissipation assembly can be cleaned one by one to ensure that there is always a radiator to dissipate heat for the server. Similarly, for the radiator left on the chassis 11 for heat dissipation, its wind direction needs to be changed to blow toward the inside of the chassis 11, and a dustproof assembly needs to be installed on the radiator so that its heat dissipation process still has a protective effect against dust. It is worth noting that in order to facilitate the disassembly and cleaning of the cooling fan 13 when the server is running, the cooling fan 13 preferably uses a power supply that is independent of the server motherboard power supply to prevent the cleaning process from affecting the server power supply.

[0038] In addition, in the present invention, during the heat dissipation process of the heat dissipation device, the wind direction is from one side of the chassis 11 to the outside, and leaves the chassis 11 from the other side of the chassis 11. Therefore, the cooling fan 13 located at the air inlet position of the chassis 11 will accumulate more dust than the other cooling fan 13, and most of the dust is located on the windward side of the cooling fan 13. Therefore, the present invention adopts a reversible cooling fan 13, so that the cooling fan 13 is reversed, and the air inlet position and the air outlet position of the switching chassis 11 are effectively blown away from the blades of the cooling fan 13 originally located at the air inlet position, which can greatly reduce the accumulation speed and amount of dust on the cooling fan 13, and can effectively reduce the cleaning frequency of the cooling fan 13, thereby improving its ease of use.

[0039] In one embodiment, the dustproof component includes a square frame-shaped outer frame 141, and a dustproof net 142 is fixedly arranged on the inner side of the outer frame 141; the installation frame 121 is square frame-shaped, and the upper side wall, the lower side wall and the inner side of the two side walls of the installation frame 121 at one end away from the chassis 11 are all provided with grooves 12, and the grooves 12 on the upper side wall, the lower side wall and the two side walls are combined to form the accommodating groove, and the accommodating groove extends upward from the top end of the installation frame 121, and a through groove 124 is formed on the upper side wall of the installation frame 121; the dustproof component is inserted into the accommodating groove through the through groove 124, and the outer frame 141 of the dustproof component is embedded in the groove 12.

[0040] In this embodiment, the dustproof component can be inserted into the receiving groove through the through groove 124, and the dustproof component inserted in the receiving groove can block the opening of the installation frame 121, wherein the outer frame 141 of the dustproof component is embedded in the groove 12 of the installation frame 121, and is sealed with the installation frame 121, which can effectively block dust, so that dust can only enter the installation frame 121 through the dustproof net 142.

[0041] In one embodiment, a first mounting groove is opened on a side wall of the through groove 124, and a baffle 1213 is retractably provided in the first mounting groove through a spring 1254, and the distance between the baffle 1213 and the bottom of the accommodating groove is the same as the height of the outer frame 141 of the dustproof component.

[0042] In this embodiment, the distance between the baffle 1213 and the bottom of the receiving groove is the same as the height of the dustproof component outer frame 141. Therefore, after the dustproof component is embedded in the receiving groove, the baffle 1213 can press the dustproof component in the receiving groove to fix the dustproof component, and ensure the stability of the sealing structure between the dustproof component and the mounting frame 121. In order to further increase the sealing between the dustproof component and the mounting frame 121, a sealing ring can be set in the groove 12 and the through groove 124 of the mounting frame 121, and the sealing is increased by the contact between the sealing ring and the dustproof component outer frame 141. In order to facilitate the disassembly and assembly of the dustproof component, a handle can be set at the top of the outer frame 141.

[0043] In one embodiment, an upper surface of the upper side wall of the mounting frame 121 is provided with an adjustment groove 1214 corresponding to the first mounting groove and connected to the first mounting groove, and the length direction of the adjustment groove 1214 is arranged along the moving direction of the baffle 1213, and a lever 1215 is fixedly provided on the baffle 1213 corresponding to the adjustment groove 1214, and the lever 1215 is extended outward from the adjustment groove 1214.

[0044] In this embodiment, the lever 1215 is fixedly connected to the baffle 1213 to control the extension and retraction of the baffle 1213, thereby improving the convenience of the dustproof component disassembly process.

[0045] In one embodiment, a cleaning head is provided at the bottom end of the outer frame 141 facing the side of the chassis 11, and the cleaning head includes a mounting rod 143 fixedly provided at the bottom end of the outer frame 141, and a plurality of bristles 1431 fixedly provided at the end of the mounting rod 143 away from the outer frame 141; a through groove 1216 is provided on the upper side wall of the mounting frame 121 corresponding to the cleaning head, and the through groove 1216 passes through the upper side wall of the mounting frame 121 from top to bottom, and the through groove 1216 is connected to the through groove 124 for the passage of the cleaning head; a closing block 144 is provided on the top end of the outer frame 141 facing the side of the chassis 11 corresponding to the cleaning head, and the closing block 144 matches the through groove 1216, and is used to be embedded in the through groove 1216 and sealed with the through groove 1216.

[0046] In this embodiment, the length of the mounting rod 143 needs to be determined according to the position of the cooling fan 13 in the radiator to ensure that the bristles 1431 on the mounting rod 143 can abut against the blades of the cooling fan 13. At this time, during the process of installing and disassembling the dustproof component, since the dustproof component can only move up and down along the accommodating groove, the bristles 1431 on the mounting rod 143 can play a certain cleaning role on the blades of the cooling fan 13. Therefore, in the process of regularly switching the direction of the cooling fan 13, the accumulation speed and amount of dust on the blades of the cooling fan 13 can be further reduced. In the process of loading and unloading the dustproof component, there is no need to stop the rotation of the cooling fan 13, and the short-term contact between the soft bristles 1431 and the cooling fan 13 will not damage the cooling fan 13.

[0047] In this embodiment, the closing block 144 provided on the dustproof component outer frame 141 is used to block the through groove 1216 to ensure the sealing between the dustproof component and the mounting frame 121. At the same time, the existence of the closing block 144 also has an anti-mistake effect, which can prevent the dustproof component from being installed upside down.

[0048] In one embodiment, the heat dissipation component also includes a trigger switch for changing the direction of the two heat dissipation fans 13. The number of the trigger switches is two, which are respectively arranged in the receiving slots of the two radiators, and the trigger switch is triggered when the dustproof component is inserted into the receiving slot.

[0049] In this embodiment, when the heat dissipation device is working, the dustproof component is inserted into the radiator at the air inlet position of the chassis 11. At this time, the dustproof component plays a role in preventing dust from entering the chassis 11. When the dustproof component is replaced on another radiator, the trigger switch on the radiator will be triggered. At this time, the radiator with the newly installed dustproof component will be converted to blow air into the chassis 11, and the other radiator will be converted to blow air outside the chassis 11. In this way, the direction of the heat dissipation device will change, and the dustproof component can still play the role of a dustproof component, which can facilitate the regular conversion of the direction of the heat dissipation fan 13, that is, it is convenient to convert the wind direction of the heat dissipation device. Among them, the heat dissipation fans 13 of the two radiators need to use a common control circuit for synchronous control, and the two trigger switches are connected to this control circuit to realize the control of the two trigger switches on the forward and reverse rotation of the heat dissipation fan 13.

[0050] In one embodiment, a second mounting groove 1217 is provided at the bottom of one of the grooves 12 of the two side walls of the mounting frame 121, and the trigger switch is installed in the second mounting groove 1217. The trigger switch includes a trigger rod 1251, and the upper end of the trigger rod 1251 is fixedly connected to a rotating shaft 1252, and the rotating shaft 1252 is rotatably arranged in the second mounting groove 1217. The lower end of the trigger rod 1251 is inclined toward the inner side of the receiving groove and extends out of the first mounting groove, and the trigger rod 1251 is arranged The lower end of 51 is connected to the bottom of the groove 12 through a spring 1254; the trigger switch also includes a button switch 1256 fixedly arranged on the groove 12 through a support arm 1255, and the button switch 1256 is located above the rotating shaft 1252; the trigger switch also includes a pressure rod 1253 arranged on the rotating shaft 1252, the lower end of the pressure rod 1253 is fixedly connected to the rotating shaft 1252, and the upper end of the pressure rod 1253 is located on the outside of the button switch 1256, for pressing the button switch 1256.

[0051] In this embodiment, the upper end of the pressing rod 1253 is located on the outside of the button switch 1256, that is, the upper end of the pressing rod 1253 is located on the side of the button switch 1256 away from the center of the accommodating groove.

[0052] In this embodiment, during the installation of the dustproof net 142, the outer frame 141 of the dustproof net 142 pushes the trigger rod 1251 to swing downward, thereby driving the rotating shaft 1252 to rotate, and then driving the pressing rod 1253 to swing toward the button switch 1256, and finally causing the pressing rod 1253 to press the button switch 1256, thereby triggering the button switch 1256. When the dustproof net 142 is removed, after the outer frame 141 of the dustproof net 142 no longer abuts against the trigger rod 1251, the trigger rod 1251 will reset under the action of the spring 1254, causing the pressing rod 1253 to leave the button switch 1256.

[0053] In one embodiment, a mounting ring 1211 is fixedly provided at the bottom end of the outer wall of the mounting frame 121, and a plurality of through holes 1212 are formed on the mounting ring 1211, and threaded mounting holes corresponding to the through holes 1212 are formed on the side panel 112 of the chassis 11, and the mounting frame 121 is detachably arranged on the side wall of the chassis 11 by a bolt connection structure passing through the through holes 1212 and the threaded mounting holes.

[0054] In this embodiment, the mounting frame 121 is detachably mounted on the side panel 112 of the chassis 11 through a bolt connection structure between the mounting ring 1211 thereon and the side panel 112 of the chassis 11, which can facilitate the disassembly and assembly of the radiator on the chassis 11. In order to improve the sealing between the mounting frame 121 and the side panel 112 of the chassis 11, an annular receiving groove can be provided on the side surface of the mounting ring 1211 facing the chassis 11, and a sealing ring can be placed in the annular receiving groove to improve its sealing.

[0055] On the other hand, the present invention further provides a server having the heat dissipation device described above.

[0056] In one embodiment, the server further includes a motherboard, which is horizontally arranged and fixed in the middle of the chassis 11 by a bracket, dividing the internal space of the chassis 11 into a first heat dissipation cavity and a second heat dissipation cavity arranged up and down; the number of heat dissipation components on the chassis 11 is two groups, and the two radiators of the two heat dissipation components are respectively arranged on opposite sides of the first heat dissipation cavity and the second heat dissipation cavity.

[0057] In this embodiment, the chassis 11 is divided into a first heat dissipation chamber and a second heat dissipation chamber arranged in the upper and lower parts, which can reduce the cross-sectional area of ​​the airflow channel of the heat dissipation component, so that the airflow is more concentrated, and the heat in the chassis 11 can be taken away more efficiently, thereby improving the heat dissipation efficiency. Preferably, the first heat dissipation chamber and the second heat dissipation chamber are in the shape of a regular quadrangular prism arranged along the airflow direction of the heat dissipation component; further preferably, the central processing unit, graphics card, and power supply on the mainboard with a larger heat generation are arranged on the upper surface of the mainboard, and the memory and hard disk on the mainboard with a smaller heat generation are arranged on the lower surface of the mainboard, so that most of the heat in the chassis 11 will be concentrated in the first heat dissipation chamber. At this time, the heat dissipation fan 13 located on the first heat dissipation chamber can use a heat dissipation fan 13 with a larger power, so that the chassis 11 can be dissipated in a targeted manner, so that it has a better heat dissipation efficiency, and the heat dissipation fan 13 on the second heat dissipation box can use a heat dissipation fan with a smaller power, which has a certain energy-saving effect.

[0058] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A server heat dissipation device, comprising a chassis and a heat dissipation assembly arranged on the chassis, wherein the chassis is square and comprises a bottom plate, a top plate and four side plates, and is characterized in that: The heat dissipation assembly includes two radiators arranged on the outer surfaces of side panels on opposite sides of the chassis, the radiator includes an installation frame detachably arranged on the chassis, an installation space is formed in the installation frame, a cooling fan with a reversing function is installed in the installation space, the installation frame is opened on one side away from the chassis, and the chassis is provided with a window connected to the installation space corresponding to the installation frame; the two radiators on the chassis have the same air outlet direction, and their air outlet directions are perpendicular to the side panels of the chassis where they are located; it also includes a dustproof assembly, the opening of the installation frame is provided with a receiving groove for detachably installing the dustproof assembly, and after the dustproof assembly is installed in the receiving groove, it is sealed and matched with the opening of the installation frame to form a heat dissipation bin, and the heat dissipation bin covers the heat dissipation fan.

2. A server heat dissipation device according to claim 1, characterized in that: The dustproof component includes a square frame, and a dustproof net is fixedly installed on the inner side of the outer frame; the installation frame is square frame-shaped, and the upper side wall, the lower side wall and the inner side of the two side walls of the installation frame at one end away from the chassis are all provided with grooves, and the grooves on the upper side wall, the lower side wall and the two side walls are combined to form the accommodating groove, and the accommodating groove extends upward from the top end of the installation frame, and a through groove is formed on the upper side wall of the installation frame; the dustproof component is inserted into the accommodating groove through the through groove, and the outer frame of the dustproof component is embedded in the groove.

3. A server heat dissipation device according to claim 2, characterized in that: A first mounting groove is provided on a side wall of the through groove, a baffle is retractably provided in the first mounting groove through a spring, and the distance between the baffle and the bottom of the accommodating groove is the same as the height of the outer frame of the dustproof component.

4. A server heat dissipation device according to claim 3, characterized in that: An adjustment groove connected to the first mounting groove is provided on the upper surface of the upper side wall of the mounting frame corresponding to the first mounting groove, and the length direction of the adjustment groove is arranged along the moving direction of the baffle plate. A lever is fixedly arranged on the baffle plate corresponding to the adjustment groove, and the lever extends outward from the adjustment groove.

5. A server heat dissipation device according to claim 2 or 3, characterized in that: A cleaning head is provided on the side of the bottom end of the outer frame facing the chassis, and the cleaning head includes a mounting rod fixedly provided on the bottom end of the outer frame, and a plurality of bristles fixedly provided on the end of the mounting rod away from the outer frame; a through groove is provided on the upper side wall of the mounting frame corresponding to the cleaning head, and the through groove is connected to the through groove and is provided for the passage of the cleaning head; a closing block is provided on the side of the top end of the outer frame facing the chassis corresponding to the cleaning head, and the closing block matches the through groove and is used to be embedded in the through groove and seal with the through groove.

6. A server heat dissipation device according to claim 2 or 3, characterized in that: The heat dissipation component also includes a trigger switch for changing the direction of the two heat dissipation fans. There are two trigger switches, which are respectively arranged in the receiving slots of the two radiators, and the trigger switches are triggered when the dustproof component is inserted into the receiving slot.

7. A server heat dissipation device according to claim 6, characterized in that: A second mounting groove is provided at the bottom of one of the grooves on the two side walls of the mounting frame, and the trigger switch is mounted in the second mounting groove. The trigger switch includes a trigger rod, and the upper end of the trigger rod is fixedly connected to a rotating shaft, and the rotating shaft is rotatably arranged in the second mounting groove, and the lower end of the trigger rod is inclined toward the inner side of the accommodating groove and extends out of the first mounting groove, and the lower end of the trigger rod is connected to the bottom of the groove through a spring; the trigger switch also includes a button switch fixedly arranged in the groove through a support arm, and the button switch is located above the rotating shaft; the trigger switch also includes a pressure rod arranged on the rotating shaft, the lower end of the pressure rod is fixedly connected to the rotating shaft, and the upper end of the pressure rod is located on the outside of the button switch for pressing the button switch.

8. A server heat dissipation device according to claim 1, characterized in that: A mounting ring is fixedly provided at the bottom end of the outer wall of the mounting frame, and a plurality of through holes are provided on the mounting ring, and threaded mounting holes are provided on the side panels of the chassis corresponding to the through holes, and the mounting frame is detachably provided on the side wall of the chassis by a bolt connection structure passing through the through holes and the threaded mounting holes.

9. A server, characterized in that: A heat dissipation device as claimed in any one of claims 1 to 8.

10. A server according to claim 9, characterized in that: It includes a mainboard, which is horizontally arranged and fixed in the middle of the chassis by a bracket, dividing the internal space of the chassis into a first heat dissipation cavity and a second heat dissipation cavity arranged up and down; the number of heat dissipation components on the chassis is two groups, and the two radiators of the two heat dissipation components are respectively arranged on the first heat dissipation cavity and the second heat dissipation cavity.

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